JP2015162280A - Color conversion substrate and display device using the same, and method for manufacturing color conversion substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a color conversion substrate having a color conversion layer which is subjected to high definition patterning and a display device using the color conversion substrate, and a method for manufacturing a color conversion substrate by which a color conversion layer can be subjected to high definition patterning.SOLUTION: A color conversion substrate 10 includes: a transparent substrate 11; a color filter layer 12 provided on the transparent substrate 11; and a color conversion layer 13 provided on the color filter layer 12, comprising a phosphor and a photosensitive material and formed through photosensitization of the photosensitive material.

Description

  The present invention relates to a color conversion substrate, a display device using the same, and a method for manufacturing the color conversion substrate.

  One method for realizing multicolor light emission using an organic EL element is a color conversion method (see, for example, Patent Documents 1 and 2). The color conversion method is a method of realizing multicolor by absorbing a light emission of an organic EL element and performing wavelength distribution conversion, and disposing a color conversion layer that emits light having a different wavelength distribution on the front surface of the organic EL element. It is. In the color conversion method, since one type of organic EL element is required (single color), manufacturing is easy, and development on displays is being actively studied. In addition, the color conversion method has an advantageous feature that a good color reproducibility can be obtained by further combining a color filter layer that transmits light in a specific wavelength range.

  As a patterning method of the color conversion layer necessary for applying the color conversion method to the display, as in the case of the inorganic phosphor, a fluorescent dye is dispersed in a liquid resist (photoreactive polymer), After forming a film by spin coating or the like, patterning by photolithography (see, for example, Patent Documents 3 and 4), or dispersing a fluorescent dye or fluorescent pigment in a basic binder, and etching this with an acidic aqueous solution And a method (for example, see Patent Document 5).

JP-A-8-279394 JP-A-8-286033 Japanese Patent Laid-Open No. 5-198921 JP-A-5-258860 Japanese Patent Laid-Open No. 9-208944

In order to increase the definition of a multi-color or full-color display using a color conversion method, it is necessary to pattern the color conversion layer with a high definition. When patterning is performed by a normal photolithography method, an application process, an exposure process with mask alignment, and a development process are necessary for each color conversion layer.
In the exposure process using a mask, the mask alignment accuracy is required to be sufficiently high. Since the mask alignment accuracy is determined by the mask finishing accuracy and the alignment accuracy of the exposure apparatus, a high-precision mask and an exposure apparatus with high alignment accuracy are required. Therefore, the mask and the exposure apparatus are expensive. Further, since mask alignment is required, the throughput of the exposure process is lowered, and as a result, there is a problem that the manufacturing cost is increased.
The method of dispersing a fluorescent dye or fluorescent pigment in a basic binder and etching it with an acidic aqueous solution also includes a patterning step by photolithography using a photoresist, and therefore has the same problem as the photolithography method. is there.

  The present invention has been made in view of the above circumstances, and has a color conversion substrate having a color conversion layer patterned with high definition, a display device using the same, and a patterning of the color conversion layer with high definition. It is an object of the present invention to provide a method for manufacturing a color conversion substrate that enables the above.

  The color conversion substrate of the present invention comprises a transparent substrate, a color filter layer provided on the transparent substrate, and a phosphor and a photosensitive material provided on the color filter layer, and the photosensitive material is photosensitive. And a color conversion layer.

  The display device of the present invention includes the color conversion substrate of the present invention and an excitation light source.

  The method for producing a color conversion substrate of the present invention includes a step of applying a photosensitive material containing a phosphor on a color filter layer formed on a transparent substrate, and the photosensitive material through the color filter layer. And irradiating light to expose the photosensitive material.

  The method for producing a color conversion substrate of the present invention includes a step of applying a red phosphor on a color filter layer formed on a transparent substrate, and a green wavelength region or a blue wavelength on the red phosphor. A step of applying a first positive resist that is sensitive to light of a region, and irradiating the first positive resist with light in a white wavelength region or colored light in a blue-green wavelength region through the color filter layer And exposing the first positive resist and developing the first positive resist to remove the first positive resist on the blue color filter layer and the green color filter layer. A step of removing the red phosphor on the blue color filter layer and the green color filter layer; and a step of applying a green phosphor on the color filter layer and the red phosphor. A step of applying a second positive resist that is exposed to light in a blue wavelength region on the green phosphor, and a white wavelength region on the second positive resist via the color filter layer. Or exposing the second positive resist by irradiating light in the blue wavelength region, developing the second positive resist, and developing the second positive resist on the blue color filter layer. And a step of removing the positive resist and a step of removing the green phosphor on the blue color filter layer.

  The method for producing a color conversion substrate of the present invention is a step of applying a first negative resist that is exposed to light in a green wavelength region or light in a blue wavelength region on a color filter layer formed on a transparent substrate. And exposing the first negative resist by irradiating the first negative resist with light in a white wavelength region or light in a blue-green wavelength region through the color filter layer; A step of developing the first negative resist to remove the first negative resist on the red color filter layer; and a red phosphor on the first negative resist and the red color filter layer. , A step of removing the exposed first negative resist, and a blue color filter layer, a green color filter layer, and the red phosphor on the red phosphor. Applying the second negative resist, and irradiating the second negative resist with light in a white wavelength range or colored light in a blue-green wavelength range via the color filter layer. Exposing the second negative resist, developing the second negative resist, removing the second negative resist on the red color filter layer and the green color filter layer, A step of applying a green phosphor on the second negative resist, the red color filter layer, and the green color filter layer; and a step of removing the exposed second negative resist. And

  According to the present invention, it is possible to provide a color conversion substrate having a color conversion layer patterned with high definition on a color filter layer.

It is a schematic sectional drawing which shows one Embodiment of a color conversion board | substrate. It is a schematic sectional drawing which shows 1st embodiment of the manufacturing method of a color conversion board | substrate. It is a schematic sectional drawing which shows 1st embodiment of the manufacturing method of a color conversion board | substrate. It is a schematic sectional drawing which shows 1st embodiment of the manufacturing method of a color conversion board | substrate. It is a schematic sectional drawing which shows 1st embodiment of the manufacturing method of a color conversion board | substrate. It is a schematic sectional drawing which shows 1st embodiment of the manufacturing method of a color conversion board | substrate. It is a schematic sectional drawing which shows 1st embodiment of the manufacturing method of a color conversion board | substrate. It is a schematic sectional drawing which shows 2nd embodiment of the manufacturing method of a color conversion board | substrate. It is a schematic sectional drawing which shows 2nd embodiment of the manufacturing method of a color conversion board | substrate. It is a schematic sectional drawing which shows 2nd embodiment of the manufacturing method of a color conversion board | substrate. It is a schematic sectional drawing which shows 2nd embodiment of the manufacturing method of a color conversion board | substrate. It is a schematic sectional drawing which shows 2nd embodiment of the manufacturing method of a color conversion board | substrate. It is a schematic sectional drawing which shows 2nd embodiment of the manufacturing method of a color conversion board | substrate. It is a schematic sectional drawing which shows 2nd embodiment of the manufacturing method of a color conversion board | substrate. It is a schematic sectional drawing which shows 2nd embodiment of the manufacturing method of a color conversion board | substrate. It is a schematic sectional drawing which shows 2nd embodiment of the manufacturing method of a color conversion board | substrate. It is a schematic sectional drawing which shows 2nd embodiment of the manufacturing method of a color conversion board | substrate. It is a schematic sectional drawing which shows 3rd embodiment of the manufacturing method of a color conversion board | substrate. It is a schematic sectional drawing which shows 3rd embodiment of the manufacturing method of a color conversion board | substrate. It is a schematic sectional drawing which shows 3rd embodiment of the manufacturing method of a color conversion board | substrate. It is a schematic sectional drawing which shows 3rd embodiment of the manufacturing method of a color conversion board | substrate. It is a schematic sectional drawing which shows 3rd embodiment of the manufacturing method of a color conversion board | substrate. It is a schematic sectional drawing which shows 3rd embodiment of the manufacturing method of a color conversion board | substrate. It is a schematic sectional drawing which shows one Embodiment of a display apparatus. It is an external view which shows the mobile telephone which is an example of application of a display apparatus. It is an external view which shows the thin television which is an example of application of a display apparatus. It is an external view which shows the portable game machine which is an example of 1 application of a display apparatus. It is an external view which shows the notebook personal computer which is one application example of a display apparatus.

Embodiments of a color conversion substrate, a display device using the same, and a method for manufacturing the color conversion substrate of the present invention will be described.
Note that this embodiment is specifically described in order to better understand the gist of the invention, and does not limit the present invention unless otherwise specified.

"Color conversion board"
FIG. 1 is a schematic cross-sectional view showing an embodiment of a color conversion substrate.
The color conversion substrate 10 of this embodiment includes a transparent substrate 11, a color filter layer 12 provided on one surface 11a of the transparent substrate 11, a color conversion layer 13 provided on the color filter layer 12, and a color A partition wall 14 that partitions a pixel (a red pixel 21, a green pixel 22, and a blue pixel 23) including the filter layer 12 and the color conversion layer 13 is schematically configured.

  Of the color filter layer 12, a region constituting the red pixel 21 is a red color filter layer 31. In the color filter layer 12, the region constituting the green pixel 22 is the green color filter layer 32. In the color filter layer 12, the region constituting the blue pixel 23 is the blue color filter layer 33.

Of the color conversion layer 13, a region constituting the red pixel 21 is a red color conversion layer 41. In the color conversion layer 13, the area constituting the green pixel 22 is the green color conversion layer 42. In addition, in the color conversion layer 13, a region constituting the blue pixel 23 is a blue color conversion layer 43.
The color conversion layer 13 absorbs near-ultraviolet light, blue light, blue-green light, or white light serving as an excitation light source, performs wavelength distribution conversion, and emits light in the visible light range.

The transparent substrate 11 is a substrate that emits light emitted from an excitation light source, which will be described later, and needs to have light transmittance. Examples of the transparent substrate 11 include inorganic material substrates made of glass, quartz, and the like, and transparent plastic substrates made of polyethylene terephthalate, polycarbazole, polyimide, and the like, but are not limited to these substrates.
Specific examples of the transparent substrate 11 include a glass substrate having a thickness of 0.7 mm, which is generally used for a liquid crystal display or the like.

Moreover, when it is necessary to form a curved part and a bending part in the color conversion board | substrate 10, it is preferable to use said plastic substrate as the transparent substrate 11. FIG.
Further, when it is necessary to improve the gas barrier property, it is more preferable to use a substrate obtained by coating a plastic substrate with an inorganic material as the transparent substrate 11. Thereby, when the plastic substrate is used as the transparent substrate 11, it is possible to prevent the wavelength conversion material from being deteriorated due to the transmission of moisture, which is the biggest problem.

