JP2015115732A - Module including irreversible circuit element - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a module including an irreversible circuit element such as an isolator capable of eliminating arrangement deviation of an electric component element due to a magnetic field of permanent magnets used for the irreversible circuit element.SOLUTION: A module includes: an isolator 3 to be an irreversible circuit element including permanent magnets 30, 31, a ferrite 32 joined to the permanent magnets 30, 31 and an external electrode 33A formed on a side face of the ferrite 32; an electric component element C31 including a magnetic substance; and a multilayer mounting substrate 2 for mounting the isolator 3 and the electric component element C31. The isolator 3 is arranged so that a direction of a magnetic field H of the permanent magnets 30, 31 is approximately perpendicular to the mounting surface of the multilayer mounting substrate 2. The external electrode 33A of the isolator 3 is electrically connected to the electric component element C31. The multilayer mounting substrate 2 has a recess 26 for the isolator which can mount the isolator 3 so that at least a part of the isolator 3 is stored.

Description

  The present invention relates to a module including an irreversible circuit element such as an isolator that allows a signal to pass only in a predetermined direction.

  As shown in FIG. 6, Patent Document 1 includes a non-reciprocal circuit element (isolator) 53 having a structure in which a pair of permanent magnets 53a and 53b are joined so as to sandwich a ferrite 53c having an external electrode 53d formed on its side surface. The module 51 is described.

  Since the isolator 53 has the permanent magnets 53 a and 53 b exposed to the outside, the magnetic field H of the permanent magnets 53 a and 53 b spreads outside the isolator 53. The direction of the magnetic field H of the permanent magnets 53 a and 53 b is substantially parallel to the mounting surface of the mounting substrate 52. Therefore, when another electrical component element 55 having an external electrode containing a metal such as Ni and disposed near the isolator 53 is mounted, the electrical component is affected by the magnetic field H of the permanent magnets 53a and 53b. There has been a problem that the element 55 is attracted to the permanent magnets 53a, 53b and mounted in an unintended direction.

  Therefore, in the module 51 of Patent Document 1, when the electrical component element 55 in the vicinity of the isolator 53 is mounted, the electrical component element 55 is placed in contact with the isolator 53 in advance, so that the mounting position shift of the electrical component element 55 is achieved. Was preventing.

JP 2012-70316 A

  However, in the module 51 of Patent Document 1, it is necessary to place the mounting electrode on the mounting board 52 for mounting the electrical component element 55 in the vicinity of the isolator 53 close to the isolator 53 with high accuracy. There was a problem that it was difficult to form.

  Further, when the isolator 53 and the electrical component element 55 are brought into contact with each other, variation such as complete contact or partial contact between the contact surfaces occurs due to variations in the dimensional finish accuracy of the components. There was a problem that the state could not be completely controlled. For this reason, in the case of partial contact, it is difficult to prevent displacement of the mounting of the electrical component element 55.

  Therefore, an object of the present invention is to provide a module including a nonreciprocal circuit element that can eliminate the displacement of electrical component elements due to the magnetic field of a permanent magnet used in a nonreciprocal circuit element such as an isolator. is there.

  The present invention relates to an isolator that is a non-reciprocal circuit element including a permanent magnet, a ferrite bonded to the permanent magnet, and an external electrode provided on a side surface of the ferrite, an electrical component element including a magnetic body, an isolator, and A mounting substrate provided with mounting electrodes for mounting electrical component elements, and the isolator is arranged so that the magnetic field direction of the permanent magnet is substantially perpendicular to the mounting surface of the mounting substrate, and the external electrode of the isolator And an electrical component element are electrically connected to each other, and the module includes a nonreciprocal circuit element.

  The magnetic field of the isolator is generated so as to penetrate the interface where the ferrite and the permanent magnet are joined. In the present invention, since the isolator is arranged so that the magnetic field direction of the permanent magnet is substantially perpendicular to the mounting surface of the mounting substrate, when other electrical component elements including a magnetic body are mounted, The influence of the magnetic field (magnetic flux) of the permanent magnet is suppressed, and the phenomenon that the electrical component element is attracted to the permanent magnet and tilted in an unintended direction and shifted in position is suppressed.

  Furthermore, since the isolator is disposed so that the magnetic field direction of the permanent magnet is substantially perpendicular to the mounting surface of the mounting board, the isolator is mounted in a state of being vertically installed on the mounting board. For this reason, the mounting area which an isolator occupies for a mounting board becomes small.

