JP2015079100A - Method for manufacturing wire grid polarizer, and substrate for wire grid polarizer - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for manufacturing a wire grid polarizer, by which use efficiency of a metal material can be increased, and a substrate for a wire grid polarizer.SOLUTION: The method for manufacturing a wire grid polarizer includes the following processes. A stepped part 10 is formed on a surface of a substrate Sb, where the stepped part 10 includes a bottom face 11, a top face 12, and a side face 13 connecting the bottom face and the top face 12; a level difference U of the stepped part 10 is a difference in a height between the bottom face 11 and the top face 12; and the bottom face 11 and the top face 12 extend along one direction. Liquid repellency, which is a property of repelling a liquid material containing metal particles, is controlled in such a manner that the liquid repellency of the bottom face excluding a corner part formed by the bottom face 11 and the side face 13, and the liquid repellency of the top face 12 are set to be higher than the liquid repellency of the corner part and the liquid repellency of the side face. A liquid material applied to the stepped part 10 is aggregated on the side face 13 and on the corner part, and the aggregated liquid material is dried to form a wire.

Description

  The technique of this indication is related with the manufacturing method of a wire grid polarizer, and the substrate for wire grid polarizer formed in the middle of manufacture of a wire grid polarizer.

  As one of the polarizers that are elements that convert natural light into linearly polarized light, a wire grid polarizer having a plurality of metal wires arranged in parallel to one plane is known. For example, as described in Patent Document 1, a wire grid polarizer includes a step of forming a metal film on one side surface of a substrate, a step of forming a mask having a plurality of openings parallel to each other on the metal film, and The metal film is etched using a mask.

JP 2009-169213 A

  By the way, in the above-described manufacturing method, a metal material for forming a plurality of metal wires is supplied to the entire side surface of the substrate, while a wire grid polarizer formed through etching has a plurality of metal wires. The metal material other than the portion where the is located has been removed. As described above, among the metal materials used for manufacturing the wire grid polarizer, the metal material removed by etching is not used as a material for forming the wire grid polarizer. It is desired.

  The technique of this indication aims at providing the manufacturing method of the wire grid polarizer which can improve the utilization efficiency of a metal material, and the base material for wire grid polarizers.

  One aspect of the method of manufacturing a wire grid polarizer in the technology of the present disclosure is to form a stepped portion on the surface of a base material, and the stepped portion includes a bottom surface, a top surface, and the bottom surface and the top surface. And the step portion has a level difference between the bottom surface and the top surface, and the bottom surface and the top surface extend along one direction. Further, the liquid repellent property of the liquid containing metal particles is liquid repellent, and the liquid repellent property of the portion other than the corner portion composed of the bottom surface and the side surface in the bottom surface, and the top surface The liquid repellency possessed is set higher than the liquid repellency possessed by the corner portion and the liquid repellency possessed by the side surface. Then, the liquid material applied to the stepped portion is aggregated on the side surface and the corner portion, and the aggregated liquid material is dried to form a wire.

  According to the manufacturing method of the wire grid polarizer in the technology of the present disclosure, the liquid material for forming the metal wire aggregates in the portion where the metal wire is formed, so that the utilization efficiency of the metal material can be increased.

  In another aspect of the method of manufacturing a wire grid polarizer according to the technique of the present disclosure, it is preferable that the angle formed between the side surface and the bottom surface is formed at an acute angle in forming the stepped portion.

  According to another aspect of the method of manufacturing a wire grid polarizer in the technology of the present disclosure, the side surface and the bottom surface, which are two surfaces constituting the corner, compared to the method in which the angle formed between the side surface and the bottom surface is an obtuse angle. The distance between is small. For this reason, the liquid material is easily held on the side surface and the bottom surface of the stepped portion.

  In another aspect of the method of manufacturing a wire grid polarizer according to the technology of the present disclosure, it is preferable to draw plasma generated from a gas containing fluorine toward the bottom surface in setting the liquid repellency.

  In the step portion having an acute angle between the side surface and the bottom surface, the corner portion constituting the step portion is covered with the side surface constituting the step portion when viewed from the direction facing the bottom surface. According to the method of manufacturing a wire grid polarizer in the technology of the present disclosure, the plasma drawn toward the bottom surface reaches the bottom surface and the top surface other than the corner portion rather than the corner portion and the side surface itself covered by the side surface. Cheap. Therefore, it is easy to selectively perform the liquid repellent treatment on the bottom surface other than the top surface and the corner portion constituting the stepped portion.

  In another aspect of the method of manufacturing a wire grid polarizer according to the technique of the present disclosure, in forming the stepped portion, the stepped portion includes a protrusion having a linear shape extending along one direction, and the stepped portion is provided. The step of the portion is a step of the ridge, and includes arranging a plurality of the step portions along a direction intersecting a direction in which the ridge extends. And it is preferable to provide further forming the reinforcement part which is a protrusion which extends along the direction which cross | intersects the direction where the said protrusion extends, and connects two said adjacent protrusions.

  According to the method of manufacturing a wire grid polarizer in the technology of the present disclosure, when an external force acts on a stepped portion having a linear shape extending along one direction, the direction intersecting the direction in which the stepped portion extends is along. A reinforcing part connected to the step part supports the step part. Therefore, the mechanical strength of the step portion is increased.

  Another aspect of the method of manufacturing a wire grid polarizer in the technology of the present disclosure further includes the step portion being removed from the surface of the base material together with the reinforcing portion after the wire is formed.

According to another aspect of the method of manufacturing a wire grid polarizer in the technology of the present disclosure, both the stepped portion and the reinforcing portion can be removed from the substrate by a single process.
In another aspect of the method of manufacturing a wire grid polarizer according to the technology of the present disclosure, the base material is a glass substrate, and the liquid repellency is set. It is preferable to provide the etching resistance by the plasma to the portions other than the corners and the top surface.

  According to another aspect of the method of manufacturing a wire grid polarizer in the technology of the present disclosure, liquid repellency is imparted to the side surface of a base material even when a glass substrate etched by plasma containing fluorine is used as the base material. It is done.

  One aspect of the substrate for wire grid polarizer in the technology of the present disclosure is a substrate provided with a surface having a stepped portion. The step portion includes a bottom surface, a top surface, and a side surface that connects the bottom surface and the top surface, and the step portion has a height difference between the bottom surface and the top surface in one direction. It is continuous along. And, the liquid repellent property of the liquid containing metal particles is liquid repellent, and the liquid repellent property of the portion other than the corner portion composed of the bottom surface and the side surface in the bottom surface, and the top surface The liquid repellency possessed is higher than the liquid repellency possessed by the corners and the liquid repellency possessed by the side surfaces.

  According to the wire grid polarizer base material in the technology of the present disclosure, the liquid containing metal particles that are the material of the wire is likely to aggregate on the corners and the side surfaces constituting the stepped part. Therefore, the use efficiency of the metal material is enhanced in the configuration in which the wire is formed on the corner portion and the side surface forming the step portion.

