JP2015004752A - Reflection type display apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a reflection type display apparatus capable of suppressing a moire phenomenon without a precise alignment between a barrier pattern and a pixel electrode pattern.SOLUTION: A reflection type display apparatus is configured so that a display medium including at least one sort of electrically responsive material is sealed between two opposite substrates. One of the substrates has light permeability, and between the substrate and the other substrate are provided a plurality of pixel electrodes aligned in a periodic pattern and a plurality of electrode structures corresponding to the plurality of electrodes in this order from the substrate toward the other substrate. At least part of wiring corresponding to the electrode structures is provided in areas between the pixel electrodes in the view from the substrate side to the other substrate side.

Description

  The present invention relates to a reflective display device applied to electronic paper and the like.

  Recently, as a reflective display device, an electrophoretic display device using an electrophoretic material as an electroresponsive material contained in a display medium has been widely used. An electrophoretic display device is a device that displays information by using electrophoretic migration, that is, particle movement, of an electrophoretic body (usually electrophoretic particles) in air or in a solvent. In general, an electrophoretic state is controlled by applying an electric field between two substrates, thereby realizing a desired display. As the electrophoretic body, charged powder as well as charged particles can be used. In that case, the charged powder electrophoreses in the gas.

  In recent years, the electrophoretic display device has attracted attention especially as an electronic paper. When applied as an electronic paper, it is possible to enjoy advantages such as visibility at the printed matter level (easy for eyes), ease of information rewriting, low power consumption, and light weight.

  However, in an electrophoretic display device, display defects, particularly a decrease in contrast, may occur due to sedimentation or uneven distribution of particles or powder. In order to prevent this phenomenon, it is used to form partition walls between the upper and lower electrode substrates and divide the migration space of the particles and powder to be electrophoresed, that is, the movement space into minute spaces. This minute space is called a cell. In each cell, ink or gas (display medium) containing an electrophoretic body is enclosed. For example, Patent Document 1 (Japanese Patent Laid-Open No. 2005-24868) and Patent Document 2 (Japanese Patent Publication No. 2011-524548) disclose conventional examples of such an electrophoretic display device.

Japanese Patent Laid-Open No. 2005-24868 Special table 2011-524548 gazette

  The present inventor has obtained the following knowledge while earnestly researching the reflective display device that observes the other substrate through the partition wall from the one substrate side.

  In the reflective display device as described above, a common translucent electrode that covers at least the display region, a partition wall that partitions a plurality of cells, and a periodic pattern are arranged between one substrate and the other substrate. The plurality of pixel electrodes formed are provided in this order when viewed from the one substrate side toward the other substrate side. And the desired display is implement | achieved by controlling the electrophoretic state of the electroresponsive material contained in a display medium for every cell. The pattern of the pixel electrode is a matrix-like periodic alignment pattern that generally forms a rectangle as a whole. In general, the partition walls are also formed in a pattern having periodicity.

  For this reason, in a reflective display device in which the partition pattern and the pixel electrode pattern are not precisely aligned, a moire phenomenon appears and display unevenness occurs. In particular, when manufacturing a high-definition and large-screen reflective display device, it is necessary to perform alignment with higher accuracy.

  The present invention has been made based on such circumstances, and an object of the present invention is to suppress the occurrence of the moire phenomenon without requiring precise alignment between the partition pattern and the pixel electrode pattern. The object is to provide a reflective display device.

  In the present invention, a display medium containing at least one kind of electrically responsive material is sealed between two opposing substrates each having an electrode formed thereon, and a predetermined electric field is applied between the two substrates. A reflective display device in which the display medium displays a desired display when the one of the substrates is translucent, and at least a display region is provided between the one substrate and the other substrate. A common translucent electrode covering the plurality of cells, partition walls partitioning a plurality of cells, a plurality of pixel electrodes arranged in a periodic pattern, and a plurality of electrode structures corresponding to the plurality of pixel electrodes, In the order from the substrate side toward the other substrate side, and in the region between the pixel electrodes as viewed from the one substrate side toward the other substrate side. At least part of the wiring for the electrode structure is arranged The light reflection characteristics of the pixel electrodes and the light reflection characteristics of the wirings arranged in the region between the pixel electrodes when viewed from the one substrate side toward the other substrate side. Are reflective display devices characterized by being substantially the same.

  According to the present invention, since the wiring having the light reflection characteristic substantially the same as the light reflection characteristic of the pixel electrode is arranged in the area between the pixel electrodes, the light reflection characteristic of the pixel electrode and the area between the pixel electrodes are The light reflection characteristics are substantially the same, and the visibility of the period of the pixel electrode pattern viewed from the one substrate side toward the other substrate is reduced. Thereby, the expression of the moire phenomenon is suppressed.

  Preferably, an insulating film is provided on the one substrate side of the wiring disposed in the region between the pixel electrodes, and the insulating film has a light transmittance of 90% or more. In this case, the insulating film can sufficiently transmit light reflected by the wiring arranged in the region between the pixel electrodes. Therefore, the light reflection characteristic of the region between the pixel electrodes where the insulating film is arranged on the wiring can be substantially the same as the light reflection characteristic of the wiring itself arranged in the region between the pixel electrodes.

  Preferably, the pixel electrode and the wiring arranged in a region between the pixel electrodes are formed of the same material. In this case, it is easy to make the light reflection characteristics of the pixel electrodes substantially the same as the light reflection characteristics of the region between the pixel electrodes.

  For example, the electrode structure is a TFT electrode structure, and the wiring arranged in the region between the pixel electrodes is electrically connected to a data wiring and / or a gate electrode electrically connected to a source / drain electrode. Scan wiring connected to the.

  Preferably, the partition is formed in a pattern that does not generate moire fringes with respect to the periodic pattern of the pixel electrodes. In this case, the occurrence of the moire phenomenon is remarkably suppressed. For example, the partition is formed in an aperiodic pattern.

  Alternatively, in the present invention, a display medium containing at least one or more kinds of electrically responsive materials is sealed between two opposing substrates on which at least one has translucency and each electrode is formed. A method of manufacturing a reflective display device in which the display medium displays a desired display when a predetermined electric field is applied between the two substrates, and has a light-transmitting property and at least displays A partition forming step of forming a partition for partitioning a plurality of cells on the common transparent electrode of one substrate on which a common transparent electrode covering the region is formed, and a plurality of electrodes on the other substrate An electrode structure forming step of forming a structure, a pixel electrode forming step of forming a plurality of pixel electrodes corresponding to the plurality of electrode structures in a periodic pattern on the plurality of electrode structures, the one substrate and the other Before the other board A counter substrate arrangement step of arranging the top surface of the partition wall and the pixel electrode of the other substrate to face each other, and in the electrode structure formation step, at least a part of the wiring for the electrode structure includes: It is formed so as to be arranged in a region between pixel electrodes when viewed from the one substrate side toward the other substrate side, and in a direction from the one substrate side toward the other substrate side. As a result, the light reflection characteristic of the pixel electrode and the light reflection characteristic of the wiring arranged in the region between the pixel electrodes are substantially the same.

