JP2015040159A - Cutting method for brittle structure and cutting method for brittle structure - Google Patents

Abstract

PROBLEM TO BE SOLVED: To stably cut a brittle structure at a position overlapping with an adhesive layer as a cutting position.SOLUTION: A cutting method for a brittle structure includes the steps of: cutting one brittle substrate between a pair of brittle substrates by forming and growing a first crack from the opposite side from a part where an adhesive layer 13 sticks; and cutting the other brittle substrate 12 between the pair of brittle substrates and the adhesive layer 13 by forming and growing a second crack from the opposite side from the part where the adhesive layer 13 sticks along the cutting line along which the one brittle substrate 11 is cut. In the step of cutting the other brittle substrate 12, the second crack 12c is formed and grown with a cutter 110 while the joint part of the adhesive layer 13 for the other brittle substrate 12 is preheated at a position at least along the cutting line so as to cut the brittle structure 10 by connecting the first crack and second crack 12c to each other.

Description

  The present invention relates to a brittle structure cutting method and a brittle structure cutting apparatus, and more particularly to a brittle structure cutting method in which a pair of mother glasses used for manufacturing a liquid crystal panel are laminated and the brittle structure. The present invention relates to a body cutting device.

  JP-A-2011-197143 (Patent Document 1) is a prior document disclosing a method for manufacturing a liquid crystal panel forming structure.

  In the method for manufacturing a liquid crystal panel forming structure described in Patent Document 1, an element sealant is formed on one of a pair of transparent substrates, and a pair of opposing outer peripheral edges of the other transparent substrate The outer peripheral sealing material is formed along the two sides. After bonding a pair of transparent substrates to each other, an outer peripheral sealing material is formed on a surface on which an outer peripheral sealing material is not formed, of the outer peripheral surfaces of a structure manufactured by bonding the pair of transparent substrates to each other. . Thereafter, the structure is cut using a glass cutter or the like with the position overlapping with the outer peripheral sealing material as a cutting position, and a liquid crystal panel forming structure is manufactured.

JP 2011-197143 A

  The outer peripheral sealing material described in Patent Document 1 functions as an adhesive layer that bonds a pair of brittle substrates together. When the adhesive force by the adhesive layer is strong and a pair of brittle substrates are firmly joined to each other by the adhesive layer, the structure is formed with the position overlapping with the outer peripheral sealing material as described in Patent Document 1 as the cutting position May not be cut using a glass cutter or the like. In the invention described in Patent Document 1, such a situation is not considered.

  The present invention has been made in view of the above problems, and a brittle structure cutting method and a brittle structure capable of stably cutting a brittle structure with a position overlapping with the adhesive layer as a cutting position. An object of the present invention is to provide a cutting device.

  The method for cutting a brittle structure according to the present invention is a method for cutting a brittle structure in which a pair of brittle substrates are bonded to each other with an adhesive layer. A method for cutting a brittle structure is to form one brittle substrate by forming a first crack from one side of a brittle substrate of a pair of brittle substrates to form a first crack from the opposite side. And the second brittle substrate of the pair of brittle substrates from the opposite side of the portion to which the adhesive layer is adhered so as to follow a cutting line where one brittle substrate is cut. And a step of cutting the other brittle substrate and the adhesive layer by forming and developing a crack. In the step of cutting the other brittle substrate, at least at the position along the cutting line, the joint portion of the adhesive layer with the other brittle substrate is preheated to form a second crack with a cutter and advance, The brittle structure is cut by connecting the first crack and the second crack.

  In one embodiment of the present invention, the step of cutting the other brittle substrate is started before the end of the step of cutting the one brittle substrate.

  In one form of this invention, in the process of cut | disconnecting the other brittle board | substrate, a 2nd crack is formed and advanced with a cutter, cooling a cutter.

  In one embodiment of the present invention, in the step of cutting the other brittle substrate, the joint is heated by irradiating the other brittle substrate or the adhesive layer with light.

  The brittle structure cutting apparatus according to the present invention is a brittle structure cutting apparatus configured by bonding a pair of brittle substrates to each other by an adhesive layer. An apparatus for cutting a brittle structure is obtained by forming a first crack from one side of a brittle substrate of a pair of brittle substrates to form a first crack from a side opposite to a portion to which an adhesive layer is attached. The cutting means for cutting the first and second brittle substrates of the pair of brittle substrates are arranged from the opposite side of the portion where the adhesive layer is adhered so as to follow the cutting line where one brittle substrate is cut. A heating mechanism that heats a joint between the cutter that cuts the other brittle substrate and the adhesive layer and the other brittle substrate of the adhesive layer at least at a position along the cutting line by forming and developing two cracks With. A brittle structure is cut by connecting the first crack and the second crack by forming a second crack with a cutter and causing the joint to advance with the heating mechanism preheated by the heating mechanism.