  According to another aspect of the present invention, there is provided a module including a nonreciprocal circuit device, wherein the mounting substrate has a recess for an isolator that can be mounted in a state where at least a part of the isolator is accommodated.

  In the present invention, since a part of the isolator is inserted into the recess for isolator provided on the mounting substrate, the module is reduced in height.

  Further, according to the present invention, the mounting substrate is a multilayer substrate, one end of the wiring pattern wired on the surface and / or inside of the mounting substrate is electrically connected to the electrical component element, and the other end is the recess for the isolator. Is connected to the external electrode of the isolator disposed in the isolator recess, and is connected to the position of the other end of the wiring pattern extended to the inner wall of the isolator recess. A module having a nonreciprocal circuit element, wherein the position of the external electrode of the isolator is substantially the same position in the thickness direction of the mounting substrate.

  In the present invention, since the position of the other end portion of the wiring pattern drawn out to the inner wall surface of the recess for the isolator and the position of the external electrode of the isolator are substantially the same position in the thickness direction of the mounting substrate, the external electrode of the isolator And the other end of the wiring pattern can be easily electrically connected.

  ADVANTAGE OF THE INVENTION According to this invention, the arrangement | positioning shift | offset | difference of the electrical component element by the magnetic field of the permanent magnet used for nonreciprocal circuit elements, such as an isolator, can be eliminated. Furthermore, since the isolator is mounted in a state where it is placed vertically with respect to the mounting substrate, the mounting area occupied by the isolator on the mounting substrate can be reduced.

  The above-described object, other objects, features, and advantages of the present invention will become more apparent from the following description of embodiments for carrying out the invention with reference to the drawings.

It is a top view which shows one Embodiment of the module provided with the nonreciprocal circuit device based on this invention. It is sectional drawing of the isolator mounting part vicinity seen from (alpha) direction of FIG. It is a perspective view which shows the mounting state of an isolator. It is sectional drawing which shows the modification of the isolator mounting part vicinity. It is a perspective view which shows the modification of an isolator. It is a top view which shows the module provided with the conventional nonreciprocal circuit element.

  An embodiment of a module including a nonreciprocal circuit device according to the present invention will be described.

  FIG. 1 is a plan view of a module including an isolator which is a non-reciprocal circuit device. FIG. 2 is a cross-sectional view of the vicinity of the isolator mounting portion viewed from the α direction of FIG.

  The module 1 is a power amplification module, and is used for a transmission circuit unit of a communication terminal such as a wireless LAN standard or Bluetooth (registered trademark) standard wireless communication device or mobile phone.

  As shown in FIG. 1, the module 1 includes a multilayer mounting board 2, isolators 3 and 4 having characteristics of transmitting signals only in a specific direction, an integrated circuit IC1 that controls transmission signals, filters FL1 and FL4, C71,... C71, inductors L1, L3, L17, and L57, and resistors R31 and R71, which are various electric component elements. The isolators 3 and 4 have transmission characteristics in different bands, and form a module 1 that can handle multiple bands.

  The multilayer mounting board 2 is made of resin, ceramic, or the like, and an inner layer electrode pattern 20 is formed between layers such as a resin layer or a ceramic layer. For example, the multilayer mounting substrate 2 is formed by stacking a plurality of ceramic green sheets on which the inner layer electrode patterns 20 are formed to form a laminate, and then firing the laminate.

  On the surface of the multilayer mounting substrate 2, mounting electrodes 24 and the like for surface mounting the integrated circuit IC1 and capacitors C2 and C4, which are various electric component elements, are formed. Further, the multilayer mounting board 2 is provided with isolator recesses 26 and 27 that can be mounted in a state where at least a part of each of the isolators 3 and 4 is accommodated.

  As shown in FIG. 2, the isolator 3 includes a pair of permanent magnets 30 and 31 and a ferrite 32, and the ferrite 32 is disposed between one magnetic pole of the permanent magnet 30 and a magnetic pole opposite to the permanent magnet 31. Has been. The configuration and mounting structure of the isolator 4 are substantially the same as those of the isolator 3 and the mounting structure, and thus detailed description thereof is omitted.

