JP2015021142A - Lock member and mask holder for substrate film deposition process - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a mask holder for substrate film deposition process such that magnets having a solid structure are easily attached to high density and easily detached.SOLUTION: A mask holder for substrate film deposition process includes a first plate 110 which supports the other surface of a substrate having a mask arranged on one surface and a second plate 120 having a plurality of hole parts 130 in which magnets 140 fitted with lock members 150 on outer surfaces are accommodated respectively. An inner peripheral surface of a hole part is provided with a fixed groove part 134 where a lock member is locked by spreading of a claw part when inserted, and a detachment part 135 which is formed continuously at a peripheral-directional end part of the fixed groove part. A projection claw locked in the fixed groove part is removed from the fixed groove part by rotating the lock member and magnet by a predetermined angle up to the detachment part.

Description

  The present invention relates to a mask holder for a substrate film formation process that holds a mask magnetically on a substrate as an object to be subjected to the film formation process, and a locking member.

Manufacturing processes of devices such as power devices and other semiconductor elements, crystal resonators, and the like include an electrode forming process using a thin film, and the electrode forming process includes a photolithography method and a mask film forming method. In the photolithography method, a thin film is formed on the entire surface of a substrate such as a semiconductor substrate by vapor deposition or sputtering, then a desired pattern opening is formed by a photoresist, and unnecessary portions are removed by etching. In the mask film forming method, a substrate and a mask in which a predetermined opening is formed in a magnetic material are sequentially stacked on a substrate film processing mask holder having a large number of magnets, and the mask is placed on the surface of the substrate. A film is formed in this state while being attracted by a magnetic force, and after the film formation is completed, a pattern is formed by removing the mask.
Although the mask film formation method is simple and has low process costs, it has a problem that defects are generated in the pattern formed by mask floating, etc., and it is not suitable for fine pattern formation. Yes. For this reason, in order to form a fine pattern, it is necessary to attract the mask to the substrate film formation mask holder with a strong magnetic force so that the mask does not float from the substrate.

  FIG. 8 is an exploded perspective view showing a conventional substrate film formation processing mask holder, and FIG. 9 is a cross-sectional view showing an attachment state of magnets in the substrate film formation processing mask holder. 8A is a view of the substrate film formation mask holder from above, FIG. 8B is a view of the substrate film formation mask holder from below, and FIG. 8C is a magnet mounting structure. It is a disassembled perspective view. The substrate film formation processing mask holder 200 includes an upper layer plate 210 that supports a substrate (not shown) that is a semiconductor substrate, and a lower layer plate 220 that is disposed below the upper layer plate 210. A large number (for example, 52 pieces) of magnets 230 are held on the upper surface of 220 (the surface on the upper layer plate 210 side).

As shown in FIGS. 8 (c) and 9, the magnet 230 uses a magnet fixing stud 241, a spacer 242, and a fixing screw 243 in a large number of mounting holes opened in a predetermined pattern in the disk-like lower layer plate 220. Attached. The magnet 230 is formed in an annular shape by opening a hole 231 for inserting the magnet fixing stud 241. The magnet fixing stud 241 includes a flange portion 244 for fixing a magnet formed in a thin thickness and an insertion portion 245 formed with a female screw portion. The spacer 242 is disposed on the lower layer plate 220 and supports the magnet 230 on the lower layer plate 220. The spacer 242 has a screw insertion hole 246 into which the fixing screw 243 is inserted. For this reason, the magnet 230 is detachably attached to the lower layer plate 220 by the fixing screw 243 and can be exchanged.
As shown in FIG. 8A, a substrate suction port 211, a substrate suction groove, and a substrate lift-up groove 213 are formed on the upper surface of the upper layer plate 210. Further, as shown in FIG. 8B, positioning holes 214 and connecting magnets 215 for connection with the upper layer plate 210 are arranged on the lower surface of the upper layer plate 210 at a predetermined pitch in the circumferential direction.