  According to the present invention, the brittle structure can be stably cut with the position overlapping the adhesive layer as the cutting position.

It is a top view which shows the structure of the brittle structure which concerns on Embodiment 1 of this invention. It is the figure which looked at the brittle structure of FIG. 1 from the arrow II direction. It is a perspective view which shows the state which has cut | disconnected CF glass with the cutting device of the brittle structure which concerns on the embodiment. It is the figure which looked at the brittle structure of FIG. 3 from the direction shown by arrow IV. It is a perspective view which shows the state which has cut | disconnected TFT glass with the cutting device of the brittle structure which concerns on the embodiment. It is sectional drawing which shows the state at the time of cut | disconnecting TFT glass in the same embodiment. It is the figure which looked at the brittle structure of FIG. 5 from the direction shown by arrow VII. It is a side view which shows the state which carried out the isotropic etching of the glass of both surfaces of the liquid crystal panel cut | disconnected by the cutting method of the brittle structure which concerns on the embodiment, and separated into pieces. It is a perspective view which shows the state which has cut | disconnected TFT glass with the cutting device of the brittle structure which concerns on Embodiment 2 of this invention. It is a perspective view which shows the state which has cut | disconnected TFT glass with the cutting device of the brittle structure which concerns on Embodiment 3 of this invention. It is a perspective view which shows the state which has cut | disconnected TFT glass with the cutting device of the brittle structure which concerns on Embodiment 4 of this invention. 6 is a plan view showing a configuration of a brittle structure according to Comparative Example 1. FIG. It is the figure which looked at the brittle structure of FIG. 12 from the arrow XIII direction. It is a side view which shows the state which cut | disconnected CF glass in the comparative example 1. FIG. It is a side view which shows the state which cut | disconnected TFT glass in the comparative example 1. FIG. In Comparative Example 1, it is a side view showing a state where the glass on both sides of the liquid crystal panel is isotropically etched. It is a side view which shows the state which cut | disconnected CF glass in the comparative example 2. FIG. It is sectional drawing which shows the state at the time of cut | disconnecting TFT glass in the comparative example 2. FIG.

  Hereinafter, embodiments and comparative examples of the present invention will be described with reference to the drawings. In the following description, the same or corresponding parts in the drawings are denoted by the same reference numerals, and the description thereof will not be repeated. Further, as a brittle structure, a brittle structure constituted by bonding a pair of mother glasses used for manufacturing a liquid crystal panel will be described as an example. However, the brittle structure is not limited to the above, and any brittle structure may be used as long as a pair of brittle substrates are bonded to each other with an adhesive layer.

First, a method for cutting a brittle structure according to Comparative Example 1 will be described.
(Comparative Example 1)
12 is a plan view showing a configuration of a brittle structure according to Comparative Example 1. FIG. FIG. 13 is a view of the brittle structure of FIG. 12 as viewed from the direction of arrow XIII. As shown in FIGS. 12 and 13, a brittle structure 90 according to Comparative Example 1 includes a CF glass 11 that is a mother glass in which a CF (color filter) is formed, and a mother glass in which a TFT (thin film transistor) is formed. TFT glass 12 and an adhesive layer 13. The CF glass 11 and the TFT glass 12 are bonded to each other by an adhesive layer 13.

  The brittle structure 90 is provided with a panel region 14 serving as a liquid crystal panel in a matrix shape in a plan view. The adhesive layer 13 is provided around the panel region 14 in plan view. That is, the panel region 14 is surrounded by the adhesive layer 13.

  In Comparative Example 1, the adhesive layer 13 is not provided at the planned cutting position of the brittle structure 90 for separating the liquid crystal panel. Therefore, a lattice-like groove 13c where the adhesive layer 13 does not exist is formed.

  As a manufacturing method of the brittle structure 90, first, an adhesive mainly composed of an epoxy resin or an acrylic resin that becomes the adhesive layer 13 is applied to the CF glass 11 or the TFT glass 12 by a printing method or an inkjet method. . Next, a liquid crystal material is dropped on the panel region 14. Thereafter, pressure is applied in a state where the CF glass 11 and the TFT glass 12 are bonded together. As a result, the liquid crystal material is sealed in the panel region 14 surrounded by the CF glass 11, the TFT glass 12, and the adhesive layer 13.

  As a method of cutting the brittle structure 90 manufactured as described above, first, one of the CF glass 11 and the TFT glass 12 is cut. FIG. 14 is a side view showing a state in which the CF glass is cut in Comparative Example 1. As shown in FIG. 14, in Comparative Example 1, the CF glass 11 is cut by a glass cutter at a position on the groove 13c. When the first crack 11c formed on the surface of the CF glass 11 is advanced by the glass cutter and reaches the back surface of the CF glass 11, the CF glass 11 is cut.

