JP2015181981A - Coating device and coating film forming method of forming coating film with discontinuous pattern on band-like film base material - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a coating device and coating method which can form a coating film having a discontinuous pattern on a base material by a simple method.SOLUTION: A coating device of forming a film on a coating film forming surface of a band-like film base material includes: a coating roll which rotates with a coating film material adhered on an outer circumferential surface; a coating liquid supply member which supplies the coating film material on the coating roll; a film base material conveying part which conveys continuously while making the coating film forming surface of the film base material in contact with the coating roll; a pattern mask imparting part which is positioned on an upstream side of a conveying direction of the film base material than the coating roll and imparts a pattern mask on the coating film forming surface of the film base material; and a pattern mask peeling part which is positioned on a downstream side of the conveying direction of the film base material than the coating roll and peels the pattern mask from the film base material.

Description

  The present invention manufactures a coating member and a coating film forming method for forming a coating film having a desired discontinuous pattern on a belt-shaped film substrate, and a film member having a concavo-convex pattern forming region spaced on the substrate. The present invention relates to an apparatus and a method for manufacturing a substrate, and a method for manufacturing a substrate having an uneven pattern using the same.

  As a method of forming a coating film on a belt-like film substrate, the coating material is attached to a rotating coating roll, and the film substrate is brought into contact with the coating material on the coating roll while being transported. A method such as a gravure coating method for forming a coating film on the surface is known.

  Such coating film forming methods are used in various applications such as electrode material sheets for solar cells, fuel cells, storage batteries, antireflection films, and catalyst coatings. In addition to forming a coating film on the substrate, it may be necessary to form the coating film on regions divided into various shapes and areas on the substrate. In such a case, a continuous non-application region in the longitudinal direction and the width direction can be formed by the method as described in Patent Document 1, and intermittent (with respect to the longitudinal direction and the width direction of the base material) A coating having a (discontinuous) pattern can be formed. In the method described in Patent Document 1, while conveying the film substrate in the longitudinal direction, the backing roll disposed so as to contact the coating roll via the substrate is intermittently separated from the coating roll, The film base is separated from the coating roll to form a continuous non-coating region in the width direction of the film base, whereby the film base is applied intermittently (discontinuously in the longitudinal direction) with respect to the longitudinal direction of the film base. A film is formed. Also, using a coating roll in which a groove is formed along the circumferential direction on the outer peripheral surface, while removing the coating material in the groove with a doctor blade or the like engaged with the groove, the film substrate is brought into contact with the coating roll. By conveying in the longitudinal direction, a continuous non-coating region is formed in the longitudinal direction (conveying direction) of the film substrate, thereby being intermittent (discontinuous in the width direction) with respect to the width direction of the film substrate. ) A coating film is formed. By the above method, it is possible to form a coating film having an intermittent (discontinuous) pattern with respect to the longitudinal direction and the width direction of the substrate.

JP 2000-51778 A

  It is an object of the present invention to form a coating film having a desired discontinuous (separated) pattern on a substrate by a simple method, and to be able to be applied to the formation of a coating film having various patterns. It is to provide an apparatus and a coating method. Moreover, the apparatus and method for manufacturing the film member which has the uneven | corrugated pattern formation area | region which has a desired discontinuous pattern on a base material using such a coating device and the coating method are provided. Furthermore, the method of manufacturing the board | substrate which has an uneven | corrugated pattern using the film member manufactured by this invention as a mold is also provided.

According to the first aspect of the present invention, there is provided a coating apparatus for forming a film on a coating film forming surface of a band-shaped film substrate,
A coating roll that rotates by attaching a coating material on the outer peripheral surface;
A coating liquid supply member for supplying the coating film material to the coating roll;
A film base material transport section for continuously transporting the coating roll while contacting the coating film forming surface of the film base material,
Located on the upstream side in the transport direction of the film base material from the coating roll, on the coating film forming surface of the film base material, a pattern mask application unit for applying a pattern mask,
A coating apparatus is provided that includes a pattern mask peeling unit that is positioned downstream of the coating roll in the transport direction of the film base and peels the pattern mask from the film base.

  The said coating device WHEREIN: The said pattern mask may have a pattern parted in the conveyance direction of the said pattern mask.

  In the coating apparatus, the pattern mask may have a pattern that is continuous in a conveyance direction of the pattern mask.

  The coating apparatus may further include a transport direction non-coating region forming mechanism that forms a non-coating region continuous in the transport direction of the film base material on the film base material.

In the coating apparatus, the transport direction non-coating region forming mechanism is
A tape-like mask that is located upstream of the coating roll in the transport direction of the film substrate and that gives a tape-shaped mass on the coating film forming surface of the film substrate along the transport direction of the film substrate. A granting unit;
It may be located downstream of the coating roll in the transport direction of the film substrate, and may include a tape-shaped mask peeling portion that peels the tape-shaped mask from the film substrate.

  In the coating apparatus, the transport direction non-coating region forming mechanism is located upstream of the coating roll in the transport direction of the film base material, and a liquid repellent material is disposed on the coating film forming surface of the film base material. The liquid repellent material application part to apply may be included.

In the coating apparatus, the coating roll includes the transport direction non-coating region forming mechanism,
The transport direction non-application area forming mechanism is formed on the outer peripheral surface of the application roll and two or more liquid carrying areas continuous in the circumferential direction of the application roll, and on the outer peripheral surface of the application roll. A liquid non-carrying region formed between each of the liquid carrying regions may be included. The liquid non-carrying region may have a flat surface. The liquid non-carrying region may be liquid repellent. The liquid non-carrying region may have a recess with respect to the liquid carrying region.

In the coating apparatus, the coating liquid supply member includes the transport direction non-coating region forming mechanism,
The transport direction non-application area forming mechanism may include at least two coating liquid supply chambers that are spaced apart from each other in the rotation axis direction of the application roll.

According to the second aspect of the present invention, there is provided a manufacturing apparatus for a strip-shaped film member having an uneven pattern,
An application part for applying a concavo-convex forming material on a band-shaped film substrate to form a film;
A transfer roll having a concavo-convex pattern, and a transfer portion for transferring the concavo-convex pattern to the film;
A transport unit that continuously transports the film base material from the coating unit toward the transfer unit;
A film member manufacturing apparatus is provided in which the coating unit is configured by the coating apparatus according to the first aspect.

According to a third aspect of the present invention, there is provided a method for forming a coating film on a film substrate using the coating apparatus of the first aspect,
A method of forming a coating film comprising forming an uncoated region corresponding to the shape of the pattern mask on the film substrate is provided.

According to a fourth aspect of the present invention, there is provided a method of forming a coating film on a film substrate using the coating apparatus of the first aspect,
Forming an uncoated region corresponding to the shape of the pattern mask on the film substrate;
There is provided a method of forming a coating film including forming a non-coating region continuous in the longitudinal direction of the film substrate using the transport direction non-coating region forming mechanism.

  In the method of forming the coating film, forming a non-coating region continuous in the longitudinal direction of the film base using the transport direction non-coating region forming mechanism provides a tape-like mask on the film base. And applying the coating material onto the film substrate provided with the tape-shaped mask by bringing the coating material into contact with the film substrate provided with the tape-shaped mask. .

  In the method for forming the coating film, forming a non-coating region continuous in the longitudinal direction of the film base material using the transport direction non-coating region forming mechanism may form a liquid repellent material on the film base material. And applying the coating material on the film substrate by bringing the coating material into contact with the film substrate to which the liquid repellent material has been applied.

  In the method for forming the coating film, forming the non-coating region continuous in the longitudinal direction of the film base using the non-coating region forming mechanism in the transport direction is two continuous in the circumferential direction of the coating roll. Carrying the coating material in the above region, and bringing the coating material carried on the coating roll into contact with the film substrate and coating the coating material on the film substrate. It's okay.

According to a fifth aspect of the present invention, there is provided a method for producing a strip-shaped film member having a concavo-convex pattern,
An application step of applying a concavo-convex forming material on a strip-shaped film substrate to form a film of the concavo-convex forming material by the method of forming the coating film of the third aspect or the fourth aspect;
There is provided a method for producing a film member comprising a transfer step of transferring a concavo-convex pattern of a transfer roll onto the film.

According to a sixth aspect of the present invention, there is provided a method for manufacturing a substrate having a concavo-convex pattern,
Forming a sol-gel material layer on a substrate;
There is provided a method for producing a substrate, comprising transferring the concavo-convex pattern of the mold to the sol-gel material layer using the film member produced by the film member production method of the fifth aspect as a mold having a concavo-convex pattern. The

  In the coating apparatus of the present invention, a film coating having a pattern having a non-application area having a shape corresponding to the shape of the pattern mask is brought into contact with the coating roll while the film base material provided with the pattern mask is conveyed. Can be formed. For this reason, since the mechanical structure for displacing the conveyance path of a film base material becomes unnecessary, an apparatus structure becomes simple. The coating apparatus of the present invention further includes means for forming a non-coating region continuous in the longitudinal direction (conveying direction) of the film substrate, thereby easily forming a coating film having various patterns on the substrate. Can do. Furthermore, using this coating apparatus, a film member in which a concavo-convex pattern is formed in a desired region on a substrate can be produced. A coating apparatus and a coating method of the present invention, and a manufacturing apparatus and a manufacturing method of a film member having a concavo-convex pattern are manufactured for an electrode material sheet such as a solar cell, a fuel cell, and a storage battery, an antireflection film, and a substrate used for catalyst coating. It is very effective for.

It is a figure which shows notionally the coating device of 1st Embodiment for forming the coating film which has a discontinuous pattern on a base material. It is a figure which shows notionally the coating device of 2nd Embodiment for forming the coating film which has a discontinuous pattern on a base material. It is a figure which shows notionally the coating device of 3rd Embodiment for forming the coating film which has a discontinuous pattern on a base material. It is a figure which shows notionally the coating device of 4th Embodiment for forming the coating film which has a discontinuous pattern on a base material. It is a figure which shows notionally the coating device of 5th Embodiment for forming the coating film which has a discontinuous pattern on a base material. It is a figure which shows notionally the manufacturing apparatus of the strip | belt-shaped film member which has an uneven | corrugated pattern. It is a figure which shows notionally an example of a mode that the uneven | corrugated pattern of a strip | belt-shaped film member is transcribe | transferred to a board | substrate. FIGS. 8A to 8C are diagrams conceptually showing pattern examples of a pattern mask used in the coating apparatus of the embodiment.

  Hereinafter, embodiments of a coating apparatus, a manufacturing apparatus and a manufacturing method of a strip-shaped film member having a concavo-convex pattern, and a member having a concavo-convex pattern manufactured using the film member will be described with reference to the drawings.

[Coating apparatus of the first embodiment]
First, the coating apparatus 140a of 1st Embodiment for forming the coating film of a discontinuous (separated) pattern on a base material is demonstrated. As shown in FIG. 1, the coating apparatus 140 a of the first embodiment mainly includes a film transport unit 120 a that continuously feeds the film base material 80, and the film base material 80 that is sent out by the film transport unit 120 a. A coating roll 40 that forms a coating film 84 by applying a liquid, a coating liquid supply member 82 that supplies a coating liquid (coating material) to the coating roll 40, and the coating roll 40 in the conveying direction of the film substrate 80. A pattern mask applying unit 170 for applying the pattern mask 50 on the film substrate 80 and a pattern on the film substrate 80 positioned on the downstream side of the coating roll 40 in the transport direction of the film substrate 80. A pattern mask peeling unit 190 for peeling the mask 50 is provided. Below, the detail of the structure of each part is demonstrated.

<Film transport unit>
As shown in FIG. 1, the film transport unit 120 a mainly includes a transport roll 78 for transporting the band-shaped film substrate 80 in the transport direction (the arrow direction in FIG. 1). Further, although not shown in FIG. 1, a feeding roll for feeding out the film base material 80 and a take-up roll that is provided downstream of the coating roll 40 and winds up the film base material 80 may be provided (see FIG. 6). . The film substrate 80 can be transported in the transport direction by the rotational drive of the transport roll 78 and / or the rotational drive of the feed roll and take-up roll.

  The film substrate 80 is a belt-like or elongated film substrate so as to enable continuous processing while being conveyed. The film substrate 80 is made of, for example, film-like glass, silicone resin, polyethylene terephthalate (PET), polyethylene terephthalate (PEN), polycarbonate (PC), cycloolefin polymer (COP), polymethyl methacrylate (PMMA), polystyrene ( PS), polyimide (PI), and an organic material such as polyarylate. The film substrate may be transparent or opaque. In order to enhance the adhesion between the film substrate 80 and the coating film formed on the surface thereof, the film substrate 80 may be subjected to an easy adhesion treatment on the surface. A gas barrier layer may be provided. Although the dimension of the film base material 80 can be set suitably, for example, the width | variety of the film base material 80 can be 50-3000 mm, and thickness can be 1-500 micrometers.

