JP2015059223A - Organic gold compound, method of making the same, and conductive paste - Google Patents

Organic gold compound, method of making the same, and conductive paste Download PDF

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JP2015059223A
JP2015059223A JP2013191354A JP2013191354A JP2015059223A JP 2015059223 A JP2015059223 A JP 2015059223A JP 2013191354 A JP2013191354 A JP 2013191354A JP 2013191354 A JP2013191354 A JP 2013191354A JP 2015059223 A JP2015059223 A JP 2015059223A
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gold
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organic gold
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conductive paste
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JP5526271B1 (en
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龍一 入波平
Ryuichi Niyuuhahei
龍一 入波平
正雄 岩崎
Masao Iwasaki
正雄 岩崎
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Kojima Chemicals Co Ltd
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Abstract

PROBLEM TO BE SOLVED: To provide an organic gold compound capable of forming a gold film which has sheet resistance even through low-temperature firing at 250°C or lower by improving a disadvantage, i.e. conventional high-temperature firing of organic gold paste, and organic gold paste using the same.SOLUTION: An organic gold compound, represented by general formula (1) Au-S-(CH)-OH (where "n" is 2-6) having mercapto alcohols oriented to gold ions through reaction between gold salt and the mercapto alcohols in a solution containing a reductant in the presence of an inert gas is made into organic gold paste, which is screen-printed on a polyamide film and fired at 250°C so as to obtain a gold film having superior sheet resistance.

Description

本発明は、有機金化合物、その製造方法及び導電性ペーストに関し、さらに詳しくは、ポリアミドフイルム、プリント配線基板、セラミックICパッケージ、ウエハ等の電子部品へ金膜導電回路形成用などの導電性ペーストに用いられる有機金化合物、その製造方法及び導電性ペーストに関する。   The present invention relates to an organic gold compound, a method for producing the same, and a conductive paste. More specifically, the present invention relates to a conductive paste for forming a gold film conductive circuit on an electronic component such as a polyamide film, a printed wiring board, a ceramic IC package, or a wafer. The present invention relates to an organic gold compound used, a method for producing the same, and a conductive paste.

従来、基板上に膜状電極等の導電性パターンを形成するため導電性ペーストとして有機金ペーストが知られている。
このような有機金ペーストの代表的な用途としては、ファクシミリー等のプリンターヘッドとして使用されているサーマルプリンターヘッドの電極作成が挙げられる。
Conventionally, an organic gold paste is known as a conductive paste for forming a conductive pattern such as a film electrode on a substrate.
A typical application of such an organic gold paste is the production of electrodes for thermal printer heads used as printer heads for facsimiles and the like.

この出願に関連する先行技術としては、金化合物として、α―ピネン、α―ターピネオール、イソボルネオールのメルカプタン金、またはサルフィド金、アベチエン酸金、ネオデカン酸金、2−エチルヘキサン酸金、ナフテン酸金等の1種又は2種以上を用い、これにロジウム化合物、ビスマス化合物、クロム化合物、鉛化合物、ケイ素化合物、有機樹脂、有機溶媒を配合した有機金ペーストを用い、セラミック基板にスクリーン印刷した後、800〜850℃で焼成し、金薄膜を得ることが知られている(例えば、特許文献1)。
このような従来の有機金ペーストは、800℃以上の高温で焼成するため基板としてセラミックス等の高温に耐える材料しか使用することができず。耐熱性フィルムとして知られるポリアミドフイルム等の機能性樹脂のフィルムおよび基板へ適用することは不可能であった。また焼成炉として高温対応の物を使用しているためエネルギーコストがかかる問題もあった。
Prior art related to this application includes gold compounds such as α-pinene, α-terpineol, gold isocaptane, or sulfide gold, gold abetienoate, gold neodecanoate, gold 2-ethylhexanoate, gold naphthenate. After using one or two or more of the above, an organic gold paste containing a rhodium compound, a bismuth compound, a chromium compound, a lead compound, a silicon compound, an organic resin, an organic solvent, and screen printing on a ceramic substrate, It is known that a gold thin film is obtained by baking at 800 to 850 ° C. (for example, Patent Document 1).
Since such a conventional organic gold paste is fired at a high temperature of 800 ° C. or higher, only a material that can withstand high temperatures such as ceramics can be used as a substrate. It was impossible to apply to functional resin films such as polyamide films and substrates known as heat resistant films. Moreover, since the thing corresponding to high temperature is used as a baking furnace, there also existed a problem which requires energy cost.

