JP2015007145A - Method for manufacturing thermal insulation material, resin composition for thermal insulation material and thermal insulation material - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for manufacturing a thermal insulation material, capable of producing a thermal insulation material having a deodorant function to aldehyde.SOLUTION: A method for manufacturing a thermal insulation material includes: a preparation step of preparing a resin composition for a thermal insulation material including at least one resin of polyethylene or ethylene-acetate copolymer, an organic adsorbent having aldehyde adsorption capacity, and a foaming agent that does not hinder the aldehyde adsorption capacity of the organic adsorbent; a molding step of molding the resin composition for a thermal insulation material into a predetermined shape; and a foam formation step of foaming the resin composition for a thermal insulation material to produce a thermal insulation material made of resin foam having pores.

Description

  The present invention relates to a method for producing a heat insulating material capable of producing a heat insulating material having a deodorizing function for aldehyde, a resin composition for heat insulating material, and the above heat insulating material.

  With the recent improvement in energy conservation, there is a demand for highly airtight and highly heat insulating houses with improved energy efficiency in the residential environment. The above-mentioned highly airtight and highly heat insulating houses can improve the efficiency of air conditioning in summer and winter.

  As a method of imparting airtightness and heat insulation to a house, a method using a heat insulating material such as an outer heat insulating method has been proposed, and the use of a resin foam having pores such as foamed polyethylene as the heat insulating material is proposed. (Patent Document 1).

Here, the foamed polyethylene is generally produced by molding a resin composition obtained by kneading polyethylene and a foaming agent, and then foaming the resin composition. Conventionally, an azo foaming agent such as azodicarbonamide is often used as the foaming agent. Since the azo foaming agent generates a large amount of ammonia gas during foaming, ammonia adheres to the obtained heat insulating material. There is a problem of generating odor.
Therefore, it has been proposed to add an adsorbent having ammonia adsorption ability to the resin foam (Patent Document 2). However, when an azo foaming agent and a chemical adsorption agent having a high adsorption capacity are used in combination, there is a problem that the organic functional group is deactivated at the foaming temperature of the azo foaming agent. In addition, an inorganic adsorbent having physical adsorption ability may not be able to adsorb a large amount of ammonia gas and may be released due to external changes.

Japanese Patent No. 3346027 Japanese Patent No. 4904526 JP2013-082199A JP 2013-039707 A

By the way, aldehyde which emits a strong irritating odor such as formaldehyde has been conventionally used for processing and the like in residential building materials (woody processing materials). In recent years, sick house syndrome that causes various symptoms on mucous membranes such as eyes, nose and throat due to volatilization of aldehyde from such building materials has become a problem. Moreover, since such an aldehyde is contained in the air, there is a problem that the higher the airtightness of the house, the easier it is to stay in the room.
For example, it has been proposed to deal with the above problem by adding a deodorizing function to aldehyde to wallpaper which is an interior material (Patent Document 3 and Patent Document 4), but the recent increase in the residential environment has been proposed. In response to the demand for airtightness and high thermal insulation, the residential environment is required to further improve the deodorizing function for aldehydes.

In view of the above circumstances, the present inventor has conducted intensive studies on including an organic adsorbent having an aldehyde adsorption ability in a heat insulating material composed of foamed polyethylene or the like. It has been found that not only the heat-insulating material itself has an odor due to the ammonia produced during the production, but also the above-described adsorption of the organic adsorbent and formaldehyde is inhibited by the ammonia. The present invention has been made based on the above findings.
That is, the main object of the present invention is to provide a method for producing a heat insulating material capable of producing a heat insulating material having a deodorizing function for aldehyde, a resin composition for a heat insulating material, and a heat insulating material.

  The present invention relates to a heat insulating material containing at least one resin of polyethylene and ethylene-vinyl acetate copolymer, an organic adsorbent having an aldehyde adsorbing ability, and a foaming agent that does not inhibit the aldehyde adsorbing ability of the organic adsorbent. A resin foam having pores by preparing a resin composition for heat treatment, a molding process for forming the resin composition for heat insulating material into a predetermined shape, and foaming the resin composition for heat insulating material There is provided a method for producing a heat insulating material comprising a foaming step for forming a heat insulating material to be configured.

  According to the present invention, the resin composition for a heat insulating material contains an organic adsorbent having an aldehyde adsorbing ability and a foaming agent that does not inhibit the aldehyde adsorbing ability of the organic adsorbent. It is possible to manufacture a heat insulating material having an odor function.

  In the said invention, after the said shaping | molding process and before the said foaming process, the electron beam irradiation which bridge | crosslinks the said resin composition for heat insulating materials by irradiating the electron resin to the shape | molded said resin composition for heat insulating materials. It is preferable to have a process. This is because the surface strength, foaming characteristics, and the like of the molded resin composition for a heat insulating material can be adjusted.

  The present invention contains at least one resin of polyethylene and ethylene-vinyl acetate copolymer, an organic adsorbent having an aldehyde adsorbing ability, and a foaming agent that does not inhibit the aldehyde adsorbing ability of the organic adsorbent. Provided is a resin composition for a heat insulating material.

  According to the present invention, the resin composition for a heat insulating material of the present invention is used by containing an organic absorbent having an aldehyde adsorbing ability and a foaming agent that does not inhibit the aldehyde adsorbing ability of the organic adsorbent. It is possible to produce a heat insulating material having a deodorizing function against aldehyde.

  The present invention is a heat insulating material composed of a resin foam having pores, and contains at least one resin of polyethylene and ethylene-vinyl acetate copolymer, and an organic adsorbent having an aldehyde adsorbing ability. A heat insulating material characterized by the above is provided.

  According to the present invention, it is possible to obtain a heat insulating material having a deodorizing function for an aldehyde by containing an organic adsorbent having an aldehyde adsorbing ability and the above-mentioned pores are constituted only by independent pores.

  In the said invention, it is preferable that the said pore is comprised only with an independent hole. This is because better heat insulating properties can be exhibited and a heat insulating material having good strength can be obtained.

  The method for manufacturing a heat insulating material of the present invention has an effect that it is possible to manufacture a heat insulating material having a deodorizing function with respect to an aldehyde by using the resin composition for a heat insulating material having the above-described composition.

It is a flowchart which shows an example of the manufacturing method of the heat insulating material of this invention. It is process drawing which shows an example of the manufacturing method of the heat insulating material of this invention. It is a flowchart which shows the other example of the manufacturing method of the heat insulating material of this invention. It is a schematic sectional drawing which shows an example of the heat insulating material of this invention. It is explanatory drawing explaining the pore in the heat insulating material of this invention. It is the photograph which expanded and observed sectional drawing of the heat insulating material in Example 1 with the optical microscope.