<Coating roll and coating liquid supply member>
The coating roll 40 applies a liquid to the film substrate 80 to form the coating film 84. A gravure roll is used as the coating roll 40. The gravure roll has a liquid carrying region 40a having fine irregularities formed on the outer peripheral surface, and rotates around a rotation axis by a drive system (not shown). The coating liquid supply member 82 includes a chamber in which the coating film material is stored, and a part of the coating roll 40 is immersed in the stored coating material. When the application roll 40 rotates, the coating material is supported on the liquid holding region 40a of the application roll 40 in the circumferential direction. The coating roll 40 is disposed so as to oppose and contact the surface (coating film forming surface) of the film substrate 80 being transported by the film transport unit, and the liquid carrying region of the coating roll 40 while the coating roll 40 rotates. When the coating material supported on 40a comes into contact with the substrate 80 being continuously conveyed, the coating material adheres onto the substrate 80 and the coating 84 is formed.

  The dimensions of the coating roll 40 and its liquid carrying area 40a can be set as appropriate. From the viewpoint of preventing the coating material from protruding from the left and right ends of the film substrate 80 and entering the back surface of the film substrate 80, the length of the liquid carrying region 40 a in the rotation axis direction is the width of the film substrate 80. It may be smaller.

<Pattern mask applying part>
In the coating apparatus 140a, a belt-like or elongated sheet having a shape corresponding to the shape of the non-application area in the pattern of the coating film formed on the film substrate 80 is used as the pattern mask 50. For example, as shown in FIG. 1, when the pattern mask has a lattice shape, the coating film 84 formed on the film substrate 80 is divided into a plurality of areas separated by a lattice-shaped non-application area (uneven pattern formation). Region). Note that the plurality of separated areas refers to a plurality of isolated regions, and the shape of the regions is not limited. The size of the pattern mask 50 may be set as appropriate. However, the pattern mask 50 may have the same width and length as the film base material 80 because the pattern mask 50 is conveyed and continuously processed together with the film base material 80. By doing so, it becomes easy to manage the alignment of the film base 80 and the pattern mask 50 in the width direction. The width of the pattern mask 50 may be appropriately set depending on the required product form, and the width of the pattern mask 50 may be smaller or larger than the film substrate 80 depending on the application. If the pattern mask 50 has a function of masking the liquid carrying area 40a of the coating roll 40, the width of the pattern mask 50 is desirably larger than the width of the liquid carrying area 40a, but may be small depending on the coating film pattern to be formed. (For example, when masking only the center of the liquid carrying region 40a in the width direction). As a material of the pattern mask 50, for example, the same film as the film substrate 80 can be used. Moreover, you may use the material which repels coating film materials, such as polyphenylene sulfide (PPS) and polyethylene (PE) (a coating material does not wet). Alternatively, the surface of the pattern mask 50 may be subjected to a liquid repellent treatment with fluororesin, silicone, or the like so that the surface of the pattern mask 50 (the surface opposite to the surface in contact with the film substrate 80) repels the coating material. . By making the pattern mask 50 repel the coating material, the amount of coating material used can be suppressed. The back surface of the pattern mask 50 (the surface in contact with the film substrate 80) may have adhesiveness so that the position of the pattern mask 50 is fixed on the film substrate 80. Moreover, although the thickness of the pattern mask 50 can be made into 5 micrometers-1000 micrometers, for example, it is easy to tear when it is too thin at the point of handling property, and when too thick, it will become difficult to wind up with a winding roll. On the other hand, there is an advantage that the thickness of the mask sheet can be appropriately selected according to the film thickness of the coating film in the thickness range of 5 μm to 1000 μm, thereby making it possible to easily control the film thickness of the coating film. . The pattern mask 50 is fed from the pattern mask feed roll 51 and taken up by the pattern mask take-up roll 52.

  The pattern mask 50 may have various patterns (blank regions) depending on the shape (pattern) of the coating film formed on the film substrate 80. For example, as shown in FIGS. 8A and 8B, a pattern (blank region) divided in the pattern mask transport direction (the direction indicated by the arrow in FIGS. 8A and 8B). Pattern masks 50 and 50 ′ having 50p and 50p ′ can be used. In the present application, “a pattern mask having a pattern divided in the conveyance direction” means only a pattern mask having a pattern divided in a direction perpendicular to the conveyance direction as shown in FIGS. 8A and 8B. Pattern mask having a pattern divided in a direction intersecting at an arbitrary angle with respect to the transport direction, and an arbitrary shape, for example, an opening having a shape such as a circle, an ellipse, or a polygon as well as a rectangle A plurality of formed pattern masks are also included. Further, as shown in FIG. 8C, a pattern mask 50 ″ having a pattern 50p ″ that is continuous in the pattern mask transport direction (the direction indicated by the arrow in FIG. 8C) is used. Also good. In the present application, “a pattern mask having a continuous pattern in the transport direction” means that a pattern (blank region) and a mask region extend in a direction parallel to the transport direction as shown in FIG. Not only a pattern mask, but also a pattern mask that extends in a direction inclined with respect to the transport direction, a pattern mask that extends in the transport direction while the mask region is bent, and a mask branched from these extended mask regions A pattern mask further including a region is also included. Pattern masks such as these pattern masks 50, 50 ′, 50 ″ can be formed, for example, by cutting a strip-shaped sheet.

  In addition, a pattern mask is a conveyance direction so that the area | region which contacts the edge part of the liquid holding area | region 40a of the coating roll 40 of the film base material 80 may be continuously masked (covered) in the conveyance direction of the film base material 80. A mask region extending in a direction parallel to the mask region may be provided. In the coating apparatus 140a, the film thickness etc. of the coating film to be formed may be non-uniform in the region in contact with the end of the liquid carrying region 40a of the coating roll 40 of the film base 80. By masking the region of the film base 80 that contacts the end of the liquid carrying region 40a of the coating roll 40 using a pattern mask, a non-uniform coating film is prevented from being formed on the film base 80. be able to.

  The pattern mask applying unit 170 is a pattern mask feeding roll 51 and a pair of rolls that are positioned upstream of the coating roll 40 in the transport direction of the film base material and rotate opposite to each other, that is, a bonding roll 54 and And a support roll 55. In the pattern mask applying unit 170, the pattern mask 50 fed out from the pattern mask feeding roll 51 is overlaid on the film base material 80 and sandwiched between the laminating roll 54 and the support roll 55, whereby a film is formed on the film base material 80. A pattern mask 50 is applied along the conveyance direction of the substrate 80.

<Pattern mask peeling part>
The pattern mask peeling unit 190 is composed of a pair of rolls that are positioned on the downstream side in the transport direction of the film base with respect to the coating roll 40 and rotate opposite to each other, that is, the peeling roll 56 and the support roll 57. In the pattern mask peeling unit 190, the pattern mask 50 that has passed between the peeling roll 56 and the support roll 57 while being superimposed on the film base material 80 is conveyed in a direction away from the film base material 80, thereby The mask 50 is peeled from the film substrate 80. The peeled pattern mask 50 can be taken up by a pattern mask take-up roll 52 provided at a position deviated from the conveyance path of the film substrate 80.

  Next, an operation for forming a coating film 84 having a desired pattern on the film substrate 80 using the coating apparatus 140a of the first embodiment as described above will be described.

  First, conveyance by the film conveyance part 120a is started, and the film base material 80 is sent out to the pattern mask provision part 170 from a supply roll. In the pattern mask applying unit 170, the pattern mask 50 fed from the pattern mask feeding roll 51 is sandwiched together with the film base 80 by the bonding roll 54 and the support roll 55, whereby the surface of the film base 80 (coating film forming surface). ) The pattern mask 50 is overlaid at a predetermined position on the top.

  Next, the film base material 80 on which the pattern mask 50 is superimposed is conveyed to a position facing the application roll 40 (front surface of the application roll 40). The film base material 80 on which the pattern mask 50 is superimposed comes into contact with the coating roll 40 while moving in the transport direction, and a coating film 84 is formed on the base material 80 and the pattern mask 50 with a predetermined film thickness. Note that when the pattern mask 50 is formed of a material that repels the coating material or when the surface of the pattern mask 50 is subjected to a liquid repellent treatment, no coating film is formed on the pattern mask 50.

  The film substrate 80 is then conveyed to the pattern mask peeling unit 190. After the film substrate 80 on which the pattern mask 50 is superimposed passes between the peeling roll 56 and the support roll 57, the pattern mask 50 is conveyed in a direction away from the film substrate 80, and the pattern mask 50 is moved to the film base. Peel from material 80. The peeled pattern mask 50 is taken up by a mask take-up roll 52. Since the coating film formed on the pattern mask 50 together with the pattern mask 50 is also peeled off from the film base material 80, the area overlapped with the pattern mask 50 of the film base material 80 is an uncoated area where no coating film is formed. Thus, the coating film 84 is formed only in the region on the film substrate 80 that did not overlap the pattern mask 50. In this way, the coating film 84 having a desired pattern can be formed on the film substrate 80.

  The coating apparatus 140a can form the coating film 84 which has a desired pattern simply by changing the shape of the pattern mask 50 to be used. For example, the film substrate 80 is applied by using the pattern masks 50 and 50 ′ having the patterns 50p and 50p ′ divided in the direction orthogonal to the transport direction as shown in FIGS. 8A and 8B. A coating film having an intermittent (discontinuous) pattern in the conveying direction of the film substrate 80 can be formed while being in contact with the roll 40. In order to form an intermittent coating film pattern in the longitudinal direction (conveying direction) of such a film substrate, in the method described in Patent Document 1, the film substrate 80 is separated from the coating roll 40 or Although it is necessary to move the conveyance path of a film base so that it may contact, in coating device 140a of this embodiment, it is not necessary. Therefore, the coating apparatus 140a does not require a complicated apparatus configuration for controlling the fluctuation of the tension of the film base material accompanying the movement of the film base transport path. Further, by using the pattern masks 50 and 50 ′ having the pattern mask 50p ″ having a continuous pattern in the transport direction as shown in FIG. A coating having a (discontinuous) pattern can be formed. In order to form an intermittent coating film pattern in the width direction of such a film substrate, the method described in Patent Document 1 uses a coating roll in which grooves are formed on the outer peripheral surface along the circumferential direction. Although necessary, it is not necessary in the coating apparatus 140a of the present embodiment. Therefore, by using the coating apparatus 140a, it is possible to easily form a coating film having a desired discontinuous pattern with a simple apparatus configuration.

[Coating Device of Second Embodiment]
Next, the coating apparatus 140b of 2nd Embodiment for forming the coating film of a discontinuous pattern on a base material is demonstrated. As shown in FIG. 2, the coating apparatus 140 b of the second embodiment mainly includes a film transport unit 120 a that continuously feeds the film base material 80, and the film base material 80 that is sent out by the film transport unit 120 a. An application roll 40 that forms a film 84 by applying a liquid, a coating liquid supply member 82 that supplies a coating liquid (coating material) to the application roll 40, and an upstream side of the application roll 40 in the conveying direction of the film substrate 80 A pattern mask applying unit 170 that applies a pattern mask 50 ′ on the film substrate 80, and a pattern mask 50 on the film substrate 80 that is positioned downstream of the coating roll 40 in the conveying direction of the film substrate 80. The pattern mask peeling unit 190 for peeling 'and the tape on the film substrate 80 located upstream of the coating roll 40 in the transport direction of the film substrate 80. A tape-shaped mask applying unit 270 that applies the mask-like mask 11, and a tape-shaped mask peeling unit 290 that is located on the downstream side of the coating roll 40 in the conveying direction of the film substrate 80 and peels the tape-shaped mask 11 on the film substrate 80. With.

  The film transport unit 120a, the coating roll 40, the coating liquid supply member 82, the pattern mask applying unit 170, and the pattern mask peeling unit 190 of the coating apparatus 140b of the second embodiment are transported by the film transport unit 140a of the first embodiment. Since it is comprised similarly to the part 120a, the coating roll 40, the coating liquid supply member 82, the pattern mask provision part 170, and the pattern mask peeling part 190, the description is abbreviate | omitted.

<Tape mask application part>
The tape-shaped mask 11 is transported together with the film base material 80 and continuously processed by masking a region continuous in the transport direction on the film base material 80. As the tape-shaped mask 11, for example, a film made of the same material as the film substrate 80 can be used. Moreover, you may use the material which repels coating film materials, such as polyphenylene sulfide (PPS) and polyethylene (PE) (a coating material does not wet). Alternatively, the surface of the tape-shaped mask 11 may be subjected to a liquid repellent treatment with fluororesin, silicone, or the like so that the surface of the tape-shaped mask 11 (the surface opposite to the surface in contact with the film substrate 80) repels the coating material. Also good. By making the tape-shaped mask 11 repel the coating material, the amount of the coating material used can be suppressed. The back surface of the tape-shaped mask 11 (the surface in contact with the film substrate 80) may have adhesiveness so that the position of the tape-shaped mask 11 is fixed on the film substrate 80. The width of the tape-shaped mask 11 is appropriately set according to the width of a non-application area continuous in the transport direction of the film substrate 80 in the coating film pattern formed on the film substrate 80, the required form of the product, and the like. However, it may be smaller than the width of the film substrate 80. The tape-shaped mask 11 may have a thickness of, for example, 5 μm to 1000 μm. If the thickness is too thin, the tape-shaped mask 11 is easily broken. On the other hand, if it is too thick, the coating roll 40 and the film substrate 80 do not come into contact with each other, and coating becomes difficult. The tape-shaped mask 11 is fed from a tape-shaped mask feed roll 13 and wound up by a tape-shaped mask take-up roll 15.

