JP2015049468A5 - Microlens array substrate, electro-optical device, and manufacturing method of microlens array substrate - Google Patents
Microlens array substrate, electro-optical device, and manufacturing method of microlens array substrate Download PDFInfo
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- 239000000758 substrate Substances 0.000 title claims description 75
- 238000004519 manufacturing process Methods 0.000 title claims description 7
- 239000000463 material Substances 0.000 claims description 91
- 238000000034 method Methods 0.000 claims description 8
- 229910010272 inorganic material Inorganic materials 0.000 claims description 3
- 239000011147 inorganic material Substances 0.000 claims description 3
- 230000003287 optical effect Effects 0.000 claims description 2
- 230000005540 biological transmission Effects 0.000 claims 2
- 238000005530 etching Methods 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
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Description
本発明は、マイクロレンズアレイ基板、電気光学装置、および、マイクロレンズアレイ基板の製造方法に関する。
The present invention relates to a microlens array substrate, an electro-optical device, and a method for manufacturing the microlens array substrate .
［適用例１］本適用例に係るマイクロレンズアレイ基板は、複数のマイクロレンズが配置された第１領域と、前記第１領域の外側に位置する第２領域と、を有するマイクロレンズアレイ基板であって、光透過性を有する基板の第１面の前記第２領域に形成されたマークと、前記基板の前記第１面の前記第１領域に形成された複数の第１凹部と、前記基板の前記第１面の前記第１領域および前記第２領域に前記マークと前記複数の第１凹部とを覆うように透光性材料を所定の膜厚で配置して、前記複数の第１凹部の形状が反映された複数の第２凹部を有する第１透光材料層と、前記第１透光材料層を覆い前記複数の第２凹部を埋め込むように、光透過性を有し前記第１透光材料層とは異なる屈折率を有する第２透光材料層と、を備え、隣り合う前記複数の第２凹部の境界部分で前記第１透光材料層の少なくとも一部が前記第２透光材料層から露出し、かつ、前記マークが前記第２透光材料層から露出しないことを特徴とする。
また、本適用例に係るマイクロレンズアレイ基板の製造方法は、複数のマイクロレンズが配置された第１領域と、前記第１領域の外側に位置する第２領域と、を有するマイクロレンズアレイ基板の製造方法であって、光透過性を有する基板の第１面の前記第２領域にマークを形成するマーク形成工程と、前記基板の前記第１面の前記第１領域に複数の第１凹部を形成する凹部形成工程と、前記基板の前記第１面の前記第１領域および前記第２領域に前記マークと前記複数の第１凹部とを覆うように透光性材料を所定の膜厚で配置して、前記複数の第１凹部の形状が反映された複数の第２凹部を有する第１透光材料層を形成する第１透光材料層形成工程と、前記第１透光材料層を覆い前記複数の第２凹部を埋め込むように、光透過性を有し前記第１透光材料層とは異なる屈折率を有する第２透光材料層を形成する工程と、隣り合う前記複数の第２凹部の境界部分で前記第１透光材料層の少なくとも一部が露出し、かつ、前記マークが露出しないように、前記第２透光材料層に対して平坦化処理を施す平坦化工程と、を備えていることを特徴とする。
Application Example 1 A microlens array substrate according to this application example is a microlens array substrate having a first region in which a plurality of microlenses are arranged, and a second region located outside the first region. A mark formed in the second region of the first surface of the light-transmitting substrate, a plurality of first recesses formed in the first region of the first surface of the substrate, and the substrate A translucent material is disposed with a predetermined film thickness so as to cover the mark and the plurality of first recesses in the first region and the second region of the first surface, and the plurality of first recesses A first light-transmitting material layer having a plurality of second recesses reflecting the shape of the first light-transmitting material layer so as to cover the first light-transmitting material layer and embed the plurality of second recesses. A second light transmissive material layer having a refractive index different from that of the light transmissive material layer, and adjacent to each other At least a part of the first light transmissive material layer is exposed from the second light transmissive material layer at a boundary portion of the plurality of second recesses, and the mark is not exposed from the second light transmissive material layer. Features.
