JP2015082589A - Crimping metal fitting - Google Patents

Crimping metal fitting Download PDF

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JP2015082589A
JP2015082589A JP2013220055A JP2013220055A JP2015082589A JP 2015082589 A JP2015082589 A JP 2015082589A JP 2013220055 A JP2013220055 A JP 2013220055A JP 2013220055 A JP2013220055 A JP 2013220055A JP 2015082589 A JP2015082589 A JP 2015082589A
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crimping
circuit board
flexible circuit
plate portion
lower plate
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敏明 葛西
Toshiaki Kasai
敏明 葛西
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Fujikura Ltd
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Fujikura Ltd
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Abstract

PROBLEM TO BE SOLVED: To reliably bring conductor circuits on both sides of a flexible circuit board into conduction.SOLUTION: A crimping metal fitting 1 comprises: a lower plate part 10 having a first connection protrusion 11 which comes into contact with a conductor 92 formed on one side of a flexible circuit board 90; an upper plate part 20 having a second connection protrusion 21 which faces the first connection protrusion 11, and which comes into contact with a conductor 93 formed on the other side; and a plurality of barrel parts 16 and 17 which are provided to stand on at least one of a pair of lateral parts on the shorter side of at least one of the lower plate part 10 and the upper plate part 20. By folding, with the flexible circuit board 90 sandwiched between the lower plate part 10 and the upper plate part 20, the barrel parts 16 and 17 so that their tips 16a and 17a comes closer to the lateral part on the side opposite, in the shorter-side direction, to the side provided with the barrel parts, the crimping metal fitting 1 is crimped to the flexible circuit board 90 while bringing the conductors 92 and 93 into conduction via the lower plate part 10 and the upper plate part 20.

Description

この発明は、フレキシブル回路基板の両面に形成された導体回路を導通させる圧着金具に関する。   The present invention relates to a crimping fitting for conducting conductor circuits formed on both surfaces of a flexible circuit board.

従来より、フレキシブルな基板本体の表面と裏面とにそれぞれ導体回路が形成されたフレキシブル回路基板においては、例えば基板本体に形成されたスルーホール内に導電性インクを印刷して充填し、この導電性インクと表裏の導体回路とを導通させることが行われている(例えば、下記特許文献1参照)。   Conventionally, in a flexible circuit board in which conductor circuits are formed on the front and back surfaces of a flexible board body, for example, a conductive ink is printed and filled in a through hole formed in the board body. The ink is electrically connected to the front and back conductor circuits (see, for example, Patent Document 1 below).

特開2007−214239号公報JP 2007-214239 A

しかしながら、上述した従来技術では、近年の極薄型のフレキシブル回路基板においては、スルーホール内に導電性インクを印刷した場合に、スルーホールの中に導電性インクが入り込まなかったり、スルーホールの全面に導電性インクが渡らなかったりして、導通不良を起こす可能性が否めなくなってきた。   However, in the above-described prior art, in recent ultra-thin flexible circuit boards, when conductive ink is printed in the through hole, the conductive ink does not enter the through hole or the entire surface of the through hole is not filled. There has been no denying the possibility of poor conduction due to the lack of conductive ink.

この発明は、上述した従来技術による問題点を解消し、フレキシブル回路基板の両面の導体回路を確実に導通させることができる圧着金具を提供することを目的とする。   An object of the present invention is to provide a crimping fitting capable of solving the above-described problems caused by the prior art and reliably connecting the conductive circuits on both sides of a flexible circuit board.

本発明に係る圧着金具は、フレキシブル回路基板の一方の面側に形成された第1導体回路と接触する第1突起部を有する第1板部と、前記フレキシブル回路基板の他方の面側に形成された第2導体回路と接触し前記第1突起部と対向する第2突起部を有する第2板部と、前記第1及び第2突起部の少なくとも一方における短手方向の一対の側部の少なくとも一方に立設されたバレル部とを備え、前記第1板部と前記第2板部との間に前記フレキシブル回路基板を挟持した状態で、前記バレル部を内側に折り曲げることで前記フレキシブル回路基板に圧着されると共に、前記第1及び第2板部で前記第1及び第2導体回路を導通させることを特徴とする。   A crimping fitting according to the present invention is formed on a first plate portion having a first protrusion that contacts a first conductor circuit formed on one surface side of a flexible circuit board, and on the other surface side of the flexible circuit board. A second plate portion having a second protrusion portion that contacts the formed second conductor circuit and faces the first protrusion portion, and a pair of lateral portions in at least one of the first and second protrusion portions. The flexible circuit board by bending the barrel part inward with the flexible circuit board sandwiched between the first plate part and the second plate part. The first and second conductor circuits are electrically connected by the first and second plate portions while being crimped to the substrate.

本発明に係る圧着金具によれば、第1及び第2板部がこれらの間にフレキシブル回路基板を挟持した状態で折り曲げられたバレル部により基板に圧着されると共に、フレキシブル回路基板の両面に形成された第1及び第2の導体回路を導通させるので、スルーホール内に導電性インクを印刷する場合と比べて導体回路同士を確実に導通させることができる。   According to the crimping fitting according to the present invention, the first and second plate parts are crimped to the board by the bent barrel part with the flexible circuit board sandwiched therebetween, and are formed on both surfaces of the flexible circuit board. Since the conducted first and second conductor circuits are conducted, the conductor circuits can be reliably conducted as compared with the case where the conductive ink is printed in the through hole.

