JP2015145917A - Electronic apparatus, and attaching method of connection electrode - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a technology of compacting an electronic apparatus incorporated with an electric component.SOLUTION: An electronic apparatus 1 includes: a power source substrate 8 attached to a frame body 6A mounted with an attachable/detachable unit 40K having an input electrode Pin1 on the side opposite to the side on which the attachable/detachable unit is mounted; and a connection electrode 70 for electrically connecting an output electrode 93 of a mold type electric component 90 to the input electrode Pin1 of the attachable/detachable unit. The connection electrode 70 includes, in the connection state of the output electrode 93 to the input electrode Pin1, a perpendicular part 71 extending substantially perpendicularly to a connection surface 93A of the output electrode 93 and a parallel part 72 extending substantially in parallel with the connection surface 93A. The perpendicular part 71 and parallel part 72 are integrally molded.

Description

  The present invention relates to an electronic device, and more particularly to a technology for downsizing an electronic device in which an electrical component is mounted.

  2. Description of the Related Art Conventionally, for example, a technique described in Patent Document 1 is known as a technique for reducing the size of an electronic device on which an electrical component is mounted. In Patent Document 1, in a molded power semiconductor element as an electrical component, an external terminal (output electrode) can be routed to a desired position, and the upper surface of the power semiconductor element can be miniaturized. Discloses a technique in which an external terminal is provided.

JP 2012-096881 A

  However, when the output electrode of the mold type transformer as the mold type electric component is provided on the upper surface of the mold type transformer as in Patent Document 1, the output electrode of the mold type transformer and the mold type transformer are incorporated. A connection electrode for electrically connecting an electrode of a process cartridge (detachable unit) mounted on an electronic apparatus main body as a device is also required in the height direction of the mold type transformer. For this reason, there is a possibility that the thinning of the apparatus may be hindered.

  The present invention provides a technique for realizing a compact electronic device in which an electrical component is incorporated.

An electronic device disclosed in this specification includes a frame on which an detachable detachable unit having input electrodes is mounted, and a side opposite to a side on which the detachable unit is mounted with respect to the frame. A power supply board to be attached, and an electrical component mounted on the power supply board and having an output terminal, which is electrically connected to the output terminal and located on the opposite side of the face facing the frame body An electrical component having a connection surface and including an output electrode extending in a direction parallel to the surface of the power supply board from a side surface orthogonal to a mounting surface in contact with the power supply board in the electrical component, and the output of the electrical component A connection electrode for electrically connecting the electrode and the input electrode of the detachable unit and extending substantially perpendicular to the connection surface of the output electrode in a connected state between the output electrode and the input electrode Drooping Comprises a portion, and a connecting electrode having a parallel portion extending substantially parallel to said connection surface.
According to this configuration, by connecting the parallel portion of the connection electrode and the connection surface of the output electrode, the distance between the power supply board and the frame body when the power supply board is attached to the frame body is set to a single connection electrode. Can be made narrower. Therefore, for example, downsizing of an electronic device in which a molded transformer is incorporated as an electrical component can be realized with a small number of connection members.

In the electronic apparatus, the connection electrode is configured by a spring, the parallel portion is configured by an extension formed so that one end of the spring extends to the connection surface of the output electrode, and the vertical portion is configured by the spring. It may be constituted by the remaining part of
According to this structure, the connection electrode which has a parallel part and a perpendicular | vertical part can be simply comprised using a spring.

In the electronic device, the tip of the extension of the spring may be fixed to the connection surface of the output electrode with a screw.
According to this configuration, the reliability of the electrical connection between the spring and the output electrode is improved by screwing.

In the electronic apparatus, the spring is a coil spring, and the extension portion is configured by a deformed portion that is deformed so that one end of the coil spring extends to the connection surface of the output electrode. You may make it comprise with the remaining part of a coil spring.
According to this structure, the connection electrode which has a parallel part and a perpendicular | vertical part can be simply comprised using a coil spring.

The electronic apparatus may further include a support member that supports the coil spring when the detachable unit is mounted.
According to this configuration, when the detachable unit is mounted, the support member can suppress the fluctuation of the coil spring, and the restoring force of the coil spring can be applied to the detachable unit. As a result, the reliability of the coil spring as the connection electrode can be improved.

The electronic apparatus may further include a cover that covers the power supply board from a side opposite to a board surface on which the electrical component is mounted, the support member is provided on the cover, and the cover is provided on a vertical portion of the coil spring. You may make it comprise with the rib contact | abutted from the side.
According to this configuration, when the coil spring connects the output electrode and the input electrode, the vertical portion of the coil spring can be pressed by the rib. Thereby, the vertical portion of the coil spring can be fixed, and the stability of the electrical connection by the coil spring can be ensured.

In the electronic apparatus, the support member is configured by a plate-like pressing member that is fixed to the connection surface of the output electrode by the screw together with the tip end portion of the deformable portion of the coil spring. The presser member may have a shape extending along the deformed portion to the vertical portion of the coil spring in a screwed state.
According to this configuration, the support member can be formed with a simple configuration.