  Hereafter, the manufacturing method of the heat insulating material of this invention, the resin composition for heat insulating materials, and a heat insulating material are demonstrated.

A. Method for Producing Heat Insulating Material The method for producing the heat insulating material of the present invention comprises at least one resin of polyethylene and ethylene-vinyl acetate copolymer, an organic adsorbent having an aldehyde adsorbing ability, and the aldehyde adsorption of the organic adsorbent. Preparation step for preparing a resin composition for a heat insulating material containing a foaming agent that does not impede performance, a molding step for forming the resin composition for a heat insulating material into a predetermined shape, and foaming the resin composition for a heat insulating material And a foaming step for forming a heat insulating material composed of a resin foam having pores.

In the present invention, “aldehyde” refers to an aldehyde compound having an aldehyde group.
The “organic adsorbent having aldehyde adsorption ability” refers to an adsorbent composed of an organic compound having a functional group that adsorbs aldehyde.
The “foaming agent that does not inhibit the aldehyde adsorption ability” refers to a foaming agent that does not generate a gas during foaming, or a foaming agent that generates a gas that does not inhibit the adsorption of the aldehyde and the functional group of the organic adsorbent.
In the following description, “organic adsorbent having aldehyde adsorbing ability” may be simply referred to as “organic adsorbent”, and “foaming agent that does not inhibit aldehyde adsorbing ability” may be simply referred to as “foaming agent”. .

The manufacturing method of the heat insulating material of this invention is demonstrated using figures. FIG. 1 is a flowchart showing an example of a method for manufacturing a heat insulating material according to the present invention, and FIG. 2 is a process diagram showing an example of a method for manufacturing a heat insulating material according to the present invention.
First, as shown in FIG. 2 (a), the method for producing a heat insulating material of the present invention includes at least one resin 2 of polyethylene and ethylene-vinyl acetate copolymer, an organic adsorbent 3 having an aldehyde adsorbing ability, and A heat insulating resin composition 1 containing a foaming agent 4 that does not impair the aldehyde adsorbing ability of the organic adsorbent 3 is prepared (preparation step), and the heat insulating resin composition 1 is formed into a predetermined shape (molding step). ). Next, as shown in FIG.2 (b), the resin composition 1 for heat insulating materials is bridge | crosslinked by irradiating the molded resin composition 1 for heat insulating materials with the electron beam EB (electron beam irradiation process). Next, as shown in FIG.2 (c), the heat insulating material 10 comprised with the resin foam which has the pore 11 is formed by foaming the resin composition 1 for heat insulating materials (foaming process).

  FIG. 3 is a flowchart showing another example of the method for manufacturing a heat insulating material according to the present invention. As shown in FIG. 1, the method for manufacturing a heat insulating material of the present invention may be performed after the forming step, and may be performed as one step as shown in FIG. 3. Good.

  FIG. 4 is a schematic cross-sectional view showing an example of a heat insulating material obtained by the method for manufacturing a heat insulating material of the present invention. As shown in FIG. 4, the heat insulating material 10 is composed of a resin foam having pores 11, and is an organic adsorbent having at least one resin 2 of polyethylene and ethylene-vinyl acetate copolymer and an aldehyde adsorbing ability. 3 is contained. Moreover, as the heat insulating material 10, it is preferable that the pore 11 is comprised only by the independent hole 11a. The independent hole 11a will be described later.

  According to the present invention, the resin composition for a heat insulating material contains an organic adsorbent having an aldehyde adsorbing ability and a foaming agent that does not inhibit the aldehyde adsorbing ability of the organic adsorbent. It is possible to manufacture a heat insulating material having an odor function.

As described above, the present inventor attempted to produce a heat insulating material having a deodorizing function against aldehyde by including an organic adsorbent having an aldehyde adsorbing ability in a heat insulating material composed of a resin foam. However, when an azo foaming agent conventionally used as a foaming agent is used, ammonia generated during thermal decomposition of the foaming agent inhibits the adsorption of the organic adsorbent and formaldehyde described above in the heat insulating material. I found out.
The reason is estimated as follows.
Ammonia generated at the time of decomposition of the azo foaming agent has a property of easily adhering to the surface of the heat insulating material. Therefore, when ammonia adheres to the surface of a heat insulating material containing an organic adsorbent having aldehyde adsorption ability, aldehyde in the air and functional groups of the organic adsorbent having aldehyde adsorption ability are adsorbed by the volume of ammonia. It is presumed to inhibit this.
In addition to the above, for example, an organic adsorbent having an aldehyde adsorbing ability may be modified by reacting with ammonia generated from the blowing agent, or an aldehyde adsorbing ability at a heating temperature for decomposing the azo foaming agent. It is assumed that the organic adsorbent possessed is denatured.

  On the other hand, in the present invention, the foaming agent does not generate gas when the resin composition for a heat insulating material is foamed by the foaming agent by using the foaming agent that does not inhibit the aldehyde adsorption ability of the organic adsorbent. Or the components in the gas generated by thermal decomposition of the foaming agent do not hinder the adsorption of the aldehyde and the functional group of the organic adsorbent, thus preventing the organic adsorbent from deteriorating in the foaming process. This makes it possible to produce a heat insulating material having a deodorizing function for aldehydes.

The present invention is characterized by finding a combination of an organic adsorbent having an aldehyde adsorbing ability and a foaming agent that does not inhibit the aldehyde adsorbing ability of the organic adsorbent based on the above findings.
Hereinafter, the detail of the manufacturing method of the heat insulating material of this invention is demonstrated.

1. Preparatory Step The preparatory step in the present invention comprises at least one resin of polyethylene and ethylene-vinyl acetate copolymer, an organic adsorbent having an aldehyde adsorbing ability, and a foaming agent that does not inhibit the aldehyde adsorbing ability of the organic adsorbent. It is the process of preparing the resin composition for heat insulating materials containing this.

(1) Resin composition for heat insulating material The resin composition for heat insulating material used in the present invention includes at least one resin of polyethylene and ethylene-vinyl acetate copolymer, an organic adsorbent having an aldehyde adsorbing ability, and the above organic type. It contains a foaming agent that does not hinder the aldehyde adsorption ability of the adsorbent.

(A) Organic adsorbent The organic adsorbent used in the present invention has an aldehyde adsorbing ability. The organic adsorbent is used for imparting a deodorizing function to aldehyde to the heat insulating material obtained by the present invention.

