JP2015130350A - plasma processing apparatus and plasma processing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To accurately control, in diversified manners, plasma density distribution in doughnut-shaped plasma generated in a chamber during an induction coupling type plasma process, and further the plasma density distribution on a substrate.SOLUTION: In an induction coupling type plasma processing apparatus, an RF antenna 54 provided on a dielectric window 52 is divided into an inside coil 58, an intermediate coil 60, and an outside coil 62, along a radial direction. In a case where circulation is made from a high frequency power source 72 to a ground potential member through an RF feeding line 68, RF antenna 54, and an earth line 70, or more specifically, in a case where circulation is made from a first node Nto a second node Nthrough a high frequency branch transmission path of each coil, counterclockwise circulation is made at the inside coil 58 and the outside coil 62, however, clockwise circulation is made at the intermediate coil 60. Variable intermediate and outside capacitors 86 and 88 are electrically connected in series, respectively, to the intermediate and outside coils 60 and 62, between the first and second nodes Nand N.

Description

  The present invention relates to a technique for performing plasma processing on a substrate to be processed, and particularly to an inductively coupled plasma processing apparatus and a plasma processing method.

  In processes such as etching, deposition, oxidation, sputtering and the like in the manufacturing process of semiconductor devices and FPDs (Flat Panel Displays), plasma is often used in order to cause a favorable reaction to a processing gas at a relatively low temperature. Conventionally, plasma of high frequency discharge in the MHz region is often used for this type of plasma processing. Plasma by high frequency discharge is roughly classified into capacitively coupled plasma and inductively coupled plasma as more specific (device-like) plasma generation methods.

  In general, an inductively coupled plasma processing apparatus is configured such that at least a part (for example, a ceiling) of a wall of a processing container is formed of a dielectric window, and a high frequency power is applied to a coil-shaped RF antenna provided outside the dielectric window. Supply. The processing container is configured as a vacuum chamber that can be depressurized, and a processing space is set between the dielectric window and the substrate in which a substrate to be processed (for example, a semiconductor wafer, a glass substrate, etc.) is disposed in the center of the chamber. A processing gas is introduced into the system. The high-frequency current flowing through the RF antenna generates a high-frequency AC magnetic field around the RF antenna so that the magnetic lines of force pass through the dielectric window and pass through the processing space in the chamber. An induced electric field is generated in the azimuth direction in the processing space. Then, the electrons accelerated in the azimuth direction by the induced electric field cause ionization collision with the molecules and atoms of the processing gas, and a donut-shaped plasma is generated.

  By providing a large processing space in the chamber, the doughnut-shaped plasma is efficiently diffused in all directions (particularly in the radial direction), and the density of the plasma is fairly uniform on the substrate. However, using only a normal RF antenna, the plasma density uniformity obtained on the substrate is insufficient for most plasma processes. In the plasma process, improving the uniformity or controllability of the plasma density on the substrate is one of the most important issues because it affects the uniformity and reproducibility of the process and, in turn, the manufacturing yield.

  In the inductively coupled plasma processing apparatus, the plasma density distribution characteristic (profile) in the donut-shaped plasma generated near the dielectric window in the chamber is important, and the core plasma density distribution profile is It affects the characteristics (particularly uniformity) of the plasma density distribution obtained on the substrate.

  In this regard, several methods for dividing the RF antenna into a plurality of annular coils having different coil diameters have been proposed as techniques for improving the uniformity of the plasma density distribution in the radial direction. This type of RF antenna division method includes a first method in which a plurality of annular coils are connected in series (for example, Patent Document 1) and a second method in which a plurality of annular coils are connected in parallel (for example, Patent Documents). 2).

US Pat. No. 5,800,609 US Pat. No. 6,164,241

  Among the conventional RF antenna division methods as described above, in the first method, since the total coil length of the RF antenna is a large length obtained by adding all the coils, the voltage drop in the RF antenna cannot be ignored. Further, a standing wave having a current nodal portion is likely to be formed near the RF input end of the RF antenna due to the wavelength effect. For this reason, the first method is difficult to obtain a uniform plasma density distribution not only in the radial direction but also in the circumferential direction, and is not suitable for a plasma process that requires a large-diameter plasma.

  On the other hand, in the second method, the RF current supplied to the RF antenna from the high-frequency power feeding portion flows relatively much in the inner coil having a small coil diameter (that is, having a small impedance) in the RF antenna. The outer coil with a large (that is, with a large impedance) flows relatively little, and the density of the plasma generated in the chamber tends to be high at the center in the radial direction and low at the periphery. Therefore, in the second method, a variable capacitor for adjusting impedance is added (connected) to each coil in the RF antenna to adjust the ratio of the RF current flowing through each coil. However, the variable range of the RF current ratio has a limit. For this reason, it has been difficult to precisely control the plasma density distribution in the vicinity of the substrate on the substrate holder.

  The present invention solves the problems of the prior art as described above, and it is possible to finely control the plasma density distribution in the doughnut-shaped plasma, and thereby, in the vicinity of the substrate on the substrate holder. Provided are an inductively coupled plasma processing apparatus and a plasma processing method capable of finely controlling a plasma density distribution.

  A plasma processing apparatus according to a first aspect of the present invention includes a processing container having a dielectric window, a substrate holding unit for holding a substrate to be processed in the processing container, and performing a desired plasma process on the substrate. A processing gas supply unit for supplying a desired processing gas into the processing container; and an RF antenna provided outside the dielectric window for generating plasma of the processing gas by inductive coupling in the processing container; A high-frequency power supply unit that supplies high-frequency power having a frequency suitable for high-frequency discharge of the processing gas to the RF antenna, and the RF antennas are disposed relatively radially inward and outwardly with a gap in the radial direction. An inner coil and an outer coil electrically connected in parallel between the first and second nodes provided in the high-frequency transmission line of the high-frequency power feeding unit, When each high-frequency branch transmission line is rotated to the second node with a single stroke, the direction when passing through the inner coil and the direction when passing through the outer coil are reversed in the circulation direction, and the first A first capacitor that is electrically connected in series with either the inner coil or the outer coil is provided between the second node and the second node.

  In the plasma processing apparatus according to the first aspect, when high-frequency power is supplied to the RF antenna from the high-frequency power feeding unit, an RF magnetic field is generated around each coil by the high-frequency current flowing through each part of the RF antenna, that is, the inner coil and the outer coil. Then, an induction electric field is formed in the processing container for high-frequency discharge of processing gas, that is, generation of donut-shaped plasma. In this plasma processing apparatus, the inner coil and the outer coil are connected in opposite directions to the high-frequency power feeding unit, and the combined impedance, particularly reactance, of the first capacitor and the coil electrically connected in series with the first capacitor is adjusted. As a result, the direction and magnitude of the current in the coil are controlled, and consequently the plasma density distribution in the donut-shaped plasma is controlled. In particular, it is possible to control the current flowing through the coil connected in series with the first capacitor to a sufficiently small amount of current in the same direction as the current flowing through the other coil, whereby the plasma density distribution in the donut-shaped plasma. As a result, the plasma density distribution on the substrate can be precisely controlled.

