JP2015161781A - Method for manufacturing reflective display device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for manufacturing a reflective display device, in which upon adhering two substrates while allowing a display medium to overflow a cell, generation of a flow disturbance when the display medium runs over an outer peripheral seal is prevented, and thereby occurrence of failure in filling the cell with the display medium can be significantly suppressed.SOLUTION: The method for manufacturing a reflective display device includes: a display medium disposition step of disposing a fluid display medium on a display region of one substrate or on a display region of the other substrate; an outer peripheral seal disposition step of disposing an outer peripheral seal that surrounds the fluid display medium, on the outside of the display region of the one substrate or on the outside of the display region of the other substrate; and an other substrate adhesion step of causing the other substrate to adhere to a top face of a partition wall of the one substrate. In the other substrate adhesion step, partial pressurizing is started by a pressing body when the one substrate and the other substrate are at positions to nip the outer peripheral seal; and the pressing position by the pressing body is relatively moved to cause the one substrate to adhere to the other substrate.

Description

  The present invention relates to a manufacturing method of a reflective display device applied to electronic paper or the like.

  Recently, as a reflective display device, an electrophoretic display device using an electrophoretic material as an electroresponsive material contained in a display medium has been widely used. An electrophoretic display device is a device that displays information by using electrophoretic migration, that is, particle movement, of an electrophoretic body (usually electrophoretic particles) in air or in a solvent. In general, an electrophoretic state is controlled by applying an electric field between two substrates, thereby realizing a desired display. As the electrophoretic body, charged powder as well as charged particles can be used. In that case, the charged powder electrophoreses in the gas.

  In recent years, the electrophoretic display device has attracted attention especially as an electronic paper. When applied as an electronic paper, it is possible to enjoy advantages such as visibility at the printed matter level (easy for eyes), ease of information rewriting, low power consumption, and light weight.

  However, in an electrophoretic display device, display defects, particularly a decrease in contrast, may occur due to sedimentation or uneven distribution of particles or powder. In order to prevent this phenomenon, it is used to form partition walls between the upper and lower electrode substrates and divide the migration space of the particles and powder to be electrophoresed, that is, the movement space into minute spaces. This minute space is called a cell or a pixel. In each cell, ink or gas (display medium) containing an electrophoretic body is enclosed. For example, Japanese Unexamined Patent Application Publication No. 2005-202245 discloses a conventional example of such an electrophoretic display device.

  Japanese Patent Application Laid-Open No. 2011-164300 discloses a manufacturing method for manufacturing a display panel as an electrophoretic display device by bonding upper and lower substrates. In addition, in Patent Document 3 (Japanese Patent Laid-Open No. 2012-013790) filed by the present applicant, an electrophoretic display is provided in which an adhesive is applied only on the partition walls partitioning the cells to ensure adhesion between the partition walls and the substrate. An apparatus manufacturing method is disclosed.

  When adhering the top surface of the partition provided on one substrate and the other substrate, it is strongly avoided from the viewpoint of display quality that bubbles enter into each cell formed by the partition. desired. For this reason, the bonding process in which a display medium exceeding the volume of the cell is placed on one of the substrates in advance and the two substrates are bonded (bonded together) while the fluid display medium overflows from the cell. It has been implemented. This point is disclosed in, for example, Patent Document 4 (Japanese Patent No. 2733679).

JP-A-2005-202245 JP 2011-164300 A JP 2012-013790 A Japanese Patent No. 2733679

  However, when the two substrates are bonded while the display medium overflows from the cell, there may be a case where the display medium is filled. Specifically, bubbles may be mixed in or streaky filling unevenness of the display medium may occur.

  As a result of diligent examination of the cause, the present inventors have started pressing from the outside of the outer peripheral seal when the two substrates are bonded while overflowing the display medium from the cell. It has been found that there is a situation overcoming the above, and that the flow turbulence generated at that time tends to cause a filling failure of the display medium. This is because, after a local pressure is generated in the display medium sandwiched between the outer peripheral seal and the substrate, a strong flow is generated when the local pressure is released, resulting in an excessive change in the component distribution of the display medium. It is thought that this is because of partial mixing with the outer peripheral seal.

