JP2014511127A - System and method for providing a general purpose computing system - Google Patents

Abstract

  The present invention relates to systems and methods for providing general purpose computing systems. Implementations include modular motherboards having two or more electronic circuit boards connected to form a motherboard. The two or more electronic circuit boards each include a security key structure on the connector to provide a key connector therebetween. Computing components can be provided on two of the major surfaces of the first electronic circuit board circuit board. Disclosed is a component that does not turn on the computing system unless the first printed circuit board is electrically connected to the second printed circuit board. A heat sink that can be used within a general purpose computing system is disclosed. Disclose customizable exterior. An expandable memory device is disclosed.

Description

CROSS REFERENCE TO RELATED APPLICATIONS This application is filed on June 6, 2011 and is filed on June 6, 2011, entitled “SYSTEMS AND METHODS FOR PROVIDING A UNIVERSAL COMPUTING SYSTEM”, specification 13 / 154,325 (Attorney Docket Number). : 11072.435) and further claims the benefit of the following US provisional patent application: filed October 28, 2010, entitled "MODULAR VIRTUALIZATION IN COMPUTER SYSTEMS" No. 61 / 407,904 (Attorney Docket No. 11072.268), filed on June 7, 2010, “SYSTEMS AND METHODS FOR OPTIMIMING MEMORY PERFORMANCE” US Provisional Patent Application No. 61 / 352,349 (Attorney Docket No. 11072.2239), filed on June 7, 2010, “SYSTEMS AND METHODS FOR PROVIDING MULTTI-LINK DYNAMIC PCIE PARTITIONING” US Provisional Patent Application No. 61 / 352,351 (Attorney Docket No. 11072.2240), filed June 7, 2010 and entitled “TRACKING APPARATUS” No. 61 / 352,357 (Attorney Docket No. 11072.241), filed Jun. 7, 2010 and entitled “MINIAURIZED POWER SUPPLY”, US Provisional Patent Application No. 61 / 352,359. Statement (agent reference number) 11072.242), filed on June 7, 2010 and entitled "SYSTEMS AND METHODS FOR PROVIDING MULTI-LINK DYNAMIC VIDEO PARTITIONING", US Provisional Patent Application No. 61 / 352,363 (Attorney Docket Number) 11072.243), filed on June 7, 2010 and entitled “SYSTEMS AND METHODS FOR PROVIDING A PIN GRID ARRAY TO BALL GRID ARRAY ADAPTER” (No. 61 / 352,369) (Attorney Docket Number: 11072.244), filed on June 7, 2010, “SYSTEMS AND METHODS FOR ACTIVATING MULTI-COLOR L US Provisional Patent Application No. 61 / 352,378 entitled “IGMIT EMITING DIODES” (Attorney Docket No. 11072.245), filed on June 7, 2010, “SYSTEMS AND METHODS FOR PROVIDING CONNECTIVITY” US Provisional Patent Application No. 61 / 352,379 (Attorney Docket No. 11072.2246), filed on June 7, 2010, “SYSTEMS AND METHODS FOR INTELLIGENT AND FLEXIBLE MANAGEMENT AND MONITORING OF US Provisional Patent Application No. 61 / 352,362 entitled "COMPUTER SYSTEMS" (Attorney Docket No. 11072.2247), June 7, 2010 U.S. Provisional Patent Application No. 61 / 352,368 (Attorney Docket No. 11072.248), filed on June 7, 2010, filed and entitled "MULTI-LINK DYNAMIC BUS PARTIONING" US Provisional Patent Application No. 61 / 352,372 entitled “MULTI-LINK DYNAMIC STORAGE PARTITIONING” (Attorney Docket No. 11072.2249), filed on June 7, 2010, “LOAD BALANCING MODULAR COOOLING” US Provisional Patent Application No. 61 / 352,384 entitled “SYSTEM” (Attorney Docket No. 11072.2250), filed on June 7, 2010, “SYSTEMS AND METHODS FOR WIRELESSL” US Provisional Patent Application No. 61 / 352,381 entitled “RECEIVING COMPUTER SYSTEM DIAGNOSTIC INFORMATION” (Attorney Docket No. 11072.2251), filed on June 7, 2010, “SYSTEMS AND METHODS FOR PROVIDING” US Provisional Patent Application No. 61 / 352,358 entitled “A CUSTOMIZABLE COMPUTER PROCESSING UNIT” (Attorney Docket No. 11072.2252), filed on June 7, 2010, “SYSTEMS AND METHODS FOR MOUNTING” US Provisional Patent Application No. 61 / 352,383 (Attorney Docket No. 11072.2253). All of these applications are expressly incorporated herein by reference in their entirety.