  The red color filter layer 31, the green color filter layer 32, and the blue color filter layer 33 absorb excitation light (light emitted from the excitation light source) that excites each phosphor included in the color conversion layer 13 out of external light. Further, the light emission of the color conversion layer 13 due to external light can be reduced / prevented, and the decrease in display contrast due to the color conversion substrate 10 can be reduced / prevented. On the other hand, the red color filter layer 31, the green color filter layer 32, and the blue color filter layer 33 can prevent the excitation light that is not absorbed by the color conversion layer 13 and transmitted through the color conversion layer 13 from leaking to the outside. It is possible to prevent a decrease in the color purity of the light emission due to the color mixture of the light emission from the color conversion layer 13 and the excitation light.

Examples of the red color filter layer 31, the green color filter layer 32, and the blue color filter layer 33 include those composed of dyes, pigments, and resins, or those composed only of dyes and pigments.
Examples of the color filter layer composed of a dye, a pigment and a resin include those in a solid state in which a dye and a pigment are dissolved or dispersed in a binder resin.
Examples of the dye and pigment used in the color filter layer include perylene, isoindoline, cyanine, azo, oxazine, phthalocyanine, quinacridone, anthraquinone, and diketopyrrolopyrrole.

The color conversion layer 13 (the red color conversion layer 41, the green color conversion layer 42, and the blue color conversion layer 43) is formed by dispersing phosphors, and may be composed of only a phosphor material. An additive may be included, and these materials may be dispersed in a polymer material (transparent resin) or an inorganic material.
Further, the partition wall 14 may not be formed between the red color conversion layer 41, the green color conversion layer 42, and the blue color conversion layer 43, but the red color conversion layer 41, the green color conversion layer 42. In order to prevent light emission from the blue color conversion layer 43 from being mixed, it is preferable that the partition wall 14 is formed.

The red color conversion layer 41 includes light in the ultraviolet wavelength region (ultraviolet light), blue light in the excitation light in the ultraviolet wavelength region to the blue-green wavelength region (hereinafter sometimes simply referred to as “excitation light”). The light in the wavelength range of green and the light in the wavelength range of green are absorbed, and the light in the wavelength range of red is emitted.
The green color conversion layer 42 absorbs light in the ultraviolet wavelength region (ultraviolet light) and light in the blue wavelength region in the excitation light, and emits light in the green wavelength region.
The blue color conversion layer 43 absorbs light in the ultraviolet wavelength region (ultraviolet light) in the excitation light, and emits light in the blue wavelength region.

  In the color conversion substrate 10, light from the excitation light source may be directly used as pixel light. For example, when light in a blue wavelength region is used as excitation light, the light may be directly used as light for the blue pixel 23.

The thickness of the color conversion layer 13 (red color conversion layer 41, green color conversion layer 42, blue color conversion layer 43) is usually 100 nm to 100 μm, but preferably 1 μm to 100 μm.
If the thickness of the color conversion layer 13 (red color conversion layer 41, green color conversion layer 42, blue color conversion layer 43) is less than 100 nm, the light in the blue wavelength range irradiated from the excitation light source. Insufficient absorption of light can cause problems such as a decrease in color conversion efficiency and a decrease in color purity of emitted light due to mixing of blue transmitted light with converted light. Furthermore, the thickness of the color conversion layer 13 is reduced in order to increase the absorption amount of light in the blue wavelength region irradiated from the excitation light source and reduce the mixing of the blue transmitted light with the converted light to such an extent that the color purity is not lowered. The thickness is preferably 1 μm or more. On the other hand, even if the thickness of the color conversion layer 13 (red color conversion layer 41, green color conversion layer 42, blue color conversion layer 43) exceeds 100 μm, the light in the blue wavelength region irradiated from the excitation light source is thick. Even when the thickness is 100 μm or less (100 nm or more), the color conversion efficiency is not increased because it is sufficiently absorbed. Therefore, the material is merely consumed, leading to an increase in material cost.

  As a phosphor material for forming the red color conversion layer 41, the green color conversion layer 42, and the blue color conversion layer 43, a known phosphor material can be used. Such phosphor materials are classified into organic phosphor materials and inorganic phosphor materials.

Organic phosphor materials used for the red phosphor include cyanine dyes such as 4-dicyanomethylene-2-methyl-6- (p-dimethylaminostyryl) -4H-pyran (DCM), 1- Pyridine dyes such as ethyl-2- [4- (p-dimethylaminophenyl) -1,3-butadienyl] -pyridinium-perchlorate, and rhodamine B, rhodamine 6G, rhodamine 3B, rhodamine 101, rhodamine 110, basic Examples thereof include rhodamine dyes such as violet 11 and oxazine dyes such as sulforhodamine 101.
Examples of inorganic phosphor materials used for the red phosphor include Y ₂ O ₂ S: Eu ³⁺ , YAlO ₃ : Eu ³⁺ , Ca ₂ Y ₂ (SiO ₄ ) ₆ : Eu ³⁺ , LiY ₉ (SiO ₄ ) ₆ O. ₂ : Eu ³⁺ , YVO ₄ : Eu ³⁺ , CaS: Eu ³⁺ , Gd ₂ O ₃ : Eu ³⁺ , Gd ₂ O ₂ S: Eu ³⁺ , Y (P, V) O ₄ : Eu ³⁺ , Mg ₄ GeO _{5. 5} F: Mn ⁴⁺ , Mg ₄ GeO ₆ : Mn ⁴⁺ , K ₅ Eu _2.5 (WO ₄ ) _6.25 , Na ₅ Eu _2.5 (WO ₄ ) _6.25 , K ₅ Eu _2.5 (MoO ₄ ) _6.25 , Na ₅ Eu _2.5 (MoO ₄ ) _{6.25, and the} like.

Examples of organic phosphor materials used for the green phosphor include 2,3,5,6-1H, 4H-tetrahydro-8-trifluoromethylquinolidine (9,9a, 1-gh) coumarin (coumarin 153), Coumarin dyes such as 3- (2′-benzothiazolyl) -7-diethylaminocoumarin (coumarin 6), 3- (2′-benzoimidazolyl) -7-N, N-diethylaminocoumarin (coumarin 7), and basic yellow 51, And naphthalimide dyes such as Solvent Yellow 11 and Solvent Yellow 116.
Examples of the inorganic phosphor material used for the green phosphor include (BaMg) Al ₁₆ O ₂₇ : Eu ²⁺ , Mn ²⁺ , Sr ₄ Al ₁₄ O ₂₅ : Eu ²⁺ , (SrBa) Al ₁₂ Si ₂ O ₈ : Eu ^2+. , (BaMg) ₂ SiO ₄ : Eu ²⁺ , Y ₂ SiO ₅ : Ce ₃₊ , Tb ³⁺ , Sr ₂ P ₂ O ₇ —Sr ₂ B ₂ O ₅ : Eu ²⁺ , (BaCaMg) ₅ (PO ₄ ) ₃ Cl: Eu ²⁺ , Sr ₂ Si ₃ O ₈ -2SrCl ₂ : Eu ²⁺ , Zr ₂ SiO ₄ , MgAl ₁₁ O ₁₉ : Ce ³⁺ , Tb ³⁺ , Ba ₂ SiO ₄ : Eu ²⁺ , Sr ₂ SiO ₄ : Eu ²⁺ , and (BaSr) SiO ₄ : Eu ^{2+ and the} like.

Examples of organic phosphor materials used for blue phosphors include stilbene dyes such as 1,4-bis (2-methylstyryl) benzene (Bis-MSB), trans-4,4′-diphenylstilbene (DPS), Examples thereof include coumarin dyes such as 7-hydroxy-4-methylcoumarin (coumarin 4), BOQP, PBBO, BOT, and POPOP.
Examples of the inorganic phosphor material used for the blue phosphor include BaMg ₂ Al ₁₆ O ₂₇ : Eu ²⁺ , Sr ₂ P ₂ O ₇ : Sn ⁴⁺ , Sr ₄ Al ₁₄ O ₂₅ : Eu ²⁺ , BaMgAl ₁₀ O ₁₇ : Eu ²⁺ , SrGa ₂ S ₄ : Ce ³⁺ , CaGa ₂ S ₄ : Ce ³⁺ , (Ba, Sr) (Mg, Mn) Al ₁₀ O ₁₇ : Eu ²⁺ , (Sr, Ca, Ba ₂ , Mg) ₁₀ (PO ₄ ) ₆ Cl ₂ : Eu ²⁺ , BaAl ₂ SiO ₈ : Eu ²⁺ , Sr ₂ P ₂ O ₇ : Eu ²⁺ , Sr ₅ (PO ₄ ) ₃ Cl: Eu ²⁺ , (Sr, Ca, Ba) ₅ (PO ₄ ) ^{_{3 Cl: Eu 2+, (Ba}} , Ca) 5 (PO 4) 3 Cl: Eu 2+, Ba 3 MgSi 2 O 8: Eu 2+, Sr 3 MgSi 2 O 8: Eu 2+ and the like elevation It is.

The polymer material (transparent resin) constituting the color conversion layer 13 preferably has a transmittance of 80% or more, more preferably 95% or more in the entire wavelength region of 400 to 700 nm in the visible light region.
The transparent resin includes a thermoplastic resin, a thermosetting resin, and a photosensitive resin. Moreover, the precursor of these transparent resins contains the reactive monomer or reactive oligomer which hardens | cures by irradiation and produces | generates transparent resin. These reactive monomers or reactive oligomers are used alone or in combination of two or more.

  The polymer material (transparent resin) constituting the color conversion layer 13 is composed of a reactive monomer or a reactive oligomer and a photopolymerization initiator having a light absorption region in transmitted light.

(Reactive monomer, Reactive oligomer)
The reactive monomer and the reactive oligomer mean a monomer and an oligomer whose polymerization is induced by a radical generated by the photopolymerization initiator described later absorbing light, and in the present invention, a monomer having the property and Any monomer or oligomer can be used as long as it is an oligomer. As the reactive monomer and reactive oligomer, a compound having at least one polymerizable carbon-carbon unsaturated bond can be used. Examples of reactive monomers and reactive oligomers include acrylic acid, methacrylic acid, polyvinyl cinnamate, fluorene, cycloolefin, imide, silicone, organic / inorganic hybrid, polycarbonate, and TAC. Photocurable materials having reactive vinyl groups such as polystyrene, fluorine, polyethylene terephthalate, MS, polyvinyl alcohol, poval, alkyd, and ring rubber are used.