本発明の一実施形態においては、第1及び第2板部は、長手方向の一方の側部同士が連結部により連結されている。   In one embodiment of the present invention, the first and second plate portions are connected at one side in the longitudinal direction by a connecting portion.

本発明によれば、フレキシブル回路基板の両面の導体回路を確実に導通させることができる。   According to the present invention, the conductive circuits on both sides of the flexible circuit board can be reliably conducted.

本発明の第1の実施形態に係る圧着金具を示す斜視図である。It is a perspective view which shows the crimping fitting which concerns on the 1st Embodiment of this invention. 同圧着金具をフレキシブル回路基板に圧着した様子を示す斜視図である。It is a perspective view which shows a mode that the crimping | compression-bonding metal fitting was crimped | bonded to the flexible circuit board. 図2のA−A’断面図である。It is A-A 'sectional drawing of FIG. 図2のB−B’断面図である。FIG. 3 is a B-B ′ sectional view of FIG. 2. 本発明の第2の実施形態に係る圧着金具を示す斜視図である。It is a perspective view which shows the crimping fitting which concerns on the 2nd Embodiment of this invention. 同圧着金具をフレキシブル回路基板に圧着した様子を示す斜視図である。It is a perspective view which shows a mode that the crimping | compression-bonding metal fitting was crimped | bonded to the flexible circuit board. 図6のC−C’断面図である。It is C-C 'sectional drawing of FIG. 本発明の第3の実施形態に係る圧着金具を示す斜視図である。It is a perspective view which shows the crimping fitting which concerns on the 3rd Embodiment of this invention. 同圧着金具をフレキシブル回路基板に圧着した様子を示す斜視図である。It is a perspective view which shows a mode that the crimping | compression-bonding metal fitting was crimped | bonded to the flexible circuit board. 図9のD−D’断面図である。FIG. 10 is a cross-sectional view taken along the line D-D ′ of FIG. 9.

以下、添付の図面を参照して、この発明の実施の形態に係る圧着金具を詳細に説明する。   Hereinafter, a crimp fitting according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

[第1の実施形態]
図1は、本発明の第1の実施形態に係る圧着金具を示す斜視図である。また、図2は、圧着金具をフレキシブル回路基板に圧着した様子を示す斜視図である。更に、図3は図2のA−A’断面図、図4は図2のB−B’断面図である。図1〜図4に示すように、第1の実施形態に係る圧着金具1は、メンブレン回路やフレキシブルプリント回路等のフレキシブル回路基板90(図2参照)に圧着される金具であり、フレキシブル回路基板90の基板本体91(図3及び図4参照)の表面及び裏面に形成された導体回路を電気的及び機械的に接続して導通させるものである。
[First Embodiment]
FIG. 1 is a perspective view showing a crimping fitting according to a first embodiment of the present invention. FIG. 2 is a perspective view showing a state where the crimping fitting is crimped to the flexible circuit board. 3 is a cross-sectional view taken along the line AA ′ in FIG. 2, and FIG. 4 is a cross-sectional view taken along the line BB ′ in FIG. As shown in FIGS. 1 to 4, the crimping fitting 1 according to the first embodiment is a fitting that is crimped to a flexible circuit board 90 (see FIG. 2) such as a membrane circuit or a flexible printed circuit. The conductive circuits formed on the front and back surfaces of the 90 substrate bodies 91 (see FIGS. 3 and 4) are electrically and mechanically connected to each other.

圧着金具1は、例えばフレキシブル回路基板90の裏面側に配置され、この裏面側に形成された裏面回路の導体92(図3及び図4参照)と接触する第1接続突起部11と、この第1接続突起部11の接触を補助するための第1及び第2圧着突起部12,13とを有する下板部10を備える。   The crimp fitting 1 is disposed on the back surface side of the flexible circuit board 90, for example, and a first connection protrusion 11 that contacts the conductor 92 (see FIGS. 3 and 4) of the back circuit formed on the back surface side. The lower plate part 10 which has the 1st and 2nd crimping | compression-bonding projection parts 12 and 13 for assisting the contact of the 1 connection projection part 11 is provided.

また、圧着金具1は、例えばフレキシブル回路基板90の表面側に配置され、この表面側に形成された表面回路の導体93(図3及び図4参照)と接触し、下板部10の第1接続突起部11とフレキシブル回路基板90を挟んで対向する位置に形成された第2接続突起部21と、この第2接続突起部21の接触を補助するための第3及び第4圧着突起部22,23とを有する上板部20を備える。   The crimp fitting 1 is disposed on the surface side of the flexible circuit board 90, for example, and contacts the surface circuit conductor 93 (see FIGS. 3 and 4) formed on the surface side. A second connection protrusion 21 formed at a position facing the connection protrusion 11 and the flexible circuit board 90, and third and fourth crimp protrusions 22 for assisting the contact of the second connection protrusion 21. , 23.

更に、圧着金具1は、例えば下板部10の長手方向と交差する短手方向の一対の側部14,15に板厚方向に立設された複数のバレル部16,17と、下板部10及び上板部20の長手方向の一方の端部同士を連結する連結片29とを備える。圧着金具1は、銅や黄銅等の導電性を有する板状の金属母材を、例えば所定の形状に打ち抜き/折り曲げ加工等して形成されており、下板部10及び上板部20は、例えば矩形短冊状の外形を有するように形成されている。   Further, the crimp fitting 1 includes, for example, a plurality of barrel portions 16 and 17 erected in a plate thickness direction on a pair of side portions 14 and 15 in a short direction intersecting with a longitudinal direction of the lower plate portion 10, and a lower plate portion. 10 and the connection piece 29 which connects one edge parts of the longitudinal direction of the upper board part 20 are provided. The crimp fitting 1 is formed by punching / bending a plate-shaped metal base material having conductivity such as copper or brass into a predetermined shape, for example. The lower plate portion 10 and the upper plate portion 20 are For example, it is formed to have a rectangular strip-shaped outer shape.

