JP2015092644A - Electronic apparatus having waterproof structure - Google Patents

Electronic apparatus having waterproof structure Download PDF

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Publication number
JP2015092644A
JP2015092644A JP2012038449A JP2012038449A JP2015092644A JP 2015092644 A JP2015092644 A JP 2015092644A JP 2012038449 A JP2012038449 A JP 2012038449A JP 2012038449 A JP2012038449 A JP 2012038449A JP 2015092644 A JP2015092644 A JP 2015092644A
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Japan
Prior art keywords
case
housing
waterproof structure
foaming agent
electronic device
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JP2012038449A
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Japanese (ja)
Inventor
修司 山下
Shuji Yamashita
修司 山下
武彦 山下
Takehiko Yamashita
武彦 山下
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Panasonic Corp
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Panasonic Corp
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Priority to JP2012038449A priority Critical patent/JP2015092644A/en
Priority to PCT/JP2013/000141 priority patent/WO2013125154A1/en
Publication of JP2015092644A publication Critical patent/JP2015092644A/en
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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1656—Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0266—Details of the structure or mounting of specific components for a display module assembly
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/18—Telephone sets specially adapted for use in ships, mines, or other places exposed to adverse environment

Abstract

PROBLEM TO BE SOLVED: To provide an electronic apparatus capable of preventing water from entering using a small space.SOLUTION: The electronic apparatus has a housing which is constituted of a first case 1 and a second case 2 and has a waterproof structure for preventing liquid from entering inside the housing. The housing is constituted of the first case 1 and the second case 2 each having a contact part 1a, 2a, which are brought into contact to fit with each other. The contact parts 1a and 2a are arranged to seal being bonded with an adhesive 12 containing a heat-foaming material. A heat generator 13 is disposed between the contact part 1a and 2a. When the housing is disassembled, the contact parts 1a and 2a are peeled off from each other by foaming the heat-foaming material contained in the adhesive 12 using the heat generator 13.

Description

本発明は、屋外や水辺付近での使用頻度が多い携帯端末装置や小型液晶表示装置などの内部への液体侵入を防ぐ防水構造を備えた電子機器に関する。   The present invention relates to an electronic apparatus having a waterproof structure that prevents liquid from entering the interior of a portable terminal device or a small liquid crystal display device that is frequently used outdoors or near water.

近年、携帯端末装置や小型液晶表示装置などの電子機器においては、筐体を２つの部材で構成し、その接合部にパッキン材を挟持し、ねじで締結することにより筐体内部への液体侵入を防ぐ防水構造を備えた構造としている（例えば特許文献１参照）。   In recent years, in an electronic device such as a portable terminal device or a small liquid crystal display device, a casing is composed of two members, a packing material is sandwiched between the joint portions, and a liquid is entered into the casing by fastening with screws. It is set as the structure provided with the waterproof structure which prevents (for example, refer patent document 1).

特開２０１０−１０９７６８号公報JP 2010-109768 A

このような従来の構成では、複数本のねじ締結部を必要とするため、筐体内部に多数のボスを配置する構造となり、小型化の弊害となっていた。   In such a conventional configuration, since a plurality of screw fastening portions are required, a structure in which a large number of bosses are arranged inside the housing is an adverse effect of downsizing.

本発明はこのような課題に鑑みなされたもので、小スペースで防水性を実現させることを目的とする。   The present invention has been made in view of such problems, and an object thereof is to realize waterproofness in a small space.

このような課題を解決するために本発明は、第１ケースと第２ケースとからなる筐体を有し、前記筐体内部への液体侵入を防ぐ防水構造を備えた電子機器であって、前記筐体の第１ケースと第２ケースは、互いに当接して嵌り合う当接部を有し、前記当接部は熱発泡剤含有接着材により接着して密閉構造を形成したことを特徴とする。   In order to solve such a problem, the present invention is an electronic device having a waterproof structure that has a casing made up of a first case and a second case and prevents liquid from entering the casing, The first case and the second case of the housing have an abutting portion that abuts and fits to each other, and the abutting portion is bonded by a thermal foaming agent-containing adhesive to form a sealed structure. To do.