  Specific examples of reactive monomers and reactive oligomers include allyl acrylate, benzyl acrylate, butoxyethyl acrylate, butoxyethylene glycol acrylate, cyclohexyl acrylate, dicyclopentanyl acrylate, 2-ethylhexyl acrylate, glycerol acrylate, glycidyl acrylate, 2-hydroxyethyl acrylate, 2-hydroxypropyl acrylate, isobornyl acrylate, isodexyl acrylate, isooctyl acrylate, lauryl acrylate, 2-methoxyethyl acrylate, methoxyethylene glycol acrylate, phenoxyethyl acrylate, stearyl acrylate, ethylene glycol diacrylate Diethylene glycol diacryl 1,4-butanediol diacrylate, 1,5-pentanediol diacrylate, 1,6-hexanediol diacrylate, 1,3-propanediol acrylate, 1,4-cyclohexanediol diacrylate, 2,2 -Dimethylolpropane diacrylate, glycerol diacrylate, tripropylene glycol diacrylate, glycerol triacrylate, trimethylolpropane triacrylate, polyoxyethylated trimethylolpropane triacrylate, pentaerythritol triacrylate, pentaerythritol tetraacrylate, triethylene glycol Diacrylate, polyoxypropyltrimethylolpropane triacrylate, butylene glycol diacrylate, 1,2, -Butanetriol triacrylate, 2,2,4-trimethyl-1,3-pentanediol diacrylate, diallyl fumarate, 1,10-decanediol dimethyl acrylate, dipentaerythritol hexaacrylate, and methacrylates of the above acrylate groups Substituted with γ-methacryloxypropyltrimethoxysilane, 1-vinyl-2-pyrrolidone, 2-hydroxyethylacryloyl phosphate, tetrahydrofurfryl acrylate, dicyclopentenyl acrylate, dicyclopentenyloxyethyl acrylate, 3- Butanediol diacrylate, neopentyl glycol diacrylate, polyethylene glycol diaclerate, hydroxypivalate ester neopentyl glycol di Chryrate, phenol-ethylene oxide modified acrylate, phenol-propylene oxide modified acrylate, N-vinyl-2-pyrrolidone, bisphenol A-ethylene oxide modified diacrylate, pentaerythritol diacrylate monostearate, tetraethylene glycol diacrylate, polypropylene glycol di Acrylate monomers such as acrylates, trimethylolpropane propylene oxide modified triacrylate, isocyanuric acid ethylene oxide modified triacrylate, trimethylolpropane ethylene oxide modified triacrylate, pentaerythritol pentaacrylate, pentaerythritol hexaacrylate, pentaerythritol tetraacrylate, and ,these An acrylate group substituted with a methacrylate group, a urethane acrylate oligomer in which an acrylate group is bonded to an oligomer having a polyurethane structure, a polyester acrylate oligomer in which an acrylate group is bonded to an oligomer having a polyester structure, an acrylate group in an oligomer having an epoxy group Bonded epoxy acrylate oligomers, polyurethane methacrylate oligomers with methacrylate groups bonded to polyurethane oligomers, polyester methacrylate oligomers with methacrylate groups bonded to oligomers with polyester structures, and methacrylate groups bonded to oligomers with epoxy groups Epoxy methacrylate oligomer, polyurethane acrylate having acrylate group , Polyester acrylate having an acrylate group, epoxy acrylate resin having an acrylate group, polyurethane methacrylate having a methacrylate group, polyester methacrylate having a methacrylate group, epoxy methacrylate resin having a methacrylate group, and the like.

The above-mentioned reactive monomer and reactive oligomer are examples of the reactive monomer and reactive oligomer that can be used in the present invention, and are not limited thereto.
Moreover, it is preferable that content of such a reactive monomer and reactive oligomer is 10-90 mass% of the non-volatile component of the polymeric material (transparent resin) which comprises the color conversion layer 13, 20-80 mass % Is more preferable.

A reactive monomer and a reactive oligomer may be used independently and may be used in mixture of 2 or more types.
Among reactive monomers and reactive oligomers, trifunctional or higher polyfunctional acrylate monomers are particularly preferably used.

(Photopolymerization initiator)
The photopolymerization initiator is for generating radicals by absorbing light and initiating the polymerization reaction of the reactive monomer and reactive oligomer.
As the photopolymerization initiator, a radical-generating photopolymerization initiator, an acid-generating photopolymerization initiator, a base-generating photopolymerization initiator, a visible light polymerization initiator, or the like is used.
The acid-generating photopolymerization initiator generates an acid by irradiating ultraviolet rays or the like, and starts polymerization of a substance having a cationic polymerizable functional group such as a vinyl group or an epoxy group.

  Examples of visible light polymerization initiators include acylphosphine oxide compounds, α-aminoalkylphenone compounds, α-hydroxyalkylphenone compounds, titanocene photopolymerization initiators, hydrogen abstraction type radical photopolymerization initiators, and oxime ester types. Examples include photopolymerization initiators, cationic photopolymerization initiators, and acid generators. Among these visible light polymerization initiators, acylphosphine oxide compounds are particularly preferable.

Examples of the acyl phosphine oxide compound include monoacyl phosphine oxide and bisacyl phosphine oxide.
Specific examples of the acylphosphine oxide compound include benzophenone, Michler's ketone, N, N′tetramethyl-4,4′-diaminobenzophenone, 4-methoxy-4′-dimethylaminobenzophenone, 4,4′-diethylaminobenzophenone, Aromatic ketones such as 2-ethylanthraquinone and phenanthrene, benzoin ethers such as benzoin methyl ether, benzoin ethyl ether and benzoin phenyl ether, benzoins such as methyl benzoin and ethyl benzoin, 2- (o-chlorophenyl) -4,5- Phenylimidazole dimer, 2- (o-chlorophenyl) -4,5-di (m-methoxyphenyl) imidazole dimer, 2- (o-fluorophenyl) -4,5-diphenylimidazole dimer, 2 -(O- Methoxyphenyl) -4,5-diphenylimidazole dimer, 2,4,5-triarylimidazole dimer, 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butanone, 2- Trichloromethyl-5-styryl-1,3,4-oxadiazole, 2-trichloromethyl-5- (p-cyanostyryl) -1,3,4-oxadiazole, 2-trichloromethyl-5- (p -Methoxystyryl) -1,3,4-oxadiazole and other halomethylthiazole compounds, 2,4-bis (trichloromethyl) -6-p-methoxystyryl-S-triazine, 2,4-bis (trichloromethyl) ) -6- (1-p-dimethylaminophenyl-1,3-butadienyl) -S-triazine, 2-trichloromethyl-4-amino-6- -Methoxystyryl-S-triazine, 2- (naphth-1-yl) -4,6-bis-trichloromethyl-S-triazine, 2- (4-ethoxy-naphth-1-yl) -4,6-bis -Halomethyl-S-triazine compounds such as trichloromethyl-S-triazine, 2- (4-butoxy-naphth-1-yl) -4,6-bis-trichloromethyl-S-triazine, 2,2-dimethoxy- 1,2-diphenylethane-1-one, 2-methyl-1- [4- (methylthio) phenyl] -2-morpholinopropanone, 1,2-benzyl-2-dimethylamino-1- (4-morpholino Phenyl) -butanone-1,1-hydroxy-cyclohexyl-phenyl ketone, Irgacure-369 (manufactured by Ciba Specialty Chemicals), Irgacure- 51 (manufactured by Ciba Specialty Chemicals Inc.), Irgacure -907 (manufactured by Ciba Specialty Chemicals Co., Ltd.) photopolymerization initiator such as.
These photopolymerization initiators may be used alone or in combination of two or more.

Examples of the light used for curing the photocurable material include ultraviolet light, visible light, near infrared light, incandescent lamp, fluorescent lamp, and sunlight. Examples of light sources that can irradiate such light include carbon arc lamps, ultra high pressure mercury lamps, high pressure mercury lamps, xenon lamps, metal halide lamps, halogen lamps, fluorescent lamps, tungsten lamps, visible light lasers, and light emitting diodes (LEDs). Can be mentioned.
As a specific example of the light source, for example, a near-ultraviolet light or visible light in a certain region within a radiation wavelength range of 360 to 600 nm can be irradiated, and a lightweight and small semiconductor laser and LED can be used.
Examples of the semiconductor laser include a semiconductor violet laser, a semiconductor blue violet laser, and a semiconductor blue laser.
Examples of the LED include a blue LED.
In addition to the above, long-wavelength visible light, infrared, and near-infrared laser irradiators can also be used as light used for curing the photocurable material.
Furthermore, using these light sources, a monochromator, and a cut filter, only light having a specific wavelength may be used.

In addition, as light used for curing the photocurable material, light is incident from the transparent substrate 11 side and transmitted through the color filter layer 12 (the red color filter layer 31, the green color filter layer 32, and the blue color filter layer 33). May be used.
At this time, when the photocurable material constituting the red color conversion layer 41 disposed on the red color filter layer 31 is polymerized (cured), the light in the red wavelength region transmitted through the red color filter layer 31 is Used as light for curing the photocurable material.
Further, when the photocurable material constituting the green color conversion layer 42 disposed on the green color filter layer 32 is polymerized (cured), the light in the green wavelength region transmitted through the green color filter layer 32 is converted into light. Used as light for curing the curable material.
Further, when the photocurable material constituting the blue color conversion layer 43 disposed on the blue color filter layer 33 is polymerized (cured), the light in the blue wavelength range transmitted through the blue color filter layer 33 is converted into light. Used as light for curing the curable material.

At this time, as the photocurable material constituting the red color conversion layer 41, a material that is polymerized (cured) with light in the red wavelength band that has passed through the red color filter layer 31 is used.
In addition, as the photocurable material constituting the green color conversion layer 42, a material that is polymerized (cured) with light in the green wavelength region that has passed through the green color filter layer 32 is used.
In addition, as the photocurable material constituting the blue color conversion layer 43, a material that is polymerized (cured) with light in a blue wavelength range that has passed through the blue color filter layer 33 is used.

  Examples of the photopolymerization initiator contained in the photocurable material constituting the blue color conversion layer 43 include aromatic ketones, benzoin ethers, benzoins, and imidazole dimers among the above photopolymerization initiators. , Halomethylthiazole compound, halomethyl-S-triazine compound, benzophenone, [4- (methylphenylthio) phenyl] phenylmethanone, ethyl anthraquinone, p-dimethylaminobenzoic acid isoamyl ester, p-dimethylaminobenzoic acid ethyl ester 2,2-dimethoxy-1,2-diphenylethane-1-one, 1-hydroxy-cyclohexyl-phenyl-ketone, 2-hydroxy-2-methyl-1-phenyl-propan-1-one, 1-hydroxy- Cyclohexyl-phenyl-ketone, 1- [4- (2-hydroxy Toxi) -phenyl] -2-hydroxy-2-methyl-1-propan-1-one, 2-methyl-1- [4- (methylthio) phenyl] -2-morpholinopropan-1-one, methylbenzoinform Mate, benzoin isobutyl ether, benzyldimethyl ketal, 2,4,6-trimethylbenzophenone, 4-methylbenzophenone, (2-hydroxy-2-methyl-1- (4- (1-methylvinyl) phenyl) propanone, 2- [(2-Dimethylaminoethyl) amino] -4,6-bis (trichloromethyl) -S-triazine-dimethyl sulfate, 2- (4-methoxyphenyl) -4,6-bis (trichloromethyl) -S- Triazine, 2-methyl-4,6-bis (trichloromethyl) -S-triazine, 2,4,6-tris (tri Rolomethyl) -S-triazine, QUANTACURE ITX, ABQ, CPTX, BMS, EPD, DMB, MCA, EHA manufactured by Octel Chemicals, TAZ-100, 101, 102, 104, 106, 107, 108 manufactured by Midori Chemical Used.

