JP2015017818A - Physical quantity sensor, electronic apparatus, and movable body - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a physical quantity sensor that suppresses variation in detection characteristics caused by temperature changes in environment in which the sensor is used and further stabilizes the detection characteristics.SOLUTION: A physical quantity sensor 100 comprises: a substrate 10; a sensor element 99 provided on the main surface of the substrate 10; and a shield part 90 disposed in an outer periphery of the sensor element 99 when the substrate 10 is planarly viewed on the main surface of the substrate 10. The shield part 90 includes a first groove 92 extending in a first direction and a second groove 93 extending in a second direction intersecting the first direction, when the substrate 10 is planarly viewed.

Description

  The present invention relates to a physical quantity sensor, an electronic device, and a moving object.

  In general, a physical quantity sensor is known as an electromechanical structure including a mechanically movable structure. As the physical quantity sensor, for example, a capacitive sensor that detects a physical quantity based on a capacitance between a movable electrode that is displaced according to the action of a physical quantity (acceleration, angular velocity, etc.) and a fixed electrode that faces the movable electrode. Is known (for example, a semiconductor dynamic sensor described in Patent Document 1). This is supported, for example, by a support substrate and a sensor element (fixed electrode, fixed portion (anchor portion), a support portion extending from the fixed portion, and a support portion provided on the substrate. Movable electrodes, etc.). The sensor element can be obtained, for example, by precision processing a semiconductor substrate (such as a silicon substrate) bonded to a substrate (such as a glass substrate) by photoetching or the like.

  In such a capacitive sensor, the parasitic capacitance formed in the configuration of the sensor element may reduce the sensitivity of the sensor. On the other hand, in the semiconductor dynamic sensor described in Patent Document 2, a technique for preventing a decrease in sensor sensitivity by providing means (shield electrode) for fixing the electric potential of the outer peripheral portion arranged on the outer periphery of the sensor element is proposed. Has been.

JP 9-2111022 A JP 2007-279056 A

  However, as described above, a physical quantity sensor having a laminated structure in which layers constituting a sensor element are bonded to a substrate (particularly, a physical quantity having an outer peripheral portion on the outer circumference of the sensor element as in the semiconductor dynamic sensor described in Patent Document 2). The sensor) has a problem that the detection characteristics of the sensor fluctuate depending on the temperature environment used. Specifically, the thermal stress generated by the difference in thermal expansion coefficient between the substrate (such as a glass substrate) and the sensor element formation layer (such as a semiconductor substrate) laminated on the substrate causes the substrate to warp, This is a problem that the detection characteristics fluctuate because the sensor element is deformed or the displacement of the movable part (movable electrode) of the sensor element is affected.

  Further, in a physical quantity sensor having a laminated structure in which layers constituting sensor elements are bonded to a substrate, when a plurality of sensor elements are mounted on the substrate, even if the shield electrode described above is provided, adjacent sensor elements There was a problem that the characteristics fluctuated due to the influence. Specifically, there is a problem that leakage force or leakage vibration from a sensor element having a movable part (particularly a vibration part) affects the detection characteristics of adjacent sensor elements.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following application examples or forms.

  Application Example 1 When the physical quantity sensor according to this application example is viewed in plan on the substrate, the first sensor element provided on the main surface of the substrate, and the main surface of the substrate, A shield portion disposed on an outer periphery of the first sensor element, and when the substrate is viewed in plan, the shield portion intersects a first groove extending in a first direction and the first direction. And a second groove extending in the second direction.

  According to this application example, the physical quantity sensor includes a substrate, a first sensor element provided on the main surface of the substrate, and a shield disposed on an outer periphery of the first sensor element (an outer periphery when the substrate is viewed in plan). Department. In this way, when the physical quantity sensor is configured by the first sensor element provided on the main surface of the substrate and the shield part provided on the outer periphery of the first sensor element, the shield part is, for example, the first sensor element. It can be configured as a shield electrode having an effect of blocking or reducing leakage of a signal to be detected and noise applied to the first sensor element from the outside. In the case of the shield electrode, it is more effective to surround the outer circumference of the first sensor element with a wider area. In that case, if there is a difference between the thermal expansion coefficient of the material constituting the shield part and the thermal expansion coefficient of the material constituting the board, the substrate and the shield part are caused by the temperature change of the environment in which the physical quantity sensor is used. In some cases, thermal stress is generated during this period, which may affect the detection characteristics of the physical quantity sensor.

According to this application example, the shield portion includes the first groove extending in the first direction and the second groove extending in the second direction intersecting the first direction. Therefore, the thermal stress generated when the shield part has a thermal expansion coefficient different from the thermal expansion coefficient of the substrate is relieved by at least one of these grooves.
Specifically, the stress generated in the surface spreading direction is decomposed into vector components in at least one of the first direction and the direction intersecting the second direction. The stress acting on the groove in a direction crossing the extending direction of the groove is relaxed by the groove. Therefore, the thermal stress generated between the substrate and the shield portion on the main surface of the substrate is also alleviated by any one of these grooves. For example, when the substrate warps due to thermal stress, the warpage is alleviated by these grooves. As a result, the thermal stress generated due to the difference in thermal expansion coefficient deforms the first sensor element, or if the first sensor element has a movable part (movable electrode), the displacement is affected. It is suppressed that the first sensor element is used, and fluctuations in detection characteristics due to temperature changes in the environment in which the first sensor element is used are suppressed.
That is, according to this application example, it is possible to provide a physical quantity sensor with more stable detection characteristics, in which fluctuations in detection characteristics due to temperature changes in the environment in use are suppressed.

  Application Example 2 In the physical quantity sensor according to the application example, the first sensor element includes a fixed portion fixed on a main surface of the substrate, a support portion extending from the fixed portion, and the support portion. And a movable part supported so as to be displaceable by being separated from the substrate.

According to this application example, the first sensor element included in the physical quantity sensor is displaceable from the substrate by the fixing portion fixed on the main surface of the substrate, the supporting portion extending from the fixing portion, and the supporting portion. And a movable part supported by the. A physical quantity sensor having such a movable part may be affected by the displacement characteristics of the movable part due to thermal stress or deformation due to thermal stress, and the detection characteristics as a physical quantity sensor may deteriorate.
According to this application example, the shield portion disposed on the outer periphery of the first sensor element includes a first groove extending in the first direction and a second groove extending in the second direction intersecting the first direction. have. Therefore, even if the first sensor element includes a movable part (movable electrode) as in this application example, the displacement of the first sensor element is suppressed, and the first sensor element is used. Variations in detection characteristics due to environmental temperature changes are suppressed.
That is, according to this application example, in the physical quantity sensor including the movable part, it is possible to suppress the fluctuation of the detection characteristic due to the temperature change of the environment in which it is used, and to make it more stable.