  The permanent magnets 30 and 31 and the ferrite 32 are integrally joined and formed in a rectangular parallelepiped shape as a whole. The magnetic field H of the permanent magnets 30 and 31 is generated so as to penetrate the interface where the ferrite 32 and the permanent magnets 30 and 31 are joined substantially vertically.

  Further, external electrodes 33A, 33B, and 33C of the isolator 3 are formed on one side surface of the ferrite 32. The external electrodes 33A, 33B, and 33C correspond to any of an input electrode, an output electrode, and a GND electrode of the isolator 3. The external electrodes 33A, 33B, and 33C are formed as a thin film of a conductive paste made of silver, copper, gold, an alloy thereof, or the like by a printing method or a transfer method. Further, these conductive pastes and photosensitive materials are mixed and formed using a processing technique such as a photolithography method or an etching method.

  As the material of the permanent magnets 30 and 31, strontium ferrite magnets and lanthanum / cobalt ferrite magnets that have excellent residual magnetic flux density and coercive force and excellent insulation (low loss) in the high frequency band are adopted. Is done.

  The capacitors C2, C4,... And the inductors L1, L3,..., Which are various electric component elements, are for forming a matching circuit necessary for forming the module 1, and are appropriately selected to be used for the multilayer mounting board 2. Implemented above. These various electric component elements include, for example, a magnetic material such as Ni in the external electrode and the internal electrode pattern.

  The isolator 3 is arranged so that the direction of the magnetic field H of the permanent magnets 30 and 31 is substantially perpendicular to the mounting surface of the multilayer mounting board 2. That is, the conventional horizontally placed isolator 53 shown in FIG. 6 is arranged in a state (vertically placed state) similar to the state in which the long side is rotated 90 degrees with the long side as a support shaft.

  Therefore, since the direction of the magnetic field H of the permanent magnets 30 and 31 is substantially perpendicular to the mounting surface of the multilayer mounting board 2, the capacitors C2, C4... And the inductors L1, L3, which are various electric component elements including a magnetic body. ,... Are mounted, the influence of the magnetic field H of the permanent magnets 30 and 31 is suppressed, and various electrical component elements are attracted to the permanent magnets 30 and 31 and are tilted in an unintended direction and shifted in position. It is possible to suppress the phenomenon that is implemented by.

  Furthermore, the isolator 3 is mounted in a state where it is placed vertically with respect to the multilayer mounting board 2. Therefore, the mounting area occupied by the isolator 3 in the multilayer mounting board 2 can be reduced as compared to the case where the isolator 3 is mounted horizontally as in the conventional isolator 53 shown in FIG.

  The isolator 3 is inserted into the isolator recess 26 provided on the multilayer mounting board 2, and a part of the isolator 3 is inserted into the isolator recess 26. Can be turned upside down. The isolator 3 is surface-mounted with a conductive adhesive or an insulating adhesive on the bottom surface of the isolator recess 26.

  More specifically, the depth of the recess 26 for the isolator is approximately half the height of the module 1. Therefore, in the module 1 mounted in the isolator recess 26, substantially half of the external electrodes 33A, 33B, and 33C can be reliably seen from the isolator recess 26. The opening size of the isolator recess 26 is designed to be slightly larger than the size in plan view when the isolator 3 is placed vertically so that the isolator 3 can be easily inserted.

  As shown in FIG. 1, the wiring pattern 20 wired inside the multilayer mounting board 2 is routed so as to be in the vicinity of the isolators 3 and 4. In FIG. 1, although the wiring pattern 20 is wired inside the multilayer mounting board 2, the wiring pattern 20 is displayed with a solid bold line.

  As shown in FIG. 2, one end portion of the wiring pattern 20 wired inside the multilayer mounting board 2 is electrically connected to an electrical component element (for example, a capacitor C31). The other end of the wiring pattern 20 is drawn out and exposed to the inner wall surface of the isolator recess 26. The position of the other end portion of the wiring pattern 20 drawn out to the inner wall surface of the recess 26 for the isolator and the position of each external electrode 33A, 33B, 33C of the isolator 3 are substantially the same position in the thickness direction of the multilayer mounting board 2. is there.

  The other end of the wiring pattern 20 drawn out to the inner wall surface of the isolator recess 26 and each external electrode 33A, 33B, 33C of the isolator 3 are electrically connected via the solder 22.