  The present invention has been made based on such circumstances, and its purpose is to flow when the display medium passes over the outer peripheral seal when the two substrates are bonded while overflowing the display medium from the cell. An object of the present invention is to provide a method of manufacturing a reflective display device that can prevent the occurrence of disturbance and can remarkably suppress the occurrence of a filling failure of a display medium.

  According to the present invention, a fluid display medium including at least one kind of electrophoretic material is sealed between two opposing substrates, at least one of which has a light-transmitting property, and a predetermined amount is provided between the two substrates. A method of manufacturing a reflective display device that displays information when an electric field is applied, wherein a partition wall forming step of forming a partition wall in a pattern on a display area of one substrate, and a display area on one substrate, Alternatively, a display medium disposing step of disposing a fluid display medium on the display area of the other substrate and a fluid state on the outside of the display area of one substrate or on the outside of the display area of the other substrate An outer peripheral seal arranging step of arranging an outer peripheral seal surrounding the display medium, and an other substrate adhering step of adhering the other substrate to the top surface of the partition wall of the one substrate, in the other substrate adhering step, The one substrate and the By pressing the partial press by the pressing body at the position where the outer substrate sandwiches the outer peripheral seal, the pressing position by the pressing body is moved relative to the one substrate and the other substrate A method of manufacturing a reflective display device, wherein the one substrate and the other substrate are bonded to each other.

  According to the present invention, in the other substrate bonding step, the pressing medium partially starts pressing by the pressing body at a position where the one substrate and the other substrate sandwich the outer periphery seal, so that the display medium gets over the outer periphery seal. Does not occur. Therefore, it is possible to avoid the occurrence of flow disturbance when the display medium gets over the outer peripheral seal. Accordingly, if the pressing position of the pressing body is moved relatively from the outer peripheral seal to the inside of the display area, it is possible to avoid the occurrence of a filling defect of the display medium due to the flow disturbance inside the display area. .

  Preferably, in the other substrate bonding step, after the pressing is started and before the pressing position is relatively moved, the pressing body is in contact with the one substrate or the other substrate and the region The position where the outer peripheral seal is sandwiched overlaps when viewed from the one substrate toward the other substrate.

  In general, the outer peripheral seal is arranged in a rectangular shape. In this case, in the other substrate bonding step, pressing is started at a position where one substrate and the other substrate sandwich one side of the rectangular shape of the outer peripheral seal, and the pressing position is set in a direction perpendicular to the one side. If the display medium is moved relatively, it is possible to effectively avoid the occurrence of flow disturbance when the display medium gets over the outer peripheral seal.

  According to the present invention, in the other substrate bonding step, the pressing medium partially starts pressing by the pressing body at a position where the one substrate and the other substrate sandwich the outer periphery seal, so that the display medium gets over the outer periphery seal. Does not occur. Therefore, it is possible to avoid the occurrence of flow disturbance when the display medium gets over the outer peripheral seal.

It is sectional drawing which shows schematically the structure of the reflection type display apparatus manufactured by the manufacturing method of the reflection type display apparatus by one embodiment of this invention. It is a flowchart which shows schematically the manufacturing method of the reflection type display apparatus by one embodiment of this invention. It is a figure which shows an example of a partition formation process roughly. It is a figure which shows an example of an contact bonding layer formation process roughly. It is a figure which shows an example of a display medium arrangement | positioning process roughly. It is sectional drawing which shows an example of the other board | substrate adhesion process roughly. It is a figure explaining the example of a display medium arrangement | positioning process.

  FIG. 1 is a cross-sectional view schematically showing a configuration of a reflective display device manufactured by a method for manufacturing a reflective display device according to an embodiment of the present invention. This reflective display device is a fluid-like material containing at least one or more kinds of electrically responsive materials between two opposing substrates 11 and 16 on which at least one has translucency and each has electrodes formed thereon. A display medium 13 is enclosed, and a desired display is performed when a predetermined electric field is applied between the two substrates 11 and 16. The display medium 13 is surrounded by the outer peripheral seal 61. Here, the fluid state includes a gaseous state and a liquid state.