  The tape-shaped mask applying unit 270 is a pair of rolls that are positioned upstream of the tape-shaped mask feeding roll 13 and the coating roll 40 in the transport direction of the film base and rotate opposite to each other, that is, a bonding roll 17 and a support roll 18. In the tape-shaped mask applying unit 270, the tape-shaped mask 11 fed from the tape-shaped mask feeding roll 13 is overlapped on the film base material 80 and sandwiched between the laminating roll 17 and the support roll 18, whereby the film base material 80. A tape-shaped mask 11 is applied on the film substrate 80 along the conveying direction. The application position of the tape-shaped mask 11 in the width direction of the film substrate 80 is appropriately set according to the position of the non-application region continuous in the transport direction formed on the film substrate 80 formed on the film substrate 80. Can do.

<Tape mask peeling part>
The tape-shaped mask peeling part 290 is composed of a pair of rolls that are located on the downstream side in the transport direction of the film base with respect to the coating roll 40 and rotate opposite to each other, that is, the peeling roll 19 and the support roll 20. . In the tape-shaped mask peeling part 290, by transporting the tape-shaped mask 11 that has passed between the peeling roll 19 and the support roll 20 while being superimposed on the film base material 80 in a direction away from the film base material 80, The tape-shaped mask 11 is peeled off from the film substrate 80. The peeled tape-shaped mask 11 can be taken up by a tape-shaped mask take-up roll 15 provided at a position deviated from the conveyance path of the film substrate 80.

  The tape-shaped mask 11 is driven by the rotation of the laminating roll 17 and the peeling roll 19 and / or by the rotational driving of the tape-shaped mask feeding roll 13 and the tape-shaped mask take-up roll 15 or by the conveyance of the film substrate 80. Then, it can be transported in the transport direction.

  Next, an operation for forming a coating film 84 having a desired pattern on the film substrate 80 using the coating apparatus 140b of the second embodiment as described above will be described.

  First, conveyance by the film conveyance part 120a is started, and the film base material 80 is sent out to the pattern mask provision part 170 from a supply roll. In the pattern mask applying unit 170, the surface of the film base 80 (coating film formation) is formed by sandwiching the pattern mask 50 ′ fed from the pattern mask feed roll 51 together with the film base 80 by the bonding roll 54 and the support roll 55. The pattern mask 50 'is overlaid at a predetermined position on the surface).

  Next, the film substrate 80 on which the pattern mask 50 ′ is superimposed is conveyed to the tape-shaped mask applying unit 270. In the tape-shaped mask applying unit 270, the tape-shaped mask 11 fed from the tape-shaped mask feeding roll 13 is sandwiched with the film base 80 by the bonding roll 17 and the support roll 18. Thereby, the tape-shaped mask 11 is further superimposed at a predetermined position on the film substrate 80 on which the pattern mask 50 'is superimposed.

  Next, the film substrate 80 on which the pattern mask 50 ′ and the tape-shaped mask 11 are superimposed is conveyed to a position facing the application roll 40 (the front surface of the application roll 40). The film base material 80 on which the pattern mask 50 ′ and the tape-shaped mask 11 are superimposed comes into contact with the coating roll 40 while moving in the transport direction, and a coating film is formed on the base material 80, the pattern mask 50 ′, and the tape-shaped mask 11. 84 is formed with a predetermined film thickness. In addition, when the pattern mask 50 'and / or the tape-shaped mask 11 is formed of a material that repels the coating material, or the surface of the pattern mask 50' and / or the tape-shaped mask 11 is subjected to a liquid repellent treatment. In that case, no coating film is formed on the pattern mask 50 ′ and / or the tape-shaped mask 11.

  Next, the film substrate 80 is conveyed to the tape-shaped mask peeling unit 290. After the film substrate 80 on which the pattern mask 50 ′ and the tape-shaped mask 11 are superimposed passes between the peeling roll 19 and the support roll 20, the tape-shaped mask 11 is conveyed in a direction away from the film substrate 80. Then, the tape-shaped mask 11 is peeled from the film substrate 80. The peeled tape-shaped mask 11 is wound up by a tape-shaped mask winding roll 15. Since the coating film formed on the tape-shaped mask 11 together with the tape-shaped mask 11 is also peeled off from the film base material 80, the region overlapped with the tape-shaped mask 11 of the film base material 80 and the pattern mask 50 ′ is the coating film. Is not formed, and a coating film is formed only in a region that is not overlapped with the tape-shaped mask 11. Thus, a non-application area | region continuous in the conveyance direction of the film base material 80 is formed.

  The film substrate 80 and the pattern mask 50 ′ from which the tape-shaped mask 11 has been peeled are then conveyed to the pattern mask peeling unit 190. After the film substrate 80 on which the pattern mask 50 ′ is superimposed passes between the peeling roll 56 and the support roll 57, the pattern mask 50 ′ is conveyed in a direction away from the film substrate 80, and the pattern mask 50 ′. Is peeled off from the film substrate 80. The peeled pattern mask 50 ′ is wound up by a mask winding roll 52. Since the coating film formed on the pattern mask 50 ′ together with the pattern mask 50 ′ is also peeled off from the film base material 80, the coating film is not formed in the region overlapped with the pattern mask 50 ′ of the film base material 80. The coating film 84 is formed only in a region that is a non-application region and does not overlap the pattern mask 50 ′ on the film substrate 80.

  As described above, an uncoated region was formed in the region of the film substrate 80 that was overlapped with the tape-shaped mask 11 or the pattern mask 50 ′, and did not overlap either the tape-shaped mask 11 or the pattern mask 50 ′. A coating 84 is formed in the region. In this way, the coating film 84 having a desired pattern can be formed on the film substrate 80.

  The coating apparatus 140b can easily form the coating film 84 having a desired pattern by changing the shape of the pattern mask 50 'to be used. Further, the coating apparatus 140b uses a pattern mask 50 ′ having a pattern divided in a direction perpendicular to the transport direction, so that the film base 80 is kept in contact with the coating roll 40 in the transport direction of the film base 80. The coating film 84 having an intermittent (discontinuous) pattern can be formed. In order to form an intermittent coating film pattern in the longitudinal direction (conveying direction) of such a film substrate, in the method described in Patent Document 1, the film substrate 80 is separated from the coating roll 40 or Although it is necessary to move the conveyance path of a film base so that it may contact, in coating device 140b of this embodiment, it is not necessary. Therefore, the complicated apparatus structure for controlling the fluctuation | variation of the tension | tensile_strength of the film base material accompanying the movement of the conveyance path of a film base material is unnecessary. Accordingly, the coating apparatus 140b can easily form a coating film having a desired discontinuous pattern while having a simple apparatus configuration.

  Furthermore, the number, position, and width of the non-application areas that are continuous in the transport direction on the film substrate 80 are changed by changing the number of tape-shaped masks 11 to be used, the width, and the position of the film substrate 80 in the width direction. can do. Therefore, for example, when forming a coating film having a pattern in which the number, position, or width of non-application areas continuous in the conveyance direction are different for each of a plurality of film bases, the number of tape-shaped masks used is changed. Coating film with a desired pattern on each film substrate by using tape masks with different widths, or by adjusting the position of the tape mask in the width direction of the film substrate 80 as appropriate. It becomes possible to do. In this case, it is not necessary to prepare each pattern mask 50 'having a shape corresponding to the shape of the non-application area of each coating film pattern, and the coating film pattern can be changed only by changing the tape-like mask. Therefore, a coating film having various patterns can be formed more easily by using the coating apparatus 140b of the present embodiment.

  The tape-shaped mask 11 shown in FIG. 2 has a linear shape. However, the tape-shaped mask 11 may have a curved shape, a polygonal shape, or the like, and a film base material according to the shape of the tape-shaped mask 11. The non-application area | region continuous in the conveyance direction of 80 is formed.

  In FIG. 2, the pattern mask applying unit 170, the tape-shaped mask applying unit 270, the tape-shaped mask peeling unit 290, and the pattern mask peeling unit 190 are formed in this order from the upstream side in the conveyance direction of the film substrate 80. However, the order of the pattern mask applying unit 170 and the tape-shaped mask applying unit 270 and the order of the tape-shaped mask peeling unit 290 and the pattern mask peeling unit 190 may be reversed.

[Applicator of Third Embodiment]
A coating apparatus 140c according to a third embodiment for forming a discontinuous pattern coating film on a substrate will be described. As shown in FIG. 3, the coating apparatus 140 c according to the third embodiment mainly includes a film transport unit 120 a that continuously feeds the film base material 80, and the film base material 80 that is sent out by the film transport unit 120 a. A coating roll 40 that forms a film 84 by applying a liquid; a coating liquid supply member 82 that supplies a coating liquid to the coating roll 40; and a film positioned upstream of the coating roll 40 in the transport direction of the film substrate 80. A pattern mask applying unit 170 for applying a pattern mask 50 ′ on the substrate 80, and a pattern for peeling the pattern mask 50 ′ on the film substrate 80 located on the downstream side of the coating roll 40 in the conveying direction of the film substrate 80. Applying a liquid repellent material on the film base 80 located upstream of the coating roll 40 in the transport direction of the mask peeling portion 190 and the film base 80 That includes a liquid-repellent material application unit 310.

  The film transport unit 120a, the coating roll 40, the coating liquid supply member 82, the pattern mask applying unit 170, and the pattern mask peeling unit 190 of the coating apparatus 140c of the third embodiment are transported by the film transport unit 140a of the first embodiment. Since it is comprised similarly to the part 120a, the coating roll 40, the coating liquid supply member 82, the pattern mask provision part 170, and the pattern mask peeling part 190, the description is abbreviate | omitted.

<Liquid repellent material application part>
As illustrated in FIG. 3, the liquid repellent material application unit 310 includes a liquid repellent material application roll 22 and a liquid repellent material supply chamber 24. The length of the application surface of the liquid repellent material application roll 22 in the rotation axis direction depends on the width of the non-application area continuous in the conveying direction of the film substrate 80 formed on the film substrate 80, the required product form, and the like. Although it can set suitably, it may be smaller than the width | variety of the film base material 80. FIG. Liquid repellent material is stored in the liquid repellent material supply chamber 24. As the liquid repellent material, for example, it is preferable that the liquid repellent material has a surface energy greatly different from that of the coating film. If the coating film is a hydrophilic material, for example, a liquid repellent material containing fluorine is preferable. When the coating film is a hydrophobic material, for example, a hydrophilic material containing oxygen is preferable. The liquid repellent material application roll 22 is provided so as to rotate in a state in which a part of the application surface is immersed in the liquid repellent material in the liquid repellent material supply chamber 24. When the liquid repellent material application roll 22 is rotated while being immersed in the liquid repellent material, the liquid repellent material is supported on the application surface of the liquid repellent material application roll 22 in the circumferential direction. The liquid repellent material application roll 22 applies a liquid repellent material to the film base material 80 by rotating while contacting the surface (coating surface) of the film base material 80, thereby forming the liquid repellent film 26. In addition, the installation position of the liquid repellent material application roll 22 in the width direction of the film base material 80 is appropriately set according to the position of the non-application area continuous in the transport direction of the film base material 80 formed on the film base material 80. A mechanism capable of moving the liquid repellent material supply chamber 24 that accommodates the liquid repellent material application roll 22 in a direction orthogonal to the transport direction may be provided. A heater or a heat roll that dries or cures the liquid repellent material may be provided behind the liquid repellent material application roll (on the downstream side) on the back surface (the surface opposite to the coating film forming surface) of the film substrate 80. The temperature may be between 50 degrees and 250 degrees, and the temperature setting may be changed depending on the heat resistance of the film substrate 80. A UV irradiator may be installed instead of a heater or a heat roll.

  Next, an operation for forming a coating film 84 having a desired pattern on the film substrate 80 using the coating apparatus 140c of the third embodiment as described above will be described.

  First, conveyance by the film conveyance part 120a is started, and the film base material 80 is sent out to the pattern mask provision part 170 from a supply roll. In the pattern mask applying unit 170, the surface of the film base 80 (coating film formation) is formed by sandwiching the pattern mask 50 ′ fed from the pattern mask feed roll 51 together with the film base 80 by the bonding roll 54 and the support roll 55. The pattern mask 50 'is overlaid at a predetermined position on the surface).

  Next, the film substrate 80 on which the pattern mask 50 ′ is superimposed is sent to the liquid repellent material application unit 310. In the liquid repellent material application part 310, the application surface carrying the liquid repellent material is brought into contact with predetermined positions of the film substrate 80 and the pattern mask 50 'while rotating the liquid repellent material application roll 22. Thereby, the liquid repellent film 26 continuous in the conveying direction of the film substrate 80 is formed at predetermined positions on the film substrate 80 and the pattern mask 50 ′.