特開平5−144318号公報JP-A-5-144318

本発明は、このような従来の有機金ペーストの高温焼成という難点を改良して250℃以下の低温焼成によってもシート抵抗を有する金皮膜を形成できる有機金化合物及びそれを用いた有機金ペーストを提供することを目的とする。   The present invention provides an organic gold compound capable of forming a gold film having a sheet resistance even by low-temperature baking at 250 ° C. or less by improving the difficulty of high-temperature baking of such a conventional organic gold paste, and an organic gold paste using the same The purpose is to provide.

本発明者は、上記課題を解決するため、低温で焼成することによりシート抵抗を有する金皮膜がえられる有機金化合物について鋭意検討した結果、金塩とメルカプトアルコール類とを不活性ガスの存在下に還元剤を含有する水溶液中で温度0℃〜90℃反応させ、反応終了後、反応溶液を濃縮、晶析することにより得られた有機金化合物は有機金ペーストとし、ポリアミドフイルムにスクリーン印刷、250℃で焼成した結果、シート抵抗に優れた金成膜が得られることを知見して本発明に到達した。   In order to solve the above problems, the present inventor has intensively studied an organic gold compound capable of obtaining a gold film having a sheet resistance by baking at a low temperature. As a result, gold salt and mercaptoalcohol in the presence of an inert gas are obtained. The organic gold compound obtained by reacting the reaction solution in an aqueous solution containing a reducing agent at a temperature of 0 ° C. to 90 ° C. after completion of the reaction, concentrating and crystallizing the reaction solution is an organic gold paste, and is screen printed on a polyamide film. As a result of firing at 250 ° C., the inventors have found that a gold film having excellent sheet resistance can be obtained, and reached the present invention.

すなわち、本発明は、以下の内容をその発明の要旨とするものである。
(1)金塩とメルカプトアルコール類とを不活性ガスの存在下に還元剤を含有する水溶液中で反応させることにより金イオンにメルカプトアルコール類を配位させてなる一般式(1)で表される有機金化合物。
一般式(1)
(化1)
Au−S−(CH−OH (1)

(式中、nは2〜6である)

(2)金塩は、水酸化金、金酸バリウム、雷金から選ばれる一種又は二種以上である請求項1に記載の有機金化合物。
(3)メルカプトアルコール類が2−メルカプトエタノールおよびその類似体である請求項1又は請求項2に記載の有機金化合物。
(4)還元剤がヒドラジン系塩類、亜硫酸ナトリウム、シュウ酸、蟻酸、グルコース類およびアミノアルコール類から選ばれる一種又は二種以上である一般式(1)で表される請求項1〜3のいずれかに記載の有機金化合物。
(5)金塩とメルカプトアルコール類とを不活性ガスの存在下に還元剤を含有する水溶液中で温度0℃〜90℃反応させ、反応終了後、反応溶液を濃縮、晶析することを特徴とする請求項1〜4のいずれかに記載の有機金化合物の製造方法。
(6)請求項1、2、3または4のいずれかに記載の有機金化合物に、合成樹脂バインダー、ガラスフリット、アルミナの1種又は2種以上配合することを特徴とする導電性ペースト。
That is, this invention makes the following content the summary of the invention.
(1) It is represented by the general formula (1) formed by reacting a gold salt and a mercapto alcohol in an aqueous solution containing a reducing agent in the presence of an inert gas to coordinate the mercapto alcohol with a gold ion. Organic gold compounds.
General formula (1)
(Chemical formula 1)
Au-S- (CH 2) n -OH (1)

(Wherein n is 2-6)

(2) The organic gold compound according to claim 1, wherein the gold salt is one or more selected from gold hydroxide, barium goldate, and thunder gold.
(3) The organogold compound according to claim 1 or 2, wherein the mercapto alcohol is 2-mercaptoethanol or an analogue thereof.
(4) Any one of claims 1 to 3 represented by the general formula (1), wherein the reducing agent is one or more selected from hydrazine salts, sodium sulfite, oxalic acid, formic acid, glucoses and amino alcohols. An organic gold compound as described above.
(5) It is characterized by reacting gold salt and mercapto alcohol in an aqueous solution containing a reducing agent in the presence of an inert gas at a temperature of 0 ° C. to 90 ° C., and after completion of the reaction, the reaction solution is concentrated and crystallized. The manufacturing method of the organic gold compound in any one of Claims 1-4.
(6) A conductive paste comprising one or more of a synthetic resin binder, glass frit, and alumina blended in the organic gold compound according to any one of claims 1, 2, 3, and 4.