  The organic adsorbent is composed of an organic compound having a functional group that adsorbs aldehyde. The organic adsorbent may be an adsorbent composed only of an organic compound or an organic-inorganic composite adsorbent composed of a composite material in which an organic compound is supported on an inorganic compound, More preferably, it is an organic-inorganic composite adsorbent. As the inorganic compound used in the organic-inorganic composite adsorbent is preferably a porous body, the organic adsorbent has the ability to adsorb aldehyde when a gas such as ammonia generated from the foaming agent enters the pores of the porous body. Easy to be disturbed. Therefore, it is because the effect by using the below-mentioned foaming agent can be exhibited more highly.

  Examples of the organic compound used in the organic adsorbent include compounds such as amines, ureas, amides, imides, hydrazides, azoles and azines.

  Examples of amines include hydroxylamine, ethanolamine, dimethylamine, diethylamine, isopropylamine, proline, hydroxyproline, dicyanodiamide, ethyleneimine, ethylenediamine, propylenediamine, diethylenetriamine, 2-diethylaminoethanol, 2-dimethylaminoethanol, 1, 2-diaminopropane, triethylenetetramine, tetraethylenepentamine, iminobispropylamine, tetramethylenediamine, guanidine carbonate, glycine, alanine, sarcosine, glutamic acid, hexamethylenediamine, melamine, morpholine, 2-amino-4,5- Examples include dicyanoimidazole, 3-azahexane-1,6-diamine, and sodium aminobenzoate.

  Examples of ureas include urea, thiourea, methylurea, ethyleneurea, acetylurea, azodicarbonamide, and the like.

  Examples of amides include formamide, acetamide, succinic acid amide, dicyandiamide and the like.

  Examples of imides include succinimide, hydantoin, and isocyanuric acid.

  Examples of hydrazides include lauric acid hydrazide, salicylic acid hydrazide, form hydrazide, acetohydrazide, propionic acid hydrazide, p-hydroxybenzoic acid hydrazide, naphthoic acid hydrazide, 3-hydroxy-2-naphthoic acid hydrazide, oxalic acid dihydrazide, and malonic acid dihydrazide. Succinic acid dihydrazide, adipic acid dihydrazide, azelaic acid dihydrazide, sebacic acid dihydrazide, dodecane-2 acid dihydrazide, maleic acid dihydrazide, fumaric acid dihydrazide, diglycolic acid dihydrazide, tartaric acid dihydrazide, diphthalide diacid dihydrazide, diphthalide diacid dihydrazide , Dimer acid dihydrazide, 2,6-naphthoic acid dihydrazide and the like.

  As azoles and azines, 3-methyl-5-pyrazolone, 1,3-dimethyl-5-pyrazolone, 3-methyl-1-phenyl-5-pyrazolone, 3-phenyl-6-pyrazolone, 3-methyl- Pyrazolones such as 1- (3-sulfophenyl) -5-pyrazolone, pyrazole, 3-methylpyrazole, 1,4-dimethylpyrazole, 3,5-dimethylpyrazole, 3,5-dimethyl-1-phenylpyrazole, 3 -Aminopyrazole, 5-amino-3-methylpyrazole, 3-methylpyrazole-5-carboxylic acid, 3-methylpyrazole-5-carboxylic acid methyl ester, 3-methylpyrazole-5-carboxylic acid ethyl ester, 1,2 , 3-triazole, 1,2,4-triazole, 3-n-butyl-3,5-dimethyl-1,2,4- Riazole, 3,5-di-n-butyl-1,2,4-triazole, 3-mercapto-1,2,4-triazole, 3-amino-1,2,4-triazole, 4-amino-1, 2,4-triazole, 3,5-diamino-1,2,4-triazole, 5-amino-3-mercapto-1,2,4-triazole, 3-amino-5-phenyl-1,2,4- Triazole, 3,5-diphenyl-1,2,4-triazole, 1,2,4-triazol-3-one, urazole (3,5-dioxy-1,2,4-triazole), 1,2,4 -Triazole-3-carboxylic acid, 1-hydroxybenzotriazole, 5-hydroxy-7-methyl-1,3,8-triazaindolizine, 1H-benzotriazole, 4-methyl-1H-benzotria Lumpur, 5-methyl -1H- benzotriazole, 6-methyl-8-hydroxy-triazolopyridazine, 4,5-dichloro-3-pyridazine, maleic hydrazide, 6-methyl-3-pyridazone and the like.

  Examples of the organic / inorganic composite adsorbent include composite materials in which compounds such as the amines, ureas, amides, imides, hydrazides, azoles and azines mentioned above are supported on an inorganic compound. Examples of the inorganic compound that can be used as the carrier include silicon dioxide, activated carbon, sepiolite, and mica from the viewpoint of heat resistance. Among these inorganic compounds, it is particularly preferable to use a porous body of silicon dioxide from the viewpoint of adsorption performance.

More specifically, as the organic-inorganic composite adsorbent, as described in paragraph [0016] of JP-A-2003-52800, an amine compound having a primary amino group is supported on the above-described inorganic compound. And composite materials. As compounds of amines having a primary amino group, as described in paragraph [0020] of the same publication, aliphatic compounds include “H ₂ N— (CH ₂ CH ₂ —NH) _n —CH ₂ CH”. ₂ NH ₂ (n is an integer of 0 or more and 3 or less) ”is preferable, and aniline is preferable as the aromatic compound.

  As the organic-inorganic composite adsorbent described above, for example, trade names “Kesmon NS-231”, “Kesmon NS-241” (Toagosei Co., Ltd.) and the like are commercially available, and these commercially available products can also be used.

  The average particle size of the organic-inorganic composite adsorbent is not particularly limited as long as it can be uniformly dispersed in the resin composition for a heat insulating material, but is preferably in the range of 0.1 μm to 10 μm, for example, in the range of 1 μm to 7 μm. Is more preferable. Here, the average particle diameter in the present specification is a value measured by a laser diffraction scattering method.

  The content of the organic adsorbent in the heat insulating resin composition is not particularly limited as long as it can be uniformly dispersed in the heat insulating resin composition. For example, 5 parts by weight with respect to 100 parts by weight of the resin It is preferable to be within the range of ˜50 parts by mass, especially within the range of 10 parts by mass to 40 parts by mass, and particularly within the range of 15 parts by mass to 35 parts by mass. If the content of the organic adsorbent is too small, it may be difficult to impart a desired deodorizing function to the resulting heat insulating material. If the content of the organic adsorbent is too large, This is because, since the resin content is relatively reduced, the strength and workability of the resulting foaming agent may be reduced.