  Next, the film substrate 80 on which the liquid repellent film 26 is formed is conveyed to a position facing the application roll 40 (the front surface of the application roll 40). The film substrate 80 contacts the coating roll 40 while moving in the transport direction, and the coating film 84 is formed with a predetermined film thickness on the substrate 80 and the pattern mask 50 ′. At this time, in the region where the liquid repellent film 26 is formed on the film substrate 80 and the pattern mask 50 ′, the film material is repelled, so the film is not formed, and the region where the liquid repellent film 26 is not formed is formed. Only a coating film is formed. In this manner, a non-application region that is continuous in the transport direction of the film substrate 80 is formed according to the region where the liquid repellent film 26 is formed. If the pattern mask 50 ′ is formed of a material that repels the coating material, or if the surface of the pattern mask 50 ′ is subjected to a liquid repellent treatment, a coating film is formed on the pattern mask 50 ′. Not.

  The film substrate 80 is then conveyed to the pattern mask peeling unit 190. After the film substrate 80 on which the pattern mask 50 ′ is superimposed passes between the peeling roll 56 and the support roll 57, the pattern mask 50 ′ is conveyed in a direction away from the film substrate 80, and the pattern mask 50 ′. Is peeled off from the film substrate 80. The peeled pattern mask 50 ′ is wound up by a mask winding roll 52. Since the coating film formed on the pattern mask 50 ′ together with the pattern mask 50 ′ is also peeled off from the film base material 80, the coating film is not formed in the region overlapped with the pattern mask 50 ′ of the film base material 80. The coating film 84 is formed only in a region that is a non-application region and does not overlap the pattern mask 50 ′ on the film substrate 80.

  As described above, an uncoated region is formed in the region of the film substrate 80 that is overlapped with the pattern mask 50 ′ and the region where the liquid repellent film 26 is formed, and does not overlap the pattern mask 50 ′ and is liquid repellent. The coating film 84 is formed only in the region where the film 26 is not formed. In this way, the coating film 84 having a desired pattern can be formed on the film substrate 80.

  The coating apparatus 140c can easily form the coating film 84 having a desired pattern by changing the shape of the pattern mask 50 'to be used. Moreover, the coating apparatus 140c uses the pattern mask 50 ′ having a pattern divided in a direction orthogonal to the transport direction, so that the film base 80 is kept in contact with the coating roll 40 in the transport direction of the film base 80. The coating film 84 having an intermittent (discontinuous) pattern can be formed. In order to form an intermittent coating film pattern in the longitudinal direction (conveying direction) of such a film substrate, in the method described in Patent Document 1, the film substrate 80 is separated from the coating roll 40 or Although it is necessary to move the conveyance path of a film base so that it may contact, in coating device 140c of this embodiment, it is not necessary. Therefore, the complicated apparatus structure for controlling the fluctuation | variation of the tension | tensile_strength of the film base material accompanying the movement of the conveyance path of a film base material is unnecessary. Therefore, the coating apparatus 140c can easily form a coating film having a desired discontinuous pattern while having a simple apparatus configuration.

  Furthermore, the number, position, and width of the non-application areas that are continuous in the transport direction on the film substrate 80 are changed by changing the number, width, and position of the rotation axis direction of the application surface of the liquid repellent material application roll 22 to be used. Can be changed. Therefore, for example, when forming a coating film having a pattern in which the number, position, or width of the non-application areas continuous in the transport direction are different from each other on each of the plurality of film base materials, By changing the number of application surfaces, using a liquid repellent material application roll 22 having application surfaces with different widths, or by appropriately moving the liquid repellent material application roll 22 in the direction of the rotation axis, It is possible to form a coating film having a desired pattern thereon. In this case, it is not necessary to prepare each pattern mask 50 'having a shape corresponding to the shape of the non-application area of each coating film pattern, and the coating film pattern can be changed only by changing the liquid repellent material application roll. . Therefore, a coating film having various patterns can be more easily formed by using the coating apparatus 140c of this embodiment.

[Applicator of Fourth Embodiment]
A coating apparatus 140d according to a fourth embodiment for forming a discontinuous pattern coating film on a substrate will be described. As shown in FIG. 4, the coating apparatus 140 d of the fourth embodiment mainly includes a film transport unit 120 a that continuously feeds the film base material 80, and the film base material 80 that is sent out by the film transport unit 120 a. An application roll 41 that forms a film 84 by applying a liquid; a coating liquid supply member 82 that supplies a coating liquid to the application roll 41; and a film positioned upstream of the application roll 41 in the transport direction of the film base 80. A pattern mask applying unit 170 that applies a pattern mask 50 ′ on the substrate 80, and a pattern that is located on the downstream side of the coating roll 41 in the conveying direction of the film substrate 80 and peels off the pattern mask 50 ′ on the film substrate 80. A mask peeling unit 190.

  The film transport unit 120a, the coating liquid supply member 82, the pattern mask applying unit 170, and the pattern mask peeling unit 190 of the coating device 140d of the fourth embodiment are the same as the film transport unit 120a of the coating device 140a of the first embodiment. Since it is configured in the same manner as the liquid supply member 82, the pattern mask applying unit 170, and the pattern mask peeling unit 190, description thereof is omitted.

<Coating roll>
The coating roll 41 applies a liquid to the film substrate 80 to form a coating film 84. As the coating roll 41, a gravure roll having two or more liquid carrying regions 41a having fine irregularities formed on the outer peripheral surface is used. The two or more liquid carrying regions 41 a are regions that are continuous in the circumferential direction of the application roll 41. The coating material supplied from the coating liquid supply member 82 is carried on the liquid carrying area 41 a of the coating roll 41. The area 41b sandwiched between the liquid holding areas 41a in the direction of the rotation axis of the coating roll 41 is subjected to a process for preventing the coating material from being carried. (Hereinafter, such a region 41b is appropriately referred to as a liquid non-carrying region 41b.) Such a process includes, for example, making the region 41b a flat surface without unevenness, and subjecting the surface of the region 41b to a liquid repellent process. For example, the region 41b can be recessed with respect to the liquid carrying region 41a to form a recess. The coating roll 41 is disposed to face the surface (coating film forming surface) of the film base material 80, and the base material 80 on which the coating material carried on the liquid carrying region 41a is continuously conveyed while the coating roll 41 rotates. , The coating material adheres onto the substrate 80 and the coating 84 is formed.

  The length and position of the liquid carrying region 41a of the coating roll 41 in the rotation axis direction are appropriately set according to the length and position of the coating film 84 formed on the film substrate 80 in the width direction of the film substrate 80. be able to.

  Next, an operation for forming the discontinuous pattern coating film 84 on the film substrate 80 using the coating apparatus 140d of the fourth embodiment as described above will be described.

  First, conveyance by the film conveyance part 120a is started, and the film base material 80 is sent out to the pattern mask provision part 170 from a supply roll. In the pattern mask applying unit 170, the surface of the film base 80 (coating film formation) is formed by sandwiching the pattern mask 50 ′ fed from the pattern mask feed roll 51 together with the film base 80 by the bonding roll 54 and the support roll 55. The pattern mask 50 'is overlaid at a predetermined position on the surface).

  Next, the film substrate 80 on which the pattern mask 50 ′ is superimposed is conveyed to a position facing the application roll 41 (the front surface of the application roll 41). Since the coating film material is supported on the liquid supporting area 41a of the coating roll 41, the coating film 84 has a predetermined film thickness in the area facing the liquid supporting area 41a on the film substrate 80 and the pattern mask 50 ′. Formed with. On the other hand, since no coating material is carried on the liquid non-carrying region 41b of the coating roll 41, a coating 84 is formed in the region facing the liquid non-carrying region 41b on the film substrate 80 and the pattern mask 50 ′. Not. Therefore, a non-coating region continuous in the transport direction is formed on the film substrate 80 and the pattern mask 50 '. If the pattern mask 50 ′ is formed of a material that repels the coating material, or if the surface of the pattern mask 50 ′ is subjected to a liquid repellent treatment, a coating film is formed on the pattern mask 50 ′. Not.

  The film substrate 80 is then conveyed to the pattern mask peeling unit 190. After the film substrate 80 on which the pattern mask 50 ′ is superimposed passes between the peeling roll 56 and the support roll 57, the pattern mask 50 ′ is conveyed in a direction away from the film substrate 80, and the pattern mask 50 ′. Is peeled off from the film substrate 80. The peeled pattern mask 50 ′ is wound up by a mask winding roll 52. Since the coating film formed on the pattern mask 50 ′ together with the pattern mask 50 ′ is also peeled off from the film base material 80, the coating film is not formed in the region overlapped with the pattern mask 50 ′ of the film base material 80. The coating film 84 is formed only in a region that is a non-application region and does not overlap the pattern mask 50 ′ on the film substrate 80.

  As described above, a non-application area is formed in the area that overlaps the pattern mask 50 ′ of the film substrate 80 and the area that opposes the liquid non-carrying area 41 b of the application roll 41, and overlaps the pattern mask 50 ′. The coating film 84 is formed in a region facing the liquid carrying region 41a of the coating roll 41. In this way, the coating film 84 having a desired pattern can be formed on the film substrate 80.

  The coating apparatus 140d can easily form the coating film 84 having a desired pattern by changing the shape of the pattern mask 50 'to be used. Further, the coating apparatus 140d uses a pattern mask 50 ′ having a pattern divided in a direction orthogonal to the transport direction, so that the film base 80 is kept in contact with the coating roll 40 in the transport direction of the film base 80. The coating film 84 having an intermittent (discontinuous) pattern can be formed. In order to form an intermittent coating film pattern in the longitudinal direction (conveying direction) of such a film substrate, in the method described in Patent Document 1, the film substrate 80 is separated from the coating roll 40 or Although it is necessary to move the conveyance path of a film base so that it may contact, in coating device 140d of this embodiment, it is not necessary. Therefore, the complicated apparatus structure for controlling the fluctuation | variation of the tension | tensile_strength of the film base material accompanying the movement of the conveyance path of a film base material is unnecessary. Therefore, the coating device 140d can easily form a coating film having a desired discontinuous pattern while having a simple device configuration.

  Furthermore, by changing the number of liquid carrying regions of the application roll 41, the width and position in the rotation axis direction (that is, changing the number of liquid non-loading regions of the application roll 41, the width and position in the rotation axis direction), The number, position, and width of the non-application areas that are continuous in the transport direction on the film substrate 80 can be changed. Therefore, for example, when forming a coating film having a pattern in which the number, position, or width of the non-application areas continuous in the transport direction are different from each other for each of the plurality of film base materials, It is possible to form a coating film having a desired pattern on each film substrate by changing the number and the width in the rotation axis direction, or by appropriately moving the coating roll in the rotation axis direction. In this case, there is no need to prepare a pattern mask 50 'having a shape corresponding to the shape of the non-application area of each coating film pattern, and the coating film can be formed by simply changing the liquid carrying area and the liquid non-carrying area of the application roll. The pattern can be changed. Therefore, a coating film having various patterns can be more easily formed by using the coating apparatus 140d of this embodiment.

[Applicator of Fifth Embodiment]
A coating apparatus 140e according to a fifth embodiment for forming a discontinuous pattern coating film on a substrate will be described. As shown in FIG. 5, the coating apparatus 140 e of the fifth embodiment mainly includes a film transport unit 120 a that continuously feeds the film base material 80, and the film base material 80 that is sent out by the film transport unit 120 a. A coating roll 40 that forms a film 84 by applying a liquid; a coating liquid supply member 82 that supplies a coating liquid to the coating roll 40; and a film positioned upstream of the coating roll 40 in the transport direction of the film substrate 80. A pattern mask applying unit 170 for applying a pattern mask 50 ′ on the substrate 80, and a pattern for peeling the pattern mask 50 ′ on the film substrate 80 located on the downstream side of the coating roll 40 in the conveying direction of the film substrate 80. A mask peeling unit 190.

  The film transport unit 120a, the coating roll 40, the pattern mask applying unit 170, and the pattern mask peeling unit 190 of the coating device 140e of the fifth embodiment are the same as the film transport unit 120a and the coating roll 40 of the coating device 140a of the first embodiment. Since the configuration is similar to that of the pattern mask applying unit 170 and the pattern mask peeling unit 190, the description thereof is omitted.

<Coating liquid supply member>
The coating liquid supply member 82 includes two or more coating liquid supply chambers 82a in which the coating material is stored, and a part of the coating roll 40 is immersed in the stored coating material. When the coating roll 40 rotates, the coating material is supported on the area of the liquid carrying area 40a of the coating roll 40 that is immersed in the coating material, and the area of the coating roll 40 that is not immersed in the coating material is coated with the coating material. Is not supported. The size and installation position of the coating liquid supply chamber 82a in the width direction of the film substrate 80 are appropriately determined according to the length and position of the coating film 84 formed on the film substrate 80 in the width direction of the film substrate 80. Can be set.

  Next, an operation for forming the discontinuous pattern coating film 84 on the film substrate 80 using the coating apparatus 140e of the fifth embodiment as described above will be described.

