JP2015173175A - Lead wire fixation structure and superconducting magnet in cryostat compatible with extremely low temperature - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method to fix a lead wire by using an adhesive sheet, that is capable of simply bonding an article and reliably bonds the article even when the adhered article is exposed to a wide range of temperature variation, a structure bonded to a heat anchor part by using the adhesive sheet, and a superconductive magnet provided with the structure.SOLUTION: Provided are: a structure that fixes a lead wire such as a sensor cable by using the adhesive sheet comprising an insulating substrate and a thermoplastic resin layer mainly composed of ethylene-methacrylic acid copolymer and laminated on the substrate; a structure in which the adhesive sheet is used to bond, to a heat transmitting member for cooling, at least a portion of the lead wire for electrically interconnecting a coil housed within a cryostat and a power source installed outside the cryostat; and a superconductive magnet which has the structure and whose coil is a superconductive coil.

Description

  The present invention relates to a lead wire fixing structure and a superconducting magnet in a cryostat compatible cryostat. The lead wire refers to a sensor cable, a current lead, or the like.

  Conventionally, a polyimide tape having an adhesive layer and an aluminum tape having an adhesive layer are widely used when fixing an article such as an electric wire or an optical fiber to a metal plate or a glass plate. Silicone pressure-sensitive adhesives, acrylic pressure-sensitive adhesives, and the like are used as the pressure-sensitive adhesive layer of the polyimide tape or aluminum tape.

  Patent Document 1 discloses an epoxy resin molding in which at least a part of a member is covered with an epoxy resin molding material layer via an adhesive layer, and the adhesive layer is a carboxyl by hydrogen bonding or metal ions. An epoxy resin molded product is described which is a resin thin film mainly composed of an ethylene-methacrylic acid copolymer in which molecular chains are cross-linked by bonding between groups.

Japanese Patent Laid-Open No. 5-179013

  By the way, in the cryostat compatible cryostat, when fixing an article such as a lead wire using polyimide tape or aluminum tape, the fixed article is exposed to a wide range of temperature changes from room temperature to cryogenic temperature. Then, it discovered that the fixed article | item becomes easy to peel off.

  On the other hand, when such a temperature change is taken into consideration, there is a problem in that it takes too much time and labor to bond an article with an epoxy adhesive instead of polyimide tape or aluminum tape.

  Accordingly, the present invention provides a method for fixing a lead wire using an adhesive sheet that can easily bond an article and has high adhesion reliability even when the adhered article is exposed to a wide range of temperature changes. The purpose is to provide. Another object of the present invention is to provide a structure in which the above-described adhesive sheet is adhered to the thermal anchor portion, and to provide a superconducting magnet having the structure.

The present invention is as follows.
(1) Adhesion comprising a base material having electrical insulating properties and a thermoplastic resin layer laminated on the base material and containing an ethylene-methacrylic acid copolymer as a main component and adhered to a lead wire A lead wire fixing structure in a cryostat capable cryostat characterized by using an agent sheet.
(2) A lead wire fixing structure in a cryostat compatible cryostat, wherein the lead wire is installed on an aluminum plate using the adhesive sheet.
(3) A cryostat compatible cryostat, a coil accommodated in the cryostat, a power source installed outside the cryostat, a lead wire electrically connecting the power source and the coil, A lead wire fixing structure including a cooling heat transfer member that is at least partially thermally connected, wherein at least a part of the lead wire and the cooling heat transfer member are bonded with an adhesive sheet. The adhesive sheet includes a base material having electrical insulation, and a thermoplastic resin layer laminated on the base material, the main component of which is an ethylene-methacrylic acid copolymer, which is adhered to a lead wire; A lead wire fixing structure in a cryostat capable cryostat.
(4) The structure according to (3), wherein the cross section of the lead wire is circular and the cooling heat transfer member or / and the lead wire and the cooling heat transfer are used in order to improve cooling efficiency. A lead wire fixing structure in a cryostat corresponding to a cryogenic temperature, wherein a groove having a shape corresponding to the shape of the lead wire is provided in a holding member provided to improve adhesion to the member.
(5) The electrode according to (3), wherein a heat transfer member that thermally connects the cooling heat transfer member and the presser member is provided in order to improve cooling efficiency. Lead wire fixing structure in cryostat compatible cryostat.
(6) The structure according to (3), wherein the superconducting coil housed in the cryostat, at least a part of a lead wire that electrically connects the power source, and the cooling heat transfer member, A superconducting magnet which is bonded with the adhesive sheet.

