JP2015115546A - Surface mounted component and manufacturing method therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a surface mounted component which allows for reduction in a range for forming solder paste on a wiring board, and to provide a manufacturing method therefor.SOLUTION: In a surface mounted component 10, a connector 14 is mounted, as a surface mounted component, on a wiring board 12. A plurality of terminals 12D are arranged on the side of the wiring board 12, and one terminals 12D are arranged closer to the connector 14 side than the other terminals 12D. A plurality of lead terminals 18A-18L are led out from the connector 14, and the tips thereof 20E, 22E, 24F are connected with a plurality of corresponding terminals 12D via a solder 26. The plurality of lead terminals 18A-18L are formed as one type having uniform heat capacity.

Description

  The present invention relates to a mounted product and a manufacturing method thereof.

  Patent Document 1 below discloses a board connector. In this board connector, a connector housing is fixed on a circuit board, and terminal fittings are press-fitted into the back wall of the connector housing. The terminal fitting is bent into an L shape toward the circuit board, and the tip of the terminal fitting is connected to a land (terminal) of the circuit board.

  Solder is used to connect the circuit board land and the terminal fitting. The solder is formed by the following procedure. First, a solder paste is printed on the circuit board land and its periphery. Next, a terminal fitting is inserted into the through hole at the center of the land. After the solder paste is melted by heat by solder reflow and drawn into the through hole, the solder paste is solidified by cooling to form solder for connecting the land and the terminal fitting.

  By the way, if there is a difference in heat capacity between the terminal fittings during solder reflow, the amount of solder paste drawn into the through hole (solder wettability) is small for terminal fittings with a small heat capacity and large for terminal fittings with a large heat capacity. . Therefore, it is necessary to make the amount of solder paste drawn uniform by separating the solder paste for each terminal fitting and defining the amount of solder paste drawn into the through hole. To realize this, it is necessary to form a space between the solder pastes, and the entire printing range of the solder paste is increased.

JP 2011-70827 A

  In view of the above facts, an object of the present invention is to provide a mounted product and a manufacturing method thereof capable of reducing the formation range of the solder paste on the wiring board.

  The mounted product according to the invention described in claim 1 is mounted on the wiring board on the side of the mounting component mounted on the wiring board, and one is positioned on the mounting component side than the other. It has a plurality of terminals, and a plurality of lead terminals that are drawn out from the mounting component, the tip portion is electrically connected to the terminals via solder, and all the heat capacities are made uniform.

  In the mounted product according to the first aspect, the mounting component is mounted on the wiring board. A plurality of terminals are arranged on the wiring board on the side of the mounted component. One of the plurality of terminals is arranged closer to the mounting component than the other. A lead terminal is drawn out from the mounting component, and the leading end of the lead terminal is electrically connected to a plurality of terminals via solder.

  Here, all the heat capacities of the plurality of lead terminals are made uniform. For this reason, even when the terminal and the lead terminal are electrically connected by melting the solder paste formed on the wiring board and drawing it into the tip of the lead terminal, the solder paste of each lead terminal The pull-in amount is made uniform. Therefore, it is not necessary to separate the solder paste for each terminal.

  In the mounted product according to the invention described in claim 2, in the mounted product according to claim 1, the first lead terminal which is the lead terminal is formed from the first lead portion drawn from the mount component and the first lead portion. The second lead terminal, which is a lead terminal adjacent to the first lead terminal, is pulled out from the mounting component on the side opposite to the wiring board of the first lead portion. The second lead portion and the second connection portion bent toward the wiring board side on the mounting component side than the first connection portion are provided.

  According to the mounted product according to claim 2, the first lead terminal which is the lead terminal includes the first lead portion and the first connection portion, and the second lead terminal adjacent to the first lead terminal is the second lead portion. A second connection portion. Here, the second lead portion is drawn from the side opposite to the wiring board of the mounting component than the first lead portion, and the terminal length of the second lead portion is shorter than the terminal length of the first lead portion. . On the other hand, the second connection part is formed closer to the mounting component than the first connection part, and the terminal length of the second connection part is longer than the terminal length of the first connection part. For this reason, since the overall terminal length of the first lead terminal and the overall terminal length of the second lead terminal can be made uniform, the heat capacity of the first lead terminal and the heat capacity of the second lead terminal can be easily made uniform. Can do.