 As a photopolymerization initiator contained in the photocurable material constituting the green color conversion layer 42, a photopolymerization initiator contained in the photocurable material constituting the blue color conversion layer 43, 2,4- Diethylthioxanthone, 2-chlorothioxanthone, 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butanone-1,2- [2- (furan-2-yl) ethenyl] -4,6- Bis (trichloromethyl) -S-triazine, 2- [2- (5-methylfuran-2-yl) ethenyl] -4,6-bis (trichloromethyl) -S-triazine, 2- [2- (3 4-Dimethoxyphenyl) ethenyl] -4,6-bis (trichloromethyl) -S-triazine, bis (2,6-dimethoxybenzoyl) -2,4,4-trimethyl-pentylphosphine oxy Acylphosphine oxides such as id and bis (2,4,6-trimethylbenzoyl) -phenylphosphine oxide, QUANTACURE QTX manufactured by Octel Chemicals, TAZ-110, 113, 118, 120, 121, 122, manufactured by Midori Chemical 123, ESA CURE KTO46 manufactured by Lamberti, or the like is used.

  As the photopolymerization initiator contained in the photocurable material constituting the red color conversion layer 41, the photopolymerization initiator contained in the photocurable material constituting the blue color conversion layer 43, bis (η5- 2,4-cyclopentadien-1-yl) -bis (2,6-difluoro-3- (1H-pyrrol-1-yl) -phenyl) titanium and η5-cyclopentadienyl-η6-cumenyl-iron (1+ ) -Hexafluorophosphate (1-) and other metallocenes, 2- [2- (4-diethylamino-2-methylphenyl) ethenyl] -4,6-bis (trichloromethyl) -S-triazine, manufactured by Midori Chemical Co., Ltd. TAZ-114 or the like is used.

A light scattering layer may be applied to the color conversion layer 13 (red color conversion layer 41, green color conversion layer 42, blue color conversion layer 43).
As a material for forming the light scattering layer, it is preferable to use a material in which light scattering particles are dispersed in a resin.
As the light scattering particles, particles composed of organic materials (organic fine particles), inorganic materials or particles composed of inorganic materials (inorganic fine particles) are used, and inorganic fine particles are preferable. By using light scattering particles as a material for forming the light scattering layer, light having directivity from the outside (for example, a light emitting element) can be diffused or scattered more isotropically and effectively. In particular, by using inorganic fine particles, a light scattering layer stable to light and heat can be formed.
Moreover, it is preferable that the light scattering particles have high transparency.
In addition, the light scattering particles preferably have a higher refractive index than the resin serving as a base material.
In addition, in order for the excitation light to be effectively scattered by the light scattering layer, the particle size of the light scattering particles needs to be in the Mie scattering region, so the particle size of the light scattering particles is 100 nm to 500 nm. The degree is preferred.

  When organic fine particles are used as the light scattering particles, for example, polymethylmethacrylate beads (refractive index: 1.49), acrylic beads (refractive index: 1.50), acrylic-styrene copolymer beads (refractive index). : 1.54), melamine beads (refractive index: 1.57), high refractive index melamine beads (refractive index: 1.65), polycarbonate beads (refractive index: 1.57), styrene beads (refractive index: 1. 60), crosslinked polystyrene beads (refractive index: 1.61), polyvinyl chloride beads (refractive index: 1.60), benzoguanamine-melamine formaldehyde beads (refractive index: 1.68), silicone beads (refractive index: 1. 50).

When an inorganic material is used as the light scattering particles, for example, an oxide of at least one metal selected from the group consisting of silicon, titanium, zirconium, aluminum, indium, zinc, tin and antimony is used as a main component. Particles (fine particles).
Further, when inorganic fine particles are used as the light scattering particles, for example, silica beads (refractive index: 1.44), alumina beads (refractive index: 1.63), titanium oxide beads (refractive index anatase type: 2). .50, rutile type: 2.70), zirconia bead (refractive index: 2.05), zinc oxide bead (refractive index: 2.00), barium titanate (BaTiO ₃ ) (refractive index: 2.4) Etc.

  The resin material used by mixing with the light scattering particles and forming the light scattering layer is preferably a translucent resin. Examples of the resin material include acrylic resin (refractive index: 1.49), melamine resin (refractive index: 1.57), nylon (refractive index: 1.53), polystyrene (refractive index: 1.60), melamine. Beads (refractive index: 1.57), polycarbonate (refractive index: 1.57), polyvinyl chloride (refractive index: 1.60), polyvinylidene chloride (refractive index: 1.61), polyvinyl acetate (refractive index) : 1.46), polyethylene (refractive index: 1.53), polymethyl methacrylate (refractive index: 1.49), poly MBS (refractive index: 1.54), medium density polyethylene (refractive index: 1.53). ), High density polyethylene (refractive index: 1.54), tetrafluoroethylene (refractive index: 1.35), poly (ethylene trifluoride) chloride (refractive index: 1.42), polytetrafluoroethylene (refractive index: 1). .3 ), And the like.

Further, the surface of the color conversion layer 13 (red color conversion layer 41, green color conversion layer 42, blue color conversion layer 43) opposite to the transparent substrate 11 (hereinafter also referred to as “one surface”). A sealing film may be provided so as to cover 13a.
The sealing film is formed by applying a resin to one surface 13a of the color conversion layer 13 using a spin coat method, ODF, or a laminate method. Alternatively, after forming an inorganic film made of SiO, SiON, SiN or the like by plasma CVD, ion plating, ion beam, sputtering, or the like so as to cover one surface 13a of the color conversion layer 13, A sealing film is formed by applying a resin using a spin coat method, ODF, a laminate method or the like so as to cover the inorganic film, or by bonding a resin film so as to cover the inorganic film. You can also.

  With this sealing film, it is possible to prevent external oxygen and moisture from being mixed into the color conversion layer 13 (the red color conversion layer 41, the green color conversion layer 42, and the blue color conversion layer 43). Deterioration of the color conversion layer 13 can be reduced. Furthermore, when the color conversion substrate 10 is applied to a display device, oxygen and moisture contained in the color conversion layer 13 reach the liquid crystal layer, the inorganic EL element, the organic EL element, etc., and the liquid crystal layer, the inorganic EL element, the organic EL element Etc. can be prevented from deteriorating.

Furthermore, a planarization film may be provided so as to cover the surface of the sealing film opposite to the surface in contact with the color conversion layer 13.
The planarization film can be formed using a known material. Examples of the material for the planarizing film include inorganic materials such as silicon oxide, silicon nitride, and tantalum oxide, and organic materials such as polyimide, acrylic resin, and resist material.
Examples of the method for forming the planarization film include a dry process such as a CVD method and a vacuum deposition method, and a wet process such as a spin coating method. However, this embodiment is limited to these materials and the formation method. is not.
Further, the planarization film may have either a single layer structure or a multilayer structure.
With this flattening film, when the color conversion substrate 10 is combined with an organic light source or a liquid crystal layer, it is possible to prevent a gap from being generated between the color conversion substrate 10 and the organic light source or the liquid crystal layer. The adhesion between the substrate 10 and the organic light source or the liquid crystal layer can be improved.

On one surface 11a of the transparent substrate 11, each pixel (red pixel 21, green pixel 22, blue pixel 23) composed of the color conversion layer 13 (red color conversion layer 41, green color conversion layer 42, blue color conversion layer 43). A light-absorbing partition wall 14 is provided between them. The partition wall 14 absorbs light emitted by the phosphor of the color conversion layer 13 (red color conversion layer 41, green color conversion layer 42, blue color conversion layer 43), and between adjacent pixels of the color conversion substrate 10, The contrast of the luminescent color can be improved.
The film thickness of the partition wall 14 is usually about 100 nm to 100 μm, but preferably 100 nm to 10 μm.

Moreover, it is preferable that the partition 14 comprises the light-reflective or light-scattering bank. As a result, out of isotropic light emission from the color conversion layer 13 (red color conversion layer 41, green color conversion layer 42, blue color conversion layer 43), light is emitted in the lateral direction (waveguide component through the color conversion layer 13). Thus, the light emission loss component that cannot be taken out to the transparent substrate 11 side is reflected and scattered in a desired pixel by a light reflective or light scattering bank so that the light emission can be used effectively. Accordingly, it is possible to prevent a decrease in color purity due to leakage of light emission to other than the desired pixel. Further, the light emission from the color conversion layer 13 can be reflected in each pixel, and the light emission from the color conversion layer 13 can be used effectively, so that the light emission efficiency can be improved and the power consumption can be reduced. Can be reduced.
Further, the film thickness of the light reflective or light scattering bank is preferably larger than the total film thickness of the color conversion layer 13. As a result, it is possible to effectively use a light emission loss component that is guided in the color conversion layer 13 and emits light in the side surface direction and cannot be extracted to the transparent substrate 11 side.

  The material for forming the light-reflective or light-scattering bank is not particularly limited, and examples thereof include a reflective film such as a metal such as gold, silver, and aluminum, and a scattering film such as titanium oxide.

Examples of the material of the partition wall 14 include inorganic materials such as silicon oxide (SiO ₂ ), silicon nitride (SiN or Si ₂ N ₄ ), tantalum oxide (TaO or Ta ₂ O ₅ ), or acrylic resin. And organic materials such as a resist material, metals such as gold, silver, and aluminum.
By using a metal as the material of the partition wall 14, it is possible to reflect light emitted from the phosphor included in the color conversion layer 13 and emit light only in a desired direction, thereby improving the light emission efficiency. This is preferable because it is possible. If the partition 14 itself is not reflective, it is possible to reflect light emitted from the phosphor contained in the color conversion layer 13 in a desired direction by forming a reflective film made of metal on the partition 14. Examples of the method for forming a reflective film made of metal on the partition wall 14 include a dry process such as a chemical vapor deposition (CVD) method and a vacuum deposition method, and a wet process such as a spin coating method. Moreover, as a patterning method of the partition 14, a conventional photolithography method or the like can be given.

"Color Conversion Board Manufacturing Method"
(First embodiment)
Next, with reference to FIGS. 1-7, 1st embodiment of the manufacturing method of a color conversion board | substrate is described.
2-7, the same code | symbol is attached | subjected to the same component as the component shown in FIG. 1, and the description is abbreviate | omitted.
A partition 14 is formed on one surface 11a of the transparent substrate 11 at a predetermined interval at a position corresponding to each pixel 12 (red pixel 21, green pixel 22, blue pixel 23) (see FIG. 2).

  Next, on one surface 11 a of the transparent substrate 11, a binder resin in which a dye or pigment corresponding to each color is dissolved or dispersed is applied between the partition walls 14, the binder resin is cured, and the color filter layer 12. (Red color filter layer 31, green color filter layer 32, blue color filter layer 33) are formed (see FIG. 2).

  Next, a photosensitive material 51 containing a red phosphor is applied on the color filter layer 12 (red color filter layer 31, green color filter layer 32, blue color filter layer 33) formed on one surface 11a of the transparent substrate 11. Apply (see FIG. 2).

As the red phosphor, those described above are used.
As the photosensitive material 51, a photo-curing material that is polymerized (cured) with light in the red wavelength band that has passed through the red color filter layer 31 is used.