  A plasma processing apparatus according to a second aspect of the present invention includes a processing container having a dielectric window, a substrate holding unit for holding a substrate to be processed in the processing container, and performing a desired plasma process on the substrate. A processing gas supply unit for supplying a desired processing gas into the processing container; and an RF antenna provided outside the dielectric window for generating plasma of the processing gas by inductive coupling in the processing container; A high-frequency power feeding unit that supplies high-frequency power having a frequency suitable for high-frequency discharge of the processing gas to the RF antenna, and the RF antenna is relatively radially inwardly, intermediately and outwardly spaced apart from each other. An inner coil, an intermediate coil, and an outer coil that are arranged and electrically connected in parallel between the first and second nodes provided in the high-frequency transmission path of the high-frequency power feeding unit; When each high-frequency branch transmission path is drawn with a single stroke from the first node to the second node, the direction when passing through the intermediate coil is the direction when passing through the inner coil and the outer coil, respectively. A first capacitor connected in series with the intermediate coil is provided between the first node and the second node.

  Further, the plasma processing method of the present invention includes a processing container having a dielectric window, a substrate holding part for holding a substrate to be processed in the processing container, and the processing for performing a desired plasma processing on the substrate. A processing gas supply unit for supplying a desired processing gas into the container; an RF antenna provided outside the dielectric window for generating plasma of the processing gas by inductive coupling in the processing container; and the processing gas A plasma processing method for performing desired plasma processing on the substrate in a plasma processing apparatus having a high-frequency power supply unit that supplies high-frequency power having a frequency suitable for high-frequency discharge to the RF antenna, wherein the RF antenna is Between the first and second nodes provided in the high-frequency transmission path of the high-frequency power feeding section, which are relatively disposed on the inner side, the middle side and the outer side, respectively. The intermediate coil is divided into an inner coil, an intermediate coil, and an outer coil that are electrically connected in parallel, and when each high-frequency branch transmission path is rotated from the first node to the second node with a single stroke, The inner coil, the intermediate coil, and the outer coil are connected so that the direction when passing through the inner coil and the outer coil is opposite to the direction when passing through the inner coil and the outer coil, respectively, and the first node A first variable capacitor electrically connected in series with the intermediate coil is provided between the second node, and a capacitance of the first variable capacitor is selected or variably controlled, and the substrate Control the upper plasma density distribution.

  In the plasma processing apparatus or the plasma processing method according to the second aspect, when high-frequency power is supplied from the high-frequency power feeding unit to the RF antenna, each part of the RF antenna, that is, the inner coil, the intermediate coil, and the outer coil, An RF magnetic field is generated around the coil, and an induction electric field for generating high-frequency discharge of processing gas, that is, generation of donut-shaped plasma, is formed in the processing container. In this plasma processing apparatus, the inner coil and the outer coil are connected in the forward direction with respect to the high-frequency power feeding unit, and the intermediate coil is connected in the reverse direction, thereby adjusting the combined impedance of the intermediate coil and the first capacitor, particularly the reactance. Thus, the direction and magnitude of the current in the coil can be controlled, and consequently the plasma density distribution in the donut-shaped plasma can be controlled in a variety of ways. In particular, it is possible to control the current flowing through the intermediate coil to a sufficiently small current amount in the same direction as the current flowing through the inner coil and the outer coil, respectively, so that the plasma density distribution in the donut-shaped plasma and thus on the substrate can be controlled. The plasma density distribution can be controlled in various ways.

  According to the plasma processing apparatus or the plasma processing method of the present invention, the plasma density distribution in the doughnut-shaped plasma generated by inductive coupling in the processing vessel and thus the plasma density distribution on the substrate can be varied by the above configuration and operation. And it can be controlled precisely.

It is a longitudinal cross-sectional view which shows the structure of the inductively coupled plasma processing apparatus in one Embodiment of this invention. It is a perspective view which shows the basic layout structure and electrical connection structure of RF antenna in embodiment. FIG. 3 is an electrical connection diagram corresponding to the configuration of FIG. 2. It is a figure which shows the layout structure and electrical connection structure of RF antenna which were used in the experiment in embodiment. It is a figure which shows one of the combinations of the coil current selected by the said experiment. It is a figure which shows the photograph image of the donut-shaped plasma obtained by the combination of the coil current of FIG. 4B. It is a plot figure which shows the electrostatic capacitance-synthetic | combination reactance characteristic for demonstrating the function of the intermediate | middle capacitor | condenser in embodiment. It is a plot figure which shows the electrostatic capacitance-normalized current characteristic for demonstrating the function of the intermediate | middle capacitor | condenser in embodiment. It is a figure which shows the layout structure and electrical connection structure of RF antenna in one modification of embodiment. It is a figure which shows the layout structure and electrical connection structure of RF antenna in another Example. It is a figure which shows the layout structure and electrical connection structure of RF antenna in another Example. It is a figure which shows the layout structure and electrical connection structure of RF antenna in another Example. It is a figure which shows the modification of the Example of FIG. 9A. It is a figure which shows the layout structure and electrical connection structure of RF antenna in another Example. It is a figure which shows the modification of the Example of FIG. 10A.

Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.
[Configuration and operation of the entire device]

  FIG. 1 shows the configuration of an inductively coupled plasma processing apparatus according to an embodiment of the present invention.

  This plasma processing apparatus is configured as an inductively coupled plasma etching apparatus using a planar coil type RF antenna, and has a cylindrical vacuum chamber (processing vessel) 10 made of metal such as aluminum or stainless steel. Yes. The chamber 10 is grounded for safety.

  First, the configuration of each part not related to plasma generation in this inductively coupled plasma etching apparatus will be described.

  A disc-shaped susceptor 12 on which, for example, a semiconductor wafer W is mounted as a substrate to be processed is horizontally disposed as a substrate holding table that also serves as a high-frequency electrode in the lower center of the chamber 10. The susceptor 12 is made of, for example, aluminum, and is supported by an insulating cylindrical support portion 14 that extends vertically upward from the bottom of the chamber 10.

  An annular exhaust path 18 is formed between the conductive cylindrical support section 16 extending vertically upward from the bottom of the chamber 10 along the outer periphery of the insulating cylindrical support section 14 and the inner wall of the chamber 10. An annular baffle plate 20 is attached to an upper portion or an inlet of 18 and an exhaust port 22 is provided at the bottom. In order to make the gas flow in the chamber 10 uniform on the axis of the semiconductor wafer W on the susceptor 12, it is preferable to provide a plurality of exhaust ports 22 at equal intervals in the circumferential direction. An exhaust device 26 is connected to each exhaust port 22 via an exhaust pipe 24. The exhaust device 26 has a vacuum pump such as a turbo molecular pump, and can depressurize the plasma processing space in the chamber 10 to a desired degree of vacuum. Outside the side wall of the chamber 10, a gate valve 28 that opens and closes a loading / unloading port 27 for the semiconductor wafer W is attached.

A high frequency power source 30 for RF bias is electrically connected to the susceptor 12 via a matching unit 32 and a power feed rod 34. The high-frequency power source 30 can output a high-frequency RF _L having a constant frequency (usually 13.56 MHz or less) suitable for controlling the energy of ions drawn into the semiconductor wafer W with variable power. The matching unit 32 accommodates a reactance variable matching circuit for matching between the impedance on the high frequency power source 30 side and the impedance on the load (mainly susceptor, plasma, chamber) side. A blocking capacitor for generating a self-bias is included in the matching circuit.