  In the mounting product according to the invention described in claim 3, in the mounting product according to claim 2, the third lead terminal which is the lead terminal adjacent to the second lead terminal is the wiring board of the second lead portion. A third lead portion pulled out from the mounting component on the opposite side and a third connection portion bent toward the wiring board side on the mounting component side from the second connection portion are provided.

  According to the mounted product of the third aspect, the third lead portion is drawn from the side opposite to the wiring board of the mounting component from the second lead portion, and the terminal length of the third lead portion is the second lead portion. It is formed shorter than the terminal length. On the other hand, the third connection part is formed closer to the mounting component than the second connection part, and the terminal length of the third connection part is longer than the terminal length of the second connection part. For this reason, since the overall terminal length of the second lead terminal and the overall terminal length of the third lead terminal can be made uniform, the heat capacity of the second lead terminal and the heat capacity of the third lead terminal can be easily made uniform. Can do.

  In the mounted product according to the invention described in claim 4, in the mounted product according to any one of claims 1 to 3, the additional mounting component is mounted on the wiring board on the side of the plurality of terminals. Yes.

  According to the mounted product according to the fourth aspect, since it is not necessary to separate the solder paste for each terminal, the range in which the solder paste is formed on the wiring board is reduced. For this reason, since the separation distance between the mounted component and the additional mounted component is reduced, the degree of integration of the mounted product can be improved.

  According to a fifth aspect of the present invention, there is provided a method for manufacturing a mounted product, comprising: a plurality of terminals arranged on a wiring board at a side of a mounted component to be mounted; A step of forming a solder paste between the terminals, a step of mounting a mounting component on the wiring board, and abutting a plurality of lead terminals drawn out of the mounting component and having all heat capacities uniformed to the plurality of terminals; A step of melting the solder paste by solder reflow and then solidifying the solder paste to form solder that electrically connects the plurality of terminals and the plurality of lead terminals.

  In the mounted product manufacturing method according to the fifth aspect, a solder paste is formed on and between the terminals arranged on the wiring board. The plurality of terminals are disposed on the side of the mounted component to be mounted, and one of the plurality of terminals is disposed on the mounted component side with respect to the other. Next, a mounting component is mounted on the wiring board, and a plurality of lead terminals drawn out from the mounting component are brought into contact with the plurality of terminals. Next, after the solder paste is melted by solder reflow, the solder paste is solidified to form solder that electrically connects the plurality of terminals and the plurality of lead terminals.

  Here, all the heat capacities of the plurality of lead terminals are made uniform. For this reason, when the solder paste is melted and drawn into the lead terminals, the amount of solder paste drawn in each lead terminal is made uniform.

  The mounted product and the manufacturing method thereof according to the present invention have an excellent effect that the formation range of the solder paste on the wiring board can be reduced.

It is a side view of the mounted product which concerns on one embodiment of this invention. It is a principal part front view of the mounted product seen from the arrow A direction shown by FIG. FIG. 2 is a plan view of a mounted product viewed from the direction of arrow B shown in FIG. 1. FIG. 4 is an enlarged cross-sectional view of a main part of the mounted product shown in FIG. 1 as a main part surrounded by a broken line with reference numeral C and enlarged as a cross section taken along line DD in FIG. 3. It is process sectional drawing of the mounted goods which shows the printing process of the solder paste of the manufacturing method which concerns on one embodiment. It is a side view corresponding to FIG. 1 of the mounted product which concerns on a comparative example. FIG. 7 is a plan view corresponding to FIG. 3 of the mounted product shown in FIG. 6.

  Hereinafter, a mounted product and a manufacturing method thereof according to an embodiment of the present invention will be described with reference to FIGS. For convenience of explanation, an arrow X direction and an arrow Y direction shown in the drawing appropriately indicate directions orthogonal to each other on the same plane as the surface of the wiring board of the mounted product. An arrow Z direction indicates a direction orthogonal to the surface of the wiring board. However, the application direction of the mounted product with respect to a vehicle body such as an automobile is not limited.