下板部10及び上板部20は、これらの間にフレキシブル回路基板90を挟み込むために設けられている。下板部10及び上板部20は、それぞれ長手方向中央付近に第1及び第2接続突起部11,21を有する。また、下板部10及び上板部20は、長手方向におけるこれら第1及び第2接続突起部11,21の両隣にそれぞれ第1及び第2圧着突起部12,13並びに第3及び第4圧着突起部22,23を有する。   The lower plate portion 10 and the upper plate portion 20 are provided to sandwich the flexible circuit board 90 therebetween. The lower plate portion 10 and the upper plate portion 20 have first and second connection protrusions 11 and 21 near the center in the longitudinal direction, respectively. Further, the lower plate portion 10 and the upper plate portion 20 are respectively adjacent to the first and second connection projection portions 11 and 21 in the longitudinal direction, respectively, and the first and second crimping projection portions 12 and 13 and the third and fourth crimping portions. Protrusions 22 and 23 are provided.

なお、第1圧着突起部12と第3圧着突起部22とが、また第2圧着突起部13と第4圧着突起部23とが、それぞれフレキシブル回路基板90を挟んで対向する位置に形成されている。下板部10の第1接続突起部11、第1及び第2圧着突起部12,13は、下板部10の上面10a側に突出するように形成されている。また、上板部20の第2接続突起部21、第3及び第4圧着突起部22,23は、上板部20の下面20a側に突出するように形成されている。   The first crimping projection 12 and the third crimping projection 22, and the second crimping projection 13 and the fourth crimping projection 23 are formed at positions facing each other across the flexible circuit board 90. Yes. The first connecting projection 11, the first and second crimping projections 12 and 13 of the lower plate portion 10 are formed so as to protrude toward the upper surface 10 a of the lower plate portion 10. Further, the second connection projection 21, the third and fourth crimping projections 22 and 23 of the upper plate portion 20 are formed so as to protrude toward the lower surface 20 a side of the upper plate portion 20.

下板部10の一対の側部14,15のうち、側部14は、下板部10の長手方向に沿った一方の側部であり、連結片29を上方にした状態で上面10aに向かって見て左側に位置している。また、側部15は、下板部10の長手方向に沿った他方の側部であり、連結片29を上方にした状態で上面10aに向かって見て右側に位置している。   Of the pair of side portions 14 and 15 of the lower plate portion 10, the side portion 14 is one side portion along the longitudinal direction of the lower plate portion 10, and faces the upper surface 10 a with the connecting piece 29 facing upward. It is located on the left side. Moreover, the side part 15 is the other side part along the longitudinal direction of the lower board part 10, and is located in the right side seeing toward the upper surface 10a in the state which made the connection piece 29 upward.

側部14には、第1の接続突起部11よりも連結片29に近い位置にバレル部16が上面10a側に突出するように立設されている。また、側部15には、第1の接続突起部11よりも連結片29から遠い位置にバレル部17が上面10a側に突出するように立設されている。   The side portion 14 is erected so that the barrel portion 16 protrudes toward the upper surface 10 a at a position closer to the coupling piece 29 than the first connection projection portion 11. Further, the side portion 15 is erected so that the barrel portion 17 protrudes toward the upper surface 10 a at a position farther from the coupling piece 29 than the first connection projection portion 11.

第1接続突起部11は、主にフレキシブル回路基板90の導体92との電気的な接点となる部分であり、図3に示すように、上板部20に向かって突出するように形成されている。この第1接続突起部11は、その長手方向が下板部10の長手方向と実質的に一致するように、下板部10の側部14,15間の短手方向の中央部分及び長手方向のバレル部16,17間の中央部分に位置している。   The first connection protrusion 11 is a portion that mainly serves as an electrical contact with the conductor 92 of the flexible circuit board 90, and is formed so as to protrude toward the upper plate portion 20 as shown in FIG. Yes. The first connecting projection 11 has a central portion in the short direction between the side portions 14 and 15 of the lower plate 10 and the longitudinal direction so that the longitudinal direction thereof substantially coincides with the longitudinal direction of the lower plate 10. It is located in the center part between the barrel parts 16 and 17.

第1及び第2圧着突起部12,13は、第1接続突起部11と同様に、上板部20に向かって突出するように形成されている。これら第1及び第2圧着突起部12,13は、上板部20の第3及び第4圧着突起部22,23との間で、主にフレキシブル回路基板90を機械的に圧着固定するために設けられている。   The first and second crimping protrusions 12 and 13 are formed so as to protrude toward the upper plate part 20, similarly to the first connection protrusion 11. These first and second crimping projections 12 and 13 are mainly used for mechanically crimping and fixing the flexible circuit board 90 between the third and fourth crimping projections 22 and 23 of the upper plate portion 20. Is provided.

第1圧着突起部12は、その長手方向が下板部10の短手方向と実質的に一致するように、下板部10の側部14,15間の短手方向の中央部分において、バレル部16の形成位置と下板部10の長手方向における位置とが対応するように第1接続突起部11よりも連結片29に近い箇所に位置している。   The first crimping protrusion 12 has a barrel at the center portion in the short direction between the side portions 14 and 15 of the lower plate portion 10 so that the longitudinal direction thereof substantially coincides with the short direction of the lower plate portion 10. It is located at a location closer to the connecting piece 29 than the first connection projection 11 so that the formation position of the portion 16 corresponds to the position in the longitudinal direction of the lower plate portion 10.