  First, conveyance by the film conveyance part 120a is started, and the film base material 80 is sent out to the pattern mask provision part 170 from a supply roll. In the pattern mask applying unit 170, the surface of the film base 80 (coating film formation) is formed by sandwiching the pattern mask 50 ′ fed from the pattern mask feed roll 51 together with the film base 80 by the bonding roll 54 and the support roll 55. The pattern mask 50 'is overlaid at a predetermined position on the surface).

  Next, the film substrate 80 on which the pattern mask 50 ′ is overlaid is conveyed to a position facing the application roll 40 (the front surface of the application roll 40). The liquid carrying region 40a of the coating roll 40 is coated with the coating material supplied by the two or more coating liquid supply chambers 82a as described above, and the coating material without being supplied with the coating material. An unsupported region is formed. The coating film material adheres to a region on the film substrate 80 and the pattern mask 50 'facing the region where the coating film material of the coating roll 40 is carried, and the coating film 84 is formed with a predetermined film thickness. On the other hand, the coating film 84 is not formed in a region on the film substrate 80 and the pattern mask 50 ′ that faces the region where the coating film material of the coating roll 40 is not carried. Therefore, a non-coating region continuous in the transport direction is formed on the film substrate 80 and the pattern mask 50 '. If the pattern mask 50 ′ is formed of a material that repels the coating material, or if the surface of the pattern mask 50 ′ is subjected to a liquid repellent treatment, a coating film is formed on the pattern mask 50 ′. Not.

  The film substrate 80 is then conveyed to the pattern mask peeling unit 190. After the film substrate 80 on which the pattern mask 50 ′ is superimposed passes between the peeling roll 56 and the support roll 57, the pattern mask 50 ′ is conveyed in a direction away from the film substrate 80, and the pattern mask 50 ′. Is peeled off from the film substrate 80. The peeled pattern mask 50 ′ is taken up by the pattern mask take-up roll 52. Since the coating film formed on the pattern mask 50 ′ together with the pattern mask 50 ′ is also peeled off from the film base material 80, the coating film is not formed in the region overlapped with the pattern mask 50 ′ of the film base material 80. The coating film 84 is formed only in a region that is a non-application region and does not overlap the pattern mask 50 ′ on the film substrate 80.

  As described above, a non-application region is formed in a region facing the pattern mask 50 ′ of the film substrate 80 and a region of the coating roll 40 facing the region where the liquid is not carried, and the pattern mask 50 ′. The coating film 84 is formed in a region that does not overlap and is opposite to the region where the liquid of the coating roll 40 is carried. In this way, the coating film 84 having a desired pattern can be formed on the film substrate 80.

  The coating apparatus 140e can easily form the coating film 84 having a desired pattern by changing the shape of the pattern mask 50 'to be used. Further, the coating apparatus 140e uses a pattern mask 50 ′ having a pattern divided in a direction perpendicular to the transport direction, so that the film base 80 is kept in contact with the coating roll 40 in the transport direction of the film base 80. The coating film 84 having an intermittent (discontinuous) pattern can be formed. In order to form an intermittent coating film pattern in the longitudinal direction (conveying direction) of such a film substrate, in the method described in Patent Document 1, the film substrate 80 is separated from the coating roll 40 or Although it is necessary to move the conveyance path of a film base so that it may contact, in coating device 140e of this embodiment, it is not necessary. Therefore, the complicated apparatus structure for controlling the fluctuation | variation of the tension | tensile_strength of the film base material accompanying the movement of the conveyance path of a film base material is unnecessary. Therefore, the coating apparatus 140e can easily form a coating film having a desired discontinuous pattern while having a simple apparatus configuration.

  Furthermore, by changing the number of coating liquid supply chambers to be used, the width and the position of the coating roll in the rotation axis direction, the distance between the coating liquid supply chambers, etc. Number, position and width can be changed. Therefore, for example, in the case of forming a coating film having a pattern in which the number, position, or width of the non-application areas continuous in the transport direction are different from each other, the number of coating liquid supply chambers to be used and It is possible to form a coating film having a desired pattern on each film substrate by changing the width or appropriately moving in the direction of the rotation axis of the coating roll. In this case, it is not necessary to prepare a pattern mask 50 'having a shape corresponding to the shape of the non-application area of each coating film pattern, and the coating film pattern can be changed only by changing the coating liquid supply chamber. Therefore, a coating film having various patterns can be more easily formed by using the coating apparatus 140e of this embodiment.

  Instead of installing a plurality of coating liquid supply chambers for one coating roll, a plurality of coating rolls each having one coating liquid supply chamber may be used. In this case, the coating rolls are arranged at different positions in the transport direction of the film substrate 80, and the coating liquid supply chambers of the coating rolls are arranged at positions separated from each other in the width direction of the film substrate 80. Alternatively, the coating liquid supply chambers may be independently movable in the direction of the rotation axis of the coating roll.

[Production apparatus for film member having uneven pattern]
Embodiment of the manufacturing apparatus of the strip | belt-shaped film member which has an uneven | corrugated pattern using the above coating devices is described. As shown in FIG. 6, the apparatus for manufacturing a film member having a concavo-convex pattern mainly includes a film transport unit 120 that continuously feeds the film base 80, and the film base 80 that is fed by the film transport unit 120. The coating part 140 which forms the coating film 84 of uneven | corrugated material, and the transfer part 160 which transfers the uneven | corrugated pattern to the coating film 84 of uneven | corrugated material located in the downstream of the application part 140 are provided. The film member manufacturing apparatus 100 according to the embodiment manufactures a film base material (hereinafter referred to as a film member) 80a including an unevenness forming material provided with an uneven pattern.

<Film transport unit>
As shown in FIG. 6, the film transport unit 120 mainly includes a feed roll 72 that feeds the band-shaped film substrate 80, a take-up roll 87 that is provided downstream of the transfer unit 160 and winds up the film member 80 a, It has the conveyance roll 78 for conveying the film base material 80 and the film member 80a in a conveyance direction. The feed roll 72 and the take-up roll 87 are rotatably attached to a support base (not shown) that makes them removable. The film base 80 can be transported in the transport direction by the rotational drive of the feed roll 72 and the take-up roll 87.

  The film substrate 80 is a belt-like or elongated film substrate in order to enable continuous processing while being conveyed. Examples of the film substrate 80 include silicone resin, film-like glass, polyethylene terephthalate (PET), polyethylene terephthalate (PEN), polycarbonate (PC), cycloolefin polymer (COP), polymethyl methacrylate (PMMA), polystyrene ( PS), polyimide (PI), and an organic material such as polyarylate. The film substrate 80 may be transparent or opaque. In order to improve the adhesion between the film substrate 80 and the coating film of the unevenness forming material formed on the surface thereof, the film substrate 80 may be subjected to an easy adhesion treatment on the surface. Further, a gas barrier layer may be provided on the surface of the film substrate 80. Although the dimension of the film base material 80 can be set suitably, for example, the width | variety of the film base material 80 can be 50-3000 mm, and thickness can be 1-500 micrometers.

<Applying part>
The coating unit 140 is configured by the coating apparatus 140a, 140b, 140c, 140d, or 140e of the above-described embodiment, and forms the coating film 84 of the unevenness forming material having a discontinuous (separated) pattern on the film substrate 80. To do. In addition, the conveyance part 120a of the coating device 140a-140e of the above-mentioned embodiment becomes a part of the film conveyance part 120 of the manufacturing apparatus of this embodiment.

<Transfer section>
As shown in FIG. 6, the transfer unit 160 includes a transfer roll 90 and a pressing roll (nip roll) 74 facing the transfer roll 90.

  The transfer roll 90 is a roll-shaped (columnar or cylindrical) mold having an uneven pattern on the outer peripheral surface. The transfer roll 90 has a drive shaft, and is driven to rotate about the shaft by a drive device such as a motor. Although the dimension of the uneven | corrugated pattern of a transfer roll can be suitably set with the dimension etc. of the film member to manufacture, a diameter can be 50-1000 mm and the length of an axial direction can be 50-3000 mm, for example.

  The transfer roll 90 used in the present embodiment is configured by attaching a thin plate-shaped mold having a concavo-convex pattern on the outer peripheral surface of a cylindrical base roll. As the material of the base roll, for example, iron, copper, titanium, stainless steel, aluminum, or the like can be used. In addition, the base roll can have a diameter of 50 to 1000 mm and an axial length of 50 to 3000 mm as an example. Examples of the thin plate mold include a plate-shaped metal mold or a film-shaped resin mold manufactured by a method described later. The resin constituting the resin mold includes rubber such as natural rubber or synthetic rubber. Depending on the application of the film member to be manufactured, the concave and convex pattern of the thin plate mold is a microlens array structure, a structure having functions such as light diffusion and diffraction, a stripe structure consisting of lines and spaces, a cylindrical shape, a conical shape, a truncated cone shape, Triangular prism, triangular pyramid, triangular frustum, quadratic prism, quadrangular pyramid, quadrangular frustum, polygonal pillar, polygonal pyramid, polygonal frustum, etc. . For example, the irregular pitch pattern may be such that the pitch of the irregularities is not uniform and the direction of the irregularities has no directivity. For example, when the film member is used for production of an optical substrate used for visible light diffraction or scattering, the average pitch of the irregularities can be in the range of 100 to 1500 nm, and is in the range of 200 to 1200 nm. It is more preferable. In a similar application, the average value (average height) of the uneven depth distribution is preferably in the range of 20 to 200 nm, and more preferably in the range of 30 to 150 nm. The standard deviation of the unevenness depth is preferably in the range of 10 to 100 nm, and more preferably in the range of 15 to 75 nm.

  The light scattered and / or diffracted from such a concavo-convex pattern has a relatively broad wavelength band, not light of a single or narrow band wavelength, and the scattered light and / or diffracted light is directed. There is no sex and heads in all directions. However, in the “irregular irregularity pattern”, the Fourier transform image obtained by performing the two-dimensional fast Fourier transform processing on the irregularity analysis image obtained by analyzing the shape of the irregularity on the surface shows a circular or annular pattern. In other words, it includes such a quasi-periodic structure in which the distribution of the pitch of the projections and depressions has no directivity in the direction of the projections and depressions. As long as the uneven pitch distribution diffracts visible light, the member having such a quasi-periodic structure can be used for a member used for a light emitting element such as an organic EL element, LED, or ECL, or a photoelectric conversion element such as a solar cell. It is suitable as a member used or a member used for manufacturing them.

  A single mold may be used as the thin plate mold, which may be wound around a base roll and attached. Alternatively, two or more mold plates may be used as the thin plate mold, and they may be attached so as to wind the outer peripheral surface of the base roll. The total length in the winding direction of the thin plate mold may be designed to be shorter than the length in the circumferential direction of the base roll. The thin plate mold can be fixed to the base roll using an adhesive, a magnet, a screw or the like. When a metal mold (metal mold) is used as the thin plate mold, for example, the metal mold is wound around the base roll, and the end of the metal mold is welded to the base roll, so that the metal mold is attached to the base roll. Can be fixed. By fixing the thin plate mold to the base roll as described above, the ends of the thin plate mold can be joined together. You may perform a mold release process to an uneven | corrugated pattern surface as needed.

  The example of the manufacturing method of the thin plate mold which has an uneven | corrugated pattern is demonstrated. First, a matrix pattern for forming the concave / convex pattern of the mold is prepared. For example, the irregular pattern of the matrix is formed by a method using self-organization (microphase separation) by heating of a block copolymer described in WO 2012/096368 by the applicants (hereinafter referred to as “BCP (Block Copolymer)”. ) Thermal annealing method), a method using self-assembly of a block copolymer described in WO2013 / 161454 in a solvent atmosphere (hereinafter referred to as “BCP solvent annealing method” as appropriate), or WO2011 / It is preferable to use the method disclosed in 007878A1 for heating and cooling the deposited film on the polymer film to form irregularities due to wrinkles on the polymer surface (hereinafter referred to as “BKL (Buckling) method” as appropriate). is there. Instead of the BCP thermal annealing method, the BCP solvent annealing method, and the BKL method, a photolithography method may be used. In addition, for example, by using a micromachining method such as a cutting method, an electron beam direct drawing method, a particle beam beam machining method, and an operation probe machining method, and a micromachining method using self-organization of fine particles, Can be produced. In the case of forming a pattern by the BCP thermal annealing method and the BCP solvent annealing method, any material can be used as the material for forming the pattern, but a styrenic polymer such as polystyrene, a polyalkyl methacrylate such as polymethyl methacrylate, etc. A block copolymer consisting of two combinations selected from the group consisting of polyethylene oxide, polybutadiene, polyisoprene, polyvinyl pyridine, and polylactic acid is preferred. Etching by irradiating energy rays typified by ultraviolet rays such as excimer UV light, and etching by a dry etching method such as RIE (reactive ion etching) on the uneven pattern obtained by the solvent annealing treatment May be performed. Moreover, you may heat-process with respect to the uneven | corrugated pattern which performed such an etching.

