JP2015168121A - Wiring mounting structure, liquid ejection head and liquid ejection device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a wiring mounting structure suppressing short circuit and disconnection of connection wiring, and further to provide a liquid ejection head and a liquid ejection device.SOLUTION: A wiring mounting structure comprises: a first base substance 30 having a first principal surface 301, a second principal surface serving as a rear surface opposite to the first principal surface 301 and an inclined surface 321 formed between the first principal surface 301 and the second principal surface; a second base substance 10 having a third principal surface 101 bonded to the second principal surface of the first base substance 30 and a connection terminal 91 formed on the third principal surface 101; and connection wiring 33 continuously formed on the first principal surface 301 of the first base substance 30, on the inclined surface 321 of the first base substance 30 and on the connection terminal 91 of the third principal surface 101. A width of at least a boundary portion between the inclined surface 321 and the third principal surface 101 of the connection wiring 33 is greater than a width of the other portion on the inclined surface 321 of the connection wiring 33.

Description

  The present invention relates to a wiring mounting structure, a liquid ejecting head, and a liquid ejecting apparatus having a first base, a second base, and a connection wiring formed across the first base and the second base.

  As a liquid ejecting head for ejecting liquid droplets, a flow path forming substrate (second base) in which a pressure generating chamber communicating with a nozzle opening is formed, a piezoelectric actuator provided on one surface side of the flow path forming substrate, A protective substrate (first substrate) joined to the piezoelectric actuator side of the flow path forming substrate is provided, and the liquid is ejected from the nozzle opening by causing a pressure change in the liquid in the pressure generating chamber by the piezoelectric actuator.

  In such an ink jet recording head, a drive circuit (semiconductor element) is provided on the surface of the protective substrate opposite to the surface bonded to the flow path forming substrate, an opening is formed in the protective substrate, and a piezoelectric actuator is formed in the opening. It has been proposed that the wiring connected to the terminal is exposed and the drive circuit and the piezoelectric actuator are electrically connected via the connection wiring provided on the side wall of the opening of the protective substrate (for example, , See Patent Document 1).

  In such an ink jet recording head, the flow path forming substrate and the protective substrate are bonded via an adhesive, and then the connection wiring is formed on the side wall of the opening, the surface of the adhesive, and the surface of the flow path forming substrate. After film formation, it is patterned into a predetermined shape by a lithography method or the like.

  In addition, a configuration has been proposed in which an insulating member is provided across the side wall and the surface of the flow path forming substrate, and a connection wiring is formed on the insulating member (for example, see Patent Document 2).

JP 2007-290232 A JP 2007-66965 A

  However, there is a problem in that stress concentrates on the boundary portion between the slope of the connection wiring and the surface of the flow path forming substrate, and disconnection is likely to occur.

  In particular, when connecting wirings are arranged at high density, or when there are restrictions on the area where connecting wiring is provided to provide other parts and openings on the slope, the connecting wirings should not be short-circuited. Since there is a limitation on the width and interval, there is a problem that the connection wiring at the boundary between the slope and the surface of the flow path forming substrate is easily cut.

  Such a problem exists not only in the liquid ejecting head but also in a wiring mounting structure used for other devices.

  In view of such circumstances, it is an object of the present invention to provide a wiring mounting structure, a liquid ejecting head, and a liquid ejecting apparatus in which short-circuiting and cutting of connection wiring are suppressed.

An aspect of the present invention that solves the above problems includes a first main surface, a second main surface that is a back surface opposite to the first main surface, and the first main surface and the second main surface. A first base having a slope formed, a third main surface joined to the second main surface of the first base, and a connection terminal formed on the third main surface. Two bases, connection wiring formed continuously on the first main surface of the first base, on the slope of the first base, and on the connection terminals of the third main surface, And the width of at least the boundary between the slope and the third main surface of the connection wiring is wider than the width of the other portion on the slope of the connection wiring.
In such an embodiment, the connection wiring is formed wide at the boundary portion between the first base and the second base, so that the rigidity of the connection wiring can be improved and the destruction of the connection wiring can be suppressed.

  Here, on the slope, the end portion on the third main surface side of the connection wiring is arranged in parallel in the first direction at a first pitch, and the end portion on the first main surface side is arranged in the first direction. The second pitch is arranged in parallel in the first direction at a second pitch that is narrower than the first pitch, and the other portion is formed at the second pitch on the first main surface side of the connection wiring. A part is preferred. According to this, a short circuit such as migration of adjacent connection wirings is suppressed by expanding the width of the part formed at the second pitch which is a wide pitch with respect to the part formed at the first pitch. be able to.

  Further, in the connection wiring on the slope, the portion formed at the second pitch is an end of an inclined portion provided to be inclined with respect to a direction orthogonal to the first direction, The other part is preferably the inclined part. According to this, pitch conversion can be performed by the inclined portion, and the wiring, the drive circuit, and the like connected to the tip after the pitch conversion can be reduced in size.

  In addition, it is preferable that the interval between the connection wirings formed to be wide at the boundary portion is equal to or greater than the interval between the connection wires adjacent to each other in the other portion. According to this, it is possible to suppress a short circuit between adjacent connection wirings.

  In addition, the first base and the second base are bonded via an adhesive, and the adhesive has a surface at the boundary between the slope and the third main surface that is not covered by the first base. Is exposed, and the connection wiring is continuously formed on the slope, the surface of the adhesive, and the third main surface, and is formed on the surface of the adhesive. It is preferable that the width of the connection wiring formed is the widest. According to this, destruction of the connection wiring due to expansion of the adhesive or the like can be suppressed.

  Moreover, it is preferable that the part where the width of the connection wiring is widened is thicker than the other part. According to this, the rigidity of the connection wiring at the boundary portion between the first base and the second base can be further improved, and destruction of the connection wiring can be suppressed.

Furthermore, another aspect of the present invention is formed between the first main surface, the second main surface that is the back surface opposite to the first main surface, and the first main surface and the second main surface. A first base having a sloped surface, a third main surface joined to the second main surface of the first base, a flow path communicating with a nozzle opening for injecting liquid, and pressure applied to the flow path A pressure generating means for causing a change; a second base having a connection terminal formed on the third main surface; the first main surface of the first base; and the inclined surface of the first base. And a connection wiring continuously formed on the connection terminal of the third main surface, and a width of a boundary portion between at least the slope of the connection wiring and the third main surface is In the liquid jet head, the width of the connection wiring is wider than that of the other part on the slope.
In such an embodiment, the connection wiring is formed wide at the boundary portion between the first base and the second base, so that the rigidity of the connection wiring can be improved and the destruction of the connection wiring can be suppressed.

According to another aspect of the invention, there is provided a liquid ejecting apparatus including the liquid ejecting head according to the above aspect.
In this aspect, it is possible to realize a liquid ejecting apparatus that improves the reliability by suppressing the destruction of the connection wiring.