  According to the present invention, since the wiring having the light reflection characteristic substantially the same as the light reflection characteristic of the pixel electrode is arranged in the area between the pixel electrodes, the light reflection characteristic of the pixel electrode and the light in the area between the pixel electrodes are arranged. The reflection characteristics are substantially the same, and the visibility of the period of the pixel electrode pattern viewed from the one substrate side toward the other substrate is reduced. Thereby, the expression of the moire phenomenon is suppressed.

  Alternatively, in the present invention, a display medium containing at least one or more kinds of electrically responsive materials is sealed between two opposing substrates on which at least one has translucency and each electrode is formed. A method of manufacturing a reflective display device in which the display medium displays a desired display when a predetermined electric field is applied between the two substrates, wherein the one substrate has translucency An electrode structure forming step of forming a plurality of electrode structures on the other substrate so as to face a common translucent electrode formed so as to cover at least the display region, and the plurality of electrode structures on the plurality of electrode structures A pixel electrode forming step of forming a plurality of pixel electrodes corresponding to the electrode structure in a periodic pattern, and after the pixel electrode forming step, on the side of the other substrate on which the pixel electrode is formed, Bulkhead partitioning multiple cells A partition forming step to be formed, and the one substrate and the other substrate are arranged so that the translucent electrode of the one substrate faces the top surface of the partition of the other substrate And in the electrode structure forming step, at least a part of the wiring for the electrode structure is between pixel electrodes when viewed in a direction from the one substrate side toward the other substrate side. The pixel electrode is formed so as to be disposed in a region and viewed in a direction from the one substrate side toward the other substrate side, and the light reflection characteristic of the pixel electrode and the region disposed between the pixel electrodes This is a reflection type display device manufacturing method characterized in that the light reflection characteristics of the wiring are substantially the same.

  According to the present invention, since the wiring having the light reflection characteristic substantially the same as the light reflection characteristic of the pixel electrode is arranged in the area between the pixel electrodes, the light reflection characteristic of the pixel electrode and the light in the area between the pixel electrodes are The reflection characteristics are substantially the same, and the visibility of the period of the pixel electrode pattern viewed from the one substrate side toward the other substrate is reduced. Thereby, the expression of the moire phenomenon is suppressed.

  Preferably, the electrode structure forming step includes an insulating film forming step of forming an insulating film on the wiring arranged in a region between the pixel electrodes, and the insulating film has a light transmittance of 90%. That's it. In this case, the insulating film can sufficiently transmit light reflected by the wiring arranged in the region between the pixel electrodes. Therefore, the light reflection characteristic of the region between the pixel electrodes where the insulating film is arranged on the wiring can be substantially the same as the light reflection characteristic of the wiring itself arranged in the region between the pixel electrodes.

  Preferably, the pixel electrode and the wiring disposed in the region between the pixel electrodes are formed of the same material. In this case, it is easy to make the light reflection characteristics of the pixel electrodes substantially the same as the light reflection characteristics of the region between the pixel electrodes.

  For example, the electrode structure is a TFT electrode structure, and the wiring arranged in the region between the pixel electrodes is electrically connected to a data wiring and / or a gate electrode electrically connected to a source / drain electrode. Scan wiring connected to the.

  Preferably, the partition is formed in a pattern that does not generate moire fringes with respect to the periodic pattern of the pixel electrodes. In this case, the occurrence of the moire phenomenon is remarkably suppressed. For example, the partition is formed in an aperiodic pattern.

  ADVANTAGE OF THE INVENTION According to this invention, the reflection type display apparatus which can suppress the expression of a moire phenomenon without requiring precise alignment with the pattern of a partition and the pattern of a pixel electrode can be provided.

FIG. 1 is a cross-sectional view schematically showing a configuration of a reflective display device according to an embodiment of the present invention. FIG. 2 is a flowchart schematically showing a manufacturing method of the reflective display device according to the embodiment of the present invention. FIG. 3 is a diagram schematically showing an example of the partition wall forming step. FIG. 4 is a diagram illustrating an example of a partition pattern. Specifically, FIG. 4A is a diagram showing a honeycomb-shaped periodic pattern in which hexagonal unit patterns are regularly arranged, and FIG. 4B is a diagram showing regular rectangular unit patterns. FIG. 4C illustrates a non-periodic pattern in which moire fringes are not generated with respect to the matrix-shaped periodic pattern of pixel electrodes. It is a figure which shows a pattern. FIG. 5 is a diagram for explaining the definition of the width of the top surface of the partition wall. FIG. 6 is a diagram schematically showing an example of the adhesive layer forming step. FIG. 7 is a diagram schematically showing an example of the display medium arranging step. FIG. 8 is a schematic view for explaining the function of the conductive paste. FIG. 9 is a plan view showing pixel electrodes arranged in a matrix-like periodic pattern on the other substrate. FIG. 10 is a cross-sectional view schematically showing a pixel electrode and a TFT electrode structure corresponding to the pixel electrode. FIG. 11 is a diagram for explaining the mechanism of the occurrence of the moire phenomenon. FIG. 12 is a diagram for explaining a mechanism for suppressing the occurrence of the moire phenomenon according to the present invention. FIG. 13 shows a structure of a TFT electrode structure that can be employed in an electrode structure according to an embodiment of the present invention, a material on one side where one substrate of data wiring and scan wiring for the TFT electrode structure is disposed, It is a figure which shows the example of the combination of the material by which the board | substrate of one side of a pixel electrode is arrange | positioned, the material of a semiconductor, and the material of the gate insulating film and passivation layer as an insulating film. FIG. 14 is a diagram for explaining the positional relationship between the pixel electrode and the wiring for the electrode structure, as viewed from the pixel electrode side toward the other substrate side. Specifically, FIG. 14A is a plan view schematically showing a pixel electrode formed on the electrode structure, and FIG. 14B is a partially enlarged view of FIG. It is a figure for demonstrating the relationship between the width | variety of the area | region between electrodes, and the width | variety of the wiring arrange | positioned at the area | region between the said pixel electrodes. FIG. 15 is a cross-sectional view showing a state where the other substrate is bonded to the partition wall top surface of one substrate in the counter substrate arranging step. FIG. 16 is a diagram for explaining the arrangement relationship between the pixel electrode and the wiring for the electrode structure when viewed from the one substrate side toward the other substrate side in the display panel according to the comparative example of the present invention. FIG.