本発明によれば、筐体の第１ケースと第２ケースは、互いに当接して嵌り合う当接部を有し、前記当接部は熱発泡剤含有接着材により接着して密閉構造を形成したことにより、小スペースで防水性を実現させることができ、また解体時は熱発泡剤含有接着材を加熱することにより、熱発泡剤含有接着材を発泡させて第１ケースと第２ケースを容易に分解することが可能となる。   According to the present invention, the first case and the second case of the housing have a contact portion that contacts and fits each other, and the contact portion is bonded by the thermal foaming agent-containing adhesive to form a sealed structure. As a result, waterproofing can be realized in a small space, and at the time of dismantling, the thermal foaming agent-containing adhesive is foamed by heating the thermal foaming agent-containing adhesive so that the first case and the second case are separated. It can be easily disassembled.

本発明の一実施の形態による電子機器の要部構造を示す断面図Sectional drawing which shows the principal part structure of the electronic device by one embodiment of this invention 同電子機器の分解斜視図Exploded perspective view of the same electronic device 同電子機器を組み立てる際の様子を示す断面図Sectional view showing how the electronic equipment is assembled 本発明の他の実施の形態による電子機器の要部構造を示す断面図Sectional drawing which shows the principal part structure of the electronic device by other embodiment of this invention 同電子機器の分解斜視図Exploded perspective view of the same electronic device

以下、本発明の一実施の形態による電子機器について、液晶表示装置を用いた携帯型電子機器を例にとって図面を参照しながら説明する。   Hereinafter, an electronic apparatus according to an embodiment of the present invention will be described with reference to the drawings, taking a portable electronic apparatus using a liquid crystal display device as an example.

図１は本発明の一実施の形態による携帯型電子機器の要部構造を示す断面図であり、図２はその携帯型電子機器の分解斜視図である。   FIG. 1 is a cross-sectional view showing a main structure of a portable electronic device according to an embodiment of the present invention, and FIG. 2 is an exploded perspective view of the portable electronic device.

図１、図２に示すように、筐体は、非磁性体の樹脂などの電気絶縁性材料からなる第１ケース１と第２ケース２とから構成されている。前記第１ケース１には、上面部に凹部による収納空間３が設けられ、その収納空間３には液晶表示装置４が両面接着テープ５により固定されて配置されている。また、液晶表示装置４上には、前記収納空間３の開口を塞ぐように保護パネル６が配置されている。この保護パネル６は、第１ケース１の収納空間３の周縁部に設けた段差部３ａに、保護パネル６の外周部を接着することにより配置されている。   As shown in FIGS. 1 and 2, the housing is composed of a first case 1 and a second case 2 made of an electrically insulating material such as a non-magnetic resin. The first case 1 is provided with a storage space 3 formed of a concave portion on the upper surface portion, and a liquid crystal display device 4 is fixed to the storage space 3 by a double-sided adhesive tape 5. A protective panel 6 is disposed on the liquid crystal display device 4 so as to close the opening of the storage space 3. The protective panel 6 is disposed by bonding the outer peripheral portion of the protective panel 6 to the step portion 3 a provided at the peripheral edge portion of the storage space 3 of the first case 1.

前記第２ケース２には、前記第１ケース１とともに、防水構造の密閉空間を形成する収納空間７が設けられ、その収納空間７には電子回路基板８や電池９が配置されている。前記電子回路基板８は、前記収納空間７に設けた突起１０にねじ１１によりねじ止めされて固定され、前記電池９は、収納空間７の底部に両面接着テープ５により固定されることにより配置されている。   In the second case 2, together with the first case 1, a storage space 7 that forms a sealed space with a waterproof structure is provided. In the storage space 7, an electronic circuit board 8 and a battery 9 are arranged. The electronic circuit board 8 is fixed by being screwed to a protrusion 10 provided in the storage space 7 with a screw 11, and the battery 9 is arranged by being fixed to the bottom of the storage space 7 with a double-sided adhesive tape 5. ing.