It is preferable that the other aspect of the base material for wire grid polarizers in the technology of the present disclosure further includes a cured body of the liquid material on the corner portion and the side surface.
According to the wire grid polarizer substrate in the technology of the present disclosure, since the liquid body is cured at the corners and side surfaces, a wire made of metal particles or a wire that is a sintered body of metal particles is used. It is easy to form on corners and side surfaces.

It is a flowchart which shows the flow of the process in 1st Embodiment of the manufacturing method of a wire grid polarizer. It is process drawing for demonstrating the level | step difference formation process in 1st Embodiment. It is process drawing for demonstrating the liquid repellency setting process in 1st Embodiment, Comprising: It is a figure which shows typically the surface state of a level | step-difference part. It is process drawing for demonstrating the liquid body application | coating process in 1st Embodiment. It is process drawing for demonstrating the level | step difference formation process in an example of 1st Embodiment. It is process drawing for demonstrating the level | step difference formation process in an example of 1st Embodiment. It is process drawing for demonstrating the liquid repellency setting process in an example of 1st Embodiment. It is process drawing for demonstrating the liquid body application | coating process in an example of 1st Embodiment. It is process drawing for demonstrating the level | step-difference part removal process in an example of 1st Embodiment. It is process drawing for demonstrating the level | step difference formation process in 2nd Embodiment of the manufacturing method of a wire grid polarizer. It is a top view which shows the structure which looked at 2nd Embodiment of the base material for wire grid polarizers from the top. FIG. 12 is a cross-sectional structure taken along line 12-12 in FIG. 11 and is a process diagram for explaining a step forming process in an example of the second embodiment. It is process drawing for demonstrating the liquid body application | coating process in an example of 2nd Embodiment. It is process drawing for demonstrating the level | step-difference part removal process in an example of 2nd Embodiment.

[First Embodiment]
With reference to FIGS. 1-5, 1st Embodiment which actualized the manufacturing method of the wire grid polarizer in this indication and the base material for wire grid polarizers in this indication is described.

  As shown in FIG. 1, the manufacturing method of the wire grid polarizer includes a step portion forming step (step S1), a liquid repellency setting step (step S2), a liquid material applying step (step S3), and a liquid material drying process. It is most important to proceed with the steps (step S4) in this order. In the step portion forming step, a step portion is formed on the surface of the base material. In the liquid repellency setting step, different liquid repellency is set on each surface constituting the stepped portion. In the liquid material applying step, a liquid material containing metal particles is applied to the stepped portion, and the applied liquid material is aggregated into a portion having relatively low liquid repellency. In the liquid drying process, the liquid is dried to form a wire. The manufacturing method of the wire grid polarizer may further include a step of firing the dried liquid, and may further include a step of removing the stepped portion after the wire is formed. It may be omitted.

  As shown in FIG. 2, the stepped portion 10 formed in the stepped portion forming step includes a bottom surface 11, a top surface 12, and a side surface 13 that connects the bottom surface 11 and the top surface 12, and the stepped portion 10 has. The step U is composed of a bottom surface 11 and a top surface 12. At this time, the stepped portion U of the stepped portion 10 may be continuous along one direction, and may extend over the entire substrate Sb in one direction, or more than the entire substrate Sb in one direction. It may be short. In the method in which the plurality of step portions 10 are formed, the step U included in each of the plurality of step portions 10 may be continuous along a plurality of directions intersecting with each other, or each of the plurality of step portions 10 may be provided. The level | step difference U which has may be continued along the mutually parallel direction. The amount of the stepped portion U of the stepped portion 10 may be constant in the direction in which the bottom surface 11 and the top surface 12 of the stepped portion 10 extend, or may have different sizes. The amount of the stepped portion U of each of the plurality of stepped portions 10 may be the same as each other, or may have different sizes.

  In the stepped portion forming step, when the surface of the base material Sb that is a flat surface is the surface Sb1, a protrusion is formed on the surface Sb1, and the difference in height between the surface Sb1 of the base material Sb and the top surface of the protrusion is as follows. The step U may be formed. Alternatively, when the surface of the substrate Sb, which is a flat surface, is the surface Sb2, a recess is formed on the surface Sb2, and the height of the portion of the surface of the substrate Sb where no recess is formed and the bottom surface of the recess A step U may be formed as a difference. Forming the protrusion on the surface Sb1 of the base material Sb may be forming a thin film made of a material constituting the protrusion on the surface Sb1 of the base material Sb and etching a part of the thin film. Then, a part of the surface Sb1 of the substrate Sb may be etched to form a protrusion by the remaining portion of the surface of the substrate Sb. Forming the concave portion on the surface Sb2 of the base material Sb may be etching only a portion corresponding to the concave portion on the surface of the base material Sb, or other portions corresponding to the concave portion on the surface of the base material Sb. Etching may be performed larger than this portion.

  When the protrusion constitutes a stepped portion, the shape of the protrusion may be a ridge extending along one direction, or may be a rectangular parallelepiped shape extending along two different directions. When the concave portion forms a stepped portion, the shape of the concave portion may be a groove shape extending along one direction, or may be a rectangular hole shape expanding along two different directions.

  The step portion 10 formed on the surface of the substrate Sb may be removed after the liquid material is dried in the wire grid polarizer, or may remain as a part of the surface of the substrate Sb. In the method in which the stepped portion 10 is removed from the surface of the substrate Sb, it is preferable that the protrusion is formed on the surface of the substrate Sb with a material such as a resist that can be easily removed after the liquid is dried.

  The material for forming the base material Sb may be any material that can form the stepped portion 10 on the surface of the base material Sb. For example, the material for forming the base material Sb and the material for forming the protrusions are the same. The material for forming the base material Sb and the material for forming the protrusions may be different from each other. The shape and size of the substrate Sb may be any shape and size that can form the step portion 10 on the surface of the substrate Sb. For example, the shape of the substrate Sb is a plate It may be a shape or a lump shape. Moreover, the magnitude | size which the base material Sb has may be a magnitude | size in which one wire grid polarizer is formed from one base material Sb, for example, and several wire grid polarizers from one base material Sb May be a size to form.

  When the protrusion constitutes the stepped portion 10, from the viewpoint of increasing the accuracy of the size of the stepped portion 10 and the accuracy of the shape of the stepped portion 10, the surface Sb1 of the substrate Sb has adhesiveness to the protruding portion, It is preferable that the mechanical resistance to processing and the chemical resistance to protrusion processing are high. For example, when the protrusion is formed of a resist, the surface Sb1 of the substrate Sb preferably has high adhesion to the resist, and it is preferable that the surface Sb1 is not easily deformed during resist exposure or resist baking.