In addition, a method for manufacturing a microlens array substrate according to this application example includes: a microlens array substrate having a first region in which a plurality of microlenses are disposed; and a second region located outside the first region. In the manufacturing method, a mark forming step of forming a mark in the second region of the first surface of the light-transmitting substrate, and a plurality of first recesses in the first region of the first surface of the substrate A recess forming step to be formed, and a translucent material having a predetermined film thickness so as to cover the mark and the plurality of first recesses in the first region and the second region of the first surface of the substrate. A first light-transmitting material layer forming step of forming a first light-transmitting material layer having a plurality of second recesses reflecting the shapes of the plurality of first recesses; and covering the first light-transmitting material layer Light transmissive so as to embed the plurality of second recesses, Forming a second light transmissive material layer having a refractive index different from that of the first light transmissive material layer, and exposing at least a part of the first light transmissive material layer at a boundary portion between the plurality of adjacent second concave portions; And a planarization step of performing a planarization process on the second light transmissive material layer so that the mark is not exposed.
本適用例によれば、基板の第１面に形成された複数の第１凹部の形状が反映された第１透光材料層の複数の第２凹部を、第１透光材料層とは異なる屈折率を有する第２透光材料層で埋め込むので、第１透光材料層と第２透光材料層との界面で光が屈折するマイクロレンズを複数備えたマイクロレンズアレイ基板を製造できる。第１透光材料層は、基板の第１面に形成されたマークと複数の第１凹部と隣り合う第１凹部同士の境界部分とを覆って形成され、第２透光材料層は第１透光材料層を覆って形成される。その第２透光材料層に対して、平坦化工程で隣り合う複数の第２凹部同士の境界部分で第１透光材料層の少なくとも一部が露出するまで平坦化処理を施すので、隣り合う第２凹部同士の境界部分で、第２透光材料層に不連続部分が形成される。そのため、不連続部分が形成されたことにより第２透光材料層にかかる応力が分散されるとともに、不連続部分が形成された分だけ第２透光材料層全体の体積が小さくなることにより第２透光材料層にかかる応力が緩和されるので、応力により生じる第２透光材料層のクラックを抑止できる。一方、平坦化工程でマークが露出しないように、すなわち、マーク上に第１透光材料層が残るように平坦化処理を施すので、マークの除去を抑止できる。これにより、第２透光材料層のクラックを抑止でき、かつ、マークの除去を抑止できるマイクロレンズアレイ基板を提供することができる。
According to this application example, the plurality of second recessed portions of the first light transmitting material layer reflecting the shapes of the plurality of first recessed portions formed on the first surface of the substrate are different from the first light transmitting material layer. Since the second light-transmitting material layer having a refractive index is embedded, a microlens array substrate including a plurality of microlenses that refract light at the interface between the first light-transmitting material layer and the second light-transmitting material layer can be manufactured. The first light transmissive material layer is formed so as to cover a mark formed on the first surface of the substrate and a boundary portion between the first concave portions adjacent to the plurality of first concave portions, and the second light transmissive material layer is the first light transmissive material layer. It is formed so as to cover the light transmissive material layer. Since the second light-transmitting material layer is planarized until at least a part of the first light-transmitting material layer is exposed at the boundary portion between the plurality of adjacent second recesses in the planarization step, the second light-transmitting material layer is adjacent to the second light-transmitting material layer. A discontinuous portion is formed in the second light transmissive material layer at a boundary portion between the second concave portions. Therefore, the stress applied to the second light transmissive material layer is dispersed due to the formation of the discontinuous portion, and the volume of the entire second light transmissive material layer is reduced by the amount of the discontinuous portion formed. Since the stress applied to the second light transmissive material layer is relaxed, cracks in the second light transmissive material layer caused by the stress can be suppressed. On the other hand, since the flattening process is performed so that the mark is not exposed in the flattening step, that is, the first light transmissive material layer remains on the mark, the removal of the mark can be suppressed. As a result, it is possible to provide a microlens array substrate that can suppress cracks in the second light transmissive material layer and can suppress the removal of marks.