In the electronic apparatus, the spring is a leaf spring, and the extension portion is formed by deforming one end portion of the leaf spring to extend to the connection surface of the output electrode, and the vertical portion is You may make it comprise with the remaining part of a leaf | plate spring.
According to this structure, the connection electrode which has a parallel part and a perpendicular | vertical part can be simply comprised using a leaf | plate spring.

In the electronic apparatus, the other end portion of the leaf spring is formed to have a folded portion that is folded with a predetermined radius of curvature, and a tip portion of the folded portion is connected to the input electrode. You may make it do.
According to this configuration, since it is easy to generate an elastic force in the leaf spring at the time of connection with the input electrode, the connection reliability is improved.

In the electronic apparatus, the connection electrode also serves as an electrode contact, and is configured by a fixing hook that fixes the power supply substrate to the frame. The fixing hook extends to the connection surface of the output electrode. A hook portion whose tip is in contact with the connection surface and functions as the electrode contact, and a post portion formed to be perpendicular to the hook portion, the hook portion being You may make it comprise the said parallel part and the said support | pillar part comprises the said perpendicular | vertical part.
According to this configuration, since the fixing hook also serves as an electrode contact, the work for attaching the connection electrode and the power supply substrate to the frame body is simplified.

Further, in the electronic device, the electrical component is mounted on the power supply board such that the output electrode protrudes from the edge of the power supply board in a direction parallel to the surface of the power supply board. On the side surface of the electrical component, the electrical component may be formed at a position closer to the mounting surface than a surface located on the opposite side of the mounting surface of the electrical component.
According to this configuration, by increasing the distance between the output electrode and the frame, it becomes easy to balance the reduction in thickness between the power supply substrate and the frame and the connection reliability of the connection electrode. In other words, it is easy to ensure connection reliability while reducing the thickness between the power supply substrate and the frame.

In the electronic apparatus, the vertical portion and the parallel portion of the connection electrode may be integrally formed.
According to this configuration, the formation of the connection electrode is simplified.

In the electronic apparatus, the electrical component includes at least one individual electrical component, and is a molded electrical component molded with an insulating resin. The molded electrical component is the connection surface of the output electrode. It is also possible to include an insulating resin portion that exposes and covers the output electrode.
According to this configuration, the electronic device including the molded electrical component can be made compact.

In the electronic device, the electronic device is an image forming apparatus, the detachable unit is a detachable unit used for forming an image on a recording medium, and the power supply substrate is used for image formation. The molded electric component may include a transformer having the output terminal.
According to this configuration, it is possible to realize a compact image forming apparatus in which a molded transformer is incorporated.

  Further, the connection electrode mounting method disclosed in the present specification includes an input electrode and a detachable attachment / detachment unit including a frame on which the input electrode is attached and a power supply board on which an electrical component having an output electrode is mounted. In an electronic device, a method of attaching a connection electrode for connecting the input electrode and the output electrode to the output electrode, wherein the connection state between the output electrode and the input electrode is relative to the connection surface of the output electrode. A forming step of forming the connection electrode with a spring so as to have a vertical portion extending substantially vertically and a parallel portion extending substantially parallel to the connection surface, so that the vertical portion and the parallel portion are integrated. A board mounting step of mounting a power supply board on the opposite side of the frame body from the side on which the detachable unit is mounted, and the vertical portion of the connection electrode is electrically connected to the input electrode. In connection is ready, including a screwing step of attaching by screw the parallel portions of said connecting electrodes to said output electrode of said electrical component.

  In the attachment method of the connection electrode, the connection electrode may be constituted by a coil spring, and may further include an installation step of installing a support member that supports the coil spring when the detachable unit is attached to the frame.

  ADVANTAGE OF THE INVENTION According to this invention, size reduction of the electronic device in which an electrical component is integrated is realizable.

1 is a schematic cross-sectional view illustrating an internal configuration of a printer according to a first embodiment. Explanatory drawing showing the positional relationship between the detachable unit of the printer and the high voltage power supply board Schematic block diagram of high-voltage power supply for printer A circuit diagram showing composition of a mold type transformer concerning Embodiment 1 The fragmentary sectional view which shows the connection form by the connection electrode in Embodiment 1 Explanatory drawing which shows the attachment method of the connection electrode which concerns on Embodiment 1. FIG. Explanatory drawing showing how to attach the connection electrode Explanatory drawing showing how to attach the connection electrode Explanatory drawing showing how to attach the connection electrode The fragmentary sectional view which shows the connection form by another connection electrode which concerns on Embodiment 1 The fragmentary sectional view which shows another form of the contact part of another connection electrode The perspective view which shows the schematic external shape of another connection electrode which concerns on Embodiment 1. FIG. The fragmentary sectional view which shows the connection form by another connection electrode which concerns on Embodiment 1 The fragmentary sectional view which shows the connection form by the connection electrode which concerns on Embodiment 2 Explanatory drawing which shows the attachment method of the high voltage power supply board which concerns on Embodiment 2. FIG. The fragmentary sectional view which shows another form of the parallel part of the connection electrode which concerns on Embodiment 2. FIG. The fragmentary sectional view which shows the connection form by another connection electrode which concerns on Embodiment 2 The perspective view which shows the schematic external shape of another connection electrode which concerns on Embodiment 2. FIG.

