JP2015077776A - Substrate printer - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate printer.SOLUTION: A substrate printer according to the present invention includes a polygonal mask in which a pattern hole is formed, a mask support part for supporting the mask on one surface of the mask, and a mask pressurizing part for pressurizing the mask on the other surface of the mask. Vertical movement of the mask pressurizing part is controlled by a lifting part, the mask support part and the mask pressurizing part are so disposed on sides of the polygonal mask as to be separated from each other, and a scale of the mask is deformed according to tension/contraction of a substrate, whereby the substrate and the mask can be correctly matched with each other.

Description

  The present invention relates to a substrate printing apparatus that prints a circuit on a substrate, and more particularly, to a substrate printing apparatus that prints a circuit on a substrate using a mask on which a circuit pattern is formed.

  In recent years, with the miniaturization, thinning, high density, and packaging of electronic products, fine patterns (fine patterns) have been used in printed circuit boards to reduce wiring density (wiring width, spacing between wirings). ) Is progressing.

  The fine pattern is widely used because it can be realized relatively easily by a printing method using a metal mask and is suitable for mass production.

  However, since a printed circuit board is usually manufactured through many heat treatment steps, expansion and contraction occur due to contraction of an organic material constituting the substrate. Such expansion and contraction of the substrate is the biggest problem in the precision printing process.

  In the case of precision printing, the pitch is less than 120 μm, and a pad (Pad) for printing solder paste is formed on the substrate to a size of about 60 μm, and the printing mask is about the size of the pad. It is opened to a size of 80 μm which is about 20 μm.

  Before performing the printing operation, the substrate and the mask are aligned using the recognition marks formed on the substrate and the mask. At this time, the size of the substrate is slightly larger than the size of the printing mask, or vice versa. If it is too small, the print quality deteriorates rapidly.

  An original plate coated with a micrometer (μm) copper foil is subjected to a pretreatment stage, a through hole processing stage, an electroless plating stage, a circuit printing stage, an etching stage, and a post-treatment stage. In addition, in the process of undergoing many heat treatment steps up to the solder paste printing step, expansion and contraction due to the shrinkage of the organic substance may occur.

  In addition, since the expansion and contraction of the substrate occurs in a very sensitive manner depending on the manufacturing process, product design, raw materials used, etc., the products produced under the same conditions and date, that is, composed of the same lot. Even in the product produced, a fine difference occurs. Therefore, the size of the mask cannot be determined in anticipation of expansion / contraction of the substrate.

  That is, the deformed substrate and the originally designed mask are not aligned, and a pre-designed pattern hole is not accurately printed on the substrate, thus causing a problem of preventing fine patterning.

Korean Published Patent Publication No. 2006-0056019

  The present invention has been made to solve the above problems, and provides a substrate printing apparatus capable of accurately aligning a substrate and a mask regardless of contraction or tension of the substrate. Objective.

  The above object of the present invention is to provide a polygonal mask having a mask shape variable portion connected to a peripheral surface, a mask support portion for supporting the mask shape variable portion, and a mask pressurizing portion for pressing the mask shape variable portion. And the mask support part and the mask pressure part are achieved by providing a substrate printing apparatus arranged corresponding to a side of the polygonal mask.

  At this time, the mask support part may be configured as a pair.

  Further, the mask shape variable portion may be made of a lattice-shaped synthetic resin.

  In addition, the above-described object of the present invention is to provide a polygonal mask having a mask shape variable portion connected to a peripheral surface, a mask support portion that supports the mask shape variable portion, and a mask pressure that pressurizes the mask shape variable portion. And a recognition member for recognizing a substrate recognition mark formed on the substrate and a mask recognition mark formed on the mask, wherein the mask support part and the mask pressure part are sides of the polygonal mask. This is achieved by providing a substrate printing apparatus that is arranged correspondingly.

  The substrate printing apparatus may further include a cylinder for controlling the operation of the mask pressurizing unit so that the position of the substrate recognition mark matches the position of the mask recognition mark.