FIG. 3 is an exploded perspective view of the recording head according to the first embodiment. FIG. 3 is a plan view of the recording head according to the first embodiment. FIG. 3 is a cross-sectional view of the recording head according to the first embodiment. FIG. 3 is an enlarged cross-sectional view of a main part of the recording head according to the first embodiment. FIG. 3 is a plan view of a main part of the recording head according to the first embodiment. FIG. 3 is a plan view showing connection wiring according to the first embodiment. 6 is a plan view showing connection wiring according to Embodiment 2. FIG. It is a top view which shows the connection wiring which concerns on other embodiment. It is sectional drawing to which the principal part of the recording head concerning other embodiment was expanded. 1 is a schematic diagram of a recording apparatus according to an embodiment of the present invention.

  Hereinafter, the present invention will be described in detail based on embodiments.

(Embodiment 1)
FIG. 1 is an exploded perspective view of an ink jet recording head that is an example of a liquid jet head according to Embodiment 1 of the present invention, and FIG. 2 is a plan view of the ink jet recording head. 3 is a cross-sectional view taken along the line AA ′ of FIG. 2, FIG. 4 is an enlarged view of the main part of FIG. 3, and FIG. 5 is a plan view of the protective substrate.

  As shown in the figure, the ink jet recording head 1 according to the present embodiment includes a plurality of members such as a flow path forming substrate 10, a communication plate 15, a nozzle plate 20, a protective substrate 30, and a compliance substrate 45.

For the flow path forming substrate 10, a metal such as stainless steel or Ni, a ceramic material typified by ZrO ₂ or Al ₂ O ₃ , a glass ceramic material, an oxide such as MgO, LaAlO ₃ , or the like can be used. In the present embodiment, the flow path forming substrate 10 is made of a silicon single crystal substrate. This flow path forming substrate 10 is anisotropically etched from one side so that the pressure generating chambers 12 partitioned by the plurality of partition walls are arranged in parallel with a plurality of nozzle openings 21 through which ink is ejected. Side by side. Hereinafter, this direction is referred to as a direction in which the pressure generating chambers 12 are arranged side by side, or a first direction X (reference direction). Further, the flow path forming substrate 10 is provided with a plurality of rows in which the pressure generation chambers 12 are arranged in parallel in the first direction X, and in this embodiment, two rows. An arrangement direction in which a plurality of rows of the pressure generation chambers 12 in which the pressure generation chambers 12 are formed along the first direction X is provided is hereinafter referred to as a second direction Y. Furthermore, a direction that intersects both the first direction X and the second direction Y is referred to as a third direction Z in the present embodiment. In this embodiment, the relationship between the directions (X, Y, Z) is orthogonal to facilitate understanding of the explanation, but the arrangement relationship of the components should not necessarily be limited to the orthogonal relationship. To mention.

  Further, the flow path forming substrate 10 has an opening area narrower than that of the pressure generation chamber 12 on one end portion side in the second direction Y of the pressure generation chamber 12, and the flow path resistance of ink flowing into the pressure generation chamber 12. A supply path or the like for providing the above may be provided.

  In addition, the communication plate 15 and the nozzle plate 20 are sequentially stacked on one surface side (the stacking direction and the −Z direction) of the flow path forming substrate 10. That is, a communication plate 15 provided on one surface of the flow path forming substrate 10 and a nozzle plate 20 having a nozzle opening 21 provided on the opposite surface side of the communication plate 15 from the flow path forming substrate 10 are provided. .

  The communication plate 15 is provided with a nozzle communication path 16 that communicates the pressure generation chamber 12 and the nozzle opening 21. The communication plate 15 has a larger area than the flow path forming substrate 10, and the nozzle plate 20 has a smaller area than the flow path forming substrate 10. By providing the communication plate 15 in this manner, the nozzle opening 21 of the nozzle plate 20 and the pressure generating chamber 12 can be separated from each other, so that the ink in the pressure generating chamber 12 is contained in the ink generated by the ink near the nozzle opening 21. Less susceptible to thickening due to moisture evaporation. Further, since the nozzle plate 20 only needs to cover the opening of the nozzle communication passage 16 that communicates the pressure generating chamber 12 and the nozzle opening 21, the area of the nozzle plate 20 can be made relatively small, and the cost can be reduced. be able to. In the present embodiment, a surface on which the nozzle openings 21 of the nozzle plate 20 are opened and ink droplets are ejected is referred to as a liquid ejecting surface 20a.

  Further, the communication plate 15 is provided with a first manifold portion 17 that constitutes a part of the manifold 100 and a second manifold portion (throttle channel, orifice channel) 18.

  The first manifold portion 17 is provided through the communication plate 15 in the thickness direction (the stacking direction of the communication plate 15 and the flow path forming substrate 10).

  Further, the second manifold portion 18 is provided to open to the nozzle plate 20 side of the communication plate 15 without penetrating the communication plate 15 in the thickness direction.

  Further, the communication plate 15 is provided with a supply communication passage 19 that communicates with one end portion in the second direction Y of the pressure generation chamber 12 for each pressure generation chamber 12. The supply communication path 19 communicates the second manifold portion 18 and the pressure generation chamber 12.

  As the communication plate 15, a metal such as stainless steel or Ni, or a ceramic such as zirconium can be used. The communication plate 15 is preferably made of a material having the same linear expansion coefficient as the flow path forming substrate 10. That is, when a material having a linear expansion coefficient that is significantly different from that of the flow path forming substrate 10 is used as the communication plate 15, warping due to a difference in linear expansion coefficient between the flow path forming substrate 10 and the communication plate 15 due to heating or cooling. Will occur. In this embodiment, by using the same material as the flow path forming substrate 10 as the communication plate 15, that is, a silicon single crystal substrate, it is possible to suppress the occurrence of warping due to heat, cracking due to heat, peeling, and the like.

  In the nozzle plate 20, nozzle openings 21 communicating with the pressure generation chambers 12 through the nozzle communication passages 16 are formed. Such nozzle openings 21 are arranged in parallel in the first direction X, and two rows of nozzle openings 21 arranged in parallel in the first direction X are formed in the second direction Y.

  As such a nozzle plate 20, for example, a metal such as stainless steel (SUS), an organic substance such as a polyimide resin, a silicon single crystal substrate, or the like can be used. In addition, by using a silicon single crystal substrate as the nozzle plate 20, the linear expansion coefficients of the nozzle plate 20 and the communication plate 15 are made equal, and the occurrence of warpage due to heating or cooling, cracks due to heat, peeling, and the like are suppressed. can do.

  On the other hand, a diaphragm 50 is formed on the surface of the flow path forming substrate 10 opposite to the communication plate 15. In the present embodiment, an elastic film 51 made of silicon oxide provided on the flow path forming substrate 10 side and an insulator film 52 made of zirconium oxide provided on the elastic film 51 are provided as the diaphragm 50. I made it. The liquid flow path such as the pressure generation chamber 12 is formed by anisotropically etching the flow path forming substrate 10 from one side (the side where the nozzle plate 20 is bonded). The other surface of the liquid flow path is defined by the elastic film 51.