  The reflective display device of the present embodiment has a rectangular shape, and corresponding to this, the outer peripheral seal 61 is arranged in a rectangular shape (see FIG. 5).

  Here, in the specification and claims of the present application, “translucent” means a property of transmitting light. In the present embodiment, the substrate (one substrate 11) arranged on the viewing side has a light-transmitting property such that the total light transmittance is 50% or more, preferably 80% or more, more preferably 90% or more. have.

  1 to 7, electrodes are provided on the surfaces of one substrate 11 and the other substrate 16, but the electrodes are not shown. In the present embodiment, one substrate 11 is disposed on the viewing side, and the other substrate 16 is disposed on the non-viewing side.

  One substrate 11 includes a light-transmitting film such as polyethylene (PE), polyethylene terephthalate (PET), polyethersulfone (PES), polyethylene naphthalate (PEN), or light-transmitting glass, and indium tin oxide (ITO). ), Zinc oxide (ZnO), tin oxide (SnO) or the like having a light-transmitting electrode (translucent electrode) so as to cover at least the display region 60 of one substrate 11 is typically used. Can be. Here, the “display area” refers to an area used for desired display in the reflective display device. In the present embodiment, one substrate 11 is flexible, but may be rigid. Here, in the specification and claims of the present application, “flexibility” means a degree that can be flexed. Further, “rigidity” means a property that a dimensional deformation with respect to a bending or twisting force is small.

  The translucent electrode can be formed by a coating method, a vapor deposition method, or the like. Since the translucent electrode is used as a common electrode in the case of active matrix driving and segment driving, it is not always necessary to form a pattern, and the entire surface of the substrate may be an electrode. On the other hand, in the case of passive matrix driving, since both opposing substrates need to be pattern electrodes, the translucent electrode is also formed in a pattern such as a stripe.

  The thickness of one substrate 11 is preferably 10 μm to 1 mm. If it is thinner than 10 μm, the strength as a panel cannot be obtained and the risk of breakage increases. On the other hand, if it is thicker than 1 mm, the panel becomes too heavy and inconvenient to handle, and the cost is high. Because it becomes. A suitable thickness range that is difficult to break and easy to handle is about 50 μm to 300 μm.

  One substrate 11 can be applied in either a roll shape or a sheet shape.

  As the other substrate 16, a substrate such as a resin film, a resin plate, glass, epoxy glass (glass epoxy) or the like can be used. The other substrate 16 may be a translucent base material. Furthermore, it may be an opaque base material that is translucent, but an opaque glass base material, resin film, resin plate, glass, epoxy glass with the other surface different from the electrode surface roughened. (Garaepo) or the like can be used. In the present embodiment, since the other substrate 16 is disposed at a position opposite to the viewing side, there is no necessity of having translucency. However, when the same physical properties as the one substrate 11 such as thermal expansion characteristics are required, a light-transmitting member similar to the one substrate 11 can be used. In the present embodiment, the other substrate 16 is also flexible, but may be rigid.

  As the electrode, a pattern electrode is used in the case of segment drive and passive matrix drive, and a pixel electrode in which a TFT (Thin Film Transistor) is arranged in the case of active matrix drive.

  The thickness of the other substrate 16 is preferably 10 μm to 1 mm, similarly to the thickness of the one substrate 11. If it is thinner than 10 μm, the strength as a panel cannot be obtained and the risk of breakage increases. On the other hand, if it is thicker than 1 mm, the panel becomes too heavy and inconvenient to handle, and the cost is high. Because it becomes. A suitable thickness range that is difficult to break and easy to handle is about 50 μm to 300 μm.

  The other substrate 16 can be applied in either a roll shape or a sheet shape.

  An outer peripheral seal 61 that surrounds the display medium 13 is rectangular on one substrate 11 or the other substrate 16 with an adhesive such as an ultraviolet curable resin having a line width of 0.5 mm and a height of 50 μm using a dispenser. It is formed by being applied in a shape and then cured by ultraviolet rays. In addition to the ultraviolet curable resin, it can be constituted by a thermosetting resin, a room temperature curable resin, a heat seal resin, or the like. In addition to the dispenser, the outer peripheral seal 61 can be arranged by various printing methods or by thermocompression bonding.