Examples of the method for applying the photosensitive material 51 include a known wet process, a known dry process, and a laser transfer method.
Known wet processes include spin coating methods, dipping methods, doctor blade methods, discharge coating methods, spray coating methods, and other coating methods, inkjet methods, letterpress printing methods, intaglio printing methods, screen printing methods, microgravure coating methods, etc. Printing method.
Known dry processes include resistance heating vapor deposition, electron beam (EB) vapor deposition, molecular beam epitaxy (MBE), sputtering, and organic vapor deposition (OVPD).

  Next, the photosensitive material 51 is exposed through the color filter layer 12 by irradiating the photosensitive material 51 with light α in the red wavelength region (see FIG. 3). Here, the light α in the red wavelength band passes through only the red color filter layer 31 and does not pass through the green color filter layer 32 and the blue color filter layer 33. Therefore, the photosensitivity applied on the red color filter layer 31. Only the material 51 is exposed by the light α in the red wavelength band that has passed through the red color filter layer 31. Thereby, only the photosensitive material 51 on the red color filter layer 31 is polymerized (cured).

  Next, the photosensitive material 51 on the green color filter layer 32 and the blue color filter layer 33 that has not been polymerized (cured) by the above exposure is removed, and the red phosphor and the photosensitive material are formed on the red color filter layer 31. A red color conversion layer 41 composed of 51 is formed (see FIG. 4).

As a method for removing the photosensitive material 51, a physical method or a chemical method is used.
Physical methods include dry ice cleaning, hot air, cold air, and brush cleaning.
Chemical methods include, for example, an ashing treatment (oxygen plasma ashing), a solvent removal method such as N-methylpyrrolidone, γ-butyrolactone, propylene glycol methyl ether, propylene glycol methyl ether acetate, and cyclohexanone, and alkali development. Law. Among these, ashing is preferable.
In addition, after these treatments, chemical methods such as washing with water, alkaline aqueous solution (alkaline developer, eg, 10-50% tetramethylammonium hydroxide (TMAH) aqueous solution and 1-50% sodium hydroxide are further used. Aqueous solution), acidic aqueous solution (acid developer), organic solvents such as alcohol, and water-soluble compounds, or physical methods such as dry ice cleaning, hot air, cold air, and brush cleaning. May be.

  Examples of the alkaline developer include monomethylamine, dimethylamine, trimethylamine, monoethylamine, diethylamine, triethylamine, monoisopropylamine, diisopropylamine, triisopropylamine, monobutylamine, dibutylamine, monoethanolamine, diethanolamine, triethanolamine, Examples thereof include aqueous liquids such as dimethylaminoethanol, diethylaminoethanol, ammonia, caustic soda, caustic potash, sodium metasilicate, potassium metasilicate, sodium carbonate, and tetraethylammonium hydroxide.

  Examples of the acidic developer include aqueous solutions such as formic acid, crotonic acid, acetic acid, propionic acid, lactic acid, hydrochloric acid, sulfuric acid, nitric acid, and phosphoric acid.

  Examples of the organic solvent include hydrocarbons such as hexane, heptane, octane, toluene, xylene, dichloromethane, chloroform, carbon tetrachloride, and trichloroethylene, alcohols such as methanol, ethanol, propanol, and butanol, diethyl ether, and dipropyl ether. , Ethers such as dibutyl ether, ethyl vinyl ether, dioxane, propylene oxide, tetrahydrofuran, cellosolve, methyl cellosolve, butyl cellosolve, methyl carbitol, diethylene glycol monoethyl ether, ketones such as acetone, methyl ethyl ketone, methyl isobutyl ketone, isophorone, cyclohexanone System, ester system such as methyl acetate, ethyl acetate, propyl acetate, butyl acetate, pyridine, formamide, N And other solvents such as N- dimethylformamide.

  Next, the photosensitive material 51 on the green color filter layer 32 and the blue color filter layer 33 that has not been polymerized (cured) by the above exposure is removed, and the red phosphor and the photosensitive material are formed on the red color filter layer 31. A red color conversion layer 41 composed of 51 is formed (see FIG. 4).

  Next, a photosensitive material 52 containing a green phosphor is applied to the red color conversion layer 41 formed on the green color filter layer 32, the blue color filter layer 33, and the red color filter layer 31 (see FIG. 5). ).

As the green phosphor, those described above are used.
As the photosensitive material 52, a photo-curing material that is polymerized (cured) with light in the green wavelength band that has passed through the green color filter layer 32 is used.

  As a method for applying the photosensitive material 52, a method similar to the method for applying the photosensitive material 51 is used.

  Next, the photosensitive material 52 is exposed to light β in the green wavelength region through the color filter layer 12 to expose the photosensitive material 52 (see FIG. 6). Here, the light β in the green wavelength band passes through only the green color filter layer 32 and does not pass through the red color filter layer 31 and the blue color filter layer 33, and therefore, the photosensitive property applied on the green color filter layer 32. Only the material 52 is exposed by the light β in the green wavelength band that has passed through the green color filter layer 32. Thereby, only the photosensitive material 52 on the green color filter layer 32 is polymerized (cured).

  Next, the photosensitive material 52 on the red color filter layer 31 and the blue color filter layer 33 that has not been polymerized (cured) by the exposure described above is removed, and the green phosphor and the photosensitive material are formed on the green color filter layer 32. A green color conversion layer 42 composed of 52 is formed (see FIG. 7).

  As a method for removing the photosensitive material 52, a method similar to the method for removing the photosensitive material 51 is used.

  Next, the green color conversion layer 42, the blue color filter layer 33 formed on the green color filter layer 32, and the red color conversion layer 41 formed on the red color filter layer 31 are exposed to light containing a blue phosphor. Apply a functional material.

As the blue phosphor, those described above are used.
As the photosensitive material, a photo-curing material that is polymerized (cured) with light in the blue wavelength band that has passed through the blue color filter layer 33 is used.

  As a method for applying the photosensitive material, a method similar to the method for applying the photosensitive material 51 is used.

  Next, the photosensitive material is exposed by irradiating the photosensitive material with light in a blue wavelength region through the color filter layer 12. Here, since the light in the blue wavelength band is transmitted only through the blue color filter layer 33 and not through the red color filter layer 31 and the green color filter layer 32, the photosensitive material coated on the blue color filter layer 33 is used. Only the light in the blue wavelength band transmitted through the blue color filter layer 33 is exposed. Thereby, only the photosensitive material on the blue color filter layer 33 is polymerized (cured).

Next, the photosensitive materials on the red color filter layer 31 and the green color filter layer 32 that have not been polymerized (cured) by the exposure described above are removed, and the blue phosphor and the photosensitive material are formed on the blue color filter layer 33. The configured blue color conversion layer 43 is formed (see FIG. 1).
Thereby, the color conversion board | substrate 10 shown in FIG. 1 is obtained.

  As a method for removing the photosensitive material, a method similar to the method for removing the photosensitive material 51 is used.

  According to the method for manufacturing a color conversion substrate of the present embodiment, the color conversion layer 13 patterned with high precision on the color filter layer 12 (the red color filter layer 31, the green color filter layer 32, and the blue color filter layer 33). The color conversion substrate 10 having (the red color conversion layer 41, the green color conversion layer 42, and the blue color conversion layer 43) is obtained.

  In the present embodiment, the case where the blue color conversion layer 43 is formed on the blue color filter layer 33 is illustrated, but the present embodiment is not limited to this. In the present embodiment, the blue color conversion layer 43 may not be formed on the blue color filter layer 33.

(Second embodiment)
Next, with reference to FIG. 1 and FIGS. 8-17, 2nd embodiment of the manufacturing method of a color conversion board | substrate is described.
8 to 17, the same components as those illustrated in FIG. 1 are denoted by the same reference numerals, and the description thereof is omitted.
A partition 14 is formed on one surface 11a of the transparent substrate 11 at a predetermined interval at a position corresponding to each pixel 12 (red pixel 21, green pixel 22, blue pixel 23) (see FIG. 2).
On one surface 11a of the transparent substrate 11, a partition wall 14 is formed at a position corresponding to each pixel 12 (red pixel 21, green pixel 22, blue pixel 23) at a predetermined interval (see FIG. 8).

  Next, on one surface 11 a of the transparent substrate 11, a binder resin in which a dye or pigment corresponding to each color is dissolved or dispersed is applied between the partition walls 14, the binder resin is cured, and the color filter layer 12. (Red color filter layer 31, green color filter layer 32, blue color filter layer 33) are formed (see FIG. 8).

  Next, a positive type photosensitive material containing a red phosphor on the color filter layer 12 (red color filter layer 31, green color filter layer 32, blue color filter layer 33) formed on one surface 11a of the transparent substrate 11. Resin 61 is applied (see FIG. 8).

As the photosensitive resin 61, those described above are used.
In this step, the photosensitive resin 61 is applied on all of the red color filter layer 31, the green color filter layer 32, and the blue color filter layer 33.
Examples of the method for applying the photosensitive resin 61 include a known wet process, a known dry process, and a laser transfer method.
Known wet processes include spin coating methods, dipping methods, doctor blade methods, discharge coating methods, spray coating methods, and other coating methods, inkjet methods, letterpress printing methods, intaglio printing methods, screen printing methods, microgravure coating methods, etc. Printing method.
Known dry processes include resistance heating vapor deposition, electron beam (EB) vapor deposition, molecular beam epitaxy (MBE), sputtering, and organic vapor deposition (OVPD).

  As the positive photosensitive resin constituting the positive photosensitive resin 61, a conventionally known positive photosensitive resist can be used. Examples of the positive photosensitive resist include naphthoquinone azide-based positive resist, OFPR series manufactured by Tokyo Ohka Kogyo Co., Ltd., AZ series manufactured by Clariant Japan Co., Ltd. It is done.

The positive photosensitive resin contains (A) a soluble resin, (B) a photoacid generator, and (C) an organic solvent.
The positive photosensitive resin may contain a conventionally known photosensitizer as necessary in accordance with the wavelength of light to be irradiated.
Specifically, as a photosensitizer, for example, it is excited by absorbing light (visible light) in a wavelength region of 400 to 700 nm, and interacts with (A) a soluble resin or (B) a photoacid generator. Thioxanthene, xanthene, ketone, thiopyrylium salt, base styryl, merocyanine, 3-substituted coumarin, 3,4-substituted coumarin, cyanine, acridine, thiazine And phenothiazine, anthracene, coronene, benzanthracene, perylene, merocyanine, ketocoumarin, coumarin, and borate dyes.
These photosensitizers may be used alone or in combination of two or more.
The “interaction” referred to here includes energy transfer and electron transfer from the excited photosensitizer to other components.

Examples of the (A) soluble resin include (A1) an alkali-soluble resin and (A2) a resin that is modified to be alkali-soluble in the presence of an acid.
(A1) Examples of the alkali-soluble resin include phenol novolac resins, acrylic resins, styrene-acrylic acid copolymers, hydroxystyrene copolymers, polyvinylphenol, poly α-methylvinylphenol, and the like. Is preferred.
(A2) Examples of the resin that is alkali-soluble in the presence of an acid include resins such as polyvinylphenol having a hydroxyl group protected with a protecting group, and a styrene-maleimide copolymer.