第2圧着突起部13は、その長手方向が下板部10の短手方向と実質的に一致するように、下板部10の側部14,15間の短手方向の中央部分において、バレル部17の形成位置と下板部10の長手方向における位置とが対応するように第1接続突起部11よりも連結片29から離れた箇所に位置している。   The second crimping protrusion 13 has a barrel at the center portion in the short direction between the side portions 14 and 15 of the lower plate portion 10 so that the longitudinal direction thereof substantially coincides with the short direction of the lower plate portion 10. It is located at a location farther from the connecting piece 29 than the first connection projection 11 so that the formation position of the portion 17 corresponds to the position in the longitudinal direction of the lower plate portion 10.

バレル部16,17は、板状の部材からなり、図4に示すようにそれぞれ立設方向の先端部16a,17aがバレル部形成側と短手方向に反対側の側部15,14に近付くように折り曲げることで上板部20を固定する。なお、バレル部16,17は、側部14,15における形成位置が上記と逆になっていてもよい。   The barrel parts 16 and 17 are made of plate-like members, and as shown in FIG. 4, the front end parts 16a and 17a in the standing direction approach the side parts 15 and 14 opposite to the barrel part forming side in the short direction. The upper plate part 20 is fixed by bending in this manner. In addition, the barrel parts 16 and 17 may have the formation position in the side parts 14 and 15 reverse to the above.

一方、第2接続突起部21は、主にフレキシブル回路基板90の導体93との電気的な接点となる部分であり、図3に示すように、下板部10に向かって突出するように形成されている。この第2接続突起部21は、その長手方向が上板部20の短手方向と実質的に一致するように、上板部20の短手方向及び長手方向の中央部分に位置し、下板部10の第1接続突起部11と対向している。第2接続突起部21の長手方向と第1接続突起部11の長手方向とは、平面視で見て直交するようになっている。   On the other hand, the second connection protrusion 21 is a portion that mainly serves as an electrical contact with the conductor 93 of the flexible circuit board 90 and is formed so as to protrude toward the lower plate 10 as shown in FIG. Has been. The second connection projection 21 is located at the center of the short direction and the long direction of the upper plate part 20 so that the long direction thereof substantially coincides with the short direction of the upper plate part 20. It faces the first connection protrusion 11 of the portion 10. The longitudinal direction of the second connection protrusion 21 and the longitudinal direction of the first connection protrusion 11 are orthogonal to each other when seen in a plan view.

第3及び第4の圧着突起部22,23は、第2接続突起部21と同様に、下板部10に向かって突出するように形成されている。これら第3及び第4の圧着突起部22,23は、下板部10の第1及び第2圧着突起部12,13との間で、主にフレキシブル回路基板90を機械的に圧着固定するために設けられている。   The third and fourth crimping protrusions 22 and 23 are formed so as to protrude toward the lower plate part 10, similarly to the second connection protrusion 21. These third and fourth crimping protrusions 22 and 23 are mainly used for mechanically crimping and fixing the flexible circuit board 90 between the first and second crimping protrusions 12 and 13 of the lower plate part 10. Is provided.

第3圧着突起部22は、その長手方向が上板部20の長手方向と実質的に一致するように、上板部20の短手方向の中央部分において、下板部10の第1圧着突起部12と対向するように上板部20の長手方向における第2接続突起部21よりも連結片29に近い箇所に位置している。   The third crimping protrusion 22 is a first crimping protrusion of the lower plate portion 10 at the center portion in the short direction of the upper plate portion 20 so that the longitudinal direction thereof substantially coincides with the longitudinal direction of the upper plate portion 20. It is located at a location closer to the coupling piece 29 than the second connection projection 21 in the longitudinal direction of the upper plate portion 20 so as to face the portion 12.

第4圧着突起部23は、その長手方向が上板部20の長手方向と実質的に一致するように、上板部20の短手方向の中央部分において、下板部10の第2圧着突起部13と対向するように上板部20の長手方向における第2接続突起部21よりも連結片29から遠い箇所に位置している。   The fourth crimping protrusion 23 is the second crimping protrusion of the lower plate part 10 at the central portion in the short direction of the upper plate part 20 so that the longitudinal direction thereof substantially coincides with the longitudinal direction of the upper plate part 20. It is located at a location farther from the connecting piece 29 than the second connection projection 21 in the longitudinal direction of the upper plate portion 20 so as to face the portion 13.

第3及び第4圧着突起部22,23の長手方向と第1及び第2圧着突起部12,13の長手方向とは、平面視で見てそれぞれ直交するようになっている。なお、第1及び第2の接続突起部11,21の上面10a及び下面20aからの高さを加算した値は、例えば第1の圧着突起部12及び第3の圧着突起部22の上面10a及び下面20aからの高さを加算した値よりも大きくなるように設定されている。   The longitudinal direction of the third and fourth crimping projections 22 and 23 and the longitudinal direction of the first and second crimping projections 12 and 13 are orthogonal to each other when seen in a plan view. The value obtained by adding the heights from the upper surface 10a and the lower surface 20a of the first and second connection projections 11 and 21 is, for example, the upper surface 10a of the first crimping projection 12 and the third crimping projection 22 and It is set to be larger than the value obtained by adding the height from the lower surface 20a.

