JP2015078443A - Pretreatment agent for electrolytic copper plating, pretreatment method for electrolytic copper plating, and electrolytic copper plating method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a pretreatment agent for electrolytic plating which does not impair adhesiveness between ground copper and a resist or adhesiveness between ground copper and an electrolytic copper plated film.SOLUTION: A method of pretreating a surface of a to-be-treated object having a resist pattern for circuit formation made by forming an electrolytic copper plated film on ground copper through electrolytic copper plating on which surface the circuit on the ground copper is to be formed is characterized by immersing the object having the ground copper in a pretreatment agent for electrolytic plating consisting of an aqueous solution comprising (A) 0.01-200 g/L of one or more adsorption inhibitors selected from triazole compounds, pyrazole compounds and imidazole compounds, (B) 0.01-200 g/L of chloride ion and (C) 0.1-200 g/L of a nonionic surfactant.

Description

  The present invention particularly relates to a pretreatment agent for electrolytic copper plating suitable for pretreatment of a printed wiring board in which a resist (ink or dry film) for circuit formation is applied on a copper film, before electrolytic copper plating. The present invention relates to a processing method and an electrolytic copper plating method.

  The printed wiring board includes a double-sided printed wiring board and a multilayer printed wiring board, which are provided with via holes and through holes for forming circuits between layers. The via hole or the through hole is subjected to electroless copper plating for providing conduction between layers, and a resist for forming a circuit is formed on the substrate surface. Then, after pre-treating the substrate, electrolytic copper plating is performed to ensure the necessary copper thickness as a conductor.

  Since the resist is designed to be exfoliated in particular alkaline, the pretreatment agent used for the pretreatment of the electrolytic copper plating is often neutral or acidic, particularly acidic. Conventional acidic pretreatment agents generally contain a surfactant and an inorganic or organic acid. Acidic pretreatment agents are often used to impart wettability into via holes and through holes, and to remove stains on the surface of copper or copper alloys, before performing electrolytic copper plating.

  The underlying copper film of the circuit (electroless plated copper and copper foil) is oxidized on the surface by the chemical type, detergency and drying unevenness when developing the resist. In some cases, the adhesion of the resin was inhibited.

  Conventional acidic pre-treatment agents are considered to have a weak cleaning effect on the oxide film on the copper surface. Therefore, in order to obtain a better cleaning effect, development of a pre-treatment agent that strongly removes the oxide film is required. It was done. However, if the cleaning is performed too strongly, the adhesion between the base copper and the resist deteriorates and the resist is peeled off.

  In addition, the following are mentioned as prior art documents relevant to the present invention.

Japanese Patent No. 2604632 Japanese Patent Laid-Open No. 3-191077 JP 2001-089882 A Japanese Patent No. 4208826 JP 2009-132967 A JP-A-10-212593 JP 2005-113162 A Japanese Patent No. 4090951 JP-A-2005-333104 JP 2000-104177 A

  The present invention has been made in view of the above circumstances, and is a pretreatment agent for electrolytic copper plating that does not impair the adhesion between the underlying copper and the resist and the adhesion between the underlying copper and the electrolytic copper plating film, before the electrolytic copper plating. It aims at providing a processing method and an electrolytic copper plating method.

  As a result of intensive studies to achieve the above object, the present inventors do not perform strong cleaning as previously thought, but adsorb resist adsorbing components that have a large adverse effect on adhesion to the underlying copper. Prior to this, the inventors have found that the above-mentioned object can be achieved by first adsorbing and washing an adsorption inhibitor component having a small adverse effect on adhesiveness on the base copper, thereby achieving the present invention.