  Further, the mask support part may be configured as a pair.

  Further, the mask shape variable portion may be made of a lattice-shaped synthetic resin.

  The mask pressurizing unit may be combined with an elevating unit that controls vertical movement.

  According to the substrate printing apparatus according to the present invention, since the size of the pattern formed on the mask can be changed according to the shrinkage or tension of the substrate, the substrate and the mask can be accurately aligned. The print quality of the substrate can be significantly improved.

  In addition, since the scale of the pattern formed on the mask can be adjusted in accordance with the contraction or tension of a part of the substrate, there is an advantage that additional manufacturing of the mask due to mask variation is unnecessary.

  In addition, the substrate printing apparatus according to the present invention has an advantage that it is possible to reduce the equipment cost by partially remodeling the conventional equipment, thereby making it unnecessary to manufacture new equipment.

It is a sectional side view of the board | substrate printing apparatus by this invention. It is drawing which showed the state before a mask was pressurized. It is drawing which showed the state after a mask was pressurized. It is a top view of the mask pressurization part by one Embodiment of this invention. It is sectional drawing which showed the state with which the mask pressurization part and the raising / lowering part were couple | bonded. 3 is a view illustrating various degrees of expansion and contraction of a mask and a mesh according to an exemplary embodiment of the present invention. It is a top view of the mask pressurization part by other embodiments of the present invention.

  Advantages and features of the present invention and methods for accomplishing them will become apparent with reference to the embodiments described in detail below in conjunction with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, and can be embodied in various different forms. The embodiments can be provided to complete the disclosure of the present invention and to fully convey the scope of the invention to those who have ordinary knowledge in the technical field to which the present invention belongs.

  The terminology used herein is for describing the embodiments and is not intended to limit the present invention. In this specification, the singular forms also include plural forms unless the context clearly indicates otherwise. As used herein, “comprise” and / or “comprising” refers to a component, stage, operation and / or element referred to is one or more other components, stages, operations and Do not exclude the presence or addition of elements.

  FIG. 1 is a side sectional view of a substrate printing apparatus 100 according to the present invention.

  As illustrated, the substrate printing apparatus 100 according to the present invention may include a mask 140, a mask support unit 110, and a mask pressurization unit 120. Combined and can move up and down.

  A pattern hole is formed in the mask 140, and a circuit pattern can be formed on the substrate 160 by printing a predetermined pattern on the substrate 160 through ink or solder paste passing through the pattern hole. The substrate 160 is placed and fixed on the table 180. At this time, the substrate 160 can be fixed to the table 180 by a vacuum suction method.

  A mask shape variable portion 147 is formed on the outer side of the mask 140. When the mask shape variable portion 147 is pressurized by the mask pressurizing portion 120, the mask 140 connected to the mask shape variable portion 147 is formed. The substrate 160 and the mask 140, which have been contracted / tensed to be deformed during the substrate manufacturing process, can be aligned. As a result, the pattern can be accurately printed on the substrate 160.

  The mask shape variable unit 147 coupled to the periphery of the mask 140 can be disposed in a state where the four sides are fixed by the mask fixing unit 150. At this time, the mask shape variable part 147 can be made of a lattice-shaped synthetic resin, and can be made of a mesh made of a polyester material that is light and excellent in mechanical properties. The tensile force can be transmitted to the mask.

  The mask 140 may be made of a nickel (Ni) material having an elastic force that is excellent enough to return to the original state even when tension or shrinkage occurs.

  On the other hand, the mask support part 110 supports the mask shape variable part 147, and the mask pressurizing part 120 is located on the upper surface of the mask shape variable part 147 and pressurizes the mask shape variable part 147. The mask pressure unit 120 and the mask support unit 110 may be configured symmetrically.