  In the present embodiment, the position of the other end of the wiring pattern 20 drawn out to the inner wall surface of the isolator recess 26 and the position of the external electrodes 33A, 33B, 33C of the isolator 3 are in the thickness direction of the multilayer mounting board 2. , The external electrodes 33A, 33B, 33C of the isolator 3 and the other end of the wiring pattern 20 can be easily electrically connected.

  Further, in the case of the conventional isolator 53 shown in FIG. 6, the external electrode is also disposed at the central portion on the mounting surface side of the isolator 53, so that there is a problem that the soldered state cannot be visually observed. However, in the present embodiment, since almost half of the external electrodes 33A, 33B, and 33C can be seen from the isolator recess 26, the soldered state can be surely seen.

  Note that the wiring pattern 20 does not necessarily have to be wired inside the multilayer mounting board 2. A wiring pattern 20a indicated by a dotted line in FIG.

  Further, as indicated by the alternate long and short dash line in FIG. 2, the module 1 molds the mounting surface of the multilayer mounting board 2 with the resin 42 after various electrical component elements such as the isolators 3 and 4 and the integrated circuit IC1 are mounted. It is preferable. The mold of the resin 42 improves the reliability of the module 1 and also allows the resin 42 to enter the isolator recess 26 and fix the isolator 3 with the resin 42, thereby improving the mounting reliability.

  FIG. 4 is a cross-sectional view showing a modification in the vicinity of the isolator mounting portion. The multilayer mounting board 2 is not provided with the recess 26 for the isolator, and the isolator 3 is surface-mounted on the multilayer mounting board 2 with a conductive adhesive or an insulating adhesive.

  In this case, the external electrodes 33A, 33B, and 33C of the isolator 3 are directly connected to external electrodes such as the capacitor C31 via the wires 44, or are mounted (connection) electrodes formed on the multilayer mounting board 2, respectively. Connect. Alternatively, another electrical component element in which a wiring pattern is formed is disposed in the vicinity of the isolator 3 and connected to the external electrodes 33A, 33B, and 33C of the isolator 3.

  FIG. 5 is a perspective view showing a modification of the isolator 3. In this isolator 3 A, external electrodes 33 A, 33 B, 33 C of the isolator 3 are formed on one side surface of the ferrite 32, and the external electrodes 33 A, 33 C are formed so as to also wrap around the end surface of the ferrite 32. Accordingly, the degree of freedom in routing the wiring pattern 20 is increased.

  In addition, this invention is not limited to the said embodiment, A various deformation | transformation is carried out within the range of the summary. For example, according to the specifications of the module 1, a multilayer mounting board 2 in which electrical component elements such as capacitors and coils are incorporated may be employed.

1 Module 2 Multilayer Mounting Board 3, 4 Isolator 30, 31 Permanent Magnet 32 Ferrite 20, 20a Wiring Pattern 24 Mounting Electrode 26, 27 Recess for Isolator 33A, 33B, 33C External Electrode 42 Resin 44 Wire H Magnetic Field IC1 Integrated Circuit FL1, FL4 Filter C2, C4, ... C31, ... C71 Capacitor L1, L3, L17, L57 Inductor R31, R71 Resistor

Claims (3)

An isolator that is a non-reciprocal circuit device including a permanent magnet, a ferrite bonded to the permanent magnet, and an external electrode provided on a side surface of the ferrite;
An electrical component element including a magnetic material;
A mounting substrate provided with mounting electrodes for mounting the isolator and the electrical component element,
The isolator is arranged so that the magnetic field direction of the permanent magnet is substantially perpendicular to the mounting surface of the mounting board,
The external electrode of the isolator and the electrical component element are electrically connected;
A module comprising a non-reciprocal circuit device.   2. The module having a nonreciprocal circuit device according to claim 1, wherein the mounting substrate has a recess for an isolator that can be mounted in a state where at least a part of the isolator is accommodated. 3.   The mounting board is a multilayer board, one end of a wiring pattern wired on the surface and / or inside of the mounting board is electrically connected to the electrical component element, and the other end is inside the recess for the isolator. The other end portion of the wiring pattern that is pulled out to the wall surface, is electrically connected to the external electrode of the isolator disposed in the isolator recess, and is extended to the inner wall surface of the isolator recess. The module having the nonreciprocal circuit device according to claim 2, wherein the position of the external electrode of the isolator and the position of the external electrode of the isolator are substantially the same position in the thickness direction of the mounting substrate.

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