Accordingly, the present invention provides the following pretreatment agent for electrolytic copper plating, pretreatment method for electrolytic copper plating, and electrolytic copper plating method.
Claim 1:
This is a method for pre-treating the surface of the base copper on which the circuit is formed, on which a resist pattern for forming a circuit is formed by forming an electrolytic copper plating film on the base copper by electrolytic copper plating. And
(A) 0.01 to 200 g / L of one or more adsorption inhibitors selected from triazole compounds, pyrazole compounds and imidazole compounds,
(B) 0.01-200 g / L of chloride ion, and (C) 0.1-200 g / L of nonionic surfactant.
A pretreatment method for electrolytic copper plating, comprising immersing the object to be treated having the base copper in a pretreatment agent for electroplating, which is an aqueous solution containing as an essential component.
Claim 2:
Further, (D) one or more solvents selected from water-soluble ethers, amines, alcohols, glycol ethers, ketones, esters and fatty acids are contained at 0.01 to 200 g / L. The pretreatment method for electrolytic copper plating according to claim 1, wherein:
Claim 3:
Furthermore, (E) acid is contained at 0.1-200 g / L, The pre-processing method of the electrolytic copper plating of Claim 1 or 2 characterized by the above-mentioned.
Claim 4:
The pretreatment method for electrolytic copper plating according to any one of claims 1 to 3, further comprising (F) an oxidizing agent at 0.01 to 200 g / L.
Claim 5:
The to-be-processed object which has the said base copper is immersed in the pretreatment agent for electroplating at the process temperature of 25-50 degreeC for 1 to 30 minutes, The any one of Claims 1 thru | or 4 characterized by the above-mentioned. Pretreatment method for electrolytic copper plating.
Claim 6:
The pretreatment method for electrolytic copper plating according to any one of claims 1 to 5, wherein the object to be treated is immersed in the pretreatment agent for electroplating and subjected to ultrasonic treatment or electrolytic treatment.
Claim 7:
7. The surface of the substrate on which the circuit is formed, wherein the resist pattern for forming a circuit is formed by forming an electrolytic copper plating film on the underlying copper by electrolytic copper plating. An electrolytic copper plating method, wherein the electrolytic copper plating film is formed by electrolytic copper plating on the surface after pretreatment by the pretreatment method according to any one of the above.
Claim 8:
(A) 0.01 to 200 g / L of one or more adsorption inhibitors selected from triazole compounds, pyrazole compounds and imidazole compounds,
(B) 0.01-200 g / L of chloride ion, and (C) 0.1-200 g / L of nonionic surfactant.
A pretreatment agent for electrolytic copper plating, which is an aqueous solution containing as an essential component.
Claim 9:
Further, (D) one or more solvents selected from water-soluble ethers, amines, alcohols, glycol ethers, ketones, esters and fatty acids are contained at 0.01 to 200 g / L. The pretreatment agent for electrolytic copper plating according to claim 8.
Claim 10:
The pretreatment agent for electrolytic copper plating according to claim 8 or 9, further comprising (E) an acid in an amount of 0.1 to 200 g / L.
Claim 11:
The pretreatment agent for electrolytic copper plating according to any one of claims 8 to 10, further comprising (F) an oxidizing agent at 0.01 to 200 g / L.

  The pretreatment agent for electroplating of the present invention does not inhibit the adhesion between the base copper and the resist, and does not inhibit the adhesion between the base copper and the electrolytic copper plating film.

It is a schematic diagram which shows the method of adhesiveness evaluation of the base copper and plating film in an Example.

Hereinafter, the present invention will be described in detail.
The pretreatment agent for electroplating of the present invention is
(A) One or more adsorption inhibitors selected from triazole compounds, pyrazole compounds, imidazole compounds, cationic surfactants and amphoteric surfactants, and (B) aqueous solutions containing chloride ions as essential components. is there.

(A) Adsorption inhibitor The (A) adsorption inhibitor of this invention adsorb | sucks preferentially on a metal surface, and functions to suppress adsorption | suction to the metal surface of a resist elution component. The (A) adsorption inhibitor of the present invention is a triazole compound, a pyrazole compound, an imidazole compound, a cationic surfactant and an amphoteric surfactant, and these may be used alone or in combination of two or more. Good. The molecular weight of the component (A) of the present invention (in the case of a polymer, the weight average molecular weight) is preferably 1,000 or less, and particularly preferably 60 to 900.

  Specific examples of the triazole compound include triazole, benzotriazole, methylbenzotriazole, aminotriazole, aminobenzotriazole, and hydroxybenzotriazole. Specific examples of the pyrazole compound include pyrazole, dimethylpyrazole, phenylpyrazole, methylphenylpyrazole, and aminopyrazole. Specific examples of the imidazole compound include imidazole, methylimidazole, and phenylimidazole.

  Examples of the cationic surfactant include alkyltrimethylammonium type, dialkyldimethylammonium type, trialkylmethylammonium type, tetraalkylammonium type, benzyl type, pyridinium type, diammonium type, and amine salt type. it can. Examples of the amphoteric surfactant include amine oxide type, betaine type, imidazoline type, aminodiacetic acid type, alanine type, glycine type, sulfate ester type, sulfonic acid type, and phosphate ester type. .