  In the present invention, it is illustrated that the mask support unit 110 supports the lower surface of the mask shape variable unit 147 and the mask pressurizing unit 120 presses the upper surface of the mask shape variable unit 147. The configuration may be such that the upper surface of the shape variable portion 147 is supported and the mask pressurizing portion 120 presses the lower surface of the mask shape variable portion 147.

  FIG. 2 is a diagram showing a state before the mask shape varying unit 147 is pressurized, and FIG. 3 is a diagram showing a state after the mask shape varying unit 147 is pressurized.

  As shown in the figure, the mask 140 is supported by the mask support part 110, and the mask pressurizing part 120 is located on the opposite surface of the mask support part 110 with the mask as the center.

  Also, as shown in FIG. 3, when the mask pressurizing unit 120 moves downward on the opposite surface of the mask support unit 110, a tensile force is applied to the mask shape variable unit 147. Thereby, the mask shape variable part 147 is pulled outside, and the mask connected to the mask shape variable part 147 can be pulled.

  Since the amount of change in the tension of the mask is controlled by the degree of pressurization of the mask pressurizing unit 120, if the degree of deformation of the substrate 160 is confirmed and the degree of tension of the mask is made coincident with it, correction is made according to the minute deformation of the substrate 160 A pattern can be printed using the mask made.

  That is, according to the present invention, the mask deformation portion 147 extended from the mask 140 is supported by the mask support portion 110, and the mask deformation can be adjusted by the downward movement of the mask pressurizing portion 120. Thus, the scale and shape of the pattern formed on the mask can be finely deformed.

  Therefore, in order to solve the problem that the mask and the substrate 160 are not matched due to the contraction or tension of the substrate 160 that occurs during the manufacturing process of the substrate 160, and the pattern is not accurately formed, the mask is stretched. Since it can be accurately aligned with the substrate, the print quality of the substrate 160 can be significantly improved.

  Meanwhile, the mask support part 110 may be formed by forming two rows of bars in parallel. In addition, the mask pressurization unit 120 includes a mask shape variable unit 147 interposed between the mask support unit 110 and the mask pressurization unit 120 while moving up and down the empty space between the two rows of mask support units 110. Can be pressurized.

  The mask pressurizing unit 120 pressurizes the mask shape variable unit 147 placed on the upper part of the mask support unit 110 formed in two rows, so that the tensile force is not biased to any one of the mask pressurizing units 120 as a whole. Therefore, the phenomenon that the mask pressurizing unit 120 is biased to one side can be prevented.

  On the other hand, FIG. 4 is a plan view of the mask pressure unit 120 according to an embodiment of the present invention. As shown in the drawing, a number of mask pressing portions 120 corresponding to the shape of the mask, that is, the sides of the mask can be formed so as to cope with the deformation of the substrate in all directions.

  The mask pressurization units 120 can operate independently to control the contraction / tension of the mask corresponding to only the deformed portion of the substrate 160. That is, not only the case where the shrinkage / tension generated in the substrate 160 is biased in any one direction but also a case where there are various deformed portions can be dealt with. As described above, the mask can be corrected according to the deformed substrate 160, so that the substrate 160 and the mask can be accurately aligned.

  On the other hand, the mask pressurizing unit 120 does not directly pressurize the mask to pull / shrink the mask, but pressurizes the mask shape variable unit 147 formed on the outer side of the mask and generates the mask shape variable unit 147. Since the mask can be pulled / shrinked by transmitting the tensile force to the mask having elasticity, the mask can be polygonal.

  In addition, by disposing a plurality of mask pressurization units 120 and mask support units 110 for each side of the mask, it is possible to accurately cope with the deformation of the substrate 160.

  For example, in FIG. 4, an octagonal mask 140 is formed, and eight pairs of the mask pressurizing unit 120 and the mask support unit 110 can be configured to correspond to each side of the mask. Similarly, the pair of the mask pressure unit 120 and the mask support unit 110 can be arranged in proportion to each other according to the shape of the mask.