  Next, the brittle structure 90 is repeatedly pulled to cut the TFT glass 12. FIG. 15 is a side view showing a state in which the TFT glass is cut in the first comparative example. As shown in FIG. 15, in Comparative Example 1, the TFT glass 12 is cut with a glass cutter at a position on the groove 13c. The second crack 12c formed on the surface of the TFT glass 12 by the glass cutter is developed and reaches the back surface of the TFT glass 12, whereby the TFT glass 12 is cut.

  In this way, when the brittle structure 90 is cut by connecting the first crack 11c and the second crack 12c at a position on the groove 13c where the adhesive layer 13 is not provided, as described later, the TFT glass is used. Since the influence of the compressive stress generated in the glass 12 can be alleviated, the second crack can be easily formed in the TFT glass 12 and propagated.

  Specifically, since the CF glass 11 and the TFT glass 12 are not joined in the groove 13c, the tensile stress generated in the CF glass 11 when the blade of the glass cutter is pressed against the TFT glass 12 is reduced. In addition, the compressive stress generated by the tensile stress generated in the CF glass 11 acting on the TFT glass 12 through the adhesive layer 13 is also reduced. Therefore, the brittle structure 90 can be cut by reducing the compressive stress acting on the portion of the TFT glass 12 where the blade of the glass cutter is pressed.

  However, when the brittle structure 90 is cut at a position on the groove 13c, there are the following problems. The groove 13c is formed by not applying an adhesive. When uneven application of the adhesive occurs, the position of the groove 13c varies. In this case, the brittle structure 90 cannot be stably cut at a position on the groove 13c.

  In addition, the separated liquid crystal panel may be thinned by etching. In this case, the separated liquid crystal panel is immersed in an etching solution, and the glass on both sides is thinned by isotropic etching. As shown in FIG. 15, a recess due to the groove 13 c exists in the cut portion around the liquid crystal panel.

  FIG. 16 is a side view showing a state where the glass on both sides of the liquid crystal panel is isotropically etched in Comparative Example 1. When the CF glass 11 and the TFT glass 12 of the liquid crystal panel cut at the position on the groove 13c are isotropically etched, the etching solution enters the concave portion, so that the liquid crystal panel cuts into the cut portion as shown in FIG. A protrusion is formed. Specifically, the protrusion 11p is formed at the tip of the etched CF glass 11e. A protrusion 12p is formed at the tip of the etched TFT glass 12e.

  When the protrusions 11p and 12p are formed, the CF glass 11 and the TFT glass 12 are easily damaged, and the quality stability of the liquid crystal panel is impaired. Therefore, it is preferable that the protrusions 11p and 12p are not formed at the cut portion of the liquid crystal panel. Therefore, it is conceivable to cut the brittle structure at a position on the adhesive layer 13 without providing the groove 13c. If the brittle structure can be cut at a position on the adhesive layer 13 formed of an adhesive that is stable with respect to the etchant, it is possible to suppress the formation of a protrusion at the cut portion of the liquid crystal panel.

  Hereinafter, a method for cutting a brittle structure according to Comparative Example 2 will be described. The brittle structure according to Comparative Example 2 is different from the brittle structure 90 according to Comparative Example 1 only in that the groove 13c is not provided.

(Comparative Example 2)
FIG. 17 is a side view showing a state in which the CF glass is cut in Comparative Example 2. As shown in FIG. 17, in Comparative Example 2, the CF glass 11 is cut with a glass cutter at a position overlapping the adhesive layer 13. When the first crack 11c formed on the surface of the CF glass 11 is advanced by the glass cutter and reaches the back surface of the CF glass 11, the CF glass 11 is cut.

  Next, the brittle structure 90 is repeatedly pulled to try to cut the TFT glass 12. 18 is a cross-sectional view showing a state when the TFT glass is cut in Comparative Example 2. FIG. As shown in FIG. 18, when a glass cutter blade 111 is pressed against the TFT glass 12 at a position on the first crack 11 c to form a second crack in the TFT glass 12, the first crack 11 c is formed in the CF glass 11. Tensile stress in the direction indicated by the arrow T is generated on both sides of.

  Since the CF glass 11 and the TFT glass 12 are firmly bonded by the adhesive layer 13, the tensile stress generated in the CF glass 11 acts on the TFT glass 12 through the adhesive layer 13. Specifically, a compressive stress in the direction indicated by the arrow P is generated in the TFT glass 12. The compressive stress in the direction indicated by the arrow P acts toward the portion of the TFT glass 12 where the blade 111 of the glass cutter is pressed.

  As described above, it is difficult to form the second crack in the portion where the compressive stress of the TFT glass 12 acts, and even if the second crack can be formed, the second crack can hardly be developed. As a result, the brittle structure cutting method according to Comparative Example 2 cannot stably cut the brittle structure.