  FIG. 1 is a cross-sectional view schematically showing a configuration of a reflective display device according to an embodiment of the present invention. In the reflective display device according to this embodiment, at least one kind of electrically responsive material is provided between two opposing substrates 11 and 16 on which at least one has translucency and each electrode is formed. The display medium 13 is enclosed, and the display medium 13 displays a desired display when a predetermined electric field is applied between the two substrates 11 and 16. Here, in the specification and claims of the present application, “translucent” means a property of transmitting light. In this embodiment mode, the substrate disposed on the viewing side has a light-transmitting property such that the total light transmittance is 50% or more, preferably 80% or more, and more preferably 90% or more.

  In FIG. 1 to FIG. 16, electrodes are provided on the surface of one substrate 11, but these electrodes are not shown. In the present embodiment, one substrate 11 is disposed on the viewing side, and the other substrate 16 is disposed on the non-viewing side.

  One substrate 11 includes a light-transmitting film such as polyethylene (PE), polyethylene terephthalate (PET), polyethersulfone (PES), polyethylene naphthalate (PEN), or light-transmitting glass, and indium tin oxide (ITO). ), Zinc oxide (ZnO), tin oxide (SnO), or the like having a translucent electrode (translucent electrode) so as to cover the display region of at least one substrate 11 is typically used. obtain. Here, the “display area” refers to an area used for desired display in the reflective display device.

  The translucent electrode can be formed by a coating method, sputtering, a vacuum deposition method, a CVD method, or the like. In this embodiment, the translucent electrode is formed as a common electrode for active matrix driving.

  The thickness of one substrate 11 is preferably 10 μm to 1 mm. If it is thinner than 10 μm, the strength as a panel cannot be obtained and the risk of breakage increases. On the other hand, if it is thicker than 1 mm, the panel weight becomes too heavy and the handling becomes inconvenient and the cost also increases. Because. A suitable thickness range that is difficult to break and easy to handle is about 50 μm to 300 μm.

  One substrate 11 can be applied in either a roll shape or a sheet shape.

  As the other substrate 16, a substrate such as a resin film, a resin plate, glass, epoxy glass (glass epoxy) or the like can be used. The other substrate 16 may be a translucent base material. Furthermore, it may be an opaque base material that is translucent, but an opaque glass base material, resin film, resin plate, glass, epoxy glass with the other surface different from the electrode surface roughened. (Garaepo) or the like can be used. In the present embodiment, since the other substrate 16 is disposed at a position opposite to the viewing side, there is no necessity of having translucency. However, when the same physical properties as the one substrate 11 such as thermal expansion characteristics are required, a light-transmitting member similar to the one substrate 11 can be used.

  In a later step, a plurality of pixel electrodes 161 and an electrode structure 163 corresponding to the plurality of pixel electrodes are provided on the surface of the other substrate 16 on the display medium side. In the present embodiment, the electrode structure 163 is an electrode structure corresponding to a TFT (Thin Film Transistor) layer for active matrix driving.

  The thickness of the other substrate 16 is preferably 10 μm to 1 mm, similarly to the thickness of the one substrate 11. If it is thinner than 10 μm, the strength as a panel cannot be obtained and the risk of breakage increases. On the other hand, if it is thicker than 1 mm, the panel weight becomes too heavy and the handling becomes inconvenient and the cost also increases. Because. A suitable thickness range that is difficult to break and easy to handle is about 50 μm to 300 μm.

  The other substrate 16 can be applied in either a roll shape or a sheet shape.

<Method for manufacturing reflective display device>
FIG. 2 is a flowchart schematically showing a manufacturing method of the reflective display device according to the embodiment of the present invention.

  FIG. 3 is a diagram schematically showing an example of the partition wall forming step. As shown in FIG. 3, first, a partition wall 12 is formed on the upper surface of one substrate 11 generally placed in a horizontal direction by, for example, photolithography (exposure by ultraviolet (UV) irradiation → development → firing). The The partition wall 12 is a member that defines a plurality of cells to be described later.

  The partition wall 12 can be composed of an ultraviolet curable resin, a thermosetting resin, a room temperature curable resin, or the like. As a method for forming the partition wall 12, a mold transfer method such as embossing can be adopted in addition to the photolithography method. Further, a method of manufacturing a structure having a desired pattern as a partition and sticking the structure to one substrate 11 may be employed. The partition wall 12 may be formed on the pixel electrode 161 described later.

  In the present embodiment, the partition walls 12 are formed in a honeycomb-like periodic pattern in which hexagonal unit patterns as shown in FIG. 4A are regularly arranged. Of course, other shapes can be adopted as the pattern of the partition wall 12, for example, a square lattice periodic pattern in which rectangular unit patterns as shown in FIG. 4B are regularly arranged. Also good. Further, the pattern of the partition wall 12 may be a non-periodic pattern as shown in FIG. 4C, that is, a pattern that does not cause a moiré phenomenon with respect to a periodic pattern of a pixel electrode 161 described later. . Here, as a specific example of the non-periodic pattern of the partition walls 12, for example, a pattern of the partition walls 12 in which the plurality of cells partitioned by the partition walls 12 are different from each other. In this case, the shape may be different for all the cells, or the shape may be different for only some of the cells. In addition, the method of changing the cell shape may or may not have periodicity.

  The width of the top surface of the partition wall 12 is 9 μm to 50 μm, preferably 9 μm to 20 μm. 9 μm is the lower limit of the line width at which the partition wall 12 can be patterned without falling down. When the width of the top surface of the partition wall 12 is less than 9 μm, in a pattern in which the length of the partition wall 12 is 60 μm or more, at least a part of the partition wall 12 falls, peels off, or the separated partition wall 12 moves over the substrate. Or move. In that case, the function of preventing the movement of particles by the partition wall 12 is lost, and the display quality is deteriorated. On the other hand, the upper limit of 50 μm, which is the upper limit of the preferred range, is an upper limit at which the partition wall 12 is not too conspicuous when visually observed.

  Here, the definition of the width of the top surface of the partition wall 12 is shown in FIG. If the corners of the top surface are not rounded, the width of the top surface is defined as it is, as shown in FIGS. 5 (a) and 5 (b). On the other hand, when the corner of the top surface is rounded, it is understood as the width between the intersection lines of the extended surface of the top surface and the extended surface of the wall surface, as shown in FIG. 5 (c) and FIG. 5 (d). The As a measuring method for evaluation, one substrate 11 on which the partition wall 12 was formed was embedded in a curable resin, and a cross section of the partition wall 12 was cut out by a microtome (Daiwa Kogyo Kogyo Co., Ltd .: FX-801). Each width can be measured based on an image taken by a scanning electron microscope (SEM).