  When the concave portion constitutes the stepped portion 10, from the viewpoint of increasing the accuracy of the size of the stepped portion 10 and the accuracy of the shape of the stepped portion 10, the mask and the base material Sb for forming the concave portion on the surface Sb2 of the base material Sb. It is preferable that the etching selectivity between the two and the mechanical resistance in processing the recesses is high. For example, when the recess is formed by etching, it is preferable that the entire base material Sb is not easily deformed by etching.

  The base material Sb described above may be, for example, a glass substrate, a resin substrate formed of various resins, or thinner than the resin substrate and wound in a roll shape. It may be a resin sheet having flexibility.

  As shown in FIG. 3, in the liquid repellency setting step, the liquid repellency of the bottom surface liquid repellent portion 15, which is a portion other than the corner portion 14 formed by the bottom surface 11 and the side surface 13 of the bottom surface 11 of the stepped portion 10. And the liquid repellency of the top surface liquid repellent portion 16 on the top surface 12 is more than the liquid repellency of the corner lyophilic portion 17 on the corner portion 14 and the liquid repellency of the side lyophilic portion 18 on the side surface 13. It is most important to set a higher value. At this time, the size of the portion constituting the corner lyophilic portion 17 in the bottom surface 11 of the stepped portion 10 and the bottom surface other than the corner lyophilic portion 17 in the bottom surface 11 of the stepped portion 10. The sizes of the liquid repellent portions 15 may be the same or different from each other. The point is that the liquid repellency of the corner lyophilic part 17 may be set lower than the liquid repellency of the bottom liquid repellent part 15. Further, the bottom surface liquid repellent part 15 on the bottom surface 11 and the top surface liquid repellent part 16 included in the stepped part 10 may be subjected to a treatment for increasing the liquid repellency there. 17 and the side lyophilic portion 18 of the stepped portion 10 may be combined with a process for increasing lyophilicity therein and a process for increasing the liquid repellency. The liquid repellency setting step may include a process in which the liquid repellency is increased in a portion other than the stepped portion 10 in the substrate Sb, or this process may be omitted.

  The treatment for improving the liquid repellency may be a treatment in which a functional group having liquid repellency is introduced into the bottom surface liquid repellent portion 15 and the top surface liquid repellent portion 16, or the bottom surface liquid repellent portion 15 and the top surface repellent portion. The liquid part 16 may be processed so that a thin film having liquid repellency is formed. Further, the treatment for increasing the liquid repellency may be a treatment in which the functional group having lyophilicity is replaced with a functional group having no lyophilic property in the bottom surface liquid repellent portion 15 and the top surface liquid repellent portion 16. Alternatively, it may be a process in which the lyophilic thin film is removed from the bottom surface liquid repellent portion 15 and the top surface liquid repellent portion 16. And the process which improves liquid repellency may be a combination of at least two selected from the plurality of processes described above.

  The treatment for increasing the lyophilicity may be a treatment in which a functional group having lyophilicity is introduced into the corner lyophilic portion 17 and the side lyophilic portion 18, or the corner lyophilic portion 17 and the side lyophilic portion. The liquid part 18 may be processed so that a thin film having lyophilicity is formed. Further, the treatment for increasing the lyophilicity may be a treatment in which the functional group having liquid repellency is replaced with a functional group having no liquid repellency in the corner lyophilic portion 17 and the side lyophilic portion 18. Alternatively, a process of removing the liquid-repellent thin film from the corner lyophilic portion 17 and the side lyophilic portion 18 may be used. And the process which improves lyophilicity may be at least two combinations selected from the plurality of processes described above.

  The process for increasing the liquid repellency may be, for example, a process in which plasma that imparts liquid repellency is supplied from above the base material Sb toward the surface of the base material Sb. The plasma supplied toward the surface of the base material Sb is usually higher than the side surface 13 of the stepped portion 10 and the corner portion 14 of the stepped portion 10, and the top surface 12 of the stepped portion 10 and the stepped portion. It is easy to reach a portion other than the corner portion 14 in the bottom surface of 10. Therefore, if it is the level difference part 10 after such a process, compared with the side lyophilic part 18 and the corner part lyophilic part 17 which the level difference part 10 has, the top surface lyophobic part 16 and the bottom surface lyophobic part 15. In this case, the liquid repellency is improved. If the plasma imparting liquid repellency is a process that is drawn from above the base material Sb toward the bottom surface 11, the top surface liquid repellent portion 16 and the bottom surface liquid repellent portion 15 of the stepped portion 10 are liquid repellent. Sexuality further increases.

  The process of increasing lyophilicity may be, for example, a process in which plasma imparting lyophilicity enters the stepped portion 10 along an oblique direction with respect to the bottom surface 11 of the stepped portion 10. The plasma incident on the stepped portion 10 along the oblique direction with respect to the bottom surface 11 of the stepped portion 10 is usually present in the side lyophilic portion 18 and the corner lyophilic portion 17 as compared with the bottom surface liquid repellent portion 15. Easy to reach. Therefore, in the case of the stepped portion 10 after such treatment, the lyophilicity is enhanced in the side lyophilic portion 18 and the corner lyophilic portion 17 as compared to the bottom lyophobic portion 15. And if it is the method which the process which the liquid repellency mentioned above progresses after the process which improves lyophilicity, the difference in the liquid repellency in each surface which the level | step-difference part 10 has increases more.

  In addition, when the formation material of base material Sb has liquid repellency previously, the process provided with liquid repellency may be abbreviate | omitted in the bottom surface liquid repellent part 15 of the level | step-difference part 10. FIG. Moreover, when the forming material of the base material Sb has lyophilicity in advance, the process of imparting lyophilicity to the corner lyophilic portion 17 of the stepped portion 10 may be omitted. In addition, when the step 10 is formed on the surface of the base material Sb, a recess is formed on the surface of the base material Sb, and the formation material of the base material Sb has lyophilicity in advance. In the side lyophilic portion 18 of the stepped portion 10 and the corner lyophilic portion 17 of the stepped portion 10, the treatment for imparting lyophilicity may be omitted. Further, when the step 10 is formed on the surface of the substrate Sb, the protrusion is formed on the surface Sb1 of the substrate Sb, and the protrusion forming material has lyophilicity. In the side lyophilic portion 18 of the stepped portion 10, a process for imparting lyophilicity may be omitted.