  On the upper surface of the susceptor 12, an electrostatic chuck 36 for holding the semiconductor wafer W with an electrostatic attraction force is provided, and a focus ring 38 that surrounds the periphery of the semiconductor wafer W in an annular shape is provided radially outward of the electrostatic chuck 36. Provided. The electrostatic chuck 36 is obtained by sandwiching an electrode 36 a made of a conductive film between a pair of insulating films 36 b and 36 c, and a high voltage DC power supply 40 is electrically connected to the electrode 36 a through a switch 42 and a covered wire 43. It is connected. The semiconductor wafer W can be attracted and held on the electrostatic chuck 36 with an electrostatic force by a high-voltage DC voltage applied from the DC power supply 40.

  Inside the susceptor 12, for example, an annular refrigerant chamber or refrigerant flow path 44 extending in the circumferential direction is provided. A refrigerant having a predetermined temperature, such as cooling water cw, is circulated and supplied to the refrigerant chamber 44 through pipings 46 and 48 from a chiller unit (not shown). The temperature during processing of the semiconductor wafer W on the electrostatic chuck 36 can be controlled by the temperature of the cooling water cw. In this connection, a heat transfer gas such as He gas from a heat transfer gas supply unit (not shown) is supplied between the upper surface of the electrostatic chuck 36 and the back surface of the semiconductor wafer W via the gas supply pipe 50. Is done. Further, for loading / unloading of the semiconductor wafer W, lift pins that can vertically move through the susceptor 12 and a lifting mechanism (not shown) and the like are also provided.

  Next, the configuration of each part related to plasma generation in this inductively coupled plasma etching apparatus will be described.

  The ceiling or top plate of the chamber 10 is provided at a relatively large distance from the susceptor 12, and a circular dielectric window 52 made of, for example, a quartz plate is airtightly attached as the top plate. On the dielectric window 52, an antenna chamber 56 for accommodating the RF antenna 54 for generating inductively coupled plasma in the chamber 10 by electromagnetically shielding it from the outside is provided integrally with the chamber 10. .

  The RF antenna 54 has an inner coil 58, an intermediate coil 60, and an outer coil 62 that are parallel to the dielectric window 52 and are respectively disposed on the inner side, the middle side, and the outer side at intervals in the radial direction. The inner coil 58, the intermediate coil 60 and the outer coil 62 in this embodiment each have an annular coil shape, are arranged coaxially (more preferably concentrically) with each other, and are relative to the chamber 10 or the susceptor 12. Are also arranged coaxially.

  In the present invention, the term “coaxial” refers to a positional relationship in which the central axes overlap each other between a plurality of objects having an axially symmetric shape. This includes not only the case where they are offset from each other but also the case where they are coincident on the same plane (concentric positional relationship).

The inner coil 58, the intermediate coil 60, and the outer coil 62 are electrically connected between the high-frequency power supply line 68 from the high-frequency power supply unit 66 for plasma generation and the return line 70 leading to the ground potential member (two nodes N). _a, are connected in parallel with N between _B). Here, the return line 70 is an earth line having a ground potential, and is connected to a ground potential member (for example, the chamber 10 or another member) that is electrically maintained at the ground potential.

Between the node N _B and the intermediate coil 60 and outer coil 62 of the ground line 70 side, the variable capacitor 86 and 88 are electrically connected in series (insert). These variable capacitors 86 and 88 can be varied independently and arbitrarily within a certain range by the capacitance variable section 90 under the control of the main control section 84. Hereinafter, a capacitor connected in series with the inner coil 58 between the nodes N _A and N _B is referred to as an “inner capacitor”, and a capacitor connected in series with the intermediate coil 60 is referred to as an “intermediate capacitor”. A capacitor connected in series with 62 is referred to as an “outer capacitor”.

The high frequency power supply unit 66 includes a high frequency power source 72 and a matching unit 74. The high frequency power source 72 can output a high frequency RF _H having a constant frequency (usually 13.56 MHz or more) suitable for generating plasma by inductively coupled high frequency discharge with variable power. The matching unit 74 accommodates a reactance variable matching circuit for matching between the impedance on the high frequency power source 72 side and the impedance on the load (mainly RF antenna, plasma) side.

  A processing gas supply unit for supplying a processing gas to the processing space in the chamber 10 is an annular manifold or buffer unit 76 provided in (or outside) the side wall of the chamber 10 at a position somewhat lower than the dielectric window 52. A plurality of side wall gas discharge holes 78 facing the plasma generation space from the buffer section 76 at equal intervals in the circumferential direction, and a gas supply pipe 82 extending from the processing gas supply source 80 to the buffer section 76. The processing gas supply source 80 includes a flow rate controller and an on-off valve (not shown).

  The main control unit 84 includes, for example, a microcomputer. Each unit in the plasma etching apparatus, for example, the exhaust device 26, the high frequency power sources 30, 72, the matching units 32, 74, the electrostatic chuck switch 42, the variable capacitors 86, 88, The individual operations of the processing gas supply source 80, the chiller unit (not shown), the heat transfer gas supply unit (not shown), and the operation (sequence) of the entire apparatus are controlled.

In order to perform etching in this inductively coupled plasma etching apparatus, the gate valve 28 is first opened, and the semiconductor wafer W to be processed is loaded into the chamber 10 and placed on the electrostatic chuck 36. Then, after the gate valve 28 is closed, an etching gas (generally a mixed gas) is supplied from the processing gas supply source 80 through the gas supply pipe 82, the buffer portion 76, and the side wall gas discharge holes 78 at a predetermined flow rate and flow rate ratio. The pressure in the chamber 10 is set to a set value by the exhaust device 26. Further, the high frequency power supply 72 of the high frequency power supply unit 66 is turned on to output a high frequency RF _H for plasma generation at a predetermined RF power, and the RF antenna 54 is connected via the matching unit 74, the RF power supply line 68 and the return line 70. A high frequency RF _H current is supplied to the inner coil 58, the intermediate coil 60 and the outer coil 62. On the other hand, the high frequency power supply 30 is turned on to output a high frequency RF _L for controlling the ion attraction at a predetermined RF power, and this high frequency RF _L is applied to the susceptor 12 via the matching unit 32 and the power feed rod 34. Further, the heat transfer gas (He gas) is supplied from the heat transfer gas supply unit to the contact interface between the electrostatic chuck 36 and the semiconductor wafer W, and the electrostatic chucking force of the electrostatic chuck 36 is turned on by turning on the switch 42. The heat transfer gas is confined in the contact interface.

In the chamber 10, the etching gas discharged from the side wall gas discharge holes 78 diffuses into the processing space below the dielectric window 52. Magnetic field lines (magnetic flux) generated around the coils due to the high-frequency RF _H current flowing through the coils 58, 60, 62 of the RF antenna 54 penetrate the dielectric window 52 and process space (plasma generation space) in the chamber 10. ), An induced electric field in the azimuth direction is generated in the processing space. Electrons accelerated in the azimuth direction by the induced electric field cause ionization collision with molecules and atoms of the etching gas, and a donut-shaped plasma is generated.