(Configuration of mounted product)
As shown in FIGS. 1 to 3, the mounted product 10 according to the present embodiment includes a rectangular flat wiring board 12 in a plan view and connectors as mounting parts respectively mounted on a surface 12 </ b> A of the wiring board 12. 14 and electronic components 30 and 32 as additional mounting components. Although the function is not particularly limited, the mounted product 10 is constructed, for example, as a controller (power supply ECU) that switches the power supply of the vehicle. The mounted product 10 is constructed as a controller (immobilizer ECU) that determines whether or not the engine can be started by comparing an electronic ID incorporated in a key with an ID registered in a vehicle, for example.

  The wiring substrate 12 is formed of an insulating substrate such as an epoxy resin substrate or a ceramic substrate. A plurality of terminals (land terminals) 12D are arranged on the surface 12A on the side of the connector 14 of the wiring board 12. The plurality of terminals 12D are arranged at a constant interval P1 with the arrow X direction as one direction of arrangement as shown in FIG. 2 and FIG. 3, and as shown in FIG. 1, FIG. 3, and FIG. Are arranged so as to be shifted in the direction of arrow Y intersecting one direction. The amount of deviation in the arrow Y direction is a constant interval P2, but here the arrangement is such that the deviation start position returns to the original for every three terminals 12D in one direction. In other words, in the plurality of terminals 12D, one terminal 12D arranged on the rightmost side in the arrow X direction shown in FIG. 3 is arranged closer to the connector 14 than the other terminal 12D arranged second from the right. ing. In addition, the other terminal 12D arranged second is arranged closer to the connector 14 than the other terminal 12D arranged third.

  On the back surface 12B facing the front surface 12A of the wiring board 12, a plurality of terminals (land terminals) 12E correspond to each of the plurality of terminals 12D and coincide with each other in the thickness direction of the wiring board 12 in the arrow Z direction. Has been placed. In particular, as shown in FIG. 4, the wiring board 12 is provided with a through hole 12 </ b> C that penetrates the central part of the terminal 12 </ b> D arranged on the front surface 12 </ b> A and the central part of the terminal 12 </ b> E arranged on the wiring board 12 and the back surface 12 </ b> B. ing. A through-hole wiring 12F is provided on the inner wall of the through-hole 12C, and the terminal 12D on the front surface 12A and the terminal 12E on the back surface 12B are electrically connected by the through-hole wiring 12F. The plurality of terminals 12D and 12E and the through-hole wiring 12F are all formed mainly of a conductive material such as copper or copper alloy. If necessary, a conductive thin film such as Ni is formed on the surface of the conductive material, and the conductive thin film is configured to improve wettability with solder.

  The connector 14 is configured as a male connector, and is configured to be electrically connected to a female connector (not shown). As shown in FIGS. 1 to 4, the connector 14 includes a connector housing 16 having a terminal lead portion 16 </ b> B provided along an array of a plurality of terminals 12 </ b> D. The connector housing 16 is attached along one side of the wiring board 12. The connector housing 16 is formed in a bottomed rectangular tube shape having an opening 16A on the outer side of the wiring board 12 and a back wall which is a terminal lead portion 16B on the inner side opposite to the opening 16A. ing. As shown in FIG. 2, here, the opening 16 </ b> A has a rectangular shape that is long in the arrow X direction along the surface 12 </ b> A of the wiring board 12 and short in the arrow Z direction from the surface 12 </ b> A of the wiring board 12. The connector housing 16 is made of, for example, a synthetic resin material.

  As shown in FIGS. 1 to 4, a plurality of lead terminals 18 </ b> A to 18 </ b> L are drawn out from the terminal lead-out portion 16 </ b> B of the connector housing 16 corresponding to each of the plurality of terminals 12 </ b> D. More specifically, the plurality of lead terminals 18A to 18L are arranged at a constant interval P1 along this arrangement direction corresponding to the arrangement of the plurality of terminals 12D, and adjacent ones in the arrangement direction intersect with the arrangement direction. They are shifted in the arrow Z direction by a fixed interval P3. In the present embodiment, the first lead terminal 18A to the third lead terminal 18C in the arrangement direction are arranged in three stages toward the arrow Z direction. Similarly, the fourth lead terminal 18D to the twelfth lead terminal 18L are arranged every three stages. In other words, the first lead terminal 18A, the fourth lead terminal 18D, the seventh lead terminal 18G, and the tenth lead terminal 18J are arranged as the first lead terminals in the first stage from the bottom. . Further, the second lead terminal 18B, the fifth lead terminal 18E, the eighth lead terminal 18H, and the eleventh lead terminal 18K are arranged as the second lead terminals in the second stage of the middle stage. The third lead terminal 18C, the sixth lead terminal 18F, the ninth lead terminal 18I, and the twelfth lead terminal 18L are arranged as the third lead terminal at the third stage from the bottom. The fixed interval P3 is set to be the same as the fixed interval P2.