本発明の有機金化合物の提供、製造方法及び導電性ペーストによれば一般式(1)で表される有機金化合物は、有機樹脂バインダーに配合してペースト化し、これをセラミック基板、ソーダーライム基板のみならずポリイミドフイルムに印刷し、250℃以下の低温で焼成することにより基板との密着性が良好でシート抵抗値の低い金パターンを形成することができるのでプラスチックフイルムにも適用性が有る。また、本発明にて提供される有機金化合物は、ノンシアン金の化合物である為、金めっき用金塩の材料とする事により、環境負荷の少ない金めっき液の作製が可能であり、その金源となり得る材料であるのでその工業的利用価値大である。   According to the provision of the organic gold compound of the present invention, the production method and the conductive paste, the organic gold compound represented by the general formula (1) is blended into an organic resin binder to form a paste, and this is formed into a ceramic substrate and a soda lime substrate. In addition to printing on a polyimide film and baking at a low temperature of 250 ° C. or lower, a gold pattern with good adhesion to the substrate and a low sheet resistance value can be formed, so that it has applicability to a plastic film. In addition, since the organic gold compound provided in the present invention is a non-cyanide gold compound, it is possible to produce a gold plating solution with less environmental impact by using a gold salt material for gold plating. Since it is a material that can be a source, its industrial utility value is great.

以下、本発明の有機金化合物、その製造方法及びそれを用いた導電性ペーストについて詳細に説明する。
本発明にかかる有機金化合物の製造方法は、電子部品の電極形成などの導電性ペーストに用いられる分散性、導電皮膜形成性に優れた有機金化合物の製造方法であり、また、導電性ペーストは、この製造方法で得られた有機金化合物を用いたものである。
Hereinafter, the organic gold compound of the present invention, the production method thereof, and the conductive paste using the same will be described in detail.
The method for producing an organic gold compound according to the present invention is a method for producing an organic gold compound that is excellent in dispersibility and conductive film-forming properties used in conductive pastes such as electrode formation of electronic components. The organic gold compound obtained by this production method is used.

1 有機金化合物の製造方法
本発明の有機金化合物の製造方法は、水酸化金、金酸バリウム、雷金等から選ばれる金塩と、メルカプトアルコール類、例えば、2−メルカプトエタノール、3−ヒドロキシプロピルメルカプタン、4−ヒドロキシブチルメルカプタン等とを窒素ガスおよびアルゴンガスなどの不活性ガスの存在下、還元剤を含有する水溶液中で温度0℃〜90℃で反応させる。反応終了後、不活性ガスの存在下、反応溶液を30℃以下に冷却し結晶を析出させ120℃以下で乾燥することにより有機金化合物の結晶粉末を得る。
1 Method for Producing Organogold Compound The method for producing an organogold compound of the present invention comprises a gold salt selected from gold hydroxide, barium goldate, thunder metal, and mercapto alcohols such as 2-mercaptoethanol and 3-hydroxy. Propyl mercaptan, 4-hydroxybutyl mercaptan and the like are reacted at a temperature of 0 ° C. to 90 ° C. in an aqueous solution containing a reducing agent in the presence of an inert gas such as nitrogen gas and argon gas. After completion of the reaction, in the presence of an inert gas, the reaction solution is cooled to 30 ° C. or lower to precipitate crystals and dried at 120 ° C. or lower to obtain an organic gold compound crystal powder.

還元剤としてはヒドラジン系塩類、亜硫酸ナトリウム、シュウ酸、蟻酸、グルコース類およびアミノアルコール類から選ばれる一種又は二種以上が使用される。
得られた有機金化合物の結晶粉末は、導電性ペーストに適した粉末とするため衝撃式、摩砕式などの粉砕方式で平均粒径0.1μm〜2μmの微分末とするのが好ましい。
As the reducing agent, one or more selected from hydrazine salts, sodium sulfite, oxalic acid, formic acid, glucoses and amino alcohols are used.
The obtained organic gold compound crystal powder is preferably a powder having an average particle size of 0.1 μm to 2 μm by a pulverization method such as an impact method or a grinding method in order to obtain a powder suitable for a conductive paste.

