JP2015177711A - Power switchboard - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a power switchboard which enables improvement of the cooling performance of a cooling device having capacity required to cool a heating component.SOLUTION: A power switchboard includes: a heat collection body attached to a heating component disposed in a board housing of the power switchboard; a heat absorber which is located in the board housing and is disposed closely contacting with the heat collection body; a cooling device housing which is attached to the board housing and supports the heat absorber; and a heat pipe attached to the cooling device housing, the heat pipe where the one side contacts with the heat absorber and the other side protrudes to the exterior of the board housing.

Description

  The present invention relates to, for example, a switchboard, and more particularly to a cooling device for the switchboard.

  Since the cooling device provided in the conventional switchboard uses an insulator for heat pipe insulation, the space for the cooling device is affected by the outer shape of the insulator and becomes large. Therefore, the number of heat pipes having a capacity necessary for cooling is also limited.

  In addition, since the heat pipe is insulated through the insulator, it is difficult to dispose it in an operating part such as a switchboard door.

Japanese Utility Model Publication No. 60-55207 Japanese Utility Model Publication No. 63-146403

  The cooling device for the conventional switchboard described above uses one insulator per heat pipe for the purpose of insulating the heat generating components (conductors) inside the switchboard from the heat pipes installed in the switchboard cabinet. Thus, a cooling device in the switchboard is configured.

  Thus, since the cooling device in the switchboard is configured to attach a heat pipe to the insulator, the outer shape of the cooling device in the switchboard is affected by the outer shape of the insulator larger than the heat pipe body. The installation space of the device is increased, and the number of heat pipes having a capacity necessary for cooling the heat generating components (conductors) inside the switchboard is limited by the outer shape of the insulator. As a result, the heat generating component (conductor) could not be miniaturized, resulting in an expensive distribution board. For this reason, it may be difficult to install a cooling device for a distribution board having a capacity necessary for cooling a heat generating component (conductor) in the board cabinet of the distribution board in a limited installation space on the distribution board jacket. There was a problem that there was.

  Furthermore, in order to insulate the heat pipe (conductor) in the panel cabinet of the switchboard and the heat pipes arranged in the panel cabinet of the switchboard by using an insulator, a cooling device is installed on the movable part such as the switchboard door. There is a problem that it is difficult to dispose.

  The present invention has been made to solve the above-described problems, and its purpose is to arrange the heat pipe without using an insulator to insulate the heat pipe, thereby arranging it inside the panel housing of the switchboard. It is an object of the present invention to provide a switchboard capable of improving the cooling capacity of a cooling device having a capacity required for cooling the heat-generating components.

  The switchboard according to the present invention includes a heat collector attached to a heat generating component disposed inside a panel housing of the switchboard, and a heat absorption member disposed inside the panel housing and in close contact with the heat collector. A body, a cooling device housing attached to the panel housing and supporting the heat sink, and attached to the cooling device housing, one side contacting the heat absorber and the other side protruding outside the panel housing. It is equipped with a heat pipe.

  According to the switchboard according to the present invention, it is possible to easily obtain a cooling device having a cooling capacity and a size adapted to the heat generation amount of the heat-generating component disposed inside the panel housing of the switchboard, and to improve the cooling capacity. It is possible to obtain a switchboard that can

It is a front view which shows the switchboard concerning Embodiment 1 of this invention. It is sectional drawing in the II-II line | wire of FIG. 1 which shows the switchboard concerning Embodiment 1 of this invention. It is sectional drawing in the III-III line of FIG. 1 which shows the switchboard concerning Embodiment 1 of this invention. It is a perspective view which shows the cooling device in the switchboard concerning Embodiment 1 of this invention. It is a front view which shows the cooling device in the switchboard concerning Embodiment 1 of this invention. It is a front view which shows the switchboard concerning Embodiment 2 of this invention. It is sectional drawing in the VII-VII line of FIG. 6 which shows the switchboard concerning Embodiment 2 of this invention. It is a front view which shows the switchboard concerning Embodiment 3 of this invention. It is sectional drawing in the IX-IX line of FIG. 8 which shows the switchboard concerning Embodiment 3 of this invention.