<Embodiment 1>
The first embodiment will be described with reference to FIGS.
1. Overall Configuration of Printer FIG. 1 is a schematic sectional view showing an internal configuration of a color printer 1 (an example of “electronic device” and “image forming apparatus”) according to the first embodiment. In the following description, when distinguishing each component for each color, subscripts of Y (yellow), M (magenta), C (cyan), and K (black) are added to the reference numerals of the respective parts, and they are not distinguished. Omits subscripts. The image forming apparatus is not limited to a color printer, and may be, for example, a multifunction machine having a FAX and a copy function, or a monochrome printer.

  A color printer (hereinafter simply referred to as “printer”) 1 includes a paper feeding unit 3, a fixing unit 4, an image forming unit 5, a belt cleaning unit 20, a belt unit 30, a high-voltage power supply device 50, and a frame (6A, 6B: An example of “frame”). For example, the printer 1 converts a toner image composed of toner of one or a plurality of colors (four colors of yellow, magenta, cyan, and black in this embodiment) according to image data input from the outside into a sheet 15 (paper, OHP sheet). Etc.).

  The sheet feeding unit 3 is provided at the lowermost part of the printer 1 and includes a tray 17 that accommodates sheets (an example of “recording medium”) 15 and a pickup roller 19. The sheets 15 accommodated in the tray 17 are picked up one by one by the pickup roller 19 and are sent to the belt unit 30 through the conveyance roller 11 and the registration roller 12.

  The belt unit (an example of the “detachable unit”) 30 is mainly for conveying the sheet 15 and is detachably mounted on a predetermined mounting portion (not shown) formed in the printer 1, for example. The The belt unit 30 includes a driving roller 31, a driven roller 32, and a belt 34, and the belt 34 is bridged between the driving roller 31 and the driven roller 32. When the driving roller 31 rotates, the surface of the belt 34 facing the photosensitive drum 42 moves from the right direction to the left direction in FIG. As a result, the sheet 15 sent from the registration roller 12 is conveyed below the image forming unit 5. The belt unit 30 includes four transfer rollers 33.

  The image forming unit 5 includes four process units 40Y, 40M, 40C, and 40K and four exposure apparatuses 43. Each process unit 40 includes a charger 41, a photosensitive drum 42, a drum cleaner roller 44, a paper dust removing roller 45, a unit case 46, a developing roller 47, and a supply roller 48. Each process unit (an example of a “detachable unit”) 40Y, 40M, 40C, 40K is detachably attached to a frame (6A, 6B) formed in the printer 1 (see FIG. 2).

  For example, the photosensitive drum 42 is formed by forming a positively chargeable photosensitive layer on an aluminum substrate, and the aluminum substrate is grounded to the ground line of the printer 1 (see FIG. 3). . The charger 41 is, for example, a scorotron charger, and includes a discharge wire 41A and a grid 41B (see FIG. 3). The charging voltage CHG is applied to the discharge wire 41A, and the grid voltage GRID of the grid 41B is controlled so that the surface of the photosensitive drum 42 has substantially the same potential (for example, + 700V).

  The exposure device 43 includes, for example, a plurality of light emitting elements (for example, LEDs) arranged in a line along the rotational axis direction of the photosensitive drum 42, and the plurality of light emitting elements are selected according to image data input from the outside. By controlling the light emission, an electrostatic latent image is formed on the surface of the photosensitive drum 42. The exposure device 43 is fixedly installed in the printer 1. The exposure device 43 may use a laser.

  The unit case 46 stores toner of each color (in this embodiment, for example, a positively chargeable non-magnetic one-component toner), and includes a developing roller 47 and a supply roller 48. The toner is supplied to the developing roller 47 by the rotation of the supply roller 48 and is positively frictionally charged between the supply roller 48 and the developing roller 47. Further, the developing roller 47 supplies the toner as a uniform thin layer onto the photosensitive drum 42 to develop the electrostatic latent image, thereby forming a toner image on the photosensitive drum 42.

  Each transfer roller 33 is disposed at a position where the belt 34 is sandwiched between each transfer drum 33. Each transfer roller 33 receives a toner image formed on the photosensitive drum 42 by applying a transfer bias TRCC having a polarity opposite to the toner charging polarity (here, negative polarity) to the photosensitive drum 42. Transfer to the sheet 15. Thereafter, the sheet 15 is conveyed to the fixing unit 4 by the belt unit 30, and the toner image is thermally fixed by the fixing unit 4 and discharged onto the upper surface of the printer 1.

  A drum cleaning mechanism including the drum cleaner roller 44 and the paper dust removing roller 45 sucks and removes deposits (toner and paper dust) on the photosensitive drum 42 by electrostatic force. Here, the paper dust removing roller 45 is provided only in the process unit 40K, for example.