  As shown in FIG. 4, in the liquid material application step, it is most important that the liquid material 19 containing metal particles aggregates on the side surface 13 and the corner portion 14 of the stepped portion 10. At this time, the liquid 19 containing metal particles may be applied toward a portion having a relatively low liquid repellency in the stepped portion 10, or a portion having a relatively low liquid repellency in the stepped portion 10. Further, it may be applied to both of the stepped portion 10 and a portion having a relatively high liquid repellency, or may be applied to a portion of the stepped portion 10 having a relatively high liquid repellency. In any method, the liquid 19 applied to the portion having a relatively high liquid repellency in the stepped portion 10 is relatively liquid repellent in the stepped portion 10 due to the surface tension of the liquid 19. It is attracted to the liquid 19 applied to the lower part. Then, the liquid material applied to the step portion 10 aggregates in a portion having a relatively low liquid repellency in the step portion 10. That is, in the side surface 13 of the stepped portion 10 and the corner portion 14 of the stepped portion 10, the low liquid repellency and shape thereof have the shape of the liquid 19 containing metal particles, the side surface 13, and And has a function of following the bottom surface 11. The liquid material applying step may further include a process of causing the liquid material applied to the stepped portion 10 to flow with a gas sprayed on the surface of the base material Sb, or the liquid material applied to the stepped portion 10 to be the base material. A process of flowing by vibration of Sb may be further included, or these may be omitted.

  Here, the liquid material 19 applied to the stepped portion 10 is aggregated on the side surface 13 and the corner portion 14 of the stepped portion 10, so that a part of the liquid material 19 applied to the stepped portion 10 is Collect on the side surface 13 of the step portion 10 and the corner portion 14 from at least one of the top surface 12 of the step portion 10 and the portion other than the corner portion 14 of the bottom surface 11 of the step portion 10. It is. At this time, the liquid material 19 may remain in a part of at least one of the top surface 12 of the step portion 10 and the portion other than the corner portion 14 in the bottom surface 11 of the step portion 10.

  In addition, from the viewpoint of increasing the utilization efficiency of the metal material for forming the wire, most of the liquid 19 applied to the step portion 10 is aggregated on the side surface 13 and the corner portion 14 of the step portion 10. It is preferable that the liquid material 19 does not remain on the top surface 12 of the stepped portion 10 and on the bottom surface 11 of the stepped portion 10 other than the corner portion 14. At this time, the angle θ formed between the side surface 13 and the bottom surface 11 in the stepped portion 10 is preferably an acute angle. With such a configuration, the angle θ formed between the side surface 13 and the bottom surface 11 is obtuse. Thus, the distance between the side surface 13 and the bottom surface 11 is short, and therefore, the liquid 19 applied to the stepped portion 10 tends to aggregate on the corner portion 14.

  Moreover, when the protrusion constitutes the step portion 10, the bottom surface 11 of the step portion 10 is a portion other than the protrusion on the surface of the substrate Sb, and the top surface 12 of the step portion 10 is the top surface 12 of the protrusion. The side surface 13 of the stepped portion 10 is a side surface 13 that rises from the bottom surface 11 along the protruding direction at the protruding portion. As described above, when one protrusion has two or more side surfaces 13, in the liquid material coating step, even if the liquid material 19 aggregates toward each of the two or more side surfaces 13 included in one protrusion. Alternatively, the liquid material 19 may aggregate only on one side surface 13 of one protrusion. If the liquid body 19 is agglomerated toward each of the two or more side surfaces 13 of one protrusion, it is possible to form two or more wires for each protrusion. Therefore, compared to the method of forming one wire for each protrusion, the number of protrusions necessary for forming the wire can be reduced, or the distance between the wires can be shortened. . In particular, when a plurality of protrusions are arranged along one direction and the liquid aggregates on each of two side surfaces facing each other at one protrusion in the direction in which the protrusions are arranged, one protrusion Compared with the method of forming a single wire, the distance between the wires in the direction in which the protrusions are arranged can be shortened.

  Moreover, when a recessed part comprises the step part 10, the bottom face 11 of the step part 10 is the bottom face 11 of a recessed part, and the top surface 12 of the step part 10 is a part other than the recessed part in the surface of the base material Sb. The side surface 13 of the stepped portion 10 is a side surface 13 that rises along the depth direction from the bottom surface 11 in the recess. As described above, even when one concave portion has two or more side surfaces 13, the liquid material 19 is aggregated toward each of the two or more side surfaces 13 included in one concave portion in the liquid material application step. Alternatively, the liquid material 19 may aggregate only on one side surface 13 of one concave portion. If the liquid body 19 is agglomerated toward each of the two or more side surfaces 13 of one recess, it is possible to form two or more wires for each recess. Therefore, compared to the method of forming one wire for each recess, the number of recesses necessary for forming the wire can be suppressed, or the distance between the wires can be shortened. In particular, when a plurality of recesses are arranged along one direction and the liquid aggregates on each of two side surfaces facing each other at one recess in the direction in which the recesses are arranged, one wire is provided for each recess. Compared with the method of forming the wire, the distance between the wires in the direction in which the recesses are arranged can be shortened.

  It is most important that the liquid 19 used in the liquid coating process includes metal particles that include a material for forming a wire and a dispersion medium that disperses the metal particles. For example, a dispersion that improves the dispersibility of the metal particles. An auxiliary agent may be included, or this may be omitted. The material forming the wire is at least one selected from the group consisting of gold, silver, and copper, for example. The liquid material used in the liquid material application step is away from the liquid-repellent portion in the stepped portion 10 and follows the portion having lyophilicity to agglomerate in the lyophilic portion. What is necessary is just to have a viscosity, for example, it is preferable that it is a viscosity of 50 cP or less.

  The liquid material 19 used in the liquid material coating step has a composition in which the contact angle at the portion having liquid repellency in the stepped portion 10 and the contact angle at the portion having lyophilicity are larger. Preferably there is. The liquid material 19 used in the liquid material coating process is solid enough to reduce the volume only to cover the entire side surface 13 of the stepped portion 10 even if the volume is reduced by drying the liquid material 19 or subsequent firing. It is preferable to include a minute. For example, an ink jet device, a spray coater, and a spin coater are used for applying the liquid material 19.

  In the liquid drying process, it is most important that the dispersion medium is removed from the liquid 19 applied to the stepped portion 10 and the liquid 19 is cured. At this time, the removal of the dispersion medium from the liquid material 19 may be that the dispersion medium evaporates due to heat applied to the liquid material 19, or the dispersion medium is dispersed by lowering the partial pressure of the dispersion medium above the liquid material 19. The medium may evaporate, or a combination thereof. In addition, the liquid body drying step may further include a process of baking the cured body of the liquid body 19 or may be omitted. In addition, in the liquid body drying step, compared to the method in which the metal wire is formed from the liquid body filled in the recesses formed between the rib portions, the area in contact with the external atmosphere per unit volume of the liquid body 19 is larger. growing. Therefore, even if the liquid drying process includes a process in which heat is applied to the liquid 19 and a process in which the cured body is baked, the processing temperature should be lower than the method in which the liquid is filled in the recesses described above. Is possible. Therefore, a resin substrate or a resin sheet can be selected as the base material forming material.