  According to the present invention, an adhesive sheet that can easily adhere an article and has high adhesion reliability even when the adhered article is exposed to a wide range of temperature changes from room temperature to extremely low temperatures is used. Thus, a method of fixing the lead wire can be provided. The present invention can also provide a structure in which the above-described adhesive sheet is adhered to the heat anchor portion, and a superconducting magnet having the structure.

FIG. 1 is a cross-sectional view of an adhesive sheet according to one embodiment. FIG. 2 is a schematic diagram illustrating a superconducting electromagnet according to one embodiment. Drawing 3 is a mimetic diagram explaining the heat anchor part concerning one embodiment. FIG. 4 is a schematic diagram illustrating a thermal anchor portion according to one embodiment. FIG. 5 is a schematic diagram illustrating a thermal anchor unit according to an embodiment. FIG. 6 is a graph showing the thermal conductivity coefficient ratio of the adhesive sheet of Example 1 and the adhesive of Comparative Example 3. The heat conduction coefficient ratio is made dimensionless with the value at room temperature (300K) of Example 1 being 1. FIG. 7 is a schematic diagram showing an optical fiber temperature sensor fixed on an aluminum plate.

[Fixed structure with adhesive sheet]
In one embodiment, the present invention provides an adhesive comprising a base material having electrical insulation and a thermoplastic resin layer containing ethylene-methacrylic acid copolymer as a main component laminated on the base material. The present invention provides a lead wire fixing structure in a cryostat capable cryostat characterized by using a sheet.

  The adherend member bonded with the adhesive sheet of the present embodiment can maintain the bonding state with high reliability even when exposed to a wide range of temperature changes. That is, it can be said that the adhesive sheet of this embodiment is a heat cycle resistant adhesive sheet.

  Further, as will be described later, the adhesive sheet of the present embodiment exhibits higher thermal conductivity than the conventional material even in the temperature region near the boiling point of liquid helium 4K (−269 ° C.). In addition, this characteristic can be maintained even in a wide range of temperature changes from room temperature to very low temperatures. That is, it can be said that the adhesive sheet of this embodiment is an adhesive sheet having a small thermal resistance (suitable for thermal connection) in a wide temperature range.

  FIG. 1 shows a cross-sectional view of an adhesive sheet according to one embodiment. The adhesive sheet 100 includes a base 110 having electrical insulation and a thermoplastic resin layer 120 laminated on both surfaces of the base 110 having electrical insulation.

(Base material)
The base material should just be a sheet-like thing which has electrical insulation in the temperature range to which the to-be-adhered member which applies an adhesive sheet is exposed. Examples of the constituent member of the substrate include polyolefin films such as polyethylene, polypropylene, and polyvinyl chloride; polyester films such as polyethylene terephthalate and polyethylene naphthalate; and various polymer films such as polycarbonate film and polyimide film.

  In one embodiment, the substrate must be electrically insulating.

  For example, when the member to be bonded is exposed to a temperature range of about −269 ° C. to about 300 ° C., a polyimide film having resistance to this temperature range is suitable. Further, the thickness of the substrate is preferably about 10 to 250 μm because it is easy to handle and it is desired to reduce the thermal resistance.

(Polyimide film)
Examples of the polyimide film include trade name Kapton (registered trademark) manufactured by Toray DuPont, “UPILEX-S type polyimide film” manufactured by Ube Industries, “Apical” manufactured by Kaneka Chemical Co., Ltd., and the like. More specifically, model numbers “50H”, “50V”, “70H”, “70V”, “100H”, “100V”, “200H”, “200V”, “300H”, “Tohru DuPont” Examples thereof include polyimide films such as “300V”, “500H”, and “500V”.