Embodiment 1 FIG.
Hereinafter, Embodiment 1 of the present invention will be described with reference to FIGS. 1 to 5. In each drawing, the same or equivalent members and parts will be described with the same reference numerals. 1 is a front view showing a switchboard according to Embodiment 1 of the present invention. For example, a configuration diagram of a switchboard when a cooling device 8 having three heat pipes 7 is provided on the uppermost door 2 of the switchboard. Is shown. 2 is a cross-sectional view taken along the line II-II of FIG. 1 showing the switchboard according to the first embodiment of the present invention. The heat generating component 3 is provided on the upper front side in the switchboard, and the cooling device 8 provided on the door 2 is shown. 1 shows a configuration diagram in which there is an insulated heat collecting body 4 that transfers heat. 3 is a cross-sectional view taken along the line III-III of FIG. 1 showing the switchboard according to Embodiment 1 of the present invention, and the cooling device casing 6 is fixed to the door 2. FIG. 4 is a perspective view showing a cooling device in the switchboard according to Embodiment 1 of the present invention.
FIG. 5 is a front view showing the cooling device in the switchboard according to the first embodiment of the present invention, and the outer shape of the cooling device 8 changes in proportion to the number of heat pipes 7 arranged in the panel housing 1 of the switchboard. A comparison diagram is shown.

  In each of these drawings, the heat generating component 3 disposed inside the panel casing 1 of the switchboard shows a case of a bus conductor, for example, and the panel casing 1 is provided with a door 2. A heat collecting member 4 is attached to the heat generating component 3 made of a bus conductor, which is obtained by insulating a high heat conductive member such as copper or aluminum for cooling the heat generating component 3 with epoxy powder coating insulation. Located in the inside of the panel housing 1 and arranged on the heat collector 4 so that the heat absorber 5 which is also insulated by epoxy powder coating insulation is in close contact with the heat collector 4 such as copper or aluminum. The heat absorber 5 is supported by a cooling device housing 6 attached to, for example, the door 2 of the panel housing 1. The heat pipe 7 is attached to the cooling device housing 6, one side is in contact with the heat absorbing body 5, and the other side is led out of the panel housing 1, for example, outside the door 2. Here, since the thickness of the epoxy powder coating insulation applied to the heat collector 4 and the heat absorber 5 is about 0.5 mm to 1 mm, the thermal conductivity is not deteriorated. Further, as long as the thermal conductivity is not deteriorated, an insulation process is not limited to the epoxy powder coating insulation. Further, the material of the heat collector 4 and the heat absorber 5 is not limited to copper or aluminum as long as the thermal conductivity is good.

  It should be noted that the number of heat pipes 7 can be arranged as many as necessary for cooling the heat generating component 3 made of a bus conductor, and the figure shows a case where three heat pipes are arranged as an example. The heat collector 4, the heat absorber 5, the cooling device housing 6, and the heat pipe 7 constitute a cooling device 8. In addition, a buffer mechanism 9 is provided between the heat absorber 5 and the cooling device housing 6 so as to mitigate the impact generated when the heat absorber 5 contacts the heat collector 4.

  FIG. 4 shows an example of the structure of the cooling device 8 in a state where the door 2 of the panel housing 1 is opened. The heat of the heat generating component 3 made of the bus conductor is collected by an insulating material with high thermal conductivity. A cooling device configured to transmit from the heat body 4 to the heat absorbing body 5 insulated by the insulating material having high thermal conductivity, and arranges the heat transmitted to the heat absorbing body 5 in the movable part of the door 2 of the panel housing 1. It is configured to transmit from one side of the heat pipe 7 attached to the casing 6 to the other side of the heat pipe 7 led out to the outside of the door 2 of the panel casing 1 and discharge it to the external space of the panel casing 1. doing. By repeating these operations, the heat generating component 3 made of the bus conductor can be efficiently cooled. Further, since the heat absorber 5, the cooling device housing 6 and the heat pipe 7 can be attached to the door 2 of the panel housing 1 which is a movable part, the space of the panel housing 1 can be saved and the heat generating component can be achieved. 3 can also be miniaturized.