  In addition, a piezoelectric actuator 300 having a first electrode 60, a piezoelectric layer 70, and a second electrode 80, which is a pressure generating unit of the present embodiment, is provided on the vibration plate 50 of the flow path forming substrate 10. . In addition, the piezoelectric actuator 300 which is a pressure generation means of this embodiment corresponds to a drive element. Here, the piezoelectric actuator 300 refers to a portion including the first electrode 60, the piezoelectric layer 70, and the second electrode 80. In general, one electrode of the piezoelectric actuator 300 is used as a common electrode, and the other electrode is patterned for each pressure generation chamber 12. In the present embodiment, the first electrode 60 is continuously provided across the plurality of piezoelectric actuators 300 to be a common electrode, and the second electrode 80 is independently provided to each piezoelectric actuator 300 to be an individual electrode. Of course, there is no problem even if it is reversed for the convenience of the drive circuit and wiring. In the above-described example, the diaphragm 50 includes the elastic film 51 and the insulator film 52. However, the present invention is not limited to this. For example, the vibration film 50 includes the elastic film 51 and the insulating film. Any one of the body films 52 may be provided, and the elastic film 51 and the insulator film 52 are not provided as the vibration plate 50, and only the first electrode 60 acts as the vibration plate. Also good. Further, the piezoelectric actuator 300 itself may substantially serve as a diaphragm.

The piezoelectric layer 70 is made of a piezoelectric material of the oxide having a polarization structure formed on the first electrode 60, for example, it may consist of a perovskite oxide represented by the general formula ABO _3, lead containing lead For example, a lead-based piezoelectric material or a lead-free piezoelectric material containing no lead can be used.

  Each of the second electrodes 80 of the piezoelectric actuator 300 is connected to one end of a lead electrode 90 that is a lead wiring. The lead electrode 90 is drawn out from the end of the second electrode 80 onto the diaphragm 50, and the other end extends between the adjacent rows of piezoelectric actuators 300 in the second direction Y. Here, the other end portion of the lead electrode 90 drawn out serves as a connection terminal 91 connected to a drive circuit which is a semiconductor element described later in detail. In the present embodiment, a connection terminal row 91 </ b> A in which the connection terminals 91 are arranged in parallel in the first direction X, which is the reference direction of the present embodiment, is formed for each row of the piezoelectric actuators 300. That is, the connection terminal row 91 </ b> A formed by connecting the connection terminals 91 in the first direction X is arranged in two rows in the second direction Y. In the present embodiment, as shown in FIG. 6, the connection terminals 91 are arranged in parallel in the first direction X at the second pitch d <b> 2 that is the same as the pitch of the piezoelectric actuator 300. In the present embodiment, the second pitch d2 is a distance between the center lines of the two connection terminals 91 adjacent in the first direction X. That is, in the present embodiment, the lead electrode 90 extends from the end portion of the piezoelectric actuator 300 along the straight line in the first direction X. Further, the flow path forming substrate 10 thus provided with the connection terminals 91 corresponds to the second base, and the surface of the flow path forming substrate 10 on the protective substrate 30 side, that is, the surface of the vibration plate 50 on the protective substrate 30 side. This is referred to as a third main surface 101.

  A protective substrate 30 having substantially the same size as the flow path forming substrate 10 is bonded to the surface of the flow path forming substrate 10 on the piezoelectric actuator 300 side. In the present embodiment, the protective substrate 30 corresponds to a first base body, and the surface of the protective substrate 30 opposite to the surface bonded to the flow path forming substrate 10 is referred to as a first main surface 301. The surface to be joined to each other is referred to as a second main surface 302. That is, the third main surface 101 of the flow path forming substrate 10 that is the second base is joined to the second main surface 302 of the protective substrate 30 that is the first base.

  As such a protective substrate 30, it is preferable to use substantially the same material as the coefficient of thermal expansion of the flow path forming substrate 10, for example, glass, ceramic material, etc. In this embodiment, the same material as the flow path forming substrate 10 is used. The silicon single crystal substrate was used. Moreover, the joining method of the flow path forming substrate 10 and the protective substrate 30 is not particularly limited. For example, in the present embodiment, the flow path forming substrate 10 and the protective substrate 30 are bonded via the adhesive 35.

  Further, the protective substrate 30 has a holding portion 31 that is a space for protecting and accommodating the piezoelectric actuator 300 on the second main surface 302 side. The holding part 31 has a concave shape that opens to the flow path forming substrate 10 side without penetrating the protective substrate 30 in the third direction Z that is the thickness direction. In the present embodiment, the holding unit 31 is provided independently for each row of the piezoelectric actuators 300 arranged in parallel in the first direction X. That is, the holding unit 31 is continuously provided over the rows of the piezoelectric actuators 300 arranged in parallel in the first direction X, and each row of the piezoelectric actuators 300, that is, two in parallel in the second direction Y. It is installed. Such a holding part 31 should just have the space of the grade which does not inhibit the motion of the piezoelectric actuator 300, and the said space may be sealed or may not be sealed.

  Further, the protective substrate 30 has a through hole 32 that is an opening of the present embodiment that penetrates in the third direction Z that is the thickness direction. The through-hole 32 is continuously provided between the two holding portions 31 arranged in parallel in the second direction Y over the first direction X, which is the direction in which the plurality of piezoelectric actuators 300 are arranged in parallel. That is, the through hole 32 is formed in a groove shape along the first direction X. That is, the through hole 32 is an opening having a long side in the direction in which the plurality of piezoelectric actuators 300 are arranged.

  As shown in FIG. 4, the first side wall portion 321 that is the wall surface on both sides of the through hole 32 in the second direction Y is inclined between the first main surface 301 and the second main surface 302. It has a slope. That is, the first side wall part 321 that is a slope extends in the first direction X that is the reference direction. Here, the phrase “the first side wall portion 321 is an inclined surface” means that the first side wall portion 321 is inclined with respect to the first main surface 301 and the second main surface 302. That is, the first side wall portion 321 is not formed in the same plane direction as the first main surface 301 and the second main surface 302, and the first side wall portion 321 is formed on the first main surface 301 and the second main surface 302. That is, it is not provided in the same plane direction as the third direction Z orthogonal to each other. That is, the first side wall portion 321 is provided to be inclined with respect to the third direction Z. The inclination angle of the first side wall portion 321 is not particularly limited. For example, when the protective substrate 30 is formed of a silicon single crystal substrate, the first side wall portion may be, for example, depending on the plane orientation of the silicon single crystal substrate. 321 is 54.7 degrees with respect to the second major surface 302. In addition, the interval between the two first side wall portions 321 facing each other in the second direction Y is gradually increased in a direction away from the flow path forming substrate 10 in the third direction Z.