<Method for manufacturing reflective display device>
FIG. 2 is a flowchart schematically showing a manufacturing method of the reflective display device according to the embodiment of the present invention. FIG. 3 is a diagram schematically showing an example of the partition wall forming step. As shown in FIG. 3, first, a partition wall having a predetermined pattern is formed on the upper surface of one substrate 11 generally placed in a horizontal direction by, for example, photolithography (exposure by ultraviolet (UV) irradiation → development → firing). 12 is formed (partition wall forming step: step (1) in FIG. 2).

  In the present embodiment, one substrate 11 is arranged on the viewing side and functions as a viewing side substrate. Therefore, one substrate 11 needs to have translucency. Correspondingly, the other substrate 16 is arranged on the non-viewing side and functions as a non-viewing side substrate. On the other hand, the partition wall 12 is a member that defines a plurality of cells to be described later. For example, the pattern of the partition walls 12 has a honeycomb shape. The height of the partition wall is 5 to 50 μm, preferably 10 to 50 μm. The cell size depends on the size of the display panel, but is 0.05 to 1 mm pitch, preferably 0.1 to 0.5 mm pitch. But the shape of the cell formed of the partition 12 does not necessarily need to be the same for all cells. For example, a pattern made up of a plurality of randomly shaped polygons may be employed.

  The partition wall 12 can be composed of an ultraviolet curable resin, a thermosetting resin, a room temperature curable resin, or the like, and is preferably formed to a height of 5 to 50 μm as described above. If the thickness is 5 μm or less, the amount of ink to be filled is small, and sufficient display characteristics, in particular, contrast cannot be obtained. On the other hand, if the thickness is 50 μm or more, the panel is too thick and the drive voltage increases excessively. From the viewpoint that good display characteristics can be obtained at a low driving voltage, a height in the range of 10 to 50 μm is preferable.

  The pattern shape of the partition walls 12 is basically arbitrary, such as a circle, a lattice, a honeycomb shape (hexagon), and other polygons. The aperture ratio is preferably 70% or more, and particularly preferably 90% or more. The higher the aperture ratio, the wider the displayable area, so that high contrast can be obtained.

  As a method for forming the partition wall 12, a mold transfer method such as embossing as well as a photolithography method may be employed. Furthermore, a method of manufacturing a mesh-processed structure as a partition and sticking the structure to one substrate 11 may be employed.

  Next, the adhesive layer 22 is formed on the partition wall 12 (adhesive layer forming step: step (2) in FIG. 2). In this adhesive layer forming step, for example, a heat sealing agent such as a polyester-based thermoplastic adhesive is formed with a thickness of 1 μm to 100 μm by a transfer method or a printing method. Preferably, it is formed with a thickness of 1 μm to 50 μm, particularly preferably with a thickness of 1 μm to 20 μm.

  Supplementing a specific description of an example of a typical thermal transfer method as a transfer method, as shown in FIG. 4, for example, a heat seal agent such as a polyester-based thermoplastic adhesive having a thickness of 20 μm is formed on a PET film 21. The formed transfer sheet is prepared, and the surface of the heat sealant of the transfer sheet is laminated on the partition wall 12 at a normal temperature and a pressure of 1 kPa. This is heated for 1 minute on a hot plate maintained at, for example, 120 ° C., which is equal to or higher than the softening temperature of the heat sealant, and then the transfer sheet is peeled off. Thereby, an adhesive layer 22 of about 6 μm, for example, is formed on the partition wall 12.

  In order to improve the adhesion between the partition wall 12 and the heat sealant 22, the partition wall 12 may be subjected to surface treatment by ultraviolet irradiation, plasma treatment, or the like, or a primer may be formed. Alternatively, a silane coupling agent may be added to the heat sealing agent 22.