［適用例２］上記適用例に係るマイクロレンズアレイ基板であって、前記複数のマイクロレンズは、第１方向、前記第１方向と交差する第２方向、前記第１方向および前記第２方向と交差する第３方向に配列され、前記第１方向、前記第２方向、および前記第３方向において隣り合う前記複数の第２凹部の境界部分で前記第１透光材料層は、前記第２透光材料層から露出することが好ましい。
Application Example 2 In the microlens array substrate according to the application example, the plurality of microlenses include a first direction, a second direction intersecting the first direction, the first direction, and the second direction. The first light transmissive material layer is arranged in the intersecting third direction, and the first light transmissive material layer is disposed in the first direction, the second direction, and boundary portions of the plurality of second recesses adjacent in the third direction. It is preferable to expose from the optical material layer .
本適用例によれば、平坦化工程で第１方向、第２方向、および第３方向の三方向において隣り合う第２凹部同士の境界部分で第１透光材料層が露出するまで平坦化処理を施すので、第２透光材料層は三方向において隣り合う第２凹部同士の境界部分で離間される。すなわち、第２透光材料層は第２凹部毎に分断される。そのため、第２透光材料層にかかる応力がより分散されるとともに、第２透光材料層全体の体積がより小さくなることにより第２透光材料層にかかる応力がより緩和されるので、応力により生じる第２透光材料層のクラックをより効果的に抑止できる。
According to this application example , in the planarization step, the planarization process is performed until the first light-transmissive material layer is exposed at the boundary portion between the second concave portions adjacent to each other in the three directions of the first direction, the second direction, and the third direction. Therefore, the second light transmissive material layer is separated at the boundary portion between the second concave portions adjacent in the three directions. That is, the second light transmissive material layer is divided for each second recess. Therefore, the stress applied to the second light transmissive material layer is further dispersed, and the stress applied to the second light transmissive material layer is further relaxed by reducing the volume of the entire second light transmissive material layer. The crack of the 2nd translucent material layer which arises by can be suppressed more effectively.
［適用例３］上記適用例に係るマイクロレンズアレイ基板であって、前記第透光性材料は、前記第１方向、前記第２方向、および前記第３方向において隣り合う前記複数の第２凹部の境界部分における前記第１透光材料層の上面が前記マークの上面よりも高くなる膜厚であることが好ましい。
Application Example 3 In the microlens array substrate according to the application example, the light-transmitting material includes the plurality of second recesses adjacent in the first direction, the second direction, and the third direction. It is preferable that the upper surface of the first light transmissive material layer at the boundary portion has a thickness that is higher than the upper surface of the mark.
本適用例によれば、第１方向、第２方向、および第３方向の三方向において隣り合う第２凹部同士の境界部分における第１透光材料層の上面がマークの上面よりも高くなる膜厚で第１透光材料層を形成する。そのため、三方向において隣り合う第２凹部同士の境界部分で第１透光材料層が露出して第２透光材料層が第２凹部毎に離間されるまで平坦化処理を施しても、マーク上に第１透光材料層を残してマークの除去を抑止することができる。
According to this application example, the upper surface of the first light transmissive material layer is higher than the upper surface of the mark at the boundary portion between the second concave portions adjacent to each other in the three directions of the first direction, the second direction, and the third direction. A first light transmissive material layer is formed with a thickness. Therefore, even if the first light-transmitting material layer is exposed at the boundary portion between the second concave portions adjacent in the three directions and the second light-transmitting material layer is separated for each second concave portion, The removal of the mark can be suppressed by leaving the first light transmissive material layer thereon.
［適用例４］上記適用例に係るマイクロレンズアレイ基板であって、前記基板と前記第１透光材料層とは、略同一の熱膨張係数を有する無機材料からなることが好ましい。
Application Example 4 In the microlens array substrate according to the application example described above, it is preferable that the substrate and the first light transmissive material layer are made of an inorganic material having substantially the same thermal expansion coefficient.