上記の方法でメルカプトアルコール類が2−メルカプトエタノールで合成して得られた結晶を成分分析した結果、理論値と略一致するAu71.7%(計算値:71.9%)、S11.6%(計算値:11.7%)であった。したがって、本発明の有機金化合物は、上記一般式(1)で表される結晶であることを確認した。   As a result of component analysis of crystals obtained by synthesizing mercaptoalcohols with 2-mercaptoethanol by the above method, Au 71.7% (calculated value: 71.9%), S11.6% almost agreeing with the theoretical value. (Calculated value: 11.7%). Therefore, it was confirmed that the organogold compound of the present invention was a crystal represented by the general formula (1).

2 導電性ペースト
本発明の導電性ペーストは、本発明の有機金化合物と、有機樹脂バインダー、有機溶媒を主成分とするものである。
有機樹脂バインダーとしては、従来の導電性ペーストに用いるものを使用することができる。例えば、エチルセルロース、ヒドロキシエチルセルロース等のセルロース系高分子、ポリブチルメタアクリレート、ポリメチルメタアクリレート、ポリエチルメタアクリレート等のアクリル系樹脂、エポキシ系樹脂、ポリウレタン系樹脂、フエノール樹脂、アルキッド樹脂、ポリビニルブチラール等をブチルカルビトール、ブチルカルビトールアセテート、ターピネオールなどの溶媒に溶解した有機樹脂バインダーに本発明の有機金化合物を混合し、必要に応じて界面活性剤、可塑剤、分散剤等を添加し、三本ロールミルその他の混練機を用いて混練・分散してペースト化することによって得られる。
2 Conductive Paste The conductive paste of the present invention contains the organic gold compound of the present invention, an organic resin binder, and an organic solvent as main components.
As an organic resin binder, what is used for the conventional conductive paste can be used. For example, cellulose polymers such as ethyl cellulose and hydroxyethyl cellulose, acrylic resins such as polybutyl methacrylate, polymethyl methacrylate, and polyethyl methacrylate, epoxy resins, polyurethane resins, phenol resins, alkyd resins, polyvinyl butyral, etc. The organic gold compound of the present invention is mixed with an organic resin binder dissolved in a solvent such as butyl carbitol, butyl carbitol acetate, or terpineol, and a surfactant, plasticizer, dispersant, etc. are added as necessary. It can be obtained by kneading and dispersing into a paste using this roll mill or other kneader.

以下、実施例により本発明を具体的に説明する。 Hereinafter, the present invention will be described specifically by way of examples.