  In addition, since the mask pressure unit 120 and the mask support unit 110 are formed in the mask shape variable unit 147, the separation distance can be adjusted in consideration of the size of the substrate 160, the size of the pattern to be printed, and the like.

  On the other hand, FIG. 5 is a cross-sectional view showing a state in which the mask pressurizing unit 120 and the elevating unit 121 are coupled, and FIG. 6 is a drawing showing various tension / shrinkage levels of the mask shape variable unit 147.

  As shown in the drawing, the elevating part 121 may include a pair of cylinders 122 and 123 formed at the lower end. The cylinders 122 and 123 can be provided at both ends of the lower part of the elevating part 121. Further, the cylinders 122 and 123 may be coupled to the mask pressurizing unit 120 by being fastened to the mask pressurizing and fastening unit 124.

  The elevating unit 121 is an apparatus for realizing the vertical movement of the cylinders 122 and 123, and the mask pressurizing unit 120 can be moved up and down by the vertical movement of the cylinders 122 and 123. The configuration is controlled by the elevating unit 121.

  At this time, since the cylinders 122 and 123 are coupled to both sides of the mask pressurizing unit 120 and can operate independently, even when tension / shrinkage occurs in a part of the substrate 160, the cylinders 122 and 123 correspond to this. The mask can be accurately aligned with the deformed substrate 160.

  However, since the tension / shrinkage of the substrate 160 may occur over the entire range or may occur only in a specific part, a plurality of mask pressurizing units 120 operate simultaneously to pressurize the mask shape variable unit 147. Even if the mask is pulled, an error may occur in the alignment between the substrate 160 and the mask.

  Therefore, the mask pressing unit 120 adjacent to the mask corresponding to the deformed portion of the substrate 160 can be operated. At this time, the cylinders 122 and 123 of the corresponding mask pressurizing unit 120 can pressurize the cylinders 122 and 123 with different pressures so that only a part of the deformed substrate 160 can be accommodated.

  For example, if the left and right cylinders 122 and 123 are individually controlled when the mask pressurizing unit 120 moves downward, different pressures are generated in the mask shape variable unit 147, and the substrate and the mask are moved in this process. Can be matched.

  Referring to FIG. 6, the mask pressurization unit 120 provided corresponding to each side of the mask can operate independently, and controls the cylinders 122 and 123 coupled to the mask pressurization unit 120. Accordingly, it is possible to accurately cope with the tension / shrinkage of the substrate 160, so that the mask can be adapted to various deformations of the substrate 160.

  Further, the mask pressurizing unit 120 can be formed integrally with the mask shape variable unit 147. If the mask pressurizing unit 120 is formed integrally with the mask, the pressurizing point of the mask can be kept constant, so that pressurization can be performed accurately.

  Meanwhile, the substrate printing apparatus 100 may further include a camera 170 for recognizing the substrate recognition mark 165 formed on the substrate and the mask recognition mark 145 formed on the mask. In addition, it may further include a control unit that controls the operation of the mask pressing unit 120 so that the position of the substrate recognition mark 165 and the position of the mask recognition mark 145 coincide with each other.

  The camera 170 can photograph the board recognition mark 165 and present information for confirming the degree of deviation from a predetermined position. Further, the control unit can calculate the degree of deformation of the substrate 160 by calculating the displacement between the predetermined position and the position of the photographed substrate recognition mark 165.

  When the degree of deformation of the substrate 160 is calculated, the mask can be pulled / shrinked by driving the mask pressurizing unit 120 so that the mask recognition mark 145 matches the substrate recognition mark 165.

  Further, the mask pressurizing unit 120 can be operated by the stepping motor 130. Since the stepping motor 130 can accurately control the rotation angle, the cylinders 122 and 123 can be accurately controlled, and thus the mask can be accurately pulled / shrinked.

  The stepping motor 130 is connected to the elevating unit 121 and can adjust the positions of the cylinders 122 and 123 at the lower end of the elevating unit 121. By adjusting the rotation angle of the stepping motor 130 to raise or lower the cylinders 122 and 123, the height of the mask pressurizing unit 120 can be elastically adjusted.