Further, on the upper surface of the lower layer plate 220, as shown in FIG. 8A, the coupling magnet 221 that adsorbs the coupling magnet 215 of the upper layer plate 210, and the positioning pin 222 inserted into the positioning hole 214 of the lower layer plate 220. Is formed. Further, as shown in FIG. 8B, a detachable stud 225 for detachably attaching the lower layer plate 220 to the apparatus base disposed at the lower portion is disposed on the lower surface of the lower layer plate 220.
According to such a substrate film formation processing mask holder 200, with the lower layer plate 220 disposed below the upper layer plate 210, the substrate is disposed on the upper surface of the upper layer plate, and further a mask made of a magnetic material on the substrate. When the is placed, the mask is attracted by the magnetic force of the magnet 230 so that the mask comes into close contact with the substrate, and the substrate and the mask are fixedly arranged in a positioned state.

When the upper layer plate 210 is removed from the lower layer plate 220 after the film formation process on the substrate is completed, the attractive force due to the magnetic force on the mask disappears, and the mask and the substrate can be removed from the upper layer plate 210.
Conventionally, when a member such as a magnet is fixed to another member such as a lower layer plate, a technique has been proposed in which a member is easily attached to the other member using a fixing bracket formed of a thin metal plate. In Patent Document 1, when a component element as a member is housed in a cylindrical case, a step is formed on the inner side of the cylindrical case, and a folded portion that is locked to the step by an elastic force is formed on both ends of the fixing bracket. When the component element is housed in the cylindrical case, the folded portion at both ends is engaged with the step in a state where the fixing bracket is applied to the member and the member is fixed to the other member. Yes.

Japanese Patent No. 4868038

However, in the conventional mask holder for film formation processing, since the hole 231 is formed in the magnet 230 in order to fix the magnet 230 to the lower layer plate 220, the volume of the magnet 230 becomes small. For this reason, there exists a problem that magnetic force falls compared with the case where the solid magnet of the same diameter and the same height is used. In order to compensate for this drawback, it is necessary to increase the number of magnets. However, the structure of the lower layer plate is complicated and the cost is increased.
Further, since the magnet 230 is fixed to the upper layer plate 210 with the fixing screw 243, it takes time and labor to attach and detach the magnet, which causes a decrease in productivity.
Further, since the magnet 230 and the magnet fixing stud 241 are disposed between the upper layer plate 210 and the lower layer plate 220 and there is a gap, the substrate is heated from free electrons flowing from the film surface during film formation by sputtering or the like. There is a problem that heat cannot be effectively released. If this heat is not effectively released to the upper layer plate 210 and the lower layer plate 220, the film formation surface of the substrate becomes a high temperature, resulting in a problem that the residual stress in the film increases.
Moreover, in the thing of patent document 1, although the operation | work which attaches a member to another member is easy, when removing a member, the folding | returning part of a fixing bracket must remove | deviate from the level | step difference of a cylindrical case. However, there is a problem that it takes time to remove the member.

  The present invention has been made in view of the above-described problems, and an object of the present invention is to provide a mask holder for substrate film formation processing provided with a locking member that can easily attach and detach a solid-state magnet with high density. And It is another object of the present invention to provide a mask holder for substrate film formation that can efficiently release the heat of the substrate to the lower layer plate.

  In order to solve the above-mentioned problem, the locking member according to claim 1 is a locking member attached to the outer surface of the columnar magnet, and by separating the circumferential edges of the plate material from each other, A cylindrical peripheral side portion that elastically engages with at least a part of the outer peripheral surface, a claw portion that protrudes from the peripheral side portion toward the inner diameter side and contacts one end surface of the magnet, and the peripheral side portion. And a plurality of protruding claws that elastically protrude toward the outer diameter side.

According to a second aspect of the present invention, there is provided a mask holder for forming a substrate on a substrate, the first plate supporting the other surface of the substrate on which the mask attracted by a magnetic force is disposed on one surface, and the other surface side of the first plate. And a second plate having a plurality of holes for receiving the magnets each having the locking member according to claim 1 attached to the outer surface thereof, and the inner peripheral surface of the holes has the holes A fixed groove portion in which the protruding claw is expanded and locked when the magnet and the locking member are inserted into the portion from an end surface opposite to the one end surface of the magnet, and a circumferential end portion of the fixed groove portion The projecting claw locked in the fixed groove portion is pressed to the inner diameter side by rotating the locking member and the magnet by a predetermined angle to reach the removal portion. Configured to be detached from the fixing groove. And butterflies.
According to the present invention, in order to attach the magnet to the second plate, the locking member is disposed on the magnet and inserted into the hole, so that the protruding claw of the locking member is recessed in the inner peripheral surface of the hole. The magnet fitted in the fixed groove can be easily fixed to the second plate. In order to remove the magnet from the second plate, the locking member may be rotated at the hole to move the protruding claw to the detaching portion, and the protruding claw may be removed from the fixed groove. For this reason, the thing of the solid structure provided with high magnetic force as a magnet can be attached or detached easily to a 2nd plate.