  FIG. 5 shows a state in which the outer shape of the cooling device 8 in the switchboard changes in proportion to the number of heat pipes 7 arranged in the panel casing 1 of the switchboard. FIG. 5A shows the case where there are three heat pipes 7, FIG. 5B shows the case where there are two heat pipes 7, and FIG. 5C shows the case where there is only one heat pipe 7. The outer shape of the cooling device 8 that can be arranged in the arrangement space on the housing 1 can be large for the heat-generating component 3 with a large amount of heat generation, and small for the heat-generating component 3 with a small amount of heat generation. It is possible to arrange with.

  As described above, the heat collector 4 that is insulated by the high heat conductive insulating material is provided on the side of the heat generating component 3 made of, for example, a bus conductor disposed inside the panel casing 1 of the switchboard, and the switchboard panel casing is provided. For example, the heat absorbing body 5, the cooling device housing 6, and the heat pipe 7 that are insulated on the door 2 of the body 1 with an insulating material having high thermal conductivity are attached, and the heat absorbing body 5 is turned into the heat collecting body 4 by closing the door 2 By adopting a configuration in which they are brought into close contact with each other, the cooling device 8 can be easily disposed on a movable part such as the door 2 of the switchboard.

  Further, in order to alleviate the impact that occurs when the heat absorber 5 is in close contact with the heat collector 4, a buffer mechanism 9 is provided between the heat absorber 5 and the cooling device housing 6, and the cooling device is provided via the buffer mechanism 9. Since one side of the heat pipe 7 necessary for cooling is brought into contact with the heat absorber 5 while maintaining sufficient insulation performance by being assembled to the housing 6, more heat pipes 7 than the conventional ones described above can be used. The number of the heat generating parts 3 can be arranged, the cooling capacity of the cooling device 8 is improved, and the heat generating parts 3 can be sufficiently cooled.

Embodiment 2. FIG.
A second embodiment of the present invention will be described with reference to FIGS. 6 and 7. In the drawings, the same or corresponding members and parts are described with the same reference numerals. FIG. 6 is a front view showing a switchboard according to Embodiment 2 of the present invention, and shows a configuration diagram when a cooling device 8 is disposed on the ceiling plate 10 of the panel casing 1 of the switchboard. 7 is a cross-sectional view taken along the line VII-VII of FIG. 6 showing a switchboard according to Embodiment 2 of the present invention.

  In the first embodiment described above, the heat absorbing body 5, the cooling device casing 6, and the heat pipe 7 of the cooling device 8 have been described as being disposed on movable parts such as the panel casing 1 door 2, but the present invention is not limited thereto. In the second embodiment, the cooling device 8 is disposed on the ceiling plate 10 of the panel casing 1 of the switchboard.

  The cooling device housing 6 of the cooling device 8 is attached to the inner side of the ceiling plate 10 of the panel housing 1 of the switchboard, and the heat absorbing body 5 is disposed so as to be in close contact with the upper portion of the heat collecting body 4 and cooled. The heat pipe 7 is attached to the apparatus housing 6, the heat pipe 7 is attached to the cooling device housing 6, one side contacts the heat absorber 5, and the other side leads out to the outside above the panel housing 1.

  The heat of the heat generating component 3 made of the bus conductor is insulated from the heat collecting body 4 insulated by the high heat conductive insulating material by the high heat conductive insulating material in close contact with the upper portion of the heat collecting body 4. The heat transfer body 5 is configured to transmit heat transferred to the heat absorption body 5 from one side of the heat pipe 7 attached to the cooling device housing 6 disposed on the ceiling plate 10 of the panel housing 1. It is configured to transmit to the other side of the heat pipe 7 led out to the outside above the ceiling plate 10 of the body 1 and to discharge to the external space above the panel housing 1. By repeating these operations, the heat generating component 3 made of the bus conductor can be efficiently cooled.

As described above, the second embodiment also has the same cooling performance as that of the first embodiment described above, and has the same effect as that of the first embodiment described above.
Also in the second embodiment, a buffer mechanism 9 may be provided between the heat absorber 5 and the cooling device casing 6, and it is sufficient to be assembled to the cooling device casing 6 via the buffer mechanism 9. While maintaining a good insulation performance, one side of the heat pipe 7 necessary for cooling is brought into contact with the heat absorber 5, and the number of heat pipes 7 more than the above-described conventional one is arranged, and the cooling device 8 Therefore, the heat generating component 3 can be reduced in size and an inexpensive switchboard can be obtained.