(Ethylene-methacrylic acid copolymer)
The thermoplastic resin layer of the adhesive sheet of this embodiment contains an ethylene-methacrylic acid copolymer as a main component. “Ethylene-methacrylic acid copolymer as a main component” means that the thermoplastic resin layer preferably contains 60% by mass or more, more preferably 75% by mass or more, and still more preferably 90% by weight or more of ethylene-methacrylic acid copolymer. It means that the polymer occupies.

  As the ethylene-methacrylic acid copolymer, those having a low melt flow rate are preferred. Moreover, the thing with a high softening temperature is preferable. More specifically, in accordance with JIS K7210: 1999, ethylene having a melt flow rate measured at 190 ° C. and a load of 2.16 kg is 0.1 to 20 g / 10 min or less, more preferably 5 to 10 g / 10 min or less. -A methacrylic acid copolymer is preferred. An ethylene-methacrylic acid copolymer having a softening temperature measured according to JIS K7206: 1999 of 70 ° C. or higher, more preferably 80 ° C. or higher is preferable.

  More specifically, as a suitable ethylene-methacrylic acid copolymer, trade names Nukurel, model numbers “AN4214C”, “AN4225C”, “AN42012C”, “N0903HC”, “N0908C” manufactured by Mitsui DuPont Polychemical Co., Ltd., “N410”, “N1108C”, “N1207C”, “N1214”, and the like. These copolymers may be used alone or in combination of two or more.

  The thermoplastic resin layer is formed by melt-extruding the material mainly composed of the above-described ethylene-methacrylic acid copolymer using, for example, an ordinary LDPE (low density polyethylene) extruder, and laminating the above-described base material. It can be laminated by processing. In the adhesive sheet of this embodiment, the thickness of the thermoplastic resin layer is preferably 50 to 200 μm. The adhesive sheet can be cut into an appropriate size and used.

  In the adhesive sheet of the present embodiment, the thermoplastic resin layer may be laminated only on one side of the substrate, or may be laminated on both sides.

  An adhesive sheet in which a thermoplastic resin layer is laminated only on one side of a substrate (hereinafter sometimes referred to as a “single-sided adhesive sheet”) is an adherend disposed on the thermoplastic resin layer side of the adhesive sheet. Only members can be fixed. On the other hand, an adhesive sheet in which a thermoplastic resin layer is laminated on both surfaces of a base material (hereinafter sometimes referred to as “double-sided adhesive sheet”) is disposed between a plurality of opposing members to be bonded. And since these to-be-adhered members can be adhere | attached, an to-be-adhered member can be more closely_contact | adhered and fixed. Moreover, as will be described later, the double-sided adhesive sheet can be bonded by winding the adhesive sheet around the member to be bonded.

  When a double-sided adhesive sheet is wound around a non-adhesive member and bonded, a region where the thermoplastic resin layers of the adhesive sheet are bonded to each other is generated. In this region, since the same material is bonded to each other, thermal stress does not occur even when the temperature changes after bonding, and stable bonding can be realized.

  Similarly to the single-sided adhesive sheet, the double-sided adhesive sheet can also fix the adherend using only one thermoplastic resin layer of the adhesive sheet for bonding. Therefore, the double-sided adhesive sheet has an advantage that it is easy to handle without making a mistake in the front and back of the adhesive sheet.

(Adhesion method)
In one embodiment, a member to be bonded can be bonded as follows using a single-sided adhesive sheet. For example, when bonding a wiring on a substrate, the wiring is first positioned and placed on the substrate. Subsequently, a single-sided adhesive sheet is placed on the wiring so that the thermoplastic resin layer is on the wiring side. Subsequently, the single-sided adhesive sheet is heated using an iron or the like to soften the thermoplastic resin layer and pressurize the adhesive sheet, wiring, and substrate. When the temperature of the thermoplastic resin is lowered, the thermoplastic resin is cured and the substrate, wiring, and adhesive sheet are bonded. The heating temperature of the adhesive sheet is preferably about the softening temperature of the thermoplastic resin layer + 60 ° C. Further, the pressure for pressurizing the adhesive sheet, the wiring and the substrate is preferably about 50 Pa. The members to be bonded that can be bonded by the bonding method of the present embodiment are not limited to the substrate and the wiring, and various members to be bonded can be bonded.

