JP2015020323A5 - - Google Patents

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JP2015020323A5
JP2015020323A5 JP2013149342A JP2013149342A JP2015020323A5 JP 2015020323 A5 JP2015020323 A5 JP 2015020323A5 JP 2013149342 A JP2013149342 A JP 2013149342A JP 2013149342 A JP2013149342 A JP 2013149342A JP 2015020323 A5 JP2015020323 A5 JP 2015020323A5
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recording head
cleaning
rotation center
spinner table
held
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JP2013149342A
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JP2015020323A (en
JP6129005B2 (en
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Claims (8)

吐出口からインクを吐出するための吐出エネルギー発生素子として電気熱変換素子を備えた複数の記録ヘッド用基板をスピンナーテーブルに保持し、前記スピンナーテーブルの回転と、洗浄液を噴射しつつ前記スピンナーテーブルの回転中心を通って移動する洗浄ノズルの往復移動と、によって、前記複数の記録ヘッド用基板を洗浄する洗浄方法であって、
前記回転中心上に前記電気熱変換素子が位置しないように、前記複数の記録ヘッド用基板をスピンナーテーブルに保持することを特徴とする記録ヘッド用基板の洗浄方法。
A plurality of recording head substrates having electrothermal conversion elements as ejection energy generating elements for ejecting ink from ejection ports are held on a spinner table, and the spinner table is rotated while jetting cleaning liquid. A cleaning method for cleaning the plurality of recording head substrates by reciprocating a cleaning nozzle that moves through a rotation center,
A method of cleaning a recording head substrate, wherein the plurality of recording head substrates are held on a spinner table so that the electrothermal transducer is not positioned on the rotation center.
前記複数の記録ヘッド用基板は、共通のウエハー上に構成された後に、前記スピンナーテーブルに保持された前記ウエハーを所定の切断ラインに沿って切断することにより、前記スピンナーテーブルに保持されたまま分離され、
前記回転中心上に前記電気熱変換素子が位置しないように、前記ウエハーを前記スピンナーテーブルに保持することを特徴とする請求項1に記載の記録ヘッド用基板の洗浄方法。
The plurality of recording head substrates are separated on the spinner table while being held on the spinner table by cutting the wafer held on the spinner table along a predetermined cutting line after being configured on a common wafer. And
2. The method for cleaning a recording head substrate according to claim 1, wherein the wafer is held on the spinner table so that the electrothermal transducer is not positioned on the rotation center.
前記ウエハーは、ダイシングテープを介して前記スピンナーテーブルに保持されることを特徴とする請求項2に記載の記録ヘッド用基板の洗浄方法。   The method of cleaning a recording head substrate according to claim 2, wherein the wafer is held on the spinner table via a dicing tape. 前記切断ラインが位置する前記記録ヘッド用基板の間に前記回転中心が位置するように、前記ウエハーを前記スピンナーテーブルに保持することを特徴とする請求項2または3に記載の記録ヘッド用基板の洗浄方法。   4. The recording head substrate according to claim 2, wherein the wafer is held on the spinner table so that the rotation center is positioned between the recording head substrates on which the cutting line is positioned. 5. Cleaning method. 前記切断ラインの交差点が位置する前記記録ヘッド用基板の間に前記回転中心が位置するように、前記ウエハーを前記スピンナーテーブルに保持することを特徴とする請求項2または3に記載の記録ヘッド用基板の洗浄方法。   4. The recording head according to claim 2, wherein the wafer is held on the spinner table so that the rotation center is located between the recording head substrates on which the intersections of the cutting lines are located. Substrate cleaning method. 前記ウエハーの中心は、前記切断ラインの交差点が位置する前記記録ヘッド用基板の間に位置することを特徴とする請求項2から5のいずれかに記載の記録ヘッド用基板の洗浄方法。   6. The method for cleaning a recording head substrate according to claim 2, wherein the center of the wafer is positioned between the recording head substrates where the intersections of the cutting lines are located. 前記回転中心の周囲に、第1、第2、第3、および第4の記録ヘッド用基板が前記スピンナーテーブルの回転方向に順次並ぶように位置し、
前記第1の記録ヘッド用基板において前記回転中心に最も近い位置の電気熱変換素子と、前記第3の記録ヘッド用基板において前記回転中心に最も近い位置の電気熱変換素子と、を結ぶ仮想線を第1の結線とし、前記第2の記録ヘッド用基板において前記回転中心に最も近い位置の電気熱変換素子と、前記第4の記録ヘッド用基板において前記回転中心に最も近い位置の電気熱変換素子と、を結ぶ仮想線を第2の結線としたときに、前記第1および第2の結線の交点が前記回転中心上に位置することを特徴とする請求項1から6のいずれかに記載の記録ヘッド用基板の洗浄方法。
Around the rotation center, the first, second, third, and fourth recording head substrates are positioned so as to be sequentially arranged in the rotation direction of the spinner table,
An imaginary line connecting the electrothermal conversion element closest to the rotation center on the first recording head substrate and the electrothermal conversion element closest to the rotation center on the third recording head substrate. Is the first connection, and the electrothermal conversion element at the position closest to the rotation center in the second recording head substrate and the electrothermal conversion at the position closest to the rotation center in the fourth recording head substrate. The intersection of the said 1st and 2nd connection is located on the said rotation center, when the virtual line which connects an element is made into a 2nd connection, The rotation point in any one of Claim 1 to 6 characterized by the above-mentioned. Cleaning method for recording head substrate.
前記洗浄ノズルから前記複数の記録ヘッド用基板のそれぞれに対して単位面積当たりに噴射される洗浄液の量を等しくするように、前記洗浄ノズルの移動速度、および前記洗浄ノズルから単位時間当たりに噴射される洗浄液の量の少なくとも一方を制御することを特徴とする請求項1から7のいずれかに記載の記録ヘッド用基板の洗浄方法。   The cleaning nozzle is ejected per unit time and the moving speed of the cleaning nozzle and the cleaning nozzle so as to equalize the amount of cleaning liquid sprayed per unit area to each of the plurality of recording head substrates from the cleaning nozzle. 8. The method for cleaning a recording head substrate according to claim 1, wherein at least one of the amounts of the cleaning liquid is controlled.
JP2013149342A 2013-07-18 2013-07-18 Cleaning method for recording head substrate Active JP6129005B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2013149342A JP6129005B2 (en) 2013-07-18 2013-07-18 Cleaning method for recording head substrate

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Application Number Priority Date Filing Date Title
JP2013149342A JP6129005B2 (en) 2013-07-18 2013-07-18 Cleaning method for recording head substrate

Publications (3)

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JP2015020323A JP2015020323A (en) 2015-02-02
JP2015020323A5 true JP2015020323A5 (en) 2016-07-28
JP6129005B2 JP6129005B2 (en) 2017-05-17

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Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7146572B2 (en) * 2018-02-23 2022-10-04 キヤノン株式会社 SUBSTRATE FILM METHOD AND LIQUID EJECTION HEAD MANUFACTURE METHOD

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10308374A (en) * 1997-03-06 1998-11-17 Ebara Corp Method and equipment for cleaning
JPH11233473A (en) * 1998-02-09 1999-08-27 Hitachi Ltd Method and device for cleaning semiconductor
JP2003031536A (en) * 2001-07-12 2003-01-31 Nec Corp Cleaning method of wafer

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