Embodiment 3 FIG.
A third embodiment of the present invention will be described with reference to FIGS. 8 and 9. In the drawings, the same or corresponding members and parts will be described with the same reference numerals. FIG. 8 is a front view showing a switchboard according to Embodiment 3 of the present invention, and shows a configuration diagram when a cooling device 8 is disposed on a side plate 11 of a panel casing 1 of the switchboard. 9 is a cross-sectional view taken along the line IX-IX of FIG. 8 showing a switchboard according to Embodiment 3 of the present invention.

  The cooling device housing 6 of the cooling device 8 is attached to the inner side of the side plate 11 of the panel housing 1 of the switchboard, and the heat absorbing body 5 is arranged in close contact with and in contact with the side of the heat collecting body 4. The heat pipe 7 is attached to the cooling device housing 6, and one side is in contact with the heat absorber 5 and the other side is led out to the outside of the side of the panel housing 1.

  The heat of the heat generating component 3 made of the bus conductor is insulated from the heat collecting body 4 insulated by the high heat conductive insulating material by the high heat conductive insulating material in close contact with the side portion of the heat collecting body 4. The heat transfer body 5 is configured to transmit heat transferred to the heat absorption body 5 from one side of the heat pipe 7 attached to the cooling device housing 6 disposed on the side plate 11 of the panel housing 1. It is configured to transmit to the other side of the heat pipe 7 led out to the outside of the side plate 11 of the housing 1 and to discharge to the external space on the side of the panel housing 1. By repeating these operations, the heat generating component 3 made of the bus conductor can be efficiently cooled.

As described above, the third embodiment also has the same cooling performance as that of the first and second embodiments described above, and has the same effects as those of the first and second embodiments described above.
Also in the second embodiment, a buffer mechanism 9 may be provided between the heat absorber 5 and the cooling device casing 6, and it is sufficient to be assembled to the cooling device casing 6 via the buffer mechanism 9. While maintaining a good insulation performance, one side of the heat pipe 7 necessary for cooling is brought into contact with the heat absorber 5, and the number of heat pipes 7 more than the above-described conventional one is arranged, and the cooling device 8 Therefore, the heat generating component 3 can be reduced in size and an inexpensive switchboard can be obtained.

  By the way, in each embodiment mentioned above, although the case where the heat-emitting component 3 consists of bus-bar conductors was described, it is not limited to this, For example, it consists of a connection conductor which connects a bus-bar conductor and the circuit breaker of a switchboard. The heat generating component 3 may be used, or the heat generating component 3 that generates high heat may be obtained, and the same effect is obtained.

  It should be noted that within the scope of the present invention, the embodiments can be freely combined, or the embodiments can be appropriately modified or omitted.

  The present invention is suitable for realizing a cooling device for a switchboard that can improve the cooling capacity of a cooling device having a capacity necessary for cooling a heat-generating component.

  1 panel housing, 2 doors, 3 heat generating components, 4 heat collector, 5 heat absorber, 6 cooling device housing, 7 heat pipe, 8 cooling device, 9 buffer mechanism, 10 ceiling plate, 11 side plate.

Claims (7)

  A heat collector attached to a heat-generating component disposed inside a panel housing of the switchboard; a heat absorber disposed in close contact with the heat collector located inside the panel housing; and the panel housing And a heat pipe that is attached to the cooling device case and that is attached to the cooling device case and has one side in contact with the heat absorption member and the other side protruding to the outside of the panel case. It features a switchboard.   The switchboard according to claim 1, wherein the heat collector is an insulation treatment of a highly heat conductive member.   3. The switchboard according to claim 1, wherein the heat absorbing body is obtained by insulating a highly heat-conductive member.   The switchboard according to any one of claims 1 to 3, wherein the heat absorber, the cooling device casing, and the heat pipe are provided on a door of the panel casing.   The switchboard according to any one of claims 1 to 3, wherein the heat absorber, the cooling device casing, and the heat pipe are provided on a ceiling plate of the panel casing.   The switchboard according to any one of claims 1 to 3, wherein the heat absorber, the cooling device casing, and the heat pipe are provided on a side plate of the panel casing.   The switchboard according to any one of claims 1 to 6, wherein a buffer mechanism is provided between the heat absorber and the cooling device casing.

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