  In one embodiment, by using only one thermoplastic resin layer of the double-sided adhesive sheet for bonding, the member to be bonded can be bonded by the same bonding method as in the case of using the single-sided adhesive sheet.

  In one embodiment, a member to be bonded can be bonded as follows using a double-sided adhesive sheet. For example, when bonding a wiring on a substrate, first, a double-sided adhesive sheet is positioned and placed on the substrate. Subsequently, the double-sided adhesive sheet is heated using an iron or the like to soften the thermoplastic resin layer. Subsequently, before the thermoplastic resin layer is cured, the wiring is positioned and placed on the double-sided adhesive sheet, and is pressed and bonded. The members to be bonded that can be bonded by the bonding method of the present embodiment are not limited to the substrate and the wiring, and various members to be bonded can be bonded.

  In one embodiment, a member to be bonded can be bonded as follows using a double-sided adhesive sheet. For example, when bonding a wiring on a substrate, first, a double-sided adhesive sheet is wound around the wiring. Subsequently, the wiring wound with the double-sided adhesive sheet is positioned and placed on the substrate. Subsequently, the double-sided adhesive sheet is heated using an iron or the like to soften the thermoplastic resin layer and pressurize and bond. The members to be bonded that can be bonded by the bonding method of the present embodiment are not limited to the substrate and the wiring, and various members to be bonded can be bonded.

  In one embodiment, the present invention provides a bonded structure in which a plurality of bonded members are bonded to each other with the above-described adhesive sheet. The adhesive structure of this embodiment can maintain an adhesive state with high reliability even when exposed to a temperature change between about −269 ° C. and about 300 ° C., for example. Moreover, as will be described later, the bonded structure according to the present embodiment can exhibit excellent thermal conductivity in a temperature range of about −269 ° C. to about 300 ° C. Furthermore, excellent thermal conductivity can be maintained even when exposed to temperature changes, for example, between about −269 ° C. and about 300 ° C.

  From the above, the adhesive structure of the present embodiment is useful as a thermal anchor part for articles used at low temperatures such as low-temperature measuring devices and current leads. Moreover, the adhesion structure of this embodiment is useful also as an adhesion part which adhere | attaches heat dissipation articles, such as a heat sink (heat sink), and a heat-emitting article.

  In one embodiment, the present invention includes a cryostat compatible cryostat, a superconducting coil housed in the cryostat, a power source installed outside the cryostat, a lead wire that electrically connects the power source and the superconducting coil, In a superconducting magnet including a cooling heat transfer member to which at least a part of the lead wire is thermally connected, at least a part of the lead wire and the cooling heat transfer member are bonded with the above-described adhesive sheet. A superconducting magnet is provided. Here, “thermally connected” means connected in a thermally conductive state. That is, in the superconducting magnet of the present embodiment, at least a part of the lead wire and the cooling heat transfer member are connected in a state capable of conducting heat.

  FIG. 2 is a schematic diagram for explaining the superconducting electromagnet of the present embodiment. The superconducting magnet 200 includes a cryostat 210, a superconducting coil 220 housed in the cryostat 210, a power source 230 installed outside the cryostat, a lead wire 240 that electrically connects the power source 230 and the superconducting coil 220, And a cooling heat transfer member 250 to which at least a part of the lead wire 240 is thermally connected. In the superconducting magnet 200, at least a part of the lead wire 240 and the cooling heat transfer member 250 are bonded together by the adhesive sheet 100 described above. The cryostat is kept at a very low temperature by a cooling device such as a refrigerator. The cooling heat transfer member 250 may be connected to a cooling end of a cold head such as a refrigerator.