  This application is also expressly incorporated herein by reference in its entirety as follows: US patent application filed Jun. 7, 2010 and entitled “SYSTEMS AND METHODS FOR PROVIDING A ROBUST COMPUTER PROCESSING UNIT” No. 12 / 795,439, filed July 9, 2007 and entitled “SYSTEMS AND METHODS FOR PROVIDING A ROBUST COMPUTER PROCESSING UNIT”, US patent application Ser. No. 11 / 827,360, 2003. US patent application Ser. No. 10/692, filed Oct. 22, 2009 and entitled “ROBUST CUSTOMIZABLE COMPUTER PROCESSING SYSTEM” No. 005, filed Jul. 26, 2010 and entitled “SYSTEMS AND METHODS FOR PROVIDING A DYNAMICLY MODULAR PROCESSING UNIT”, Jul. 10, 2006 No. 11 / 483,956, filed October 22, 2003, entitled “SYSTEMS AND METHODS FOR PROVIDING A DYNAMICLY MODULAR PROCESSING UNIT” US patent application entitled "DYNAMICALLY MODULAR PROCESSING UNIT" No. 10 / 691,114, filed Oct. 18, 2010 and entitled “NON-PERIPHERALS PROCESSING CONTROL MODULE HAVING IMPROVED HEAT DISPIPATING PROPERITES” No. 12 / 906,836, 2007 U.S. Patent Application No. 11 / 833,852, filed on August 3, 2003, entitled "NON-PERIPHERALS PROCESSING CONTROL MODULE HAVING IMPROVED HEAT DISPIPATING PROPERIES", filed October 22, 2003, NON-PERIPHERALS PROCESSING CONTROL MODULE HAVIN US Patent Application No. 10 / 691,473 entitled “G IMPROVED HEAT DISPIPATING PROPERITES”, filed on October 22, 2002, entitled “NON-PERIPHERALS PROCESSING CONTROL HAVING IMPROVED HEAT DISPIPATE” US Provisional Patent Application No. 60 / 420,127, filed Mar. 19, 2003, entitled “SYSTEMS AND METHODS FOR PROVIDING A DURABLE AND DYNAMICLY MODULAR PROCESSING UNIT” 789. All of these applications are expressly incorporated herein by reference in their entirety.

  The present invention relates to computer processors and processing systems, computer housings, and computer exterior modules. In particular, the present invention is a non-peripheral-based computer processor and a non-peripheral-based computer processor configured in its own exterior module and having its own electrical printed circuit board configuration and other electrical components in its own design. It relates to a processing system. Furthermore, the present invention provides a robust and customizable computer processing unit and system, the aforementioned items, and a unique computer operating environment designed to incorporate intelligence within various structures, devices, systems and other items. About providing.

  As one of the most influential technologies in the modern or historical world, computers and computer systems have dramatically changed the way we live and spend, and accelerated technological progress to rapid growth rates. In fact, computers and computing systems facilitate inventions, enable rapid technological advances, simplify work, record / store data, connect the world, and virtually every industry and everywhere in the world. It plays an essential role in many other applications in the country. In fact, computers have become an indispensable tool for individuals, businesses, and governments. Since its inception, computers and computing systems have undergone significant evolutionary changes. The small and powerful modern systems in use today are almost incomparable to their original counterparts of last year.