  Since the tension / shrinkage of the substrate can occur not only in any one direction but in all directions, the mask pressure unit 120 and the mask support unit 110 are formed separately for each side of the polygonal mask. be able to. At this time, each end may be connected to an adjacent portion to surround the mask.

  At this time, the mask pressing unit 120 may have a polygonal ring shape connected to one another, and the height of the cylinders 122 and 123 may be adjusted to form a substrate 160 that has been deformed over a wide range. Correspondingly, the mask can be pulled / shrinked.

  Further, by controlling the stepping motor 130 to have the same rotation angle so that both ends of the cylinders 122 and 123 have the same height, the cylinders 122 and 123 on both sides are simultaneously lowered to pressurize the mask, The alignment accuracy between the substrate 160 and the mask can be improved.

  In the present invention, since the mask support unit 110, the mask pressure unit 120, and means for realizing the vertical movement can be added to the conventional printing equipment, the conventional equipment is partially modified to pull the mask. / Shrinkage can be controlled. Therefore, since it is not necessary to manufacture a new facility, there is an advantage that the manufacturing cost of the facility can be reduced.

  The above detailed description illustrates the invention. Also, the foregoing is merely illustrative of a preferred embodiment of the present invention and the present invention can be used in a variety of other combinations, modifications and environments. That is, changes or modifications can be made within the scope of the inventive concept disclosed in the present specification, the scope equivalent to the disclosed contents, and / or the skill or knowledge of the industry. The embodiments described above are for explaining the best state in carrying out the present invention, in other states known in the art in using other inventions such as the present invention, and for the invention. Various modifications required in specific application fields and applications are possible. Accordingly, the above detailed description of the invention is not intended to limit the invention to the disclosed embodiments. Also, the appended claims should be construed to include other implementations.

DESCRIPTION OF SYMBOLS 100 Substrate printing apparatus 110 Mask support part 120 Mask pressurization part 121 Lifting part 122 Cylinder 124 Mask pressurization fastening part 130 Stepping motor 140 Mask 145 Mask recognition mark 147 Mask shape variable part 150 Mask fixing part 160 Substrate 165 Substrate recognition mark 170 Camera 180 tables

Claims (9)

A polygonal mask in which the mask shape variable portion is connected to the peripheral surface;
A mask support portion for supporting the mask shape variable portion;
A mask pressurizing unit that pressurizes the mask shape variable unit,
The substrate printing apparatus, wherein the mask support part and the mask pressure part are arranged corresponding to the sides of the polygonal mask.   The board | substrate printing apparatus of Claim 1 with which the said mask support part is comprised by a pair.   The board | substrate printing apparatus of Claim 1 with which the said mask shape variable part is comprised with a lattice-shaped synthetic resin.   The substrate printing apparatus according to claim 1, wherein the mask pressurizing unit is coupled to an elevating unit that controls vertical movement. A polygonal mask in which the mask shape variable portion is connected to the peripheral surface;
A mask support portion for supporting the mask shape variable portion;
A mask pressurizing unit that pressurizes the mask shape variable unit;
A recognition member for recognizing a substrate recognition mark formed on the substrate and a mask recognition mark formed on the mask,
The substrate printing apparatus, wherein the mask support part and the mask pressure part are arranged corresponding to the sides of the polygonal mask.   The substrate printing apparatus according to claim 5, further comprising a cylinder that controls an operation of the mask pressurizing unit so that a position of the substrate recognition mark and a position of the mask recognition mark coincide with each other.   The substrate printing apparatus according to claim 5, wherein the mask support portion is configured as a pair.   The substrate printing apparatus according to claim 5, wherein the mask shape variable portion is made of a lattice-shaped synthetic resin.   The substrate printing apparatus according to claim 5, wherein the mask pressurizing unit is coupled to an elevating unit that controls vertical movement.

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