  The thickness of the partition wall 12 is 5 to 50 μm, preferably 10 to 50 μm. If the thickness is 5 μm or less, the amount of ink to be filled is small and sufficient display characteristics, particularly contrast, cannot be obtained. From the viewpoint that good display characteristics can be obtained at a low driving voltage, a thickness in the range of 10 to 50 μm is preferable.

  The cell aperture ratio is preferably 70% or more, and particularly preferably 90% or more. The higher the aperture ratio, the wider the displayable area, so that high contrast can be obtained.

  Next, the adhesive layer 22 is formed on the partition wall 12 (adhesive layer forming step: step (2) in FIG. 2). In this adhesive layer forming step, a thermoplastic resin such as a polyester-based thermoplastic adhesive is formed with a thickness of 1 μm to 100 μm by, for example, a transfer method or a printing method. Preferably, it is formed with a thickness of 1 μm to 50 μm, particularly preferably with a thickness of 1 μm to 20 μm.

  Supplementing a specific description of an example of a typical thermal transfer method as a transfer method, as shown in FIG. 6, for example, a polyester-based thermoplastic adhesive having a thickness of 20 μm on a PET film as a substrate 21. A transfer sheet 20 on which an adhesive 221 is formed is prepared. Next, the transfer sheet 20 is arranged to face the one substrate 11 so that the surface of the adhesive 221 is arranged on the top surface of the partition wall 12 of the one substrate 11. In this state, one substrate 11 and the transfer sheet 20 are laminated at a normal temperature and a pressure of 1 kPa. After laminating, one substrate 11 was oriented such that the end of the partition wall 12 on the one substrate 11 side was positioned higher than the top surface of the partition wall 12 on the side opposite to the one substrate 11. In this state, the one substrate 11 and the transfer sheet 20 are heated for one minute at a temperature higher than the softening point or melting point of the adhesive 221. Thereby, the adhesive layer 22 is formed on the partition wall 12.

  As the adhesive 221 for forming the adhesive layer 22, an adhesive using a thermoplastic material is preferable. It has a property of softening by heating and solidifying when cooled, and is plastic when repeated cooling and heating. Is a material that is reversibly maintained.

  When an adhesive made of a thermoplastic material is used as an adhesive layer, the adhesive 221 solidified on the transfer sheet substrate 21 is softened by heating to a temperature exceeding its softening point or melting point, The adhesive 221 can be reliably thermally transferred only to the top surface of the partition wall. Further, since the adhesive 221 after thermal transfer is cooled to room temperature and solidified again, tackiness, i.e., stickiness, is eliminated. Further, since there is no tack, that is, stickiness, the display medium 13 filled in the cell does not adhere to the adhesive 221. The adhesive 21 on the top surface of the partition wall is again heated to a temperature exceeding its softening point or melting point to be softened, so that it has tackiness, that is, stickiness, so that it is securely bonded to the other substrate 16. The Since the adhesive 221 after being bonded to the other substrate 16 is not tacked again at room temperature, that is, has no stickiness, the display medium 13 is not bonded to the adhesive 221 again, and the display quality may be deteriorated. Nor.

  Specifically, thermoplastic base polymers such as ethylene-vinyl acetate copolymer, polyester, polyamide, polyolefin, polyurethane, natural rubber, styrene-butadiene block copolymer, styrene-isoprene block copolymer, styrene-ethylene. A resin mainly composed of a thermoplastic elastomer such as a butylene-styrene block copolymer or a styrene-ethylene-propylene-styrene copolymer, and a tackifier resin or a plasticizer is mainly used.

  In order to improve the adhesion between the partition wall 12 and the adhesive 221, the partition wall 12 may be subjected to a surface treatment by ultraviolet irradiation, plasma treatment, or the like, or a primer may be formed. Alternatively, a silane coupling agent may be added to the adhesive 221.

  Next, the ink 13 as a display medium is placed on one substrate 11 (display medium placement step: step (3) in FIG. 2). FIG. 7 is a diagram schematically showing an example of the display medium arranging step. Here, (1) the ink 13 is dropped from the dispenser 31 or inkjet or die coat (ink dropping step), and (2) the ink 13 is made uniform in the surface by the applicator 32 or doctor blade, doctor knife, and central squeegee. It is applied (ink application process). The ink 13 may be disposed on one substrate 16.

  As the display medium 13, a display medium containing at least one or more kinds of electrically responsive materials can be used. Examples of the electroresponsive material include a charged particle material and a liquid crystal material, and the charged particle material includes a so-called electrophoretic material in which colored particles such as white, black, and color move in response to an electric field, or two particles. There are materials typified by twist balls that are color-coded and rotated by an electric field, or nanoparticle materials that move by an electric field. On the other hand, the liquid crystal material includes a material for electrically controlling transmission and scattering known as PDLC (Polymer Dispersed Liquid Crystal), a material in which a liquid crystal is mixed with a dye, a cholesteric liquid crystal material, and the like. These materials that have electrical responsiveness and change optical characteristics need to be isolated into cells regardless of the type, and are subject to application of the present invention.

  Returning to FIG. 2, after the display medium placement step, a conductive paste application step is performed (conductive paste application step: step (4) in FIG. 2). FIG. 8 is a schematic view for explaining the function of the conductive paste. The conductive paste 14 is a metal paste such as a silver paste, and is applied to a predetermined position by, for example, a dispenser 41 or ink jet, tampo printing, pad printing, or stacking printing. As shown in FIG. 8, the conductive paste 14 functions as a wiring for applying a voltage to the other substrate 16. When a predetermined electric field (voltage) is applied between the translucent electrode of one substrate 11 and the pixel electrode 161 of the other substrate 16, the electrically responsive material in the ink 13 which is a display medium is driven, and the characters Desired information such as a pattern is displayed. Thereafter, even if the electric field is no longer applied, the information display state is maintained until a new electric field is applied between the two substrates.

  Next, a plurality of electrode structures 163 are formed on the other substrate 16 (electrode structure forming step: step (5) in FIG. 2), and the plurality of electrode structures 163 are corresponding to the plurality of electrode structures 163. A plurality of pixel electrodes are formed (pixel electrode forming step: step (6) in FIG. 2). The electrode structure 163 of this embodiment is a TFT electrode structure. The pixel electrode 161 is formed in a matrix-like periodic pattern as shown in FIG.

  More specifically, as shown in FIG. 10, the TFT electrode structure 163 corresponding to the active matrix driving TFT layer on the other substrate 16 corresponds to the matrix pattern of the pixel electrode 161 shown in FIG. The whole is formed in a matrix. Each TFT electrode structure 163 has a source / drain electrode and a gate electrode. A data wiring is electrically connected to the source / drain electrode, and a scan wiring 169 is electrically connected to the gate electrode. It is connected to the.