  A belt cleaning unit (an example of a “detachable unit”) 20 is provided below the belt unit 30 (see FIG. 2) and is detachably mounted on a predetermined mounting portion (not shown). The belt cleaning unit 20 includes a belt cleaning roller 21, a deposit collection roller 22, and a collection box 23, and collects deposits (mainly toner remaining on the belt 34) on the belt 34.

2. Configuration of High Voltage Power Supply Device Next, an electrical configuration related to the present invention of the printer 1 will be described with reference to FIG. FIG. 3 shows a schematic block diagram of the high-voltage power supply device 50 mounted on the high-voltage power supply substrate (an example of “power supply substrate”) 8 and a connection configuration related to the high-voltage power supply device 50. Note that the high-voltage power supply device 50 includes voltage generation circuits corresponding to the process units 40Y, 40M, 40C, and 40K, but the configuration corresponding to each process unit is substantially the same. Only the voltage generation circuit associated with 40K is shown.

  The high-voltage power supply device 50 includes a CPU 60, a plurality of voltage generation circuits connected to the CPU 60, a motor drive circuit 58, a ROM 61, and a RAM 62. The CPU 60 controls the entire printer in addition to controlling the voltage generation circuit. The ROM 61 stores an operation program for the entire printer, and the RAM 62 stores image data used for printing processing.

  For example, as shown in FIG. 3, the plurality of voltage generation circuits include a charging voltage generation circuit 51, a paper dust removal bias / drum cleaner bias generation circuit 52, a transfer bias generation circuit 53, a development bias generation circuit 54, and a supply roller bias. A generation circuit 55, a belt cleaner bias generation circuit 56, and a deposit recovery bias generation circuit 57 are included.

  The charging voltage generation circuit 51 includes a mold type transformer 90, and generates a charging voltage CHG applied to the discharge wire 41A of the charger 41 and a grid voltage GRID applied to the grid 41B of the charger 41. Here, the charging voltage CHG is, for example, 5.5 kV to 8 kV (positive polarity), and the grid voltage GRID is, for example, about 700 V (positive polarity). Here, the grid voltage GRID is generated by, for example, a discharge current during discharge between the discharge wire 41 </ b> A and the grid 41 </ b> B and a grid resistance provided in the charging voltage generation circuit 51. The mold type transformer 90 is molded with an insulating resin except for electrode portions such as the output electrode 93 (see FIG. 4).

  The charging voltage generation circuit 51 generates the charging voltage CHG in accordance with, for example, a PWM signal from the PWM1 port of the CPU 60, and the charging voltage CHG is feedback controlled via the A / D1 port.

  The paper dust removal bias / drum cleaner bias generation circuit 52 generates a paper dust removal bias DCLNB to be applied to the paper dust removal roller 45 and a drum cleaner bias DCLNA to be applied to the drum cleaner roller 44. Here, the paper dust removal bias DCLNB is, for example, about −300 V (negative polarity) during toner suction, and is, for example, about 700 V (positive polarity) during toner discharge / paper dust suction.

  The drum cleaner bias DCLNA is, for example, about −400 V (negative polarity) at the time of toner suction, and is about 600 V (positive polarity) at the time of toner discharge / paper powder suction. In this embodiment, the paper dust removal bias / drum cleaner bias generation circuit 52 generates a paper dust removal bias DCLNB in accordance with the PWM signal from the PWM2 port of the CPU 60, and the drum cleaner bias DCLNA is based on the paper dust removal bias DCLNB. Is generated. The paper dust removal bias DCLNB is feedback controlled via the A / D2 port. The drum cleaner bias DCLNA and the paper dust removal bias DCLNB may be individually generated by individual voltage generation circuits.

  The transfer bias generation circuit 53 generates a transfer bias (an example of “voltage”) TRCC applied to the transfer roller 33. Here, the transfer bias TRCC is, for example, about −7 kV (negative polarity). The transfer bias generation circuit 53 generates a transfer bias TRCC in accordance with, for example, a PWM signal from the PWM3 port of the CPU 60, and the transfer bias TRCC is feedback controlled via the A / D3 port.

  The development bias generation circuit 54 generates a development bias DEV to be applied to the development roller 47. Here, the developing bias DEV is, for example, about 400 to 550 V (positive polarity). For example, the development bias generation circuit 54 generates a development bias DEV in accordance with a PWM signal from the PWM4 port of the CPU 60, and the development bias DEV is feedback-controlled through the A / D4 port.

  The supply roller bias generation circuit 55 generates a supply roller bias (an example of “voltage”) SR to be applied to the supply roller 48. Here, the supply roller bias SR is, for example, about 500 to 650 V (positive polarity). The supply roller bias generation circuit 55 generates the supply roller bias SR according to, for example, a PWM signal from the PWM5 port of the CPU 60, and the supply roller bias SR is feedback controlled via the A / D5 port.