(1)有機金化合物の製造
塩化金酸50.0gを純水500mlに溶解し、これに5%炭酸水素ナトリウムをpH9.0になるまで、添加・攪拌する。析出した水酸化金を濾別後純水にて洗浄する。
次に、洗浄後の水酸化金を純水800mlに分散した後、窒素ガスをバブリングしながら加熱・攪拌をして液温を60℃にする。そのまま1時間放置する。
次いで、この懸濁溶液に亜硫酸ナトリウム48.2gの少量(一部)をゆっくり添加する。反応の様子を確認しながら、2−メルカプトエタノール14.2gの少量(一部)をゆっくり添加する。残りの亜硫酸ナトリウムを反応の様子を確認しながら添加する。窒素ガスのバブリングはそのまま継続しながら反応溶液の温度を60〜65℃に保温して3時間熟成を行う。
更に、反応溶液へ残りの2−メルカプトエタノールを徐々に添加する。2−メルカプトエタノールの添加終了後、反応溶液の温度を80℃に保ち窒素ガスのバブリングをそのまま5時間継続し、再熟成を行う。その際、還流の要領で溶媒が減らない様にする。
再熟成終了後の反応溶液は、そのまま窒素ガスのバブリング及び、攪拌を継続しながら30℃以下に冷却し結晶を析出させる。次いで、結晶を濾過、エタノールで洗浄した後、80℃で乾燥する事により、24.3gの淡黄色粉末状の結晶を得た。(収率:73.0%)
(2)導電性ペーストの調製
実施例1で得た有機金化合物20重量部、有機樹脂ダインダー(エチルセルロース6重量%ターピネオール溶液)20重量部、ターピネオール10重量部を予備混練した後、これを3本ロールミルにより混練して導電性ペーストを調製した。
この導電性ペーストを用いて50mm×60mm×0.1mmのポリイミドフイルム上に325メッシュのスクリーンでスクリーン印刷後、乾燥機で120℃15分間乾燥し、コンベア炉にてピーク温度250℃、ピーク焼成時間10分間、入口から出口まで60分間かけて焼成し、ポリイミドフイルム上に2mm×20mmの金薄膜パターンを設けた。
このようにして得られた金薄膜のシート抵抗値を測定した結果を表1に示す。
(1) Production of organic gold compound 50.0 g of chloroauric acid is dissolved in 500 ml of pure water, and 5% sodium hydrogen carbonate is added to this and stirred until the pH is 9.0. The precipitated gold hydroxide is filtered off and washed with pure water.
Next, after the gold hydroxide after washing is dispersed in 800 ml of pure water, the liquid temperature is set to 60 ° C. by heating and stirring while bubbling nitrogen gas. Leave for 1 hour.
Then, a small amount (part) of 48.2 g of sodium sulfite is slowly added to this suspension solution. While confirming the state of the reaction, a small amount (part) of 14.2 g of 2-mercaptoethanol is slowly added. Add the remaining sodium sulfite while confirming the reaction. While the bubbling of nitrogen gas is continued as it is, the temperature of the reaction solution is kept at 60 to 65 ° C. and aged for 3 hours.
Further, the remaining 2-mercaptoethanol is gradually added to the reaction solution. After completion of the addition of 2-mercaptoethanol, the temperature of the reaction solution is kept at 80 ° C., and bubbling of nitrogen gas is continued for 5 hours as it is, followed by ripening. At this time, the solvent should not be reduced in the manner of reflux.
The reaction solution after completion of ripening is cooled to 30 ° C. or lower while continuing bubbling of nitrogen gas and stirring as it is to precipitate crystals. Next, the crystals were filtered, washed with ethanol, and dried at 80 ° C. to obtain 24.3 g of pale yellow powdery crystals. (Yield: 73.0%)
(2) Preparation of conductive paste 20 parts by weight of the organic gold compound obtained in Example 1, 20 parts by weight of an organic resin dinder (ethyl cellulose 6% by weight terpineol solution) and 10 parts by weight of terpineol were pre-kneaded, and then three of these were mixed. A conductive paste was prepared by kneading with a roll mill.
Using this conductive paste, screen printing on a 325 mesh screen on a polyimide film of 50 mm x 60 mm x 0.1 mm, followed by drying at 120 ° C for 15 minutes with a dryer, peak temperature at 250 ° C in a conveyor furnace, peak firing time Baking was performed for 10 minutes from the inlet to the outlet over 60 minutes, and a gold thin film pattern of 2 mm × 20 mm was provided on the polyimide film.
The results of measuring the sheet resistance value of the gold thin film thus obtained are shown in Table 1.