前記第１ケース１と第２ケース２は、互いに当接する当接部１ａ、２ａを有し、前記当接部１ａ、２ａにおいて、熱発泡剤含有接着材１２により接着して密閉構造を形成している。また、前記第１ケース１の当接部１ａには環状の凹部１ｂが設けられ、第２ケース２の当接部２ａには、前記凹部１ｂに嵌り合う環状の突条部２ｂが設けられている。さらに、前記当接部１ａ、２ａには、発熱体１３が凹部１ｂの底部に配置することにより設けられており、そしてその発熱体１３を覆うように熱発泡剤含有接着材１２を凹部１ｂに充填するとともに、その熱発泡剤含有接着材１２により第１ケース１と第２ケース２とを、当接部１ａ、２ａにおいて接着している。   The first case 1 and the second case 2 have contact portions 1a and 2a that contact each other, and the contact portions 1a and 2a are adhered by a thermal foaming agent-containing adhesive 12 to form a sealed structure. ing. The abutting portion 1a of the first case 1 is provided with an annular recess 1b, and the abutting portion 2a of the second case 2 is provided with an annular ridge 2b that fits into the recess 1b. Yes. Further, the contact portions 1a and 2a are provided with a heating element 13 disposed at the bottom of the recess 1b, and a thermal foaming agent-containing adhesive 12 is provided in the recess 1b so as to cover the heating element 13. While filling, the first case 1 and the second case 2 are bonded to each other at the contact portions 1a and 2a by the thermal foaming agent-containing adhesive material 12.

ここで、前記発熱体１３は、前記第１ケース１及び前記第２ケース２を形成する材料より熱変形温度が高いステンレスや鋼板などの磁性材料からなる金属材料で構成され、外部からの電磁誘導加熱により発熱するものである。   Here, the heating element 13 is made of a metal material made of a magnetic material such as stainless steel or a steel plate having a higher thermal deformation temperature than the material forming the first case 1 and the second case 2, and electromagnetic induction from the outside. It generates heat when heated.

また、前記熱発泡剤含有接着材１２の熱発泡温度は、第１ケース１及び第２ケース２を形成する材料の熱変形温度より低く設定している。なお、前記熱発泡剤含有接着材１２は、防水性を持たせるためシリコン系の接着材をベースに作製したものを使用している。また、前記熱発泡剤含有接着材１２において、熱発泡剤としては、常温で液体または固体の物質をマイクロカプセル化したもの、熱により物質がガス化するものなどがあり、常温で液体または固体の物質をマイクロカプセル化したものには、有機溶剤をマイクロカプセル化したものがある。また、熱により物質がガス化するものには、無機系と有機系があり、無機系発泡剤としては炭酸アンモニウム、炭酸水素アンモニウム、炭酸水素ナトリウム、亜硝酸アンモニウム、水素化ホウ素ナトリウム、アジト類などがある。一方有機系発泡剤としては、水、トリクロロモノフルオロメタンやジクロロモノフルオロメタンなどのハロゲン化フッ素化合物、アゾビスイソブチロニトリルやアゾジカルボンアミド、バリウムアゾジカルボキシレートなどのアゾ系化合物、パラトルエンスルホニルヒドラジドやジフェニルスルフォン−３，３′−ジスルホニルヒドラジド、４，４′−オキシビス（ベンゼンスルフォニルヒドラジド）、アリルビス（スルホニルヒドラジド）などのヒドラジン系化合物、Ｐ−トルイレンスルホニルセミカルバジドや４，４′−オキシビス（ベンゼンスルホニルセミカルバジド）などのセミカルバジド系化合物、５−モルホリル−１，２，３，４−チアトリアゾールなどのトリアゾール系化合物、Ｎ，Ｎ′−ジニトロソペンタメチレンテトラミンやＮ，Ｎ′−ジメチル−Ｎ，Ｎ′−ニトロソテレフタルアミドなどのＮ−ニトロソ系化合物等が挙げられる。   The thermal foaming temperature of the thermal foaming agent-containing adhesive 12 is set lower than the thermal deformation temperature of the material forming the first case 1 and the second case 2. The thermal foaming agent-containing adhesive 12 is made of a silicon-based adhesive as a base for providing waterproofness. In the thermal foaming agent-containing adhesive 12, examples of the thermal foaming agent include microcapsules of a liquid or solid substance at room temperature, those in which the substance is gasified by heat, and the like. A material obtained by microencapsulating a substance includes a material obtained by microencapsulating an organic solvent. In addition, substances that are gasified by heat include inorganic and organic types, and examples of inorganic foaming agents include ammonium carbonate, ammonium hydrogen carbonate, sodium hydrogen carbonate, ammonium nitrite, sodium borohydride, and azides. is there. On the other hand, organic foaming agents include water, halogenated fluorine compounds such as trichloromonofluoromethane and dichloromonofluoromethane, azo compounds such as azobisisobutyronitrile, azodicarbonamide, barium azodicarboxylate, and paratoluene. Hydrazine compounds such as sulfonyl hydrazide, diphenylsulfone-3,3′-disulfonyl hydrazide, 4,4′-oxybis (benzenesulfonyl hydrazide), allyl bis (sulfonyl hydrazide), P-toluylene sulfonyl semicarbazide and 4,4′- Semicarbazide compounds such as oxybis (benzenesulfonylsemicarbazide), triazole compounds such as 5-morpholyl-1,2,3,4-thiatriazole, N, N′-dinitrosopentamethylenetetrami And N, N'- dimethyl -N, N-nitroso compounds such as N'- dinitrosoterephthalamide, and the like.