  The belt cleaner bias generation circuit 56 generates a belt cleaner bias BCLNA to be applied to the belt cleaner roller 21. Here, the belt cleaner bias BCLNA is, for example, about −1200 V (negative polarity). The belt cleaner bias generation circuit 56 generates a belt cleaner bias BCLNA according to, for example, a PWM signal from the PWM6 port of the CPU 60, and the belt cleaner bias BCLNA is feedback-controlled through the A / D6 port.

  The deposit collection bias generation circuit 57 generates a deposit collection bias BCLNB to be applied to the deposit collection roller 22. Here, the deposit recovery bias BCLNB is, for example, about −1600 V (negative polarity). For example, the deposit collection bias generation circuit 57 generates the deposit collection bias BCLNB according to a PWM signal from the PWM7 port of the CPU 60, and the deposit collection bias BCLNB is feedback-controlled through the A / D7 port.

  The motor drive circuit 58 drives the main motor 14 according to the control of the CPU 60. Each roller is controlled to rotate in accordance with the rotation control of the main motor 14.

  Next, with reference to FIG. 4 and FIG. 5, for example, a molded transformer 90 included in the charging voltage generation circuit 51 will be described. As shown in FIG. 4, the molded transformer 90 includes primary side terminals 91, 92b, 92c, 95, a transformer T1, a rectifier diode D1, a smoothing capacitor C1, resistors R1, R2, an output electrode 93, a secondary side ground. The terminal 94, the insulating resin part 120, etc. are included. These are molded with a flame retardant resin 110 (see FIG. 5). The configuration of the molded transformer 90 is not limited to this. For example, an oscillation FET (field effect transistor) connected to the primary side of the transformer T1 may be included in the molded transformer 90. Here, the mold type transformer 90 is an example of an “electric part” and a “mold type electric part”. Further, the transformer T1, the rectifier diode D1, the smoothing capacitor C1, and the resistors R1 and R2 are examples of individual electric components. The electrical component and the molded electrical component are not limited to the molded transformer.

  The output electrode 93 is an output electrode electrically connected to one P1 of a pair of secondary output terminals (P1, P2: examples of output terminals) of the transformer T1, and is opposite to the surface facing the frame 6A. It has a plate-like shape having a connection surface 93A, which is a surface located on the side, and is parallel to the surface of the high-voltage power supply substrate 8 from the side surface orthogonal to the mounting surface 90A in contact with the high-voltage power supply substrate 8 in the molded transformer 90. Extending in any direction. The output electrode 93 is formed with a screw hole 93 </ b> H for coupling the screw 80.

  The mold type transformer 90 is mounted on the high voltage power supply substrate 8 so that the output electrode protrudes from the edge of the high voltage power supply substrate 8 in a direction parallel to the surface of the high voltage power supply substrate 8 (see FIG. 5). Further, the output electrode 93 is formed on the side surface of the molded transformer 90 at a position closer to the mounting surface 90A than the surface 90B positioned on the opposite side of the mounting surface 90A of the molded transformer 90 (FIG. 5). reference). As a result, by increasing the distance between the output electrode 93 and the frame 6A, it becomes easy to balance the reduction in thickness between the high-voltage power supply substrate 8 and the frame 6A and the connection reliability of the connection electrode 70. In other words, it is easy to ensure connection reliability while reducing the thickness between the high-voltage power supply substrate 8 and the frame 6A.

  The insulating resin portion 120 insulates the output electrode 93 with the insulating resin 100. At that time, the insulating resin portion 120 exposes the connection surface 93 </ b> A of the output electrode 93 and covers the output electrode 93 in order to enable connection to the outside of the output electrode 93.

3. Connection Configuration Between Detachable Unit and High-Voltage Power Supply Board Next, with reference to FIGS. 5 to 13, a connection configuration between the detachable unit and the high-voltage power supply board 8 will be described using the process unit 40K as an example. Specifically, a connection configuration between the input electrode Pin1 of the charger 41 of the process unit 40K (an example of a detachable unit) and the mold type transformer 90 of the charging voltage generation circuit 51 mounted on the high-voltage power supply substrate 8 will be described. Since the same applies to the other process units 40Y, 40M, and 40C, the description thereof is omitted.

  As shown in FIG. 5, the connection electrode 70 is used when connecting the input electrode Pin <b> 1 of the charger 41 of the process unit 40 </ b> K and the output electrode 93 of the molded transformer 90 of the charging voltage generation circuit 51. .

  As shown in FIG. 5, the connection electrode 70 is connected to the output electrode 93 and the input electrode Pin <b> 1, and a vertical portion 71 extending substantially perpendicular to the connection surface 93 </ b> A of the output electrode 93 and the connection surface 93 </ b> A. The vertical portion 71 and the parallel portion 72 are integrally formed. Note that the vertical portion 71 and the parallel portion 72 are not limited to being integrally formed, and the vertical portion 71 and the parallel portion 72 may be formed separately and then combined.