  Application Example 3 In the physical quantity sensor according to the application example, the first direction is a displacement direction of the movable part in a plan view of the substrate.

  According to this application example, the first direction is a displacement direction of the movable portion included in the first sensor element (a displacement direction in plan view of the substrate). That is, the shield part disposed on the outer periphery of the first sensor element has a first groove extending in the same direction as the direction in which the movable part included in the first sensor element is displaced when the substrate is viewed in plan, and the first groove And a second groove extending in a direction intersecting with a direction in which the movable portion included in the sensor element is displaced.

When the shield part has a thermal expansion coefficient different from the thermal expansion coefficient of the substrate, the shield part includes the second groove extending in the direction intersecting the displacement direction of the movable part included in the first sensor element. Thus, the thermal stress generated in the displacement direction of the movable part can be more effectively relaxed. In particular, when the second groove extends across the direction perpendicular to the displacement direction of the movable part, the thermal stress is more effectively relieved.
Further, since the shield part includes the first groove, the thermal stress itself that the substrate receives from the shield part is suppressed. Specifically, when the shield part includes the first groove extending in the displacement direction of the movable part provided in the first sensor element, the bonding area between the substrate and the shield part is reduced in the displacement direction of the movable part. Therefore, the thermal stress itself generated in the displacement direction of the movable part that the substrate receives from the shield part is suppressed.
As a result, the thermal stress generated by the difference in thermal expansion coefficient may cause the first sensor element to be deformed, or if the first sensor element has a movable part (movable electrode), it will affect the displacement. And the fluctuation of the detection characteristic due to the temperature change of the environment in which the first sensor element is used is suppressed.

  Application Example 4 In the physical quantity sensor according to the application example described above, the physical quantity sensor includes a second sensor element provided on a main surface of the substrate, and the first groove and the second groove include the first sensor element and the first sensor. It is provided in the said shield part of the area | region between 2 sensor elements, It is characterized by the above-mentioned.

  According to this application example, the physical quantity sensor further includes the second sensor element in addition to the first sensor element provided on the main surface of the substrate. As described above, when a plurality of sensor elements are provided on a common substrate, the detection characteristics as a physical quantity sensor may be deteriorated, for example, noise generated by one sensor element may affect the other sensor element. . This noise may be caused not only by electrical noise but also by mechanical energy such as stress and vibration. Specifically, the thermal stress or residual stress generated or possessed by the structure of the sensor element, or in the case of having a movable part, the vibration leakage of the movable part is transmitted to the adjacent sensor element, and the adjacent sensor element. May affect the detection characteristics.

  According to this application example, the first groove and the second groove are provided in a shield portion in a region between the first sensor element and the second sensor element. Accordingly, the stress acting between the first sensor element and the second sensor element and the energy such as leakage vibration transmitted from one to the other are transmitted by the first groove and the second groove or at least one groove. Can be mitigated and the influence on the characteristics can be suppressed.

  Application Example 5 In the physical quantity sensor according to the application example, the first groove and the second groove have a rotationally symmetric shape formed by the first groove and the second groove when the substrate is viewed in plan. It is preferable to arrange | position so that it may become.

As in this application example, when the substrate is viewed in plan, the first groove and the second groove are more effectively arranged so that the figure formed by the first groove and the second groove is rotationally symmetric. Variations in detection characteristics due to temperature changes can be suppressed.
Specifically, when there is a difference between the thermal expansion coefficient of the material constituting the substrate and the thermal expansion coefficient of the material constituting the shield part in the substrate and the shield part provided on the main surface of the substrate. The thermal stress is generated between the substrate and the shield part due to the temperature change of the environment where the physical quantity sensor is used. As a result, for example, this thermal stress may cause the substrate to warp. According to this application example, the first groove and the second groove having the effect of relieving the thermal stress are such that the figure formed by the first groove and the second groove is rotationally symmetric when the substrate is viewed in plan. Is arranged. That is, the effect of relaxing the thermal stress can balance at least the overlapping regions as rotational symmetry. Therefore, for example, even when the substrate is warped, the stress balance is lost and unintended distortion is reduced, and the stress can be relaxed more stably.
Note that being arranged so as to be rotationally symmetric means that the natural number n is arranged n + 1 times rotationally symmetric.

  Application Example 6 In the physical quantity sensor according to the application example, the first groove and the second groove, or the first groove or the second groove penetrates the shield portion in the thickness direction of the substrate. It is preferable.

As in this application example, the first groove and the second groove, or the first groove or the second groove is provided through the shield portion in the thickness direction of the substrate, so that the temperature change is more effectively performed. The fluctuation of the detection characteristic due to can be suppressed.
Specifically, in the stress relaxation effect described above, the groove for relaxing the stress (the first groove and the second groove, or the first groove or the second groove) is formed as a groove penetrating the shield portion. There is no shield part (residual bottom part) left as the bottom of the groove, and therefore no stress is transmitted at the residual bottom part. Also, for example, when the shield part is formed on the substrate and the residual bottom part is fixed on the substrate, the residual part fixed to the substrate is eliminated by penetrating the groove, thereby shielding the substrate and the shield. Since the bonding area with the portion is reduced, the thermal stress itself generated due to the difference in the thermal expansion coefficient between the substrate and the shield portion can be further reduced. As a result, thermal stress can be more effectively mitigated, and fluctuations in detection characteristics due to temperature changes can be more effectively suppressed.

  Application Example 7 When the physical quantity sensor according to this application example is viewed in plan on the substrate, the first sensor element provided on the main surface of the substrate, and the main surface of the substrate, A first groove extending in a first direction in a region overlapping with the shield portion when the substrate is viewed in plan, and a shield portion disposed on an outer periphery of the first sensor element. And a second groove extending in a second direction intersecting the first direction.