また、第1及び第2の接続突起部11,21の上面10a及び下面20aからの高さを加算した値は、例えば第2の圧着突起部13及び第4の圧着突起部23の上面10a及び下面20aからの高さを加算した値よりも大きくなるように設定されている。これにより、下板部10と上板部20との間でフレキシブル回路基板90を挟み込んで圧着する際に、図3に示すように上板部20が下板部10とは反対方向に僅かに撓むように構成されている。   The value obtained by adding the heights from the upper surface 10a and the lower surface 20a of the first and second connection projections 11 and 21 is, for example, the upper surface 10a of the second crimping projection 13 and the fourth crimping projection 23, and It is set to be larger than the value obtained by adding the height from the lower surface 20a. As a result, when the flexible circuit board 90 is sandwiched and pressure-bonded between the lower plate portion 10 and the upper plate portion 20, the upper plate portion 20 is slightly in the opposite direction to the lower plate portion 10 as shown in FIG. It is comprised so that it may bend.

次に、第1の実施形態に係る圧着金具1の作用について説明する。
圧着金具1をフレキシブル回路基板90に圧着させる際には、連結片29が延びた展開状態の下板部10及び上板部20のうち、まず下板部10のバレル部16,17を、それぞれ図2に示すようなフレキシブル回路基板90に形成された貫通孔99に挿通し、第1接続突起部11が導体92と接するように下板部10の上面10a上にフレキシブル回路基板90を載置する。
Next, the operation of the crimping fitting 1 according to the first embodiment will be described.
When the crimping fitting 1 is crimped to the flexible circuit board 90, first, the barrel portions 16 and 17 of the lower plate portion 10 of the lower plate portion 10 and the upper plate portion 20 in the unfolded state in which the connecting piece 29 is extended, The flexible circuit board 90 is placed on the upper surface 10 a of the lower plate portion 10 so that the first connection protrusion 11 is in contact with the conductor 92 through the through hole 99 formed in the flexible circuit board 90 as shown in FIG. To do.

なお、フレキシブル回路基板90の導体92,93は、少なくとも第1及び第2接続突起部11,21と対応する箇所で露出していればよいが、第1及び第2接続突起部11,21と対応する箇所だけでなく、第1乃至第4圧着突起部12,13,22,23と対応する箇所も露出しておくことが好ましい。図示の例では、圧着金具1の圧着箇所以外にカバーレイ94を設けている。   The conductors 92 and 93 of the flexible circuit board 90 may be exposed at least at locations corresponding to the first and second connection projections 11 and 21, but the first and second connection projections 11 and 21 and It is preferable that not only the corresponding portions but also the portions corresponding to the first to fourth crimping protrusions 12, 13, 22, and 23 are exposed. In the illustrated example, a cover lay 94 is provided in addition to the crimping location of the crimping fitting 1.

次に、連結片29を下板部10上のフレキシブル回路基板90側に向けて折り曲げて、上板部20が下板部10上に下面20aを下側にして配置され、第2接続突起部21が導体93と接しつつ第1接続突起部11上に位置するようにフレキシブル回路基板90に当接させる。   Next, the connecting piece 29 is bent toward the flexible circuit board 90 side on the lower plate portion 10, and the upper plate portion 20 is disposed on the lower plate portion 10 with the lower surface 20a on the lower side. 21 is brought into contact with the flexible circuit board 90 so as to be positioned on the first connection protrusion 11 while being in contact with the conductor 93.

最後に、バレル部16,17の先端部16a,17aを上述したように折り曲げて、上板部20の上面側をそれぞれ押圧する。このように押圧された上板部20では、バレル部16,17による押圧力が第3及び第4圧着突起部22,23に伝達されるので、これら第3及び第4圧着突起部22,23がフレキシブル回路基板90を強く押圧する。   Finally, the front end portions 16a and 17a of the barrel portions 16 and 17 are bent as described above, and the upper surface side of the upper plate portion 20 is pressed. In the upper plate part 20 pressed in this way, the pressing force by the barrel parts 16 and 17 is transmitted to the third and fourth crimping protrusions 22 and 23, so that these third and fourth crimping protrusions 22 and 23 are transmitted. Strongly presses the flexible circuit board 90.

一方、下板部10には、上述したように上板部20の第3及び第4圧着突起部22,23と対向するように第1及び第2圧着突起部12,13が形成されているので、フレキシブル回路基板90は、第1及び第3圧着突起部12,22及び第2及び第4圧着突起部13,23の間にそれぞれ挟まれて圧着される。   On the other hand, as described above, the first and second crimping projections 12 and 13 are formed on the lower plate 10 so as to face the third and fourth crimping projections 22 and 23 of the upper plate 20. Therefore, the flexible circuit board 90 is sandwiched and crimped between the first and third crimping projections 12 and 22 and the second and fourth crimping projections 13 and 23, respectively.

第1の実施形態に係る圧着金具1では、このようにバレル部16,17の押圧力が、第1及び第3圧着突起部12,22の間と第2及び第4圧着突起部13,23の間にそれぞれ集中する構造を備えるので、圧着金具1は非常に強い圧着強度でフレキシブル回路基板90に圧着されることとなる。   In the crimping fitting 1 according to the first embodiment, the pressing force of the barrel portions 16 and 17 is thus between the first and third crimping projections 12 and 22 and the second and fourth crimping projections 13 and 23. Therefore, the crimp fitting 1 is crimped to the flexible circuit board 90 with a very strong crimp strength.