(B) Foaming agent The foaming agent used for this invention does not inhibit the said aldehyde adsorption capacity of the said organic type adsorption agent.
The said foaming agent is used in order to foam a heat insulating material resin composition into a resin foam in the foaming process mentioned later.

  The foaming agent generates a gas that does not generate a gas during foaming, or generates a gas that does not inhibit the adsorption of the aldehyde and the functional group of the organic adsorbent. In the present invention, the foaming agent is preferably a thermally expandable microcapsule type foaming agent. When a thermally expandable microcapsule-type foaming agent is used, no gas is generated from the foaming agent, so that the resin composition for a heat insulating material can be foamed without further hindering the aldehyde adsorption ability of the organic adsorbent. Moreover, since the pore of the resin foam in the obtained heat insulating material can be made into an independent hole and a pore diameter can be made small, it can be set as a heat insulating material with a more favorable heat insulation function. Moreover, since generation | occurrence | production of the gas from a foaming agent is suppressed, it can also suppress about the odor by the component in gas adhering to a heat insulating material.

A thermally expandable microcapsule-type foaming agent is a microcapsule encapsulating a foaming agent, and more specifically, a microcapsule encapsulating a foaming agent in fine particles (microcapsules) composed of a thermoplastic resin. The fine particles whose volume is increased by the vaporizing pressure of the foaming agent softened by the thermoplastic resin at a predetermined temperature and enclosed inside.
The foaming agent to be encapsulated in the microcapsule is preferably a vaporizable liquid, and is preferably a lower hydrocarbon from the viewpoint of the production of the microcapsule and the production cost, specifically, low boiling point such as propane, butane, isobutane, isopentane, etc. Hydrocarbons having a boiling point in the range of 55 ° C. to 205 ° C. and mixtures of these with water-insoluble petroleum ether are preferred. Specific examples of the water-insoluble petroleum ether that can be used in the present invention include heavy oils such as Group 4 and 3 petroleums, creosote oil, aniline, nitrobenzene, and the like.
The thermoplastic resin constituting the microcapsule preferably has a softening point in the range of 50 ° C. to 200 ° C., expands several times to several tens of times at this temperature, and has gas barrier properties. . Specifically, polyvinyl chloride, polyvinylidene chloride, polyacrylonitrile, polymethyl (meth) acrylate, polyvinyl acetate, acrylonitrile-methyl (meth) acrylate copolymer, acrylonitrile-methacrylonitrile copolymer, (meth) acrylonitrile- Mention may be made of homopolymers such as methyl (meth) acrylate- (meth) acrylonitrile copolymers or copolymers thereof and mixtures thereof.

The average particle diameter of the microcapsules before foaming is preferably in the range of 1 μm to 100 μm, and more preferably in the range of 10 μm to 50 μm. The expansion temperature is preferably in the range of 50 ° C to 200 ° C from the viewpoint of handleability.
Examples of such commercially available thermally expandable microcapsules include Matsumoto Microsphere F series and FN series manufactured by Matsumoto Yushi Seiyaku Co., Ltd.

On the other hand, as the foaming agent that generates gas that does not inhibit the adsorption of the aldehyde and the functional group of the organic adsorbent, those that generate carbon dioxide, water, hydrogen, nitrogen, oxygen, and the like can be used. Specific foaming agents include inorganic foaming agents such as sodium bicarbonate, sodium carbonate, calcium carbonate, and sodium bicarbonate, N, N′-dimethyl-N, N′-dinitrosotephthalamide, and N, N ′. Nitroso compounds such as dinitrosopentamethylenetetramine, azo compounds such as azobisisobutyronitrile, azocyclohexylnitrile, and barium azodicarboxylate, calcium azide, 4,4′-diphenyldisulfonyl azide, and p-toluene Azide compounds such as sulfonyl azide, propane, butane, isobutane, pentane, isopentane, neopentane, hexane, heptane, benzene, methylene dichloride, trichloroethylene, and hydrocarbon compounds containing fluorine atoms (freon), etc. To mention Yes. In the present invention, a foaming agent that generates one kind of gas during foaming or a foaming agent that produces two or more kinds of gas may be used.
Of these, inorganic foaming agents are preferred because of their low cost and stability to water. As a commercially available inorganic foaming agent, “Unifine” manufactured by Otsuka Chemical Co., Ltd. can be mentioned.

  Such a foaming agent may be a liquid foaming agent or a solid foaming agent. The average particle diameter of the solid foaming agent is, for example, preferably in the range of 1 μm to 30 μm, and more preferably in the range of 5 μm to 10 μm.

  In addition, the foaming temperature of the foaming agent used in the present invention is not particularly limited as long as a desired heat insulating material can be obtained. For example, the range of 130 ° C. to 200 ° C. is preferable from the viewpoint of handleability.

  The content of the foaming agent in the resin composition for a heat insulating material is not particularly limited as long as the resin composition for a heat insulating material can be foamed to obtain a resin foam. The mass is preferably in the range of 100 to 100 parts by mass, more preferably in the range of 1 to 80 parts by mass, and still more preferably in the range of 2 to 70 parts by mass. It is because it may become difficult to obtain the heat insulating material comprised with the desired resin foam when there is too little content of a foaming agent, or when there is too much content.

(C) Resin The resin used in the present invention is at least one of polyethylene and an ethylene-vinyl acetate copolymer. In the present invention, either one of polyethylene or ethylene-vinyl acetate copolymer may be used as the resin, or a mixture of polyethylene and ethylene-vinyl acetate copolymer may be used.

  As polyethylene, for example, low density polyethylene (LDPE), medium density polyethylene (MDPE), high density polyethylene (HDPE), linear low density polyethylene (LLDPE) and the like can be widely used. In the present invention, low density polyethylene is particularly preferable. It is because the resin composition for heat insulation members which can be made to foam favorably by the foaming process mentioned later can be obtained.

  As the ethylene-vinyl acetate copolymer, a common one can be used, but those having a vinyl acetate copolymerization ratio (VA amount) in the range of 9% to 25% by weight are preferable, and 9% by weight. Those within the range of ˜20% by weight are more preferred. This is because it is easy to mold the resin composition for a heat insulating material into a desired shape in the molding step described later.

  The resin used in the present invention preferably has an MFR (melt flow rate) measured under the conditions of 190 ° C. and a load of 21.18 N described in JIS K 6922 within a range of 10 g / 10 min to 25 g / 10 min. . When the MFR is within the above range, the temperature rise when forming the heat insulating material resin composition by extrusion film formation in the molding step described later is small, and the film can be formed in a non-foamed state. If the MFR is too large, the resin is too soft and the resulting resin layer may have insufficient scratch resistance.