(B) As a photo-acid generator, a quinonediazide group containing compound etc. are mentioned.
Examples of the quinonediazide group-containing compound include sulfonic acid of quinonediazides such as orthobenzoquinonediazide, orthonaphthoquinonediazide, orthoanthraquinonediazide, and a compound containing a phenolic hydroxyl group or amino group, polyhydroxybenzophenone, gallic acid alkylphenol resin, dimethylphenol, Hydroquinone, polyhydroxydiphenylalkane, polyhydroxydiphenylalkene, bisphenol A, tris (hydroxyphenyl) methane and its methyl substituents, naphthol, pyrocatechol, pyrogallol, aniline, p-aminodiphenylamine, part of p-aminodiphenylamine Or partially esterified, partially amidated p-aminodiphenylamine, Like completely those amidated.

  Next, on the photosensitive resin 61 applied to the red color filter layer 31, the green color filter layer 32, and the blue color filter layer 33, the first positive type is exposed by light in the green wavelength band or light in the blue wavelength band. A resist 71 is applied (see FIG. 9).

As the first positive resist 71, the above positive photosensitive resin is used.
As the photosensitizer contained in the first positive resist 71, a 4-substituted-3-benzothiazoylcoumarin compound that is sensitive to light in the blue and green wavelength ranges is used.

  As a method for applying the first positive resist 71, known wet process spin coating methods, dipping methods, doctor blade methods, discharge coating methods, spray coating methods, and other coating methods, ink jet methods, letterpress printing methods, intaglio plates, etc. Printing method, screen printing method, micro gravure coating method, printing method using roller, printing method using roll coater, printing method using curtain roll coater, electrostatic coating, dip coating, silk printing, spin coating, etc. Examples include printing methods.

Next, the first positive resist 71 is exposed through the color filter layer 12 by irradiating the first positive resist 71 with light γ ₁ in the white wavelength region or the blue-green wavelength region (FIG. 10). reference).
Here, the light γ ₁ in the white wavelength region or the blue-green wavelength region becomes light in the red wavelength region when transmitted through the red color filter layer 31, and becomes light in the green wavelength region when transmitted through the green color filter layer 32. When the light passes through the blue color filter layer 33, it becomes light in the blue wavelength range. Therefore, the light in the green wavelength range or the light in the blue wavelength range is applied on the green color filter layer 32 and the blue color filter layer 33. The first positive resist 71 to be exposed is exposed to light in the green wavelength band that has passed through the green color filter layer 32 and light in the blue wavelength band that has passed through the blue color filter layer 33.

  Next, the first positive resist 71 is developed to remove the first positive resist 71 on the green color filter layer 32 and the blue color filter layer 33 whose solubility has been increased by the exposure described above (FIG. 11). At this time, the first positive resist 71 remains only on the red color filter layer 31.

  Next, the photosensitive resin 61 on the green color filter layer 32 and the blue color filter layer 33 is removed by etching (see FIG. 12). Further, the first positive resist 71 on the red color filter layer 31 is removed by etching, and a red color conversion layer 41 composed of a photosensitive resin 61 is formed on the red color filter layer 31.

  In this step, a known wet etching method or a known dry etching method is used as the etching method.

  Next, on the green color filter layer 32 and the blue color filter layer 33 formed on one surface 11a of the transparent substrate 11, and on the photosensitive resin 61 applied on the red color filter layer 31, a green phosphor is applied. A positive type photosensitive resin 62 containing is applied (see FIG. 13).

As the photosensitive resin 62, those described above are used.
As a method for applying the photosensitive resin 62, a method similar to the method for applying the photosensitive resin 61 is used.

  Next, on the photosensitive resin 62 applied to the red color filter layer 31, the green color filter layer 32, and the blue color filter layer 33, a second positive resist 72 that is exposed to light in the blue wavelength region is applied (FIG. 14).

As the second positive resist 72, the above positive photosensitive resin is used.
As a photosensitizer contained in the second positive resist 72, 7-diethylamino-3-benzothiazoylcoumarin (common name: coumarin-6) or bis [ 3- (7-Diethylaminocoumaryl)] ketone (common name: ketocoumarin) is used.

  As a method of applying the second positive resist 72, a method similar to the method of applying the first positive resist 71 is used.

Next, the second positive resist 72 is exposed to light by irradiating the second positive resist 72 with light δ ₁ in the white wavelength region or the blue wavelength region through the color filter layer 12 (see FIG. 15). ).
Here, the light δ ₁ in the white wavelength region or the blue wavelength region becomes light in the red wavelength region when transmitted through the red color filter layer 31, and becomes light in the green wavelength region when transmitted through the green color filter layer 32. When the light passes through the blue color filter layer 33, it becomes light in the blue wavelength region. Therefore, the second positive resist 72 coated on the blue color filter layer 33 and sensitive to light in the blue wavelength region is used as a blue color filter. The layer 33 is exposed to light having a blue wavelength range that has passed through the layer 33.

  Next, the second positive resist 72 is developed to remove the second positive resist 72 on the blue color filter layer 33 whose solubility has been increased by the exposure described above (see FIG. 16). At this time, the second positive resist 72 remains on the red color filter layer 31 and the green color filter layer 32.

  Next, the photosensitive resin 62 on the green color filter layer 32 is removed by etching. Further, the second positive resist 72 on the red color filter layer 31 and the green color filter layer 32 is removed by etching, and a green color conversion layer composed of a photosensitive resin 62 is formed on the green color filter layer 32. 42 is formed. Further, the photosensitive resin 62 on the red color filter layer 31 is removed (see FIG. 17).

 In this step, a known wet etching method or a known dry etching method is used as the etching method.

Next, a blue phosphor is applied on the blue color filter layer 33 formed on the one surface 11 a of the transparent substrate 11 to form a blue color conversion layer 43.
Thereby, the color conversion board | substrate 10 shown in FIG. 1 is obtained.

As the blue phosphor, those described above are used.
As a method of applying the blue phosphor, a method similar to the method of applying the photosensitive resin 61 is used.

  According to the method for manufacturing a color conversion substrate of the present embodiment, the color conversion layer 13 patterned with high precision on the color filter layer 12 (the red color filter layer 31, the green color filter layer 32, and the blue color filter layer 33). The color conversion substrate 10 having (the red color conversion layer 41, the green color conversion layer 42, and the blue color conversion layer 43) is obtained.

  In the present embodiment, the case where the blue color conversion layer 43 is formed on the blue color filter layer 33 is illustrated, but the present embodiment is not limited to this. In the present embodiment, the blue color conversion layer 43 may not be formed on the blue color filter layer 33.

(Third embodiment)
Next, with reference to FIG. 1 and FIGS. 18-23, 3rd embodiment of the manufacturing method of a color conversion board | substrate is described.
18 to 23, the same components as those illustrated in FIG. 1 are denoted by the same reference numerals, and the description thereof is omitted.
On one surface 11a of the transparent substrate 11, a partition wall 14 is formed at a position corresponding to each pixel 12 (red pixel 21, green pixel 22, blue pixel 23) with a predetermined interval (see FIG. 18).
On one surface 11a of the transparent substrate 11, a partition wall 14 is formed at a position corresponding to each pixel 12 (red pixel 21, green pixel 22, blue pixel 23) with a predetermined interval (see FIG. 18).

  Next, on one surface 11 a of the transparent substrate 11, a binder resin in which a dye or pigment corresponding to each color is dissolved or dispersed is applied between the partition walls 14, the binder resin is cured, and the color filter layer 12. (Red color filter layer 31, green color filter layer 32, blue color filter layer 33) are formed (see FIG. 18).

  Next, on the color filter layer 12 (the red color filter layer 31, the green color filter layer 32, and the blue color filter layer 33) formed on the one surface 11a of the transparent substrate 11, light in the green wavelength band or blue wavelength. A first negative resist 81 that is exposed to light in the region is applied (see FIG. 18).

  The first negative resist 81 is a negative photosensitive resin composed of a reactive monomer and a photopolymerization initiator having a light absorption region in transmitted light.

(Reactive monomer)
The reactive monomer means a monomer whose polymerization is induced by radicals generated by absorption of light by a photopolymerization initiator to be described later. In the present invention, any monomer can be used as long as it has such properties. It can be used. As the reactive monomer, a compound having at least one polymerizable carbon-carbon unsaturated bond can be used.

  Specific examples of reactive monomers include allyl acrylate, benzyl acrylate, butoxyethyl acrylate, butoxyethylene glycol acrylate, cyclohexyl acrylate, dicyclopentanyl acrylate, 2-ethylhexyl acrylate, glycerol acrylate, glycidyl acrylate, and 2-hydroxyethyl. Acrylate, 2-hydroxypropyl acrylate, isobornyl acrylate, isodexyl acrylate, isooctyl acrylate, lauryl acrylate, 2-methoxyethyl acrylate, methoxyethylene glycol acrylate, phenoxyethyl acrylate, stearyl acrylate, ethylene glycol diacrylate, diethylene glycol diacrylate 1,4-butane All diacrylate, 1,5-pentanediol diacrylate, 1,6-hexanediol diacrylate, 1,3-propanediol acrylate, 1,4-cyclohexanediol diacrylate, 2,2-dimethylolpropane diacrylate, glycerol Diacrylate, tripropylene glycol diacrylate, glycerol triacrylate, trimethylolpropane triacrylate, polyoxyethylated trimethylolpropane triacrylate, pentaerythritol triacrylate, pentaerythritol tetraacrylate, triethylene glycol diacrylate, polyoxypropyltrimethylol Propane triacrylate, butylene glycol diacrylate, 1,2,4-butanetriol Acrylate, 2,2,4-trimethyl-1,3-pentanediol diacrylate, diallyl fumarate, 1,10-decanediol dimethyl acrylate, dipentaerythritol hexaacrylate, and the acrylate group substituted with a methacrylate group Γ-methacryloxypropyltrimethoxysilane, 1-vinyl-2-pyrrolidone, 2-hydroxyethylacryloyl phosphate, tetrahydrofurfryl acrylate, dicyclopentenyl acrylate, dicyclopentenyloxyethyl acrylate, 3-butanediol diacrylate , Neopentyl glycol diacrylate, polyethylene glycol diaclerate, hydroxypivalate ester neopentyl glycol diacrylate, phenol -Ethylene oxide modified acrylate, phenol-propylene oxide modified acrylate, N-vinyl-2-pyrrolidone, bisphenol A-ethylene oxide modified diacrylate, pentaerythritol diacrylate monostearate, tetraethylene glycol diacrylate, polypropylene glycol diacrylate, tri Acrylate monomers such as methylolpropane propylene oxide modified triacrylate, isocyanuric acid ethylene oxide modified triacrylate, trimethylolpropane ethylene oxide modified triacrylate, pentaerythritol pentaacrylate, pentaerythritol hexaacrylate, pentaerythritol tetraacrylate, and these Acrylate group Those substituted with acrylate groups, urethane acrylate oligomers with acrylate groups bonded to oligomers with polyurethane structures, polyester acrylate oligomers with acrylate groups bonded to oligomers with polyester structures, and acrylate groups bonded to oligomers with epoxy groups Epoxy acrylate oligomers, urethane methacrylate oligomers with methacrylate groups bonded to oligomers with polyurethane structures, polyester methacrylate oligomers with methacrylate groups bonded to oligomers with polyester structures, epoxies with methacrylate groups bonded to oligomers with epoxy groups Methacrylate oligomer, polyurethane acrylate with acrylate group, acrylate group Polyester acrylate, epoxy acrylate resin having an acrylate group, polyurethane methacrylate having a methacrylate group, polyester methacrylate having a methacrylate group, epoxy methacrylate resin having a methacrylate group, and the like.