  The radicals and ions of the doughnut-shaped plasma diffuse in all directions in a wide processing space, the radicals flow isotropically, and the ions are pulled by a DC bias, so that the top surface (surface to be processed) of the semiconductor wafer W To be supplied. Thus, the active species of the plasma cause a chemical reaction and a physical reaction on the surface to be processed of the semiconductor wafer W, and the film to be processed is etched into a desired pattern.

  Here, the “doughnut-shaped plasma” is not limited to a strictly ring-shaped plasma in which plasma does not stand on the radially inner side (center portion) of the chamber 10 but only on the radially outer side. This means that the volume or density of plasma on the outer side in the radial direction is larger than the inner side in the radial direction. Further, depending on conditions such as the type of gas used for the processing gas and the pressure value in the chamber 10, the “doughnut-shaped plasma” may not occur.

In this inductively coupled plasma etching apparatus, the inner coil 58, the intermediate coil 60, and the outer coil 62 of the RF antenna 54 have a special electrical connection configuration as described below, and further, a capacitor (see FIG. 1) is connected to the RF antenna 54. In the example, the variable capacitors 86 and 88) are added to effectively suppress or reduce the wavelength effect and potential difference (voltage drop) in the RF antenna 54, and plasma process characteristics on the semiconductor wafer W, that is, etching characteristics (etching rate). , Selectivity, etching shape, etc.) can be improved in the circumferential direction and radial direction.

[Basic configuration and operation of RF antenna]

  The main feature of this inductively coupled plasma etching apparatus is the spatial layout configuration and electrical connection configuration inside the RF antenna 54. 2 and 3 show the basic configuration of the layout and electrical connection (circuit) of the RF antenna 54 in this embodiment.

As shown in FIG. 2, the inner coil 58 is a single-turn annular coil with a constant radius that goes around the gap or the cut line G _i , and is located near the center of the chamber 10 in the radial direction. One end, i.e. RF inlet end 58in the inner coil 58 is connected to the RF feed line 68 of the high-frequency power supply portion 66 via the connecting conductor 92 and the first node N _A that extends upward. The other end, i.e. RF outlet end 58out of the inner coil 58 is connected to the earth line 70 via a connecting conductor 94 and the second node N _B extending upward.

Intermediate coil 60 is made constant radius single turn toroidal coils around across the gap or cut G _m, it is located in the middle portion of the chamber 10 at the outer side than the inner coil 58 in the radial direction. One end, i.e. RF inlet end 60in intermediate coil 60 is adjacent to the RF outlet 58out of the inner coil 58 in the radial direction, the high-frequency power supply unit 66 via a connection conductor 96 and the first node N _A that extends upward Are connected to the RF feed line 68. The other end, i.e. RF outlet end 60out of intermediate coil 60 is adjacent to the RF inlet end 58in the inner coil 58 in the radial direction, the earth line 70 via a connecting conductor 98 and the second node N _B extending upward It is connected.

The outer coil 62 is a single-turn annular coil with a constant radius that goes around the gap or the cut _Go, and is located outside the intermediate coil 60 and closer to the side wall of the chamber 10 in the radial direction. One end, i.e. RF inlet end 62in the outer coil 62 is adjacent to the RF outlet end 60out of intermediate coil 60 in the radial direction, the high-frequency power supply unit 66 via the connection conductor 100 and the first node N _A that extends upward Are connected to the RF feed line 68. The other end, i.e. RF outlet end 62out of the outer coil 62 is adjacent to the RF inlet end 60in intermediate coil 60 in the radial direction, the earth line 70 through the connection conductor 102 and a second node N _B extending upward It is connected.

  As shown in FIG. 2, the connecting conductors 92-102 extending above the RF antenna 54 are laterally separated (at a considerably high position) from the dielectric window 52 within the antenna chamber 56 (FIG. 1). A branch line or a jumper line is formed to reduce the electromagnetic influence on the coils 58, 60, 62.

In the coil arrangement and connection structure in the RF antenna 54 as described above, when the high-frequency power source 72 passes through the RF feed line 68, the RF antenna 54, and the ground line 70 to the ground potential member, more specifically, the first node. when traveling around the high-frequency branch transmission path of each coil 58, 60, 62 constituting the RF antenna 54 from N _a to the second node N _B, counterclockwise in FIG. 2 when passing through the inner coil 58 and outer coil 62, respectively In contrast, when it passes through the intermediate coil 60, it turns clockwise in FIG. Thus, it is an important characteristic point that the direction when passing through the intermediate coil 60 and the direction when passing through the inner coil 58 and the outer coil 62 are reversed in the circulation direction.

  In the inductively coupled plasma etching apparatus of this embodiment, a high-frequency current supplied from the high-frequency power feeding unit 66 flows through each part in the RF antenna 54, whereby the inner coil 58, the intermediate coil 60, and the Around the outer coil 62, a high-frequency AC magnetic field distributed in a loop according to Ampere's law is generated, and the processing space extends radially in the relatively inner (lower) area below the dielectric window 52. A transverse field line is formed.

  Here, the radial direction (horizontal) component of the magnetic flux density in the processing space is always zero at the center and the peripheral portion of the chamber 10 regardless of the magnitude of the high-frequency current, and becomes a maximum somewhere in the middle. The intensity distribution of the induced electric field in the azimuth direction generated by the high-frequency AC magnetic field also shows the same distribution as the magnetic flux density in the radial direction. That is, in the radial direction, the electron density distribution in the donut-shaped plasma substantially corresponds to the current distribution in the RF antenna 54 in a macro manner.

  The RF antenna 54 in this embodiment is different from a normal spiral coil that pivots from the center or the inner peripheral end to the outer peripheral end, and the annular inner coil 58 that is localized in the center of the antenna and the antenna in the middle. A current distribution in the RF antenna 54 is a concentric shape corresponding to the position of each coil 58, 60, 62. Distribution.

Here, a uniform or uniform high-frequency current (hereinafter referred to as “inner coil current”) I _i flows through the inner coil 58 in the loop. The intermediate coil 60, within a loop uniform or uniform high frequency current (hereinafter referred to as "intermediate coil current".) I _m flows. A high-frequency current (hereinafter referred to as “outer coil current”) I _{o that} is uniform or uniform in the loop flows through the outer coil 62. In this embodiment, the capacitances C ₈₆ and C ₈₈ of the intermediate capacitor 86 and the outer capacitor 88 can be varied within a predetermined range under the coil arrangement and connection structure (FIG. 2) as described above, as will be described later. Alternatively, the coil currents I _i , I _m , and I _o flowing through the coils 58, 60, and 62 in the RF antenna 54 can be all aligned in the same direction in the circulation direction.

  Therefore, in the donut-shaped plasma generated below (inside) the dielectric window 52 of the chamber 10, the current density (that is, plasma density) near the position immediately below each of the inner coil 58, the intermediate coil 60, and the outer coil 62. Rises and becomes high (maximum). As described above, the current density distribution in the donut-shaped plasma is not uniform in the radial direction but has an uneven profile. However, the plasma diffuses in all directions in the processing space in the chamber 10, so that the density of the plasma is leveled near the susceptor 12, that is, on the substrate W.