  In this embodiment mode, the arrangement of the pixel electrode 161, the data wiring 168, and the scan wiring 169 and the material of the pixel electrode 161, the data wiring 168, the scan wiring 169, and the insulating films 164a and 164b suppress the occurrence of the moire phenomenon. To be decided. Here, with reference to FIGS. 11 and 12, the arrangement of the pixel electrode 161, the data wiring 168, and the scan wiring 169, and the pixel electrode 161, the data wiring 168, and the like for effectively suppressing the occurrence of the moire phenomenon. The materials of the scan wiring 169 and the insulating films 164a and 164b will be described. In this embodiment, the insulating film 164a is a gate insulating film, and the insulating film 164b is a passivation layer.

  FIG. 11 is a diagram for explaining the mechanism of the occurrence of the moire phenomenon. According to the knowledge obtained by the present inventor, the moire phenomenon has the following two periodic patterns when viewed from one substrate 11 side toward the other substrate side 16 as shown in FIG. Generated by being visually recognized. The first pattern is visually recognized corresponding to the periodic pattern of the partition walls 12 or, when the partition walls 12 are formed of a material having a high light transmittance, corresponding to the partition walls 12 formed of the periodic pattern. It is the periodic pattern of the high transmittance part with high light transmittance. Further, the second pattern is because the light reflection characteristics of the pixel electrodes 161 periodically arranged on the insulating film 164 of the other substrate 16 are significantly different from the light reflection characteristics of the region between the pixel electrodes 161. It is a pattern of a periodic change of the light reflection characteristic that is visually recognized. That is, when the first pattern and the second pattern overlap with each other with different periods and rotational deviations, periodic shading occurs when viewed from the one substrate 11 side, which is the cause of the occurrence of the moire phenomenon. It is thought that.

  Therefore, as shown in FIG. 12, the difference in the light reflection characteristics between the region where the pixel electrode 161 is formed and the region between the pixel electrodes 161 is reduced, and the periodic light reflection is performed on the other substrate 16. If the formation of the characteristic change pattern is suppressed, the occurrence of the moire phenomenon is considered to be suppressed.

  In the present embodiment, in order to suppress the occurrence of the moire phenomenon, the light reflection characteristics of the pixel electrode 161 and the region between the pixel electrodes 161 when viewed from the one substrate 11 side toward the other substrate 16 side. The arrangement of the pixel electrode 161, the data line 168, and the scan line 169, and the material of the pixel electrode 161, the data line 168, the scan line 169, and the insulating films 164a and 164b are set so that the light reflection characteristics are substantially the same. It is determined according to the structure of the TFT electrode structure 163 and the material of the semiconductor 165 used for the TFT electrode structure 163.

  Here, in the present embodiment, the light reflection characteristic is an average reflectance. The average reflectance can be measured, for example, using a near-infrared microspectrophotometer (Olympus: USPM-RU-W). In the present embodiment, with respect to light within a wavelength range of 400 nm to 800 nm, the reflectance of each wavelength of light having different wavelengths by 10 nm is measured for each wavelength of light, and the obtained measurement values are obtained. The average value is defined as the average reflectance of the object. Similarly, with respect to two objects, the reflectance of each object of various wavelengths of light having a wavelength range of 400 nm to 800 nm and different wavelengths by 10 nm is measured for each wavelength of light, and the same wavelength. The absolute value of the difference in reflectance between the two objects is obtained for each light, and the average value of the obtained absolute values is defined as the difference in average reflectance between the two objects. When the difference in average reflectance is within 30%, the light reflection characteristics of the two objects are evaluated to be substantially the same.

  The structure of the TFT electrode structure 163, the material on which the one substrate 11 of the data wiring 168 and the scan wiring 169 for the TFT electrode structure 163 is disposed, and the side on which the one substrate 11 of the pixel electrode 161 is disposed. As a combination of the above material, the material of the semiconductor 165, and the material of the gate insulating film 164a and the passivation layer 164b as insulating films, for example, a combination as shown in FIG. 13 can be employed.

  The pixel electrode 161, the data line 168, and the scan line 169 may be formed by stacking a plurality of layers made of different metals from the other substrate 16 side toward the side where the one substrate 11 is disposed. In this embodiment mode, at least one of the pixel electrode 161, the data wiring 168, and the scan wiring 169 on which the substrate 11 is disposed is formed using the same material. As a result, the surface of the pixel electrode 161, the data wiring 168, and the scan wiring 169 on the side where the one substrate 11 is disposed has the same light reflection characteristics. Here, the meaning of the term “same material” includes not only a material whose constituent components are completely the same, but also a material having a slight difference in constituent components such as impurities if the main components are the same. To do.

  In this embodiment, the insulating films 164a and 164b are made of a material having a high light transmittance such that the combined light transmittance of the insulating films 164a and 164b is 90% or more.

  Here, the “light transmittance” refers to an average value of the rate at which light passes through the object from one side of the object toward the other side. The light transmittance can be measured, for example, using a near-infrared microspectrophotometer (Olympus: USPM-RU-W). In the present embodiment, with respect to light having a wavelength in the range of 400 nm to 800 nm, the ratio of light having various wavelengths that are different by 10 nm each passing through the object from one side to the other is determined for each wavelength light. The average value of the measured values obtained by measurement is defined as the light transmittance of the object.

  Below, the light transmittance of each material is the direction from the side where one substrate 11 of the material is arranged toward the other substrate 16 or the side where one substrate 11 is arranged from the other substrate 16 side. It is described as the light transmittance in the direction toward.

  By selecting a material having a high light transmittance as described above as the material of the insulating films 164a and 164b, the insulating film is viewed from the side where the one substrate 11 is disposed toward the other substrate 16 side. The lights 164a to 164b can sufficiently transmit light reflected from the data lines 168 to the scan lines 169. As a result, the light reflection characteristics of the region 166 between the pixel electrodes 161 in which the insulating films 164a and 164b are arranged on the data wiring 168 or the scan wiring 169 are substantially the same as the light reflection characteristics of the data wiring 168 and the scan wiring 169 itself. Become.

  In this embodiment mode, the pixel electrode 161, the data wiring 168, and the scan wiring 169 are arranged so that at least a part of the data wiring 168 and the scan wiring 169 extends from the pixel electrode 161 side to the other substrate 16 side. It is determined so as to be disposed in a region between the pixel electrodes 161 on the electrode structure 163 when viewed in the direction of the head. That is, as shown in FIGS. 14A and 14B, the pixel electrode 161, the data wiring 168, and the scan wiring 169 are arranged so that the edges of the adjacent pixel electrodes 161 facing each other are from the pixel electrode 161 side. When viewed in the direction toward the other substrate 16, the data wiring 168 or scan wiring 169 disposed below the edge is opposed to the edge, or the data wiring 168 or scan wiring 169 is opposed to the edge. It forms so that it may be located between parts. In the present embodiment, the width We of the region between the pixel electrodes 161 is about 5 μm, and the width Wd of the data wiring 168 and the width Ws of the scan wiring 169 are about 5 μm to 10 μm.