Said reactive monomer is an example of the reactive monomer which can be used for this invention, It is not limited to these.
Further, the content of such a reactive monomer is preferably 10 to 90% by mass, and more preferably 20 to 80% by mass of the nonvolatile component of the first negative resist 81.

A reactive monomer may be used independently and may be used in mixture of 2 or more types.
Of the reactive monomers, a trifunctional or higher polyfunctional acrylate monomer is particularly preferably used.

(Photopolymerization initiator)
The photopolymerization initiator is for generating radicals by absorbing light and initiating the polymerization reaction of the reactive monomer.

As photopolymerization initiators, benzophenone, Michler ketone, N, N′tetramethyl-4,4′-diaminobenzophenone, 4-methoxy-4′-dimethylaminobenzophenone, 4,4′-diethylaminobenzophenone, 2-ethylanthraquinone, Aromatic ketones such as phenanthrene, benzoin ethers such as benzoin methyl ether, benzoin ethyl ether and benzoin phenyl ether, benzoins such as methyl benzoin and ethyl benzoin, 2- (o-chlorophenyl) -4,5-phenylimidazole dimer 2- (o-chlorophenyl) -4,5-di (m-methoxyphenyl) imidazole dimer, 2- (o-fluorophenyl) -4,5-diphenylimidazole dimer, 2- (o-methoxy) Phenyl) -4,5-di Phenylimidazole dimer, 2,4,5-triarylimidazole dimer, 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butanone, 2-trichloromethyl-5-styryl-1 , 3,4-oxadiazole, 2-trichloromethyl-5- (p-cyanostyryl) -1,3,4-oxadiazole, 2-trichloromethyl-5- (p-methoxystyryl) -1,3 Halomethylthiazole compounds such as 1,4-oxadiazole, 2,4-bis (trichloromethyl) -6-p-methoxystyryl-S-triazine, 2,4-bis (trichloromethyl) -6- (1-p -Dimethylaminophenyl-1,3-butadienyl) -S-triazine, 2-trichloromethyl-4-amino-6-p-methoxystyryl-S-tri Gin, 2- (naphth-1-yl) -4,6-bis-trichloromethyl-S-triazine, 2- (4-ethoxy-naphth-1-yl) -4,6-bis-trichloromethyl-S- Triazine, halomethyl-S-triazine compounds such as 2- (4-butoxy-naphth-1-yl) -4,6-bis-trichloromethyl-S-triazine, 2,2-dimethoxy-1,2-diphenylethane -1-one, 2-methyl-1- [4- (methylthio) phenyl] -2-morpholinopropanone, 1,2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butanone-1 , 1-hydroxy-cyclohexyl-phenylketone, Irgacure-369 (Ciba Specialty Chemicals), Irgacure-651 (Ciba Specialty Chemi) Manufactured Luz Ltd.), Irgacure -907 (manufactured by Ciba Specialty Chemicals Co., Ltd.) photopolymerization initiator such as.
These photopolymerization initiators may be used alone or in combination of two or more.

  As the photopolymerization initiator contained in the first negative resist 81, among the above photopolymerization initiators, photopolymerization initiators that are sensitive to light in the blue wavelength region, 2,4-diethylthioxanthone, 2-chloro Thioxanthone, 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butanone-1,2- [2- (furan-2-yl) ethenyl] -4,6-bis (trichloromethyl)- S-triazine, 2- [2- (5-methylfuran-2-yl) ethenyl] -4,6-bis (trichloromethyl) -S-triazine, 2- [2- (3,4-dimethoxyphenyl) ethenyl ] -4,6-bis (trichloromethyl) -S-triazine, bis (2,6-dimethoxybenzoyl) -2,4,4-trimethyl-pentylphosphine oxide or bis (2 Acylphosphine oxides such as 4,6-trimethylbenzoyl) -phenylphosphine oxide, QUANTACURE QTX manufactured by Octel Chemicals, TAZ-110, 113, 118, 120, 121, 122, 123 manufactured by Midori Chemical Co., Lamberti ESA CURE KTO46 or the like is used.

  As a method for applying the first negative resist 81, known wet process spin coating methods, dipping methods, doctor blade methods, discharge coating methods, spray coating methods, and other coating methods, ink jet methods, letterpress printing methods, intaglio plates, etc. Printing method, screen printing method, micro gravure coating method, printing method using roller, printing method using roll coater, printing method using curtain roll coater, electrostatic coating, dip coating, silk printing, spin coating, etc. Examples include printing methods.

Next, the first negative resist 81 is exposed to the first negative resist 81 by irradiating the first negative resist 81 with light γ ₂ in the white wavelength region or the blue-green wavelength region through the color filter layer 12 (FIG. 19). reference).
Here, the light γ ₂ in the white wavelength region or the blue-green wavelength region becomes light in the red wavelength region when transmitted through the red color filter layer 31, and becomes light in the green wavelength region when transmitted through the green color filter layer 32. When the light passes through the blue color filter layer 33, it becomes light in the blue wavelength range. Therefore, the light in the green wavelength range or the light in the blue wavelength range is applied on the green color filter layer 32 and the blue color filter layer 33. The first negative resist 81 to be exposed is exposed to light in the green wavelength range that has passed through the green color filter layer 32 and light in the blue wavelength range that has passed through the blue color filter layer 33.

  Next, the first negative resist 81 is developed, and the first negative resist 81 on the red color filter layer 31 that has not been exposed by the above-described exposure is removed (see FIG. 20). At this time, the first negative resist 81 remains on the green color filter layer 32 and the blue color filter layer 33.

  Next, on the red color filter layer 31 formed on the one surface 11a of the transparent substrate 11, and on the first negative resist 81 applied on the green color filter layer 32 and the blue color filter layer 33, A red phosphor 91 is applied (see FIG. 20).

As the red phosphor 91, those described above are used.
In this step, the red phosphor 91 is applied on the red color filter layer 31 and all of the first negative resist 81 applied on the green color filter layer 32 and the blue color filter layer 33.
Examples of the method for applying the red phosphor 91 include a known wet process, a known dry process, and a laser transfer method.
Known wet processes include spin coating methods, dipping methods, doctor blade methods, discharge coating methods, spray coating methods, and other coating methods, inkjet methods, letterpress printing methods, intaglio printing methods, screen printing methods, microgravure coating methods, etc. Printing method.
Known dry processes include resistance heating vapor deposition, electron beam (EB) vapor deposition, molecular beam epitaxy (MBE), sputtering, and organic vapor deposition (OVPD).

  Next, the red phosphor 91 and the first negative resist 81 on the green color filter layer 32 and the blue color filter layer 33 are removed by etching, and the red phosphor 91 is formed on the red color filter layer 31. The configured red color conversion layer 41 is formed (see FIG. 21).

  In this step, a known wet etching method or a known dry etching method is used as the etching method.

  Next, on the green color filter layer 32 and the blue color filter layer 33 formed on the one surface 11a of the transparent substrate 11, and on the red phosphor 91 applied on the red color filter layer 31, a blue wavelength is applied. A second negative resist 82 that is exposed to light in the region is applied (see FIG. 22).

As the second negative resist 82, the negative photosensitive resin described above is used.
As the photopolymerization initiator contained in the second negative resist 82, among the above-mentioned photopolymerization initiators, aromatic ketones, benzoin ethers, benzoins, and imidazole 2 sensitized by light in the blue wavelength region Halomethylthiazole compounds, halomethyl-S-triazine compounds, benzophenone, [4- (methylphenylthio) phenyl] phenylmethanone, ethylanthraquinone, p-dimethylaminobenzoic acid isoamyl ester, p-dimethylaminobenzoic acid Ethyl ester, 2,2-dimethoxy-1,2-diphenylethane-1-one, 1-hydroxy-cyclohexyl-phenyl-ketone, 2-hydroxy-2-methyl-1-phenyl-propan-1-one, 1- Hydroxy-cyclohexyl-phenyl-ketone, 1- [4- (2 Hydroxyethoxy) -phenyl] -2-hydroxy-2-methyl-1-propan-1-one, 2-methyl-1- [4- (methylthio) phenyl] -2-morpholinopropan-1-one, methylbenzoin Formate, benzoin isobutyl ether, benzyldimethyl ketal, 2,4,6-trimethylbenzophenone, 4-methylbenzophenone, (2-hydroxy-2-methyl-1- (4- (1-methylvinyl) phenyl) propanone, 2 -[(2-Dimethylaminoethyl) amino] -4,6-bis (trichloromethyl) -S-triazine-dimethyl sulfate, 2- (4-methoxyphenyl) -4,6-bis (trichloromethyl) -S -Triazine, 2-methyl-4,6-bis (trichloromethyl) -S-triazine, 2,4,6- Lith (trichloromethyl) -S-triazine, QUANTACURE ITX, ABQ, CPTX, BMS, EPD, DMB, MCA, EHA, manufactured by Octel Chemicals, TAZ-100, 101, 102, 104, 106, 107, manufactured by Midori Chemical Co., Ltd. 108 or the like is used.

  As a method for applying the second negative resist 82, a method similar to the method for applying the first negative resist 81 is used.

Next, the second negative resist 82 is exposed to the second negative resist 82 by irradiating the second negative resist 82 with light δ ₂ in the white wavelength region or the blue wavelength region through the color filter layer 12 (see FIG. 22). ).
Here, the light δ ₂ in the white wavelength region or the blue wavelength region becomes light in the red wavelength region when transmitted through the red color filter layer 31, and becomes light in the green wavelength region when transmitted through the green color filter layer 32. When the light passes through the blue color filter layer 33, it becomes light in the blue wavelength range. Therefore, the second negative resist 82 coated on the blue color filter layer 33 and sensitive to light in the blue wavelength range is used as the blue color filter. The layer 33 is exposed to light having a blue wavelength range that has passed through the layer 33.

  Next, the second negative resist 82 is developed, and the second negative resist 82 on the red color filter layer 31 and the green color filter layer 32 that have not been exposed by the above-described exposure is removed. At this time, the second negative resist 82 remains on the blue color filter layer 33.

  Next, the first color coated on the green color filter layer 32 formed on the one surface 11 a of the transparent substrate 11, the red phosphor 91 coated on the red color filter layer 31, and the blue color filter layer 33. A green phosphor 92 is applied on the second negative resist 82 (see FIG. 23).

As the green phosphor 92, those described above are used.
As a method of applying the green phosphor 92, the same method as the method of applying the red phosphor 91 is used.