(1)有機金化合物の製造
塩化金酸50.0gを純水500mlに溶解し、これに10%アンモニア水をpH10.0になるまで、添加・攪拌する。析出した雷金を濾別後純水にて洗浄する。
次に、洗浄後の雷金を純水800mlに分散した後、窒素ガスをバブリングしながら加熱・攪拌をして液温を60℃にする。そのまま1時間放置する。
次いで、この懸濁溶液に亜硫酸ナトリウム48.2gの少量(一部)をゆっくり添加する。反応の様子を確認しながら、2−メルカプトエタノール14.2gの少量(一部)をゆっくり添加する。残りの亜硫酸ナトリウムを反応の様子を確認しながら添加する。窒素ガスのバブリングはそのまま継続しながら反応溶液の温度を60〜65℃に保温して3時間熟成を行う。
更に、反応溶液へ残りの2−メルカプトエタノールを徐々に添加する。2−メルカプトエタノールの添加終了後、反応溶液の温度を80℃に保ち窒素ガスのバブリングをそのまま5時間継続し、再熟成を行う。その際、還流の要領で溶媒が減らない様にする。
再熟成終了後の反応溶液は、そのまま窒素ガスのバブリング及び、攪拌を継続しながら30℃以下に冷却し結晶を析出させる。次いで、結晶を濾過、エタノールで洗浄した後、80℃で乾燥する事により、18.8gの淡黄色粉末状の結晶を得た。(収率:56.5%)
(2)導電性ペーストの調製
実施例2で得た有機金化合物20重量部、有機樹脂バインダー(エチルセルロース6重量%ターピネオール溶液)20重量部、ターピネオール10重量部を予備混練した後、これを3本ロールミルにより混練して導電性ペーストを調製した。
この導電性ペーストを用いて50mm×60mm×0.1mmのポリイミドフイルム上に325メッシュのスクリーンでスクリーン印刷後、乾燥機で120℃15分間乾燥し、コンベア炉にてピーク温度250℃、ピーク焼成時間10分間、入口から出口まで60分間かけて焼成し、ポリイミドフイルム上に2mm×20mmの金薄膜パターンを設けた。このようにして得られた金薄膜のシート抵抗値を測定した結果を表1に示す。
(1) Production of organic gold compound 50.0 g of chloroauric acid is dissolved in 500 ml of pure water, and 10% aqueous ammonia is added and stirred therein until the pH reaches 10.0. The deposited thunder gold is separated by filtration and washed with pure water.
Next, after the washed thunder gold is dispersed in 800 ml of pure water, the liquid temperature is set to 60 ° C. by heating and stirring while bubbling nitrogen gas. Leave for 1 hour.
Then, a small amount (part) of 48.2 g of sodium sulfite is slowly added to this suspension solution. While confirming the state of the reaction, a small amount (part) of 14.2 g of 2-mercaptoethanol is slowly added. Add the remaining sodium sulfite while confirming the reaction. While the bubbling of nitrogen gas is continued as it is, the temperature of the reaction solution is kept at 60 to 65 ° C. and aged for 3 hours.
Further, the remaining 2-mercaptoethanol is gradually added to the reaction solution. After completion of the addition of 2-mercaptoethanol, the temperature of the reaction solution is kept at 80 ° C., and bubbling of nitrogen gas is continued for 5 hours as it is, followed by ripening. At this time, the solvent should not be reduced in the manner of reflux.
The reaction solution after completion of ripening is cooled to 30 ° C. or lower while continuing bubbling of nitrogen gas and stirring as it is to precipitate crystals. Next, the crystals were filtered, washed with ethanol, and dried at 80 ° C. to obtain 18.8 g of a pale yellow powdery crystal. (Yield: 56.5%)
(2) Preparation of conductive paste 20 parts by weight of the organic gold compound obtained in Example 2, 20 parts by weight of an organic resin binder (ethylcellulose 6% by weight terpineol solution) and 10 parts by weight of terpineol were pre-kneaded, and then three of these were mixed. A conductive paste was prepared by kneading with a roll mill.
Using this conductive paste, screen printing on a 325 mesh screen on a polyimide film of 50 mm x 60 mm x 0.1 mm, followed by drying at 120 ° C for 15 minutes with a dryer, peak temperature at 250 ° C in a conveyor furnace, peak firing time Baking was performed for 10 minutes from the inlet to the outlet over 60 minutes, and a gold thin film pattern of 2 mm × 20 mm was provided on the polyimide film. The results of measuring the sheet resistance value of the gold thin film thus obtained are shown in Table 1.