  In the present embodiment, as shown in FIG. 5, the connection electrode is constituted by a coil spring 70, and the parallel portion 72 is an extension 72 formed so that one end of the coil spring 70 extends to the connection surface 93 </ b> A of the output electrode 93. The vertical portion 71 is constituted by the remaining portion 71 of the coil spring. Here, as shown in FIG. 7, the extension portion 72 is configured by a deformed portion 72 in which one end of the coil spring 70 is deformed so as to extend to the connection surface 93 </ b> A of the output electrode 93. Therefore, the connection electrode having the parallel portion 72 and the vertical portion 71 can be easily configured using the coil spring 70.

  Further, the distal end portion of the extension portion 72 of the coil spring 70 is fixed to the connection surface 93 </ b> A of the output electrode 93 with a screw 80. Therefore, the reliability of the electrical connection between the coil spring 70 and the output electrode 93 is improved by screwing.

  In addition, the printer 1 includes a cover 9 that covers the high-voltage power supply substrate 8 from the side opposite to the substrate surface on which the molded transformer 90 is mounted, and when the process unit 40K is attached to the cover 9. A support member for supporting the coil spring 70 is provided. The support member is configured by a rib 9A that comes into contact with the vertical portion 71 of the coil spring 70 from the cover side.

  Therefore, when the process unit 40K is mounted, the rib 9A can suppress the fluctuation of the coil spring 70 and can impart the elastic force (restoring force) of the coil spring 70 to the detachable unit. Thereby, the reliability of the coil spring 70 as the connection electrode can be improved. In other words, when the coil spring 70 connects the output electrode 93 and the input electrode Pin1, the vertical portion 71 of the coil spring 70 can be pressed by the rib 9A. Thereby, the vertical portion 71 of the coil spring 70 can be fixed, and the stability of the electrical connection by the coil spring 70 can be ensured.

3-1. Method for Attaching Coil Spring (Connection Electrode) Next, a method for attaching the coil spring 70 will be described with reference to FIGS.

  First, as shown in FIG. 6, the high-voltage power supply substrate 8 is attached to the frame 6A from the side opposite to the side on which the process unit 40K is mounted. For example, as shown in FIG. 6, the high-voltage power supply substrate 8 is attached to a plurality of substrate attachment pillars 6 </ b> C provided on the frame 6 </ b> A by using predetermined screws 81. Stop (an example of the board mounting process). Then, one end of the coil spring 70 is erected to form a contact portion 73 that contacts the input electrode Pin1 of the process unit 40K, and a connection electrode formed by extending the other end of the coil spring 70 is formed on the frame 6A. Fit into the fitting part 7.

  Next, as shown in FIG. 7, the other end of the coil spring 70 that is stretched is bent to form a parallel portion (extension portion and deformation portion) 72 (an example of a forming step). Next, as shown in FIG. 8, the distal end portion of the extension 72 of the coil spring 70 is screwed to the connection surface 93 </ b> A of the output electrode 93 with a screw 80 (an example of a screwing process). Next, as shown in FIG. 10, ribs 9A are provided on the cover 9 (an example of an installation process), and the cover 9 provided with the ribs 9A is attached to the frame 6A using screws or the like. Thereby, as shown in FIG. 5, one end of the vertical portion 71 of the coil spring 70 abuts on the rib 9A.

  The coil spring 70 may be formed from the beginning in a form having a vertical portion 71 and a parallel portion 72 as shown in FIG. In this case, the attaching step shown in FIGS. 6 and 7 is omitted.

  Further, as a rib 9A support member, a plate that is fixed to the connection surface 93A of the output electrode 93 by a screw 80 together with the tip of the deformed portion 72 of the coil spring 70, as shown in FIG. 10, instead of the rib 9A. A shaped pressing member 85 may be used. The presser member 85 has a shape extending along the deformed portion 72 to the vertical portion 71 of the coil spring in a screwed state. In this case, the support member can be formed with a simple configuration.

  Further, the contact portion that contacts the input electrode Pin1 of the process unit 40K may be configured by a contact portion 73A that is separate from the coil spring 70, as shown in FIG.

  Further, when the connection electrode is constituted by a spring, the connection electrode is not limited to the coil spring 70, and may be constituted by a plate spring 70A as shown in FIGS. The extension 72A is formed by deforming one end of the leaf spring 70A so as to extend to the connection surface 93A of the output electrode 93, and the vertical portion 71A is constituted by the remaining portion of the leaf spring 70A. The vertical portion 71A is formed thicker than the extension 72A in order to give elasticity. Thus, by forming the spring with the leaf spring 70A, a connection electrode having a parallel portion and a vertical portion can be easily configured.

  The other end of the leaf spring 70A is formed to have a folded portion 73B that is folded with a predetermined radius of curvature, and the tip of the folded portion 73B comes into contact with the input electrode Pin1 and is electrically connected. Connect to. In this case, when connecting to the input electrode Pin1, the connection can be made smooth, and an elastic force is easily generated in the leaf spring 70A, so that the connection reliability is improved.