  In the present embodiment, the first main surface 301 and the second main surface 302 are similar to the first side wall portion 321 with respect to the two second side wall portions 322 that are the wall surfaces on both sides of the through hole 32 in the first direction X. It is inclined with respect to. Thus, by providing the first side wall portion 321 and the second side wall portion 322 in an inclined manner, the through hole 32 can be easily formed with high accuracy by, for example, etching.

  A part of the third main surface 101 (a part of the diaphragm 50) of the flow path forming substrate (second base) 10 is exposed in the through hole 32 of the protective substrate 30 and is exposed in the region. A connection terminal 91 that is an end portion of the lead electrode 90 drawn out from the piezoelectric actuator 300 is exposed.

  Specifically, the exposed portion of the lead electrode 90 exposed to the inner region of the through-hole 32 serves as the connection terminal 91. A group consisting of a plurality of connection terminals 91 arranged in parallel in the first direction X on the third main surface 101 of the flow path forming substrate 10 is referred to as a connection terminal row 91A. In the present embodiment, two connection terminal rows 91 </ b> A are juxtaposed in the second direction Y in the portion exposed by the through hole 32 of the third main surface 101 (region inside the through hole 32).

  Here, the adhesive 35 that adheres the flow path forming substrate 10 and the protective substrate 30 is formed in a region between the second main surface 302 of the protective substrate 30 and the third main surface 101 of the flow path forming substrate 10. It is provided so as to protrude from the region to the third main surface 101 in the through hole 32 of the flow path forming substrate 10.

  Such an adhesive 35 has a contact angle θ1 of the surface 36 with the third main surface 101 of the flow path forming substrate 10 in the second direction Y, which is an extension direction of the connection wiring 33 described later in detail. It is smaller than the reference angle θb formed by the first side wall portion 321 and the third main surface 101. In the present embodiment, the reference angle θb is an angle between the first side wall portion 321 and the third main surface 101. However, the third main surface 101 and the second main surface 302 are parallel surfaces. Therefore, the reference angle θb is the same angle as the angle between the third main surface 102 and the first side wall portion 321.

  Here, the contact angle θ1 of the surface 36 of the adhesive 35 with the third main surface 101 is, as shown in the figure, the boundary portion in contact with the third main surface 101 of the surface 36 of the adhesive 35, and the third main surface. It is an angle with 101. That is, when the surface 36 of the adhesive 35 is formed as a curved surface, the contact angle θ1 of the surface 36 of the adhesive 35 with the third main surface 101 is the third main surface of the surface 36 of the adhesive 35. 101 is an angle between the tangential direction at the contact point with 101 and the third main surface 101.

  Further, in the present embodiment, the adhesive 35 extends to the first side wall portion 321 that is a slope, and the surface 36 of the adhesive 35 is provided continuously to the surface 36 of the first side wall portion 321. ing. Here, the surface 36 of the adhesive 35 is continuous with the surface of the first side wall part 321. The surface 36 of the adhesive 35 and the surface of the first side wall part 321 have the second main surface 302 interposed therebetween. Say that they are in direct contact with each other. In the present embodiment, the surface of the adhesive 35 and the surface of the first side wall 321 are made continuous by extending the adhesive 35 over the first side wall 321. Without being limited thereto, the surface 36 of the adhesive 35 and the surface of the first side wall portion 321 may be flush with each other. However, since it is difficult to control the surface 36 of the adhesive 35 with high accuracy so as to be flush with the surface of the first side wall portion 321, the adhesive 35 extends to the first side wall portion 321. Is preferred.

  As described above, the surface 36 of the adhesive 35 provided on the first side wall portion 321 has an angle θ2 with respect to the third main surface 101 at a portion continuous with the first side wall portion 321 that is smaller than the reference angle θb. It has become.

  The surface 36 of the adhesive 35 has an angle with the third main surface 101 that is greater than the reference angle θb in all regions in the second direction Y that is the extending direction of the connection wiring 33. small. That is, the surface of the adhesive 35 is provided to be inclined with respect to the third main surface 101 in the second direction Y, and the tangential direction and the third main surface in all regions of the surface 36 of the adhesive 35. The inclination angle with respect to 101 is smaller than the reference angle θb. That is, the surface 36 of the adhesive 35 is not provided in a convex shape, that is, protruding to the connection wiring 33 side, between the region continuous with the first side wall portion 321 and the region continuous with the third main surface 101. It is formed in a straight line or a concave shape. Note that the surface 36 of the adhesive 35 being formed in a concave shape means that it is formed in a concave shape along the second direction Y, which is the extending direction of the connection wiring 33, and the angle is different. It may be a polygonal shape provided with a plurality of straight lines or a concave curved surface. In the present embodiment, the surface 36 of the adhesive 35 is formed in a concave curved surface shape.

  The adhesive 35 is not particularly limited, and for example, an epoxy adhesive can be used.

  Further, the connection wiring 33 is continuously formed on the protective substrate 30, the flow path forming substrate 10 and the adhesive 35. Here, the connection wiring 33 will be described in detail with reference to FIG. FIG. 6 is a plan view showing the connection wiring.

  The connection wiring 33 extends from the first main surface 301 to the third main surface 101, that is, to the connection terminal 91 of the lead electrode 90 via the first side wall portion 321. Specifically, the connection wiring 33 is provided for each lead electrode 90, and is provided on the first connection wiring 331 provided on the first main surface 301 and the third main surface 101 side. A second connection wiring 332 formed on the upper surface, and an inclined surface wiring 333 formed over the first side wall portion 321 and the adhesive 35 to connect the first connection wiring 331 and the second connection wiring 332; Are provided.

  A plurality of connection wirings 33 are arranged in parallel in the first direction X for each row of connection terminals 91 of the lead electrode 90. In the present embodiment, since two connection terminal rows 91A of the lead electrode 90 are provided in the second direction Y, the connection wiring 33 is connected to both sides of the through hole 32 in the second direction Y on the connection terminal row 91A. Are provided corresponding to each.

  Here, the first connection wiring 331 is provided side by side in the first direction X on the first main surface 301 on both sides of the through hole 32 in the second direction Y. The first connection wiring 331 extends in a straight line in the second direction Y. One end portion of the first connection wiring 331 on the first main surface 301 is a first wiring terminal 334 that is electrically connected to the drive circuit 200 that is a semiconductor element. The first connection wirings 331 having the first wiring terminals 334 are juxtaposed along the first direction X at a first pitch d1 narrower than the second pitch d2 of the connection terminals 91 adjacent to each other in the lead electrode 90. Yes. In other words, the second pitch d2 of the connection terminals 91 is wider than the first pitch d1 of the first wiring terminals 334.