以上のように本発明においては、第１ケース１と第２ケース２とからなる筐体を有し、前記筐体内部への液体侵入を防ぐ防水構造を備え、そして前記筐体の第１ケース１と第２ケース２は、互いに当接して嵌り合う当接部１ａ、２ａを有し、前記当接部１ａ、２ａは熱発泡剤含有接着材１２により接着して密閉構造を形成したものである。   As described above, according to the present invention, the housing includes the first case 1 and the second case 2, and includes a waterproof structure that prevents liquid from entering the inside of the housing. The first case 2 and the second case 2 have contact portions 1a and 2a that contact and fit with each other, and the contact portions 1a and 2a are bonded by a thermal foaming agent-containing adhesive 12 to form a sealed structure. is there.

このような本発明の電子機器においては、電磁誘導加熱装置を用いて外部より発熱体１３を発熱させることにより、熱発泡剤含有接着材１２が発泡温度以上になると、図３に示すように、前記熱発泡剤含有接着材１２が膨張または発泡し、第１ケース１と第２ケース２とを密閉して接着していた当接部１ａ、２ａが剥がれることとなり、容易に解体することができる。また、解体後、第１ケース１と第２ケース２とを再度接着したい場合は、熱発泡剤含有接着材１２を塗布して接着すればよい。   In such an electronic device of the present invention, when the heat-foaming agent-containing adhesive 12 is at a foaming temperature or higher by causing the heating element 13 to generate heat from the outside using an electromagnetic induction heating device, as shown in FIG. The thermal foaming agent-containing adhesive 12 expands or foams, and the contact portions 1a and 2a that have sealed and bonded the first case 1 and the second case 2 are peeled off, and can be easily disassembled. . Further, when it is desired to bond the first case 1 and the second case 2 again after disassembly, the thermal foaming agent-containing adhesive 12 may be applied and bonded.

すなわち、ねじなどを用いることなく、第１ケース１と第２ケース２からなる筐体の防水構造を実現することができ、これにより少ないスペースで防水構造を実現することができる。   That is, it is possible to realize a waterproof structure of the casing made up of the first case 1 and the second case 2 without using screws and the like, thereby realizing a waterproof structure in a small space.

図４は本発明の他の実施の形態による携帯型電子機器の要部構造を示す断面図であり、図５はその携帯型電子機器の分解斜視図である。   FIG. 4 is a cross-sectional view showing the main structure of a portable electronic device according to another embodiment of the present invention, and FIG. 5 is an exploded perspective view of the portable electronic device.