  After the pattern matrix is formed by a BCP thermal annealing method, a BCP solvent annealing method, a BKL method, or the like, a mold on which the pattern is further transferred can be formed by an electroforming method or the like as follows. First, a seed layer that becomes a conductive layer for electroforming can be formed on a matrix having a pattern by electroless plating, sputtering, vapor deposition, or the like. The seed layer is preferably 10 nm or more in order to make the current density uniform in the subsequent electroforming process and to make the thickness of the metal layer deposited by the subsequent electroforming process constant. Examples of seed layer materials include nickel, copper, gold, silver, platinum, titanium, cobalt, tin, zinc, chromium, gold / cobalt alloy, gold / nickel alloy, boron / nickel alloy, solder, copper / nickel / chromium An alloy, a tin-nickel alloy, a nickel-palladium alloy, a nickel-cobalt-phosphorus alloy, or an alloy thereof can be used. Next, a metal layer is deposited on the seed layer by electroforming (electroplating). The thickness of the metal layer can be, for example, 10 to 3000 μm in total including the thickness of the seed layer. Any of the above metal species that can be used as a seed layer can be used as a material for the metal layer deposited by electroforming. The formed metal layer desirably has an appropriate hardness and thickness from the viewpoint of ease of processing such as pressing, peeling and cleaning of the resin layer for forming a subsequent mold.

  The metal layer including the seed layer obtained as described above is peeled off from the matrix having the concavo-convex structure to obtain a metal substrate. The peeling method may be physically peeled off, or the material forming the pattern may be removed by dissolving it using an organic solvent that dissolves them, for example, toluene, tetrahydrofuran (THF), chloroform or the like. When the metal substrate is peeled from the mother die, the remaining material components can be removed by washing. As a cleaning method, wet cleaning using a surfactant or the like, or dry cleaning using ultraviolet rays or plasma can be used. Further, for example, remaining material components may be adhered and removed using an adhesive or an adhesive. The metal substrate (metal mold) having the pattern transferred from the mother die thus obtained can be used as the thin plate mold of this embodiment.

  Furthermore, a film-like resin mold can be produced by transferring the concavo-convex structure (pattern) of the metal substrate to a film-like support substrate using the obtained metal substrate. For example, after the curable resin is applied to the support substrate, the resin layer is cured while pressing the uneven structure of the metal substrate against the resin layer. As a support substrate, for example, a substrate made of an inorganic material such as glass or silicon substrate, polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polycarbonate (PC), cycloolefin polymer (COP), polymethyl methacrylate (PMMA), Examples thereof include resin substrates such as polystyrene (PS), polyimide (PI), and polyarylate, and base materials made of metal materials such as nickel, copper, and aluminum. The support substrate may be transparent or opaque. In order to improve adhesion, a surface treatment or an easy adhesion layer may be provided on the substrate, or a gas barrier layer may be provided. The thickness of the support substrate can be in the range of 1 to 500 μm.

  Examples of the curable resin include epoxy, acrylic, methacrylic, vinyl ether, oxetane, urethane, melamine, urea, polyester, polyolefin, phenol, cross-linked liquid crystal, fluorine, and silicone. And various resins such as monomers, oligomers, polymers, and the like. The thickness of the curable resin is preferably in the range of 0.5 to 500 μm. If the thickness is less than the lower limit, the height of the irregularities formed on the surface of the cured resin layer tends to be insufficient, and if the thickness exceeds the upper limit, the influence of the volume change of the resin that occurs during curing increases and the irregular shape is well formed. It may not be possible.

Examples of the method for applying the curable resin include spin coating, spray coating, dip coating, dropping, gravure printing, screen printing, letterpress printing, die coating, curtain coating, ink jet, and sputtering. Various coating methods such as a method can be employed. Furthermore, the conditions for curing the curable resin vary depending on the type of resin used. For example, the curing temperature is in the range of room temperature to 250 ° C., and the curing time is in the range of 0.5 minutes to 3 hours. Preferably there is. It is also possible by a method of curing by irradiation of energy rays such as ultraviolet rays or electron beams, in that case, it is preferable dose is in the range of ^{20mJ / cm 2 ~5J / cm 2} .

  Next, the metal substrate is removed from the cured resin layer after curing. The method for removing the metal substrate is not limited to the mechanical peeling method, and a known method can be adopted. A film-like resin mold having a cured resin layer in which irregularities are formed on a support substrate that can be obtained in this manner can be used as the thin plate-shaped mold of the present embodiment.

  In addition, by applying a rubber-based resin material on the concavo-convex structure (pattern) of the metal substrate obtained by the above-described method, curing the applied resin material, and peeling from the metal substrate, the concavo-convex pattern of the metal substrate can be obtained. A transferred rubber mold can be produced. The obtained rubber mold can be used as the thin plate mold of this embodiment.

  In the transfer unit 160, the pressing roll 74 sandwiches the film base material 80 on which the coating film 84 of the unevenness forming material is formed together with the transfer roll 90, and the back surface of the base material 80 (the surface on which the coating film of the unevenness forming material is formed). The base material 80 is pressed from the opposite surface). In the embodiment shown in FIG. 5, the upstream and downstream conveying rolls 78 of the transfer unit 160 are arranged so that the base material 80 is wound around substantially half of the circumference of the transfer roll 90. In this embodiment, the base material 80 is in contact with the transfer roll 90 in front of or in the vicinity of the pressing roll 74, winds about half a circumference of the transfer roll 90, leaves the transfer roll 90, and is peeled off from the transfer roll 90. . Thereby, the film member 80a is obtained. Further, in this embodiment, a UV irradiation light source 85 is provided on the downstream side of the pressing roll 74 and on the upstream side from the position where the substrate 80 peels from the transfer roll 90. Instead of the UV irradiation light source 85, a device for curing the coating film 84 of the unevenness forming material such as a heater may be provided.

  The film member manufacturing apparatus 100 may further be provided with a static eliminator for neutralizing the film substrate 80 fed from the feed roll 72 and the film member 80a before being taken up by the take-up roll 87. .

  The film member manufacturing apparatus 100 further includes an inspection apparatus that observes the thickness and state of the coating film formed by the application unit 140, an inspection apparatus that observes the uneven pattern of the coating film 84 after being peeled off from the transfer roll 90, and the like. Can be provided.

[Method for producing film member having uneven pattern]
Next, operation | movement of said film member manufacturing apparatus 100 and embodiment of the manufacturing method of a film member are described, referring FIG.

  First, the conveyance by the conveyance unit 120 is started, and the film substrate 80 is sent from the feeding roll 72 to the coating unit 140 via the conveyance roll 78.

  In the coating part 140, the coating film 84 of the uneven | corrugated material which has a discontinuous pattern is formed on the film base material 80 with the above-mentioned coating device 140a, 140b, 140c, 140d or 140e. Thereby, the coating film 84 is formed in a desired discontinuous region on the substrate 80.

  As the concavo-convex forming material, a photo-curing resin, a thermosetting resin, a thermoplastic resin can be used, for example, epoxy-based, acrylic-based, methacryl-based, vinyl ether-based, oxetane-based, urethane-based, melamine-based, urea-based, Various resins such as monomers, oligomers, polymers and the like such as polyester, polyolefin, phenol, cross-linked liquid crystal, fluorine, silicone, and polyamide are listed.

The unevenness forming material may be formed of an inorganic material because of its excellent heat resistance. In particular, silica, Ti-based material, ITO (indium-tin-oxide) -based material, ZnO, ZrO ₂ , Al ₂ O ₃ A sol-gel material such as can be used. For example, when a concavo-convex pattern layer made of silica is formed on a film substrate by a sol-gel method, a metal alkoxide (silica precursor) sol-gel material is prepared. As precursors of silica, tetramethoxysilane (TMOS), tetraethoxysilane (TEOS), tetra-i-propoxysilane, tetra-n-propoxysilane, tetra-i-butoxysilane, tetra-n-butoxysilane, tetra- Tetraalkoxide monomers typified by tetraalkoxysilane such as sec-butoxysilane, tetra-t-butoxysilane, methyltrimethoxysilane, ethyltrimethoxysilane, propyltrimethoxysilane, isopropyltrimethoxysilane, phenyltrimethoxysilane, Methyltriethoxysilane (MTES), ethyltriethoxysilane, propyltriethoxysilane, isopropyltriethoxysilane, phenyltriethoxysilane, methyltripropoxysilane, ethyltripro Xysilane, propyltripropoxysilane, isopropyltripropoxysilane, phenyltripropoxysilane, methyltriisopropoxysilane, ethyltriisopropoxysilane, propyltriisopropoxysilane, isopropyltriisopropoxysilane, phenyltriisopropoxysilane, tolyltriethoxy Trialkoxide monomers represented by trialkoxysilanes such as silane, dimethyldimethoxysilane, dimethyldiethoxysilane, dimethyldipropoxysilane, dimethyldiisopropoxysilane, dimethyldi-n-butoxysilane, dimethyldi-i-butoxysilane, dimethyldi- sec-Butoxysilane, Dimethyldi-t-butoxysilane, Diethyldimethoxysilane, Diethyldiethoxysilane, Diethyl Dipropoxysilane, Diethyldiisopropoxysilane, Diethyldi-n-butoxysilane, Diethyldi-i-butoxysilane, Diethyldi-sec-butoxysilane, Diethyldi-t-butoxysilane, Dipropyldimethoxysilane, Dipropyldiethoxysilane, Di Propyl dipropoxysilane, dipropyldiisopropoxysilane, dipropyldi-n-butoxysilane, dipropyldi-i-butoxysilane, dipropyldi-sec-butoxysilane, dipropyldi-t-butoxysilane, diisopropyldimethoxysilane, diisopropyldiethoxysilane, diisopropyl Dipropoxysilane, diisopropyldiisopropoxysilane, diisopropyldi-n-butoxysilane, diisopropyldi-i-butoxysilane, diisopro Pildi-sec-butoxysilane, diisopropyldi-t-butoxysilane, diphenyldimethoxysilane, diphenyldiethoxysilane, diphenyldipropoxysilane, diphenyldiisopropoxysilane, diphenyldi-n-butoxysilane, diphenyldi-i-butoxysilane Dialkoxide monomers typified by dialkoxysilanes such as diphenyldi-sec-butoxysilane and diphenyldi-t-butoxysilane can be used. Furthermore, alkyltrialkoxysilane or dialkyl dialkoxysilane whose alkyl group has C4-C18 carbon atoms can also be used. Monomers having a vinyl group such as vinyltrimethoxysilane and vinyltriethoxysilane, 2- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, 3-glycidoxypropyltrimethoxy Monomers having an epoxy group such as silane, 3-glycidoxypropylmethyldiethoxysilane, 3-glycidoxypropyltriethoxysilane, monomers having a styryl group such as p-styryltrimethoxysilane, 3-methacryloxypropylmethyl Monomers having a methacrylic group such as dimethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-methacryloxypropylmethyldiethoxysilane, 3-methacryloxypropyltriethoxysilane, 3-acryloxypropyl Monomers having an acrylic group such as trimethoxysilane, N-2- (aminoethyl) -3-aminopropylmethyldimethoxysilane, N-2- (aminoethyl) -3-aminopropyltrimethoxysilane, 3-aminopropyltri Monomers having amino groups, such as methoxysilane, 3-aminopropyltriethoxysilane, 3-triethoxysilyl-N- (1,3-dimethyl-butylidene) propylamine, N-phenyl-3-aminopropyltrimethoxysilane, Monomers having a ureido group such as 3-ureidopropyltriethoxysilane, monomers having a mercapto group such as 3-mercaptopropylmethyldimethoxysilane, 3-mercaptopropyltrimethoxysilane, sulfi such as bis (triethoxysilylpropyl) tetrasulfide A monomer having a group, a monomer having an isocyanate group such as 3-isocyanatopropyltriethoxysilane, a polymer obtained by polymerizing these monomers in a small amount, a composite material characterized by introducing a functional group or a polymer into a part of the material, etc. Metal alkoxides may be used. In addition, some or all of the alkyl group and phenyl group of these compounds may be substituted with fluorine. Furthermore, metal acetylacetonate, metal carboxylate, oxychloride, chloride, a mixture thereof and the like can be mentioned, but not limited thereto. Examples of the metal species include, but are not limited to, Ti, Sn, Al, Zn, Zr, In, and a mixture thereof in addition to Si. What mixed suitably the precursor of the said metal oxide can also be used. Furthermore, a silane coupling agent having a hydrolyzable group having affinity and reactivity with silica and an organic functional group having water repellency can be used as a precursor of silica. For example, silane monomers such as n-octyltriethoxysilane, methyltriethoxysilane, methyltrimethoxysilane, vinyltriethoxysilane, vinyltrimethoxysilane, vinyltris (2-methoxyethoxy) silane, vinylsilane such as vinylmethyldimethoxysilane, Methacrylic silane such as 3-methacryloxypropyltriethoxysilane, 3-methacryloxypropyltrimethoxysilane, 2- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-glycyl Epoxy silanes such as Sidoxypropyltriethoxysilane, 3-Mercaptopropyltrimethoxysilane, Mercaptosilanes such as 3-Mercaptopropyltriethoxysilane, 3-Octanoylthio-1-pro Sulfur silane such as rutriethoxysilane, 3-aminopropyltriethoxysilane, 3-aminopropyltrimethoxysilane, N- (2-aminoethyl) -3-aminopropyltrimethoxysilane, N- (2-aminoethyl)- Examples include aminosilanes such as 3-aminopropylmethyldimethoxysilane and 3- (N-phenyl) aminopropyltrimethoxysilane, and polymers obtained by polymerizing these monomers.