The invention according to claim 3 is characterized in that a plurality of the fixing groove portion and the detaching portion are arranged on the circumferential side portion with a circumferential interval of 90 degrees.
According to the present invention, the magnet attached to the second plate can be easily removed simply by rotating the locking member 90 degrees without a hole and disposing the protruding claw on the removal portion. At this time, the locking member only needs to be rotated 90 degrees at the maximum.
According to a fourth aspect of the present invention, the plurality of hole portions formed in the second plate are regularly arranged so that the centers of the four adjacent hole portions form a square, and the fixing groove portion is formed in a diagonal direction of the square. The removal portion constitutes a part of the inner peripheral surface of the hole portion.
According to the present invention, since the fixed groove portions are arranged in the diagonal direction, even if the hole portions are arranged close to each other, the fixed groove portions do not overlap with the fixed groove portions of the adjacent hole portions. The density can be increased.

According to a fifth aspect of the present invention, in the mask holder for substrate film formation processing, the first plate has a contact portion that contacts the second plate in a region other than the region where the magnet and the locking member are disposed. It is characterized by providing.
According to the present invention, since the first plate is in close contact with the second plate at the contact portion, the heat of the substrate disposed on the first plate is efficiently transferred from the first plate to the second plate.

  According to the mask holder for film formation of a substrate according to the present invention, in order to attach the magnet to the second plate, the locking claw of the locking member is formed by simply placing the locking member on the magnet and inserting it into the hole. The magnet can be easily fixed to the second plate by being fitted into a fixing groove portion recessed in the inner peripheral surface. On the other hand, in order to remove the magnet from the second plate, it is only necessary to rotate the locking member in the hole portion, move the protruding claw to the removing portion, and remove the protruding claw from the fixed groove portion. For this reason, the thing of the solid structure provided with high magnetic force as a magnet can be attached or detached easily to a 2nd plate.

It is a disassembled perspective view which shows the mask holder for board | substrate film-forming processes which concerns on embodiment of this invention. The latch member used for the substrate film-forming mask holder is shown, (a) is a plan view, (b) is a side view, and (c) is a front view. It is a perspective view which shows the latching member used for the mask holder for the said film-forming processes. The hole part formed in the lower layer plate of the substrate film-forming mask holder is shown, (a) is a plan view, (b) is a cross-sectional view corresponding to line BB in (a), (c) ) Is a cross-sectional view corresponding to the line CC in (a). The state which has arrange | positioned the magnet which has arrange | positioned the locking member by the same substrate film-forming mask holder to the lower layer plate, (a) is sectional drawing which shows a fixed state, (b) is sectional drawing which shows a removal state It is. The lower layer plate used for the substrate film-forming mask holder is shown, (a) is a plan view, (b) is a side view, and (c) is a cross-section corresponding to line CC in (b). (D) is an enlarged view of a portion D in (c), (e) is a cross-sectional view corresponding to the line BB in (a), and (f) is a line AA in (a). FIG. It is sectional drawing which shows the state which combined the upper layer plate and the lower layer plate in the mask holder for the film-forming processes of the said board | substrate. It is the perspective view which shows the conventional mask holder for substrate film-forming processing, (a) is the figure which looked at the mask holder for substrate film-forming processing from the upper side, (b) is the mask holder for film-forming processing of the substrate seen from the bottom. (C) is an exploded perspective view of the magnet mounting structure. It is sectional drawing which shows the attachment state of the magnet in the mask holder for the said film-forming processes.

Hereinafter, a mask holder for substrate film formation processing according to the present invention will be described. First, the overall structure of the substrate film forming process mask holder will be described.
FIG. 1 is an exploded perspective view showing the configuration of a substrate film formation processing mask holder according to an embodiment of the present invention. The substrate film formation processing mask holder 100 includes an upper layer plate 110 that is a first plate on which a substrate 10 as a film formation target such as a semiconductor substrate, a quartz crystal substrate, and a ceramic substrate can be arranged, and a lower layer plate 120 that is a second plate. With. The lower layer plate 120 is disposed on the lower surface side opposite to the upper surface of the upper layer plate on which the substrate 10 is disposed. The substrate film forming process mask holder 100 is for performing a film forming process by disposing a mask 20 that is attracted to a square substrate 10 by a magnetic force. An opening 21 corresponding to the film formation pattern of the substrate 10 is formed in the mask 20.
In addition, although the shape of a board | substrate is not restricted to a square, in this example, a square board | substrate is demonstrated as an example.