  The evolution of processing power in computers and computing systems exhibits a rapid growth pattern, but the physical and structural characteristics of these systems, i.e. processing components (printed circuit boards, motherboards, etc.) and peripheral components (hard drives) Cases or exterior modules that house electrical components such as CD / DVD-ROM drives, sound cards, video cards, etc., are unfortunately limited to only minor improvements and require design considerations. Function, workability, and inclusion of various components and associated design constraints. Today's computers and computing systems have not been able to reduce the large and cumbersome exterior modules that support processing components and other components.

  Traditional computer systems and their exterior modules, i.e. desktops, servers, and other similar computers or computing systems, are very functional and useful, but are large and cumbersome for several reasons, one reason is the monitor Except for various external devices such as keyboards and mice, they are designed to include all of the components and peripheral devices necessary to operate the computer system. In fact, one of the responsibilities of the slow evolution of large and unwieldy computer exterior modules is the perceived convenience of bringing both processing and peripheral components together in a single, easy-to-use package It is. Such an exterior module has a rather large bottom area, is heavy and unsuitable for mobility or environmental compatibility. However, little has been done to get rid of this problem, and such systems are common and acceptable. For example, server systems are commonly found in certain areas or spaces or rooms specially designed to accommodate box-shaped structures, and desktop computers are sometimes hidden in their desks It takes a lot of space in the personal workplace in the state, or some computers are left out because there is no other place to put.

  While there are clearly a number of advantages and benefits, there are some problems and deficiencies inherent and caused by conventional computers and computing systems and the exterior modules that contain them. First, they take up space, require multiple cords, and look bad because they generally look out of place with furniture and other decorations. Secondly, they emit noise and generate or radiate large amounts of noise and heat, as arises from the processing and peripheral components contained within it during operation. Third, they provide a great place for dust, litter, insects, and various other foreign objects to collect. Fourth, they, especially internal components, are difficult to keep clean. Fifth, they cause a large amount of radiation in the form of electromagnetic interference. Sixth, they are unsuitable for environmental suitability or situation suitability, i.e. they are one-dimensional in function, i.e. they only perform computational functions. Seventh, they are not easily expandable, that is, it is difficult to combine multiple computers to achieve higher processing power, especially without sufficient space or area. Eighth, the size and number of existing components requires a forced cooling system, such as one or more fans, to dissipate heat from within the system. Ninth, they require that all peripheral devices be operational at the same time without giving the user the ability to replace any one peripheral device or all peripheral devices as desired. Includes device-based systems. Tenth, some peripheral devices may be replaceable, but some are not. These peripheral devices, such as hard drives, are permanent, fixed structures.

  Another significant disadvantage of conventional computers and computing systems is that they cannot be easily adapted to various environments or placed within existing systems, devices, etc. to enable “smart” systems. It is impossible. Conventional computers are placed on the floor or in a desk and operate in a limited way. Further, conventional computers are not designed to integrate intelligence within or as part of a structure or device to incorporate intelligence into the structure or device. Still further, conventional computers do not have significant load bearing capacity to enable them to serve as support members and are not suitable for providing a customizable personal workplace environment.

  Finally, the means for dissipating the heat of conventional computers and computing systems, or the means for cooling components, present some disadvantages. In almost all cases, heat dissipation or cooling is achieved by some type of forced cooling system. This generally means providing means for ventilating the circulated air, such as by placing or mounting one or more blowers or fans inside and forming slits in the side walls of the exterior module. . In fact, most of the computer exteriors that currently exist are forced cooling to cool the interior of the computer where the processing components are located to dissipate heat and maintain or maintain a temperature that is acceptable for component operation. You need to use the system. Furthermore, since most of the peripheral devices used are inside, the exterior module tends to be rather large and has a relatively large internal space volume. As a result, since there is no way for air to escape, heat exhaust from the processing components is effectively confined within this spatial volume. Therefore, in order to circulate air and dissipate heat from the inside to the outside air, various mechanical devices such as blowers and fans are incorporated into conventional exterior modules, which is undesirable in the room where the computer is located Temperature rise.