According to this application example, the physical quantity sensor is formed on the outer periphery of the first sensor element when the substrate is viewed in plan on the substrate, the first sensor element provided on the main surface of the substrate, and the main surface of the substrate. And an arranged shield part. In addition, the substrate has a first groove extending in the first direction and a second groove extending in the second direction intersecting the first direction in a region overlapping with the shield part. Therefore, the thermal stress generated when the substrate has a thermal expansion coefficient different from the thermal expansion coefficient of the shield part is alleviated by at least one of these grooves. As a result, the thermal stress generated due to the difference in thermal expansion coefficient deforms the first sensor element, or if the first sensor element has a movable part (movable electrode), the displacement is affected. It is suppressed that the first sensor element is used, and fluctuations in detection characteristics due to temperature changes in the environment in which the first sensor element is used are suppressed.
That is, according to this application example, it is possible to provide a physical quantity sensor with more stable detection characteristics, in which fluctuations in detection characteristics due to temperature changes in the environment in use are suppressed.

  Application Example 8 An electronic apparatus according to this application example includes the physical quantity sensor according to the application example.

  According to this application example, the electronic device is provided with a physical quantity sensor having a more stable detection characteristic by suppressing fluctuations in the detection characteristic due to a temperature change in the environment in which the electronic device is used. can do.

  Application Example 9 A moving object according to this application example includes the physical quantity sensor according to the application example.

  According to this application example, as a moving body, fluctuations in detection characteristics due to temperature changes in the environment used are suppressed, and by providing a physical quantity sensor with more stable detection characteristics, environmental characteristics such as temperature changes are more stable. A moving body can be provided.

(A)-(c) The schematic diagram which shows the physical quantity sensor which concerns on Embodiment 1. FIG. (A) The schematic diagram which shows the state which bonded together the board | substrate and the silicon substrate. (B) BB sectional drawing of Fig.1 (a). (A) The top view which shows the physical quantity sensor which concerns on Embodiment 2. FIG. (B) The top view which shows the physical quantity sensor which concerns on Embodiment 3. FIG. FIG. 4A is a perspective view illustrating a configuration of a mobile personal computer as an example of an electronic apparatus, and FIG. 5B is a perspective view illustrating a configuration of a mobile phone as an example of an electronic apparatus. The perspective view which shows the structure of the digital still camera as an example of an electronic device. The perspective view which shows the motor vehicle as an example of a mobile body roughly. Sectional drawing which shows the physical quantity sensor which concerns on a modification.

  DESCRIPTION OF EMBODIMENTS Embodiments embodying the present invention will be described below with reference to the drawings. The following is one embodiment of the present invention and does not limit the present invention. In the following drawings, the scale may be different from the actual scale for easy understanding.

(Embodiment 1)
First, the physical quantity sensor according to the first embodiment will be described.
FIGS. 1A to 1C are schematic views showing the physical quantity sensor 100 according to the first embodiment. FIG. 1A is a plan view of the physical quantity sensor 100, and FIG. 1B is a physical quantity sensor 100. FIG. 1C is a cross-sectional view taken along the line AA of FIG. 1B.
In the following, for convenience of explanation, in the XYZ axes appended to the figure, the X direction is the right direction, the X axis direction (± X direction) is the horizontal direction, the Y direction is the depth direction, and the Y axis direction (± Y direction). The description will be made assuming that the front-rear direction, the Z direction is the upward direction, the Z-axis direction (± Z direction) is the vertical direction, or the thickness direction of the substrate 10 described later.

The physical quantity sensor 100 includes a substrate 10, a sensor element 99 as a first sensor element, a shield part 90, and the like.
The substrate 10 is a plate-like body that supports the physical quantity sensor 100 as a base substrate, and has a rectangular shape when viewed in plan. The sensor element 99 is provided on the main surface of the substrate 10. The substrate 10 also serves as a base substrate for the sensor element 99.
The sensor element 99 includes a sensing unit 20, wiring 30 and the like.
The sensing unit 20 includes fixed portions 41 and 42, a movable electrode 50 as a movable portion, a fixed electrode 60, and the like. The movable electrode 50 includes support portions 51 and 52, movable electrode fingers 53 and 54, a movable base 55, and the like.

The substrate 10 is provided with a recess 70 on the upper surface as a main surface. The concave portion 70 is formed in a region in which the movable electrode 50 (the support portions 51 and 52, the movable electrode fingers 53 and 54, and the movable base portion 55) of the sensing unit 20 is accommodated when the substrate 10 is viewed in plan.
The fixing portions 41 and 42 are provided to be bonded to the main surface of the substrate 10 in a region outside the region of the recess 70 when the substrate 10 is viewed in plan. Specifically, the fixing portion 41 is joined to a portion on the −X direction side (left side in the figure) with respect to the concave portion 70 of the main surface of the substrate 10, and the fixing portion 42 is on the + X direction side (with respect to the concave portion 70 ( It is joined to the part on the right side in the figure. Further, the fixing portions 41 and 42 are provided so as to straddle the outer peripheral edge portion of the concave portion 70 when viewed in plan.

The movable base 55 is a rectangular plate-like body whose longitudinal direction faces the X direction, and is supported by the substrate 10 via support portions 51 and 52 between the fixed portions 41 and 42. More specifically, the left end portion of the movable base portion 55 is connected to the fixed portion 41 via the support portion 51, and the right end portion of the movable base portion 55 is connected to the fixed portion 42 via the support portion 52. Has been.
From the long side portion of the movable base 55 on the + Y side, a plurality of (three in this embodiment) beam-like movable electrode fingers 53 are arranged in the + Y direction, and from the long side portion of the movable base portion 55 on the −Y side, These (three in this embodiment) beam-like movable electrode fingers 54 extend in the −Y direction.
The concave portion 70 is formed as a relief portion for releasing the movable electrode 50 (support portions 51 and 52, movable electrode fingers 53 and 54, movable base portion 55) from the substrate 10. In the present embodiment, the shape of the recess 70 in plan view is a rectangle, but is not limited thereto.

The support portions 51 and 52 connect the movable base portion 55 to the fixed portions 41 and 42 so as to be displaceable. In the present embodiment, the support portions 51 and 52 are configured to be able to displace the movable base portion 55 in the X-axis direction as indicated by an arrow a in FIG.
The plurality of movable electrode fingers 53 and the plurality of movable electrode fingers 54 extending in the Y-axis direction are provided side by side in the X-axis direction in which the movable electrode 50 is displaced.

Specifically, the support portion 51 includes two (a pair of) beams, and each has a shape extending in the + X direction while meandering in the Y-axis direction. In other words, each beam has a shape that is folded a plurality of times (three times in the present embodiment) in the Y-axis direction. The number of times each beam is folded may be once or twice, or may be four or more times.
Similarly, the support portion 52 is composed of a pair of beams having a shape extending in the −X direction while meandering in the Y-axis direction.