  Next, the green phosphor 92 and the second negative resist 82 on the blue color filter layer 33 are removed by etching. Further, the green phosphor 92 on the red phosphor 91 applied on the red color filter layer 31 is removed, and the green color conversion layer 42 composed of the green phosphor 92 is formed on the blue color filter layer 33.

  In this step, a known wet etching method or a known dry etching method is used as the etching method.

Next, a blue phosphor is applied on the blue color filter layer 33 formed on the one surface 11 a of the transparent substrate 11 to form a blue color conversion layer 43.
Thereby, the color conversion board | substrate 10 shown in FIG. 1 is obtained.

As the blue phosphor, those described above are used.
As a method of applying the blue phosphor, a method similar to the method of applying the red phosphor 91 is used.

  According to the method for manufacturing a color conversion substrate of the present embodiment, the color conversion layer 13 patterned with high precision on the color filter layer 12 (the red color filter layer 31, the green color filter layer 32, and the blue color filter layer 33). The color conversion substrate 10 having (the red color conversion layer 41, the green color conversion layer 42, and the blue color conversion layer 43) is obtained.

  In the present embodiment, the case where the blue color conversion layer 43 is formed on the blue color filter layer 33 is illustrated, but the present embodiment is not limited to this. In the present embodiment, the blue color conversion layer 43 may not be formed on the blue color filter layer 33.

"Display device"
FIG. 24 is a schematic cross-sectional view showing an embodiment of a display device.
24, the same components as those shown in FIG. 1 are denoted by the same reference numerals, and the description thereof is omitted.
The display device 100 according to the present embodiment is generally configured by the color conversion substrate 10 and the excitation light source 110 described above.

As the excitation light source 110, one having an emission wavelength shorter than that of the color conversion layer 13 (red color conversion layer 41, green color conversion layer 42, blue color conversion layer 43) is used. In order to realize color conversion in the red color conversion layer 41 and the green color conversion layer 42, the emission wavelength of the excitation light source 110 is usually from the ultraviolet wavelength range to the blue wavelength range.
Although it does not specifically limit as the excitation light source 110, For example, a light emitting diode (LED (ultraviolet light emitting LED, blue LED)), an organic electroluminescent element (organic EL element (ultraviolet light emitting organic EL element, blue light emitting organic)) EL element)), inorganic electroluminescent element (inorganic EL element (ultraviolet light emitting inorganic EL element, blue light emitting inorganic EL element)), fluorescent lamp, light bulb, fluorescent display tube (VFD), and the like.

  In order to bond the color conversion substrate 10 and the excitation light source 110, an adhesive layer made of a conventional ultraviolet curable resin or thermosetting resin is provided between them, and the color conversion substrate 10 and the excitation light source 110 are excited via the adhesive layer. The light source 110 is bonded. For example, a curable adhesive is applied to the surface of the color conversion substrate 10 that faces the excitation light source 110, and the color conversion substrate 10 and the excitation light source 110 are brought into close contact with each other through the adhesive, and then the adhesive is used. The color conversion substrate 10 and the excitation light source 110 are bonded by curing.

Further, an inert gas such as nitrogen gas or argon gas may be sealed between the color conversion substrate 10 and the excitation light source 110, for example.
Furthermore, it is preferable to mix a hygroscopic agent such as barium oxide in the enclosed inert gas. In this way, when the excitation light source 110 is an organic EL element, deterioration of the organic EL element due to moisture can be effectively reduced.

  Further, between the color conversion substrate 10 and the excitation light source 110, the refractive index of the transparent substrate 11 and the refractive index of the color conversion layer 13 (red color conversion layer 41, green color conversion layer 42, blue color conversion layer 43). It is preferable to provide a low refractive index layer having a low refractive index. As a result, light emission from the color conversion layer 13 is guided through the transparent substrate 11 on the light extraction side and guided to the side surface of the transparent substrate 11. Utilizing the difference in refractive index with the refractive index layer, the light above the critical angle that cannot be extracted from the transparent substrate 11 on the light extraction side to the air layer is reflected by the difference in refractive index between the color conversion layer 13 and the low bending layer. Reflecting and reflecting member formed on the side opposite to the light extraction side (transmitting the excitation light provided between the color conversion layer 13 and the excitation light source 110 and reflecting the light emitted from the color conversion layer 13) Reflected by a reflective layer (dielectric multilayer film, band-pass filter, metal ultra-thin film, etc.), inorganic EL part, semi-transparent electrode or reflective electrode provided in the organic EL part, and emitted again in the light extraction direction In this way, the light emitted through the transparent substrate 11 on the light extraction side is guided. It becomes possible to reduce the loss. As a result, the power consumption of the display device 100 can be reduced and the luminance can be improved.

  A material that can be used for the low refractive index layer is not particularly limited. For example, a fluorine-based resin (Poly (1,1,1,3,3,3-hexafluoropropyl acrylate): n = 1.375. , Poly (2,2,3,3,4,4,4-heptafluorobutyl methacrylate): n = 1.383, Poly (2,2,3,3,3-pentafluoropropyl methacrylate): n = 1.395, Poly (2,2,2-trifluoroethyl methacrylate): n = 1.418, mesoporous silica (n = 1.2), airgel (n = 1.05), etc. And introduced into the space between the excitation light source 110 Dry air, may be formed by gas such as nitrogen, the space may be formed in the vacuum state.

"Electronics"
The display device described above can be applied to various electronic devices.
Hereinafter, electronic devices including the above display device will be described with reference to FIGS.
The above display device can be applied to, for example, the mobile phone shown in FIG.
A cellular phone 120 illustrated in FIG. 25 includes a voice input unit 121, a voice output unit 122, an antenna 123, an operation switch 124, a display unit 125, a housing 126, and the like.
The above display device can be suitably applied as the display unit 125. By applying the above display device to the display unit 125 of the mobile phone 120, an image can be displayed with good light emission efficiency.

Further, the display device described above can be applied to, for example, a flat-screen television shown in FIG.
A thin television 130 illustrated in FIG. 26 includes a display portion 131, speakers 132, a cabinet 133, a stand 134, and the like.
The above display device can be suitably applied as the display unit 131. By applying the above display device to the display portion 131 of the flat-screen television 130, an image can be displayed with good light emission efficiency.

Further, the above display device can be applied to, for example, a portable game machine shown in FIG.
A portable game machine 140 illustrated in FIG. 27 includes operation buttons 141 and 142, an external connection terminal 143, a display unit 144, a housing 145, and the like.
The above display device can be preferably applied as the display unit 144. By applying the above display device to the display unit 144 of the portable game machine 140, an image can be displayed with good light emission efficiency.

The above display device can be applied to, for example, a notebook computer shown in FIG.
A notebook personal computer 150 illustrated in FIG. 28 includes a display portion 151, a keyboard 152, a touch pad 153, a main switch 154, a camera 155, a recording medium slot 156, a housing 157, and the like.
The above display device can be suitably applied as the display unit 151. By applying the above display device to the display portion 151 of the notebook computer 150, an image can be displayed with good light emission efficiency.

As mentioned above, although preferred embodiment which concerns on this invention was described referring drawings, it cannot be overemphasized that this invention is not limited to said embodiment. The shapes and combinations of the constituent members shown in the above embodiment are merely examples, and various modifications can be made based on design requirements and the like without departing from the gist of the present invention.
For example, the display device described in the above embodiment is preferably provided with a polarizing plate. As the polarizing plate, a combination of a conventional linear polarizing plate and a λ / 4 plate can be used. By providing such a polarizing plate, external light reflection from the electrodes of the display device or external light reflection on the surface of the substrate or the sealing substrate can be prevented, and the contrast of the display device can be improved. it can.
In addition, specific descriptions regarding the shape, number, arrangement, material, formation method, and the like of each component of the color conversion substrate, the display device, and the electronic device are not limited to the above-described embodiments, and can be appropriately changed. is there.

  The method for manufacturing the color conversion substrate described in the above embodiment is not limited to the above embodiment, but includes a liquid crystal display device, a plasma display (PDP), a field emission display (FED), and a surface conduction electron-emitting device. It can also be used as appropriate for an electronic display device such as a display (SED).

DESCRIPTION OF SYMBOLS 10 ... Color conversion board | substrate, 11 ... Transparent substrate, 12 ... Color filter layer, 13 ... Color conversion layer, 14 ... Partition, 21 ... Red pixel, 22 ... Green pixel , 23 ... blue pixel, 31 ... red color filter layer, 32 ... green color filter layer, 33 ... blue color filter layer, 41 ... red color conversion layer, 42 ... green color Conversion layer, 43 ... blue color conversion layer, 51,52 ... photosensitive material, 61,62 ... photosensitive resin, 71 ... first positive resist, 72 ... second Positive resist, 81 ... first negative resist, 82 ... second negative resist, 91 ... red phosphor, 92 ... green phosphor.

Claims (5)

 A transparent substrate, a color filter layer provided on the transparent substrate, a color conversion layer provided on the color filter layer, composed of a phosphor and a photosensitive material, and the photosensitive material being exposed to light; A color conversion board characterized by comprising:  A display device comprising the color conversion substrate according to claim 1 and an excitation light source. Applying a photosensitive material containing a phosphor on a color filter layer formed on a transparent substrate;
Irradiating the photosensitive material with light through the color filter layer to expose the photosensitive material, and a method for producing a color conversion substrate. Applying a red phosphor on the color filter layer formed on the transparent substrate;
Applying a first positive resist that is exposed to light in a green wavelength range or light in a blue wavelength range on the red phosphor;
Irradiating the first positive resist through the color filter layer by irradiating the first positive resist with white wavelength light or blue-green wavelength light, and exposing the first positive resist;
Developing the first positive resist to remove the first positive resist on the blue color filter layer and the green color filter layer;
Removing the red phosphor on the blue color filter layer and the green color filter layer;
Applying a green phosphor on the color filter layer and the red phosphor;
Applying a second positive resist that is exposed to light in a blue wavelength range on the green phosphor;
Irradiating the second positive resist through the color filter layer with white wavelength light or blue wavelength light to expose the second positive resist; and
Developing the second positive resist to remove the second positive resist on the blue color filter layer;
And a step of removing the green phosphor on the blue color filter layer. A step of applying a first negative resist that is sensitized by light in a green wavelength region or light in a blue wavelength region on a color filter layer formed on a transparent substrate;
Irradiating the first negative resist with light in a white wavelength region or light in a blue-green wavelength region through the color filter layer to expose the first negative resist; and
Developing the first negative resist to remove the first negative resist on the red color filter layer;
Applying a red phosphor on the first negative resist and the red color filter layer;
Removing the exposed first negative resist;
Applying a second negative resist that is exposed to light in a blue wavelength region on the blue color filter layer, the green color filter layer, and the red phosphor; and
Irradiating the second negative resist with white wavelength light or blue-green wavelength light to the second negative resist through the color filter layer, and exposing the second negative resist;
Developing the second negative resist to remove the second negative resist on the red color filter layer and the green color filter layer;
Applying a green phosphor on the second negative resist, the red color filter layer and the green color filter layer;
And a step of removing the exposed second negative resist. A method for producing a color conversion substrate, comprising:

Images