  In this embodiment, all of the inner coil 58, the intermediate coil 60 and the outer coil 62 are annular coils, and a uniform or uniform high-frequency current flows in the coil circulation direction. Of course, a substantially uniform plasma density distribution can be obtained in the vicinity of the susceptor 12, that is, on the substrate W.

Further, in the radial direction, as will be described later, by changing or selecting the capacitances C ₈₆ and C ₈₈ of the intermediate capacitor 86 and the outer capacitor 88 to appropriate values within a predetermined range, the inner coil 58 and the intermediate coil can be selected. The plasma density distribution in the donut-shaped plasma can be freely controlled by adjusting the balance of the currents I _i , I _m and I _o flowing through the outer coil 62 and the outer coil 62, respectively. Accordingly, the plasma density distribution in the vicinity of the susceptor 12, that is, on the substrate W can be freely controlled, and the uniform plasma density distribution can be easily achieved with high accuracy.

In this embodiment, the wavelength effect and voltage drop in the RF antenna 54 depends on the length of each individual coil 58, 60, 62. Therefore, by selecting the length of each coil so as not to cause the wavelength effect in the individual coils 58, 60, 62, all the problems of the wavelength effect and the voltage drop in the RF antenna 54 can be solved. In order to prevent the wavelength effect, it is desirable to make the length of each coil 58, 60, 62 shorter than a quarter wavelength of the high frequency RF _H.

The condition of less than ¼ wavelength regarding the coil length is more easily satisfied as the coil diameter is smaller and the number of turns is smaller. Therefore, the inner coil 58 having the smallest coil diameter in the RF antenna 54 can easily adopt a multi-turn configuration. On the other hand, the outer coil 62 having the largest coil diameter is preferably a single winding rather than a plurality of windings. Although the intermediate coil 60 depends on the diameter of the semiconductor wafer W, the frequency of the high-frequency RF _H , and the like, normally, like the outer coil 62, a single winding is desirable.

[Function of capacitor added to RF antenna]

  Another important feature of the inductively coupled plasma etching apparatus of this embodiment is the function or operation of a variable capacitor (particularly, the intermediate capacitor 86) added to the RF antenna 54.

In the inductively coupled plasma etching apparatus of this embodiment, the synthetic reactance of the intermediate coil 60 and the intermediate capacitor 86 (hereinafter referred to as “intermediate synthetic reactance”) is made by varying the capacitance C ₈₆ of the intermediate capacitor 86. the X _m is variable, it is possible to vary the current value of the intermediate current I _m flowing through the intermediate coil 60.

Here, the capacitance C ₈₆ of the intermediate capacitor 86 has a desirable range. That, in conjunction with the connection of the intermediate coil 60 for high-frequency power supply unit 66 as described above is in the direction opposite to the connection of the inner coil 58 and outer coil 60, intermediate combined reactance X _m is a negative value It is desirable to change or select the capacitance C ₈₆ of the intermediate capacitor 86 so that the capacitive reactance of the intermediate capacitor 86 is larger than the inductive reactance of the intermediate coil 60. From another viewpoint, the capacitance C ₈₆ of the intermediate capacitor ₈₆ is variable or selected within a region smaller than the capacitance when the series circuit including the intermediate coil 60 and the intermediate capacitor 86 causes series resonance. Is desirable.

In RF antenna 54 intermediate coil 60 is connected in the opposite direction to the inner coil 58 and outer coil 62 as described above, the electrostatic intermediate capacitor 86 in the region where the intermediate combined reactance X _m is a negative value by varying the capacitance C _86, in the same direction inside a current I _i and the outer current I _o and the circumferential direction intermediate current I _m flowing through the intermediate coil 60 flows through the inner coil 58 and outer coil 62, respectively. Moreover, it is also possible to gradually increase the current value of the intermediate current I _m from substantially zero can be selected for example to 1/10 or less or more than 1/5 of the inner current I _i and the outer current I _o.

When such control of the intermediate current I _m to sufficiently small current value than the inner current I _i and the outer current I _o, 3 single coils 58, 60 which are disposed concentrically in parallel connection like this embodiment 4 shows that in the inductively coupled plasma etching apparatus using the RF antenna 54 composed of, 62, the plasma density in the doughnut-shaped plasma generated directly under the chamber 10 can be finely and uniformly made uniform. It has been confirmed in.

In this experiment, as shown in FIG. 4A, in the RF antenna 54, the inner coil 58 is formed in two turns (two turns) with a diameter of 100 mm, and the intermediate coil 60 and the outer coil 62 are single wound with a diameter of 200 mm and 300 mm, respectively. (1 turn). As main process conditions, the frequency of the high frequency RF _H is 13.56 MHz, the RF power is 1500 W, the pressure in the chamber 10 is 100 mTorr, the processing gas is a mixed gas of Ar and O ₂ , and the gas flow rate is Ar / O ₂ = 300. / 30 sccm.

In this experiment, 3.9A and the capacitance C _86, C ₈₈ of the intermediate condenser 86 and the outer capacitor 88 variable and, 13.5A the inner coil current I _i, as shown in FIG. 4B, the intermediate coil current I _m When the outer coil current I _o was adjusted to 18.4 A, a uniform plasma density distribution in the radial direction was confirmed as shown in FIG. 4C.

Note that (even if the intermediate coil 60 is not) be the intermediate coil current I _m to 0A, since plasma generated in the vicinity of each of the position directly below the inner coil 58 and outer coil 62 is diffused in the radial direction, Fig 3 As shown by the dotted line, there is a plasma density that is not low (somewhat lowered) even in the middle region between the coils 58 and 62. Therefore, a small amount of current the current flowing through each I _m in both coils 58 and 62 I _i separately to intermediate coil 60 located in the middle and the both coils 58 and 62, the flow in the same direction in the circumferential direction and I _o, intermediate The generation of inductively coupled plasma is moderately enhanced near the position immediately below the coil 60, and the plasma density becomes uniform in the radial direction.

In this embodiment, to be able to control the current value of the intermediate coil current I _m in equivalent small value, and connect the intermediate coil 60 in the reverse direction as described above, intermediate combined reactance of the capacitance C ₈₆ of the intermediate condenser 86 X _m is variable in a negative region. In this case, the smaller the value of C ₈₆ in the region of X _m <0, the absolute value becomes large intermediate combined reactance X _m, the current value of the intermediate current I _m is (approaches zero) smaller. Conversely, the larger the value of C ₈₆ in the region of X _m <0, the absolute value of the intermediate combined reactance X _m becomes smaller, the current value of the intermediate current I _m becomes larger.

  Here, the function of the intermediate capacitor 86 will be described in more detail with reference to FIGS. 5A and 5B.

FIG. 5A shows that a variable capacitor is connected in series to a coil having a reactance of 50Ω (corresponding to a single-turn annular coil having a diameter of about 200 mm including a connected portion), and the capacitance C of the variable capacitor is set to 20 pF to 1000 pF. The value of the synthetic reactance X when it is varied in the range is plotted. FIG. 5B is a graph in which the value of the current I _N flowing through the coil at that time is normalized (as a value of the ratio to the current flowing when there is no variable capacitor).