本適用例によれば、基板と第１透光材料層とが略同一の熱膨張係数を有する無機材料からなるので、樹脂材料からなる場合と比べて耐熱性に優れるとともに、温度変化などに起因して生じる応力を抑えることができる。
According to this application example, since the substrate and the first light-transmissive material layer are made of an inorganic material having substantially the same thermal expansion coefficient, the heat resistance is excellent as compared with the case of being made of a resin material, and due to a temperature change or the like. Can be suppressed.
本適用例によれば、基板の第１面にマスク層を形成する前に、マークを覆う第３の透光材料層を形成する。そのため、マスク層を除去する際に用いる溶剤でマークも除去されてしまうおそれがある場合に、マークを第３の透光材料層で保護して、マークが除去されることを抑止できる。
According to this application example, before the mask layer is formed on the first surface of the substrate, the third light transmissive material layer covering the mark is formed. Therefore, when there is a possibility that the mark is also removed by the solvent used when removing the mask layer, the mark can be protected by the third light transmissive material layer, and the removal of the mark can be suppressed.
［適用例６］上記適用例に係るマイクロレンズアレイ基板であって、前記マークは、アライメントマークを含んでいてもよい。
Application 6 In the microlens array substrate according to the application example described above, the mark may include an alignment mark.
本適用例によれば、マイクロレンズアレイ基板に位置合わせの基準となるアライメントマークを形成するので、マイクロレンズアレイ基板を用いて液晶装置の素子基板や対向基板を形成する工程において、マイクロレンズに対する遮光層の位置決めを容易に行うことができ、マイクロレンズに対する遮光層の位置ズレを抑えることができる。
According to this application example, since the alignment mark serving as the alignment reference is formed on the microlens array substrate, the microlens array substrate is used to shield the microlens in the process of forming the element substrate and the counter substrate of the liquid crystal device. Positioning of the layer can be easily performed, and positional deviation of the light shielding layer with respect to the microlens can be suppressed.
［適用例７］上記適用例に係るマイクロレンズアレイ基板であって、前記マークは、前記第１透光材料層の層厚測定用のマークを含んでいてもよい。
Application Example 7 In the microlens array substrate according to the application example described above, the mark may include a mark for measuring a thickness of the first light transmissive material layer .
本適用例によれば、マイクロレンズアレイ基板に第１透光材料層の層厚測定用のマークを形成するので、平坦化工程における第１透光材料層の層厚の制御を容易に行うことができ、アライメントマーク上の第１透光材料層の残厚をより確実に確保することができる。
According to this application example, since the mark for measuring the thickness of the first light transmissive material layer is formed on the microlens array substrate, it is possible to easily control the layer thickness of the first light transmissive material layer in the planarization step. Thus, the remaining thickness of the first light transmissive material layer on the alignment mark can be ensured more reliably.
［適用例８］本適用例に係る電気光学装置は、第１基板と、前記第１基板に対向配置された第２基板と、前記第１基板と前記第２基板との間に配置された電気光学層と、を備えた電気光学装置であって、上記適用例のマイクロレンズアレイ基板を前記第１基板に備え、前記マイクロレンズアレイ基板の前記第２透光材料層の上層に形成されたスイッチング素子を有することを特徴とする。
Application Example 8 An electro-optical device according to this application example is disposed between the first substrate, the second substrate disposed opposite to the first substrate, and the first substrate and the second substrate. An electro-optic device , wherein the microlens array substrate of the application example is provided on the first substrate, and is formed on an upper layer of the second light transmissive material layer of the microlens array substrate . It has a switching element .
本適用例によれば、マイクロレンズアレイ基板の第２透光材料層の上層にスイッチング素子を形成する工程における高温加熱処理時に高温加熱や冷却などの温度変化に晒されても、第２透光材料層のクラックを抑止できるマイクロレンズアレイ基板を備えているので、品質が高く明るい電気光学装置を製造することができる。 According to this application example, even if the second light-transmitting material layer of the microlens array substrate is exposed to a temperature change such as high-temperature heating or cooling during the high-temperature heat treatment in the step of forming the switching element on the second light-transmitting material layer, Since the microlens array substrate capable of suppressing cracks in the material layer is provided, a high-quality and bright electro-optical device can be manufactured.