  The liquid 19 aggregated in the stepped portion 10 is cured in a state of following the side surface 13 of the stepped portion 10 and the side surface 13 of the stepped portion 10 by removing the dispersion medium contained therein. That is, the side surface 13 of the stepped portion 10 and the corner portion 14 of the stepped portion 10 support the cured body of the liquid material 19 on the side surface 13 and the bottom surface 11 in the process of drying the liquid material 19. It has a function. In addition, the hardening body of the liquid body 19 may function as a wire in this state, or may function as a wire by firing the hardening body.

  Hereinafter, among the manufacturing method of the wire grid polarizer described above, the ridges made of resist constitute a stepped portion, and a plurality of stepped portions are aligned along the juxtaposed direction intersecting the extending direction of the ridges, An example in which each of the plurality of stepped portions is subjected to a process for increasing the liquid repellency will be described with reference to FIGS.

  As shown in FIG. 5, first, in the step portion forming step, a resist layer 22 having a predetermined thickness is formed on a surface 21 s which is one side surface of a glass substrate 21 having a rectangular plate shape which is an example of a base material. It is formed. The base material is not limited to the glass substrate 21 and may be, for example, a resin substrate formed of various resins, or may be thinner than the resin substrate and flexible enough to be wound into a roll shape. It may be a resin sheet.

  The forming material of the resist layer 22 may be a positive type resist or a negative type resist. The resist may be any of a photo resist, an electron beam resist, and an X-ray resist. For example, a spin coater or a spray coater is used to form the resist layer 22.

  As shown in FIG. 6, the resist pattern 22 is formed on the surface 21 s of the glass substrate 21 by performing pre-bake, exposure, development, and post-bake processes in order on the resist layer 22, that is, by photolithography. It is formed. The resist pattern 23 includes a plurality of rib portions 24 that are ridges and a plurality of protective film portions 25.

  Each of the plurality of rib portions 24 has a linear shape extending along an extending direction that is a direction parallel to one side constituting the surface 21 s of the glass substrate 21. Each of the plurality of rib portions 24 is arranged along a juxtaposed direction that is a direction intersecting the extending direction of the rib portions 24. In FIG. 2, the extending direction of each of the plurality of rib portions 24 is a direction perpendicular to the paper surface, and the parallel arrangement direction of the plurality of rib portions 24 is the left-right direction with respect to the paper surface. Each of the plurality of protective film portions 25 is located in each of the portions that are sandwiched between the two rib portions 24 on the surface 21 s and are separated from the two rib portions 24.

  Each rib portion 24 has an inverted trapezoidal columnar shape as viewed from the extending direction of the rib portion 24. Of the surface of the rib portion 24, the surface constituting the base of the inverted trapezoid as viewed from the extending direction of the rib portion 24 is a rib top surface 24t that is an example of the top surface of the stepped portion. Of the surfaces extending along the extending direction of the rib portion 24, each of the two surfaces other than the rib top surface 24t is a rib side surface 24s that is an example of a side surface of the stepped portion. Of the surface 21 s of the glass substrate 21, a portion located between the adjacent rib portions 24 is a surface portion 21 b that is an example of a bottom surface of a step portion. In the two rib portions 24 adjacent to each other, the distance between the two rib side surfaces 24s facing each other is larger as it is closer to the surface 21s of the glass substrate 21, and is the maximum in the surface portion 21b.

  The plurality of rib portions 24 may be formed at equal intervals on the surface 21 s of the glass substrate 21, or may be formed at different intervals. On the surface 21 s of the glass substrate 21, even if a portion occupied by one rib portion 24 and a portion corresponding to a gap between two adjacent rib portions 24 have the same length in the juxtaposed direction. It is also possible to have different lengths.

  For example, when the wire grid is composed of a plurality of wires arranged in the juxtaposed direction and the intervals between two wires adjacent to each other in the juxtaposition direction are equal to each other, the plurality of rib portions 24 have the following configuration. . That is, the repeated distance of the rib portions 24 in the juxtaposed direction is the rib pitch P1, and the rib pitch P1 is the width of the rib top surface 24t in the juxtaposed direction and the two rib portions 24 adjacent to each other in the juxtaposed direction. It is the sum with the interval between. In each of the plurality of rib portions 24, the rib pitch P1 is constant, and the width of the rib top surface 24t is also constant.

  The protective film portion 25 extends along a direction parallel to the extending direction of the rib portion 24, and the thickness that is the width along the normal direction to the surface 21 s of the glass substrate 21 is smaller than the thickness of the rib portion 24. The thickness of the rib portion 24 is preferably smaller than one tenth. The width W in the protective film portion 25 along the juxtaposed direction is preferably equal to the distance between the rib top surfaces 24t of the two rib portions 24 sandwiching the single protective film portion 25. As viewed from the normal direction to the surface 21 s of the glass substrate 21, the entire protective film portion 25 preferably overlaps with the space between the two rib portions 24 sandwiching the protective film portion 25.

  In the resist pattern 23 having the plurality of rib portions 24 and the plurality of protective film portions 25, the exposure amount is adjusted according to the resist pattern 23 in the exposure process for the resist layer 22, for example, It is formed by exposure using a mask.

  As shown in FIG. 7, a liquid repellency setting process using a glass substrate 21 having a resist pattern 23 is performed. In the process of increasing the liquid repellency, for example, various plasma generation apparatuses are used, and the plasma P generated from the gas containing fluorine is supplied to the glass substrate 21 located inside the plasma generation apparatus. The gas containing fluorine may be, for example, a hydrocarbon hydrocarbon gas, and carbon tetrafluoride is preferable. By supplying plasma P to the glass substrate 21, liquid repellency is mainly imparted to the rib top surfaces 24 t of the rib portions 24 and the protective film portions 25.

  At this time, since each rib portion 24 is formed in an inverted trapezoidal columnar shape, on the rib side surface 24 s of the glass substrate 21, the plasma P is a portion near the edge in contact with the glass substrate 21 in each rib portion 24, that is, a step. It becomes difficult to be supplied to the corner part 24e of the part. Further, since the entire protective film portion 25 overlaps the space between the two rib portions 24 sandwiching the protective film portion 25 in the normal direction to the surface 21 s of the glass substrate 21, While the plasma P passing through the gap mainly reaches the protective film portion 25, it hardly reaches the surface 21s of the glass substrate 21. Therefore, for example, even when the plasma P generated from the carbon tetrafluoride gas for etching the glass substrate 21 is used, the surface 21s of the glass substrate 21 is suppressed from being etched, and a step difference from the rib side surface 24s. The liquid repellency is enhanced except for the corner 24e. Thereby, the base material 31 for wire grid polarizer which is a structure in the middle of manufacture of a wire grid polarizer is formed.