  Thus, robust computers and computers that can be customized to perform computational functions within those environments to provide additional compatibility, ease of use, and functionality within a wide range of new and existing environments A system is needed.

  In light of the deficiencies in conventional computers and computing systems discussed above, the present invention provides new and novel computers and computing systems that improve these designs. Among other things, preferred exemplary embodiments of the present invention are used to improve existing computers and computing systems and methods, and possibly overcome one or more problems associated with such existing systems and methods. Can do.

  In accordance with the invention as embodied and broadly described herein, the invention includes a robust process control unit, an external object, and a means for operably connecting the process control unit to the external object. Featuring a customizable computing system, the processing control unit incorporates intelligence in the external object, thereby causing the external object to perform smart functions.

  In a preferred embodiment, the processing control unit comprises (a) a main support chassis having a plurality of sidewall supports and a plurality of junction centers, including means for supporting internal computer components, without requiring an interface. A dynamic backplane that provides support for connecting peripheral devices and other computing components directly to the system bus; an exterior module that includes means for enclosing the main support chassis and providing access to the interior of the exterior module; , (B) one or more computer processing components disposed in the junction center of the exterior module, and (c) means for cooling the interior of the exterior module.

  As indicated above, embodiments of the present invention are extremely versatile. As a further example, the processing control unit may physically support and / or process various equipment, devices, and / or inanimate objects, such as lighting fixtures, electrical outlets, home appliances, or breaker boxes. Can be used to provide. As shown herein, at least some embodiments of the present invention drive / control the operation of various components, structures, assemblies, equipment modules, etc., among which smart functions can be used. It includes a processing unit that functions as an engine.

  Embodiments of the present invention encompass platforms that can be used in connection with any type of enterprise application, particularly a computer and / or electrical enterprise. This platform allows multiple modifications that can be made with minimal impact on the processing control unit, thereby increasing the usefulness of the platform across all types of applications and environments. Further, the processing control unit can function alone or can be associated with other similar processing control units in a robust and customizable computing system to provide enhanced processing capabilities. .

  Although the methods and processes of the present invention have proven particularly useful in the personal computing enterprise field, implement any industrial enterprise and / or such devices that utilize control systems or smart interface systems. Those skilled in the art will appreciate that the method and process of the present invention can be used in a variety of different applications and in a variety of different manufacturing areas to yield a robust and customizable enterprise that includes the enterprises that benefit from Can do. Examples of such industries include, but are not limited to, the automotive industry, avionics industry, hydraulic control industry, auto / video control industry, telecommunications industry, medical industry, special application industry, and consumer electronics industry. included. Thus, the systems and methods of the present invention provide tremendous computing power to markets, including markets that have been left untouched by current computer techniques.

  The invention further features a method for incorporating intelligence within an external object and enabling smart functionality therein. The method includes obtaining one or more computational functions within the processing control unit to obtain the external object, operatively connecting the processing control unit to the external object, and causing the external object to perform a smart function. Starting.

  In the following description, these and other features and advantages of the present invention will be set forth, or these and other features and advantages of the present invention will become more fully apparent. These features and advantages can be realized by the equipment and combinations shown herein. Furthermore, the features and advantages of the present invention can be learned by practicing the present invention or will become apparent from the description provided hereinafter.

  In order to describe the above-listed features and other features and advantages of the invention, a more detailed description of the invention will be made by referring to specific embodiments of the invention shown in the accompanying drawings. It will be understood that these drawings depict only typical embodiments of the invention and therefore should not be considered as limiting the scope of the invention, and that by using the accompanying drawings, the invention will be further specified. And describe and explain with details.