  The second connection wiring 332 is provided on the lead electrode 90, that is, on the surface of the lead electrode 90 opposite to the flow path forming substrate 10, and is electrically connected to the connection terminal 91 of the lead electrode 90. . In other words, the second connection wiring 332 extends linearly in the second direction Y, and is disposed opposite to the connection terminal 91 of the lead electrode 90 in the third direction Z. Such second connection wirings 332 are arranged in parallel in the first direction X at the same second pitch d2 as the lead electrodes 90. The second connection wiring 332 is a second wiring terminal that is electrically connected to the connection terminal 91 of the lead electrode 90. Incidentally, in this embodiment, the 2nd connection wiring 332 which is a 2nd wiring terminal is equivalent to the wiring terminal as described in a claim.

  The inclined surface wiring 333 is formed so as to connect the first connection wiring 331 and the second connection wiring 332. The inclined surface wiring 333 includes a linear portion 333a provided on the second connection wiring 332 side and an inclined portion 333b provided on the first connection wiring 331 side continuously to the linear portion 333a. Such a straight line portion 333 a is extended on a straight line along the second direction Y. In addition, the inclined portion 333b is inclined with respect to the straight portion 333a, that is, extends linearly in a direction inclined at an angle θ with respect to the second direction Y. Here, the straight line portion 333a is formed at the second pitch d2, and the end portion of the inclined portion 333b on the first connection wiring 331 side is formed at the first pitch d1. In the present embodiment, the inclined portions 333b of all the inclined surface wirings 333 are formed at the same inclination angle, and the first portion of the linear portion 333a is adjusted by adjusting the length of the linear portion 333a in the second direction Y. The pitch d1 is converted to the end of the inclined portion 333b on the first connection wiring 331 side, that is, the second pitch d2 of the first wiring terminal 334.

  In the connection wiring 33 including the first connection wiring 331, the second connection wiring 332, and the inclined surface wiring 333, the width of the boundary portion between the first side wall portion 321 and the third main surface 101 is the first side wall portion 321. It is formed to be wider than other portions of the inclined surface wiring 333 which is the upper connection wiring 33.

  Specifically, the first connection wiring 331, the second connection wiring 332, and the inclined surface wiring 333 are basically formed with the same width w1. The width w2 of the boundary portion between the first side wall portion 321 and the third main surface 101 of the connection wiring 33, that is, the portion where the second connection wiring 332 and the inclined surface wiring 333 are continuous is above the first side wall portion 321. The wide portion 335 is wider than the width w1 of the other portion.

  The width of the connection wiring 33 referred to here is the width in the first direction X for the first connection wiring 331, the straight line portion 333a, and the second connection wiring 332, and the second width for the inclined portion 333b. It is the width in the direction orthogonal to the direction of inclination inclined at an angle θ with respect to the direction Y. That is, the width of the connection wiring 33 is a width in a direction orthogonal to the extending direction of the connection wiring 33.

  The wide portion 335 is formed from the straight portion 333 a on the first side wall portion 321 to the second connection wiring 332 on the lead electrode 90. In other words, in the present embodiment, the adhesive 35 having the surface 36 continuous with each surface is formed at the boundary between the first side wall portion 321 and the lead electrode 90, but the wide portion 335 has the first side wall portion. It is formed from the part 321 to the lead electrode 90 through the surface 36 of the adhesive 35. That is, the wide portion 335 is formed across the boundary between the first side wall portion 321 and the surface 36 of the adhesive 35 and the boundary between the surface 36 and the lead electrode 90.

  In the present embodiment, such a wide portion 335 is formed so that the most widened portion becomes the surface 36 of the adhesive 35. Specifically, the wide portion 335 of the present embodiment is provided so as to gradually widen so that the width w1 becomes the width w2 from the adhesive 35 side of the linear portion 333a toward the adhesive 35. Further, the wide portion 335 is provided so as to gradually widen from the adhesive 35 side of the second connection wiring 332 toward the adhesive 35 so that the width w1 becomes the width w2. The connection wiring 33 is formed so as to have a width w <b> 2 in all portions on the surface 36 of the adhesive 35.

  Further, the other part that defines the width w <b> 2 of the wide part 335 is a part other than the wide part 335 on the first side wall part 321. The other part of this embodiment is the inclined part 333b. Specifically, in the present embodiment, the inclined surface wiring 333 on the first side wall portion 321 has a straight portion 333a and an inclined portion 333b. The end portion of the straight portion 333a on the third main surface 101 side is arranged in parallel in the first direction X at the same first pitch d1 as that of the second connection wiring 332. On the other hand, the end of the inclined portion 333b on the first main surface 301 side is formed with the same second pitch d2 as the first connection wiring 331. As described above, since the second pitch d2 is narrower than the first pitch d1, pitch conversion is performed, so that the adjacent interval s1 of the inclined portion 333b is other than the wide portion 335 of the linear portion 333a. It becomes narrower than the interval s2. Therefore, the wide portion 335 can be formed with a width w2 wider than the width w1 of the inclined portion 333b which is another portion. Incidentally, the interval s3 between the wide portions 335 adjacent to each other in the first direction X is preferably equal to or greater than the interval s1 between the inclined portions 333b. That is, the width w2 of the wide portion 335 is preferably widened until the interval s3 is the maximum interval s1 of the inclined portions. Thereby, since the interval s1 is designed so that the adjacent connection wirings 33 are not easily short-circuited by migration or the like, the inclined portion 333b is widened by setting the interval s3 of the adjacent wide portions 335 to be equal to or greater than the interval s1. Also in the part 335, the short circuit by the migration etc. of the adjacent connection wiring 33 can be suppressed similarly to the linear part 333a.

  As shown in FIG. 6, the interval s1 between the inclined portions 333b is an interval at a position where adjacent inclined portions 333b are closest to each other. In this embodiment, the interval s1 is relative to the second direction Y of the inclined portion 333b. It is the interval in the direction orthogonal to the inclination direction inclined at an angle θ.

  Of course, in this embodiment, the other part which defines the wide part 335 is not limited to the inclined part 333b, the inclined part 333b is not provided on the first side wall part 321 and only the straight part 333a is provided. In such a case, the portion on the first main surface 301 side of the linear portion 333a may be set as another portion.

  In this way, by providing the wide portion 335 wider than the other portions on the first side wall portion 321 at the boundary portion between the first side wall portion 321 and the third main surface 101 of the connection wiring 33, the protective substrate 30. Since the rigidity of the connection wiring 33 at the boundary portion between the protective substrate 30 and the flow path forming substrate 10 can be improved, the connection wiring 33 is disconnected when stress is concentrated on the boundary portion between the protective substrate 30 and the flow path forming substrate 10. Can be suppressed.

  Further, when the connection wirings 33 are arranged on the first side wall portion 321 at a high density as in this embodiment, the width w1 is limited so that the connection wirings 33 are not short-circuited. By providing the wide portion 335 only at the boundary portion between the protective substrate 30 and the flow path forming substrate 10, it is possible to make it difficult for the connection wirings 33 to be short-circuited. In particular, in the present embodiment, the interval s3 where the wide portions 335 are adjacent to each other is equal to or larger than the adjacent interval s1 of the inclined portions 333b arranged at a high density, so that even if the wide portions 335 are formed, the connection wirings 33 are connected to each other. Can be difficult to short circuit.