(D) Additive In addition to the organic adsorbent, foaming agent, and resin described above, the resin composition for a heat insulating material used in the present invention can be added by appropriately selecting necessary additives.
Hereinafter, the additive will be described.

(I) Crosslinking agent In this invention, you may make the resin composition for heat insulating materials contain a crosslinking agent as needed. Moreover, when performing the electron beam irradiation process mentioned later, it is preferable to contain the crosslinking agent. It is because the crosslinking by electron beam irradiation can be accelerated | stimulated by containing a crosslinking agent.
Examples of the crosslinking agent include polyfunctional monomers such as neopentyl glycol dimethacrylate and trimethylolpropane trimethacrylate, oligomers, and the like. As content of the crosslinking agent in the resin composition for heat insulating materials, it is preferable to set it as 10 mass parts or less with respect to 100 mass parts of resin, and it is more preferable to set it as the range of 1 mass part-4 mass parts, for example. preferable.

(Ii) Inorganic filler In this invention, you may make the resin composition for heat insulating materials contain an inorganic filler as needed. By containing the inorganic filler, heat generation can be suppressed when the heat insulating material burns.
Examples of the inorganic filler include calcium carbonate, aluminum hydroxide, magnesium hydroxide, antimony trioxide, zinc borate, a molybdenum compound, a bromine compound, and a phosphorus compound. 100 mass parts or less are preferable with respect to 100 mass parts of resin components, and, as for content of the inorganic filler in the resin composition for heat insulating materials, about 20 mass parts-70 mass parts are more preferable.

(Iii) Pigment In the present invention, a pigment may be contained in the resin composition for a heat insulating material as necessary. As for the pigment, for example, titanium oxide, carbon black, black iron oxide, yellow iron oxide, chrome lead, molybdate orange, cadmium yellow, nickel titanium yellow, chrome titanium yellow, iron oxide (valve), cadmium red, ultramarine blue, Inorganic pigments such as bitumen, cobalt blue, chromium oxide, cobalt green, aluminum powder, bronze powder, mica titanium, zinc sulfide; for example, aniline black, perylene black, azo (azo lake, insoluble azo, condensed azo), polycyclic (Isoindolinone, isoindoline, quinophthalone, perinone, flavantron, anthrapyrimidine, anthraquinone, quinacridone, perylene, diketopyrrolopyrrole, dibromoanthanthrone, dioxazine, thioindigo, phthalocyanine, indanthrone, halo Organic pigments of emissions phthalocyanine), and the like. The content of the pigment in the heat insulating resin composition is preferably about 10 to 50 parts by mass, more preferably about 15 to 30 parts by mass with respect to 100 parts by mass of the resin.

(Iv) Antioxidant In the present invention, an antioxidant may be contained in the resin composition for a heat insulating material as necessary.
Examples of the antioxidant include 2,6-ditert-butyl-p-cresol and tetrakis [methylene-3 (3,5-di-tert-butyl-4-hydroxy-phenyl), which are phenolic antioxidants. Propionate] methane, phosphorous antioxidant tris (2,4-di-butylphenyl) phosphite, distearyl pentaerythritol diphosphite and the like.

(V) Foam stabilizer In this invention, you may make the resin composition for heat insulating materials contain a foam stabilizer as needed.
Examples of the foam stabilizer include alkyl sulfonate and alkyl benzene sulfonate. Specifically, at least one of sodium dodecylbenzenesulfonate and calcium dodecylbenzenesulfonate is preferable.

  Further, a metal soap such as zinc stearate and a surfactant can be used. About 0.3 mass part-10 mass parts are preferable with respect to 100 mass parts of resin, and, as for content of the foam stabilizer in the resin composition for heat insulating materials, about 1 mass part-5 mass parts are more preferable.

(Vi) Foaming aid In the present invention, if necessary, the resin composition for a heat insulating material may contain a foaming aid.
Examples of the foaming aid include urea, zinc oxide, hydroxide, carbonate, basic carbonate, sulfate, nitrate, phosphite, carboxylate and the like. Such a zinc compound is preferably added from the viewpoint of improving the foaming speed. Examples of the carboxylic acid constituting the carboxylate include acetic acid, propionic acid, 2-ethylhexanoic acid, nonanoic acid, isononanoic acid, isodecanoic acid, neodecanoic acid, lauric acid, myristic acid, palmitic acid, stearic acid, and isostearic acid. Examples thereof include aliphatic acids such as acid, oleic acid, 12-hydroxystearic acid, ricinoleic acid and behenic acid, and aromatic acids such as benzoic acid, p-tert-butylbenzoic acid, toluic acid, salicylic acid and naphthenic acid. The zinc carboxylate using these carboxylic acids may be in the form of a normal salt, an acid salt, or a basic salt. The above-mentioned carboxylic acids constituting the zinc carboxylate can be used, but from the viewpoint of reducing VOC, those which are powders at room temperature using fatty acids having 12 or more carbon atoms, such as zinc stearate Zinc laurate and the like are preferable. When other carboxylic acid is used, it may be liquid or may need to be dissolved in an organic solvent in order to improve handling properties.

  About 0.001 mass part-20 mass parts are preferable with respect to 100 mass parts of resin, and, as for content of a foaming adjuvant, about 0.001 mass part-10 mass parts are more preferable.

(Vii) Other additives The resin composition for a heat insulating material used in the present invention may contain a surface treatment agent, a fluorescent whitening agent, a fungicide, a lubricant, etc. in addition to the above-described optional components. . Further, for example, silica aerogel may be added to improve the heat insulating property of the heat insulating material.
Since these additives can be the same as those used for general heat insulating materials, description thereof is omitted here.

(2) Preparatory process The resin composition for heat insulating materials mentioned above can be obtained by kneading said composition, for example. The specific method for forming the resin composition for a heat insulating material can be the same as the method for forming a resin composition used for a general heat insulating material, and thus the description thereof is omitted here.
The resin composition for a heat insulating material prepared in this step can be preliminarily molded into a pellet before the molding step described later.

2. Molding step The molding step in the present invention is a step of molding the heat insulating material resin composition into a predetermined shape. This process may be performed before the foaming process described later, or may be performed within the same process as the foaming process described later. In the present invention, it is particularly preferable to perform this step before the foaming step.

The molding method of the resin composition for a heat insulating material used in this step is not particularly limited as long as the resin composition for a heat insulating material can be molded into a predetermined shape according to the use of the heat insulating material obtained by the present invention. Examples of the molding method include a T-die molding method and an injection molding method.
In addition, the step of molding the resin composition for a heat insulating material when this step is performed in the same step as the foaming step will be described in the section “3. Foaming step” described later.