The characteristic structure of the mask holder 100 for substrate film formation processing of the present invention is as follows.
That is, the substrate film formation processing mask holder 100 includes an upper layer plate (first plate) 110 that supports the other surface of the substrate 10 on which the mask 20 attracted by magnetic force is disposed on one surface, and the other surface of the first plate. And a lower layer plate (second plate) 120 provided with a plurality of hole portions 130 each accommodating a cylindrical magnet 140 having a locking member 150 attached to the outer surface, and an inner peripheral surface of the hole portion In the hole, when the magnet and the locking member are inserted from the end surface opposite to the one end surface of the magnet, the protruding claw 153 is expanded and locked, and the fixed groove portion The removal part 135 formed continuously at the circumferential end is provided, and the protruding claw locked in the fixed groove part is pressed to the inner diameter side by rotating the locking member and the magnet by a predetermined angle to reach the removal part. To leave the fixed groove It is configured.

In the substrate film formation processing mask holder 100 according to the present embodiment, the upper layer plate 110 and the lower layer plate 120 have a larger rectangular shape than the substrate 10. A cylindrical hole 130 for accommodating and arranging a large number of columnar magnets 140 is regularly opened on the upper surface of the lower layer plate 120. In the substrate film formation processing mask holder 100 according to the first embodiment, the locking member 150 is attached to the magnet 140 and is inserted into the hole 130.
In a state where the magnet 140 is attached in the hole 130 of the lower layer plate 120, the substrate 10 and the mask 20 are disposed on the upper layer plate 110, and the mask 20 is brought into close contact with the substrate 10 by the magnetic force of the magnet 140. The magnet 140 is, for example, a sintered magnet such as neodymium or samarium cobalt, and is configured as a columnar column.
When the substrate on which the film formation process is performed is a disk-shaped substrate such as a silicon wafer, the upper layer plate 110 and the lower layer plate 120 are also formed in a disk shape, and the diameter thereof is larger than the outer diameter of the substrate.

  Next, the locking member 150 that supports the magnet 140 will be described. 2A and 2B show a locking member used in a substrate film formation processing mask holder according to an embodiment of the present invention, wherein FIG. 2A is a plan view, FIG. 2B is a side view, and FIG. FIG. 3 is a perspective view showing the locking member. The locking member 150 is formed by pressing a metal thin plate having elasticity such as stainless steel (SUS304). The locking member 150 includes a cylindrical peripheral side portion 151 that covers the outer periphery of the magnet 140. Further, the locking member 150 projects inwardly from the upper end, which is one end side of the circumferential side portion 151, to the three claw portions 152 that contact the end surface (upper surface) on the first plate side of the magnet 140, and the circumferential side portion 151. Two leaf spring-shaped projecting claws 153 that are arranged and elastically project toward the outer diameter direction are provided.

The locking member 150 is formed by processing a substantially rectangular plate material into a cylindrical shape, and a slit 154 penetrating vertically is formed in the peripheral side portion 151 after the cylindrical processing. Yes. The peripheral side portion 151 can be elastically deformed in the inner and outer diameter directions by providing the slit 154, and elastically presses the peripheral surface of the magnet 140 to hold the locking member 150 on the magnet 140.
The claw portions 152 are arranged at equal intervals on the upper edge of the circumferential side portion 151 at a predetermined pitch, in this example, a circumferential pitch of 120 degrees. The claw portion 152 locks the upper surface of the magnet 140 so that the magnet 140 does not come out of the upper opening of the peripheral side portion 151. The periphery of the magnet 140 is held by the peripheral side portion 151, and the end surface thereof is positioned by the claw portion 152, so that the magnet 140 is securely held by the locking member 150.