  Next, an outer peripheral seal 61 for surrounding the fluid display medium is disposed in a rectangular shape along the outer periphery of the region where the partition wall 12 is formed (display region 60) (peripheral seal arrangement step: FIG. 2). Step (3)).

  If a specific description is supplemented about an example of the arrangement method of the outer periphery seal 61, the outer periphery seal 61 is made of an adhesive such as an ultraviolet curable resin with a line width of 0.5 mm and a height of 50 μm using a dispenser. It arrange | positions by apply | coating to a shape.

  Returning to FIG. 2, each partition 12 or each region partitioned by the partition 12 and the adhesive layer 22 is a cell, and liquid ink 13 as a fluid display medium is disposed in each cell (display medium). Arrangement step: step (4) in FIG.

  FIG. 5 is a diagram schematically showing an example of the display medium arranging step. Here, (1) the ink 13 is dropped from the dispenser 31 or the inkjet or die coat (ink dropping step), and (2) the ink 13 is made uniform in the surface by the applicator 32 or doctor blade, doctor knife, and central squeegee. It is applied (ink application process). The ink 13 may be disposed on the other substrate 16 as will be described later.

  Examples of the electroresponsive material include a charged particle material and a liquid crystal material. Examples of the charged particle material include so-called electrophoretic materials in which colored particles such as white, black, and color move in response to an electric field, or nanoparticle materials that move in response to an electric field. On the other hand, the liquid crystal material includes a material for electrically controlling transmission and scattering known as PDLC (Polymer Dispersed Liquid Crystal), a material in which a liquid crystal is mixed with a dye, a cholesteric liquid crystal material, and the like. These materials that change optical characteristics in response to an electric response need to be isolated into cells regardless of the type, and are within the scope of the present invention.

  Thereafter, the adhesive layer 22 on the partition wall 12 and the other substrate 16 facing the one substrate 11 are bonded (the other substrate bonding step: step (5) in FIG. 2). Thereby, the ink 13 is sealed in each cell.

  On the other hand, in the substrate bonding step, the heat sealing agent applied as the adhesive layer 22 is heated to obtain an adhesive force. Specifically, as shown in FIG. 6, while applying a predetermined thermocompression pressure (laminate pressure) by a laminator 91 as a pair of opposed pressing rollers, the heat sealant is heated from the periphery to a temperature exceeding its softening temperature. The partition 12 filled with the ink 13 and the other substrate 16 are bonded together by heating to soften.

  Here, in the other substrate bonding step of the present embodiment, pressing is partially started by the pressing body at a position where one substrate 11 and the other substrate 16 sandwich one rectangular side of the outer peripheral seal 61, By relatively moving the pressing position, the one substrate 11 and the other substrate 16 are bonded to each other.

  Specifically, as shown in FIG. 6A, a pair of laminators 91 as an example of a pressing body are positioned at vertical positions corresponding to one rectangular side of the outer peripheral seal 61. Then, as shown in FIG. 6B, the pair of laminators 91 sandwich the opposing substrates 11 and 16, and the laminator 91 starts to press the opposing substrates 11 and 16. In this state, the region C where the pair of laminators 91 are in contact with the one substrate 11 and the other substrate 16 and the position S that sandwiches one rectangular side of the outer peripheral seal 61 from one substrate 11 to the other substrate 16. Looking in the direction towards After that, as shown in FIG. 6C, the laminator 91 moves the pressing position where the one substrate 11 and the other substrate 16 are pressed against each other, so that the excess of the ink 13 overflows from each cell. However, the opposing substrates 11 and 16 are bonded. Then, as shown in FIG. 6 (d), after the laminator 91 has passed the other side facing the one side of the outer peripheral seal 61 where the pressing has been started, A laminator 91 releases the pressure.

  Then, the outer periphery seal | sticker hardening process which hardens the outer periphery seal | sticker 61 is performed. Specifically, the region where the outer peripheral seal 61 is disposed is irradiated with ultraviolet rays, and the outer peripheral seal 61 is cured.