  When a mixture of TEOS and MTES is used as the unevenness forming material, the mixing ratio thereof can be set to 1: 1, for example, as a molar ratio. This sol-gel material produces amorphous silica by performing hydrolysis and polycondensation reactions. In order to adjust the pH of the solution as a synthesis condition, an acid such as hydrochloric acid or an alkali such as ammonia is added. The pH is preferably 4 or less or 10 or more. Moreover, you may add water in order to perform a hydrolysis. The amount of water to be added can be 1.5 times or more in molar ratio with respect to the metal alkoxide species.

  Examples of the solvent of the concavo-convex material solution made of a sol-gel material include alcohols such as methanol, ethanol, isopropyl alcohol (IPA) and butanol, aliphatic hydrocarbons such as hexane, heptane, octane, decane and cyclohexane, benzene, Aromatic hydrocarbons such as toluene, xylene and mesitylene, ethers such as diethyl ether, tetrahydrofuran and dioxane, ketones such as acetone, methyl ethyl ketone, isophorone and cyclohexanone, butoxyethyl ether, hexyloxyethyl alcohol, methoxy-2-propanol , Ether alcohols such as benzyloxyethanol, glycols such as ethylene glycol and propylene glycol, ethylene glycol dimethyl ether, diethylene glycol Glycol ethers such as methyl ether and propylene glycol monomethyl ether acetate, esters such as ethyl acetate, ethyl lactate and γ-butyrolactone, phenols such as phenol and chlorophenol, N, N-dimethylformamide, N, N-dimethylacetamide Amides such as N-methylpyrrolidone, halogen-based solvents such as chloroform, methylene chloride, tetrachloroethane, monochlorobenzene and dichlorobenzene, hetero-containing compounds such as carbon disulfide, water, and mixed solvents thereof. In particular, ethanol and isopropyl alcohol are preferable, and those in which water is mixed are also preferable.

  Additives for concavo-convex forming materials consisting of sol-gel materials include polyethylene glycol, polyethylene oxide, hydroxypropyl cellulose, polyvinyl alcohol for viscosity adjustment, alkanolamines such as triethanolamine which are solution stabilizers, β diketones such as acetylacetone , Β-ketoester, formamide, dimethylformamide, dioxane and the like can be used. Further, as an additive of the sol-gel material solution, a material that generates acid or alkali by irradiating light such as energy rays typified by ultraviolet rays such as excimer UV light can be used. By adding such a material, the sol-gel material solution can be cured by irradiation with light.

  The thickness of the coating film 84 of the uneven forming material to be formed is preferably in the range of 0.5 to 500 μm. If the thickness is less than the lower limit, the height of the unevenness formed on the surface of the unevenness forming material tends to be insufficient, and if the thickness exceeds the upper limit, the effect of volume change of the unevenness forming material that occurs during curing increases and the uneven shape is good. May not be formed.

  Next, the base material 80 on which the coating film 84 of the unevenness forming material is formed in a desired discontinuous region is laid and conveyed on the conveyance roll 78 downstream of the application unit 140, and the transfer roll 90 of the transfer unit 160. And it goes to the pressing roll 74. The substrate 80 conveyed immediately below the pressing roll 74 is superimposed on the concave / convex pattern of the transfer roll 90 and pressed by the pressing roll 74, and the concave / convex pattern of the transfer roll 90 is transferred to the coating film 84.

UV light from the UV light source 85 may be applied to the base material 80 on which the concave / convex pattern has been transferred by the pressing roll 74 while the transfer roll 90 is being pressed, thereby promoting the curing of the coating film 84. The conditions for curing the unevenness forming material vary depending on the type of material used as the unevenness forming material. For example, when the unevenness forming material is cured by heating, the curing temperature is in the range of room temperature to 250 ° C., and the curing time. Is preferably in the range of 0.5 minutes to 3 hours. It is also possible by a method of curing by irradiation of energy rays such as ultraviolet rays or electron beams, in that case, it is preferable dose is in the range of ^{20mJ / cm 2 ~5J / cm 2} . In the example shown in FIG. 6, the UV light can be irradiated to the coating film 84 of the unevenness forming material by the UV irradiation light source 85 disposed below the transfer roll 90.

  From the transfer roll 90, the film base material (film member 80 a) having the cured coating film 84 a of the unevenness forming material is changed in the course along the outer periphery of the transfer roll 90 and then conveyed away from the transfer roll 90. Peel off. Thereafter, the film member 80 a is wound around the winding roll 87. The method of peeling the film member 80a from the transfer roll 90 is not limited to a mechanical peeling method, and any known method can be adopted. For example, in FIG. 6, the film member 80a having the coating film (unevenness pattern layer) 84a of the concavo-convex forming material after curing is conveyed in the direction away from the transfer roll 90 on the downstream side of the pressing roll 74, thereby Can be peeled from the transfer roll 90. Thus, a film member 80a having a cured uneven pattern layer 84a in which unevenness is formed on the film substrate 80 can be obtained. The uneven pattern layer 84a is formed in a region having a desired discontinuous pattern on the film substrate 80.

[Manufacturing Method of Substrate Equipped with Uneven Structure Layer]
Furthermore, the board | substrate provided with the uneven structure layer by which the uneven | corrugated pattern of the film member was transcribe | transferred can be manufactured by using the film member manufactured using the above methods and manufacturing apparatuses as a film-like mold. Details of this method will be described below.

In order to form the concavo-convex structure layer to which the concavo-convex pattern of the film-shaped mold is transferred by the sol-gel method, first, a solution of the sol-gel material is prepared. The concavo-convex structure layer is preferably formed of an inorganic material because of its excellent heat resistance. In particular, silica, Ti-based material, ITO (indium-tin-oxide) -based material, ZnO, ZrO ₂ , Al ₂ O A sol-gel material such as ₃ can be used. As the metal alkoxide (precursor), the solvent, and the additive used for the preparation of the solution of the sol-gel material, the metal alkoxide (which can be used as the unevenness forming material in the embodiment of the manufacturing method of the band-shaped film member described above) The same as those exemplified as the precursor), the solvent, and the additive can be used.

  The prepared solution of sol-gel material is applied onto the substrate. Substrates made of inorganic materials such as glass, quartz and silicon substrates, polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polycarbonate (PC), cycloolefin polymer (COP), polymethyl methacrylate (PMMA), polystyrene Resin substrates such as (PS), polyimide (PI), and polyarylate can be used. The substrate may be transparent or opaque. If the concavo-convex pattern substrate obtained from this substrate is used for the production of an organic EL element, the substrate is preferably a substrate having heat resistance, light resistance to UV light and the like. From this viewpoint, a substrate made of an inorganic material such as glass, quartz, or a silicon substrate is more preferable. In particular, it is preferable that the substrate is formed of an inorganic material because a difference in refractive index between the substrate and the concavo-convex structure layer is small and unintended refraction and reflection in the optical substrate can be prevented. In order to improve adhesion, a surface treatment or an easy-adhesion layer may be provided on the substrate, or a gas barrier layer may be provided for the purpose of preventing the ingress of gases such as moisture and oxygen. . The substrate may have an optical function layer having various optical functions such as light collection and light diffusion on the surface opposite to the surface on which the concavo-convex structure layer is formed. Any coating method such as a bar coating method, a spin coating method, a spray coating method, a dip coating method, a die coating method, and an ink jet method can be used as a coating method for the sol-gel material. The bar coating method, die coating method and spin coating method are preferred because the material can be applied uniformly and the application can be completed quickly before the sol-gel material gels. In addition, since the desired concavo-convex pattern made of a sol-gel material is formed in a later step, the surface of the substrate (including the surface treatment and the easy adhesion layer) may be flat, and the substrate itself may have the desired concavo-convex pattern. Has no pattern. The film thickness of the applied sol-gel material may be, for example, 100 to 500 nm.

  After application of the sol-gel material, the substrate may be held in the air or under reduced pressure in order to evaporate the solvent in the coating film (hereinafter also referred to as “sol-gel material layer” as appropriate). If this holding time is short, the viscosity of the coating film becomes too low to transfer the uneven pattern in the subsequent pressing step, and if the holding time is too long, the polymerization reaction of the precursor proceeds and the viscosity of the coating film is high. Thus, the uneven pattern cannot be transferred in the pressing step. Further, after the application of the sol-gel material, the polymerization reaction of the precursor proceeds with the progress of the evaporation of the solvent, and the physical properties such as the viscosity of the sol-gel material change in a short time. From the viewpoint of the stability of the concave / convex pattern formation, it is desirable that the drying time range in which the pattern transfer can be satisfactorily wide is sufficiently wide. This includes the drying temperature (holding temperature), the drying pressure, the sol-gel material species, the mixing ratio of the sol-gel material species, It can be adjusted by the amount of solvent used at the time of material preparation (concentration of sol-gel material) or the like.

  Next, the concavo-convex structure layer is formed by transferring the concavo-convex pattern of the film-shaped mold to the sol-gel material layer using the film member manufactured by the above-described method and manufacturing apparatus as a film-shaped mold for concavo-convex pattern transfer. At this time, the mold may be pressed against the sol-gel material layer using a pressing roll. In the roll process using a pressure roll, the time for contact between the mold and the coating film is short compared to the press type, so that pattern breakage due to differences in the thermal expansion coefficients of the mold, the substrate, and the stage on which the substrate is installed is prevented. Can prevent gas bubbles from being generated in the pattern due to bumping of the solvent in the sol-gel material solution, and gas marks can be prevented from remaining, and because it makes line contact with the substrate (coating film), transfer pressure In addition, the peeling force can be reduced, and it is easy to cope with an increase in area, and there is an advantage that air bubbles are not caught during pressing. Further, the substrate may be heated while pressing the mold. As an example of pressing the mold against the sol-gel material layer using the pressing roll, as shown in FIG. 7, the film-shaped mold 80a is fed by feeding the film-shaped mold 80a between the pressing roll 122 and the substrate 10 conveyed immediately below the pressing roll 122. Can be transferred to the sol-gel material layer 12 on the substrate 10. That is, when the film-shaped mold 80a is pressed against the sol-gel material layer 12 by the pressing roll 122, the film-shaped mold 80a is conveyed on the surface of the sol-gel material layer 12 on the substrate 10 while the film-shaped mold 80a and the substrate 10 are conveyed synchronously. Cover. At this time, the film-shaped mold 80a and the substrate 10 are brought into close contact with each other by rotating while pressing the pressing roll 122 against the back surface of the film-shaped mold 80a (the surface opposite to the surface on which the concavo-convex pattern is formed). In order to feed the strip-shaped film-shaped mold 80a toward the pressing roll 122, it is convenient to unwind and use the film-shaped mold 80a as it is from the film roll around which the strip-shaped film-shaped mold 80a is wound.

  After pressing the mold against the sol-gel material layer, the sol-gel material layer may be calcined. By pre-firing, the gelation of the sol-gel material layer is promoted, the pattern is solidified, and it is difficult to collapse during peeling. When pre-baking is performed, it is preferable to heat in the atmosphere at a temperature of 40 to 150 ° C. Note that the preliminary firing is not necessarily performed.

  After pressing the mold or pre-baking the sol-gel material layer, the mold is peeled from the sol-gel material layer. A known peeling method can be employed as a mold peeling method. The mold may be peeled off while heating, whereby the gas generated from the sol-gel material layer can be released, and bubbles can be prevented from being generated in the sol-gel material layer. When the roll process is used, the peeling force may be smaller than that of a plate mold used in the press method, and the mold can be easily peeled from the sol-gel material layer without the sol-gel material layer remaining in the mold. In particular, since the sol-gel material layer is pressed while being heated, the reaction easily proceeds, and the mold is easily peeled off from the sol-gel material layer immediately after pressing. Furthermore, you may use a peeling roll for the improvement of the peelability of a mold. As shown in FIG. 7, the peeling roll 123 is provided on the downstream side of the pressing roll 122, and the film-like mold 80 a is rotated and supported by the peeling roll 123 while urging the sol-gel material layer 12. The state attached to the layer (coating film) 12 can be maintained only for the distance between the pressing roll 122 and the peeling roll 123 (a fixed time). Then, by changing the course of the film mold 80a so that the film mold 80a is pulled up above the peeling roll 123 on the downstream side of the peeling roll 123, the film mold 80a is pulled from the sol-gel material layer 12 on which the irregularities are formed. It is peeled off. The sol-gel material layer 12 may be pre-fired or heated during the period in which the film-shaped mold 80a is attached to the sol-gel material layer 12. In addition, when using the peeling roll 123, peeling of the mold 80a can be made still easier by peeling, for example, heating at 40-150 degreeC.