(1)有機金化合物の製造
塩化金酸50.0gを純水500mlに溶解し、これに水酸化バリウム八水和物114.8gを添加・攪拌する。析出した金酸バリウムを濾別後純水にて洗浄する。
次に、洗浄後の金酸バリウムを純水800mlに分散した後、窒素ガスをバブリングしながら加熱・攪拌をして液温を60℃にする。そのまま1時間放置する。
次いで、この懸濁溶液に亜硫酸ナトリウム48.2gの少量(一部)をゆっくり添加する。反応の様子を確認しながら、2−メルカプトエタノール14.2gの少量(一部)をゆっくり添加する。残りの亜硫酸ナトリウムを反応の様子を確認しながら添加する。窒素ガスのバブリングはそのまま継続しながら反応溶液の温度を60〜65℃に保温して3時間熟成を行う。
更に、反応溶液へ残りの2−メルカプトエタノールを徐々に添加する。2−メルカプトエタノールの添加終了後、反応溶液の温度を80℃に保ち窒素ガスのバブリングをそのまま5時間継続し、再熟成を行う。その際、還流の要領で溶媒が減らない様にする。
再熟成終了後の反応溶液は、そのまま窒素ガスのバブリング及び、攪拌を継続しながら30℃以下に冷却し結晶を析出させる。次いで、結晶を濾過、エタノールで洗浄した後、80℃で乾燥する事により、14.3gの淡黄色粉末状の結晶を得た。(収率:43.0%)
(2)導電性ペーストの調製
実施例3で得た有機金化合物20重量部、有機樹脂バインダー(エチルセルロース6重量%ターピネオール溶液)20重量部、ターピネオール10重量部を予備混練した後、これを3本ロールミルにより混練して導電性ペーストを調製した。
この導電性ペーストを用いて50mm×60mm×0.1mmのポリイミドフイルム上に325メッシュのスクリーンでスクリーン印刷後、乾燥機で120℃15分間乾燥し、コンベア炉にてピーク温度250℃、ピーク焼成時間10分間、入口から出口まで60分間かけて焼成し、ポリイミドフイルム上に2mm×20mmの金薄膜パターンを設けた。このようにして得られた金薄膜のシート抵抗値を測定した結果を表1に示す。
(1) Production of organic gold compound 50.0 g of chloroauric acid is dissolved in 500 ml of pure water, and 114.8 g of barium hydroxide octahydrate is added and stirred therein. The precipitated barium metal oxide is filtered off and washed with pure water.
Next, after the washed barium aurate is dispersed in 800 ml of pure water, the liquid temperature is set to 60 ° C. by heating and stirring while bubbling nitrogen gas. Leave for 1 hour.
Then, a small amount (part) of 48.2 g of sodium sulfite is slowly added to this suspension solution. While confirming the state of the reaction, a small amount (part) of 14.2 g of 2-mercaptoethanol is slowly added. Add the remaining sodium sulfite while confirming the reaction. While the bubbling of nitrogen gas is continued as it is, the temperature of the reaction solution is kept at 60 to 65 ° C. and aged for 3 hours.
Further, the remaining 2-mercaptoethanol is gradually added to the reaction solution. After completion of the addition of 2-mercaptoethanol, the temperature of the reaction solution is kept at 80 ° C., and bubbling of nitrogen gas is continued for 5 hours as it is, followed by ripening. At this time, the solvent should not be reduced in the manner of reflux.
The reaction solution after completion of ripening is cooled to 30 ° C. or lower while continuing bubbling of nitrogen gas and stirring as it is to precipitate crystals. Next, the crystals were filtered, washed with ethanol, and dried at 80 ° C. to obtain 14.3 g of a pale yellow powdery crystal. (Yield: 43.0%)
(2) Preparation of conductive paste 20 parts by weight of the organic gold compound obtained in Example 3, 20 parts by weight of an organic resin binder (ethylcellulose 6% by weight terpineol solution) and 10 parts by weight of terpineol were pre-kneaded, and then three of these were mixed. A conductive paste was prepared by kneading with a roll mill.
Using this conductive paste, screen printing on a 325 mesh screen on a polyimide film of 50 mm x 60 mm x 0.1 mm, followed by drying at 120 ° C for 15 minutes with a dryer, peak temperature at 250 ° C in a conveyor furnace, peak firing time Baking was performed for 10 minutes from the inlet to the outlet over 60 minutes, and a gold thin film pattern of 2 mm × 20 mm was provided on the polyimide film. The results of measuring the sheet resistance value of the gold thin film thus obtained are shown in Table 1.

比較例Comparative example

導電性ペーストの調製
α―ピネンサルファイド金化合物20重量部、有機樹脂バインダー(エチルセルロース6重量%ターピネオール溶液)20重量部、ターピネオール10重量部を予備混練した後、これを3本ロールミルにより混練して導電性ペーストを調製した。
この導電性ペーストを用いて50mm×60mm×0.1mmのポリイミドフイルム上に325メッシュのスクリーンでスクリーン印刷後、乾燥機で120℃15分間乾燥し、コンベア炉にてピーク温度250℃、ピーク焼成時間10分間、入口から出口まで60分間かけて焼成し、ポリイミドフイルム上に2mm×20mmの金薄膜パターンを設けた。このようにして得られた金薄膜のシート抵抗値を測定した結果を表1に示す。
Preparation of conductive paste 20 parts by weight of α-pinene sulfide gold compound, 20 parts by weight of an organic resin binder (6% by weight of ethylcellulose terpineol solution) and 10 parts by weight of terpineol were pre-kneaded and then kneaded by a three-roll mill. An adhesive paste was prepared.
Using this conductive paste, screen printing on a 325 mesh screen on a polyimide film of 50 mm x 60 mm x 0.1 mm, followed by drying at 120 ° C for 15 minutes with a dryer, peak temperature at 250 ° C in a conveyor furnace, peak firing time Baking was performed for 10 minutes from the inlet to the outlet over 60 minutes, and a gold thin film pattern of 2 mm × 20 mm was provided on the polyimide film. The results of measuring the sheet resistance value of the gold thin film thus obtained are shown in Table 1.