  When using a triazole compound, a pyrazole compound, or an imidazole compound as the component (A) of the present invention, the concentration is preferably 0.01 to 200 g / L, and particularly preferably 0.05 to 10 g / L. If it is less than 0.01 g / L, the amount of adsorption may be too small to obtain the effects of the present invention. On the other hand, when it exceeds 200 g / L, the resist may be peeled off, and the economical efficiency is also lowered.

  Further, when a cationic surfactant or an amphoteric surfactant is used as the component (A) of the present invention, the concentration is preferably 0.01 to 200 g / L, particularly 0.5 to 10 g / L. It is preferable. If it is less than 0.01 g / L, the amount of adsorption may be too small to obtain the effects of the present invention. On the other hand, when it exceeds 200 g / L, the resist may be peeled off, and the economical efficiency is also lowered. In addition, a commercial item can be used as a cationic surfactant and an amphoteric surfactant.

(B) Chloride Ion In the present invention, the (B) chloride ion has a function of improving the uniformity of the cleaning performance of the metal surface by the acid by adsorbing to the crystal grain boundary of the metal. Compounds that supply chloride ions include hydrochloric acid, ammonium chloride, sodium chloride, potassium chloride, cationic surfactants containing chloride ions (including cationic dyes), oxo chlorides, etc. It is not limited. In addition, the said compound which supplies a chloride ion may be used individually by 1 type or in combination of 2 or more types.

  The concentration of chloride ions in the pretreatment agent of the present invention is preferably 0.01 to 200 g / L, particularly 0.04 to 100 g / L, and particularly preferably 0.2 to 50 g / L. . If it is less than 0.01 g / L, the cleaning performance may not be obtained. On the other hand, if it exceeds 200 g / L, the base copper may be discolored, and the economic efficiency is also lowered.

  In this invention, there exists an effect which the adhesiveness of the film | membrane by the electroplating of a post process improves by coexisting the said (A) and (B) component in a solution. This is because the component (A) suppresses adsorption of the resist-eluting component to the metal surface, and the (B) component effectively cleans the substrate surface having copper, thereby improving the adhesion between copper and copper. To do.

(C) Nonionic surfactant The pretreatment agent of the present invention preferably contains (C) a nonionic surfactant in addition to the components (A) and (B). The nonionic surfactant can increase the wettability of the object to be processed and improve the adsorption effect and the cleaning effect. Nonionic surfactants include alkyl ether type, alkyl phenyl ether type, alkyl amine type, alkyl amide type, polyhydric alcohol ether type, fatty acid ester type, POE polyhydric alcohol fatty acid ester type, polyhydric alcohol fatty acid ester type, Nonionic surfactants having an acetylene glycol type, polyoxyalkylene, polyoxyethylene, and an average HLB value of 10 to 18 can be used, and commercially available products can be used.

  When using a nonionic surfactant, it is preferable that the density | concentration is 0.1-200 g / L, and it is more preferable that it is 0.5-10 g / L. When the amount is less than 0.1 g / L, wettability may not be obtained. When the amount exceeds 200 g / L, the resist may be peeled off, and the economical efficiency is lowered.

  In addition, when a cationic surfactant or an amphoteric surfactant is used as the component (A), it is not necessary to add the component (C) separately as long as the wettability is sufficiently ensured.

(D) Solvent The pretreatment agent of the present invention preferably contains (D) a solvent in addition to the above components. The solvent can act as an auxiliary agent for cleaning the base copper. Examples of the solvent of component (D) include water-soluble ethers, amines, alcohols, glycol ethers, ketones, esters, and fatty acids, especially ethers such as dioxane and tetrahydrofuran, ethylamine, and ethanolamine. , Amines such as N-methyl-2-pyrrolidone and N, N-dimethylformamide, alcohols such as methanol, ethanol, propanol, ethylene glycol and propylene glycol, ethyl cellosolve, butyl cellosolve, diethylene glycol monoethyl ether, triethylene glycol mono Glycol ethers such as ethyl ether and propylene glycol monoethyl ether, ketones such as acetone, methyl ethyl ketone and butyl lactone, ethyl acetate, propyl acetate, butyl acetate and Esters such as cellosolve, propionic acid, butyric acid, formic acid, acetic acid, fatty acids such as lactic acid are preferred. In addition, you may use these solvents individually by 1 type or in combination of 2 or more types.

  When adding a solvent, it is preferable that the density | concentration is 0.01-200 g / L, and it is especially preferable that it is 0.1-50 g / L. When the amount is less than 0.01 g / L, the cleaning performance may not be improved. On the other hand, when the amount exceeds 200 g / L, the resist may be peeled off, and the economical efficiency is lowered.