4). Effect of Embodiment 1 The high voltage power supply board when the high voltage power supply board 8 is attached to the frame 6A by connecting the parallel portions (72, 72A) of the springs (70, 70A) and the connection surface 93A of the output electrode 93. The distance between the frame 8 and the frame 6A can be narrowed by using a single connection electrode. Therefore, the compactness of the printer 1 (electronic device) in which the molded transformer 90 is incorporated can be realized with a small number of connection members.

  Moreover, the connection electrode which has a parallel part and a perpendicular | vertical part can be simply comprised using a spring (70,70A).

<Embodiment 2>
Next, Embodiment 2 will be described with reference to FIGS. The first embodiment is different from the first embodiment only in the configuration related to the connection electrode that electrically connects the output electrode 93 of the molded transformer 90 and the input electrode Pin1 of the process unit 40K. Therefore, only the differences will be described. That is, in the first embodiment, an example in which the connection electrode is configured by a spring has been shown, but in the second embodiment, an example in which the connection electrode is configured by other than a spring is illustrated.

Example 1
The connection electrode of Example 1 shown in FIG. 14 is configured by a fixing hook 70B that fixes the high-voltage power supply substrate 8 to the frame 6A. Here, the fixing hook 70B is formed of a conductor and serves as both a hook and an electrode contact.

  The fixing hook 70B is formed so as to extend to the connection surface 93A of the output electrode 93, and a tip portion thereof comes into contact with the connection surface 93A and functions as an electrode contact, and is perpendicular to the hook portion 72. And a support column 71 formed as described above. The hook part 72 constitutes a parallel part, and the column part 71 constitutes a vertical part.

  As shown in FIG. 15, the fixing hook 70 </ b> B acts as a hook when the high voltage power supply substrate 8 is attached to the frame 6 </ b> A using screws 81 (see FIG. 6). In other words, the output electrode 93 of the mold type transformer 90 is first hooked and fixed to the fixing hook 70B.

  Further, as an action as an electrode contact, as shown in FIG. 14, the fixing hook 70 </ b> B is configured so that the parallel portion 72 </ b> B of the fixing hook 70 </ b> B becomes the output electrode 93 after the high-voltage power supply substrate 8 is attached to the frame 6 </ b> A. The vertical portion 71B of the fixing hook 70B has an action of connecting to the input electrode Pin1 via the contact portion 73B that contacts the input electrode Pin1.

  In this case, since the fixing hook 70B also serves as an electrode contact, the work for attaching the connection electrode and the high-voltage power supply substrate 8 to the frame 6A is simplified. In order to improve the contact between the parallel portion 72B of the fixing hook 70B and the output electrode 93, a protrusion 74 may be provided on the parallel portion 72B as shown in FIG.

(Example 2)
The connection electrodes may be those shown in FIGS. 17 and 18. That is, as shown in FIG. 18, the connection electrode 70 </ b> C of the second embodiment may be one in which the vertical portion 71 </ b> C, the parallel portion 72 </ b> C, and the contact portion 73 </ b> C are integrally formed with a conductor. In this case, as shown in FIG. 17, the parallel portion 72 </ b> C is held by the screw 80 with the spring 83 interposed therebetween. The parallel portion 72 </ b> C is electrically connected to the output electrode 93 via the spring 83 and the screw 80. In this case, the elasticity when the process unit 40K is mounted on the frame 6A is held by the spring 83.

<Other embodiments>
The present invention is not limited to the embodiments described with reference to the above description and drawings. For example, the following embodiments are also included in the technical scope of the present invention.

  (1) In each of the above embodiments, the mold type transformer 90 of the charging voltage generation circuit 51 has been described as an example. However, the present invention is not limited to this. The transformer included in each bias generation circuit (52-57) shown in FIG. 3 can also be a molded transformer having the same configuration as the molded transformer 90.

  (2) In each of the above embodiments, using the connection electrode 70, the output electrode 93 of the molded transformer 90 included in the high-voltage power supply device 50 mounted on the high-voltage power supply substrate 8 and the input electrode of the corresponding process unit 40K. Although the example which connects Pin1 was shown, it is not restricted to this. The present invention can be applied to electrical connection between an output electrode of an arbitrary electrical component provided on a power supply board and an arbitrary input electrode provided on a detachable unit.

  (3) In each of the above embodiments, the present invention is an electronic device including a frame body on which the detachable unit is mounted, and a power supply board that is mounted on the opposite side of the frame body from the side on which the detachable unit is mounted. Although the example applied to an image forming apparatus as an apparatus has been shown, the present invention is not limited to this. The present invention can be applied to, for example, a personal computer, a server, and the like as an electronic device including such a frame and a power supply board.