表1から、本発明の有機金化合物によるペーストにより形成された薄膜は、ポリイミドフイルム上において低温焼成を実施した場合においても緻密な皮膜となっているため導電性が極めて良好であることが確認された。
一方、比較例の有機金ペーストにより形成された膜は、低温での焼結性がよくないため導電性が測定できなかった。
本発明の有機金属化合物は、図1に示すように示差熱分析結果からも明らかなように低温焼成においても金属Au析出が有効である。
TG−DTAの測定結果より、TG曲線から、190℃付近から分解が始まり、一気に金属Auになっている事が確認出来る。更に、230℃付近で反応が終結しており、低温焼成にて金属Au析出が可能である事を示している。
また、DTA曲線から、金属Auになる際、吸熱反応である事が確認出来る。通常、有機成分が燃焼する為、発熱反応を示す事が多いが、本熱分解機構は、配位子の燃焼による金属Auの析出では無く、金−配位子間での電子授受反応による配位子脱離−金属Auの析出である。
Table 1 confirms that the thin film formed from the paste of the organic gold compound of the present invention has a very good conductivity because it is a dense film even when subjected to low-temperature firing on a polyimide film. It was.
On the other hand, the film formed of the organic gold paste of the comparative example was not good in sinterability at low temperatures, and therefore the conductivity could not be measured.
In the organometallic compound of the present invention, metal Au precipitation is effective even in low-temperature firing, as is apparent from the differential thermal analysis results as shown in FIG.
From the measurement result of TG-DTA, it can be confirmed from the TG curve that the decomposition started from around 190 ° C., and it became metal Au at a stretch. Furthermore, the reaction is terminated at around 230 ° C., indicating that metal Au can be deposited by low-temperature firing.
Moreover, it can confirm that it is an endothermic reaction when it becomes metal Au from a DTA curve. Usually, the organic component burns and often exhibits an exothermic reaction, but this thermal decomposition mechanism is not the deposition of metal Au due to the combustion of the ligand, but the distribution by the electron transfer reaction between the gold and the ligand. Ligand elimination-metal Au precipitation.

実施例1の有機金化合物の示差熱分析データーである。3 is differential thermal analysis data of the organic gold compound of Example 1.

Claims (6)

金塩とメルカプトアルコール類とを不活性ガスの存在下に還元剤を含有する水溶液中で反応させることにより金イオンにメルカプトアルコール類を配位させてなる一般式(1)で表される有機金化合物。
一般式(1)
(化1)
Au−S−(CH−OH (1)

(式中、nは2〜6である)
An organic gold represented by the general formula (1) obtained by reacting a gold salt with a mercapto alcohol in an aqueous solution containing a reducing agent in the presence of an inert gas to coordinate the mercapto alcohol with a gold ion. Compound.
General formula (1)
(Chemical formula 1)
Au-S- (CH 2) n -OH (1)

(Wherein n is 2-6)
金塩は、水酸化金、金酸バリウム、雷金から選ばれる一種又は二種以上である請求項1に記載の有機金化合物。   The organic gold compound according to claim 1, wherein the gold salt is one or more selected from gold hydroxide, barium goldate, and thunder gold. メルカプトアルコール類が2−メルカプトエタノールおよびその類似体である請求項1又は請求項2に記載の有機金化合物。   The organogold compound according to claim 1 or 2, wherein the mercapto alcohol is 2-mercaptoethanol or an analogue thereof. 還元剤がヒドラジン系塩類、亜硫酸ナトリウム、シュウ酸、蟻酸、グルコース類およびアミノアルコール類から選ばれる一種又は二種以上である一般式(1)で表される請求項1〜3のいずれかに記載の有機金化合物。   The reducing agent according to any one of claims 1 to 3, represented by the general formula (1), which is one or more selected from hydrazine-based salts, sodium sulfite, oxalic acid, formic acid, glucoses, and amino alcohols. Organic gold compounds. 金塩とメルカプトアルコール類とを不活性ガスの存在下に還元剤を含有する水溶液中で温度0℃〜90℃反応させ、反応終了後、反応溶液を濃縮、晶析することを特徴とする請求項1〜4のいずれかに記載の有機金化合物の製造方法。   A gold salt and a mercapto alcohol are reacted in an aqueous solution containing a reducing agent in the presence of an inert gas at a temperature of 0 ° C to 90 ° C, and after completion of the reaction, the reaction solution is concentrated and crystallized. Item 5. A method for producing an organic gold compound according to any one of Items 1 to 4. 請求項1、2、3または4のいずれかに記載の有機金化合物に、合成樹脂バインダー、ガラスフリット、アルミナの1種又は2種以上配合することを特徴とする導電性ペースト。






5. A conductive paste comprising one or more of a synthetic resin binder, glass frit, and alumina blended in the organic gold compound according to claim 1, 2, 3 or 4.






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