FIG. 2 shows a block diagram providing an exemplary modular processing unit connected to peripheral devices to provide an exemplary computing enterprise according to the present invention. 1 illustrates an exemplary embodiment of a durable and dynamically modular processing unit. Non-peripheral exterior, cooling process (eg, thermodynamic convection cooling, forced air, and / or liquid cooling), optimized layered printed circuit board configuration, optimized processing and memory ratios, and peripherals and FIG. 3 shows another view of the embodiment of FIG. 2 with a dynamic backplane that provides additional flexibility and support for the application. Other exemplary embodiments are shown. Other exemplary embodiments are shown. A dynamically modular processing unit with an exterior that is not based on peripheral devices represents a typical enterprise that is used alone within a personal computing enterprise. A dynamically modular processing unit with an exterior that is not based on peripheral devices represents a representative enterprise being used within another representative computing enterprise. FIG. 6 illustrates another exemplary enterprise similar to FIG. 5 including additional peripheral devices such as removable drives and other modular peripheral devices. A dynamically modular processing unit represents another representative enterprise used within an electronic enterprise. A dynamically modular processing unit represents another typical enterprise that is being used as a handheld enterprise. FIG. 9 illustrates utilizing the embodiment of FIG. 8 within another representative enterprise. FIG. 6 illustrates another representative handheld enterprise with a non-peripheral exterior in combination with an external flip-up I / O peripheral. FIG. 11 shows another view of the embodiment of FIG. A dynamically modular processing unit represents a typical enterprise used in a typical consumer electronics. A dynamically modular processing unit represents another typical enterprise used in a typical electrical device. One or more dynamically modular processing units represent a typical enterprise being used in another electrical device. One or more dynamically modular processing units represent a representative enterprise being used within another representative device. A plurality of dynamically modular processing units, each having a non-peripheral exterior, represent a representative enterprise that is oriented and used within the computing enterprise to provide additional processing power. 2 illustrates an exemplary embodiment of a modular motherboard having a motherboard connector. 2 illustrates an exemplary embodiment of a modular motherboard connector. 3 illustrates a three-dimensional exemplary embodiment of a modular motherboard connector. Fig. 4 illustrates another three-dimensional exemplary embodiment of a modular motherboard connector. 1 illustrates a modular motherboard according to an embodiment of the present invention. FIG. 22 shows the modular motherboard of FIG. 21 combining two parts of the modular motherboard, according to one embodiment of the present invention. FIG. 23 shows the modular motherboard of FIG. 22 combining all three parts of the modular motherboard, according to one embodiment of the present invention. FIG. 24 shows the modular motherboard of FIG. 23 with a back plate according to an embodiment of the present invention. FIG. 25 illustrates the modular motherboard of FIG. 24 having a computer chassis, according to one embodiment of the present invention. FIG. 25 illustrates the modular motherboard of FIG. 24 having an end plate according to an embodiment of the present invention. FIG. 4 shows a perspective view of an assembled non-peripheral computer exterior, according to one embodiment of the present invention. FIG. 6 shows another perspective view of an assembled, non-peripheral computer exterior, according to one embodiment of the present invention. FIG. 2 shows a perspective view of an exemplary embodiment of a disassembled non-peripheral computer exterior, in particular a main support chassis, according to one embodiment of the present invention. FIG. 6 shows an exploded view of a main support chassis and a plurality of inserts and a dynamic backplane according to an embodiment of the present invention. FIG. 6 shows an end plate designed to be coupled to the end of the main support chassis, according to one embodiment of the present invention. FIG. 6 shows an end cap designed to fit and / or couple to the end of the main support chassis, in accordance with an embodiment of the present invention. 1 illustrates an expandable memory device for attachment to a dynamic backplane, according to one embodiment of the invention. Non-peripheral including a representative embodiment of a dynamic backplane with one or more I / O ports and power ports located on the surface for coupling various components to the non-peripheral computer exterior FIG. 2 shows a perspective view of an exemplary embodiment of a computer exterior of the computer. FIG. 2 shows a plan view of several representative embodiments of a dynamic backplane. FIG. 2 shows a plan view of several representative embodiments of a dynamic backplane. FIG. 2 shows a plan view of several representative embodiments of a dynamic backplane. FIG. 2 shows a plan view of several representative embodiments of a dynamic backplane. FIG. 4 shows a diagram representing a non-peripheral computer exterior that controls six display devices, according to one embodiment of the present invention. FIG. 6 shows a perspective view of an exemplary embodiment of a three-board circuit board configuration that is coupled to or fits within a non-peripheral computer exterior main support chassis, according to one embodiment of the present invention. FIG. 3 shows a perspective view of an exemplary embodiment of a dynamic backplane interconnected to a printed circuit