  After the mold is peeled from the sol-gel material layer, the sol-gel material layer may be cured, thus forming the concavo-convex structure layer. In the present embodiment, the sol-gel material layer can be cured by the main baking. By the main baking, the hydroxyl group contained in the silica (amorphous silica) constituting the sol-gel material layer (coating film) is detached, and the sol-gel material layer becomes stronger. The main baking is preferably performed at a temperature of 200 to 1200 ° C. for about 5 minutes to 6 hours. Thus, the sol-gel material layer is cured to obtain a substrate having a concavo-convex pattern corresponding to the concavo-convex pattern of the mold, that is, a substrate in which a concavo-convex structure layer made of a sol-gel material is directly formed on a flat substrate. At this time, when the concavo-convex structure layer is made of silica, it becomes amorphous or crystalline, or a mixed state of amorphous and crystalline depending on the firing temperature and firing time. In addition, when a material that generates an acid or alkali by irradiating light such as ultraviolet rays is added, an energy ray such as ultraviolet rays or excimer UV is irradiated to the concavo-convex structure layer when transferring the concavo-convex pattern. The concavo-convex structure layer may be cured by.

  Note that the surface of the uneven structure layer may be subjected to a hydrophobic treatment. A known method may be used for the hydrophobizing treatment. For example, if the surface is silica, it can be hydrophobized with dimethyldichlorosilane, trimethylalkoxysilane, or the like, or trimethylsilyl such as hexamethyldisilazane. A method of hydrophobizing with an agent and silicone oil may be used, or a surface treatment method of metal oxide powder using supercritical carbon dioxide may be used. By making the surface of the concavo-convex structure layer hydrophobic, moisture can be easily removed from the substrate in the manufacturing process when the concavo-convex pattern substrate manufactured by the manufacturing method of the embodiment is used for manufacturing a device such as an organic EL element. It is possible to prevent the occurrence of defects such as dark spots in the organic EL element and the deterioration of the device.

  Moreover, in the said embodiment, although the sol-gel material was used as a material of a concavo-convex structure layer, you may use curable resin material other than the above-mentioned inorganic material. As the curable resin, for example, a resin such as photo-curing and thermosetting, moisture-curing type, and chemical-curing type (two-component mixing) can be used. Specifically, epoxy, acrylic, methacrylic, vinyl ether, oxetane, urethane, melamine, urea, polyester, polyolefin, phenol, cross-linkable liquid crystal, fluorine, silicone, polyamide And various resins such as monomers, oligomers and polymers. Further, a gas barrier layer may be provided on the surface of the concavo-convex structure layer for the purpose of preventing the entry of gas such as moisture and oxygen.

When forming a concavo-convex structure layer using a curable resin, for example, by applying a curable resin to a substrate and then curing the coating film while pressing a mold having a fine concavo-convex pattern on the applied curable resin layer The concavo-convex pattern of the mold can be transferred to the curable resin layer. The curable resin may be applied after being diluted with an organic solvent. As the organic solvent used in this case, a solvent capable of dissolving the uncured resin can be selected and used. For example, it can be selected from known solvents such as alcohol solvents such as methanol, ethanol and isopropyl alcohol (IPA), and ketone solvents such as acetone, methyl ethyl ketone and methyl isobutyl ketone (MIBK). Examples of the method for applying the curable resin include spin coating, spray coating, dip coating, dropping, gravure printing, screen printing, letterpress printing, die coating, curtain coating, ink jet, and sputtering. Various coating methods such as a method can be employed. The conditions for curing the curable resin vary depending on the type of resin used. For example, the curing temperature is in the range of room temperature to 250 ° C., and the curing time is in the range of 0.5 minutes to 3 hours. Is preferred. It is also possible by a method of curing by irradiation of energy rays such as ultraviolet rays or electron beams, in that case, it is preferable dose is in the range of ^{20mJ / cm 2 ~5J / cm 2} .

Moreover, you may use a silane coupling agent as a material of an uneven structure layer. Thereby, when manufacturing an organic EL element using the board | substrate which has the uneven | corrugated pattern (uneven structure) of embodiment, improving the adhesiveness between layers, such as an uneven structure layer and an electrode formed on it. Thus, resistance in a cleaning process and a high-temperature treatment process in the manufacturing process of the organic EL element is improved. The type of the silane coupling agent used in the concavo-convex structure layer is not particularly limited. For example, RSiX ₃ (R is selected from a vinyl group, a glycidoxy group, an acrylic group, a methacryl group, an amino group, and a mercapto group. An organic functional group containing at least one selected from the above, and X is a halogen element or an alkoxyl group). Examples of methods for applying the silane coupling agent include spin coating, spray coating, dip coating, dropping, gravure printing, screen printing, letterpress printing, die coating, curtain coating, ink jet, and sputtering. Various coating methods such as a method can be employed. Thereafter, a cured film can be obtained by drying under appropriate conditions according to each material. For example, you may heat-dry at 100-150 degreeC for 15-90 minutes.

  The material of the uneven structure layer may be an inorganic material or a curable resin material containing an ultraviolet absorbing material. The ultraviolet absorbing material has an action of suppressing deterioration of the film by absorbing ultraviolet rays and converting light energy into a harmless form such as heat. As the ultraviolet absorber, conventionally known ones can be used. For example, a benzotriazole-based absorbent, a triazine-based absorbent, a salicylic acid derivative-based absorbent, a benzophenone-based absorbent, or the like can be used.

  As mentioned above, although embodiment of this invention has been described, the coating apparatus and coating method of this invention, the manufacturing apparatus and manufacturing method of the film member which has an uneven | corrugated pattern, and the board | substrate which has an uneven | corrugated pattern using the film member manufactured by it The manufacturing method is not limited to the above embodiment, and can be appropriately modified within the scope of the technical idea described in the claims. In addition, the coating apparatus and the film member manufacturing apparatus of the present invention are not limited to the configuration of the above-described embodiment, and the arrangement of various elements such as a transport roll may be different from the arrangement shown in the drawings of the present application. In addition, the coating device and the film member having a concavo-convex pattern of the present invention can be used for various applications, for example, an organic EL element, an optical filter, a microlens array, a prism array, an optical waveguide, an LED, and a flat panel display. Optical films and polarizing elements for manufacturing, optical parts such as diffraction gratings and relief holograms, optical elements and optical parts such as various lenses, solar cells, antireflection films, semiconductor chips, patterned media, data storage, electronic paper, Materials used in applications in the bio field such as LSI manufacturing, anti-fogging substrate, water repellent substrate, hydrophilic substrate, paper manufacturing, food manufacturing, DNA separation chip, immunoassay chip, cell culture sheet, nanobiodevice and the like It can also be used for manufacturing. In addition, various electronic devices, in particular, semiconductor integrated circuits, flat screens, micro electro mechanical systems (MEMS), sensor elements, optical disks, high-density memory disks and other magnetic recording media, nano devices, optical devices, liquid crystal display thin film transistors, It can also be used for organic transistors, color filters, overcoat layers, pillar materials, liquid crystal alignment rib materials, microlens arrays, microreactors, photonic liquid crystals, etc.

  The coating apparatus of this invention can form the coating film which has a discontinuous pattern on a base material by a simpler method. Furthermore, the film member which has the uneven | corrugated pattern formation area of a desired pattern on a base material can be manufactured with the manufacturing apparatus of the film member using the coating device of this invention. A substrate having a concavo-convex pattern such as an optical substrate manufactured by using the manufactured film member as a flexible mold is excellent in heat resistance, weather resistance, and corrosion resistance, and is also used in a manufacturing process of an element incorporating the optical substrate. There is resistance, and the lifetime of these elements can be extended. Therefore, such a board | substrate can be used suitably for various uses, such as an organic EL element and a solar cell.

DESCRIPTION OF SYMBOLS 11 Tape-shaped mask, 26 Liquid repellent film 40, 41 Application roll, 50, 50 ', 50''Pattern mask 80 Film base material, 80a Film member 82 Coating liquid supply member 84 Coating film, 90 Transfer roll 100 Film member manufacturing apparatus , 120 Film transport unit 140 Coating unit 140a, 140b, 140c, 140d, 140e Coating device 160 Transfer unit

Claims (19)

A coating apparatus for forming a film on a coating film forming surface of a belt-shaped film substrate,
A coating roll that rotates by attaching a coating material on the outer peripheral surface;
A coating liquid supply member for supplying the coating film material to the coating roll;
A film base material transport section for continuously transporting the coating roll while contacting the coating film forming surface of the film base material,
Located on the upstream side in the transport direction of the film base material from the coating roll, on the coating film forming surface of the film base material, a pattern mask application unit for applying a pattern mask,
A coating apparatus provided with a pattern mask peeling part which is located downstream from the coating roll in the transport direction of the film base and peels the pattern mask from the film base.   The coating apparatus according to claim 1, wherein the pattern mask has a pattern divided in a conveyance direction of the pattern mask.   The coating apparatus according to claim 1, wherein the pattern mask has a continuous pattern in a conveyance direction of the pattern mask.   The coating apparatus as described in any one of Claims 1-3 further equipped with the conveyance direction non-application area | region formation mechanism which forms the non-application area | region continuous in the conveyance direction of the said film base material on the said film base material. The transport direction non-application area forming mechanism is
A tape-shaped mask that is located upstream of the coating roll in the transport direction of the film base and that provides a tape-shaped mask on the coating film forming surface of the film base along the transport direction of the film base A granting unit;
The coating apparatus according to claim 4, further comprising: a tape-shaped mask peeling unit that is positioned downstream of the coating roll in the transport direction of the film base and peels the tape-shaped mask from the film base.   A liquid repellent material in which the transport direction non-application area forming mechanism is located on the upstream side of the film base in the transport direction of the film base and applies a liquid repellent material on the coating film forming surface of the film base The coating apparatus of Claim 4 containing an application part. The application roll includes the transport direction non-application area forming mechanism,
The transport direction non-application area forming mechanism is formed on the outer peripheral surface of the application roll and two or more liquid carrying areas continuous in the circumferential direction of the application roll, and on the outer peripheral surface of the application roll. The coating apparatus according to claim 4, comprising a liquid non-carrying region formed between each of the liquid carrying regions.   The coating apparatus according to claim 7, wherein the liquid non-carrying region has a flat surface.   The coating apparatus according to claim 7 or 8, wherein the liquid non-carrying region is liquid repellent.   The coating apparatus according to claim 7, wherein the liquid non-carrying region has a recess with respect to the liquid carrying region. The coating liquid supply member includes the transport direction non-application area forming mechanism,
The coating apparatus according to claim 4, wherein the transport direction non-application area forming mechanism includes at least two coating liquid supply chambers that are spaced apart from each other in the rotation axis direction of the application roll. An apparatus for producing a strip-shaped film member having an uneven pattern,
An application part for applying a concavo-convex forming material on a band-shaped film substrate to form a film;
A transfer roll having a concavo-convex pattern, and a transfer portion for transferring the concavo-convex pattern to the film;
A transport unit that continuously transports the film base material from the coating unit toward the transfer unit;
The manufacturing apparatus of the film member by which the said application part is comprised with the coating device as described in any one of Claims 1-11. A method of forming a coating film on a film substrate using the coating apparatus according to any one of claims 1 to 3,
A method of forming a coating film comprising forming an uncoated region corresponding to the shape of the pattern mask on the film substrate. A method for forming a coating film on a film substrate using the coating apparatus according to any one of claims 4 to 11,
Forming an uncoated region corresponding to the shape of the pattern mask on the film substrate;
Forming a non-coating region continuous in the longitudinal direction of the film substrate using the transport direction non-coating region forming mechanism.   Forming a non-coating region continuous in the longitudinal direction of the film base using the transport direction non-coating region forming mechanism, providing a tape-like mask on the film base; and The coating film material according to claim 14 is formed, wherein the coating film material is brought into contact with the applied film base material, and the coating film material is applied onto the film base material provided with the tape-shaped mask. Method.   Forming a non-coating region continuous in the longitudinal direction of the film base using the transport direction non-coating region forming mechanism, applying a liquid repellent material on the film base, and the liquid repellency The method of forming the coating film of Claim 14 including making a coating-film material contact the said film base material which apply | coated material, and apply | coating the said coating-film material on the said film base material.   Forming a non-coating region continuous in the longitudinal direction of the film substrate using the transport direction non-coating region forming mechanism supports the coating material in two or more continuous regions in the circumferential direction of the coating roll The coating film according to claim 14, comprising: applying the coating material on the film substrate by bringing the coating material carried on the coating roll into contact with the film substrate. How to form. A method for producing a strip-shaped film member having an uneven pattern,
An application step of applying a concavo-convex forming material on a band-shaped film substrate to form a film of the concavo-convex forming material by the method of forming a coating film according to any one of claims 13 to 17.
A method for producing a film member, comprising a transfer step of transferring an uneven pattern of a transfer roll to the film. A method of manufacturing a substrate having a concavo-convex pattern,
Forming a sol-gel material layer on a substrate;
The manufacturing method of a board | substrate including transferring the said uneven | corrugated pattern of the said mold to the said sol-gel material layer using the film member manufactured by the manufacturing method of the film member of Claim 18 as a mold which has an uneven | corrugated pattern.

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