DESCRIPTION OF SYMBOLS 1 ... Printer, 6A, 6B ... Frame, 8 ... High voltage power supply board, 9 ... Cover, 9A ... Rib, 40 ... Process unit, 93A ... Connection surface, 70 ... Coil spring, 71 ... Vertical part, 72 ... Parallel part, 80 ... Screws, 90 ... Mold type transformer, 93 ... Output electrode, 120 ... Insulating resin part

Claims (16)

A detachable unit having an input electrode and a removable unit,
A power supply board attached to the opposite side of the frame body from the side on which the detachable unit is mounted;
An electrical component mounted on the power supply board and having an output terminal, having a connection surface that is electrically connected to the output terminal and located on the opposite side of the surface facing the frame, An electrical component including an output electrode extending in a direction parallel to the surface of the power supply board from a side surface orthogonal to a mounting surface in contact with the power supply board in the electrical component;
A connection electrode that electrically connects the output electrode of the electrical component and the input electrode of the detachable unit, and is connected to the connection surface of the output electrode in a connected state with the output electrode and the input electrode. A connection electrode having a vertical portion extending substantially perpendicular to the connection portion and a parallel portion extending substantially parallel to the connection surface;
With electronic equipment. The electronic device according to claim 1,
The connection electrode is constituted by a spring,
The parallel portion is configured by an extension formed so that one end of the spring extends to the connection surface of the output electrode,
The electronic device, wherein the vertical portion is constituted by a remaining portion of the spring. The electronic device according to claim 2,
The electronic device, wherein a distal end portion of the extension portion of the spring is fixed to the connection surface of the output electrode by a screw. The electronic device according to claim 3,
The spring is a coil spring;
The extension portion is configured by a deformed portion that is deformed so that one end of the coil spring extends to the connection surface of the output electrode,
The electronic device, wherein the vertical portion is constituted by a remaining portion of the coil spring. The electronic device according to claim 4,
An electronic apparatus comprising a support member that supports the coil spring when the detachable unit is mounted. The electronic device according to claim 5,
A cover for covering the power supply board from the side opposite to the board surface on which the electrical component is mounted;
The electronic device, wherein the support member is provided on the cover, and is configured by a rib that contacts a vertical portion of the coil spring from the cover side. The electronic device according to claim 5,
The support member is configured by a plate-like pressing member that is fastened by the screw to the connection surface of the output electrode together with the distal end portion of the deformation portion of the coil spring.
The electronic device, wherein the pressing member has a shape extending along the deformation portion to the vertical portion of the coil spring in a state where the pressing member is screwed. The electronic device according to claim 3,
The spring is a leaf spring;
The extension portion is formed by deforming one end portion of the leaf spring to extend to the connection surface of the output electrode,
The vertical part is an electronic device constituted by the remaining part of the leaf spring. The electronic device according to claim 8,
The other end portion of the leaf spring is formed with a folded portion that is folded with a predetermined radius of curvature, and the tip portion of the folded portion is connected to the input electrode. The electronic device according to claim 1,
The connection electrode also serves as an electrode contact and is configured by a fixing hook that fixes the power supply substrate to the frame.
The fixing hook is
A hook portion that is formed so as to extend to the connection surface of the output electrode, the tip portion of which contacts the connection surface and functions as the electrode contact;
A strut portion formed to form a right angle to the hook portion,
The electronic device, wherein the hook portion constitutes the parallel portion, and the strut portion constitutes the vertical portion. The electronic device according to any one of claims 1 to 10,
The electrical component is mounted on the power supply board such that the output electrode protrudes from the edge of the power supply board in a direction parallel to the surface of the power supply board,
The output electrode is an electronic device formed on a side surface of the electrical component at a position closer to the mounting surface than a surface of the electrical component opposite to the mounting surface. The electronic device according to any one of claims 1 to 11,
An electronic apparatus in which the vertical portion and the parallel portion of the connection electrode are integrally formed. The electronic device according to any one of claims 1 to 12,
The electrical component includes at least one individual electrical component, and is a molded electrical component molded with an insulating resin,
The molded electrical component includes an insulating resin portion that exposes the connection surface of the output electrode and covers the output electrode. The electronic device according to any one of claims 1 to 13,
The electronic device is an image forming apparatus,
The detachable unit is a detachable unit used for forming an image on a recording medium,
The power supply substrate is a high-voltage power supply substrate that generates a high voltage used for image formation,
The electrical component is an electronic device including a transformer having the output terminal. A connection for connecting the input electrode and the output electrode in an electronic device including an input electrode having a detachable detachable unit and a power source board on which an electrical component having an output electrode is mounted. A method of attaching an electrode to the output electrode,
In the connection state between the output electrode and the input electrode, the connection electrode having a vertical portion extending substantially perpendicular to the connection surface of the output electrode and a parallel portion extending substantially parallel to the connection surface; A forming process formed by a spring;
A board mounting step of attaching a power supply board to the opposite side of the frame body from the side on which the detachable unit is mounted;
A screwing step of attaching the parallel part of the connection electrode to the output electrode of the electrical component with a screw in a state where the vertical part of the connection electrode is electrically connectable to the input electrode;
A method for attaching a connection electrode, comprising: In the attachment method of the connection electrode according to 15 above,
The connection electrode is constituted by a coil spring,
A connection electrode mounting method, further comprising an installation step of installing a support member that supports the coil spring when the detachable unit is mounted on the frame.

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