また、上述したように、平面視で第1及び第3圧着突起部12,22が直交し、第2及び第4圧着突起部13,23が直交しているので、例えば上板部20が下板部10に対し多少位置ずれしても、これら第1及び第3圧着突起部12,22並びに第2及び第4圧着突起部13,23の間にフレキシブル回路基板90を確実に挟み込むことができる。   Further, as described above, the first and third crimping protrusions 12 and 22 are orthogonal to each other and the second and fourth crimping protrusions 13 and 23 are orthogonal to each other in plan view. The flexible circuit board 90 can be securely sandwiched between the first and third pressure-bonding protrusions 12 and 22 and the second and fourth pressure-bonding protrusions 13 and 23 even if they are slightly displaced from the plate portion 10. .

なお、上述したようにバレル部16,17が上板部20を押圧することで、第3及び第4圧着突起部22,23の間に位置する第2接続突起部21にも押圧力が伝達され、第2接続突起部21もフレキシブル回路基板90を押圧する。また、第1及び第2圧着突起部12,13の中心を結ぶ直線は第1接続突起部11を通過し、第3及び第4圧着突起部22,23の中心を結ぶ直線は第2接続突起部21を通過して、これら直線は平面視で重複するようになっている。従って、第3及び第4圧着突起部22,23を介してバレル部16,17の押圧力は、第2接続突起部21に確実に伝達される。   As described above, when the barrel portions 16 and 17 press the upper plate portion 20, the pressing force is transmitted to the second connection projection portion 21 located between the third and fourth crimping projection portions 22 and 23. Then, the second connection protrusion 21 also presses the flexible circuit board 90. The straight line connecting the centers of the first and second crimping projections 12 and 13 passes through the first connection projection 11, and the straight line connecting the centers of the third and fourth crimping projections 22 and 23 is the second connection projection. Passing through the part 21, these straight lines overlap in plan view. Therefore, the pressing force of the barrel portions 16 and 17 is reliably transmitted to the second connection protrusion 21 via the third and fourth crimp protrusions 22 and 23.

更に、下板部10には、上板部20の第2接続突起部21と対向する第1接続突起部11が形成されているので、フレキシブル回路基板90は、第1接続突起部11及び第2接続突起部21の間に挟まれて固定される。そして、平面視において、第1及び第2接続突起部11,21が直交しているので、例えば上記のように多少位置ずれしたとしても、第1及び第2接続突起部11,21の間にフレキシブル回路基板90を確実に挟み込むことができる。   Furthermore, since the first connection projection 11 facing the second connection projection 21 of the upper plate 20 is formed on the lower plate 10, the flexible circuit board 90 includes the first connection projection 11 and the first connection projection 11. It is fixed by being sandwiched between the two connection projections 21. Since the first and second connection projections 11 and 21 are orthogonal to each other in plan view, even if the position is slightly displaced as described above, for example, between the first and second connection projections 11 and 21. The flexible circuit board 90 can be securely sandwiched.

圧着時には、バレル部16,17に押圧された上板部20が、第2接続突起部21の部分で盛り上がるように撓むので、上板部20においては、第2接続突起部21の部分で下板部10に向かう弾性力が作用する。これにより、第1及び第2接続突起部11,21の間でフレキシブル回路基板90が強く固定される。このため、特にフレキシブル回路基板90が撓みやすいメンブレン回路であっても、強固に固定することが可能となる。   At the time of crimping, the upper plate portion 20 pressed by the barrel portions 16 and 17 bends so as to rise at the portion of the second connection projection portion 21, so that the upper plate portion 20 has a portion of the second connection projection portion 21. An elastic force toward the lower plate portion 10 acts. Thereby, the flexible circuit board 90 is strongly fixed between the first and second connection protrusions 11 and 21. For this reason, even if the flexible circuit board 90 is a membrane circuit that is easily bent, it can be firmly fixed.

このように、第1の実施形態に係る圧着金具1では、第1及び第2接続突起部11,21間と、第1及び第3圧着突起部12,22間と、第2及び第4圧着突起部13,23間との3点においてフレキシブル回路基板90を挟み込んで固定しているので、圧着強度は向上することとなる。   Thus, in the crimping fitting 1 according to the first embodiment, between the first and second connection projections 11 and 21, between the first and third crimping projections 12 and 22, and the second and fourth crimping. Since the flexible circuit board 90 is sandwiched and fixed at the three points between the protrusions 13 and 23, the pressure bonding strength is improved.

また、第1の実施形態に係る圧着金具1では、電気的な接点となる第1及び第2接続突起部11,21がフレキシブル回路基板90を押圧しながら挟み込んでいるので、これら第1及び第2接続突起部11,21がフレキシブル回路基板90と強く密着する構造を実現し、フレキシブル回路基板90と圧着金具1との電気的接続信頼性が向上する。   Further, in the crimping fitting 1 according to the first embodiment, the first and second connection projections 11 and 21 that are electrical contacts sandwich the flexible circuit board 90 while pressing, so the first and second The structure in which the two connection projections 11 and 21 are in close contact with the flexible circuit board 90 is realized, and the electrical connection reliability between the flexible circuit board 90 and the crimping fitting 1 is improved.

更に、第1の実施形態に係る圧着金具1では、バレル部16,17の先端部16a,17aが、上板部20の短手方向の中央部よりもバレル部16,17に近い位置を押圧しているので、この中央部を挟んだ上板部20の両側をバランス良く押圧していることとなり、フレキシブル回路基板90を安定的に固定することができる。   Furthermore, in the crimping fitting 1 according to the first embodiment, the tip portions 16a and 17a of the barrel portions 16 and 17 are pressed closer to the barrel portions 16 and 17 than the center portion in the short direction of the upper plate portion 20. Therefore, both sides of the upper plate portion 20 sandwiching the center portion are pressed with good balance, and the flexible circuit board 90 can be stably fixed.