  When the capacitance C of the variable capacitor is sufficiently small, the synthetic reactance X shows a large negative value. As the capacitance C of the variable capacitor increases, the combined reactance X increases past zero (Ω) corresponding to series resonance, and gradually approaches the value of the coil reactance (50Ω).

The current I _N flowing through the coil is proportional to 1 / X and is represented by the following equation.
Here, f is the frequency of the high frequency applied to the coil.

If the capacitance C of the variable capacitor is sufficiently small, the current I _N also has a negative sign, that is, a reverse direction current with a value close to zero. From there, when the capacitance C is increased, the current I _N having the same magnitude as the current flowing through the coil when there is no variable capacitor passes through the state (I _N = −1) in the reverse direction, and in series. current value C _R across rapidly reverse current I _N at which becomes resonance is gradually increased. When passing the series resonance point C _R, now in a state where a large current flows I _N in the positive direction in reversal, in accordance continue to further increase the capacitance C from which, when the variable capacitor is not Asymptotically approaches a state (I _N = + 1) in which a current I _N having the same direction and the same magnitude as the current flowing through the coil flows.

It should be noted here that there cannot exist a state in which a positive current I _N flowing sufficiently small (that is, smaller than +1) flows in the series circuit including the coil and the variable capacitor. In the positive direction, the current I _N can flow only at a magnitude (I _N ≧ 1) equal to or greater than that without the variable capacitor. If the current I _N is to be reduced to a positive value smaller than that without the variable capacitor, the capacitance C must be varied within a range smaller than the series resonance point C _R , that is, within a range where the current I _N is reversed. .

Therefore, in this embodiment, with respect to the intermediate coils 60, synthetic reactance X _m is a variable capacitance C ₈₆ of the intermediate condenser 86 in the region where a negative value, and an intermediate coil current I _m current inner coil I _i In addition, the connection of the intermediate coil 60 is opposite to the connection of the inner coil 58 and the outer coil 62 so as to flow in the same direction as the outer coil current _Io . This makes it possible to flow in the same direction in the circumferential direction and the inner coil current I _i and the outer coil current I _o small enough intermediate coil current I _m in the middle coil 60, finely uniformize the plasma density distribution in the radial direction can do.

However, the selection of the current I _m flowing through the intermediate coil 86 for connecting the opposite direction there is one constraint. That is, in the plurality of coils electrically connected in parallel, the current (I _i ) flowing in the other coils (the inner coil 58 and the outer coil 62) is connected to the coil connected in the opposite direction (the intermediate coil 60 in this embodiment). , I _o ) cannot flow a current (I _m ) of the same degree.

  In a series circuit consisting of a coil and a variable capacitor connected in the opposite direction, if the capacitance of the variable capacitor is increased from a sufficiently small value under the condition that the combined reactance is negative, the current increases accordingly. Somewhere, it reaches a region where the value is the same as the synthetic reactance on the other coil side with the opposite sign. In the parallel reactance circuit, considering that the ratio of the current is proportional to the reciprocal of the reactance, this corresponds to a state in which the same sign flows with the opposite sign. In such a state, the entire parallel reactance circuit becomes a parallel resonance circuit, and the load impedance viewed from the matching unit takes a very large value. In a normal matching device, such a region is out of the matching range, or the power transmission efficiency is extremely deteriorated. Therefore, it is necessary to take care not to pass the same amount of current as that flowing through the other coils 58 and 62 through the intermediate coil 60 connected in the opposite direction.

The outer capacitor 88 added to the RF antenna 54 together with the intermediate capacitor 86 functions to adjust the balance between the inner current I _i flowing through the inner coil 58 and the outer current I ₀ flowing through the outer coil 62. As described above, the intermediate current I _m flowing through the intermediate coil 60 is usually a minor flows most of the high-frequency current supplied from the high-frequency power supply unit 66 to the RF antenna 54 is divided into an inner coil 58 and outer coil 62 . Here, by changing the capacitance C ₈₈ of the outer capacitor 88, the combined reactance (hereinafter referred to as “outer combined reactance”) Z _o of the outer coil 62 and the outer capacitor 88 is changed, and as a result, the inner current I The distribution ratio between _i and the outer current I _o can be adjusted.

Since both the inner coil 58 and the outer coil 62 are connected in the forward direction, the outer combined reactance X _o has a positive value in order to make the inner current I _i and the outer current I _o in the same direction in the circumferential direction. The capacitance C ₈₈ of the outer capacitor 88 may be varied in the region. In this case, the smaller the value of C ₈₈ in the region of X _o > 0, the smaller the value of the outer synthetic reactance X _{o and} the larger the amount of current of the outer current I _o. The amount of current I _i becomes relatively small. On the other hand, the larger the value of C ₈₈ in the region of X _o > 0, the larger the value of the outer synthetic reactance X _o , and the smaller the amount of current of the outer current I _o. The amount of current I _i becomes relatively large.

Instead of the outer capacitor 88, a configuration in which a capacitor is connected in series to the inner coil 58, that is, a configuration in which an inner capacitor is provided is also conceivable. However, when no capacitor is added to the RF antenna 54, current flows in a concentrated manner in the inner coil 58 having the lowest impedance (particularly reactance) in proportion to the coil diameter, and the plasma density in the donut-shaped plasma is at the center. Protrusively high. Adding the inner capacitor only increases the concentration of the current in the inner coil 58, and thus only increases the imbalance between the inner coil current I _i and the outer coil current I _o, and controls the plasma density distribution. Over not desirable.

Thus, in the inductively coupled plasma etching apparatus of this embodiment, the inner current I _i flowing through the inner coil 58 and the outer current I flowing through the outer coil 62 are varied by changing the capacitance C ₈₈ of the outer capacitor 88. The balance with ₀ can be adjusted arbitrarily. As described above, by varying the capacitance C ₈₆ of the intermediate condenser 86, to adjust the balance between the intermediate current I _m and an inner current I _i and the outer current I ₀ flowing through the intermediate coil 60 optionally Can do.

[Other Embodiments or Modifications Related to RF Antenna]

In the above embodiment, respectively connected to intermediate capacitor 86 and the outer capacitor 88 RF outlet end of the intermediate coil 60 and outer coil 62 60OUT, between the second node N _B of 62out and the earth line 70 side. As a modification, as shown in FIG. 6, an intermediate capacitor 86 and an outer capacitor 88 are respectively provided between the first node N _A on the high-frequency power source 72 side and the RF inlet ends 60 in and 62 in of the intermediate coil 60 and the outer coil 62. A configuration for connection is also possible.

As another example, as shown in FIG. 7, for such is also switched to either the connection of the intermediate coil 60 in the reverse direction and forward direction between the first node N _A and the second node N _B A configuration in which the changeover switch 110 is provided is also possible. In the illustrated configuration example, two movable contacts 110a and 110b of the changeover switch 110 are connected to both ends 60a and 60b of the intermediate coil 60, respectively. The first movable contact 110a is connected to the first power source side stationary contact 110c which is connected to the first node N _A of the high frequency power source 72 side, first is connected to the second node N _B of the ground line 70 side 1 It is possible to switch between the earth-side fixed contact 110d. The second movable contact 110b includes a second power source side stationary contact 110e connected to the first node N _A of the high frequency power source 72 side, first is connected to the second node N _B of the ground line 70 side 2 It is possible to switch between the ground side fixed contact 110f.