Each protruding claw 153 is formed to protrude in the outer diameter direction by cutting and raising a part of the peripheral side portion 151. Each protruding claw 153 is formed at a position spaced downward from the upper end edge of the locking member 150 by a predetermined dimension. In the present example, the two protruding claws 153 are formed at two positions with an interval of 180 degrees on the outer periphery of the peripheral side portion 151. As shown in the figure, the protrusion claw 153 protrudes in the outer diameter direction from the outer peripheral surface of the peripheral side portion 151 when no external force is applied. It enters into the notch 151a formed in the side 151.
In this way, the locking member 150 includes a cylindrical peripheral side portion 151 that elastically engages at least a part of the outer peripheral surface of the magnet 140 by separating the circumferential ends of the plate member, and the peripheral side. And a plurality of projecting claws 153 that are formed by cutting and raising a plate material constituting the peripheral side part and elastically projecting toward the outer diameter side. It is equipped with.
The nail | claw part 152 may protrude from parts other than the axial direction one end edge of a side periphery. Further, when the magnet has a columnar shape other than the columnar shape, for example, a polygonal columnar shape, the side peripheral portion may have a polygonal columnar shape corresponding thereto.
Further, even if the claw portion does not exist, the claw portion is unnecessary when the magnet can be held only by the holding pressure holding force by the side peripheral portion.

Next, the hole 130 formed in the lower layer plate 120 will be described. 4A and 4B show holes formed through the lower layer plate of the mask holder for substrate film formation processing according to the embodiment of the present invention. FIG. 4A is a plan view, and FIG. 4B is a view of B- in FIG. Sectional drawing equivalent to B line, (c) is sectional drawing equivalent to CC line in (a). FIG. 5 shows a state in which the magnet on which the locking member is arranged is arranged in the hole of the lower layer plate, (a) is a sectional view showing a fixed state, and (b) is a sectional view showing a removed state. It is.
The hole portion 130 of the lower layer plate 120 is a stepped hole opened so that the first hole portion 131 having a large diameter and the second hole portion 132 having a small diameter communicate with each other from the upper surface side of the lower layer plate 120. The first hole 131 has a diameter into which the magnet 140 to which the locking member 150 is attached fits. The second hole 132 is formed to have a smaller diameter than the first hole 131 and is used to insert a rod-shaped member that pushes out the magnet 140 when the magnet 140 and the locking member 150 are removed. When the magnet 140 attached with the locking member 150 is fitted in the hole 130, the bottom surface of the magnet 140 is held on the bottom surface of the first hole 131 as shown in FIG. In this state, the magnet 140 is disposed in a state where the upper end surface is exposed from the lower layer plate 120.

On the inner peripheral surface of the hole portion 130 that accommodates the magnet 140 to which the locking member 150 is attached, an inner peripheral region in which each protruding claw 153 is located a predetermined distance below the upper end of the first hole portion 131 can be assumed. This region is referred to as a protruding nail arrangement region 133.
In the substrate film formation processing mask holder 100 according to the present embodiment, the fixed groove portion 134 and the removal portion 135 are continuously formed in each protruding nail arrangement region 133. The fixed groove portion 134 is formed by being recessed with, for example, a slot cutter from the original cylindrical inner peripheral surface of the hole portion 130 toward the outer diameter. The fixed groove 134 is formed as a curved surface (arc surface) having a larger radius of curvature than the circular inner peripheral surface of the hole in plan view. When the magnet 140 to which the locking member 150 is attached is housed in the hole, the protruding claw 153 of the locking member 150 is elastically fitted into the fixed groove 134, and the position of the locking member 150 in the axial direction is increased. Regulate the deviation.
In this example, the detaching portions 135 are disposed at both ends in the circumferential direction of the fixed groove portion. However, the detachable portions may be provided only at one circumferential end portion of the fixed groove portion.

Further, when the protruding claw 153 is fitted in the fixed groove 134, the detaching portion 135 has a protruding claw when the locking member 150 is rotated in any direction along the inner peripheral surface of the hole. 153 is elastically pushed inwardly and is pulled out from the fixed groove 134 in the circumferential direction, so that the locking member 150 can be removed from the hole 130 in the axial direction. The removal portion 135 is a surface that is continuous with the inner peripheral surface in which the fixing groove portion 134 is not formed in the protruding claw arrangement region 133. That is, the detaching part 135 constitutes a part of the inner peripheral surface.
Since a part of the inner peripheral surface exists (protrudes) above the fixed groove portion 134 in the axial direction, the protruding claw is pressed by being pressed by the inner peripheral surface in the process of inserting the locking member into the hole portion. Once deformed to the inner diameter side and released into the fixed groove portion, it is opened and expanded to the outer diameter side, and the wall portion at the boundary between the fixed groove portion and the inner peripheral surface is brought into a locked state. When the locking member and the magnet are inserted into the hole while the protruding claw is in the axial position of the removing portion 135, the protruding claw is compressed and deformed inward when it reaches the removing portion. By entering a fixed groove by rotating it by a predetermined angle, it becomes locked.
The fixing groove portion 134 and the removing portion 135 are formed at two positions in the protruding claw arrangement region 133 at a circumferential interval of 180 degrees. The fixed groove portions 134 and the removal portions 135 are alternately arranged at intervals of 90 degrees.