  When the plasma P is supplied to the glass substrate 21, it is more preferable that a bias voltage is applied to the glass substrate 21. By applying a bias voltage to the glass substrate, positive ions including fluorine in the plasma P are moved along the normal direction with respect to the surface 21 s of the glass substrate 21. It becomes easy to reach the protective film part 25. Therefore, the plasma P passing through the gap between the two adjacent rib portions 24 can easily reach only the protective film portion 25 that is a portion other than the corner portion 24e of the stepped portion.

  As shown in FIG. 8, a liquid material 26 containing metal particles is applied to the glass substrate 21 and the resist pattern 23. At this time, the rib top surface 24t of each rib part 24 and the protective film part 25 have liquid repellency. Therefore, the liquid material 26 applied to the glass substrate 21 and the resist pattern 23 is a portion that is lyophilic with respect to these liquid-repellent portions, that is, the two rib side surfaces 24 s described above in each rib portion 24. And agglomerates in the corner 24e of the stepped portion. Therefore, when the liquid material is supplied to the glass substrate 21, the liquid material 26 is divided into two rib side surfaces 24 s of each rib portion 24 and a portion connected to the two rib side surfaces 24 s on the surface of the glass substrate 21. A film is formed.

  Since each rib portion 24 is formed in an inverted trapezoidal columnar shape, the liquid material applied to the rib side surface 24s of each rib portion 24 spreads over the entire rib side surface 24s, and each rib portion 24 and the protective film portion 25 are spread. It is easy to reach the gap between the two, that is, the corner 24e of the stepped portion. Further, the liquid material 26 applied to the rib top surface 24t of each rib portion 24 wets and spreads over the entire rib side surface 24s and moves along the direction of gravity due to its own weight, so that the rib portions 24 and the protective film portion 25 are separated from each other. It collects in the gap between. As a result, in the film of the liquid material 26 formed between the two adjacent rib portions 24, the width along the juxtaposed direction becomes larger as the surface 21s of the glass substrate 21 is closer.

  As shown in FIG. 9, a plurality of metal wires 27 are formed on the glass substrate 21 by baking the film of the liquid material 26. Two metal wires 27 are formed in a state of sandwiching one rib portion 24 in a direction orthogonal to the extending direction. Therefore, the plurality of metal wires 27 are formed on the surface 21 s of the glass substrate 21 at a wire pitch P <b> 2 that is a substantially half pitch of the rib pitch P <b> 1 where the plurality of rib portions 24 are formed.

  In this way, the metal wire 27 can be formed with a wire pitch P2 smaller than the rib pitch P1 where the plurality of rib portions 24 are formed, using the resist pattern 23 having the plurality of rib portions 24. For example, when the rib pitch P1 is 300 nm, the wire pitch P2 can be approximately 150 nm. As a result, since the wire pitch P2 is smaller than when the metal wires 27 are formed at the same pitch as the rib pitch P1, the transmittance of the wire grid polarizer including the plurality of metal wires 27 can be increased.

  Similarly, as shown in FIG. 9, the ashing process is performed on the glass substrate 21 having the metal wires 27, whereby the plurality of rib portions 24 and the plurality of protective film portions 25 are removed. For the ashing process, for example, an ashing apparatus is used, and plasma generated from oxygen gas is supplied to the glass substrate 21 located inside the ashing apparatus. Thereby, a wire grid polarizer 32 having a plurality of metal wires 27 is formed.

In order to improve the polarization characteristics of the wire grid polarizer 32, it is preferable that the wire grid polarizer 32 does not have the resist pattern 23.
As described above, according to the first embodiment, the following effects can be obtained.

  (1) Since the liquid material 26 for forming the metal wire 27 aggregates in the glass substrate 21 and the portion where the metal wire 27 is formed in the resist pattern 23, the utilization efficiency of the metal material can be improved.

  (2) Since each rib portion 24 is formed in an inverted trapezoidal columnar shape, the liquid material 26 is easily held on the two rib side surfaces 24 s and the surface portion 21 b facing each other in each rib portion 24.

(3) It is easy to selectively perform liquid repellency treatment on the bottom surfaces other than the rib top surface 24t and the corner portions 24e constituting the stepped portion.
(4) Even if the glass substrate 21 etched by the plasma P generated from the carbon tetrafluoride gas is used as a base material, the surface 21 s of the glass substrate 21 is provided by providing the protective film portion 25 with liquid repellency. Liquid repellency is given to the top. Therefore, the liquid material 26 is likely to adhere to the two rib side surfaces 24 s facing each other in each rib portion 24.

  (5) Since two metal wires 27 are formed with respect to one rib portion 24, compared to a method in which one metal wire is formed in a recess formed between two rib portions, the metal wire 27 wire pitch P2 can be reduced. Thereby, the transmittance | permeability of a wire grid polarizer can be raised.

Note that the first embodiment can be implemented with appropriate modifications as follows.
In the process of increasing the liquid repellency, the bias voltage may not be applied to the glass substrate 21. If each rib portion 24 is formed in an inverted trapezoidal columnar shape, the plasma P reaches the rib top surface 24t and the protective film portion 25 of each rib portion 24 even if no bias voltage is applied to the glass substrate 21. The tendency that the plasma P hardly reaches near the edge in contact with the glass substrate 21 in each rib portion 24 is maintained.

  -Each rib part 24 does not need to be formed in an inverted trapezoidal column shape, may be formed in a trapezoidal column shape, may be formed in a rectangular column shape, may be formed in a polygonal column shape, or these inverted trapezoidal shapes. The rib portions 24 having at least two shapes selected from the group consisting of a columnar shape, a trapezoidal columnar shape, a rectangular columnar shape, and a polygonal columnar shape may be mixed. Even if each rib portion 24 has such a shape, the above-described (( The effect according to 1) can be obtained.

  In addition, in the gap between the two adjacent rib portions 24, a configuration in which the width along the juxtaposition direction increases as the distance from the surface 21s of the glass substrate 21 increases, for example, two rib portions 24 having a trapezoidal columnar shape are arranged. In the configuration, the following liquid repellency setting step is preferable. That is, in order to provide relatively high liquid repellency in the stepped portion to the side surface and the corner portion of the stepped portion, a mask that covers the side surface and the corner portion of the stepped portion is disposed above the glass substrate 21. Thus, it is preferable to supply the above-described plasma. Further, in order to provide relatively high liquid repellency in the stepped portion to the side surface and the corner portion of the stepped portion, a mask that exposes the side surface and the corner portion of the stepped portion is disposed above the glass substrate 21. Thus, it is preferable to separately supply plasma with enhanced lyophilicity toward the glass substrate 21.

  The resist pattern 23 may not have the protective film part 25. When the resist pattern 23 does not have the protective film portion 25, a base material that is not etched by the plasma P of the gas containing fluorine is selected, that is, either a resin sheet or a plastic substrate is used as the base material. Preferably it is selected. Alternatively, as the gas containing fluorine, a gas that does not etch the glass substrate 21 when the plasma P is generated is selected, or the time during which the plasma P is supplied or the temperature of the glass substrate 21 changes the glass substrate 21. It is preferable that the etching is not performed. Note that even if the base material is a glass substrate and the fluorine-containing gas is a carbon tetrafluoride gas, the glass substrate is etched, but the portion where the fluorine-containing particles are attached to the glass substrate Not a little, liquid repellency is given.