(E) Acid In addition to the said component, it is preferable that the pretreatment agent of this invention contains (E) acid. The acid can improve the effect of removing the oxide film on the metal. The acid may be either an inorganic acid or an organic acid. Examples of the inorganic acid include sulfuric acid, nitric acid, hydrofluoric acid, and phosphoric acid. Examples of the organic acid include citric acid, formic acid, lactic acid, and alkylsulfone. An acid etc. are mentioned. These acids may be used alone or in combination of two or more.

  When the pretreatment agent of the present invention contains an acid, the concentration is preferably 0.1 to 200 g / L, and particularly preferably 1 to 100 g / L. When the amount is less than 0.1 g / L, the effect of removing the oxide film may not be obtained. When the amount exceeds 200 g / L, the resist may be peeled off, and the economy is also lowered.

  (B) When hydrochloric acid is used as a supply source of chloride ions, or (D) when fatty acids are added as a solvent, the component (E) is separately provided if the acid concentration satisfies the above appropriate range. May not be added.

(F) Oxidizing agent In addition to the above components, it is preferable to add (F) an oxidizing agent to the pretreatment agent of the present invention. The oxidizing agent can act as an auxiliary agent for cleaning the base copper. Examples of the oxidizing agent include, but are not limited to, peroxide, ferric chloride, cupric chloride, aqueous hydrogen peroxide, and the like. In addition, you may use these oxidizing agents individually by 1 type or in combination of 2 or more types.

  When an oxidizing agent is added, the concentration is preferably 0.01 to 200 g / L, and particularly preferably 1 to 50 g / L. If it is less than 0.01 g / L, the cleaning performance may not be improved. On the other hand, if it exceeds 200 g / L, the base copper may be discolored, and the economy is also lowered.

  The pretreatment agent of the present invention is a resist (ink or dry film) for forming a circuit by forming an electrolytic copper plating film on an underlying copper film (electroless plated copper, copper foil, etc.) by electrolytic copper plating. ), And is preferably used for pretreatment of the surface of the base copper film that forms the electrolytic copper plating film of the printed wiring board on which the circuit resist pattern is formed. As the pretreatment method, a method of immersing the workpiece in the pretreatment agent of the present invention is preferably employed. When performing the electroplating pretreatment using the pretreatment agent of the present invention, the treatment temperature is preferably 25 to 50 ° C, and particularly preferably 30 to 45 ° C. If it is less than 25 ° C., cleaning may be insufficient, and if it exceeds 50 ° C., the resist may be peeled off.

  The pretreatment time is preferably 1 to 30 minutes, particularly preferably 2 to 10 minutes. If it is less than 1 minute, a sufficient cleaning effect may not be obtained, and if it exceeds 30 minutes, the resist may be peeled off.

  Depending on the water washing conditions in the development process and the degree of drying unevenness, the oxide film on the surface of the underlying copper is strong, and the adhesion with the electrolytic copper plating film may be hindered. In such a case, it is preferable to perform ultrasonic treatment while immersing the workpiece in the pretreatment agent of the present invention. Washability can be improved by using ultrasonic treatment in combination with pretreatment.

  Similarly, when the oxide film on the surface of the underlying copper is strong and may interfere with the adhesion to the electrolytic copper plating film, the electrolytic treatment is performed while immersing the workpiece in the pretreatment agent of the present invention. You may go. By using the electrolytic treatment in combination with the pretreatment, the cleaning property can be improved.

  The electroplating method of the present invention is a method of performing electroplating after pretreatment of an object to be processed using the pretreatment agent of the present invention. As the electroplating method, electrolytic copper plating is a suitable target, and conventionally known electroplating baths and electroplating conditions can be employed as the electroplating method.

  EXAMPLES Hereinafter, the present invention will be specifically described with reference to examples and comparative examples, but the present invention is not limited to the following examples.

  As a substrate for evaluation, a substrate obtained by attaching a resist film to R-1705 manufactured by Panasonic Electric Works Co., Ltd. was used. As the resist film, Sunfort (ADH252) manufactured by Asahi Kasei E-Materials Co., Ltd. or Fotec (RY-3525) manufactured by Hitachi Chemical Co., Ltd. was used. The line / space was 25 μm / 25 μm, and the film thickness of the electrolytic copper plating was 20 μm.