  Thereafter, as shown in FIG. 2, the sheet is cut into a predetermined size by a cutting device 51 such as a guillotine, an upper blade slide device, a laser cutting device, or a laser cutter, thereby completing the manufacture of a desired reflective display device (cutting process: Step (6) in FIG.

  According to the present embodiment as described above, in the other substrate bonding step, the one substrate 11 and the other substrate 16 are partially pressed by the laminator 91 at the position where one rectangular side of the outer peripheral seal 61 is sandwiched. Therefore, it is possible in principle to avoid the occurrence of flow disturbance when the ink 13 passes over one side of the outer peripheral seal 61. Therefore, if the pressing position is moved from one side of the outer peripheral seal 61 to the inside of the display area, it is possible in principle to avoid the occurrence of ink filling problems due to the flow disturbance inside the display area. .

  The above embodiment can also be applied to the case where a plurality of reflective display devices are manufactured from a mother substrate. In this case, the other substrate bonding step shown in FIG. 6 is performed on each of the display areas of the reflective display device. In other words, the vertical movement of the pair of laminators 91 is performed for each display area.

  Note that the above embodiment can be applied in principle when the electrophoretic body is a charged powder and the display medium is a gas.

  Further, the display medium is not limited to one that electrically changes optical characteristics, but may be one that responds to an external field caused by magnetism or heat. That is, the present invention is not limited to the type of display medium in principle. Applicable. Further, the display medium arranging step is not limited to the above-described mode as shown in FIG. 7A, and the arrangement of the one substrate 11 and the other substrate 16 is reversed so that the display area of the other substrate 16 is displayed. A display medium may be arranged on the top (see FIG. 7B). If the display medium has a certain degree of viscosity (fluidity is not excessively high), instead of disposing the display medium on the display area of one substrate on which the partition wall 12 is formed, the display area of the one substrate 11 is displayed. A display medium may be arranged on the display area of the other substrate 16 that is to be opposed to the substrate 16 (see FIG. 7C), and the arrangement of the one substrate 11 and the other substrate 16 is turned upside down. A display medium may be arranged on the display area of one substrate 11 (see FIG. 7D).

  Furthermore, the pressing body is not limited to the laminator 91, and a pressing blade or the like can be employed.

  Next, practical examples actually performed will be described.

<Example of Reflective Display Device>
<Example 1>
As one substrate 11, an indium tin oxide (ITO) vapor deposition film (thickness 0.2 μm) was provided as a transparent electrode on one surface of a 300 mm × 400 mm × 0.125 mm thick PET film (Toyobo A4100). A substrate was prepared. The transparent electrode is formed by a general film formation method such as sputtering, vacuum evaporation, or CVD, and is also formed by zinc oxide (ZnO), tin oxide (SnO), etc. in addition to indium tin oxide (ITO). obtain.

Next, a negative photosensitive resin material (DuPont MRC Dry Film Resistry Dry Film Resist) is laminated on the one substrate 11 to a thickness of 30 μm and heated at 100 ° C. for 1 minute. Then, exposure is performed using an exposure mask (exposure amount: 500 mJ / cm ² ), and thereafter development using a 1% KOH aqueous solution is performed for 30 seconds, followed by baking at 200 ° C. for 60 minutes. The partition wall 12 having a honeycomb pattern with the width of the end portion on the other substrate 16 side of 15 μm and the cell pitch of 300 μm was formed.

  Next, a heat sealing agent (Toyobo's Byron 550) is formed on the PET film 21 with a thickness of 10 μm to form a PET film with a heat sealing layer (transfer sheet), and the heat sealing agent of the film 21 is used as the other of the partition walls 12. After thermocompression bonding (130 ° C., 1 kPa) to the end portion on the substrate 16 side, the film 21 is separated from the partition wall 12 to form a heat seal layer as an adhesive 22 on the entire end portion on the other substrate 16 side of the partition wall. (See FIG. 4).

  Subsequently, an ultraviolet curable resin (manufactured by ThreeBond Co., Ltd .: acrylic sealant 3052D) is applied without any break using a dispenser so as to surround the outer periphery of the display region 60 of one substrate 11, and the outer peripheral seal 61 is line width It was formed in a rectangular shape of 1.0 mm, a height of 100 μm, and 200 mm × 300 mm.