  In the liquid repellency setting step, when a thin film that does not have resistance to etching is formed on the surface of the base material while the base material has resistance to etching, the thin film is removed from the base material, thereby It is sufficient if resistance to etching is given.

  -In the liquid repellency setting process, when the substrate does not have resistance to etching, it is only necessary that the substrate is resistant to etching by substitution of elements or functional groups that give resistance to etching on the surface of the substrate. .

  The extending direction, which is the direction in which each rib portion 24 extends, may not be a direction parallel to one side constituting the glass substrate 21, for example, a direction that intersects one side at a predetermined angle other than orthogonal. May be.

  A wire grid polarizer may be formed by transferring the metal wires 27 shown in FIG. 9 to the transfer substrate. According to such a configuration, a substrate formed from a material that does not have resistance to photolithography and liquid repellent treatment can be used as the substrate of the wire grid polarizer, so freedom in the selection of the substrate of the wire grid polarizer The degree increases.

  8 is transferred to the transfer substrate together with the plurality of rib portions 24 and the plurality of protective film portions 25, so that the wire grid polarizer is formed. It may be formed. Note that the plurality of rib portions 24 and the plurality of protective film portions 25 may or may not be removed after transfer to the transfer substrate.

[Second Embodiment]
With reference to FIG. 10 to FIG. 14, a method for manufacturing a wire grid polarizer and a second embodiment in which a substrate for a wire grid polarizer is embodied will be described. The second embodiment differs from the first embodiment in the shape of the stepped portion formed in the stepped portion forming step. Therefore, in the following, such differences will be described in detail, and other descriptions will be omitted.

  In the step portion forming step, a plurality of step portions are arranged along one direction. At this time, each of the plurality of stepped portions includes a ridge extending along a direction intersecting the direction in which the plurality of stepped portions are arranged, and the step provided in the stepped portion is a step provided in the ridge. In the stepped portion forming step, a reinforcing portion that is a protrusion that extends along a direction intersecting the direction in which the protrusion extends and connects two adjacent protrusions is formed.

  As shown in FIG. 10, the stepped portion 10 formed in the stepped portion forming step includes a bottom surface 11, a top surface 12, and a protrusion 41 composed of a side surface 13 that connects the bottom surface 11 and the top surface 12. Yes. The step portion 10 includes a reinforcing portion 42 that connects between the side surfaces 13 facing each other by two adjacent protrusions 41. At this time, the protrusion 41 only needs to extend along a direction intersecting the parallel arrangement direction in which the plurality of stepped portions 10 are arranged, and may extend along a direction orthogonal to the parallel arrangement direction. You may extend along the direction which forms an angle other than orthogonal with an installation direction. The protrusions 41 need only extend along one direction, and may have a rectangular parallelepiped shape that extends along two different directions.

  The reinforcing portion 42 of the stepped portion 10 only needs to extend along a direction intersecting with the direction in which the ridge 41 extends, or may extend along a direction orthogonal to the direction in which the ridge 41 extends, You may extend along the direction which forms an angle other than the direction where the strip | line 41 is extended, and orthogonal. The reinforcing portion 42 extends from the surface Sb1 of the base material Sb along the above-described protruding direction, and the top surface of the reinforcing portion 42 may be located on the same plane as the top surface 12 of the stepped portion 10. It may be located on a plane higher than the surface 12, or may be located on a plane lower than the top surface.

  The reinforcement part 42 should just be a protrusion extended along the protrusion direction from the surface Sb1 of the base material Sb, and may be a rectangular parallelepiped shape extending along two directions, or a rectangular parallelepiped shape extending along two directions. Other cube shapes may be used. The magnitude | size along the extension direction where the protrusion 41 extends in the reinforcement part 42 should just be smaller than the magnitude | size of the protrusion 41 along the extension direction. One reinforcing portion 42 may be positioned between two adjacent protrusions 41, or two or more reinforcing portions 42 may be positioned.

  The manufacturing method of the wire grid polarizer may include a step of removing the step portion 10 after the wire is formed, and the step of removing the step portion 10 may be omitted. When the manufacturing method of the wire grid polarizer includes a step of removing the stepped portion 10, the protrusion 41 may be removed together with the reinforcing portion 42, or the protrusion 41 may be removed before the reinforcing portion 42. And the reinforcement part 42 may be removed before a protrusion.

  Hereinafter, among the manufacturing method of the wire grid polarizer described above, the plurality of stepped portions are arranged along the juxtaposed direction intersecting the extending direction of the ridges, and the plurality of reinforcing portions are extending directions of the ridges. An example of connecting two adjacent ridges that extend along a direction intersecting with each other will be described with reference to FIGS. 11 to 14.

  As shown in FIG. 11, a plastic substrate 43, which is an example of a base material, has a resist pattern 23 formed by photolithography. The resist pattern 23 includes a plurality of rib portions 24 that are protrusions and a plurality of reinforcing portions 42.

  Each of the plurality of rib portions 24 has a linear shape extending along the above-described extending direction, and is arranged along a juxtaposed direction that is a direction intersecting with the extending direction of the rib portions 24. In FIG. 11, the extending direction of each of the plurality of rib portions 24 is the vertical direction with respect to the paper surface, and the parallel arrangement direction of the plurality of rib portions 24 is the left-right direction with respect to the paper surface. The resist pattern 23 includes a reinforcing portion 42 that extends along the juxtaposed direction and connects two rib portions 24 adjacent to each other in the juxtaposed direction.

  As shown in FIG. 12, each reinforcing portion 42 has a trapezoidal column shape when viewed from the extending direction of the rib portion 24. Each reinforcing portion 42 extends along the protruding direction from the surface 43 s that is one side surface of the plastic substrate 43, and the top surface of each reinforcing portion 42 is the same plane as the plane on which the rib top surface 24 t of each rib portion 24 is located. Located on the top.

  In the liquid repellency setting step, liquid repellency is also given to the top surface of the reinforcing portion 42 among the plurality of side surfaces constituting the reinforcing portion 42. Thereby, the base material 31 for wire grid polarizers is formed.

  As shown in FIG. 13, the liquid material 26 described above is applied to the plastic substrate 43 and the resist pattern 23. As a result, the liquid material 26 applied to the plastic substrate 43 and the resist pattern 23 is a portion that is lyophilic with respect to the portion having liquid repellency, that is, the above-described two ribs in each rib portion 24. The side surface 24s and the corner portion 24e of the stepped portion are aggregated.

