JP2015119024A5 - - Google Patents
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- JP2015119024A5 JP2015119024A5 JP2013261068A JP2013261068A JP2015119024A5 JP 2015119024 A5 JP2015119024 A5 JP 2015119024A5 JP 2013261068 A JP2013261068 A JP 2013261068A JP 2013261068 A JP2013261068 A JP 2013261068A JP 2015119024 A5 JP2015119024 A5 JP 2015119024A5
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- lead wire
- key
- key circuit
- guide structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011810 insulating material Substances 0.000 claims description 3
Description
以上の課題を解決するため、本発明は、
キー回路基板の一面側に配置された弾性絶縁材料のキーシートに設けられた突起が、当該キー回路基板の貫通孔に貫通されて当該キー回路基板の他面側に突出され、
前記突起の前記キー回路基板の他面側への突出部に形成された溝に、前記キー回路基板の他面側に配置された電子部品のリード線が挿入されて挟み込まれている、リード線のガイド構造を特徴とする。
In order to solve the above problems, the present invention provides:
The protrusion provided on the key sheet of the elastic insulating material disposed on the one surface side of the key circuit board is penetrated through the through hole of the key circuit board and protrudes to the other surface side of the key circuit board.
A lead wire in which a lead wire of an electronic component disposed on the other surface side of the key circuit board is inserted and sandwiched in a groove formed in a protrusion of the protrusion to the other surface side of the key circuit board. It features a guide structure.
Claims (5)
前記突起の前記キー回路基板の他面側への突出部に形成された溝に、前記キー回路基板の他面側に配置された電子部品のリード線が挿入されて挟み込まれていることを特徴とするリード線のガイド構造。 The protrusion provided on the key sheet of the elastic insulating material disposed on the one surface side of the key circuit board is penetrated through the through hole of the key circuit board and protrudes to the other surface side of the key circuit board.
A lead wire of an electronic component disposed on the other surface side of the key circuit board is inserted and sandwiched in a groove formed in a protrusion of the protrusion to the other surface side of the key circuit board. Lead wire guide structure.
前記キー回路基板の外側にメイン回路基板の端子部が配置され、
前記リード線の一端が前記電子部品の端子部に半田付けされて、
前記リード線の他端が前記メイン回路基板の端子部に半田付けされていることを特徴とする請求項１に記載のリード線のガイド構造。 The electronic component is disposed on a part of the key circuit board,
The terminal part of the main circuit board is arranged outside the key circuit board,
One end of the lead wire is soldered to the terminal part of the electronic component,
The lead wire guide structure according to claim 1, wherein the other end of the lead wire is soldered to a terminal portion of the main circuit board.
前記複数の略平行する前記溝に前記リード線がそれぞれ挿入されて挟み込まれていることを特徴とする請求項１から３のいずれか一項に記載のリード線のガイド構造。 A plurality of the grooves are formed substantially parallel to the protrusion of the protrusion toward the other surface,
The lead wire guide structure according to any one of claims 1 to 3, wherein the lead wires are respectively inserted and sandwiched in the plurality of substantially parallel grooves.
前記キー回路基板と、
前記キーシートと、
前記リード線と、
当該キー回路基板、当該キーシート、及び、当該リード線が収容されるケースと、を備えることを特徴とする電子機器。 It has a guide structure according to any one of claims 1 to 4 ,
The key circuit board;
The key sheet;
The lead wire;
An electronic device comprising: the key circuit board, the key sheet, and a case in which the lead wire is accommodated .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013261068A JP6237198B2 (en) | 2013-12-18 | 2013-12-18 | Lead wire guide structure and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013261068A JP6237198B2 (en) | 2013-12-18 | 2013-12-18 | Lead wire guide structure and electronic device |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2015119024A JP2015119024A (en) | 2015-06-25 |
| JP2015119024A5 true JP2015119024A5 (en) | 2017-02-02 |
| JP6237198B2 JP6237198B2 (en) | 2017-11-29 |
Family
ID=53531520
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013261068A Active JP6237198B2 (en) | 2013-12-18 | 2013-12-18 | Lead wire guide structure and electronic device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP6237198B2 (en) |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5771380U (en) * | 1980-05-29 | 1982-04-30 | ||
| JPS61172420U (en) * | 1985-04-17 | 1986-10-27 | ||
| JPS6418787U (en) * | 1987-07-24 | 1989-01-30 | ||
| JPH03222217A (en) * | 1990-01-26 | 1991-10-01 | Casio Comput Co Ltd | Key switching device |
| US5952616A (en) * | 1995-09-22 | 1999-09-14 | Hughes Electronics Corporation | Cable retainer with retaining surfaces having offset protrusions |
| JPH10215084A (en) * | 1997-01-28 | 1998-08-11 | Yazaki Corp | Wiring board mounting structure |
-
2013
- 2013-12-18 JP JP2013261068A patent/JP6237198B2/en active Active
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