The shape of the molded resin composition for a heat insulating material (hereinafter sometimes referred to as a molded body) is appropriately selected according to the use of the heat insulating material and is not particularly limited. Examples of the shape of the molded body include a sheet shape. In this case, the molded body may be formed by being wound in a roll shape, or may be formed of a single sheet.
Moreover, the shape etc. which were inject | poured according to the structure where a heat insulating material is used are mentioned.

  The thickness of the molded body is appropriately selected depending on the use of the heat insulating material and is not particularly limited, but is in the range of 50 μm to 3000 μm, particularly in the range of 100 μm to 2000 μm, particularly in the range of 200 μm to 1000 μm. It is preferable. This is because if the thickness of the molded body is small, the strength of the molded body may be reduced. If the thickness of the molded body is large, it may be difficult to sufficiently foam the molded body in the foaming process described later. Because there is.

3. Foaming step The foaming step in the present invention is a step of forming a heat insulating material composed of a resin foam having pores by foaming the resin composition for a heat insulating material.

  The foaming method of the resin composition for heat insulating material used in this step is not particularly limited as long as the resin can be foamed by reacting the foaming agent in the resin composition for heat insulating material. For example, a molded heat insulating material A normal pressure foaming method in which the resin composition is foamed by heating at normal pressure can be suitably used.

  The heating temperature of the resin composition for a heat insulating material in the normal pressure foaming method can be appropriately determined according to the type of resin, foaming agent and the like, and is not particularly limited, but is within the range of 70 ° C to 300 ° C, especially 100. It is preferable that it is in the range of 150 ° C to 250 ° C, particularly in the range of 150 ° C to 230 ° C. This is because if the heating temperature is low, the foaming agent may not react, and if the heating temperature is high, the obtained heat insulating material may be deformed by heat.

Moreover, when heating the resin composition for heat insulating materials mentioned above with a foaming furnace, it is preferable that the atmosphere temperature of a foaming furnace exists in the range of 400 to 600 degreeC.
This is because the heating temperature of the heat insulating resin composition can be set to a desired temperature.

  Moreover, when performing this process in the same process as the molding process described above, for example, an extrusion foaming method in which foaming is performed while reacting a foaming agent in a resin composition for a heat insulating material in an extruder and extruding under high pressure, or a press die. The press foaming method can be used in which the foaming agent in the resin composition for a heat insulating material is reacted and foamed while reducing pressure.

4). Other process The manufacturing method of the heat insulating material of this invention will not be specifically limited if it has the preparatory process mentioned above, a formation process, and a foaming process, A process other than the above can be selected suitably as needed. . In the present invention, it is preferable to perform an electron beam irradiation step in addition to the above steps. Hereinafter, the electron beam irradiation process will be described.

  The electron beam irradiation step in the present invention is a step of crosslinking the heat insulating material resin composition by irradiating the heat insulating material resin composition with an electron beam after the molding step and before the foaming step. is there. By performing this step, the surface strength, foaming characteristics, and the like of the molded body can be adjusted. As the energy of the electron beam, an optimum value can be adopted in the range of about 150 kV to 5000 kV depending on the thickness of the molded body before foaming. In general, the higher the molded body thickness, the higher the acceleration voltage is required. The irradiation amount is preferably about 10 kGy to 100 kGy, and more preferably about 10 kGy to 50 kGy. A known electron beam irradiation apparatus can be used as the electron beam source.

5. Thermal insulation The thermal insulation obtained by the method for producing a thermal insulation of the present invention contains at least one resin of polyethylene and ethylene-vinyl acetate copolymer and an organic adsorbent having an aldehyde adsorption ability, and has pores. It is comprised with the resin foam which has.

  The thickness of the heat insulating material produced according to the present invention is appropriately selected according to its use and is not particularly limited. When used for a heat insulating material for a house, it is preferable that the thickness is 2 mm or more, especially 2 mm to 10 mm, particularly 2 mm to 5 mm, from the viewpoint of ease of processing.

  About the shape of a heat insulating material, it determines suitably according to the use.

The heat insulating material of the present invention is a resin foam having pores. Examples of the shape of the pores of the heat insulating material include independent holes and communication holes.
Here, the “independent hole” refers to a spherical hole that does not have a portion where adjacent pores formed in the heat insulating material communicate with each other. Further, the “communication hole” means a hole having a portion in which at least two adjacent pores formed in the heat insulating material are continuously connected.
Moreover, it can be judged as follows whether the form of a pore is an independent hole or a communicating hole.
For example, the fragments of the heat insulating material can be observed using an optical microscope, a magnifying glass, or the like. In this case, the independent holes are often observed as dodecahedrons having 12 pentagonal faces.

The pores in the heat insulating material of the present invention will be described with reference to the drawings.
FIGS. 5A and 5B are explanatory views for explaining the pores of the heat insulating material obtained by the method for manufacturing a heat insulating material of the present invention. As shown to Fig.5 (a), the independent hole 11a is a spherical hole which does not have the part which adjacent pores 11 formed in the heat insulating material 10 communicate. On the other hand, as shown in FIG. 5 (b), the communication hole 11b is a hole having a portion in which at least two adjacent pores 11 formed in the heat insulating material 10 are continuously connected. is there.
Note that reference numerals not described in FIGS. 5A and 5B are the same as those in FIG. 2 and the like, and thus the description thereof is omitted here.

As the pores of the heat insulating material, the pores may be constituted only by independent holes, the pores may be constituted by independent holes and communication holes, or only constituted by communication holes. It may be done.
“The pores are composed only of closed pores” means not only when all of the pores of the heat insulating material are closed pores, but also to the extent that the closed cell ratio (%) described later is 95% or more. This includes cases with holes.
Moreover, “the pores are composed only of communication holes” means not only the case where all the pores of the heat insulating material are communication holes, but also the degree that the open cell ratio (%) described later is 95% or more. This includes the case of having an independent hole.