  As shown in FIG. 4, the first-stage lead terminal 18A and the like include a first lead portion 20A and a first connection portion 20D. The first lead portion 20A is horizontally disposed along the surface 12A of the wiring board 12. One end portion 20B of the first lead portion 20A is press-fitted into the terminal lead portion 16B and protrudes into the connector housing 16. Yes. A portion bent in an L shape toward the wiring board 12 at the other end portion 20C of the first lead portion 20A is defined as a first connection portion 20D. The front end portion 20E on the wiring board 12 side of the first connection portion 20D is inserted into the through hole 12C and electrically and mechanically connected to the terminal 12D via the solder 26. Since the connector 14 in the present embodiment is configured as a pin insertion type, the distal end portion 20E is electrically and mechanically connected to the through-hole wiring 12F and the terminal 12E in addition to the terminal 12D. Here, since the first lead portion 20A is set to the terminal length L1, and the first connection portion 20D is set to the terminal length L4, the overall terminal length of the first stage lead terminal 18A and the like is set to the terminal length L1. A value obtained by adding the terminal length L4.

  The second lead terminal 18B and the like drawn from the upper side opposite to the wiring board 12 of the terminal lead part 16B by a fixed interval P3 from the first lead terminal 18A and the like are connected to the second lead part 22A and the second lead part 18A. And a connecting portion 22D. The second lead portion 22A is arranged in parallel with the first lead portion 20A, and one end portion 22B of the second lead portion 22A is press-fitted into the terminal lead portion 16B and protrudes into the connector housing 16. The other end portion 22C of the second lead portion 22A is positioned closer to the terminal lead portion 16B than the other end portion 20C of the first lead portion 20A by a certain distance P2. A portion bent in an L shape toward the wiring board 12 at the other end 22C is a second connection portion 22D. A distal end portion 22E on the wiring board 12 side of the second connection portion 22D is inserted into the through hole 12C and electrically and mechanically connected to the terminal 12D via the solder 26. Here, the second lead portion 22A is set to a terminal length L2 shorter than the terminal length L1 of the first lead portion 20A by a constant interval P2, and the second connection portion 22D is constant than the terminal length L4 of the first connection portion 20D. The terminal length L5 is set longer by the interval P3. Therefore, the overall terminal length of the second stage lead terminal 18B and the like is a value obtained by adding the terminal length L5 to the terminal length L2, and this terminal length is the same as the terminal length of the first stage lead terminal 18A and the like. ing.

  The third stage lead terminal 18C and the like drawn from the upper side opposite to the wiring board 12 of the terminal lead part 16B by a constant interval P3 from the second stage lead terminal 18B and the like are connected to the third lead part 24A and the third lead part 18A. And a connecting portion 24D. The third lead portion 24A is arranged in parallel with the second lead portion 22A, and one end portion 24B of the third lead portion 24A is press-fitted into the terminal lead portion 16B and protrudes into the connector housing 16. The other end portion 24C of the third lead portion 24A is located on the terminal lead portion 16B side by a constant interval P2 further than the other end portion 22C of the second lead portion 22A. A portion bent in an L shape toward the wiring board 12 at the other end 24C is a third connection portion 24D. The tip 24E on the wiring board 12 side of the third connection 24D is inserted into the through hole 12C and is electrically and mechanically connected to the terminal 12D via the solder 26. Here, the third lead portion 24A is set to a terminal length L3 shorter than the terminal length L2 of the second lead portion 22A by a constant interval P2, and the third connection portion 24D is constant than the terminal length L5 of the second connection portion 22D. The terminal length L6 is set longer by the interval P3. Therefore, the overall terminal length of the third stage lead terminal 18C, etc. is a value obtained by adding the terminal length L6 to the terminal length L3, and this terminal length is the first stage lead terminal 18A etc. and the second stage lead terminal. It is the same as the terminal length such as 18B.