Subsequently, an ink 13 having the following components is used as a display medium, dropped from the dispenser 31, and squeezed with a central squeegee 32 (Neurong squeegee 1: urethane resin) to form a rectangular shape. Each cell was filled in the outer peripheral seal 61 formed.
<Ink component>
・ Electrophoretic particles (titanium dioxide): 60 parts by weight ・ Dispersion liquid: 40 parts by weight

  Next, as the other substrate 16, a 300 mm × 400 mm × 38 μm thick polyimide film (manufactured by Teijin DuPont) on which various electrodes such as Cu electrodes were formed in a pattern was used. Various electrode patterns were formed by a general etching method.

  Then, in the atmosphere, the other substrate 16 is aligned and superposed on the adhesive layer 22 on the partition wall 12 of the one substrate 11, and a constant thermocompression pressure is applied by the laminator 91 in the partition wall 12. The partition 12 of one substrate 11 and the other substrate 16 were brought into close contact with each other while extruding an excess of the ink 13 exceeding the cell volume. Specifically, as shown in FIGS. 6A to 6E, pressing is started at a position where one substrate 11 and the other substrate 16 sandwich one rectangular side of the outer peripheral seal 61. By relatively moving the pressing position, the one substrate 11 and the other substrate 16 were bonded to each other. The temperature during thermocompression bonding was 100 ° C. Moreover, the thermocompression bonding pressure was 0.1 MPa.

  The display quality of the display panel obtained as described above was evaluated and was very good. In particular, display unevenness did not occur in the vicinity of the outer peripheral seal 61.

<Comparative Example 1>
In contrast to the first embodiment, in the other substrate bonding step, pressing is started in the vicinity of the edge between the one substrate 11 and the other substrate 16, and the relative position while overcoming each side of the outer peripheral seal 61 facing the pressing position. Thus, the one substrate 11 and the other substrate 16 are bonded to each other. The other steps were the same process to produce a display panel.

  The display quality of the display panel thus obtained was evaluated, but streaky display unevenness occurred in the vicinity of one side of the outer peripheral seal 61 laminated first, and the quality was not good.

11 One substrate 12 Partition 13 Ink (display medium)
16 Other substrate 22 Heat sealant 31 Dispenser 32 Central squeegee 41 Dispenser 51 Cutting device 60 Display area 61 Perimeter seal 91 Laminator

Claims (3)

A fluid display medium containing at least one kind of electrophoretic body is sealed between two opposing substrates, at least one of which has translucency, and a predetermined electric field is applied between the two substrates. A method of manufacturing a reflective display device that displays information when
A partition formation step of forming a partition in the display region of one substrate;
A display medium disposing step of disposing a fluid display medium on the display area of one substrate or the display area of the other substrate;
An outer peripheral seal disposing step of disposing an outer peripheral seal surrounding a fluid display medium on the outer side of the display region of one substrate or the outer side of the display region of the other substrate;
The other substrate bonding step of bonding the other substrate to the top surface of the partition wall of the one substrate;
With
In the other substrate bonding step, pressing is partially started by the pressing body at a position where the one substrate and the other substrate sandwich the outer peripheral seal, and the pressing position by the pressing body is set to the one substrate and the A method of manufacturing a reflective display device, wherein the one substrate and the other substrate are bonded to each other by being moved relative to the other substrate. In the other substrate bonding step, after the pressing is started and before the pressing position is relatively moved, the area where the pressing body contacts the one substrate or the other substrate and the outer peripheral seal 3. The method for manufacturing a reflective display device according to claim 2, wherein the sandwiched position overlaps when viewed from the one substrate toward the other substrate. The outer peripheral seal is arranged in a rectangular shape,
In the other substrate bonding step, pressing is started at a position where the one substrate and the other substrate sandwich one rectangular side of the outer peripheral seal, and the pressing position is in a direction perpendicular to the one side. The method for manufacturing a reflective display device according to claim 1, wherein the one substrate and the other substrate are bonded to each other by being moved relative to each other.

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