  As described above, the arrangement of the pixel electrode 161, the data wiring 168, and the scan wiring 169, and the material of the pixel electrode 161, the data wiring 168, the scan wiring 169, and the insulating films 164a and 164b are determined. The light reflection characteristics and the light reflection characteristics in the region between the pixel electrodes 161 are substantially the same, and the occurrence of moire is effectively suppressed.

  However, a gap may be formed between the pixel electrode 161 and the data line 168 or the scan line 169 when viewed from the pixel electrode 161 side toward the other substrate 16 side. In this case, if the width of the gap is about 5 μm, the occurrence of moire can be suppressed to a level that does not cause a practical problem.

  Further, the material on the side where the one substrate 11 of the pixel electrode 161, the data wiring 168, and the scan wiring 169 is not necessarily the same, and the direction from the pixel electrode 161 side toward the other substrate 16 side is not necessarily required. As shown in FIG. 3, the difference between the light reflection characteristics of the pixel electrode 161 and the light reflection characteristics of the region 166 between the pixel electrodes 161 in which the insulating films 164a to 164b are arranged on the data wiring 168 and the scan wiring 169 is the occurrence of moiré. However, different materials may be selected as long as the difference does not cause a practical problem. However, when the electrode structure 163 has a bottom contact structure, the material is limited to a material that can make ohmic contact with the semiconductor of the electrode structure 163. In the case where the electrode structure 163 is a top contact structure, the material can be selected without being restricted by stacking wirings.

  Thereafter, the adhesive layer 22 on the partition wall 12 and the other substrate 16 facing the one substrate 11 are bonded while extruding excess ink exceeding the cell volume in the partition wall 12 (opposing substrate placement step: FIG. Step 2 (6)). Thereby, the display medium (ink 13) is sealed in each cell. The positioning of the one substrate 11 and the other substrate 16 may not be performed by precisely adjusting the positional relationship between the pattern of the partition wall 12 and the pattern of the pixel electrode 16 using a microscope or the like. While aligning the alignment mark provided on one substrate 11 and the alignment mark provided on the other substrate 16 with the naked eye, that is, the pattern of the partition wall 12 and the pattern of the pixel electrode 16 It may be performed without precisely adjusting the positional relationship with.

  In the counter substrate bonding step, as shown in FIG. 15, the adhesive 221 transferred as the adhesive layer 22 is heated to obtain an adhesive force. Specifically, the partition wall 12 and the other substrate are softened by heating the adhesive 221 from the periphery to a temperature exceeding the softening temperature while applying a predetermined thermocompression bonding pressure (laminating pressure) by the laminator 91. 16 is bonded. However, other thermocompression bonding modes may be employed.

  Further, in the present embodiment, after bonding by the laminator 91, a four-side thermocompression bonding process is performed in which the four sides (peripheral portions) of both the substrates 11 and 16 are further thermocompression bonded. Specifically, a hot plate 92 is laid under the four sides (peripheral parts) of both substrates 11 and 16, and the lamination pressure is applied to the four sides of both substrates 11 and 16 with metal pieces 93 from the inside to the outside. Will be implemented.

  Thereafter, as shown in FIG. 2, the sheet is cut into a predetermined size by a cutting device 51 such as a guillotine, an upper blade slide device, a laser cutting device, or a laser cutter (cutting step: step (7) in FIG. 2) and desired reflection. The production of the mold display device is completed.

  According to the present embodiment, since the wirings 168 to 169 having substantially the same light reflection characteristics as the light reflection characteristics of the pixel electrode 161 are arranged in the region 166 between the pixel electrodes 161, the light reflection of the pixel electrode 161 is performed. The characteristics and the light reflection characteristics of the region 166 between the pixel electrodes 161 are substantially the same, and the visibility of the period of the pattern of the pixel electrode 161 when viewed from the one substrate 11 side toward the other substrate 16 side. Is reduced. Thereby, the expression of the moire phenomenon is suppressed.

  In addition, insulating films 164a and 164b are provided on one substrate 11 side of the wirings 168 to 169 arranged in the region 166 between the pixel electrodes 161, and the insulating films 164a and 164b have a light transmittance of 90. % Or more. Therefore, the insulating films 164a and 164b can sufficiently transmit the light reflected by the wirings 168 to 169 disposed in the region 166 between the pixel electrodes 161. Accordingly, the light reflection characteristics of the region 166 between the pixel electrodes 161 in which the insulating films 164a and 164b are disposed on the wirings 168 to 169 are the same as the light reflection of the wirings 168 to 169 themselves disposed in the region 166 between the pixel electrodes 161. It becomes almost the same as the characteristic.

  In addition, the wirings 168 to 169 arranged in the region 166 between the pixel electrode 161 and the pixel electrode 161 are formed of the same material. Thereby, it is easy to make the light reflection characteristics of the pixel electrodes 161 substantially the same as the light reflection characteristics of the region 166 between the pixel electrodes 161.

  Furthermore, if the partition walls 12 are formed in an aperiodic pattern, the occurrence of the moire phenomenon is remarkably suppressed.

  Next, practical examples actually performed will be described.

<Example of Reflective Display Device>
<Example 1>
As one substrate 11, an indium tin oxide (ITO) vapor deposition film (thickness 0.2 μm) is provided as a translucent electrode on one surface of a 300 mm × 400 mm × 0.1 mm thick PET substrate (Toyobo A4100). A prepared board was prepared. The translucent electrode is formed by a general film forming method such as sputtering, vacuum evaporation, or CVD, and in addition to indium tin oxide (ITO), zinc oxide (ZnO), tin oxide (SnO), etc. Can be formed.

Next, a negative photosensitive resin material (a dry film resist manufactured by DuPont MRC Dry Film Resist Co., Ltd.) is laminated on the one substrate 11 to a thickness of 20 μm and heated at 100 ° C. for 1 minute. Then, exposure is performed using an exposure mask (exposure amount: 500 mJ / cm ² ), and thereafter development using a 1% KOH aqueous solution is performed for 30 seconds, followed by baking at 200 ° C. for 60 minutes. A 20 μm partition wall 12 was formed. As the pattern of the partition walls 12, a honeycomb pattern (pitch: 300 μm) in which regular hexagonal unit patterns are regularly arranged is adopted.

  Then, a polyethylene terephthalate (PET) film 21 (manufactured by Teijin DuPont) having a thickness of 50 μm is used as the transfer film substrate 21, and a heat sealant 221 (Byron made by Toyobo) is used as the adhesive 221 for forming the adhesive layer 22. 630) was applied with a die coder with a thickness of 20 μm and dried. Thereby, a roll-shaped transfer sheet 20 having a 10 μm adhesive layer was produced. The softening temperature of the heat sealant 221 was about 110 ° C.