  Each of the plurality of lead terminals 18A to 18L has a circular cross section in the longitudinal direction and the same diameter in the entire longitudinal direction, and is formed of the same conductive material such as copper, copper alloy, or iron alloy. In addition, as described above, the plurality of lead terminals 18A to 18L are all formed with the same length because they are formed in the same length, although there are differences in the L-shape depending on the lead-out position from the terminal lead-out portion 16B. It is formed by volume. Thereby, all the heat capacities of the plurality of lead terminals 18A to 18L are made uniform. Here, the term “same” is used to mean that the same is included in the range, as well as the case where there is a variation in manufacturing or processing.

  As shown in FIGS. 1 and 3, in the present embodiment, electronic components 30 and 32 are mounted on the surface 12A of the wiring board 12 on the side opposite to the connector 14 of the plurality of terminals 12D. The electronic components 30 and 32 are, for example, semiconductor packages in which semiconductor chips that construct a controller are sealed. The connector 14 and the electronic components 30 and 32 are electrically connected through wiring (not shown) drawn from the plurality of terminals 12D (or 12E) to the surface 12A of the wiring board 12.

(Method for manufacturing mounted products)
A method for manufacturing the mounted product 10 according to the present embodiment, particularly a solder reflow method for mounting the connector 14 is as follows. First, as shown in FIG. 5, on the surface 12A of the wiring board 12, a solder paste 26P is formed on the plurality of terminals 12D and between the terminals 12D by printing. As shown in FIG. 3, the solder paste 26 </ b> P has a rectangular shape in a plan view in which one direction in which the plurality of terminals 12 </ b> D are arranged is a long direction and a direction intersecting the one direction is a short direction. In addition, the solder paste 26P is printed as one region having no space between adjacent terminals 12D. As shown in FIG. 3, a specified separation dimension L7 is required between the area where the solder paste 26P is printed and the electronic components 30 and 32 mounted on the surface 12A of the wiring board 12. By setting the separation dimension L7, a short circuit between the plurality of terminals 12D and the electronic components 30 and 32 due to the solder paste 26P is prevented.

  Next, the connector housing 16 of the connector 14 is attached to the surface 12A of the wiring board 12, and each of the plurality of lead terminals 18A to 18L led out from the terminal lead-out portion 16B of the connector housing 16 corresponds to the plurality of terminals 12D. It abuts on each. Since the connector 14 in the present embodiment is configured by a pin insertion type, the plurality of lead terminals 18A to 18L are respectively inserted into the through holes 12C at the center of the plurality of terminals 12D.

  Next, the solder paste 26P is exposed to a high temperature and melted by solder reflow, and then the temperature is lowered to solidify the solder paste 26P, thereby forming the solder 26 as shown in FIG. The solder paste 26P is drawn into the gaps between the plurality of lead terminals 18A to 18L, the plurality of terminals 12D, the through-hole wiring 12F, and the plurality of terminals 12E during solder reflow, and the solder 26 is formed in this state. Accordingly, the plurality of lead terminals 18A to 18L are electrically and mechanically connected to the plurality of terminals 12D, the through-hole wiring 12F, and the plurality of terminals 12E through the solder 26.

(Operation and effect of the present embodiment)
In the mounted product 10 according to the present embodiment, as shown in FIGS. 1 to 3, a connector 14 as a mounted component is mounted on the surface 12 </ b> A of the wiring board 12. A plurality of terminals 12 </ b> D are arranged on the surface 12 </ b> A of the wiring board 12 on the side of the connector 14. One of the terminals 12D is arranged closer to the connector 14 than the other. A plurality of lead terminals 18A to 18L are drawn out from the connector housing 16 of the connector 14, and the tip portions 20E, 22E, and 24E of the lead terminals 18A to 18L are electrically connected to the plurality of terminals 12D via the solder 26. Yes.

  Here, as shown in FIG. 4, since all of the plurality of lead terminals 18A to 18L are formed with the same terminal length and the same terminal diameter, they have the same volume, and The heat capacity is made uniform. That is, the plurality of lead terminals 18A to 18L of the connector 14 are formed of one type in which all the heat capacities are made uniform.