なお、バレル部16,17の先端部16a,17aが上板部20の中央部よりもバレル部16,17から遠い位置を押圧するようにしてもよい。このようにすれば、バレル部16,17の折り曲げ半径を大きくすることができるので、バレル部16,17の折れや破断を抑制することができる。   In addition, you may make it the front-end | tip parts 16a and 17a of the barrel parts 16 and 17 press a position far from the barrel parts 16 and 17 rather than the center part of the upper board part 20. FIG. In this way, the bending radii of the barrel portions 16 and 17 can be increased, so that the barrel portions 16 and 17 can be prevented from being folded or broken.

第1の実施形態に係る圧着金具1では、バレル部16が下板部10の側部14の連結片29に近い箇所のみに設けられ、バレル部17が下板部10の側部15の連結片29から遠い箇所のみに設けられているので、バレル部16,17が短手方向において互いに対向せず、圧着金具1を小型化しても、バレル部16,17の先端部16a,17aを確実に折り曲げて上板部20を強く押圧することができる。これにより、フレキシブル回路基板90との圧着強度の低下を抑えつつ小型化を図ることができる。   In the crimping fitting 1 according to the first embodiment, the barrel portion 16 is provided only at a location near the connecting piece 29 of the side portion 14 of the lower plate portion 10, and the barrel portion 17 is connected to the side portion 15 of the lower plate portion 10. Since the barrel portions 16 and 17 are not opposed to each other in the short direction, the distal end portions 16a and 17a of the barrel portions 16 and 17 are surely secured even if the crimping fitting 1 is downsized. The upper plate part 20 can be strongly pressed by being bent into the upper part. Thereby, size reduction can be achieved, suppressing the fall of the crimping | compression-bonding strength with the flexible circuit board 90. FIG.

[第2の実施形態]
図5は、本発明の第2の実施形態に係る圧着金具を示す斜視図である。また、図6は、圧着金具をフレキシブル回路基板に圧着した様子を示す斜視図である。更に、図7は、図6のC−C’断面図である。第2の実施形態に係る圧着金具1Aは、バレル部16,17の他に、バレル部18,19を備えた点が第1の実施形態に係る圧着金具1と相違しているが、それ以外の構成は同様となっている。従って、以降においては、第1の実施形態に係る圧着金具1と相違する点について主に説明し、既に説明した部分については同一の符号を附して説明を省略する。
[Second Embodiment]
FIG. 5 is a perspective view showing a crimping fitting according to the second embodiment of the present invention. FIG. 6 is a perspective view showing a state where the crimping fitting is crimped to the flexible circuit board. 7 is a cross-sectional view taken along the line CC ′ of FIG. The crimping fitting 1A according to the second embodiment is different from the crimping fitting 1 according to the first embodiment in that the barrels 18 and 19 are provided in addition to the barrels 16 and 17, but other than that. The structure of is the same. Therefore, in the following, differences from the crimping fitting 1 according to the first embodiment will be mainly described, and portions already described are denoted by the same reference numerals and description thereof is omitted.

図5〜図7に示すように、第2の実施形態に係る圧着金具1Aの下板部10の側部14には、第1接続突起部11よりも連結片29に近い位置にバレル部16が、第1接続突起部11よりも連結片29から遠い位置にバレル部18がそれぞれ上面10a側に突出するように立設されている。また、下板部10の側部15には、第1接続突起部11よりも連結片29から遠い位置にバレル部17が、第1接続突起部11よりも連結片29に近い位置にバレル部19がそれぞれ上面10a側に突出するように立設されている。   As shown in FIG. 5 to FIG. 7, the barrel portion 16 is located on the side portion 14 of the lower plate portion 10 of the crimping fitting 1 </ b> A according to the second embodiment at a position closer to the connecting piece 29 than the first connection protrusion 11. However, the barrel portions 18 are erected so as to protrude to the upper surface 10 a side at positions farther from the coupling piece 29 than the first connection projection portion 11. Further, the side plate 15 of the lower plate portion 10 has a barrel portion 17 at a position farther from the connecting piece 29 than the first connecting projection 11 and a barrel portion at a position closer to the connecting piece 29 than the first connecting projection 11. 19 are erected so as to protrude to the upper surface 10a side.

すなわち、バレル部16,19は第1圧着突起部12を挟んで下板部10の短手方向に対向するように、またバレル部17,18は第2圧着突起部13を挟んで下板部10の短手方向に対向するようにそれぞれ形成されている。このような構成によっても、バレル部16〜19で上板部20を押圧することができるので、上記第1の実施形態に係る圧着金具1と同様の作用効果を奏することができる。   That is, the barrel parts 16 and 19 are opposed to each other in the short direction of the lower plate part 10 with the first crimping projection part 12 interposed therebetween, and the barrel parts 17 and 18 are the lower plate part with the second crimping projection part 13 sandwiched therebetween. 10 are formed so as to face each other in the short direction. Even with such a configuration, the upper plate portion 20 can be pressed by the barrel portions 16 to 19, so that the same operational effects as the crimping fitting 1 according to the first embodiment can be obtained.