  Further, a short circuit due to migration is likely to occur in the adjacent connection wiring 33 on the adhesive 35 due to impurities contained in the adhesive 35, foreign matters at the time of manufacture, and the like, but in this embodiment, the wide portion 335 is adjacent. By setting the matching interval s3 to be equal to or greater than the adjacent interval s1 of the inclined portions 333b arranged at high density, occurrence of a short circuit such as migration can be suppressed.

  Further, in the present embodiment, the connection wiring 33 is formed with substantially the same thickness over the surface 36 of the adhesive 35. That is, the angles θ1 and θ2 of the surface 36 of the adhesive 35 of the present embodiment are smaller than the reference angle θb, and the angles between all tangential directions of the surface 36 and the third main surface 101 are smaller than the reference angle θb. Further, since the surface 36 has a so-called slope shape formed in a concave curved surface shape, the connection wiring 33 is formed from the first side wall portion 321 to the lead electrode 90 on the third main surface 101. When formed by a film, the thickness is formed with substantially the same thickness. Thereby, disconnection etc. on the adhesive 35 of the connection wiring 33 can be further suppressed. Further, since the surface 36 of the adhesive 35 is formed in a slope shape, the reference angle extends over the lead electrode 90 on the first side wall portion 321, the surface 36 of the adhesive 35, and the third main surface 101. No corners greater than θb are formed. Therefore, the connection wiring 33 provided continuously over the first side wall portion 321, the surface 36 of the adhesive 35, and the lead electrode 90 is also formed with a corner portion having an angle of the reference angle θb or more. Therefore, when the adhesive 35 expands, it is possible to suppress breakage due to stress concentration at the corners of the connection wiring 33. In the present embodiment, since the surface 36 of the adhesive 35 is formed in a concave curved surface, the connection wiring 33 on the adhesive 35 is also formed in a concave curved surface, and the stress concentration on the corners of the connection wiring 33 is effective. Can be suppressed.

  Further, in the present embodiment, the adhesive 35 that bonds the flow path forming substrate 10 and the protective substrate 30 is protruded and formed in a slope shape, so that the manufacturing process is compared with the case where a filler other than the adhesive 35 is used. Can be simplified to reduce the cost.

  The connection wiring 33 is formed by bonding the flow path forming substrate 10 on which the piezoelectric actuator 300, the lead electrode 90, and the like are formed and the protective substrate 30 on which the through hole 32 is formed, with an adhesive 35, and then connecting the connection wiring 33. The wiring 33 can be formed by film formation and lithography. Incidentally, the connection wiring 33 may be formed by any of sputtering, vapor deposition, plating, and the like. In addition, a part of the connection wiring 33 is formed in advance on the protective substrate 30 before bonding to the flow path forming substrate 10, and after the flow path forming substrate 10 and the protective substrate 30 are bonded, A part of the connection wiring 33 may be formed over the adhesive 35 and the lead electrode 90 and the connection wiring 33 may be electrically connected. Regardless of the manufacturing method, the wide portion 335 can be easily formed.

  The connection wiring 33 may be formed by stacking a plurality of layers. For example, a close contact layer provided on the flow path forming substrate 10 and the protective substrate 30 side and a conductive layer provided on the opposite side of the close contact layer from the flow path forming substrate 10 and the protective substrate 30 may be laminated. Here, examples of the adhesion layer include nickel (Ni), chromium (Cr), nickel chromium (NiCr), palladium (Pd), titanium (Ti), tungsten (W), titanium tungsten (TiW), and the like. . Examples of the conductive layer include gold (Au) and copper (Cu). Of course, another layer may be interposed between the adhesion layer and the conductive layer, or may be formed as one layer in which the above-described materials are mixed.

  On the first main surface 301 of the protective substrate 30, the drive circuit 200 that is a semiconductor element of this embodiment is mounted. The drive circuit 200 is disposed on the first main surface 301 of the protective substrate 30 so as to cover and close at least a part of the through hole 32. That is, the drive circuit 200 is provided at a position facing the through hole 32 in the third direction Z. In such a drive circuit 200, the width in the second direction Y is larger than the opening width of the first main surface 301 of the through-hole 32, and the through-hole 32 is disposed across the second direction Y. . In the present embodiment, in the drive circuit 200, the length in the first direction X is shorter than the opening length of the first main surface 301 of the through hole 32. And the drive circuit 200 is arrange | positioned in the approximate center of the through-hole 32 so that a part of through-hole 32 may be exposed to the both sides of the 1st direction X. As shown in FIG.

  The drive circuit 200 is provided with a terminal 201 that is electrically connected to the first wiring terminal 334 of the connection wiring 33. The terminal 201 is provided on the surface of the drive circuit 200 on the protective substrate 30 side. The terminals 201 are arranged in parallel in the first direction X on both sides of the drive circuit 200 in the second direction Y. Accordingly, the terminal 201 of the drive circuit 200 and the first wiring terminal 334 are connected to face each other in the third direction Z. The terminal 201 of the drive circuit 200 is provided with a connection portion 211 that is a metal bump, and the connection between the connection portion 211 and the first wiring terminal 334 is performed by welding such as solder connection or anisotropic conductive adhesion. Electrical connection is reliably achieved by pressure bonding with an agent (ACP, ACF) and a non-conductive adhesive (NCP, NCF) interposed.

  Thus, in this embodiment, since the drive circuit 200 is disposed across the through hole 32 in the second direction Y, the drive circuit 200 is disposed on the first main surface 301 of the protective substrate 30. Space can be reduced as much as possible. Thereby, the size of the ink jet recording head 1 can be reduced.

  In particular, in this embodiment, since the pitch conversion is performed by the connection wiring 33, the drive circuit 200 can be reduced in size. Therefore, the space for disposing the drive circuit 200 on the protective substrate 30 can be further reduced, and the ink jet recording head 1 can be further downsized.

  Further, since the drive circuit 200 is provided across the through hole 32 in the second direction Y, the protection substrate 30 whose rigidity has been reduced by the through hole 32 can be reinforced by the drive circuit 200.

  Furthermore, since the drive circuit 200 is shorter than the through hole 32 in the first direction X, the through hole 32 communicates with the outside on both sides of the drive circuit 200 in the first direction X, and heat is dissipated in the through hole 32. It can be performed. Therefore, it is possible to suppress the heat generated from the drive circuit 200 and the connection wiring 33 from being accumulated in the through hole 32.

