JP2015020323A5 - - Google Patents
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- Publication number
- JP2015020323A5 JP2015020323A5 JP2013149342A JP2013149342A JP2015020323A5 JP 2015020323 A5 JP2015020323 A5 JP 2015020323A5 JP 2013149342 A JP2013149342 A JP 2013149342A JP 2013149342 A JP2013149342 A JP 2013149342A JP 2015020323 A5 JP2015020323 A5 JP 2015020323A5
- Authority
- JP
- Japan
- Prior art keywords
- recording head
- cleaning
- rotation center
- spinner table
- held
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000000758 substrate Substances 0.000 claims 21
- 238000004140 cleaning Methods 0.000 claims 18
- 238000006243 chemical reaction Methods 0.000 claims 5
- 239000007788 liquid Substances 0.000 claims 3
Claims (8)
前記回転中心上に前記電気熱変換素子が位置しないように、前記複数の記録ヘッド用基板をスピンナーテーブルに保持することを特徴とする記録ヘッド用基板の洗浄方法。 A plurality of recording head substrates having electrothermal conversion elements as ejection energy generating elements for ejecting ink from ejection ports are held on a spinner table, and the spinner table is rotated while jetting cleaning liquid. A cleaning method for cleaning the plurality of recording head substrates by reciprocating a cleaning nozzle that moves through a rotation center,
A method of cleaning a recording head substrate, wherein the plurality of recording head substrates are held on a spinner table so that the electrothermal transducer is not positioned on the rotation center.
前記回転中心上に前記電気熱変換素子が位置しないように、前記ウエハーを前記スピンナーテーブルに保持することを特徴とする請求項1に記載の記録ヘッド用基板の洗浄方法。 The plurality of recording head substrates are separated on the spinner table while being held on the spinner table by cutting the wafer held on the spinner table along a predetermined cutting line after being configured on a common wafer. And
2. The method for cleaning a recording head substrate according to claim 1, wherein the wafer is held on the spinner table so that the electrothermal transducer is not positioned on the rotation center.
前記第1の記録ヘッド用基板において前記回転中心に最も近い位置の電気熱変換素子と、前記第3の記録ヘッド用基板において前記回転中心に最も近い位置の電気熱変換素子と、を結ぶ仮想線を第1の結線とし、前記第2の記録ヘッド用基板において前記回転中心に最も近い位置の電気熱変換素子と、前記第4の記録ヘッド用基板において前記回転中心に最も近い位置の電気熱変換素子と、を結ぶ仮想線を第2の結線としたときに、前記第1および第2の結線の交点が前記回転中心上に位置することを特徴とする請求項1から6のいずれかに記載の記録ヘッド用基板の洗浄方法。 Around the rotation center, the first, second, third, and fourth recording head substrates are positioned so as to be sequentially arranged in the rotation direction of the spinner table,
An imaginary line connecting the electrothermal conversion element closest to the rotation center on the first recording head substrate and the electrothermal conversion element closest to the rotation center on the third recording head substrate. Is the first connection, and the electrothermal conversion element at the position closest to the rotation center in the second recording head substrate and the electrothermal conversion at the position closest to the rotation center in the fourth recording head substrate. The intersection of the said 1st and 2nd connection is located on the said rotation center, when the virtual line which connects an element is made into a 2nd connection, The rotation point in any one of Claim 1 to 6 characterized by the above-mentioned. Cleaning method for recording head substrate.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013149342A JP6129005B2 (en) | 2013-07-18 | 2013-07-18 | Cleaning method for recording head substrate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013149342A JP6129005B2 (en) | 2013-07-18 | 2013-07-18 | Cleaning method for recording head substrate |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2015020323A JP2015020323A (en) | 2015-02-02 |
JP2015020323A5 true JP2015020323A5 (en) | 2016-07-28 |
JP6129005B2 JP6129005B2 (en) | 2017-05-17 |
Family
ID=52485232
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013149342A Active JP6129005B2 (en) | 2013-07-18 | 2013-07-18 | Cleaning method for recording head substrate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP6129005B2 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7146572B2 (en) * | 2018-02-23 | 2022-10-04 | キヤノン株式会社 | SUBSTRATE FILM METHOD AND LIQUID EJECTION HEAD MANUFACTURE METHOD |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10308374A (en) * | 1997-03-06 | 1998-11-17 | Ebara Corp | Method and equipment for cleaning |
JPH11233473A (en) * | 1998-02-09 | 1999-08-27 | Hitachi Ltd | Method and device for cleaning semiconductor |
JP2003031536A (en) * | 2001-07-12 | 2003-01-31 | Nec Corp | Cleaning method of wafer |
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2013
- 2013-07-18 JP JP2013149342A patent/JP6129005B2/en active Active
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