board. FIG. 3 shows a top view of a first electrical printed circuit board and side and top views of a heat sink rail, according to one embodiment of the present invention. FIG. 2 shows a plan view of a mobile computer (COW) having a process control unit, according to an exemplary embodiment of the present invention. FIG. 4 shows a side view of a dynamic backplane with a pico projector, according to an exemplary embodiment of the present invention. FIG. 2 shows a block diagram of a processing control unit and two graphics processing units according to an exemplary embodiment of the present invention. FIG. 3 shows a cross-sectional view of a printed circuit board (“PCB”) and a plurality of heat generating components according to an exemplary embodiment of the present invention. FIG. 3 illustrates a cross-sectional view of a single heat sink device and multiple heat generating components coupled to a PCB, according to an exemplary embodiment of the present invention. FIG. 3 illustrates an exploded cross-sectional view of a modular heat sink device and a plurality of heat generating components coupled to a PCB, according to an exemplary embodiment of the present invention. FIG. 4 shows an exploded cross-sectional view of a modular heat sink device having a replaceable diffusion duct plate according to an exemplary embodiment of the present invention. FIG. 4 shows an exploded cross-sectional view of a modular heat sink device coupled to a multi-board PCB, according to an exemplary embodiment of the present invention. FIG. 3 shows an exploded cross-sectional view of a modular heat sink device having an alignment mechanism coupled to a PCB and a plurality of heat generating components according to an exemplary embodiment of the present invention. FIG. 2 shows various views of a system and method for increasing air flow through a computing device, according to an exemplary embodiment of the present invention. FIG. 2 shows various views of a system and method for increasing air flow through a computing device, according to an exemplary embodiment of the present invention. FIG. 2 shows various views of a system and method for increasing air flow through a computing device, according to an exemplary embodiment of the present invention. FIG. 2 shows various views of a system and method for increasing air flow through a computing device, according to an exemplary embodiment of the present invention. FIG. 2 shows various views of a system and method for increasing air flow through a computing device, according to an exemplary embodiment of the present invention. FIG. 2 shows various views of a system and method for increasing air flow through a computing device, according to an exemplary embodiment of the present invention. FIG. 2 shows various views of a system and method for increasing air flow through a computing device, according to an exemplary embodiment of the present invention. 1 shows a perspective view of an exemplary mounting bracket on a computer display device, according to an exemplary embodiment of the present invention. FIG. FIG. 60 shows a perspective view of a process control unit attached to the mounting hardware of FIG. 59 according to an exemplary embodiment of the present invention. FIG. 3 shows a perspective view of an exemplary mounting bracket component for a main support chassis, according to an exemplary embodiment of the present invention. FIG. 62 shows another view of the representative mounting bracket of FIG. 61. FIG. 3 shows a perspective view of an exemplary mounting bracket component for a main support chassis, according to an exemplary embodiment of the present invention. FIG. 5 shows a perspective view of another exemplary mounting bracket component for a main support chassis, according to an exemplary embodiment of the present invention. FIG. 5 shows a perspective view of another exemplary mounting bracket component for a main support chassis, according to an exemplary embodiment of the present invention. FIG. 2 shows a diagram of a computer system that can be used with embodiments of the present invention. 1 illustrates an exemplary network computer system that can be used with embodiments of the present invention. Fig. 3 shows various exemplary configurations of modular devices according to embodiments of the present invention. FIG. 4 shows various views of a portion of a modular device housing, according to an embodiment of the present invention. FIG. 4 shows various views of a portion of a modular device housing, according to an embodiment of the present invention. FIG. 4 shows various views of a portion of a modular device housing, according to an embodiment of the present invention. FIG. 4 shows various views of a portion of a modular device housing, according to an embodiment of the present invention. FIG. 4 shows various views of a portion of a modular device housing, according to an embodiment of the present invention. FIG. 6 shows various perspective views of an exemplary printed circuit board in a housing, according to an embodiment of a modular device. FIG. 6 shows various perspective views of an exemplary printed circuit board in a housing, according to an embodiment of a modular device. FIG. 6 shows various perspective views of an exemplary printed circuit board in a housing, according to an embodiment of a modular device. A diagram of a representative printed circuit board is shown. A diagram of a representative printed circuit board is shown. A diagram of a representative printed circuit board is shown. FIG. 3 shows a side view of a T-shaped connector disposed in a slot of a printed circuit board. FIG. 3 shows a side view of a T-shaped connector disposed in a slot of a printed circuit board. 1 illustrates an exemplary mobile system according to an embodiment of the present invention. 1 shows a block diagram of a computer network according to an embodiment of the present invention. FIG.