  Then, one substrate 11 was placed on the transfer sheet 20 with the surface on which the partition wall 12 was formed facing down, and was laminated at room temperature with a pressing force of about 1 kPa in this state. . Thereafter, the periphery of the heat sealant 221 was heated to a temperature exceeding its softening temperature, for example, about 130 ° C., and one substrate 11 was peeled from the transfer sheet 20 in that state. As a result, the heat sealant 221 was thermally transferred to the entire top surface of the partition wall 12. The height of the heat sealant 221 transferred to the top surface of the partition wall 12, that is, the height from the top surface of the partition wall 12 to the top of the heat sealant 221 was about 7 μm.

Subsequently, an ink 13 having the following components is used as a display medium, dropped from the dispenser 31, and squeezed with a central squeegee 32 (Neurong squeegee 1: made of urethane resin), and then in each cell. Filled. Excess ink that protruded in the substrate width direction was scraped off by another squeegee 33a, 33b (Nelogue Squeegee 2: made of urethane resin), and further wiped off by a roll wiper 34.
<Ink component>
・ Electrophoretic particles (titanium dioxide): 60 parts by weight ・ Dispersion liquid: 40 parts by weight

  Subsequently, a silver paste (manufactured by Fujikura Kasei Co., Ltd.) was spot-coated by a dispenser 41 on a part of the outer periphery of the partition wall pattern (2 mm × 2 mm square region).

Next, non-alkali glass (OA-10G manufactured by Nippon Electric Glass Co., Ltd.) having a size of 300 mm × 400 mm × thickness 0.5 mm is prepared as the other substrate 16. TFT electrode structure 163 corresponding to the TFT layer, data wiring 168 and scan wiring 169 for the TFT electrode structure 163, and pixel electrode 161 corresponding to the TFT electrode structure electrode structure 163 are as follows. Been formed.
<TFT electrode structure>
TFT electrode structure 163 structure: bottom gate / top contact structure Data wiring 168, scan wiring 169 and pixel electrode 161: From the other substrate 16 side to the side where one substrate 11 is disposed by sputtering. Formed to have three layers of Ti layer (thickness 10 nm) / Al layer (thickness 100 nm) / Ti layer (thickness 10 nm) in this order. Gate insulating film 164a: SiO ₂ film (thickness by sputtering) 200 nm, forming a light transmittance of 96%) - oxide semiconductor 165: by sputtering, an amorphous InGaZnO (thickness 20 nm) passivation layer 164b: by a sputtering method, a coating-type transparent ultraviolet curing on the SiO ₂ film A resin (ADEKA FX-V550) layer (thickness 4 μm, light transmittance 94%) is formed (gate insulating film 164a). 90% transmission in conjunction fine passivation layer 164b)

  Patterning was performed by a general photolithography method. In addition, the data wiring 168, the scan wiring 169, and the pixel electrode 161 are arranged in such a manner that the edge of the adjacent pixel electrode 161 facing each other when viewed from the one substrate 11 side toward the other substrate 16 side, and the pixel electrode It was formed so that there was no gap between the data line 168 or the scan line 169 arranged in the region 166 between the electrodes 161. Further, the pixel electrode 161 and the electrode structure 163 corresponding to the pixel electrode 161 are formed in a matrix-like periodic pattern in which 600 × 800 are arranged in the matrix direction.

  Then, in the atmosphere, the other substrate 16 is provided on the adhesive layer 22 on the partition wall 12 of the one substrate 11, and the alignment mark provided on the one substrate 11 and the other substrate 16 are provided. The alignment mark and the alignment mark were overlapped while being observed and matched with the naked eye. Then, while applying a constant thermocompression pressure with the laminator 91 to the one substrate 11 and the other substrate 16 that are superposed on each other, while extruding excess ink exceeding the cell volume in the partition wall 12, The partition wall 12 and the other substrate 16 were brought into close contact with each other.

  The temperature at the time of thermocompression bonding is preferably higher than the softening point or near the melting point of the heat sealant 221, and is 80 ° C. to 150 ° C., preferably 80 ° C. to 90 ° C., and in this example, 80 ° C. The thermocompression bonding pressure is preferably 0.01 MPa to 0.7 MPa, particularly preferably 0.1 MPa to 0.4 MPa, and 0.3 MPa in this example.

Thereafter, the sheet is cut into a predetermined size by the cutting device 51, and a UV curable resin (LCB-610, manufactured by E-Heat Sea Co., Ltd.) is applied to the periphery of both substrates 11 and 16 using a dispenser (not shown). Then, it was cured by exposure to ultraviolet rays (exposure amount 700 mJ / cm ² ) (peripheral sealing treatment). Thus, a display panel was produced.

  A near-infrared microspectrophotometer (Olympus: USPM-RU-W) is applied to the region where the pixel electrodes 161 of the display panel obtained as described above and the region 166 between the pixel electrodes 161 are formed. , The reflectance in the two regions of light of various wavelengths with different wavelengths by 10 nm was measured for light of each wavelength with respect to the light in the wavelength range of 400 nm to 800 nm. Then, when the average value of the obtained measurement values, that is, the average reflectance, was obtained for each region, the average reflectance of the region where the pixel electrode 161 was formed was 60%, and the region between the pixel electrodes 161 was The average reflectance of 166 was 50%. Further, the absolute value of the difference in reflectance for each light of the same wavelength in the region where the pixel electrode 161 is formed and the region 166 between the pixel electrodes 161 is obtained, and the average value of the obtained absolute values is calculated. The average of the absolute values, that is, the difference in average reflectance was within 20%. That is, the light reflection characteristics of the two regions are substantially the same.

  Then, the display quality of the display panel was evaluated, but there was no unevenness due to the moire phenomenon, and the display was uniform. This is because the data wiring 168 or the scanning wiring 169 disposed in the region 166 between the pixel electrodes 161 is viewed in the direction from the one substrate 11 side toward the other substrate 16 side. This is because the difference between the light reflection characteristics of the region 166 between the pixel electrodes 161 is reduced. That is, it is considered that the visibility of the pattern of the pixel electrode is reduced when viewed from the one substrate 11 side toward the other substrate 16 side by reducing the difference in the light reflection characteristics. It is done.

<Comparative Example 1>
In contrast to the first embodiment, the pixel electrode 161, the data line 168, and the scan line 169 are arranged like the data line 168 and the scan line 169 for the conventional pixel electrode 161 and the TFT electrode structure 163 shown in FIG. The data line 168 and the scan line 169 were formed so as to be mainly disposed below the pixel electrode 161, and the other steps were the same process, and the display panel was manufactured.