  A case member 40 that forms a manifold 100 communicating with the plurality of pressure generating chambers 12 is fixed to the joined body of the flow path forming substrate 10, the protective substrate 30, the communication plate 15, and the nozzle plate 20. . The case member 40 has substantially the same shape as the communication plate 15 described above in a plan view, and is bonded to the protective substrate 30 and is also bonded to the communication plate 15 described above. Specifically, the case member 40 has a recess 41 having a depth in which the flow path forming substrate 10 and the protective substrate 30 are accommodated on the protective substrate 30 side. The concave portion 41 has an opening area larger than the surface of the protective substrate 30 bonded to the flow path forming substrate 10. The opening surface on the nozzle plate 20 side of the recess 41 is sealed by the communication plate 15 in a state where the flow path forming substrate 10 and the like are accommodated in the recess 41. As a result, a third manifold portion 42 is defined between the flow path forming substrate 10 and the protective substrate 30 and the case member 40. The first manifold portion 17 and the second manifold portion 18 provided on the communication plate 15 and the third manifold portion 42 defined by the case member 40 constitute the manifold 100 of the present embodiment.

  In addition, as a material of case member 40, resin, a metal, etc. can be used, for example. Incidentally, the case member 40 can be mass-produced at low cost by molding a resin material.

  A compliance substrate 45 is provided on the surface of the communication plate 15 where the first manifold portion 17 and the second manifold portion 18 open. The compliance substrate 45 seals the openings of the first manifold portion 17 and the second manifold portion 18 on the liquid ejection surface 20a side. In this embodiment, the compliance substrate 45 includes a sealing film 46 and a fixed substrate 47. The sealing film 46 is made of a flexible thin film (for example, a thin film having a thickness of 20 μm or less formed of polyphenylene sulfide (PPS) or stainless steel (SUS)), and the fixed substrate 47 is made of stainless steel ( It is formed of a hard material such as a metal such as SUS. Since the region of the fixed substrate 47 facing the manifold 100 is an opening 48 that is completely removed in the thickness direction, one surface of the manifold 100 is sealed only with a flexible sealing film 46. The compliance portion 49 is a flexible portion.

  The case member 40 is provided with an introduction path 44 that communicates with the manifold 100 and supplies ink to each manifold 100. The case member 40 is provided with a connection port 43 that exposes the first main surface 301 of the protective substrate 30 and accommodates the drive circuit 200 therein. A signal for driving the drive circuit 200 and supply of power from the outside are mounted by inserting a flexible board or the like into the connection port 43 and electrically connected to the drive circuit 200 in the connection port 43 or protection. The connection is made through a wiring or the like (not shown) formed on the substrate 30.

  In the ink jet recording head 1 having such a configuration, when ink is ejected, the ink is taken in from the liquid storage means in which the ink is stored through the introduction path 44, and the inside of the flow path extends from the manifold 100 to the nozzle opening 21. Fill with ink. Thereafter, in accordance with a signal from the drive circuit 200, a voltage is applied to each piezoelectric actuator 300 corresponding to the pressure generating chamber 12, so that the diaphragm 50 is bent together with the piezoelectric actuator 300. As a result, the pressure in the pressure generating chamber 12 is increased and ink droplets are ejected from the predetermined nozzle openings 21.

(Embodiment 2)
FIG. 7 is an enlarged view of the connection wiring according to the first embodiment of the present invention. In addition, the same code | symbol is attached | subjected to the member similar to Embodiment 1 mentioned above, and the overlapping description is abbreviate | omitted.

  As shown in FIG. 7, the connection wiring 33 includes a first connection wiring 331, a second connection wiring 332, and an inclined surface wiring 333.

  The wide portion 335 is provided from the first side wall portion 321 to the end of the second connection wiring 332.

  Even in such a configuration, since the second connection wiring 332 is formed with the first pitch d1 wider than the second pitch d2, the second connection wirings 332 adjacent to each other are short-circuited. Can be suppressed.

(Other embodiments)
As mentioned above, although each embodiment of this invention was described, the fundamental structure of this invention is not limited to what was mentioned above.

  For example, in each of the above-described embodiments, the connection wiring 33 is exemplified by the configuration including the linear portion 333a and the inclined portion 333b as the inclined surface wiring 333 formed on the first side wall portion 321. Without being limited thereto, for example, the inclined surface wiring 333 may be configured by only the straight portion 333a. Such an example is shown in FIG. FIG. 8 is an enlarged view of a connection wiring according to another embodiment.

  As shown in FIG. 8, the connection wiring 33 includes a first connection wiring 331, a second connection wiring 332, and an inclined surface wiring 333.

  The first connection wiring 331 is provided to be inclined with respect to the second direction Y. Further, the inclined surface wiring 333 is formed only by the straight portion 333a. Even in such a connection wiring 33, destruction of the connection wiring 33 is suppressed by providing a wide portion 335 having a width wider than other portions at a boundary portion between the first side wall portion 321 and the third main surface 101. can do. In the example shown in FIG. 8, the other part that defines the wide part 335 is a part on the first main surface 301 side of the straight part 333a.

  In each of the above-described embodiments, the straight portion 333a is provided on the third main surface 101 side. However, the present invention is not particularly limited thereto. For example, the inclined portion 333b is provided on the third main surface 101 side. Also good. In this case, the wide portion 335 may be provided on the inclined portion 333b.

  Further, in each of the above-described embodiments, the adhesive 35 is formed in a shape having the surface 36 continuous on the first side wall portion 321 and the lead electrode 90, but is not particularly limited thereto. Here, a modification of the adhesive is shown in FIG. FIG. 9 is an enlarged cross-sectional view of a main part of an ink jet recording head according to another embodiment.

  As shown in FIG. 9, the adhesive 35 is formed only between the second main surface 302 and the third main surface 101, and is not provided to protrude into the through hole 32 of the third main surface 101. . Even with such a configuration, disconnection of the connection wiring 33 can be suppressed by forming the wide portion 335 as in the first and second embodiments.

  Further, in each of the above-described embodiments, the connection wiring 33 is formed with substantially the same thickness. However, the present invention is not particularly limited to this, and for example, the thickness of the wide portion 335 is compared with other portions. It may be thicker. Thereby, the rigidity of the wide part 335 can further be improved and the destruction and disconnection of the wide part 335 can be suppressed.

  Further, in each of the above-described embodiments, the drive circuit 200 is mounted on the protective substrate 30 across the through hole 32. However, the present invention is not particularly limited thereto, and the drive circuit 200 is mounted on the through hole 32 of the protective substrate 30. You may make it mount in any one or both sides of the 2nd direction Y. Further, a flexible substrate, a rigid substrate, or the like on which the drive circuit 200 is mounted may be mounted on the protective substrate 30. In each of the above-described embodiments, the first connection wiring 331, the second connection wiring 332, and the inclined surface wiring 333 are formed as the connection wiring 33. However, the present invention is not particularly limited thereto, and the connection wiring 33 includes at least the second connection wiring 33. What is necessary is just to have the connection wiring 332 and the inclined surface wiring 333. That is, for example, a mounting component such as the drive circuit 200 may be connected to the inclined surface wiring 333.