  Hereinafter, a brittle structure cutting method and a brittle structure cutting apparatus according to Embodiment 1 of the present invention will be described with reference to the drawings.

(Embodiment 1)
FIG. 1 is a plan view showing a configuration of a brittle structure according to Embodiment 1 of the present invention. FIG. 2 is a view of the brittle structure of FIG. 1 as viewed from the direction of arrow II. As shown in FIGS. 1 and 2, the brittle structure 10 includes a CF glass 11 that is a mother glass in which CF is formed, a TFT glass 12 that is a mother glass in which a TFT is formed, and an adhesive layer 13. Has been. The CF glass 11 and the TFT glass 12 which are a pair of brittle substrates are bonded to each other by an adhesive layer 13.

  The brittle structure 10 is provided with a panel region 14 serving as a liquid crystal panel in a matrix in a plan view. The adhesive layer 13 is provided around the panel region 14 in plan view. That is, the panel region 14 is surrounded by the adhesive layer 13. The adhesive layer 13 is formed by curing an adhesive mainly composed of an epoxy resin or an acrylic resin. Note that the material of the adhesive layer 13 is not limited to the above, and any resin material can be used as long as it can seal the liquid crystal material and has resistance to an etching solution described later.

  As a method for manufacturing the brittle structure 10, first, an adhesive mainly composed of an epoxy resin or an acrylic resin that becomes the adhesive layer 13 is applied to the CF glass 11 or the TFT glass 12 by a printing method or an inkjet method. . Next, a liquid crystal material is dropped on the panel region 14. Thereafter, pressure is applied in a state where the CF glass 11 and the TFT glass 12 are bonded together. As a result, the liquid crystal material is sealed in the panel region 14 surrounded by the CF glass 11, the TFT glass 12, and the adhesive layer 13.

  FIG. 3 is a perspective view showing a state in which the CF glass is cut by the brittle structure cutting apparatus according to the present embodiment. FIG. 4 is a view of the brittle structure of FIG. 3 as viewed from the direction indicated by arrow IV.

  As shown in FIG. 3, the brittle structure cutting apparatus 100 according to this embodiment includes a glass cutter 110 that is a cutting unit that cuts a brittle substrate, and a laser beam irradiation unit 120 that is a heating mechanism.

  The glass cutter 110 has a disk-shaped blade 111 at the tip. The blade 111 is rotatably supported. The blade 111 is made of diamond or super steel material. The glass cutter 110 is provided so that lubricating oil can be supplied to the blade 111. The glass cutter 110 is not limited to one having a disk-shaped rotary blade, and may be a fixed diamond cutter or the like.

  The laser beam irradiation unit 120 is attached to the side of the glass cutter 110 so that the laser beam can be irradiated toward the vicinity of the blade 111 of the glass cutter 110. The laser beam irradiation unit 120 according to the present embodiment is a carbon dioxide gas laser and irradiates a laser beam having a wavelength in the vicinity of 10 μm. Carbon dioxide laser has good energy efficiency among gas lasers. However, the configuration of the laser beam irradiation unit 120 is not limited to the carbon dioxide laser, and the wavelength of the irradiated laser beam is not limited to the above.

  As will be described later, in order to efficiently heat the TFT glass 12 by irradiating it with the laser beam, the wavelength of the laser beam is longer than 5 μm, which is a wavelength range easily absorbed by the glass, and shorter than 15 μm. It is preferable.

  The cutting device 100 is provided so as to be movable relative to the brittle structure 10. In the cutting device 100, the laser beam irradiation unit 120 is disposed on the front side in the relative movement direction of the cutting device 100 as compared with the glass cutter 110.

  In the method for cutting a brittle structure according to this embodiment, first, as shown in FIG. 3, the blade 111 of the glass cutter 110 is pressed against the surface of the CF glass 11 without irradiating the laser beam from the laser beam irradiation unit 120. In this state, the cutting device 100 is moved relative to the brittle structure 10 in the direction indicated by the arrow 1. At this time, the blade 111 of the glass cutter 110 is pressed against the opposite side of the CF glass 11 where the adhesive layer 13 is attached.

  As a result, as shown in FIGS. 3 and 4, the first crack 11 c can be formed and propagated from the opposite side of the CF glass 11 where the adhesive layer 13 is attached. When the first crack 11c reaches from the front surface to the back surface of the CF glass 11, the CF glass 11 is cut.

  Next, the brittle structure 10 is repeated to cut the TFT glass 12 and the adhesive layer 13. FIG. 5 is a perspective view showing a state in which the TFT glass is cut by the brittle structure cutting apparatus according to the present embodiment. FIG. 6 is a cross-sectional view showing a state when the TFT glass is cut in this embodiment. FIG. 7 is a view of the brittle structure of FIG. 5 as seen from the direction indicated by arrow VII.