  In the superconducting magnet 200, at least a part of the lead wire 240 and the cooling heat transfer member 250 are bonded together by the adhesive sheet 100 described above. For this reason, the heat of the lead wire 240 can be efficiently transmitted to the heat transfer member 250 for cooling, and the temperature difference between the lead wire 240 and the heat transfer member 250 for cooling can be maintained at 1K or less. That is, the adhesion portion (adhesion structure) between the lead wire 240 and the cooling heat transfer member 250 functions as a heat anchor portion. In this heat anchor portion, heat of the lead wire 240 is transmitted to the cooling heat transfer member 250 while maintaining electrical insulation between the lead wire 240 and the cooling heat transfer member 250. For this reason, heat outside the cryostat 210 can be prevented from entering the superconducting coil 220 via the lead wire 240. As a result, the cooling time of the superconducting coil can be shortened and the temperature rise of the superconducting coil can be suppressed.

  FIG. 3 is a schematic diagram for explaining a heat anchor portion 300 according to one embodiment in the superconducting magnet 200. In the thermal anchor portion 300, the lead wire 240 has a rectangular cross section. The lead wire 240 and the cooling heat transfer member 250 are bonded together by the adhesive sheet 100 described above. The adhesive sheet 100 is a double-sided adhesive sheet and is wound around the lead wire 240. In the heat anchor portion 300, a pressing member 310 is provided in order to further improve the adhesion (thermal connectivity) between the lead wire 240 and the cooling heat transfer member 250. The holding member 310 can bring the lead wire 240 into close contact with the cooling heat transfer member 250 by the fixing bolt 320 and the disc spring 330.

  FIG. 4 is a schematic diagram for explaining a thermal anchor portion 300a according to one embodiment in the superconducting magnet 200. FIG. In the thermal anchor portion 300a, the lead wire 240a has a circular cross section. The lead wire 240a and the cooling heat transfer member 250 are bonded by the adhesive sheet 100 described above. The adhesive sheet 100 is a double-sided adhesive sheet and is wound around the lead wire 240a. In the heat anchor portion 300a, in order to further improve the adhesion (thermal connectivity) between the lead wire 240a and the cooling heat transfer member 250, a groove conforming to the shape of the lead wire 240a is provided in the cooling heat transfer member 250. Is provided. Furthermore, in order to further improve the adhesion between the lead wire 240a and the cooling heat transfer member 250, a pressing member 310 is provided. The holding member 310 can bring the lead wire 240 a into close contact with the cooling heat transfer member 250 by the fixing bolt 320 and the disc spring 330. Thus, by providing the cooling heat transfer member with a groove conforming to the shape of the lead wire, the thermal connectivity between the lead wire and the cooling heat transfer member can be further improved.

  FIG. 5 is a schematic diagram for explaining a heat anchor portion 300b according to one embodiment in the superconducting magnet 200. FIG. In the thermal anchor portion 300b, the lead wire 240a has a circular cross section. The lead wire 240a and the cooling heat transfer member 250 are bonded by the adhesive sheet 100 described above. The adhesive sheet 100 is a double-sided adhesive sheet and is wound around the lead wire 240a. In the heat anchor portion 300b, in order to further improve the adhesion (thermal connectivity) between the lead wire 240a and the cooling heat transfer member 250, a groove conforming to the shape of the lead wire 240a is provided in the cooling heat transfer member 250. Is provided. Further, in order to further improve the adhesion between the lead wire 240a and the cooling heat transfer member 250, a pressing member 310 is provided. The holding member 310 can bring the lead wire 240 a into close contact with the cooling heat transfer member 250 by the fixing bolt 320 and the disc spring 330. Furthermore, in the heat anchor portion 300b, a heat transfer member 340 that thermally connects the cooling heat transfer member 250 and the pressing member 310 is provided. The heat transfer member 340 improves the heat transfer efficiency between the cooling heat transfer member 250 and the presser member 310, and the presser member 310 is cooled. As a result, the lead wire 240a is cooled from both surfaces of the cooling heat transfer member 250 and the pressing member 310, and the cooling efficiency is further improved. Further, as a means for improving the cooling efficiency, it is also effective to provide the holding member 310 with a groove having a shape corresponding to the shape of the lead wire 240a.