The fixed electrode 60 includes a plurality of fixed electrode fingers 61 and 62 arranged in a comb-like shape that meshes with the plurality of movable electrode fingers 53 and 54 of the movable electrode 50 with a space therebetween.
The fixed electrode fingers 61 are arranged in pairs (accordingly, 2 × 3 locations) so as to oppose both sides in the X-axis direction so as to sandwich one movable electrode finger 53 with a gap therebetween. Similarly, the fixed electrode fingers 62 are arranged to be opposed to each other on both sides in the X-axis direction (accordingly, 2 × 3 locations) so as to sandwich one movable electrode finger 54 with a gap therebetween. ing.

  The fixed electrode fingers 61 and 62 are provided on the main surface of the substrate 10 with one end bonded to the main surface in a region outside the region of the recess 70 when the substrate 10 is viewed in plan. . Specifically, the fixed electrode finger 61 has an end portion on the opposite side to the movable electrode 50 side (+ Y side with respect to the movable electrode 50) on the upper surface of the substrate 10 on the + Y direction side with respect to the concave portion 70. It is joined. Each fixed electrode finger 61 has a fixed end as a fixed end, and a free end extending in the −Y direction. Similarly, the end of the fixed electrode finger 62 on the side opposite to the movable electrode 50 side (the −Y side with respect to the movable electrode 50) is on the upper surface of the substrate 10 on the −Y direction side with respect to the recess 70. The fixed end is the fixed end, and the free end extends in the + Y direction.

With such a configuration, the capacitance between the fixed electrode finger 61 (hereinafter referred to as the first fixed electrode finger) positioned on the + X side of the movable electrode finger 53 in the fixed electrode finger 61 and the movable electrode finger 53. The capacitance between the fixed electrode finger 61 (hereinafter referred to as the second fixed electrode finger) located on the −X side of the movable electrode finger 53 of the fixed electrode finger 61 and the movable electrode finger 53 is movable. It can be changed according to the displacement of the electrode 50.
Similarly, the capacitance between the fixed electrode finger 62 (hereinafter also referred to as the first fixed electrode finger) located on the + X side of the movable electrode finger 54 in the fixed electrode finger 62 and the movable electrode finger 54. , And static electricity between the movable electrode finger 54 and the fixed electrode finger 62 (hereinafter also referred to as the second fixed electrode finger) located on the −X side of the movable electrode finger 54 of the fixed electrode finger 62. The capacity can be changed according to the displacement of the movable electrode 50.

The first fixed electrode finger and the second fixed electrode finger are separated from each other on the substrate 10 and are electrically insulated. Therefore, the electrostatic capacitance between the first fixed electrode finger and the movable electrode 50 (movable electrode fingers 53, 54) and the static capacitance between the second fixed electrode finger and the movable electrode 50 (movable electrode fingers 53, 54) are described. Capacitance can be measured separately, and physical quantities can be detected with high accuracy based on the measurement results.
That is, for example, the sensing unit 20 is configured so that the movable electrode 50 (movable electrode fingers 53 and 54) elastically deforms the support units 51 and 52 in accordance with changes in physical quantities such as acceleration and angular velocity while the X-axis direction (+ X Direction or -X direction). The sensor element 99 can detect a physical quantity such as acceleration or angular velocity based on the capacitance that changes with such displacement. That is, the sensor element 99 is a capacitive acceleration sensor.
Note that the shapes of the movable electrode 50 and the fixed electrode 60 are determined according to the shape, size, and the like of each part constituting the sensing unit 20, and are not limited to the above-described configuration.

  The wiring 30 is an electrical connection wiring for detecting the above-described capacitance, and is laid along a recess 71 formed in the main surface of the substrate 10. The wiring 30 is connected to the electrode 31a for connecting the first fixed electrode finger and connected to the external circuit, the wiring connected to the electrode 31b for connecting the second fixed electrode finger and connected to the external circuit, The movable electrode 50 and a wiring connected to the electrode 31c for connecting to an external circuit are provided.

The recess 71 is provided as a region where the wiring 30 is laid in the region outside the recess 70. That is, the recess 71 is formed so that the region where the wiring 30 is laid is accommodated in the region of the recess 71 when the substrate 10 is viewed in plan.
The depth dimension of the recess 71 (the dimension in the thickness direction of the substrate 10) is larger than the thickness dimension of the wiring 30 and smaller than the depth dimension of the recess 70 except for a contact portion described later.

As described above, the recess 71 is formed on the main surface of the substrate 10, and the wiring 30 thinner than the depth of the recess 71 is laid in the region of the recess 71. Contact between the wiring 30 and the sensing unit 20 stacked on the upper layer of the substrate 10 is avoided.
The predetermined electrical connection portion is a contact portion in which an upper layer constituting the sensing unit 20 is stacked so as to cover a part of the wiring 30 and the wiring 30 and the upper layer are in contact with each other to be electrically connected.
As shown in FIG. 1B, the connection between the first and second fixed electrode fingers by the wiring 30 and the connection between the wiring 30 and the fixing portion 41 are performed by a contact portion 81. The movable electrode 50 is electrically connected to the wiring 30 via the fixed portion 41.

The constituent material of the wiring 30 is not particularly limited as long as it has conductivity, and various electrode materials can be used. For example, ITO (Indium Tin Oxide), IZO (Indium zinc oxide), Examples thereof include oxides (transparent electrode materials) such as In ₂ O ₃ , SnO ₂ , Sb-containing SnO ₂ , and Al-containing ZnO, Au, Pt, Ag, Cu, Al, and alloys containing these, and one of these. Species or a combination of two or more can be used.

Further, an insulating film may be provided on the wiring 30 except for the contact portion where the wiring 30 and the upper layer constituting the sensing unit 20 abut. This insulating film has a function of avoiding electrical connection (short circuit) between the wiring 30 and the non-connection portion of the sensing unit 20. The constituent material of the insulating film is not particularly limited, and various insulating materials can be used. However, when the substrate 10 is made of a glass material (particularly, a glass material to which alkali metal ions are added). Silicon dioxide (SiO ₂ ) is preferably used.