  As shown in FIG. 5, when the TFT glass 12 is cut, the blade 111 of the glass cutter 110 is pressed against the surface of the TFT glass 12 while irradiating the TFT glass 12 with the laser light 120 b from the laser light irradiation unit 120. Thus, the cutting device 100 is moved relative to the brittle structure 10 in the direction indicated by the arrow 2. At this time, the blade 111 of the glass cutter 110 is pressed against the opposite side of the TFT glass 12 where the adhesive layer 13 is attached. The direction indicated by the arrow 2 is along the cutting line in which the CF glass 11 is cut.

  In the TFT glass 12, the heating region 12h around the irradiation position of the laser beam 120b is heated to a temperature lower than the softening point of the glass. The heat in the heating area 12h is transferred to the bonding portion 13i of the adhesive layer 13 shown in FIG. 6 that is in contact with the TFT glass 12 in the heating area 12h. The joint 13i is softened by the heat transfer. As a result, the bonding force between the CF glass 11 and the TFT glass 12 is reduced at the bonding portion 13i.

  Since the laser beam irradiation unit 120 is disposed on the front side in the relative movement direction of the cutting device 100 as compared with the glass cutter 110, the blade 111 of the glass cutter 110 passes over the heating region 12h. As a result, as shown in FIG. 6, the blade 111 of the glass cutter is pressed against the TFT glass 12 at a position on the first crack 11c in a state where the joint portion 13i of the adhesive layer 13 is softened.

  Since the bonding force between the CF glass 11 and the TFT glass 12 is reduced at the bonding portion 13i, the direction indicated by the arrow Ts in the CF glass 11 when the blade 111 of the glass cutter 110 is pressed against the TFT glass 12. The tensile stress generated in the CF glass 11 is reduced, and the tensile stress generated in the CF glass 11 acts on the TFT glass 12 through the adhesive layer 13 to reduce the compressive stress generated in the direction indicated by the arrow Ps. Therefore, the compressive stress acting on the portion of the TFT glass 12 where the blade 111 of the glass cutter 110 is pressed can be reduced.

  Thus, by cutting the TFT glass 12 at the position on the joint portion 13i where the adhesive layer 13 is softened, the influence of the compressive stress generated in the TFT glass 12 can be alleviated. As a result, in the TFT glass 12, the second crack 12c is formed and developed from the opposite side of the portion where the adhesive layer 13 is adhered so as to extend along the cutting line in which the CF glass 11 is cut. The glass 12 and the adhesive layer 13 can be cut.

  As shown in FIGS. 5 to 7, in the method for cutting a brittle structure according to the present embodiment, a state in which the bonding portion 13 i of the adhesive layer 13 with the TFT glass 12 is heated in advance at least along the cutting line. Then, the second crack 12c is formed and advanced by the glass cutter 110, and the brittle structure 10 can be stably cut by connecting the first crack 11c and the second crack 12c. Therefore, the brittle structure 10 can be stably cut with the position overlapping the adhesive layer 13 as the cutting position.

  In the present embodiment, the CF glass 11 is cut before the TFT glass 12, but the TFT glass 12 may be cut before the CF glass 11. In addition, the second crack 12c may be formed and advanced in a state where the entire brittle structure 10 is heated in advance and the entire adhesive layer 13 is softened.

  Further, two cutting devices 100 may be prepared, the CF glass 11 may be cut by one cutting device 100, and the TFT glass 12 may be cut by the other cutting device 100.

  Specifically, in the cutting device 100 arranged on the CF glass 11 side, the cutting device 100 is pressed with the blade 111 of the glass cutter 110 against the surface of the CF glass 11 without irradiating the laser light from the laser light irradiation unit 120. The CF glass 11 is cut by moving 100 relative to the brittle structure 10.

  In the cutting apparatus 100 disposed on the TFT glass 12 side, the cutting apparatus 100 is in a state where the blade 111 of the glass cutter 110 is pressed against the surface of the TFT glass 12 while irradiating the TFT glass 12 with the laser light 120b from the laser light irradiation unit 120. Is moved relative to the brittle structure 10 to cut the TFT glass 12.

  In this case, it is not necessary to repeat the brittle structure 10 when the brittle structure 10 is cut. Further, the cutting time of the brittle structure 10 can be shortened by cutting the CF glass 11 and the TFT glass 12 almost simultaneously by the two cutting devices 100. The cutting time of the brittle structure 10 can be shortened by starting the cutting of the other of the CF glass 11 and the TFT glass 12 before the cutting of at least one of the CF glass 11 and the TFT glass 12 is completed.