この図４、図５に示す実施の形態においては、第２ケース２の開口部に第１ケース１を嵌め合わせる構造とし、第１ケース１の外周部１ｃと第２ケース２の内周部２ｃとにそれぞれ当接部１ａ、２ａを形成したものである。そして、その当接部１ａ、２ａ上に熱発泡剤含有接着材１２を塗布して、第１ケース１と第２ケース２とを接着することにより密閉して防水構造を実現したものである。   In the embodiment shown in FIGS. 4 and 5, the first case 1 is fitted into the opening of the second case 2, and the outer peripheral portion 1 c of the first case 1 and the inner peripheral portion 2 c of the second case 2. Are formed with contact portions 1a and 2a, respectively. And the thermal foaming agent containing adhesive material 12 is apply | coated on the contact parts 1a and 2a, the 1st case 1 and the 2nd case 2 are adhere | attached, and it seals and implement | achieves a waterproof structure.

また、当接部１ａ、２ａに塗布した熱発泡剤含有接着材１２上に、環状の金属材料からなる発熱体１３を被せるように配置したものである。   Moreover, it arrange | positions so that the heat generating body 13 which consists of cyclic | annular metal material may be covered on the thermal foaming agent containing adhesive material 12 apply | coated to contact part 1a, 2a.

この実施の形態の電子機器においても、電磁誘導加熱装置を用いて外部より発熱体１３を発熱させることにより、熱発泡剤含有接着材１２が発泡温度以上になると、熱発泡剤含有接着材１２が膨張または発泡し、第１ケース１と第２ケース２とを密閉して接着していた当接部１ａ、２ａが剥がれることとなり、容易に解体することができる。   Also in the electronic device of this embodiment, when the heat-foaming agent-containing adhesive 12 becomes equal to or higher than the foaming temperature by heating the heating element 13 from the outside using an electromagnetic induction heating device, the heat-foaming-agent-containing adhesive 12 is The abutting portions 1a and 2a that have expanded or foamed and sealed and bonded the first case 1 and the second case 2 are peeled off, and can be easily disassembled.

上記実施の形態においては、第１ケース１と第２ケース２の当接部１ａ、２ａに発熱体１３を配置し、電磁誘導加熱装置を用いて外部より発熱体１３を発熱させることにより、熱発泡剤含有接着材１２の発泡剤を発泡させる構成としたが、第１ケース１と第２ケース２の当接部１ａ、２ａに発熱体１３を設けずに、外部より熱風などを当てて熱発泡剤含有接着材１２の発泡剤を発泡させる構成としてもよい。   In the above embodiment, the heating element 13 is disposed at the contact portions 1a, 2a of the first case 1 and the second case 2, and the heating element 13 is heated from the outside by using an electromagnetic induction heating device. Although the foaming agent of the foaming agent-containing adhesive 12 is configured to foam, the heat is not applied to the contact portions 1a and 2a of the first case 1 and the second case 2 by applying hot air or the like from the outside. The foaming agent of the foaming agent-containing adhesive 12 may be configured to foam.

以上のように本発明によれば、第１ケース１と第２ケース２とからなる筐体を有し、前記筐体内部への液体侵入を防ぐ防水構造を備えた電子機器であって、前記筐体の第１ケース１と第２ケース２は、互いに当接して嵌り合う当接部１ａ、２ａを有し、前記当接部１ａ、２ａは熱発泡剤含有接着材１２により接着して密閉構造を形成したものであり、小スペースで防水性を実現させることができ、また解体時は熱発泡剤含有接着材１２を加熱することにより、熱発泡剤含有接着材１２を発泡させて第１ケース１と第２ケース２を容易に分解することが可能となる。   As described above, according to the present invention, there is provided an electronic apparatus having a waterproof structure that includes a casing including the first case 1 and the second case 2 and prevents liquid from entering the casing. The first case 1 and the second case 2 of the housing have contact portions 1a and 2a that contact and fit with each other, and the contact portions 1a and 2a are adhered and sealed with a thermal foaming agent-containing adhesive material 12. The structure is formed, waterproofing can be realized in a small space, and the heat-foaming agent-containing adhesive material 12 is foamed by heating the heat-foaming-agent-containing adhesive material 12 at the time of disassembly. The case 1 and the second case 2 can be easily disassembled.

以上のように本発明によれば、小型の電子機器の防水構造を実現する上で有用な発明である。   As described above, according to the present invention, the invention is useful for realizing a waterproof structure for a small electronic device.