Next, attachment / detachment of the magnet 140 to / from the lower layer plate 120 will be described. In order to attach the magnet 140 in the hole 130 of the lower layer plate 120, first, the locking member 150 is attached to the outer surface of the magnet 140. A magnet is inserted (pressed in) from the lower opening of the locking member 150 in a state where the claw portion 152 is bent inward, and the outer peripheral surface of the magnet 140 is elastically held by the peripheral side portion 151 and three claw portions are formed. The one end surface of the magnet 140 is locked by 152. At this time, the protruding claw 153 of the locking member 150 is in a state of elastically projecting outward from the peripheral side portion 151.
The magnet 140 in this state is inserted into the hole 130 with the claw portion 152 side of the locking member facing upward. The peripheral side portion 151 that can be deformed in the inner and outer diameter directions due to the presence of the slit 154 is pushed by the inner peripheral surface of the first hole 131 and compressed to the inner diameter side. In this insertion process, the protruding claw 153 is also pressed by the inner wall of the first hole 131 and elastically deformed toward the inner diameter side. Then, when the magnet 140 to which the locking member 150 is attached is inserted to a position where it comes into contact with the bottom of the protruding claw arrangement region 133, the protruding claw 153 is arranged in the protruding claw arrangement region 133. The bottom surface of the magnet is seated on the bottom surface of the first hole.

  When the locking member and the magnet are inserted into the hole portion while aligning the circumferential direction position of the protruding claw so that the protruding claw 153 corresponds to the fixed groove portion 134, the protruding claw 153 is projected when the protruding claw 153 reaches the protruding claw placement region. Is in a state of protruding into the fixed groove portion 134 and being locked. That is, as shown in FIG. 5A, the projecting claw 153 is fitted in the fixing groove 134 and the locking member 150 is fixed so that it cannot move in the axial direction in the hole, so that the magnet 140 held by the retainer is Fixed to the hole. When the locking claw 153 does not correspond to the fixed groove portion 134 and the locking member and the magnet are inserted into the hole, the locking claw is rotated when the protruding claw reaches the protruding claw arrangement region 133. The protruding claw 153 can be fitted into the fixed groove 134. At this time, since the rotation angle of the magnet 140 may be within 90 degrees, the assembly workability can be improved.

  Further, in order to remove the magnet 140 from the state in which the magnet 140 is disposed in the hole 130 of the lower layer plate 120, the magnet 140 to which the locking member 150 is attached is pinched and rotated, and the projecting claw 153 is disposed in the projecting claw arrangement region. It moves to the removal part 135 of 133. Then, the protruding claw 153 is elastically pushed inward and enters into the notch 151 a formed in the peripheral side portion 151. In this state, the locking member and the magnet can be easily pulled out from the hole as shown in FIG. At this time, the rotation angle of the magnet 140 is 90 degrees.

Next, the lower layer plate 120 and the upper layer plate 110 can be separated. When the substrate 10 disposed on the upper layer plate 110 and the mask 20 disposed on the substrate 10 are aligned, if the mask 20 is moved in contact with the substrate 10, the surface of the substrate 10 and the already formed substrate 10 are formed. It may hurt the pattern. For this reason, the mask 20 and the substrate 10 are aligned with a small gap, for example, a gap of 50 to 200 microns. At this time, a sufficient distance is provided between the upper layer plate 110 and the lower layer plate 120 so that the magnetic force of the magnet 140 disposed on the lower layer plate 120 does not act on the mask 20.
The alignment between the substrate 10 and the mask 20 is completed, and the lower layer plate 120 is placed close to the upper layer plate 110 and brought into contact in a predetermined positional relationship while the mask is in contact with the surface of the substrate. Usually, this operation is performed by an alignment apparatus not shown.