  In the liquid material application step, when an external force is applied to each rib portion 24 by applying the liquid material 26, the reinforcing portion 42 connected to each rib portion 24 along the direction intersecting with the extending direction of each rib portion 24 is a rib portion. In order to support 24, the mechanical strength of each rib part 24 increases.

  As shown in FIG. 14, a plurality of metal wires 27 are formed on the plastic substrate 43 by baking the film of the liquid material 26. The plurality of metal wires 27 are formed on the surface 43 s of the plastic substrate 43 at a wire pitch P <b> 2 that is substantially half the rib pitch P <b> 1 on which the plurality of rib portions 24 are formed.

  Similarly, as shown in FIG. 14, the ashing process is performed on the plastic substrate 43 having the metal wires 27, thereby removing the plurality of rib portions 24 and the plurality of reinforcing portions 42. That is, both the plurality of rib portions 24 and the plurality of reinforcing portions 42 are removed from the plastic substrate 43 by a single ashing process.

According to the second embodiment described above, the effects listed below can be obtained.
(6) When an external force is applied to each rib portion 24 by applying the liquid material 26, the reinforcing portion 42 connected to the stepped portion supports the rib portion 24, so that the mechanical strength of the rib portion 24 is increased.

(7) Both the plurality of rib portions 24 and the plurality of reinforcing portions 42 can be removed from the plastic substrate 43 by a single ashing process.
In addition, 2nd Embodiment can be changed and implemented suitably as follows.

If the resist pattern 23 has one or more reinforcing portions 42, the effect according to the above (5) can be obtained.
The base material is not limited to the plastic substrate 43 but may be a glass substrate or a resin sheet. In addition, when a base material is a glass substrate, it is preferable that the protective film part 25 demonstrated in 1st Embodiment is formed on a glass substrate. Alternatively, plasma that is generated from a fluorine-containing gas and does not etch the glass substrate is used in the liquid-repellent treatment, or the plasma supply time and the glass substrate temperature are such that the glass substrate is not etched. It is preferable.

  -Each rib part 24 does not need to be formed in an inverted trapezoidal column shape, may be formed in a trapezoidal column shape, may be formed in a rectangular column shape, may be formed in a polygonal column shape, or these inverted trapezoidal shapes. The rib portions 24 having at least two shapes selected from the group consisting of a columnar shape, a trapezoidal columnar shape, a rectangular columnar shape, and a polygonal columnar shape may be mixed. The shape of the reinforcing portion 42 is not limited to the trapezoidal column shape, but is preferably changed according to the shape of the rib portion 24. For example, when the rib portion 24 has a trapezoidal column shape, the reinforcing portion 42 has an inverted trapezoidal column shape. Preferably, the reinforcing portion 42 is also formed in a rectangular column shape when the rib portion 24 is in a rectangular column shape.

  The extending direction, which is the direction in which each rib portion 24 extends, does not have to be a direction parallel to one side constituting the plastic substrate 43, for example, a direction intersecting one side at a predetermined angle other than orthogonal. May be.

  A wire grid polarizer is formed by transferring the metal wires 27 formed by firing the liquid material 26 shown in FIG. 13 to the transfer substrate together with the plurality of rib portions 24 and the plurality of reinforcing portions 42. May be. The plurality of rib portions 24 and the plurality of reinforcing portions 42 may or may not be removed after the transfer to the transfer substrate.

  DESCRIPTION OF SYMBOLS 10 ... Step part, 11 ... Bottom surface, 12 ... Top surface, 13 ... Side surface, 14, 24e ... Corner | angular part, 15 ... Bottom liquid-repellent part, 16 ... Top surface liquid-repellent part, 17 ... Corner part lyophilic part, 18 ... Side lyophilic part, 19, 26 ... liquid, 21 ... glass substrate, 21b ... surface part, 21s ... surface, 22 ... resist layer, 23 ... resist pattern, 24 ... rib part, 24s ... rib side face, 24t ... rib top Surface, 25 ... Protective film part, 27 ... Metal wire, 31 ... Base material for wire grid polarizer, 32 ... Wire grid polarizer, 41 ... Projection, 42 ... Reinforcement part, 43 ... Plastic substrate, 43s ... Surface, P1 ... rib pitch, P2 ... wire pitch, Sb ... base material, Sb1, Sb2 ... surface.

Claims (8)

Forming a stepped portion on a surface of the base material, wherein the stepped portion includes a bottom surface, a top surface, and a side surface connecting the bottom surface and the top surface, and the step included in the stepped portion is formed on the bottom surface. And the top surface, and the bottom surface and the top surface extend along one direction,
The liquid repellency of the liquid containing metal particles is liquid repellency, the liquid repellency of the bottom surface other than the corners formed by the bottom surface and the side surface, and the liquid repellent property of the top surface. Setting the liquidity higher than the liquid repellency of the corners and the liquid repellency of the side surfaces;
Forming the wire by aggregating the liquid material applied to the stepped portion on the side surface and the corner portion, and drying the agglomerated liquid material. Manufacturing method of grid polarizer. In forming the stepped portion,
The method for manufacturing a wire grid polarizer according to claim 1, wherein an angle formed by the side surface and the bottom surface is an acute angle. In setting the liquid repellency,
The method of manufacturing a wire grid polarizer according to claim 2, wherein plasma generated from a gas containing fluorine is drawn toward the bottom surface. In forming the stepped portion,
The step portion includes a ridge having a linear shape extending along one direction, the step which the step portion has is a step which the ridge has, and in a direction intersecting the direction in which the ridge extends. Arranging a plurality of the stepped portions along,
A reinforcing portion that is a protrusion that extends along a direction intersecting with the direction in which the protrusion extends and that connects the two protrusions adjacent to each other is further formed. 5. The manufacturing method of the wire grid polarizer of one term. The method for manufacturing a wire grid polarizer according to claim 4, further comprising removing the stepped portion together with the reinforcing portion from the surface of the base material after the wire is formed. The substrate is a glass substrate;
In setting the liquid repellency,
Before the plasma retraction,
The method of manufacturing a wire grid polarizer according to claim 3, further comprising: providing etching resistance by the plasma to a portion other than the corner portion and the top surface in the bottom surface. A substrate having a surface having a stepped portion,
The step portion is
A bottom surface, a top surface, and a side surface that connects the bottom surface and the top surface, and the step of the stepped portion is a difference in height between the bottom surface and the top surface and is continuous along one direction. ,
The liquid repellent property of liquid containing metal particles is liquid repellent,
Of the bottom surface, the liquid repellency of a portion other than the corner portion composed of the bottom surface and the side surface, and the liquid repellency of the top surface are the liquid repellency of the corner portion, and A substrate for a wire grid polarizer that has higher liquid repellency. The substrate for a wire grid polarizer according to claim 7, further comprising a cured body of the liquid material on the corner portion and the side surface.

Images