The shield part 90 is a shield electrode that has an effect of blocking or reducing leakage of a signal detected by the sensor element 99 and noise applied to the sensor element 99 from the outside. As shown in FIG. On the main surface, the substrate 10 is disposed in the outer peripheral region of the sensor element 99 when viewed in plan.
Specifically, the sensor element 99 is configured to occupy a rectangular region in plan view in the central portion on the main surface of the substrate 10, and the shield portion 90 is formed in a frame shape so as to surround the sensor element 99. ing. For example, a ground potential is applied to the shield unit 90 by wiring (not shown).

  The shield part 90 has a plurality of first grooves 92 extending in the X-axis direction as the first direction and a second direction intersecting the first direction (X-axis direction) when the substrate 10 is viewed in plan. And a plurality of second grooves 93 extending in the Y-axis direction. That is, the first direction in which the first groove 92 extends is the displacement direction of the movable portion (movable electrode 50).

The first groove 92 is a hole groove penetrating from the upper surface to the lower surface of the shield part 90, and the length in the X-axis direction is about 70% of the frame width of the shield part 90 having a frame shape and the width is about 10%. It is a size. The first grooves 92 are arranged at substantially equal intervals in the frame region of the shield part 90.
Similar to the first groove 92, the second groove 93 is a hole groove penetrating the shield part 90. The length in the Y-axis direction is about 70% of the frame width of the shield part 90 that forms a frame shape, and the width is about 70%. The size is about 10%. The second grooves 93 are arranged at substantially equal intervals so as to be alternately arranged between or adjacent to the first grooves 92 arranged at substantially equal intervals.
Further, the first groove 92 and the second groove 93 are arranged so that the figure constituted by the first groove 92 and the second groove 93 is rotationally symmetrical twice when the substrate 10 is viewed in plan.

  In addition, the magnitude | size and number of the 1st groove | channel 92 and the 2nd groove | channel 93 are not limited to the content mentioned above. For example, a configuration in which the length and width are made smaller and a larger number may be arranged may be used. Further, the first groove 92 and the second groove 93 may be continuous to form a cross shape or an L shape. However, it is necessary to provide it within a range that does not impair the effect as a shield electrode. Further, it is preferable that the figure constituted by the first groove 92 and the second groove 93 is rotationally symmetric.

As a material constituting the sensing unit 20 (the fixed units 41 and 42, the support units 51 and 52, the movable electrode fingers 53 and 54, the movable base 55 and the fixed electrode fingers 61 and 62) and the shield unit 90, silicon is preferably used as a preferred example. Used. In the production thereof, they are preferably formed integrally, for example, by patterning a single silicon substrate.
The silicon substrate can be processed with high accuracy by etching. Therefore, by configuring the sensing unit 20 using a silicon substrate as a main material, the dimensional accuracy of the sensing unit 20 can be improved, and as a result, the sensitivity of the sensor element 99 can be increased. Moreover, it is preferable that the silicon material constituting the sensing unit 20 and the shield unit 90 is doped with impurities such as phosphorus and boron. Thereby, the sensor element 99 can be excellent in the conductivity of the sensing unit 20 and the shielding property as the shield electrode of the shield unit 90.
The constituent material of the sensing unit 20 is not limited to a silicon substrate, and any material that can detect a physical quantity based on a change in capacitance may be used.

  As a constituent material of the substrate 10, a glass material having an insulating property is used as a suitable example. In particular, when the sensing unit 20 is formed of a silicon substrate, it is preferable to use a glass material containing alkali metal ions (movable ions) (for example, borosilicate glass such as Pyrex (registered trademark) glass). Thereby, the sensor element 99 can be comprised by anodically bonding the board | substrate 10 (glass substrate) and the sensing part 20 (silicon substrate).

Fig.2 (a) is a schematic diagram which shows a state when a glass substrate and the silicon substrate which comprises a shield part and a sensing part are bonded together.
As described above, a physical quantity sensor having a laminated structure in which a layer (silicon substrate, etc.) constituting a sensing unit or a shield unit (shield electrode) is bonded to a substrate (glass substrate, etc.) depends on the temperature environment used. As a result, there is a problem in that the detection characteristics fluctuate. Specifically, as shown in FIG. 2A, the thermal stress generated by the difference in thermal expansion coefficient between the glass substrate and the silicon substrate laminated on the glass substrate causes the glass substrate to warp. Since the sensor element is deformed or the displacement of the movable part (movable electrode) of the sensor element is affected, the detection characteristics fluctuate.

On the other hand, thermal stress can be relieved by providing the 1st groove | channel 92 and the 2nd groove | channel 93 in the shield part 90 (silicon substrate) like this embodiment.
FIG. 2B is a cross-sectional view taken along the line BB in FIG. 1A, and shows a state where the first groove 92 and the second groove 93 are provided in the shield part 90. As can be seen from this drawing, by allowing the first groove 92 and the second groove 93 to pass through the shield part 90, it is possible to reduce the thermal stress generated and to transmit the generated thermal stress. . That is, when the bonding area between the substrate 10 and the shield part 90 is reduced, the generated thermal stress is relieved (decreased), and when the shield part 90 is discontinuous, the transmission of the thermal stress is divided. The As a result, the occurrence of warpage as shown in FIG.

As described above, according to the physical quantity sensor 100 according to the present embodiment, the following effects can be obtained.
The physical quantity sensor 100 includes a substrate 10, a sensor element 99 provided on the main surface of the substrate 10, and a shield portion 90 disposed on the outer periphery of the sensor element 99 (the outer periphery when the substrate 10 is viewed in plan). ing. The shield part 90 includes a first groove 92 extending in the first direction (X-axis direction) and a second groove 93 extending in a second direction (Y-axis direction) intersecting the first direction. Yes. Therefore, the thermal stress generated when the shield part 90 has a thermal expansion coefficient different from the thermal expansion coefficient of the substrate 10 is relieved by at least one of these grooves.

Specifically, the stress acting on the groove in a direction intersecting with the extending direction of the groove is relaxed by the groove. Therefore, the thermal stress generated between the substrate 10 and the shield part 90 on the main surface of the substrate 10 is also alleviated by these grooves (the first groove 92 and the second groove 93, or at least one of these grooves). The For example, when the substrate 10 warps due to thermal stress, the warpage is alleviated by these grooves. As a result, the thermal stress generated due to the difference in thermal expansion coefficient is prevented from deforming the sensor element 99 or affecting the displacement of the movable part (movable electrode 50) included in the sensor element 99. Thus, fluctuations in detection characteristics due to temperature changes in the environment in which the sensor element 99 is used are suppressed.
That is, it is possible to provide a physical quantity sensor with more stable detection characteristics in which fluctuations in detection characteristics due to temperature changes in the environment in which it is used are suppressed.