  In such a configuration, when the first and second movable contacts 110a and 110b are switched to the first power supply side fixed contact 110c and the second ground side fixed contact 110f, the intermediate coil 60 is connected in the opposite direction. When the first and second movable contacts 110a and 110b are switched to the first ground side fixed contact 110d and the second power source side fixed contact 110e, respectively, the intermediate coil 60 is connected in the forward direction.

Further, as another embodiment, as shown in FIG. 8, it is possible to have a configuration having both the first intermediate coil 60A connected in the reverse direction and the second intermediate coil 60B connected in the forward direction. Again, between the first node N _A and the second node N _B, first and second intermediate coils 60A, 60B and first and second intermediate capacitor 86A respectively connected in series, provided 86B configuration Is preferred.

In this embodiment, when an intermediate coil current I _m (I _mA + I _mB ) that is equal to or larger than the inner coil current I _i and the outer coil current I _o is required, the second intermediate capacitor on the forward side is used. The capacitance C _86B of _86B is adjusted from a large value toward the series resonance point C _R, and the capacitance C _86A of the first intermediate capacitor 86A on the reverse direction side is adjusted to the vicinity of the minimum value. Conversely, when the intermediate coil current I _m (I _mA + I _mB ) sufficiently smaller than the inner coil current I _i and the outer coil current I _o is required, the capacitance C _86B of the second intermediate capacitor _86B is minimized. fit around a value, adjusting the electrostatic capacitance C _86A of the first intermediate capacitor 86A between a minimum value and a series resonance point C _R.

  FIG. 9A shows an example in which each of the coils (inner coil 54 / intermediate coil 60 / outer coil 62) constituting the RF antenna 54 is composed of a pair of spiral coils in a spatially and electrically parallel relationship. Such a spiral coil may be used when the wavelength effect is not a significant problem.

In the illustrated configuration example, the inner coil 58 is composed of a pair of spiral coils 58a and 58b that translate 180 ° in the circumferential direction. These spiral coils 58a, 58b is, the node N _D that is provided on the upstream side of the node N _B than the node N _A of the high frequency power source 72 side is provided on the downstream side node N _C and the ground line 70 side Are electrically connected in parallel.

The intermediate coil 60 is composed of a pair of spiral coils 60a and 60b that translate 180 degrees in the circumferential direction. These spiral coils 60a, 60b rather than the node N _B of the node N _E and the ground line side which is provided on the downstream side than the node N _A of the high frequency power source 72 side (more than intermediate capacitor 86) provided on the upstream side It is electrically connected in parallel between the node N _F, which is.

The outer coil 62 is composed of a pair of spiral coils 62a and 62b that translate 180 ° in the circumferential direction. These spiral coils 62a, 62b rather than the node N _B of the high frequency power source 72 side of the node N nodes arranged downstream of the _A N _G and the earth line 70 side (more than the outer capacitor 88) on the upstream side It is electrically connected in parallel with the provided node _NH .

Thus, even when the parallel spiral coil is used, the inner coil 58 and the outer coil 62 are connected in the forward direction, and the intermediate coil 60 is connected in the reverse direction. That is, the orientation of the case through the case where traveling around each of the high-frequency branch transmission path in a single stroke from a first node N _A to node N _B, the inner coil 58 (58a, 58b) and outer coils 62 (62a, 62b) respectively, a 9A, the direction when passing through the intermediate coil 60 (60a, 60b) is counterclockwise in FIG. 9A.

Also in this embodiment, as shown in FIG. 9B, the intermediate capacitor 86 and the outer capacitor 88 are provided on the high-frequency power source 72 side, more specifically, connected between the node N _A and the nodes N _E and N _G , respectively. Configuration is also possible.

  The loop shape of each of the coils 58, 60, 62 constituting the RF antenna 54 of this embodiment is not limited to a circle, and may be a quadrangle as shown in FIG. 15A and FIG. There may be. Thus, even when the loop shape of the coils 58, 60, 62 is polygonal, the intermediate coil 60 is connected in the opposite direction to the inner coil 58 and the outer coil 62 as shown in the figure, and the variable intermediate capacitor 86 and A configuration with a variable outer capacitor 88 is preferred. The cross-sectional shape of the coil is not limited to a rectangle, but may be a circle or an ellipse, or may be a stranded wire instead of a single wire.

  Although not shown, in the RF antenna 54, another coil is disposed on the radially inner side of the inner coil 58 and / or the radially outer side of the outer coil 62, and a total of four or more coils are connected in parallel. Is also possible. Alternatively, a configuration in which the inner coil 58 is omitted and only the intermediate coil 60 and the outer coil 62 are provided (in this case, the intermediate coil 60 becomes a relatively inner coil) is possible. Furthermore, a configuration in which the outer coil 62 is omitted and only the inner coil 58 and the intermediate coil 60 are provided (a configuration in which the intermediate coil 60 becomes a relatively outer coil) is possible. In this case, it is preferable to connect a variable inner capacitor in series with the inner coil 58.

If necessary, it is also possible to capacitance C ₈₆ of the intermediate condenser 86 is intermediate combined reactance X _m variable in a positive value region. In this case, the intermediate coil current I _m flowing through the intermediate coil 60 is reversed in direction in the inner coil current I _i and the outer coil current I _o and circumferential directions respectively flowing in the inner coil 58 and within the outer coil 62. This is useful when it is desired to reduce the plasma density intentionally near the intermediate coil 60.

  Further, a part of the capacitor (including the intermediate capacitor 86) added to the RF antenna 54 can be a fixed capacitor or a semi-fixed capacitor, and a configuration in which only the intermediate capacitor 86 is added to the RF antenna 54 is also possible. It is.

  The configuration of the inductively coupled plasma etching apparatus in the above-described embodiment is an example, and various modifications can be made to the configuration of each part not directly related to plasma generation as well as each part of the plasma generation mechanism.

For example, as a basic form of the RF antenna, a type other than the planar type, such as a dome type, is possible. A configuration in which the processing gas is introduced into the chamber 10 from the ceiling in the processing gas supply unit is also possible, and a configuration in which the high frequency RF _L for DC bias control is not applied to the susceptor 12 is also possible.

  Furthermore, the inductively coupled plasma processing apparatus or plasma processing method according to the present invention is not limited to the technical field of plasma etching, and can be applied to other plasma processes such as plasma CVD, plasma oxidation, plasma nitridation, and sputtering. . Further, the substrate to be processed in the present invention is not limited to a semiconductor wafer, and various substrates for flat panel displays, photomasks, CD substrates, printed substrates, and the like are also possible.