[第3の実施形態]
図8は、本発明の第3の実施形態に係る圧着金具を示す斜視図である。また、図9は、圧着金具をフレキシブル回路基板に圧着した様子を示す斜視図である。更に、図10は、図9のD−D’断面図である。第3の実施形態に係る圧着金具1Bは、下板部10及び上板部20が連結片29により連結されておらず、それぞれ独立した部材からなる点が第2の実施形態に係る圧着金具1Bと相違している。
[Third Embodiment]
FIG. 8 is a perspective view showing a crimping fitting according to the third embodiment of the present invention. FIG. 9 is a perspective view showing a state where the crimping fitting is crimped to the flexible circuit board. Further, FIG. 10 is a sectional view taken along the line DD ′ of FIG. In the crimping fitting 1B according to the third embodiment, the lower plate portion 10 and the upper plate portion 20 are not connected by the connecting piece 29, and the points made of independent members are the crimping fitting 1B according to the second embodiment. Is different.

すなわち、図8〜図10に示すように、側部14,15にバレル部16〜19が形成されると共に第1接続突起部11、第1及び第2圧着突起部12,13が形成された下板部10と、第2接続突起部21、第3及び第4圧着突起部22,23が形成された上板部20とは、平面視で見てそれぞれ独立した矩形短冊状に形成されている。   That is, as shown in FIGS. 8 to 10, the barrel portions 16 to 19 are formed on the side portions 14 and 15, and the first connection projection portion 11, the first and second crimping projection portions 12 and 13 are formed. The lower plate portion 10 and the upper plate portion 20 on which the second connection projection portion 21 and the third and fourth crimping projection portions 22 and 23 are formed are formed in rectangular strips that are independent from each other when seen in a plan view. Yes.

このような構成であっても、上記第1及び第2の実施形態に係る圧着金具1,1Aと同様の作用効果を奏することが可能である。また、連結片29がないので、フレキシブル回路基板90の端部側ではなく中央部など、任意の箇所に圧着金具1を圧着することが可能となる。   Even with such a configuration, it is possible to achieve the same operational effects as the crimping fittings 1 and 1A according to the first and second embodiments. Further, since the connecting piece 29 is not provided, the crimping fitting 1 can be crimped to an arbitrary location such as the central portion rather than the end side of the flexible circuit board 90.

1,1A,1B 圧着金具
10 下板部
10a 上面
11 第1接続突起部
12 第1圧着突起部
13 第2圧着突起部
14,15 側部
16〜19 バレル部
20 上板部
20a 下面
21 第2接続突起部
22 第3圧着突起部
23 第4圧着突起部
29 連結片
90 フレキシブル回路基板
91 基板本体
92,93 導体
94 カバーレイ
99 貫通孔
1, 1A, 1B Crimping bracket 10 Lower plate portion 10a Upper surface 11 First connection projection portion 12 First crimping projection portion 13 Second crimping projection portion 14, 15 Side portion 16-19 Barrel portion 20 Upper plate portion 20a Lower surface 21 Second Connection projection 22 Third crimp projection 23 Fourth crimp projection 29 Connection piece 90 Flexible circuit board 91 Board body 92, 93 Conductor 94 Coverlay 99 Through-hole

Claims (2)

フレキシブル回路基板の一方の面側に形成された第1導体回路と接触する第1突起部を有する第1板部と、
前記フレキシブル回路基板の他方の面側に形成された第2導体回路と接触し前記第1突起部と対向する第2突起部を有する第2板部と、
前記第1及び第2板部の少なくとも一方における短手方向の一対の側部の少なくとも一方に立設されたバレル部とを備え、
前記第1板部と前記第2板部との間に前記フレキシブル回路基板を挟持した状態で、前記バレル部を内側に折り曲げることで前記フレキシブル回路基板に圧着されると共に、前記第1及び第2板部で前記第1及び第2導体回路を導通させる
ことを特徴とする圧着金具。
A first plate portion having a first protrusion contacting a first conductor circuit formed on one surface side of the flexible circuit board;
A second plate portion having a second protrusion portion that contacts the second conductor circuit formed on the other surface side of the flexible circuit board and faces the first protrusion portion;
A barrel portion erected on at least one of the pair of side portions in the lateral direction in at least one of the first and second plate portions;
While the flexible circuit board is sandwiched between the first plate part and the second plate part, the barrel part is bent inward to be crimped to the flexible circuit board, and the first and second A crimping fitting, wherein the first and second conductor circuits are made conductive by a plate portion.
前記第1及び第2板部は、長手方向の一方の側部同士が連結部により連結されている
ことを特徴とする請求項1記載の圧着金具。
The crimping fitting according to claim 1, wherein the first and second plate portions are connected to each other in the longitudinal direction by a connecting portion.
JP2013220055A 2013-10-23 2013-10-23 Crimping metal fitting Pending JP2015082589A (en)

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Publication Number Publication Date
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JP2013220055A Pending JP2015082589A (en) 2013-10-23 2013-10-23 Crimping metal fitting

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5498567U (en) * 1977-12-23 1979-07-12
JPH0399488A (en) * 1989-09-12 1991-04-24 Nec Corp Front and rear connecting piece and method of double sided circuit board
JP2011216340A (en) * 2010-03-31 2011-10-27 Fujikura Ltd Crimp terminal
JP2011216330A (en) * 2010-03-31 2011-10-27 Fujikura Ltd Crimp terminal

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5498567U (en) * 1977-12-23 1979-07-12
JPH0399488A (en) * 1989-09-12 1991-04-24 Nec Corp Front and rear connecting piece and method of double sided circuit board
JP2011216340A (en) * 2010-03-31 2011-10-27 Fujikura Ltd Crimp terminal
JP2011216330A (en) * 2010-03-31 2011-10-27 Fujikura Ltd Crimp terminal

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