Example 1
Polyimide film (manufactured by Toray DuPont, Kapton (registered trademark) 50H, thickness 12.5 μm) (on both sides, ethylene-methacrylic acid copolymer (Mitsui, DuPont Polychemical Co., Ltd., Nucrel "AN4214C") is thick. The adhesive sheet laminated at a thickness of 100 μm was used as the adhesive sheet of Example 1. Note that Nucrel “AN4214C” was measured at 190 ° C. under a load of 2.16 kg according to JIS K7210: 1999. Was 7 g / 10 min, and the softening temperature measured according to JIS K7206: 1999 was 92 ° C.

(Comparative Examples 1 and 2)
A commercially available polyimide tape (polyimide; base material thickness 0.0125 mm, pressure-sensitive adhesive layer: silicon-based, pressure-sensitive adhesive layer thickness 0.0125 mm) was used as the adhesive sheet of Comparative Example 1. A commercially available aluminum tape (soft aluminum foil; base material thickness 0.05 mm, pressure-sensitive adhesive layer: acrylic, pressure-sensitive adhesive layer thickness 0.05 mm) was used as the adhesive sheet of Comparative Example 2.

(Experimental example 1)
The adhesive sheets of Example 1, Comparative Example 1 and Comparative Example 2 were cut to a size of about 2 cm × 0.5 cm, attached to an aluminum plate, and exposed to a thermal cycle of about −196 ° C. to about 300 ° C. The reliability of adhesion was evaluated.

  The adhesive sheet of Example 1 was attached by heating and pressurizing using an iron under conditions of a temperature of about 150 ° C. and a pressure of about 50 Pa. The adhesive sheets of Comparative Example 1 and Comparative Example 2 were affixed under conditions of a pressure of about 50 Pa without heating.

The aluminum plate on which the adhesive sheets of Example 1, Comparative Example 1 and Comparative Example 2 were attached was immersed in liquid nitrogen at −196 ° C. and cooled. Subsequently, the cooled aluminum plate was taken out from the liquid nitrogen and heated to about 300 ° C. using a heat gun (HAKKO HEATING GUN 883B, trade name of Hakuko Co., Ltd.). Subsequently, the reliability of adhesion of the adhesive sheets of Example 1, Comparative Example 1, and Comparative Example 2 was evaluated. The above operation was repeated 18 times. In Table 1, the evaluation result of the reliability of adhesion of each adhesive sheet after 1 to 18 thermal cycles is shown. It was evaluated whether the adhesive sheets of Comparative Example 1 and Comparative Example 2 were easily peeled off by hand. The adhesive sheet of Example 1 was not peeled off. The evaluation criteria were as follows.
“◯”: The whole adhesive sheet was adhered, and it was not peeled off or difficult to peel off.
“Δ”: Part of the adhesive sheet was easily peeled off.
“×”: Most of the adhesive sheet was easily peeled off.

  Part of the adhesive sheet of Comparative Example 1 was easily peeled off after 13 thermal cycles. In addition, the adhesive sheet of Comparative Example 2 was easily peeled off after nine thermal cycles. In contrast, the adhesive sheet of Example 1 was firmly adhered even after 18 thermal cycles, and the reliability of adhesion was high.

(Comparative Example 3)
A commercially available adhesive (instant adhesive) containing cyanoacrylate as a main component (a thickness of about 0.1 mm) was used as the adhesive of Comparative Example 3.

(Experimental example 2)
The adhesive sheet of Example 1 and the adhesive of Comparative Example 3 were cooled from room temperature (about 27 ° C.) to about −263 ° C., and in the range of about 10 K (about −263 ° C.) to about 300 K (about 27 ° C.). The thermal conductivity coefficient was measured. The thermal conductivity coefficient was measured as follows. Heat was applied from above the adhesive sheet of Example 1 and the adhesive of Comparative Example 3 by a heater, and the thermal conductivity coefficient was determined from the temperature difference between the upper part and the lower part.