１ 第１ケース
２ 第２ケース
１ａ、２ａ 当接部
３、７ 収納空間
４ 液晶表示装置
５ 両面接着テープ
６ 保護パネル
８ 電子回路基板
９ 電池
１０ 突起
１１ ねじ
１２ 熱発泡剤含有接着材
１３ 発熱体 DESCRIPTION OF SYMBOLS 1 1st case 2 2nd case 1a, 2a Contact part 3, 7 Storage space 4 Liquid crystal display device 5 Double-sided adhesive tape 6 Protection panel 8 Electronic circuit board 9 Battery 10 Protrusion 11 Screw 12 Thermal foaming agent containing adhesive material 13 Heating element

Claims (4)

第１ケースと第２ケースとからなる筐体を有し、前記筐体内部への液体侵入を防ぐ防水構造を備えた電子機器であって、前記筐体の第１ケースと第２ケースは、互いに当接して嵌り合う当接部を有し、前記当接部は熱発泡剤含有接着材により接着して密閉構造を形成したことを特徴とする防水構造を備えた電子機器。 An electronic device having a housing composed of a first case and a second case and having a waterproof structure that prevents liquid from entering the housing, wherein the first case and the second case of the housing are: An electronic device having a waterproof structure, wherein the electronic device has a contact portion that is fitted in contact with each other, and the contact portion is bonded by a thermal foaming agent-containing adhesive to form a sealed structure. 前記当接部に発熱体を配置したことを特徴とする請求項１記載の防水構造を備えた電子機器。 The electronic device having a waterproof structure according to claim 1, wherein a heating element is disposed in the contact portion. 前記発熱体は、前記第１ケース及び前記第２ケースを形成する材料より熱変形温度が高い材料で形成したことを特徴とする請求項２記載の防水構造を備えた電子機器。 3. The electronic device with a waterproof structure according to claim 2, wherein the heating element is made of a material having a higher thermal deformation temperature than a material forming the first case and the second case. 前記熱発泡剤含有接着材の熱発泡温度は、筐体の第１ケース及び第２ケースを形成する材料の熱変形温度より低く設定したことを特徴とする請求項１記載の防水構造を備えた電子機器。 2. The waterproof structure according to claim 1, wherein a thermal foaming temperature of the thermal foaming agent-containing adhesive is set lower than a thermal deformation temperature of a material forming the first case and the second case of the housing. Electronics.
JP2012038449A 2012-02-24 2012-02-24 Electronic apparatus having waterproof structure Pending JP2015092644A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018021701A1 (en) * 2016-07-29 2018-02-01 Samsung Electronics Co., Ltd. Electronic device including waterproof structure
US11374606B2 (en) * 2018-12-06 2022-06-28 Samsung Electronics Co., Ltd. Electronic device having waterproof structure

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Publication number Priority date Publication date Assignee Title
WO2018120418A1 (en) * 2016-12-27 2018-07-05 华为技术有限公司 Mounting structure of display screen, electronic device, and method for mounting display screen
CN111107724A (en) * 2019-12-17 2020-05-05 速珂智能科技（上海）有限公司 Waterproof controller shell

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DE102004050949A1 (en) * 2004-10-18 2006-04-20 Tesa Ag Process for recycling electronic components
JP5061890B2 (en) * 2007-12-27 2012-10-31 富士通株式会社 Electronic equipment housing
JP5173753B2 (en) * 2008-11-11 2013-04-03 日東電工株式会社 Dismantling structure, electrical and non-electrical equipment having dismantling structure, and disassembling method
JP2010177507A (en) * 2009-01-30 2010-08-12 Hitachi Automotive Systems Ltd Box type electronic module

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018021701A1 (en) * 2016-07-29 2018-02-01 Samsung Electronics Co., Ltd. Electronic device including waterproof structure
CN107666806A (en) * 2016-07-29 2018-02-06 三星电子株式会社 Electronic equipment including waterproof construction
US10134540B2 (en) 2016-07-29 2018-11-20 Samsung Electronics Co., Ltd. Electronic device including waterproof structure
US11374606B2 (en) * 2018-12-06 2022-06-28 Samsung Electronics Co., Ltd. Electronic device having waterproof structure

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