  The average reflectance of the region where the pixel electrode 161 of the display panel obtained as described above is formed, the average reflectance of the portion where the wiring is arranged in the region 166 between the pixel electrodes 161, and the two When the difference in the average reflectance of the region was measured, the average reflectance of the region where the pixel electrode 161 was formed was about 60%, and in the region 166 between the pixel electrodes 161, the portion where no wiring was arranged The average reflectance was about 15%, and the difference in average reflectance between the two regions was 50% or more. That is, the light reflection characteristics of the two regions were significantly different.

  And when the display quality was evaluated about the said display panel, the nonuniformity by a moire phenomenon generate | occur | produced. This is because the data wiring 168 and the scanning wiring 169 for the TFT electrode structure 163 are almost arranged in the region 166 between the pixel electrodes 161 when viewed from the one substrate 11 side toward the other substrate 16 side. This is probably because the difference between the light reflection characteristics of the pixel electrodes 161 and the light reflection characteristics of the region 166 between the pixel electrodes 161 was significant. That is, it is considered that the visibility of the periodic pattern of the pixel electrode 161 was high when viewed from the one substrate 11 side toward the other substrate 16 side due to the remarkable difference in the light reflection characteristics. It is done.

<Example 2>
Compared to the first embodiment, the data wiring 168 and the scan wiring 169 have two layers of Ti layer / Al layer in this order from the side of the other substrate 16 toward the side where the one substrate 11 is arranged. A display panel was manufactured in the same process except for the above.

  The average reflectance of the region where the pixel electrode 161 of the display panel obtained as described above is formed, the average reflectance of the portion where the wiring is arranged in the region 166 between the pixel electrodes 161, and the two When the difference in the average reflectance of the region was measured, the average reflectance of the region where the pixel electrode 161 was formed was about 60%, and in the region 166 between the pixel electrodes 161, the portion where no wiring was arranged The average reflectance was about 70%, and the difference in average reflectance between the two regions was within 10%. That is, the light reflection characteristics of the two regions are substantially the same.

  Then, when the display quality of the display panel was evaluated, the unevenness due to the moire phenomenon slightly occurred, but the visibility of the unevenness was low enough to cause no practical problem. This is because the material on the one substrate 11 side of the data wiring 168 and the scan wiring 169 for the electrode structure 163 is different from the material on the one substrate 11 side of the pixel electrode 161, but from the one substrate 11 side. This is because the wirings 168 to 169 reduce the difference between the light reflection characteristics of the pixel electrodes 161 and the light reflection characteristics of the region 166 between the pixel electrodes 161 when viewed in the direction toward the other substrate 16. it is conceivable that. That is, it is considered that the visibility of the pattern of the pixel electrode is reduced when viewed from the one substrate 11 side toward the other substrate 16 side by reducing the difference in the light reflection characteristics. It is done.

<Example 3>
Compared to the first embodiment, the data wiring 168 and the scanning wiring 169 for the electrode structure 163 are formed with a gap of 0.1 to 3 μm between the pixel electrode 161 and the data wiring 168 or the scanning wiring 169. A display panel was manufactured in the same process except for the above.

  The average reflectance of the region where the pixel electrode 161 of the display panel obtained as described above is formed, the average reflectance of the portion where the wiring is arranged in the region 166 between the pixel electrodes 161, and the two When the difference in the average reflectance of the region was measured, the average reflectance of the region where the pixel electrode 161 was formed was about 60%, and in the region 166 between the pixel electrodes 161, the portion where no wiring was arranged The average reflectance was about 40% to 50%, and the difference in average reflectance between the two regions was within 10%. That is, the light reflection characteristics of the two regions are substantially the same.

  Then, when the display quality of the display panel was evaluated, the unevenness due to the moire phenomenon slightly occurred, but the visibility of the unevenness was low enough to cause no practical problem. This is because the data wiring 168 or the scanning wiring 169 disposed in the region 166 between the pixel electrodes 161 is viewed in the direction from the one substrate 11 side toward the other substrate 16 side. This is because the difference between the light reflection characteristics of the region 166 between the pixel electrodes 161 is reduced. That is, it is considered that the visibility of the pattern of the pixel electrode is reduced when viewed from the one substrate 11 side toward the other substrate 16 side by reducing the difference in the light reflection characteristics. It is done.

<Example 4>
A partition panel 12 was formed in a non-periodic pattern as shown in FIG.

  The display quality of the display panel obtained as described above was evaluated, but there was no unevenness due to the moire phenomenon, and the display was more uniform than in Example 1. This is because, when viewed in the direction from the one substrate 11 side toward the other substrate 16 side, the visibility of the pattern of the pixel electrode is determined by the data wiring 168 or the scanning wiring 169 arranged in the region 166 between the pixel electrodes 161. In addition to the reduction, the partition wall 12 is formed in an aperiodic pattern, so that the pattern of the high transmittance portion formed by the partition wall 12 having a high light transmittance is also an aperiodic pattern. It is thought that.

11 One substrate 12 Partition 13 Ink (display medium)
14 conductive paste 16 other substrate 161 pixel electrode 163 electrode structure 164a insulating film 164b insulating film 166 region between pixel electrodes 20 transfer sheet 21 PET film 22 adhesive layer 221 heat sealant 31 dispenser 32 applicator 33a squeegee 33b squeegee 34 roll wiper 51 Cutting device 91 Laminator 92 Hot plate 93 Metal piece

Claims (4)

When a display medium including at least one kind of electrically responsive material is sealed between two opposing substrates on which electrodes are formed, and when a predetermined electric field is applied between the two substrates, A reflective display device in which a display medium displays a desired display,
One substrate has translucency,
A common translucent electrode that covers at least a display region, a partition wall that partitions a plurality of cells, a plurality of pixel electrodes arranged in a periodic pattern, between the one substrate and the other substrate; A plurality of electrode structures corresponding to a plurality of pixel electrodes are provided in this order when viewed from the one substrate side toward the other substrate side,
In the region between the pixel electrodes as viewed in the direction from the one substrate side toward the other substrate side, at least a part of the wiring for the electrode structure is disposed,
When viewed in the direction from the one substrate side to the other substrate side, the light reflection characteristics of the pixel electrodes and the light reflection characteristics of the wirings arranged in the region between the pixel electrodes are substantially the same. A reflective display device characterized by the above. The reflective display device according to claim 1, wherein the pixel electrode and the wiring arranged in a region between the pixel electrodes are formed of the same material. The electrode structure is a TFT electrode structure,
The wiring arranged in the region between the pixel electrodes may be a data wiring electrically connected to the source / drain electrode and / or a scanning wiring electrically connected to the gate electrode. The reflective display device according to claim 1. 4. The reflective display device according to claim 1, wherein the partition wall is formed in an aperiodic pattern.

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