  In the case where the cutting of the CF glass 11 and the cutting of the TFT glass 12 are performed almost simultaneously by the two cutting devices 100, the brittleness of both of the cutting devices 100 is caused by the difference in the degree of wear of the blades 111 of both glass cutters 110. It is necessary that the blade 111 of the glass cutter 110 that forms the second crack 12c is not positioned in front of the blade 111 of the glass cutter 110 that forms the first crack 11c in the relative traveling direction with respect to the structure 10.

  Therefore, the blade 111 of the glass cutter 110 that forms the first crack 11 c is about 100 μm from the blade 111 of the glass cutter 110 that forms the second crack 12 c in the relative advancing direction of both the cutting apparatuses 100 with respect to the brittle structure 10. It is preferable to position it ahead.

  FIG. 8 is a side view showing a state in which the glass on both surfaces of the liquid crystal panel cut into pieces by the brittle structure cutting method according to the present embodiment is isotropically etched. When the CF glass 11 and the TFT glass 12 of the liquid crystal panel cut at a position on the joint portion 13i are isotropically etched, the cut portion of the liquid crystal panel has a chamfered shape as shown in FIG.

  Therefore, in the liquid crystal panel cut into pieces by the brittle structure cutting method according to the present embodiment, it is possible to suppress the formation of protrusions at the cut portion of the liquid crystal panel as in Comparative Example 1. Specifically, it is possible to suppress the protrusion 11p from being formed at the tip of the etched CF glass 11e. It can suppress that the projection part 12p is formed in the front-end | tip of the etched TFT glass 12e.

  By suppressing the formation of the protrusions 11p and 12p, it is possible to make the CF glass 11 and the TFT glass 12 difficult to break, so that the quality stability of the liquid crystal panel can be improved.

  Hereinafter, a brittle structure cutting method and a brittle structure cutting apparatus according to Embodiment 2 of the present invention will be described with reference to the drawings. Note that the cutting device 200 according to the present embodiment is different from the cutting device 100 according to the first embodiment only in that the cooling nozzle 210 is provided, and thus the description of the other components will not be repeated.

(Embodiment 2)
FIG. 9 is a perspective view showing a state where the TFT glass is cut by the brittle structure cutting apparatus according to Embodiment 2 of the present invention. As shown in FIG. 9, the brittle structure cutting apparatus 200 according to the second embodiment of the present invention includes a cooling nozzle 210 that blows cold air 210 a toward a blade 111 of a glass cutter 110.

  When cutting the TFT glass 12, the blade 111 of the glass cutter 110 passes over the heating region 12h, so that the temperature gradually increases. When the length of one side of the brittle structure 10 is longer than 1 m, the cutting performance of the blade 111 may deteriorate due to the blade 111 becoming hot and expanding.

  Therefore, in this embodiment, by blowing the cool air 210a toward the blade 111 from the cooling nozzle 210, the glass cutter 110 forms and develops the second crack 12c while cooling the blade 111 of the glass cutter 110. By doing in this way, it can suppress that the blade 111 becomes high temperature, and the cutting performance of the blade 111 can be maintained. Note that cooling water may be sprayed from the cooling nozzle 210.

  Hereinafter, a brittle structure cutting method and a brittle structure cutting apparatus according to Embodiment 3 of the present invention will be described with reference to the drawings. Note that the cutting device 300 according to the present embodiment is different from the cutting device 200 according to the second embodiment only in that an infrared irradiation unit 310 is provided instead of the laser beam irradiation unit 120, and therefore, description of other configurations will not be repeated.

(Embodiment 3)
FIG. 10 is a perspective view showing a state in which the TFT glass is cut by the brittle structure cutting apparatus according to Embodiment 3 of the present invention. As shown in FIG. 10, the brittle structure cutting apparatus 300 according to Embodiment 3 of the present invention includes an infrared irradiation unit 310 that is a heating mechanism.

  The infrared irradiation part 310 is attached to the side of the glass cutter 110 so that infrared rays can be irradiated toward the vicinity of the blade 111 of the glass cutter 110. The infrared irradiation unit 310 according to the present embodiment is a ceramic heater and irradiates infrared rays having a wavelength of 1 μm or more and 5 μm or less. However, the configuration of the infrared irradiation unit 310 is not limited to the ceramic heater but may be an infrared lamp or the like, and the wavelength of the irradiated infrared ray is not limited to the above.

  As will be described later, in order to efficiently heat the adhesive layer 13 by irradiating it with infrared rays, the wavelength of the infrared rays is preferably 5 μm or less, which is the range of wavelengths that pass through the glass.

  As shown in FIG. 10, when the TFT glass 12 is cut, the blade 111 of the glass cutter 110 is pressed against the surface of the TFT glass 12 while irradiating the adhesive layer 13 with the infrared ray 310b from the infrared ray irradiation unit 310. The cutting device 100 is moved relative to the brittle structure 10 in the direction indicated by the arrow 2. At this time, the blade 111 of the glass cutter 110 is pressed against the opposite side of the TFT glass 12 where the adhesive layer 13 is attached. The direction indicated by the arrow 2 is along the cutting line in which the CF glass 11 is cut.

