JP2015013483A5 - Bonding apparatus and manufacturing method of bonding substrate - Google Patents

Bonding apparatus and manufacturing method of bonding substrate Download PDF

Info

Publication number
JP2015013483A5
JP2015013483A5 JP2014191943A JP2014191943A JP2015013483A5 JP 2015013483 A5 JP2015013483 A5 JP 2015013483A5 JP 2014191943 A JP2014191943 A JP 2014191943A JP 2014191943 A JP2014191943 A JP 2014191943A JP 2015013483 A5 JP2015013483 A5 JP 2015013483A5
Authority
JP
Japan
Prior art keywords
adhesive
bonding
workpieces
pair
workpiece
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2014191943A
Other languages
Japanese (ja)
Other versions
JP5815099B2 (en
JP2015013483A (en
Filing date
Publication date
Application filed filed Critical
Priority to JP2014191943A priority Critical patent/JP5815099B2/en
Priority claimed from JP2014191943A external-priority patent/JP5815099B2/en
Publication of JP2015013483A publication Critical patent/JP2015013483A/en
Publication of JP2015013483A5 publication Critical patent/JP2015013483A5/en
Application granted granted Critical
Publication of JP5815099B2 publication Critical patent/JP5815099B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Description

上記の目的を達成するため、本発明は、表示装置を構成する一対のワークを、電磁波の照射により硬化する接着剤を介して貼り合わせる貼合装置において、少なくとも一方のワークの片面の全体に行き渡るように、前記接着剤を供給する供給部と、ワークの片面の全体に行き渡った前記接着剤の全面に対して、貼り合わせ前に、大気中で電磁波を照射することにより、仮硬化させる照射部と、仮硬化状態の接着剤に対して、他方のワークを貼り合わせる貼合部と、を有することを特徴とする。
In order to achieve the above-described object, the present invention spreads over the entire surface of at least one of the workpieces in a bonding apparatus that bonds a pair of workpieces constituting the display device via an adhesive that cures by irradiation with electromagnetic waves. as a supply unit for supplying the adhesive, the entire surface of the adhesive prevailing across the one side of the workpiece, prior to bonding, by irradiating an electromagnetic wave in the atmosphere, the irradiation unit to be temporarily cured If, with respect to the adhesive temporary curing conditions, characterized by having a a bonding unit for bonding the other workpiece.

Claims (6)

表示装置を構成する一対のワークを、電磁波の照射により硬化する接着剤を介して貼り合わせる貼合装置において、
少なくとも一方のワークの片面の全体に行き渡るように、前記接着剤を供給する供給部と、
ワークの片面の全体に行き渡った前記接着剤の全面に対して、貼り合わせ前に、大気中で電磁波を照射することにより、仮硬化させる照射部と、
仮硬化状態の前記接着剤に対して、他方のワークを貼り合わせる貼合部と、
この貼合部で貼り合わされ、前記接着剤が仮硬化状態の前記一対のワークを、大気中で放置する放置部と、
前記大気中で放置された前記一対のワークに対して電磁波を照射して前記接着剤を本硬化させる硬化部と、
を有することを特徴とする貼合装置。 In a bonding apparatus that bonds a pair of workpieces constituting a display device via an adhesive that is cured by irradiation with electromagnetic waves,
As spread over the entire one surface of at least one of the workpiece, and a supply unit for supplying the adhesive,
Over the entire surface of the adhesive prevailing across the one side of the workpiece, prior to bonding, by irradiating an electromagnetic wave in the atmosphere, and the irradiation portion to be temporarily cured,
For the adhesive in the temporarily cured state, a bonding part that bonds the other workpiece;
The pair of workpieces that are pasted together at this pasting portion and the adhesive is temporarily cured,
A curing part that radiates electromagnetic waves to the pair of workpieces left in the atmosphere to permanently cure the adhesive;
It has a bonding apparatus characterized by having. 前記照射部は、紫外線を照射する照射装置を有することを特徴とする請求項１記載の貼合装置。The bonding apparatus according to claim 1, wherein the irradiation unit includes an irradiation device that irradiates ultraviolet rays. 前記放置部は、貼り合わされた前記一対のワークを前記貼合部から前記硬化部に搬送する搬送装置であることを特徴とする請求項１または請求項２記載の貼合装置。The bonding device according to claim 1, wherein the leaving unit is a transport device that transports the pair of bonded workpieces from the bonding unit to the curing unit. 前記貼合部は、貼り合わせ時の前記一対のワークの周囲を真空引き可能な真空室を有することを特徴とする請求項１〜３のいずれか１項に記載の貼合装置。The said bonding part has a vacuum chamber which can evacuate the circumference | surroundings of the said pair of workpiece | work at the time of bonding, The bonding apparatus of any one of Claims 1-3 characterized by the above-mentioned. 表示装置を構成する一対のワークを、電磁波の照射により硬化する接着剤を介して貼り合わせる貼合基板の製造方法において、In the method for manufacturing a bonded substrate in which a pair of workpieces constituting a display device are bonded together through an adhesive that is cured by irradiation with electromagnetic waves,
少なくとも一方のワークの片面の全体に行き渡るように、前記接着剤を供給し、Supplying the adhesive so as to spread over the entire surface of at least one of the workpieces,
ワークの片面の全体に行き渡った前記接着剤の全面に対して、貼り合わせ前に、大気中で電磁波を照射することにより、仮硬化させ、For the entire surface of the adhesive spread over the entire surface of one side of the workpiece, before being bonded, by irradiating electromagnetic waves in the atmosphere, temporarily cured,
仮硬化状態の前記接着剤に対して、他方のワークを貼り合わせ、The other workpiece is bonded to the adhesive in the temporarily cured state,
貼り合わされ、前記接着剤が仮硬化状態の前記一対のワークを、大気中で放置した後、前記一対のワークに対して電磁波を照射して前記接着剤を本硬化させることを特徴とする貼合基板の製造方法。Bonding, wherein the pair of workpieces that are bonded and the adhesive is temporarily cured are left in the air, and then the electromagnetic waves are irradiated to the pair of workpieces to fully cure the adhesive. A method for manufacturing a substrate. 前記電磁波が、紫外線であることを特徴とする請求項５記載の貼合基板の製造方法。The said electromagnetic wave is an ultraviolet-ray, The manufacturing method of the bonding board | substrate of Claim 5 characterized by the above-mentioned.
JP2014191943A 2014-09-19 2014-09-19 Bonding apparatus and manufacturing method of bonding substrate Active JP5815099B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2014191943A JP5815099B2 (en) 2014-09-19 2014-09-19 Bonding apparatus and manufacturing method of bonding substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014191943A JP5815099B2 (en) 2014-09-19 2014-09-19 Bonding apparatus and manufacturing method of bonding substrate