Next, a structure for efficiently conducting heat from the upper layer plate 110 to the lower layer plate 120 in the substrate film formation mask holder 100 will be described.
Next, arrangement | positioning of the hole 130 of the lower layer plate 120 in which the magnet 140 is arrange | positioned is demonstrated in detail. FIG. 6 shows a lower layer plate used in the substrate film formation processing mask holder according to the embodiment of the present invention. Here, (a) is a plan view, (b) is a side view, (c) is a cross-sectional view corresponding to the CC line in (b), and (d) is an enlarged view of a portion D in (c). (E) is sectional drawing equivalent to the BB line in (a), (f) is sectional drawing equivalent to the AA line in (a).

In the substrate film forming process mask holder 100, as shown in FIG. 6A, a plurality of holes 130 to be opened in the lower layer plate 120 are arranged. The holes are regularly arranged in a lattice shape so that the centers of four adjacent holes form a square with a side dimension of d. When the holes 130 are brought close to each other, the magnets 140 can be densely arranged. However, if the dimension d is made too small, the fixed groove portions 134 formed in the holes 130 may interfere with each other.
In the substrate film formation processing mask holder 100 according to the first embodiment, the fixing groove portion 134 formed in the hole portion 130 of the lower layer plate 120 has a square diagonal direction formed by the centers of the four hole portions 130 (FIG. 6A). (D), it is arranged at the arrow E). For this reason, even if the dimension d between the centers of the hole portions 130 is reduced, the fixed groove portions 134 of the hole portions 130 adjacent to each other are not overlapped. Therefore, the space | interval dimension of the hole part 130 can be made as small as possible, and the attraction force of the magnet 140 can be enlarged.

  Next, the joint portion between the upper layer plate 110 and the lower layer plate 120 will be described. FIG. 7 is a cross-sectional view showing a state in which the upper layer plate and the lower layer plate are combined in the substrate film formation mask holder. In the mask holder 100 for substrate film formation processing according to the embodiment, a contact portion 111 that contacts the lower layer plate 120 is formed on the lower surface of the upper layer plate 110 in a region other than the region where the magnet 140 and the locking member 150 are disposed. ing. The contact part 111 is formed from the lower side of the upper layer plate 110 toward the lower layer plate 120 and is convex. For this reason, since the heat from the upper layer plate 110 is directly conducted from the contact portion 111 to the lower layer plate 120, the substrate 10 disposed on the upper layer plate 110 can be efficiently cooled.

Next, a specific example of the substrate film forming process mask holder 100 will be described. In the substrate film formation processing mask holder 100, the lower layer plate 120 is preferably made of a pure copper material in consideration of workability and thermal conductivity. The thickness of the lower layer plate 120 is, for example, 7 mm, the hole 130 has a diameter of 4.3 mm, and a magnet 140 having a diameter of 4 mm is disposed. The holes 130 are orthogonally arranged with an interval d of 4.6 mm. The fixed groove 134 is provided at a depth of 1 mm at a depth of 0.5 mm from the upper surface of the lower layer plate 120.
The magnet 140 is a rare earth magnet having a solid cylindrical shape with a diameter of 4 mm and a height of 6 mm. The locking member 150 is manufactured by press molding a SUS304 hardened material having a thickness of 0.1 mm in consideration of workability.

The inner diameter of the peripheral side portion 151 of the locking member 150 is 4 mm, that is, the same as the outer diameter of the magnet 140, and the protruding amount of the protruding claw 153 is 0.3 mm.
The upper layer plate 110 is made of pure copper having a thickness of 3 mm, and is drilled at a position corresponding to the hole 130 of the lower layer plate 120 to a diameter of 4.4 mm and a depth of 2.2 mm. The magnet 140 inserted into the lower layer plate 120 protrudes from the surface of the lower layer plate 120 at a height of 2 mm, and the opening depth of the upper layer plate 110 exceeds this. For this reason, when the lower layer plate 120 and the upper layer plate 110 are brought into contact with each other, a portion of the lower surface of the lower layer plate 120 that has not been punched contacts the lower layer plate 120 as the contact portion 111 and conducts heat from the substrate with high efficiency. it can.