  Further, for example, in each of the above-described embodiments, the through hole 32 is provided in the protective substrate 30, and the first side wall portion 321 that is a slope is provided in the through hole 32. The two protective substrates 30 may be provided separately from the flow path forming substrate 10 and the opposing end surfaces of the two protective substrates 30 may be inclined surfaces.

  Further, in each of the embodiments described above, the thin film piezoelectric actuator 300 has been described as the pressure generating means for causing a pressure change in the pressure generating chamber 12, but the present invention is not particularly limited thereto. For example, a green sheet is attached. It is possible to use a thick film type piezoelectric actuator formed by such a method, a longitudinal vibration type piezoelectric actuator in which piezoelectric materials and electrode forming materials are alternately stacked and expanded and contracted in the axial direction. Also, as a pressure generating means, a heating element is arranged in the pressure generating chamber, and droplets are discharged from the nozzle opening by bubbles generated by the heat generated by the heating element, or static electricity is generated between the diaphragm and the electrode. Thus, a so-called electrostatic actuator that discharges liquid droplets from the nozzle openings by deforming the diaphragm by electrostatic force can be used.

  In addition, the ink jet recording head 1 of each of the embodiments constitutes a part of an ink jet recording head unit including an ink flow path communicating with an ink cartridge and the like, and is mounted on the ink jet recording apparatus. FIG. 10 is a schematic view showing an example of the ink jet recording apparatus.

  In the ink jet recording apparatus I shown in FIG. 10, the ink jet recording head 1 is provided with an ink cartridge 2 that is a liquid storage means in a detachable manner, and the carriage 3 on which the ink jet recording head 1 is mounted is attached to the apparatus main body 4. The carriage shaft 5 is provided so as to be movable in the axial direction.

  Then, the driving force of the driving motor 6 is transmitted to the carriage 3 via a plurality of gears and a timing belt 7 (not shown), so that the carriage 3 on which the ink jet recording head 1 is mounted is moved along the carriage shaft 5. . On the other hand, the apparatus main body 4 is provided with a conveyance roller 8 as a conveyance means, and a recording sheet S which is a recording medium such as paper is conveyed by the conveyance roller 8. Note that the conveyance means for conveying the recording sheet S is not limited to the conveyance roller, and may be a belt, a drum, or the like.

  In the ink jet recording apparatus I described above, the ink jet recording head 1 is mounted on the carriage 3 and moved in the main scanning direction. However, the present invention is not particularly limited thereto. The present invention can also be applied to a so-called line type recording apparatus in which printing is performed simply by moving a recording sheet S such as paper in the sub-scanning direction.

  In the above-described example, the ink jet recording apparatus I has a configuration in which the ink cartridge 2 that is a liquid storage unit is mounted on the carriage 3, but is not particularly limited thereto, for example, a liquid storage unit such as an ink tank. May be fixed to the apparatus main body 4 and the storage means and the ink jet recording head 1 may be connected via a supply pipe such as a tube. Further, the liquid storage means may not be mounted on the ink jet recording apparatus.

  Furthermore, the present invention is intended for a wide range of liquid jet heads in general, for example, for manufacturing recording heads such as various ink jet recording heads used in image recording apparatuses such as printers, and color filters such as liquid crystal displays. The present invention can also be applied to a coloring material ejecting head, an organic EL display, an electrode material ejecting head used for forming electrodes such as an FED (field emission display), a bioorganic matter ejecting head used for biochip manufacturing, and the like.

  In addition, the present invention broadly symmetrizes the wiring mounting structure and the overall manufacturing method thereof, and can be applied to devices other than the liquid jet head.

  I ink jet recording apparatus (liquid ejecting apparatus), 1 ink jet recording head (liquid ejecting head), 10 flow path forming substrate (second base), 101 third main surface, 15 communication plate, 20 nozzle plate, 20a liquid ejecting Surface, 21 nozzle opening, 30 protective substrate (first base), 301 first main surface, 302 second main surface, 31 holding portion, 32 through hole, 321 first side wall (slope), 322 second side wall, 33 connection wiring, 331 first connection wiring, 332 second connection wiring (second wiring terminal; wiring terminal), 333 inclined surface wiring, 333a linear portion, 333b inclined portion, 334 first wiring terminal, 335 wide portion, 35 bonding Agent, 36 surface, 40 case member, 45 compliance substrate, 50 diaphragm, 60 first electrode, 70 Collector layer, 80 a second electrode, 90 lead electrodes, 91 connecting terminal, 91A connection terminal row, 100 manifolds, 200 drive circuit (semiconductor device), 201 terminal, 211 connecting member, 300 piezoelectric actuator

Claims (8)

A first base body having a first main surface, a second main surface which is a back surface opposite to the first main surface, and an inclined surface formed between the first main surface and the second main surface. When,
A second base having a third main surface joined to the second main surface of the first base, and a connection terminal formed on the third main surface;
Connection wiring continuously formed on the first main surface of the first base, on the slope of the first base, and on the connection terminal of the third main surface;
With
A wiring mounting structure, wherein a width of at least a boundary portion between the slope and the third main surface of the connection wiring is wider than a width of another portion on the slope of the connection wiring. On the slope, the end on the third main surface side of the connection wiring is juxtaposed in the first direction at a first pitch, and the end on the first main surface side is the first end. Juxtaposed in the first direction at a second pitch narrower than the pitch;
2. The wiring mounting structure according to claim 1, wherein the other portion is a portion formed at the second pitch on the first main surface side of the connection wiring. In the connection wiring on the slope, the portion formed at the second pitch is an end of an inclined portion provided to be inclined with respect to a direction orthogonal to the first direction,
The wiring mounting structure according to claim 2, wherein the other portion is the inclined portion.   The interval between the connection wirings formed wide in the boundary portion is not less than the interval between the connection wires adjacent to each other in the other portion. The wiring mounting structure according to claim 1. The first base and the second base are joined via an adhesive,
The adhesive is provided such that the surface is exposed at the boundary between the slope and the third main surface not covered by the first base,
The connection wiring is continuously formed on the slope, the surface of the adhesive, and the third main surface;
The wiring mounting structure according to claim 1, wherein a width of the connection wiring formed on the surface of the adhesive is the widest.   The wiring mounting structure according to any one of claims 1 to 5, wherein a portion where the width of the connection wiring is widened is thicker than the other portion. A first base body having a first main surface, a second main surface which is a back surface opposite to the first main surface, and an inclined surface formed between the first main surface and the second main surface. When,
A third main surface joined to the second main surface of the first base, a flow path communicating with a nozzle opening for injecting liquid, pressure generating means for causing a pressure change in the flow path, and the third A second base having a connection terminal formed on the main surface;
Connection wiring continuously formed on the first main surface of the first base, on the slope of the first base, and on the connection terminal of the third main surface;
With
The liquid ejecting head according to claim 1, wherein a width of at least a boundary portion between the slope of the connection wiring and the third main surface is wider than a width of another portion of the connection wiring on the slope. A liquid ejecting apparatus comprising the liquid ejecting head according to claim 7.

Images