The ratio of the said independent hole and a communicating hole can be calculated | required as an independent bubble rate (%) and an open cell rate (%).
The closed cell ratio (%) in the heat insulating material can be obtained by a method based on ASTM D2856, and can be obtained by using, for example, a dry density meter Accupic manufactured by Shimadzu Corporation. The open cell rate (%) can be calculated from the closed cell rate (%).
As an example, the following measuring method as disclosed in JP 2008-299201 A can be mentioned.
The resin foam is submerged in water in a graduated cylinder, its volume A is measured, and its weight M is measured using an electronic balance. Further, the density ρ is determined from the volume and weight of the resin composition for a heat insulating material before foaming. Further, a dry density meter Accupic 1330 manufactured by Shimadzu Corporation is used to measure the volume B excluding the communicating holes (open cells), that is, the volume of the resin foam including closed holes (closed cells).
From the obtained measurement results, the closed cell ratio (%) and the open cell ratio (%) can be obtained using the following equations.
Closed cell ratio (%) = (volume B−weight M ÷ density ρ) / (volume A−weight M ÷ density ρ)
Open cell ratio (%) = 100 (%)-closed cell ratio (%)

The pores of the heat insulating material of the present invention preferably have a higher closed cell ratio (%). This is because the heat insulating function can be exhibited higher and the strength of the heat insulating material can be improved. The closed cell ratio (%) of such a heat insulating material is preferably 70% or more, more preferably 80% or more, and particularly preferably 90% or more.
In the heat insulating material of the present invention, it is more preferable that the closed cell ratio (%) in the pores is 95% or more, that is, the pores are constituted only by the closed pores. This is because, when the pores are constituted only by independent pores, better heat insulating properties can be exhibited and a heat insulating material having good strength can be obtained.

Here, the independent holes can be formed by using a thermally expandable microcapsule type foaming agent as the foaming agent. The thermally expandable microcapsule-type foaming agent forms pores in the resin composition for a heat insulating material by expanding the microcapsules. Therefore, since the adjacent thermally expandable microcapsule-type foaming agent forms the pores without affecting each other, the resulting pore shape is an independent pore.
On the other hand, the communication hole can be formed by using a foaming agent that generates gas by thermal decomposition. Such a foaming agent forms pores in the resin composition for a heat insulating material by a gas due to thermal decomposition. Therefore, when the adjacent foaming agents influence each other when forming the pores, the obtained pores communicate with each other to form a communication hole.

  When the pores of the heat insulating material are constituted by independent holes, they may have microcapsules made of a thermoplastic resin or resin films made of a thermoplastic resin in the independent holes.

In the present invention, it is more preferable that the pores are composed only of independent pores. As described above, since the heat insulating material can be formed using the thermally expandable microcapsule type foaming agent, the generation of gas from the foaming agent can be suppressed, so that the aldehyde adsorbing ability of the organic adsorbent is high. It can be made into a heat insulating material which is not inhibited more and has a good deodorizing function against aldehyde.
Moreover, since the independent hole can make the pore diameter smaller than that of the communication hole, the heat transfer in the heat insulating material can be made smaller, and a good heat insulating material can be exhibited. .

The average pore diameter of the heat insulating material is appropriately selected according to the use of the heat insulating material, the type of foaming agent, and the like, and is not particularly limited, but is preferably 200 μm or less, particularly 150 μm or less, and particularly preferably 100 μm or less.
This is because if the average pore diameter of the heat insulating material is large, the desired heat insulating function may not be exhibited and the strength of the heat insulating material may be reduced.
The average pore diameter of the heat insulating material was measured by arbitrarily extracting 30 pore diameters from a photograph observed with an optical microscope and averaging the measured values.

The porosity of the heat insulating material can be appropriately selected according to the use of the heat insulating material, and is not particularly limited, but is preferably 80% or more, particularly 85% or more, particularly 90% or more. This is because if the porosity of the heat insulating material is small, the desired heat insulating property may not be exhibited.
The porosity of the heat insulating material was calculated from the volume and weight of the density of the sheet before foaming (molded body) cut out to an arbitrary size. Similarly, the density of the foamed sheet (resin foam) was calculated after foaming, and the porosity was measured according to the following formula.
Porosity (%) = (density of unfoamed sheet−density of foamed sheet) / density of unfoamed sheet × 100

The thermal conductivity of the heat insulating material of the present invention is appropriately selected depending on the type of resin, the type of foaming agent, and the like, and is not particularly limited, but is 0.05 W / (m · K) or less, especially 0.04 W / (m · K) or less, particularly preferably 0.033 W / (m · K) or less.
When the heat conductivity of the heat insulating material of the present invention is within the above-described range, good heat insulating properties can be exhibited.
The thermal conductivity of the heat insulating material is measured by, for example, a steady-state method-heat flow meter method using a thermal conductivity measuring device HC-074 series (according to ASTM C518, ISO8301 and JIS A 1412-Part2) manufactured by Eihiro Seiki Co., Ltd. can do.

  As a use of the heat insulating material of this invention, although it can use suitably as a heat insulating material for houses, it is not limited to this, for example. Moreover, when the heat insulating material of this invention is a sheet form, a several heat insulating material can be laminated | stacked and used together.

B. Resin composition for heat insulating material The resin composition for heat insulating material of the present invention comprises at least one resin of polyethylene and ethylene-vinyl acetate copolymer, an organic adsorbent having an aldehyde adsorbing ability, and the above organic adsorbent. And a foaming agent that does not inhibit the aldehyde adsorbing ability.

  According to the present invention, the resin composition for a heat insulating material of the present invention is used by containing an organic absorbent having an aldehyde adsorbing ability and a foaming agent that does not inhibit the aldehyde adsorbing ability of the organic adsorbent. Thus, a heat insulating material having a deodorizing function against aldehyde can be produced.

  About the resin composition for heat insulating materials used for this invention, since it can be made to be the same as that of the content demonstrated in the above-mentioned item of "A. manufacturing method of heat insulating material", description here is abbreviate | omitted.

C. Heat insulation material The heat insulation material of the present invention is a heat insulation material composed of a resin foam having pores, and is a resin of any one of polyethylene and ethylene-vinyl acetate copolymer, and an organic adsorption having an aldehyde adsorption ability It contains an agent.

  The heat insulating material of this invention is demonstrated using figures. FIG. 4 is a schematic sectional view showing an example of the heat insulating material of the present invention. About FIG. 4, since it is the same as that of the content demonstrated by the term of "A. manufacturing method of a heat insulating material", description here is abbreviate | omitted.

  According to this invention, it can be set as the heat insulating material which has the deodorizing function with respect to an aldehyde by containing the organic type adsorption agent which has aldehyde adsorption ability.

  Further, in the present invention, it is preferable that the pores are constituted only by independent pores. This is because better heat insulating properties can be exhibited and a heat insulating material having good strength can be obtained.

  The details of the heat insulating material of the present invention that “the pores are composed only of independent holes” and other details of the heat insulating material of the present invention can be the same as those described in the above-mentioned section “A. Method of manufacturing heat insulating material”. Therefore, the description here is omitted.