Further, the first direction is the displacement direction of the movable part provided in the sensor element 99 (the displacement direction in plan view of the substrate 10). That is, the shield part 90 disposed on the outer periphery of the sensor element 99 includes a first groove 92 extending in the same direction as the direction in which the movable part included in the sensor element 99 is displaced when the substrate 10 is viewed in plan view, and the sensor A second groove 93 extending in a direction intersecting the direction in which the movable portion provided in the element 99 is displaced is provided.
When the shield part 90 has a thermal expansion coefficient different from the thermal expansion coefficient of the substrate 10, the shield part 90 includes the second groove 93 extending in a direction intersecting the displacement direction of the movable part included in the sensor element 99. The second groove 93 can more effectively relieve the thermal stress generated in the displacement direction of the movable part. In particular, since the second groove 93 extends so as to intersect the direction of displacement of the movable part in a direction substantially perpendicular to the displacement direction, the thermal stress is more effectively relieved.

  Further, since the shield part 90 includes the first groove 92, the thermal stress itself that the substrate 10 receives from the shield part 90 is suppressed. Since the shield part 90 includes the first groove 92 extending in the displacement direction of the movable part included in the sensor element 99, the thermal stress itself generated in the displacement direction of the movable part that the substrate 10 receives from the shield part 90 is suppressed. The

  As a result, the thermal stress generated by the difference in thermal expansion coefficient may cause the sensor element 99 to be deformed or may affect the displacement of the movable part (movable electrode 50) included in the sensor element 99. It is suppressed, and fluctuations in detection characteristics due to temperature changes in the environment where the sensor element 99 is used are suppressed.

(Embodiment 2)
Next, the physical quantity sensor according to the second embodiment will be described. In the description, the same components as those in the above-described embodiment are denoted by the same reference numerals, and redundant description is omitted.
FIG. 3A is a plan view showing the physical quantity sensor 101 according to the second embodiment.
The second embodiment further includes a second sensor element in addition to the first sensor element (sensor element 99), and includes a first groove 92 and a second groove 93 in a shield part in a region between the sensor elements. It is characterized by being.

The physical quantity sensor 101 includes a substrate 10, a sensor element 99, a sensor element 99a and a sensor element 99b as second sensor elements, a shield part 90a, and the like.
The sensor element 99a is, for example, a capacitive acceleration sensor having the same configuration as the sensor element 99 and having a different installation direction (orientation). The sensor element 99 detects the acceleration in the X-axis direction, whereas the sensor element 99a is arranged to detect the acceleration in the Y-axis direction.
The sensor element 99b is, for example, a gyro sensor that detects angular velocity. Inside, a vibrator is provided as a movable part.

  As shown in FIG. 3A, the sensor element 99, the sensor element 99a, and the sensor element 99b are arranged on the main surface of the substrate 10 at intervals. Specifically, the sensor element 99 is located in the lower right area (+ X, −Y side area) of the rectangular substrate 10, and the sensor element 99 b is located in the depth direction area (+ X, + Y side area). 99 and the sensor element 99b are arranged on the left side area (the center area in the Y-axis direction on the -X side).

  A shield portion 90a is disposed on the outer periphery of each sensor element. In other words, the shield portion 90 a is formed in a region other than the region occupied by each sensor element on the main surface of the substrate 10. For example, a ground potential is applied to the shield part 90a by wiring (not shown).

A first groove 92 and a second groove 93 are provided in the shield part 90a in the region between the sensor elements. Specifically, in the shield part 90a in the region between the sensor element 99 and the sensor element 99b, a groove row 94 is provided that is composed of rows in which the first grooves 92 and the second grooves 93 are alternately arranged in the X-axis direction. ing. Further, the first groove 92 and the second groove 93 are alternately arranged in the Y-axis direction in the shield part 90a in the region between the sensor element 99 and the sensor element 99a and between the sensor element 99b and the sensor element 99a. A groove row 95 made of a row is provided.
In each of the groove row 94 and the groove row 95, the figure constituted by the first groove 92 and the second groove 93 is arranged so as to be twice rotationally symmetric when the substrate 10 is viewed in plan.
Note that it is not always necessary to provide both the groove row 94 and the groove row 95, and the groove row may be provided in a region where the stress generated between the sensor elements needs to be relaxed.

As described above, according to the physical quantity sensor 101 according to the present embodiment, the following effects can be obtained.
The physical quantity sensor 101 further includes a second sensor element (sensor element 99a, sensor element 99b) in addition to the first sensor element (sensor element 99) provided on the main surface of the substrate 10. As described above, when a plurality of sensor elements are provided on a common substrate, the detection characteristics as a physical quantity sensor may be deteriorated, for example, noise generated by one sensor element may affect the other sensor element. . This noise may be caused not only by electrical noise but also by mechanical energy such as stress and vibration. Specifically, in the case where the thermal stress or residual stress generated or possessed by the sensor element structure has a movable part, vibration leakage of the movable part is transmitted to the adjacent sensor element, and the adjacent sensor element It may affect the detection characteristics.

  According to the present embodiment, the first groove 92 and the second groove 93 are at least between the sensor element 99 and the sensor element 99a, between the sensor element 99 and the sensor element 99b, and between the sensor element 99a and the sensor element 99b. Is provided in the shield part 90a in any region between. Therefore, the stress acting between the sensor elements and the energy such as leakage vibration transmitted from one to the other are alleviated by the first groove 92 and the second groove 93 or at least one of the grooves, and the characteristics are reduced. Can be suppressed.

(Embodiment 3)
Next, a physical quantity sensor according to the third embodiment will be described. In the description, the same components as those in the above-described embodiment are denoted by the same reference numerals, and redundant description is omitted.
FIG. 3B is a plan view showing the physical quantity sensor 102 according to the third embodiment.
As in the second embodiment, the third embodiment includes a second sensor element in addition to the first sensor element. The first embodiment covers the entire area (entire surface) of the shield part 90a surrounding the outer periphery of each sensor element. A groove 92 and a second groove 93 are provided.