DESCRIPTION OF SYMBOLS 10 Chamber 12 Susceptor 26 Exhaust device 52 Dielectric window 54 RF antenna 58 Inner coil 60 Intermediate coil 62 Outer coil 66 High frequency electric power feeding part 70 Ground line 72 High frequency power source for plasma generation 74 Matching device 80 Processing gas supply source 84 Main control part 86 Intermediate capacitor 88 Outer capacitor 90 Capacitance variable section

Claims (26)

A processing vessel having a dielectric window;
A substrate holding unit for holding a substrate to be processed in the processing container;
A processing gas supply unit for supplying a desired processing gas into the processing container in order to perform a desired plasma processing on the substrate;
An RF antenna provided outside the dielectric window to generate plasma of a processing gas by inductive coupling in the processing container;
A high-frequency power feeding section that supplies high-frequency power having a frequency suitable for high-frequency discharge of the processing gas to the RF antenna,
The RF antennas are disposed relatively inside and outside at a radial interval, and are electrically parallel between the first and second nodes provided in the high-frequency transmission path of the high-frequency power feeding unit. Having inner and outer coils connected,
When each high-frequency branch transmission line is rotated from the first node to the second node with a single stroke, the direction when passing through the inner coil and the direction when passing through the outer coil are reversed in the circulation direction. become,
Between the first node and the second node, a first capacitor that is electrically connected in series with either the inner coil or the outer coil is provided.
Plasma processing equipment.   2. The plasma processing apparatus according to claim 1, wherein currents in the same direction in a circumferential direction flow through the inner coil and the outer coil, respectively.   The plasma processing according to claim 2, wherein a current flowing through the coil electrically connected in series with the first capacitor is smaller than a current flowing through the other coil between the inner coil and the outer coil. apparatus.   4. The plasma processing apparatus according to claim 2, wherein the first capacitor has a capacitance smaller than a capacitance that causes series resonance with a coil electrically connected in series with the first capacitor. 5.   5. The first capacitor according to claim 1, wherein the first capacitor is a variable capacitor, and the direction and the amount of current flowing through a coil electrically connected in series with the first capacitor are controlled by changing a value of the capacitance. The plasma processing apparatus according to any one of claims.   The plasma processing apparatus according to claim 5, wherein a capacitance of the first variable capacitor is selected so as not to cause parallel resonance between the first node and the second node.   The 2nd capacitor | condenser electrically connected in series with either the said inner side coil or the said outer side coil is provided between the said 1st node and the said 2nd node. The plasma processing apparatus according to claim 6.   The plasma processing according to claim 7, wherein the second capacitor is a variable capacitor, and the amount of current flowing through a coil electrically connected in series with the second capacitor is controlled by changing a value of the capacitance. apparatus.   The plasma processing apparatus according to claim 1, wherein the inner coil and the outer coil are arranged coaxially.   The plasma processing apparatus according to claim 9, wherein the inner coil and the outer coil are arranged concentrically. The dielectric window forms a ceiling of the processing vessel;
Both the inner coil and the outer coil are placed on the dielectric window,
The plasma processing apparatus according to claim 10. A processing vessel having a dielectric window;
A substrate holding unit for holding a substrate to be processed in the processing container;
A processing gas supply unit for supplying a desired processing gas into the processing container in order to perform a desired plasma processing on the substrate;
An RF antenna provided outside the dielectric window to generate plasma of a processing gas by inductive coupling in the processing container;
A high-frequency power feeding section that supplies high-frequency power having a frequency suitable for high-frequency discharge of the processing gas to the RF antenna,
The RF antennas are disposed relatively inside, in the middle and outside at intervals in the radial direction, and are electrically connected between the first and second nodes provided in the high frequency transmission path of the high frequency power feeding unit. Having an inner coil, an intermediate coil and an outer coil connected in parallel;
When each high-frequency branch transmission path is drawn with a single stroke from the first node to the second node, the direction when passing through the intermediate coil is the direction when passing through the inner coil and the outer coil, respectively. Reverse in the lap direction,
A first capacitor electrically connected in series with the intermediate coil is provided between the first node and the second node.
Plasma processing equipment.   The plasma processing apparatus according to claim 12, wherein the first capacitor is a variable capacitor, and the direction and the amount of current flowing through the intermediate coil are controlled by changing a value of the capacitance.   The plasma processing apparatus according to claim 13, wherein a capacitance of the first capacitor is selected so that parallel resonance does not occur between the first node and the second node.   The plasma processing apparatus according to claim 12, further comprising: a second capacitor electrically connected in series with the outer coil between the first node and the second node. .   The plasma processing apparatus according to claim 15, wherein the second capacitor is a variable capacitor, and a balance between currents flowing through the inner coil and the outer coil is controlled by changing a capacitance value thereof.   The plasma processing apparatus according to any one of claims 12 to 16, wherein the inner coil, the intermediate coil, and the outer coil are arranged coaxially.   The plasma processing apparatus according to claim 17, wherein the inner coil, the intermediate coil, and the outer coil are arranged concentrically. The dielectric window forms a ceiling of the processing vessel;
All of the inner coil, the intermediate coil, and the outer coil are disposed on the dielectric window,
The plasma processing apparatus according to claim 18.   The plasma processing apparatus according to any one of claims 12 to 19, wherein the outer coil is a single-wound coil that makes one turn in a circumferential direction.   The plasma processing apparatus according to any one of claims 12 to 20, wherein the intermediate coil is a single-turn coil that makes a round in a circumferential direction. A processing container having a dielectric window, a substrate holding unit for holding a substrate to be processed in the processing container, and supplying a desired processing gas into the processing container in order to perform a desired plasma process on the substrate. A high-frequency power having a frequency suitable for high-frequency discharge of the processing gas; a processing gas supply unit; an RF antenna provided outside the dielectric window to generate plasma of the processing gas by inductive coupling in the processing container; A plasma processing method for performing a desired plasma process on the substrate in a plasma processing apparatus having a high-frequency power supply unit that supplies the RF antenna to the RF antenna,
The RF antenna is disposed between a first node and a second node that are disposed relatively inside, in the middle, and outside at intervals in the radial direction, and provided in a high-frequency transmission path of the high-frequency power feeding unit. Split into inner coil, intermediate coil and outer coil connected in parallel,
When each high-frequency branch transmission path is drawn with a single stroke from the first node to the second node, the direction when passing through the intermediate coil is the direction when passing through the inner coil and the outer coil, respectively. The inner coil, the intermediate coil and the outer coil are connected so as to be reversed in the circumferential direction,
A first variable capacitor electrically connected in series with the intermediate coil is provided between the first node and the second node;
Selecting or variably controlling the capacitance of the first variable capacitor to control the plasma density distribution on the substrate;
Plasma processing method.   23. The plasma processing method according to claim 22, wherein the amount of current flowing through the intermediate coil is adjusted to be smaller by reducing the capacitance of the first variable capacitor.   23. The plasma processing method according to claim 22, wherein the amount of current flowing through the intermediate coil is adjusted to be larger by bringing the capacitance of the first variable capacitor closer to series resonance.   The capacitance of the first variable capacitor is selected so as not to cause parallel resonance between the first node and the second node. Plasma processing method. Connecting a second variable capacitor electrically in series with the outer coil between the first node and the second node;
Selecting or variably controlling the capacitance of the first and second variable capacitors to control the plasma density distribution on the substrate;
The plasma processing method as described in any one of Claims 22-25.