[Examples 1 to 24, Comparative Examples 1 to 18]
Each pretreatment agent was prepared so that it might become a composition of following Table 2-Table 5. The adhesion evaluation was performed by the following method. In Tables 2 to 5, all units are g / L.

[Evaluation of adhesion between underlying copper and resist]
The evaluation substrate with the resist film attached was immersed in a pretreatment agent and treated at 35 ° C. for 3 minutes. The processed evaluation substrate was observed with an optical microscope (200 times magnification) to evaluate the presence or absence of resist peeling. When the resist did not peel, the adhesion was good, and when the resist peeled, the adhesion was poor. The results are shown in Tables 2 to 5. In Tables 2 to 5, ◯ represents good adhesion, and x represents poor adhesion.

[Evaluation of adhesion between base copper and plating film]
The substrate that had been plated in accordance with the steps shown in Table 1 below was immersed in a 40 g / L NaOH solution at 50 ° C. for 5 minutes to remove the resist. Enlarge the evaluation board with an optical microscope (magnification 200 times), and insert the cutting edge of the cutter knife 4 between the copper wirings of L / S = 25 μm / 25 μm until they contact the base copper 2 as shown in FIG. The plating film 3 was flipped in the horizontal direction. In FIG. 1, 1 represents a substrate. As a result, the adhesion was good when the base copper was peeled off together with the plating film and the resin was visible, and the adhesion was poor when only the plating film was peeled off and the base copper was visible. The results are shown in Tables 2 to 5. In Tables 2 to 5, ◯ represents good adhesion, and x represents poor adhesion.

１）〜３）は、いずれも上村工業（株）製めっき浴ビアフィリング用添加剤

1) to 3) are all additives for plating bath via filling manufactured by Uemura Kogyo Co., Ltd.

４）日油（株）製、ベタイン型両性界面活性剤
５）（株）ＡＤＥＫＡ製、アミンオキシド型両性界面活性剤
６）日油（株）製、アルキルトリメチルアンモニウム型カチオン性界面活性剤
７）日油（株）製、ジアルキルジメチルアンモニウム型カチオン性界面活性剤

4) NOF Corporation, betaine-type amphoteric surfactant 5) ADEKA Corporation, amine oxide-type amphoteric surfactant 6) NOF Corporation, alkyltrimethylammonium-type cationic surfactant 7) Dialkyldimethylammonium type cationic surfactant, manufactured by NOF Corporation

  From the results of Examples 1 to 12, the pretreatment agent for electroplating composed of an adsorption inhibitor and chloride ions had good adhesion.

８）日本乳化剤（株）製、ポリオキシエチレンアルキルエーテル型ノニオン性界面活性剤
９）日信化学工業（株）製、アセチレングリコール型ノニオン性界面活性剤

8) Polyoxyethylene alkyl ether type nonionic surfactant manufactured by Nippon Emulsifier Co., Ltd. 9) Acetylene glycol type nonionic surfactant manufactured by Nissin Chemical Industry Co., Ltd.

  From the results of Examples 13 to 24, the adhesion was good even when a nonionic surfactant, an acid, a solvent, and an oxidizing agent were included in addition to the adsorption inhibitor and chloride ion.

  In Comparative Example 16, which is a composition of a conventional general acidic pretreatment agent, poor adhesion between the base copper and the plating film occurred. From the results of Comparative Examples 1 to 5 and 8 to 14, in the single composition solution, adhesion failure between the base copper and the plating film occurred. From the results of Comparative Examples 6 and 7, when bromide ions or fluoride ions were added instead of chloride ions, poor adhesion between the base copper and the plating film occurred. From the result of Comparative Example 15 which is a composition of a conventional general microetching solution, adhesion failure between the base copper and the plating film occurred when microetching was performed. From the result of Comparative Example 17, if the chloride ion was not included, poor adhesion between the base copper and the plating film occurred. From the result of Comparative Example 18, if the adsorption inhibitor was not included, poor adhesion between the base copper and the plating film occurred.

[Examples 25 to 28]
Adhesion was evaluated according to the above method except that the pretreatment agent of Example 1 was used for pretreatment at a treatment temperature of 25, 30, 45, and 50 ° C. The results are shown in Table 6. The adhesion between the base copper and the resist and the adhesion between the base copper and the plating film were both good.

[Examples 29 to 33]
Adhesion was evaluated according to the above method except that the pretreatment agent of Example 1 was used for pretreatment at 1, 5, 10, 20, and 30 minutes. The results are shown in Table 7. The adhesion between the base copper and the resist and the adhesion between the base copper and the plating film were both good.