The physical quantity sensor 102 is the same as the physical quantity sensor 101 except that the positions and numbers of the first grooves 92 and the second grooves 93 provided in the shield part 90a are different.
As shown in FIG. 3B, the physical quantity sensor 102 is disposed so that the first groove 92 and the second groove 93 are alternately arranged in the X-axis direction and the Y-axis direction over the entire region of the shield part 90a. ing.
Further, the first groove 92 and the second groove 93 are arranged so that the figure constituted by the first groove 92 and the second groove 93 is rotationally symmetrical twice when the substrate 10 is viewed in plan.

According to the physical quantity sensor 102 according to the present embodiment, the following effects can be obtained.
The thermal stress generated when the shield part 90a has a thermal expansion coefficient different from the thermal expansion coefficient of the substrate 10 is relaxed by these grooves (the first groove 92 and the second groove 93, or at least one of these grooves). Is done. Further, the thermal stress generated between the substrate 10 and the shield portion 90a on the main surface of the substrate 10 is also alleviated by these grooves. As a result, the thermal stress generated due to the difference in thermal expansion coefficient may cause the sensor elements (sensor element 99, sensor element 99a, sensor element 99b) provided on the main surface of the substrate 10 to be deformed, Influencing the displacement of the movable portion provided is suppressed, and fluctuations in detection characteristics due to temperature changes in the environment in which the sensor element is used are suppressed.
Further, the stress acting between the plurality of sensor elements and the energy such as leakage vibration transmitted from one to the other are alleviated by the first groove 92 and the second groove 93, or at least one of these grooves. The influence on the characteristics can be suppressed.
As described above, the first groove 92 and the second groove 93 are alternately arranged in the X-axis direction and the Y-axis direction over the entire region of the shield part 90a, so that the detection characteristics can be more effectively obtained. Stabilization can be achieved.

  In the first to third embodiments, the first groove 92 and the second groove 93 have been described as hole grooves penetrating from the upper surface to the lower surface of the shield portions 90, 90a. That is, the 1st groove | channel 92 and the 2nd groove | channel 93 may be a groove | channel which has a bottom part, without penetrating the shield parts 90 and 90a in both or one side. Further, the bottom portion may be on the lower surface side (substrate 10 side) or vice versa.

  In the first to third embodiments, the second grooves 93 are described as being arranged at substantially equal intervals so as to be alternately arranged between or adjacent to the first grooves 92 arranged at approximately equal intervals. The first grooves 92 and the second grooves 93 are not necessarily arranged alternately. Further, it is not always necessary to arrange them at regular intervals. It is desirable to lay out appropriately according to the planar shape and size of the shield part in which the first groove 92 and the second groove 93 are arranged, the arrangement and orientation of the sensor element, and the assumed stress relaxation effect.

  The sensor element is not necessarily limited to the sensor having the above-described configuration. The physical quantity sensor is a structure in which the layers that make up the sensor element and the shield part are stacked on the main surface of the board. Thermal stress generated by the difference in the thermal expansion coefficient between the shield part and the board, and between the sensor elements A similar effect can be obtained if the stress transmitted through the shield portion arranged in the case affects the detection characteristics of the sensor element.

[Electronics]
Next, an electronic apparatus to which the physical quantity sensor 100 as an electronic component according to an embodiment of the present invention is applied will be described with reference to FIGS. 4 (a), 4 (b), and 5. FIG. In the following description, the physical quantity sensor 100 is described as an example, but the physical quantity sensors 101 and 102 may be used.

  FIG. 4A is a perspective view showing an outline of the configuration of a mobile (or notebook) personal computer as an electronic apparatus including an electronic component according to an embodiment of the present invention. In this figure, a personal computer 1100 includes a main body portion 1104 provided with a keyboard 1102 and a display unit 1106 provided with a display portion 1000. The display unit 1106 is rotated with respect to the main body portion 1104 via a hinge structure portion. It is supported movably. Such a personal computer 1100 includes a physical quantity sensor 100 as an electronic component that functions as a filter, a resonator, a reference clock, and the like.

  FIG. 4B is a perspective view schematically showing a configuration of a mobile phone (including PHS) as an electronic apparatus including the electronic component according to the embodiment of the present invention. In this figure, a cellular phone 1200 is provided with a plurality of operation buttons 1202, an earpiece 1204 and a mouthpiece 1206, and a display unit 1000 is disposed between the operation buttons 1202 and the earpiece 1204. Such a cellular phone 1200 incorporates a physical quantity sensor 100 as an electronic component (timing device) that functions as a filter, a resonator, an angular velocity sensor, or the like.

FIG. 5 is a perspective view schematically illustrating a configuration of a digital still camera as an electronic apparatus including the electronic component according to the embodiment of the present invention. In this figure, connection with an external device is also simply shown. The digital still camera 1300 generates an imaging signal (image signal) by photoelectrically converting an optical image of a subject using an imaging element such as a CCD (Charge Coupled Device).
A display unit 1000 is provided on the back surface of a case (body) 1302 in the digital still camera 1300, and is configured to display based on an imaging signal from the CCD. The display unit 1000 displays a subject as an electronic image. Functions as a viewfinder. A light receiving unit 1304 including an optical lens (imaging optical system), a CCD, and the like is provided on the front side (the back side in the drawing) of the case 1302.
When the photographer confirms the subject image displayed on the display unit 1000 and presses the shutter button 1306, the CCD image pickup signal at that time is transferred and stored in the memory 1308. In the digital still camera 1300, a video signal output terminal 1312 and an input / output terminal 1314 for data communication are provided on the side surface of the case 1302. As shown in the figure, a television monitor 1430 is connected to the video signal output terminal 1312 and a personal computer 1440 is connected to the input / output terminal 1314 for data communication as necessary. Further, the imaging signal stored in the memory 1308 is output to the television monitor 1430 or the personal computer 1440 by a predetermined operation. Such a digital still camera 1300 incorporates a physical quantity sensor 100 as an electronic component that functions as a filter, a resonator, an angular velocity sensor, or the like.

  As described above, an electronic device with higher operation accuracy can be provided by providing the physical quantity sensor 100 in which a decrease in detection accuracy is further suppressed as an electronic device.

  The physical quantity sensor 100 according to an embodiment of the present invention includes a personal computer (mobile personal computer) in FIG. 4A, a mobile phone in FIG. 4B, and a digital still camera in FIG. For example, inkjet type ejection device (for example, inkjet printer), laptop personal computer, television, video camera, car navigation device, pager, electronic notebook (including communication function), electronic dictionary, calculator, electronic game machine, workstation , Video phone, crime prevention TV monitor, electronic binoculars, POS terminal, medical equipment (eg, electronic thermometer, blood pressure monitor, blood glucose meter, electrocardiogram measuring device, ultrasonic diagnostic device, electronic endoscope), fish detector, various measuring devices , Instruments (eg, vehicle, aircraft, ship instruments), fly It can be applied to an electronic device simulator, and the like.