Claims (9)
光透過性を有する基板の第１面の前記第２領域に形成されたマークと、A mark formed in the second region of the first surface of the light-transmitting substrate;
前記基板の前記第１面の前記第１領域に形成された複数の第１凹部と、A plurality of first recesses formed in the first region of the first surface of the substrate;
前記基板の前記第１面の前記第１領域および前記第２領域に前記マークと前記複数の第１凹部とを覆うように透光性材料を所定の膜厚で配置して、前記複数の第１凹部の形状が反映された複数の第２凹部を有する第１透光材料層と、A translucent material is disposed at a predetermined film thickness so as to cover the mark and the plurality of first recesses in the first region and the second region of the first surface of the substrate, and the plurality of first regions A first light transmissive material layer having a plurality of second recesses reflecting the shape of one recess;
前記第１透光材料層を覆い前記複数の第２凹部を埋め込むように、光透過性を有し前記第１透光材料層とは異なる屈折率を有する第２透光材料層と、を備え、A second light-transmitting material layer having a light transmission property and a refractive index different from that of the first light-transmitting material layer so as to cover the first light-transmitting material layer and fill the plurality of second recesses. ,
隣り合う前記複数の第２凹部の境界部分で前記第１透光材料層の少なくとも一部は、前記第２透光材料層から露出し、かつ、前記マークは、前記第２透光材料層から露出しないことを特徴とするマイクロレンズアレイ基板。At least a part of the first light transmissive material layer is exposed from the second light transmissive material layer at a boundary portion between the plurality of adjacent second recesses, and the mark is formed from the second light transmissive material layer. A microlens array substrate that is not exposed.
光透過性を有する基板の第１面の前記第２領域にマークを形成するマーク形成工程と、
前記基板の前記第１面の前記第１領域に複数の第１凹部を形成する凹部形成工程と、
前記基板の前記第１面の前記第１領域および前記第２領域に前記マークと前記複数の第１凹部とを覆うように透光性材料を所定の膜厚で配置して、前記複数の第１凹部の形状が反映された複数の第２凹部を有する第１透光材料層を形成する第１透光材料層形成工程と、
前記第１透光材料層を覆い前記複数の第２凹部を埋め込むように、光透過性を有し前記第１透光材料層とは異なる屈折率を有する第２透光材料層を形成する工程と、
隣り合う前記複数の第２凹部の境界部分で前記第１透光材料層の少なくとも一部が露出し、かつ、前記マークが露出しないように、前記第２透光材料層に対して平坦化処理を施す平坦化工程と、を備えていることを特徴とするマイクロレンズアレイ基板の製造方法。 A method for manufacturing a microlens array substrate, comprising: a first region in which a plurality of microlenses are arranged; and a second region located outside the first region,
A mark forming step of forming a mark in the second region of the first surface of the substrate having optical transparency;
A recess forming step of forming a plurality of first recesses in the first region of the first surface of the substrate;
A translucent material is disposed at a predetermined film thickness so as to cover the mark and the plurality of first recesses in the first region and the second region of the first surface of the substrate, and the plurality of first regions A first light-transmitting material layer forming step of forming a first light-transmitting material layer having a plurality of second recesses reflecting the shape of one recess;
Forming a second light transmissive material layer having a light transmission property and a refractive index different from that of the first light transmissive material layer so as to cover the first light transmissive material layer and fill the plurality of second recesses; When,
A planarization process is performed on the second light transmissive material layer so that at least a part of the first light transmissive material layer is exposed at the boundary portions of the plurality of adjacent second recesses and the mark is not exposed. And a planarizing step for applying a microlens array substrate.