  6 and 7 show a mounted product 40 according to the comparative example. The mounted product 40 includes a wiring board 42, a connector 44 mounted on the surface 42 </ b> A of the wiring board 42, and electronic components 52 and 54. On the surface 42A of the wiring substrate 42, a plurality of terminals 42D arranged at regular intervals in the arrow X direction are arranged in two rows in the arrow Y direction. A plurality of lead terminals 48 </ b> A to 48 </ b> L are drawn from a terminal lead portion 46 </ b> B of the connector housing 46 of the connector 44. The lead terminals 48A to 48F in the first stage of the terminal lead part 46B are connected to the plurality of terminals 12D in the first row near the terminal lead part 46B via the solder 50 from the surface 42A of the wiring board 42 upward. Yes. The second lead terminals 48G to 48L of the terminal lead portion 46B are connected to the plurality of terminals 12D in the second row far from the terminal lead portion 46B via the solder 50. That is, the terminal lengths of the first-stage lead terminals 48A to 48F are different from the terminal lengths of the second-stage lead terminals 48G to 48L, and the plurality of lead terminals 48A to 48L are formed in two types having different heat capacities. . In the mounted product 40 according to the comparative example configured as described above, a difference in heat capacity is generated between the plurality of lead terminals 48A to 48L. Therefore, a difference occurs in the pull-in amount of the solder paste 56P in the solder reflow. Therefore, as shown in FIG. 7 by the two-dotted line, the printing range of the solder paste 56P is printed including the solder paste 56P printed on the first row of terminals 12D and the second row of terminals 12D. A space L8 is required between the solder paste 56P.

  In the mounting product 10 according to the present embodiment compared to the mounting product 40 according to the comparative example, all the heat capacities of the plurality of lead terminals 18A to 18L are made uniform, so that the plurality of terminals 12D and the plurality of lead terminals 18A to 18A are compared. The drawing amount of the solder paste 26P is made uniform at each connection point with 18L. For this reason, as shown in FIG. 3, it is not necessary to separate the solder paste 26P for each terminal 12D. In particular, in the solder paste 26P, the space in the arrow Y direction can be eliminated. Therefore, according to the mounted product 10 according to the present embodiment, the formation range of the solder paste 26P on the wiring board 12 can be reduced.

  Further, as shown in FIG. 4, in the mounted product 10 according to the present embodiment, the first lead terminal 18A as the first lead terminal of the plurality of lead terminals 18A to 18L is the first lead portion 20A. And a first connection portion 20D. The second lead terminal 18B and the like as the second lead terminal adjacent to the first lead terminal 18A and the like include a second lead portion 22A and a second connection portion 22D. Here, the second lead portion 22A is drawn from above the terminal lead portion 16B than the first lead portion 20A, and the terminal length L2 of the second lead portion 22A is shorter than the terminal length L1 of the first lead portion 20A. It is formed. On the other hand, the second connection part 22D is bent on the terminal lead part 16B side with respect to the first connection part 20D, and the terminal length L5 of the second connection part 22D is longer than the terminal length L4 of the first connection part 20D. Is done. For this reason, the overall terminal length of the first-stage lead terminal 18A and the like and the overall terminal length of the second-stage lead terminal 18B etc. can be made uniform. The heat capacity of the lead terminals 18B of the eyes and the like can be easily made uniform.

  Further, as shown in FIG. 4, the mounted product 10 according to the present embodiment includes a third-stage lead terminal 18 </ b> C as a third lead terminal, and the third-stage lead terminal 18 </ b> C has a third lead terminal 18 </ b> C. A lead-out part 24A and a third connection part 24D are provided. The third lead portion 24A is drawn from above the terminal lead portion 16B than the second lead portion 22A, and the terminal length L3 of the third lead portion 24A is shorter than the terminal length L2 of the second lead portion 22A. . On the other hand, the third connection portion 24D is bent closer to the terminal lead portion 16B than the second connection portion 22D, and the terminal length L6 of the third connection portion 24D is longer than the terminal length L5 of the second connection portion 22D. Is done. For this reason, the overall terminal length of the second-stage lead terminal 18B and the like and the overall terminal length of the third-stage lead terminal 18C and the like can be made uniform. The heat capacity of the lead terminals 18C of the eyes and the like can be easily made uniform.