[Moving object]
Next, a moving body to which the physical quantity sensor 100 according to an embodiment of the present invention is applied will be described with reference to FIG. In the following description, the physical quantity sensor 100 is described as an example, but the physical quantity sensors 101 and 102 may be used.

  FIG. 6 is a perspective view schematically showing an automobile 1400 as a moving body including the physical quantity sensor 100. The automobile 1400 is equipped with a gyro sensor including the physical quantity sensor 100 according to the present invention. For example, as shown in the figure, an automobile 1400 as a moving body is equipped with an electronic control unit 1402 incorporating the gyro sensor for controlling the tire 1401. As another example, the physical quantity sensor 100 includes a keyless entry, an immobilizer, a car navigation system, a car air conditioner, an antilock brake system (ABS), an air bag, a tire pressure monitoring system (TPMS). ), Electronic control units (ECUs) such as engine controls, battery monitors for hybrid vehicles and electric vehicles, vehicle body posture control systems, and the like.

  As described above, by providing the physical quantity sensor 100 in which a decrease in accuracy is further suppressed as a moving body, it is possible to provide a moving body with more stable environmental characteristics such as a temperature change.

  Note that the present invention is not limited to the above-described embodiment, and various modifications and improvements can be added to the above-described embodiment. A modification will be described below. Here, the same components as those in the above-described embodiment are denoted by the same reference numerals, and redundant description is omitted.

(Modification 1)
FIG. 7 is a cross-sectional view showing a physical quantity sensor 103 according to a modification, and is a cross-sectional view at a position corresponding to the BB cross section in FIG.
In the first to third embodiments, the first groove 92 and the second groove 93 for relieving stress are described as being provided in the shield part on the main surface of the substrate 10. However, these grooves may be provided in the substrate 10. .

In the physical quantity sensor 103, the first groove 92 and the second groove 93 are not provided in the shield part 90. Instead, the substrate 10 is provided with a third groove 96 and a fourth groove 97. Except for this point, the physical quantity sensor 103 is the same as the physical quantity sensor 100.
The third groove 96 is a hole groove penetrating from the main surface to the lower surface of the substrate 10, and is disposed at the same position as the first groove 92 in the physical quantity sensor 100 when the substrate 10 is viewed in plan. Similarly, the fourth groove 97 is a hole groove penetrating from the main surface to the lower surface of the substrate 10 and is disposed at the same position as the second groove 93 in the physical quantity sensor 100 when the substrate 10 is viewed in plan. . That is, the third groove 96 and the fourth groove 97 are both provided in a region overlapping the shield part 90.

According to the physical quantity sensor 103 according to this modification, the substrate 10 has a third groove 96 extending in the first direction and a second direction extending in the second direction intersecting the first direction in the region overlapping the shield part 90. 4 grooves 97. Therefore, the thermal stress generated when the substrate 10 has a thermal expansion coefficient different from the thermal expansion coefficient of the shield part 90 is alleviated by at least one of these grooves. As a result, the thermal stress generated due to the difference in thermal expansion coefficient is prevented from deforming the sensor element 99 or affecting the displacement of the movable part (movable electrode 50) included in the sensor element 99. Thus, fluctuations in detection characteristics due to temperature changes in the environment in which the sensor element 99 is used are suppressed.
That is, even when the substrate 10 is provided with a groove for relieving stress as in the present modified example, fluctuations in the detection characteristics due to changes in the temperature of the environment used are suppressed, and the detection characteristics are more stable. A physical quantity sensor can be provided.

  DESCRIPTION OF SYMBOLS 10 ... Board | substrate, 20 ... Sensing part, 30 ... Wiring, 31a, 31b, 31c ... Electrode, 41, 42 ... Fixed part, 50 ... Movable electrode, 51, 52 ... Support part, 53, 54 ... Movable electrode finger, 55 ... Movable base, 60 ... fixed electrode, 61, 62 ... fixed electrode finger, 70, 71 ... concave portion, 81 ... contact portion, 90, 90a ... shield portion, 92 ... first groove, 93 ... second groove, 94, 95 ... Groove row, 96 ... third groove, 97 ... fourth groove, 99, 99a, 99b ... sensor element, 100 to 103 ... physical quantity sensor.

Claims (9)

A substrate,
A first sensor element provided on a main surface of the substrate;
A shield portion disposed on an outer periphery of the first sensor element when the substrate is viewed in plan on the main surface of the substrate; and
When the substrate is viewed in plan, the shield part has a first groove extending in a first direction and a second groove extending in a second direction intersecting the first direction. A physical quantity sensor. The first sensor element is
A fixed portion fixed on the main surface of the substrate;
A support portion extending from the fixed portion;
The physical quantity sensor according to claim 1, further comprising a movable portion that is supported by the support portion so as to be separated from the substrate and displaceable.   The physical quantity sensor according to claim 2, wherein the first direction is a displacement direction of the movable part in a plan view of the substrate. A second sensor element provided on the main surface of the substrate;
The said 1st groove | channel and the said 2nd groove | channel are provided in the said shield part of the area | region between the said 1st sensor element and the said 2nd sensor element, Any of Claim 1 thru | or 3 characterized by the above-mentioned. The physical quantity sensor according to claim 1.   The said 1st groove | channel and the said 2nd groove | channel are arrange | positioned so that the figure comprised by the said 1st groove | channel and the said 2nd groove | channel may become rotationally symmetric when the said board | substrate is planarly viewed. The physical quantity sensor according to any one of claims 1 to 4.   The first groove and the second groove, or the first groove or the second groove penetrates the shield part in the thickness direction of the substrate. The physical quantity sensor according to any one of 5. A substrate,
A first sensor element provided on a main surface of the substrate;
A shield portion disposed on an outer periphery of the first sensor element when the substrate is viewed in plan on the main surface of the substrate; and
The substrate has a first groove extending in a first direction and a second groove extending in a second direction intersecting the first direction in a region overlapping the shield portion when the substrate is viewed in plan. And a physical quantity sensor characterized by comprising:   An electronic apparatus comprising the physical quantity sensor according to any one of claims 1 to 7.   A moving body comprising the physical quantity sensor according to any one of claims 1 to 7.

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