JP2015138767A5 - - Google Patents

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Publication number
JP2015138767A5
JP2015138767A5 JP2014011808A JP2014011808A JP2015138767A5 JP 2015138767 A5 JP2015138767 A5 JP 2015138767A5 JP 2014011808 A JP2014011808 A JP 2014011808A JP 2014011808 A JP2014011808 A JP 2014011808A JP 2015138767 A5 JP2015138767 A5 JP 2015138767A5
Authority
JP
Japan
Prior art keywords
electrodes
insulating substrate
substrate opposite
back surface
heating element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2014011808A
Other languages
Japanese (ja)
Other versions
JP6254859B2 (en
JP2015138767A (en
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP2014011808A external-priority patent/JP6254859B2/en
Priority to JP2014011808A priority Critical patent/JP6254859B2/en
Priority to CN201580005454.0A priority patent/CN106415770B/en
Priority to TW104102497A priority patent/TWI656554B/en
Priority to KR1020167018858A priority patent/KR102263795B1/en
Priority to PCT/JP2015/051774 priority patent/WO2015111683A1/en
Publication of JP2015138767A publication Critical patent/JP2015138767A/en
Publication of JP2015138767A5 publication Critical patent/JP2015138767A5/ja
Publication of JP6254859B2 publication Critical patent/JP6254859B2/en
Application granted granted Critical
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Claims (1)

上記発熱体は、上記絶縁基板の上記第１〜第３の電極が形成されている表面と反対側の裏面に形成されている請求項１〜９のいずれか１項に記載の遮断素子。 The interruption element according to any one of claims 1 to 9, wherein the heating element is formed on a back surface of the insulating substrate opposite to a surface on which the first to third electrodes are formed.
JP2014011808A 2014-01-24 2014-01-24 Breaking element, breaking element circuit, Active JP6254859B2 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2014011808A JP6254859B2 (en) 2014-01-24 2014-01-24 Breaking element, breaking element circuit,
PCT/JP2015/051774 WO2015111683A1 (en) 2014-01-24 2015-01-23 Interrupting element and interrupting-element circuit
TW104102497A TWI656554B (en) 2014-01-24 2015-01-23 Blocking element and blocking element circuit
KR1020167018858A KR102263795B1 (en) 2014-01-24 2015-01-23 Interrupting element and interrupting-element circuit
CN201580005454.0A CN106415770B (en) 2014-01-24 2015-01-23 Cutting member and cutting member circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014011808A JP6254859B2 (en) 2014-01-24 2014-01-24 Breaking element, breaking element circuit,

Publications (3)

Publication Number Publication Date
JP2015138767A JP2015138767A (en) 2015-07-30
JP2015138767A5 true JP2015138767A5 (en) 2016-05-26
JP6254859B2 JP6254859B2 (en) 2017-12-27

Family

ID=53681481

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014011808A Active JP6254859B2 (en) 2014-01-24 2014-01-24 Breaking element, breaking element circuit,

Country Status (5)

Country Link
JP (1) JP6254859B2 (en)
KR (1) KR102263795B1 (en)
CN (1) CN106415770B (en)
TW (1) TWI656554B (en)
WO (1) WO2015111683A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6797565B2 (en) * 2015-12-18 2020-12-09 デクセリアルズ株式会社 Fuse element
JP7040886B2 (en) * 2016-07-26 2022-03-23 ショット日本株式会社 Protective element
JP6811590B2 (en) * 2016-11-10 2021-01-13 デクセリアルズ株式会社 Protective element
JP7477958B2 (en) * 2019-10-30 2024-05-02 デクセリアルズ株式会社 Protection elements and circuits

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10261353A (en) * 1997-03-18 1998-09-29 Uchihashi Estec Co Ltd Resistance/temperature fuse
JP4203190B2 (en) * 1999-08-31 2008-12-24 大東通信機株式会社 Fuse device
JP2001325868A (en) * 2000-05-17 2001-11-22 Sony Chem Corp Protective element
JP2004363630A (en) * 2004-08-30 2004-12-24 Sony Chem Corp Packaging method of protective element
JP2008311161A (en) * 2007-06-18 2008-12-25 Sony Chemical & Information Device Corp Protective element
JP5117917B2 (en) * 2008-04-21 2013-01-16 デクセリアルズ株式会社 Protective element and manufacturing method thereof
JP5072796B2 (en) * 2008-05-23 2012-11-14 ソニーケミカル＆インフォメーションデバイス株式会社 Protection element and secondary battery device
JP5301298B2 (en) * 2009-01-21 2013-09-25 デクセリアルズ株式会社 Protective element
JP6249600B2 (en) * 2012-03-29 2017-12-20 デクセリアルズ株式会社 Protective element

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