  Further, in the mounted product 10 according to the present embodiment, it is not necessary to separate the solder paste 26P for each terminal 12D, as shown in FIG. That is, the formation range of the solder paste 26P on the wiring board 12 in the direction of arrow Y is reduced. Therefore, as shown in FIGS. 1 and 3, the electronic component 30 can be mounted in the direction of the arrow F, and the electronic component 32 can be mounted in the direction of the arrow G, both close to the connector 14. Accordingly, since the distance between the connector 14 and the electronic components 30 and 32 is reduced, the degree of integration of the mounted product 10 can be improved.

  Furthermore, in the manufacturing method of the mounted product 10 according to the present embodiment, all the heat capacities of the plurality of lead terminals 18A to 18L of the connector 14 are made uniform. Therefore, as shown in FIG. 4, when the solder paste 26P is melted by the solder reflow and drawn into the lead terminals 18A to 18L, the amount of the solder paste 26P drawn in the lead terminals 18A to 18L becomes uniform. Is done.

[Supplementary explanation of the above embodiment]
The present invention is not limited to the above-described embodiment, and can be modified as follows, for example, without departing from the scope of the invention. In the above embodiment, the connector has 12 lead terminals, but the number of lead terminals is not limited. In addition, since the present invention only requires one type in which the heat capacity of the lead terminals of the connector is uniform, a lead terminal having a large terminal diameter and a short terminal length and a lead terminal having a small terminal diameter and a long terminal length are provided. May be. Furthermore, in the present invention, the cross-sectional shape of the lead terminal may be elliptical, rectangular, polygonal or the like. Further, although the connector in the above embodiment is a pin insertion type, the present invention may be a surface mount type in which the lead terminal of the connector is in a gull wing shape (L shape), a J shape or the like.

  Furthermore, although the said embodiment demonstrated the example which mounted the connector on the wiring board as a mounting component, this invention may be electronic components, such as a semiconductor package, a resistive element, and a capacitive element, as a mounting component. Moreover, in the said embodiment, although the non-flexible board | substrate is used as a wiring board, this invention may be applied to a flexible board | substrate as a wiring board.

10 Mounted Product 12 Wiring Board 12D Terminal 14 Connector (Mounted Component)
16 Connector Housing 16B Terminal Leader 18A-18L Lead Terminal 20A First Leader 20D First Connector 22A Second Leader 22D Second Connector 24A Third Leader 24D Third Connector 26 Solder 26P Solder Paste 30, 32 Electronic parts (additional mounting parts)

Claims (5)

A mounting component mounted on a wiring board;
A plurality of terminals arranged on the wiring board on the side of the mounting component and one of the terminals arranged on the mounting component side than the other,
A plurality of lead terminals that are drawn out from the mounting component, the tip portion is electrically connected to the terminal via solder, and all the heat capacities are made uniform,
Mounting product with   The first lead terminal, which is the lead terminal, includes a first lead portion pulled out from the mounting component, and a first connection portion bent from the first lead portion toward the wiring board, The second lead terminal, which is the lead terminal adjacent to the lead terminal, has a second lead portion drawn from the mounting component on the opposite side of the first lead portion from the wiring board, and more than the first connection portion. The mounted product according to claim 1, further comprising a second connection portion bent toward the wiring board side on the mounting component side.   The third lead terminal, which is the lead terminal adjacent to the second lead terminal, is connected to the third lead portion drawn from the mounting component on the opposite side of the second lead portion from the wiring board, and the second connection. The mounted product according to claim 2, further comprising a third connection portion bent toward the wiring board side on the mounting component side than the portion.   The mounted product according to any one of claims 1 to 3, wherein an additional mounting component is mounted on a side of the plurality of terminals on the wiring board. Forming a solder paste on a plurality of terminals arranged between the terminals and disposed on the wiring board on the side of the mounted component to be mounted, and one is arranged on the mounting component side than the other;
Mounting a mounting component on the wiring board, and abutting a plurality of lead terminals drawn out from the mounting component and having a uniform heat capacity to the plurality of terminals;
A step of forming solder to electrically connect the plurality of terminals and the plurality of lead terminals after the solder paste is melted by solder reflow to solidify the solder paste;
A method for manufacturing a mounted product comprising:

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