前記複数のマイクロレンズは、第１方向、前記第１方向と交差する第２方向、前記第１方向および前記第２方向と交差する第３方向に配列され、
前記第１方向、前記第２方向、および前記第３方向において隣り合う前記複数の第２凹部の境界部分で前記第１透光材料層は、前記第２透光材料層から露出することを特徴とするマイクロレンズアレイ基板。 The microlens array substrate according to claim 1,
The plurality of microlenses are arranged in a first direction, a second direction intersecting the first direction, the first direction, and a third direction intersecting the second direction,
The first light transmissive material layer is exposed from the second light transmissive material layer at a boundary portion of the plurality of second recesses adjacent in the first direction , the second direction, and the third direction. A microlens array substrate.
前記透光性材料は、前記第１方向、前記第２方向、および前記第３方向において隣り合う前記複数の第２凹部の境界部分における前記第１透光材料層の上面が前記マークの上面よりも高くなる膜厚であることを特徴とするマイクロレンズアレイ基板。 The microlens array substrate according to claim 3 ,
In the translucent material, the upper surface of the first translucent material layer at the boundary portion between the plurality of second recesses adjacent in the first direction, the second direction, and the third direction is more than the upper surface of the mark. a microlens array substrate, characterized in that is the film thickness higher.
前記基板と前記第１透光材料層とは、略同一の熱膨張係数を有する無機材料からなることを特徴とするマイクロレンズアレイ基板。 The microlens array substrate according to claim 1 ,
The microlens array substrate, wherein the substrate and the first light transmissive material layer are made of an inorganic material having substantially the same thermal expansion coefficient.
前記凹部形成工程は、
前記基板の前記第１面の前記第１領域と前記第２領域とにマスク層を形成する工程と、
前記マスク層の前記第１領域に前記基板が露出する複数の開口部を形成する工程と、
前記マスク層の前記開口部を介して前記基板にエッチングを施すことにより前記複数の第１凹部を形成する工程と、
前記マスク層を除去する工程と、を含み、
前記マーク形成工程と前記凹部形成工程との間に、前記マークを覆う第３の透光材料層を形成する工程を有することを特徴とするマイクロレンズアレイ基板の製造方法。 A method of manufacturing a microlens array substrate according to claim 2 ,
The recess forming step includes
Forming a mask layer on the first region and the second region of the first surface of the substrate;
Forming a plurality of openings exposing the substrate in the first region of the mask layer;
Forming the plurality of first recesses by etching the substrate through the openings of the mask layer;
Removing the mask layer,
A method of manufacturing a microlens array substrate, comprising a step of forming a third light transmissive material layer covering the mark between the mark forming step and the recess forming step.
前記マーク形成工程で形成するマークは、アライメントマークを含むことを特徴とするマイクロレンズアレイ基板。 The microlens array substrate according to claim 1 ,
The microlens array substrate, wherein the mark formed in the mark forming step includes an alignment mark.
前記マークは、前記第１透光材料層の層厚測定用のマークを含むことを特徴とするマイクロレンズアレイ基板。 The microlens array substrate according to claim 1 ,
The microlens array substrate , wherein the mark includes a mark for measuring a thickness of the first light transmissive material layer.
請求項１に記載のマイクロレンズアレイ基板を前記第１基板に備え、
前記マイクロレンズアレイ基板の前記第２透光材料層の上層に形成されたスイッチング素子を有することを特徴とする電気光学装置。 An electro-optical device , comprising: a first substrate; a second substrate disposed opposite to the first substrate; and an electro-optical layer disposed between the first substrate and the second substrate,
The microlens array substrate according to claim 1 provided in the first substrate,
The electro-optical device characterized in that it comprises a switching element formed on an upper layer of the second light transmitting material layer of the microlens array substrate.
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| JP6702394B2 (en) | 2018-10-26 | 2020-06-03 | セイコーエプソン株式会社 | Electro-optical device, method for manufacturing electro-optical device, and member for manufacturing electro-optical device |
| CN115185025A (en) * | 2022-07-26 | 2022-10-14 | 京东方科技集团股份有限公司 | Micro-lens array substrate, preparation method thereof and display device |
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