  As described above, the infrared irradiation unit 310 irradiates infrared rays having a wavelength of 1 μm or more and 5 μm or less. Infrared rays having a wavelength of 5 μm or less are transmitted through the TFT glass 12, so that it is possible to heat the adhesive layer 13 by irradiating it with infrared rays.

  In the adhesive layer 13, the heating region 31h around the irradiation position of the infrared ray 310b is heated to a temperature lower than the softening point of the glass. The joint 13i of the adhesive layer 13 shown in FIG. 6 located in the heating region 31h is heated and softened. As a result, the bonding force between the CF glass 11 and the TFT glass 12 is reduced at the bonding portion 13i.

  Since the infrared irradiation part 310 is arrange | positioned ahead of the relative movement direction of the cutting device 300 compared with the glass cutter 110, the blade 111 of the glass cutter 110 passes on the heating area | region 31h. As a result, as shown in FIG. 6, the blade 111 of the glass cutter is pressed against the TFT glass 12 at a position on the first crack 11c in a state where the joint portion 13i of the adhesive layer 13 is softened.

  Since the bonding force between the CF glass 11 and the TFT glass 12 is reduced at the bonding portion 13i, the direction indicated by the arrow Ts in the CF glass 11 when the blade 111 of the glass cutter 110 is pressed against the TFT glass 12. The tensile stress generated in the CF glass 11 is reduced, and the tensile stress generated in the CF glass 11 acts on the TFT glass 12 through the adhesive layer 13 to reduce the compressive stress generated in the direction indicated by the arrow Ps. Therefore, the compressive stress acting on the portion of the TFT glass 12 where the blade 111 of the glass cutter 110 is pressed can be reduced.

  Thus, by cutting the TFT glass 12 at the position on the joint portion 13i where the adhesive layer 13 is softened, the influence of the compressive stress generated in the TFT glass 12 can be alleviated. As a result, in the TFT glass 12, the second crack 12c is formed and developed from the opposite side of the portion where the adhesive layer 13 is adhered so as to extend along the cutting line in which the CF glass 11 is cut. The glass 12 and the adhesive layer 13 can be cut.

  In the cutting method of the brittle structure according to the first embodiment, the bonding portion 13i of the adhesive layer 13 is heated and softened by heat transfer from the TFT glass 12, whereas the brittle structure according to the present embodiment. In the body cutting method, the bonding portion 13i of the adhesive layer 13 is softened by irradiating the adhesive layer 13 with infrared rays and heating it.

  Also in the cutting method of the brittle structure according to the present embodiment, the second crack 12c is caused by the glass cutter 110 in a state in which the bonding portion 13i of the adhesive layer 13 with the TFT glass 12 is preheated at least at a position along the cutting line. By forming and progressing, the 1st crack 11c and the 2nd crack 12c are connected, and the brittle structure 10 can be cut | disconnected stably. Therefore, the brittle structure 10 can be stably cut with the position overlapping the adhesive layer 13 as the cutting position.

  Hereinafter, a brittle structure cutting method and a brittle structure cutting apparatus according to Embodiment 4 of the present invention will be described with reference to the drawings. Note that the cutting device 400 according to the present embodiment is different from the cutting devices 200 and 300 according to the second and third embodiments only in that both the laser light irradiation unit 120 and the infrared irradiation unit 310 are provided. Do not repeat.

(Embodiment 4)
FIG. 11 is a perspective view showing a state in which the TFT glass is cut by the brittle structure cutting apparatus according to Embodiment 4 of the present invention. As shown in FIG. 11, the brittle structure cutting apparatus 400 according to the fourth embodiment of the present invention includes a laser light irradiation unit 120 and an infrared irradiation unit 310 as a heating mechanism.

  The laser beam irradiation unit 120 is attached to the side of the glass cutter 110 so that the laser beam can be irradiated toward the vicinity of the blade 111 of the glass cutter 110. The laser beam irradiation unit 120 is disposed on the front side in the relative movement direction of the cutting device 400 as compared with the glass cutter 110.

  The infrared irradiation unit 310 is attached to the side of the laser beam irradiation unit 120 so that infrared rays can be irradiated toward the passing position of the blade 111 of the glass cutter 110. The infrared irradiation unit 310 is disposed on the front side in the relative movement direction of the cutting device 400 as compared to the laser beam irradiation unit 120.

  As shown in FIG. 11, when the TFT glass 12 is cut, the laser light 120 b is irradiated from the laser light irradiation unit 120 to the TFT glass 12 and the infrared ray 310 b is irradiated from the infrared irradiation unit 310 to the adhesive layer 13. With the blade 111 of the glass cutter 110 pressed against the surface of the TFT glass 12, the cutting device 100 is moved relative to the brittle structure 10 in the direction indicated by the arrow 2.