[Reference Example 1]
The substrate for evaluation was heat-treated at 120 ° C. for 2 hours before the pretreatment of the steps in Table 1 to oxidize the surface, and then using the pretreatment agent of Example 1 according to the above method, the base copper and the plating film The adhesion was evaluated. The results are shown in Table 8.

[Example 34]
The substrate for evaluation was heat-treated at 120 ° C. for 2 hours before the pretreatment of the process of Table 1 to oxidize the surface, and then the substrate for evaluation was pretreated in Example 1 during the pretreatment of the process of Table 1. The adhesion between the base copper and the plating film was evaluated according to the above method except that the ultrasonic treatment was performed while being immersed in the agent. The results are shown in Table 8.

[Example 35]
The substrate for evaluation was heat-treated at 120 ° C. for 2 hours before the pretreatment of the process of Table 1 to oxidize the surface, and then the substrate for evaluation was pretreated in Example 1 during the pretreatment of the process of Table 1. The adhesion between the base copper and the plating film was evaluated according to the above method except that the electrolytic treatment (0.5 V) was performed while immersed in the agent. The results are shown in Table 8.

  From the result of Reference Example 1, poor adhesion occurred partially when an oxide film was present on the substrate surface. From the results of Examples 34 and 35, in the case where an oxide film is present on the substrate surface, when ultrasonic treatment or electrolytic treatment was used in combination with the pretreatment, the adhesion failure was eliminated.

1 Substrate 2 Base copper 3 Plating film 4 Cutter knife

Claims (11)

This is a method for pre-treating the surface of the base copper on which the circuit is formed, on which a resist pattern for forming a circuit is formed by forming an electrolytic copper plating film on the base copper by electrolytic copper plating. And
(A) 0.01 to 200 g / L of one or more adsorption inhibitors selected from triazole compounds, pyrazole compounds and imidazole compounds,
(B) 0.01-200 g / L of chloride ion, and (C) 0.1-200 g / L of nonionic surfactant.
A pretreatment method for electrolytic copper plating, comprising immersing the object to be treated having the base copper in a pretreatment agent for electroplating, which is an aqueous solution containing as an essential component.   Further, (D) one or more solvents selected from water-soluble ethers, amines, alcohols, glycol ethers, ketones, esters and fatty acids are contained at 0.01 to 200 g / L. The pretreatment method for electrolytic copper plating according to claim 1, wherein:   Furthermore, (E) acid is contained at 0.1-200 g / L, The pre-processing method of the electrolytic copper plating of Claim 1 or 2 characterized by the above-mentioned.   The pretreatment method for electrolytic copper plating according to any one of claims 1 to 3, further comprising (F) an oxidizing agent at 0.01 to 200 g / L.   The to-be-processed object which has the said base copper is immersed in the pretreatment agent for electroplating at the process temperature of 25-50 degreeC for 1 to 30 minutes, The any one of Claims 1 thru | or 4 characterized by the above-mentioned. Pretreatment method for electrolytic copper plating.   The pretreatment method for electrolytic copper plating according to any one of claims 1 to 5, wherein the object to be treated is immersed in the pretreatment agent for electroplating and subjected to ultrasonic treatment or electrolytic treatment.   7. The surface of the substrate on which the circuit is formed, wherein the resist pattern for forming a circuit is formed by forming an electrolytic copper plating film on the underlying copper by electrolytic copper plating. An electrolytic copper plating method, wherein the electrolytic copper plating film is formed by electrolytic copper plating on the surface after pretreatment by the pretreatment method according to any one of the above. (A) 0.01 to 200 g / L of one or more adsorption inhibitors selected from triazole compounds, pyrazole compounds and imidazole compounds,
(B) 0.01-200 g / L of chloride ion, and (C) 0.1-200 g / L of nonionic surfactant.
A pretreatment agent for electrolytic copper plating, which is an aqueous solution containing as an essential component.   Further, (D) one or more solvents selected from water-soluble ethers, amines, alcohols, glycol ethers, ketones, esters and fatty acids are contained at 0.01 to 200 g / L. The pretreatment agent for electrolytic copper plating according to claim 8.   The pretreatment agent for electrolytic copper plating according to claim 8 or 9, further comprising (E) an acid in an amount of 0.1 to 200 g / L.   The pretreatment agent for electrolytic copper plating according to any one of claims 8 to 10, further comprising (F) an oxidizing agent at 0.01 to 200 g / L.

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