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2010219950A Division JP2012073533A (en) 2010-09-29 2010-09-29 Sticking device and sticking method

Publications (3)

Publication Number Publication Date
JP2015013483A JP2015013483A (en) 2015-01-22
JP2015013483A5 true JP2015013483A5 (en) 2015-03-19
JP5815099B2 JP5815099B2 (en) 2015-11-17

Family

ID=52435624

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014191943A Active JP5815099B2 (en) 2014-09-19 2014-09-19 Bonding apparatus and manufacturing method of bonding substrate

Country Status (1)

Country Link
JP (1) JP5815099B2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104679339B (en) 2015-01-19 2016-08-17 欧浦登（顺昌）光学有限公司 A kind of hermetically sealed liquid crystal integrated screen and manufacturing process thereof
JP6829219B2 (en) * 2018-03-12 2021-02-10 株式会社飯沼ゲージ製作所 Laminating method and laminating device

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008038413A1 (en) * 2006-09-28 2008-04-03 Shibaura Mechatronics Corporation Bonding method and bonding apparatus
JP5139736B2 (en) * 2007-06-27 2013-02-06 東レエンジニアリング株式会社 Liquid crystal component manufacturing method and manufacturing apparatus

Similar Documents

Publication Publication Date Title
MX2017015550A (en) Methods of bonding hardware to vehicular glass.
JP2012073533A5 (en) Bonding apparatus and manufacturing method of bonding substrate
JP2012152677A5 (en)
GB2520905A (en) Advanced handler wafer debonding method
SG11201802510SA (en) Laminate film for temporary bonding, methods for producing substrate workpiece and laminate substrate workpiece using the laminate film for temporary bonding, and method for producing semiconductor device using the same
GB2562941A (en) Handler bonding and debonding for semiconductor dies
JP2015173104A5 (en) Peeling method
JP2015155089A5 (en)
WO2014202415A3 (en) Device and method for additively producing at least one component region of a component
JP2013075521A5 (en)
JP6475519B2 (en) Method for forming protective member
WO2015103352A3 (en) Dental compositions containing upconversion phosphors and methods of use
EP2963144A3 (en) Abrasive coating and manufacture and use methods
TW201614348A (en) Apparatus and method for irradiating polarized light for light alignment
WO2017076901A3 (en) Method for creating surface effects, in particular in uv-curable layers, device for making same, and article obtained according to the invention
PH12018502073A1 (en) Method for manufacturing semiconductor device
AU2017253939B2 (en) Device and method for increasing the adhesion of a component layer to a carrier object
EP2626898A3 (en) Sealant laminated composite, sealed semiconductor devices mounting substrate, sealed semiconductor devices forming wafer, semiconductor apparatus, and method for manufacturing semiconductor apparatus
MY160731A (en) Method for manufacturing electronic parts
JP2018077491A (en) Device for manufacturing member for display and method for manufacturing member for display
JP2016068389A5 (en)
WO2012051979A3 (en) Device for producing, repairing and/or replacing a component by means of a powder that can be solidified by energy radiation, method and component produced according to said method
SG10201903680SA (en) Method for temporary bonding workpiece and adhesive
JP2014096577A5 (en) Method for manufacturing display device
TW201613011A (en) Method and apparatus for manufacturing semiconductor devices