  By doing so, the bonding portion 13i located in the heating region 31h of the adhesive layer 13 irradiated with the infrared rays 310b is heated and softened, and subsequently, the TFT glass 12 heated by being irradiated with the laser beam 120b. The joint 13i can be heated and softened by heat transfer from the heating region 12h. Therefore, the joint part 13i of the adhesive layer 13 can be effectively heated and softened. That is, by irradiating light (electromagnetic waves) having different wavelengths, both the TFT glass 12 and the adhesive layer 13 are heated to effectively soften the bonding portion 13i.

  By cutting the TFT glass 12 at a position on the bonding portion 13i where the adhesive layer 13 is softened, the influence of the compressive stress generated in the TFT glass 12 can be effectively alleviated. As a result, in the TFT glass 12, the second crack 12c is formed and developed from the opposite side of the portion where the adhesive layer 13 is adhered so as to extend along the cutting line in which the CF glass 11 is cut. The glass 12 and the adhesive layer 13 can be easily cut.

  Also in the cutting method of the brittle structure according to the present embodiment, the second crack 12c is caused by the glass cutter 110 in a state in which the bonding portion 13i of the adhesive layer 13 with the TFT glass 12 is preheated at least at a position along the cutting line. By forming and progressing, the 1st crack 11c and the 2nd crack 12c are connected, and the brittle structure 10 can be cut | disconnected stably. Therefore, the brittle structure 10 can be stably cut with the position overlapping the adhesive layer 13 as the cutting position.

  In addition, the laser beam irradiation unit 120 may be disposed on the front side in the relative movement direction of the cutting device 400 as compared with the infrared irradiation unit 310. Examples of combinations of heating mechanisms include a carbon dioxide laser and a ceramic heater, a carbon dioxide laser and an infrared lamp, and a ceramic heater and an infrared lamp. Three or more heating mechanisms may be combined.

  It should be thought that embodiment disclosed this time is an illustration and restrictive at no points. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

  10,90 brittle structure, 11, 11e CF glass, 11c first crack, 11p, 11p, 12p, 12p protrusion, 12, 12e TFT glass, 12c second crack, 12h, 31h heating region, 13 adhesive layer, 13c groove part, 13i joint part, 14 panel region, 100, 200, 300, 400 cutting device, 110 glass cutter, 111 blade, 120 laser light irradiation part, 120b laser light, 210 cooling nozzle, 210a cold air, 310 infrared irradiation part, 310b Infrared.

Claims (5)

A method for cutting a brittle structure comprising a pair of brittle substrates bonded together by an adhesive layer,
Cutting one of the brittle substrates by forming a first crack from the opposite side of the portion to which the adhesive layer is attached in one brittle substrate of the pair of brittle substrates; ,
In the other brittle substrate of the pair of brittle substrates, a second crack is formed from the opposite side of the portion where the adhesive layer is adhered, along a cutting line where the one brittle substrate is cut. And the step of cutting the other brittle substrate and the adhesive layer by making progress,
In the step of cutting the other brittle substrate, the second crack is formed by a cutter in a state where the joint portion of the adhesive layer with the other brittle substrate is preheated at least at a position along the cutting line. A method for cutting a brittle structure, wherein the brittle structure is cut by connecting the first crack and the second crack.   The method for cutting a brittle structure according to claim 1, wherein the step of cutting the other brittle substrate is started before the end of the step of cutting the one brittle substrate.   The method of cutting a brittle structure according to claim 1 or 2, wherein, in the step of cutting the other brittle substrate, the second crack is formed and advanced by the cutter while the cutter is cooled.   The brittle structure according to any one of claims 1 to 3, wherein, in the step of cutting the other brittle substrate, the junction is heated by irradiating the other brittle substrate or the adhesive layer with light. How to cut the body. A brittle structure cutting device comprising a pair of brittle substrates bonded together by an adhesive layer,
Cutting means for cutting the one brittle substrate by forming a first crack from the opposite side of the portion to which the adhesive layer is attached in one brittle substrate of the pair of brittle substrates. When,
In the other brittle substrate of the pair of brittle substrates, a second crack is formed from the opposite side of the portion where the adhesive layer is adhered, along a cutting line where the one brittle substrate is cut. And a cutter that cuts the other brittle substrate and the adhesive layer,
A heating mechanism that heats at least a joint portion of the adhesive layer with the other brittle substrate at a position along the cutting line;
Cutting the brittle structure by connecting the first crack and the second crack by forming and propagating the second crack with the cutter in a state in which the joint is preheated by the heating mechanism; Cutting device for brittle structures.

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