Further, when the upper layer plate 110 has a thickness of 3 mm, when the upper layer plate 110 and the lower layer plate 120 are separated after film formation on the substrate 10, the mechanical strength is maintained against the magnetic force that the magnet 140 is attracting the mask 20. it can. Thereby, the upper layer plate 110 is not bent and unnecessary deformation is not given to the substrate 10.
As described above, according to the substrate film formation processing mask holder according to the present embodiment, it is not an annular magnet having a weak magnetic force for a large arrangement area, but a cylindrical magnet having a small arrangement area but a strong magnetic force. Can be arranged at high density, and the mask and the substrate can be reliably adhered by a cylindrical magnet having a strong magnetic force per unit area. For this reason, the defect of the film-forming pattern by the mask floating etc. can be eliminated. Further, since the magnet is arranged using the locking member, any magnet can be easily replaced as needed during operation. For this reason, the whole operability can be improved. Furthermore, heat generated by the inflow of free electrons to the substrate generated by a sputtering apparatus can be efficiently conducted, temperature rise during film formation can be prevented, and internal stress of the film formation material can be reduced.
The magnet is not limited to a cylindrical shape, and may be a triangular prism, a quadrangular prism, other polygonal pillars, or a deformed pillar. Therefore, in the present specification and claims, the columnar shape includes all columnar bodies.

In the present embodiment, the material of the upper layer plate and the lower layer plate is not limited to pure copper, and can be made of other metal materials such as aluminum. Further, the thickness of the upper layer plate is determined by the amount of protrusion of the magnet, but the amount of protrusion of the magnet can be increased to increase the thickness of the upper layer plate to ensure higher strength.
Furthermore, although the locking member is stainless steel (SUS304) in the embodiment, other materials having appropriate elasticity, such as phosphor bronze and titanium, can be used. In addition, as an example of the locking member, an example was shown in which one plate was rounded into a cylindrical shape. However, it can also be manufactured by drawing with a press, or synthetic resin using injection molding or the like. Can also be produced.

DESCRIPTION OF SYMBOLS 10 ... Board | substrate, 20 ... Mask, 100 ... Mask holder for board | substrate film-forming process, 110 ... Upper layer plate (1st plate), 111 ... Contact part, 120 ... Lower layer plate (2nd plate), 130 ... Hole part, 133 ... Projection nail arrangement region 134... Fixed groove part 135 .. removal part 140 .. magnet 150 .. locking member 151 .. circumferential side part 152 .. nail part 153.

Claims (5)

A locking member attached to the outer surface of the columnar magnet,
By separating the circumferential edges of the plate material from each other, a cylindrical peripheral side portion that elastically engages at least a part of the outer peripheral surface of the magnet, and an outside diameter extending from the peripheral side portion, A nail portion that contacts one end surface;
A locking member comprising: a plurality of protruding claws formed on the peripheral side portion and elastically protruding toward the outer diameter side. A first plate that supports the other surface of the substrate on which a mask attracted by magnetic force is disposed on one surface;
A second plate having a plurality of holes that are respectively disposed on the other surface side of the first plate and each of which accommodates the magnet having the locking member according to claim 1 attached to the outer surface;
With
When the magnet and the locking member are inserted into the hole from the end surface opposite to the one end surface of the magnet, the protruding claws are expanded and locked to the inner peripheral surface of the hole. A fixed groove part and a removal part formed continuously at the circumferential end of the fixed groove part are provided,
The protruding claw locked in the fixed groove portion is configured to rotate toward the inner diameter side by rotating the locking member and the magnet by a predetermined angle to reach the removal portion, and to be detached from the fixed groove portion. A mask holder for forming a substrate on a substrate.   3. The mask holder for film formation of a substrate according to claim 2, wherein a plurality of the fixing groove portions and the detaching portions are arranged on the peripheral side portion with a circumferential interval of 90 degrees. The plurality of holes formed in the second plate are regularly arranged such that the centers of the four adjacent holes form a square,
The fixed groove portion is arranged in a diagonal direction of the square,
4. The mask holder for film formation of a substrate according to claim 2, wherein the removal portion constitutes a part of an inner peripheral surface of the hole portion.   The said 1st plate is provided with the contact part which contacts the said 2nd plate in the area | regions other than the area | region where the said magnet and the said locking member are arrange | positioned, The Claim 1 thru | or 4 characterized by the above-mentioned. The mask holder for a substrate film-forming process as described.

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