  The present invention is not limited to the above embodiment. The above-described embodiment is an exemplification, and the present invention has the same configuration as the technical idea described in the claims of this aspect and exhibits any similar function and effect. Are included in the technical scope.

  Hereinafter, the present invention will be specifically described with reference to Examples and Comparative Examples.

[Example 1]
(Preparation process)
A resin composition for a heat insulating material having the following composition was prepared and prepared.
<Composition of the resin composition for heat insulating materials>
Low-density polyethylene (manufactured by Tosoh Corporation, trade name: Petrocene 208) 100 parts by mass Foaming agent (manufactured by Matsumoto Yushi Seiyaku Co., Ltd., trade name: 190D) 10 parts by weight Cross-linking agent (manufactured by JSR Corporation, trade name) : Opstar JUA-702) 1 part by mass Formaldehyde deodorant (manufactured by Toagosei Co., Ltd., trade name: Kesmon NS-241)
30 parts by mass

(Molding process and electron beam irradiation process)
Using a T-die extruder, the resin composition for a heat insulating material was extruded and formed to a thickness of 1000 μm to obtain a sheet-like molded body. As for the extrusion conditions, the cylinder temperature in which the resin composition for heat insulating material was accommodated was 120 ° C. The die temperature was 120 ° C. Next, for the purpose of improving the surface strength, the resin composition for a heat insulating material formed by irradiation with an electron beam (800 kV, 3 Mrad) was crosslinked.

(Foaming process)
The molded resin composition for a heat insulating material was heated in a foaming furnace (at 230 ° C. for 35 seconds) to foam the resin composition for a heat insulating material, thereby obtaining a heat insulating member composed of a resin foam. The thickness of the obtained heat insulating member was 10 mm.

[Example 2]
The heat insulating material was treated in the same manner as in Example 1 except that the content of the formaldehyde deodorant (made by Toagosei Co., Ltd., trade name: Kesmon NS-241) in the heat insulating material composition was changed to 5 parts by mass. Produced.

[Example 3]
The heat insulating material was produced like Example 1 except having prepared and prepared the resin composition for heat insulating materials of the following composition.
<Composition of the resin composition for heat insulating materials>
Ethylene-vinyl acetate copolymer (manufactured by Sumitomo Chemical Co., Ltd., trade name: Evertate CV5053) 100 parts by mass Foaming agent (manufactured by Matsumoto Yushi Seiyaku Co., Ltd., trade name: 190D) 10 parts by weight Cross-linking agent (JSR (stock) Product name: OPSTAR JUA-702) 1 part by mass Formaldehyde deodorant (manufactured by Toagosei Co., Ltd., product name: Kesmon NS-241)
30 parts by mass

[Comparative Example 1]
A heat insulating material was produced in the same manner as in Example 1 except that the foaming agent used in the resin composition for heat insulating material was changed to azodicarbonamide (Eiwa Kasei Co., Ltd.).

[Comparative Example 2]
A heat insulating material was produced in the same manner as in Example 1 except that the adsorbent used in the resin composition for heat insulating material was changed to an inorganic adsorbent (trade name: Mizusuka Sieves manufactured by Mizusawa Chemical Industry Co., Ltd.).

[Evaluation]
(Formaldehyde deodorization performance test)
A heat insulating material test piece (1 cm × 1 cm × 10 mm thickness) was inserted into a Tedlar bag having an internal capacity of 30 (L), and 20 L of synthetic air (volume ratio of nitrogen and oxygen N ₂ / O ₂ : 4/1, RH 50%) Were fed into the Tedlar bag, and formaldehyde was fed into the Tedlar bag to generate a gas so that the formaldehyde concentration in the Tedlar bag was 80 ppm. The formaldehyde concentration was measured immediately after gas injection and after storage for 30 minutes in the dark. The formaldehyde concentration in the Tedlar bag was measured with a detector tube. The formaldehyde concentration after 30 minutes is 70 ppm or more, “1”, 69 ppm to 60 ppm in the range “2”, 59 ppm to 50 ppm in the range “3”, 49 ppm to 20 ppm in the range “4”, less “5”. As a result, Examples 1 to 3 had a capacity of “5” and Comparative Examples 1 and 2 had a capacity of “2”.

(Thermal conductivity)
When heat conductivity was measured about the heat insulating material of Examples 1-3 and Comparative Examples 1-2, all showed the heat conductivity of about 40 mW / (m * K).
The thermal conductivity was measured by a stationary method-heat flow meter method using a thermal conductivity measuring device manufactured by Eihiro Seiki Co., Ltd. At this time, the heat insulating material sample was cut into an arbitrary size, and the sample was placed between the plates set at 10 ° C. and 30 ° C. and measured.

(Insulation pore shape)
FIG. 6 is a photograph obtained by magnifying and observing a cross-sectional view of the heat insulating material in Example 1 with an optical microscope. As shown in FIG. 6, it has confirmed that the pore of the heat insulating material in Example 1 was comprised by the independent hole.

DESCRIPTION OF SYMBOLS 1 ... Heat insulating material 2 ... Resin 3 ... Organic adsorbent 4 ... Foaming agent 10 ... Heat insulating material 11 ... Pore 11a ... Independent hole

Claims (5)

Resin composition for thermal insulation containing at least one resin of polyethylene and ethylene-vinyl acetate copolymer, an organic adsorbent having an aldehyde adsorbing ability, and a foaming agent that does not inhibit the aldehyde adsorbing ability of the organic adsorbent A preparation process to prepare,
A molding step of molding the heat insulating resin composition into a predetermined shape;
A foaming step of forming a heat insulating material composed of a resin foam having pores by foaming the resin composition for heat insulating material;
The manufacturing method of the heat insulating material characterized by having.   After the molding step and before the foaming step, an electron beam irradiation step of crosslinking the heat insulating material resin composition by irradiating the molded resin composition for heat insulating material with an electron beam. The manufacturing method of the heat insulating material of Claim 1 characterized by the above-mentioned. At least one resin of polyethylene and ethylene-vinyl acetate copolymer;
An organic adsorbent having aldehyde adsorption capacity;
A foaming agent that does not hinder the aldehyde adsorption ability of the organic adsorbent;
A resin composition for a heat insulating material, comprising: A heat insulating material composed of a resin foam having pores,
A heat insulating material comprising an at least one resin of polyethylene and an ethylene-vinyl acetate copolymer, and an organic adsorbent having an aldehyde adsorbing ability.   The heat insulating material according to claim 4, wherein the pores are constituted only by independent holes.