  FIG. 6 is a graph showing the thermal conductivity coefficient ratio of the adhesive sheet of Example 1 and the adhesive of Comparative Example 3. The heat conduction coefficient ratio is made dimensionless with the value at room temperature (300K) of Example 1 being 1. When the adhesive of Comparative Example 3 was cooled from room temperature (about 27 ° C.) to about −263 ° C., the thermal conductivity coefficient was significantly reduced. In contrast, the adhesive sheet of Example 1 maintained a high thermal conductivity coefficient even after cooling from room temperature (about 27 ° C.) to about −263 ° C. This result shows that the adhesive sheet of Example 1 is useful for forming a thermal anchor portion of an article used at a low temperature such as a low-temperature measuring device or a current lead.

(Experimental example 3)
The optical fiber temperature sensor was fixed on the aluminum plate using the adhesive sheet of Example 1. FIG. 7 is a schematic diagram showing an optical fiber temperature sensor fixed on an aluminum plate. An optical fiber temperature sensor was fixed on the aluminum plate 500. An optical fiber temperature sensor was placed on the aluminum plate 500, and the adhesive sheet 100 of Example 1 was placed on the temperature sensor unit 410. Subsequently, using an iron, the aluminum plate 500 and the temperature sensor unit 410 were bonded and fixed by heating and pressing under conditions of a temperature of about 150 ° C. and a pressure of about 50 Pa. With a simple operation, the optical fiber temperature sensor could be fixed on the aluminum plate 500 with high reliability.

  ADVANTAGE OF THE INVENTION According to this invention, the adhesive sheet which can adhere | attach articles | goods simply and has high reliability of adhesion | attachment also when exposing the adhere | attached articles | goods to the temperature change between about -196 degreeC-about 300 degreeC. It is possible to provide a method of fixing a lead wire using The present invention can also provide a structure in which the above-described adhesive sheet is adhered to the heat anchor portion, and a superconducting magnet having the structure.

  DESCRIPTION OF SYMBOLS 100 ... Adhesive sheet, 110 ... Base material, 120 ... Thermoplastic resin layer, 200 ... Superconducting magnet, 210 ... Cryostat, 220 ... Superconducting coil, 230 ... Power supply, 240, 240a ... Lead wire, 250 ... Heat transfer member for cooling 260 ... Refrigerator, 300, 300a, 300b ... Thermal anchor part, 310 ... Holding member, 320 ... Fixing bolt, 330 ... Disc spring, 340 ... Heat transfer member, 400 ... Optical fiber temperature sensor, 410 ... Temperature sensor part, 500 ... Aluminum plate.

Claims (6)

  An adhesive sheet comprising: a base material having electrical insulation; and a thermoplastic resin layer that is laminated on the base material and includes an ethylene-methacrylic acid copolymer as a main component and is bonded to a lead wire. A lead wire fixing structure in a cryostat compatible cryostat characterized by using.   The lead wire fixing structure in a cryostat compatible cryostat according to claim 1, wherein the lead wire is installed on an aluminum plate using the adhesive sheet. Cryogenic cryostat, coil housed in the cryostat, power source installed outside the cryostat, lead wire for electrically connecting the power source and the coil, and at least part of the lead wire A lead wire fixing structure comprising a heat transfer member for cooling which is thermally connected,
At least a part of the lead wire and the heat transfer member for cooling are bonded with an adhesive sheet,
The adhesive sheet includes a base material having electrical insulation, and a thermoplastic resin layer that is laminated on the base material and contains an ethylene-methacrylic acid copolymer as a main component and is bonded to a lead wire. A lead wire fixing structure in a cryostat capable cryostat.   4. The structure according to claim 3, wherein the cross section of the lead wire is circular and the cooling heat transfer member or / and the lead wire and the cooling heat transfer member are provided in order to improve cooling efficiency. A lead wire fixing structure in a cryostat capable cryostat, wherein a groove having a shape corresponding to the shape of the lead wire is provided in a holding member provided to improve adhesion.   The cryostat-compatible cryostat according to claim 3, further comprising a heat transfer member that thermally connects the cooling heat transfer member and the pressing member to improve cooling efficiency. Lead wire fixing structure.   The structure according to claim 3, wherein at least a part of a lead wire electrically connecting the superconducting coil accommodated in the cryostat, the power source, and the heat transfer member for cooling are the adhesive. A superconducting magnet that is bonded with a sheet.

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