  The present invention relates to a system and method for providing a dynamically modular processing unit. Specifically, embodiments of the present invention are modular processing that is lightweight, compact, configured to be selectively used alone within an enterprise, or oriented with one or more additional processing units. Occurs in relation to units. In some embodiments, the modular processing unit has a non-peripheral exterior, cooling process (eg, thermodynamic convection cooling, forced air, and / or liquid cooling), optimized layered printed circuit board configuration, optimal A dynamic backplane that provides additional flexibility and support for integrated processing and memory ratios, as well as peripherals and applications.

  The following disclosure of the present invention includes eight subheadings: “Modular Motherboard”, “Modular Motherboard Connector”, “Customizable Computer Processing Unit”, “Customizable Chassis Design”, “Load Balancing Modular Cooling System”, “ System and method for mounting "," Providing computing resources using modular devices ", and" Software installed on portable hardware devices ". The use of subheadings is solely for the convenience of the reader and should not be construed as limiting in any way.

Modular motherboards Modern computers and computing systems drive inventions, enable rapid technological advancements, simplify work, record / store data, connect the world, in virtually every industry and every country in the world It plays an essential role in improving countless applications. In fact, computers have become an indispensable tool for individuals, businesses, and governments. Computing systems are embedded in countless machines, applications, and systems that increase their functionality, efficiency, and speed while reducing costs.

  At the heart of modern computers and computing systems is the computer motherboard. The motherboard is a main circuit board in the electronic processing system. The motherboard provides an electronic connection over which the components of the computing system operate. Historically, motherboards have been made with a single electronic circuit board to which the core components of the computer system are attached. These core components include a processor or socket that installs the processor, a clock, a slot that installs electronic memory or the main memory of the system, memory that contains the system firmware or basic I / O system ("BIOS") (typically Nonvolatile memory), power connectors, and power circuits are generally included. Furthermore, some motherboards include expansion card slots, peripheral control devices, and peripheral device connectors.

  Current motherboards support only minor upgrades and modifications to their components and configurations. For example, most motherboards only support a narrow range of processor types. If a computer user wants to replace the current supported processor with a different type of processor, the user may have to replace the entire motherboard. Similarly, most motherboards do not allow the user to add additional processors or add processors that require a different processor socket than is included on the motherboard. In these cases, the user must completely replace the motherboard.

  By its very nature, the two-dimensional motherboard configuration limits the size of the corresponding computer exterior. Two-dimensional motherboards are dust-free and require an overly large exterior to accommodate the motherboard, its components, cooling system, and internal peripherals. Such an exterior takes up a lot of space in offices and desks and cannot be easily moved.

  In summary, current motherboard configurations are adapted, upgraded, and have limited ability to support various system components. In addition, current motherboard configurations impose size restrictions on the exterior and computing systems. Accordingly, it would be desirable to provide a motherboard that overcomes current motherboard imperfections.

  In response to problems and demands in the art that have not yet been fully solved by currently available motherboards, a modular motherboard and a method for providing a modular motherboard are presented herein. Specifically, the implementation of the present invention occurs in connection with a modular motherboard made of two or more electronic circuit boards, each performing at least one designated function. The electronic circuit board is operably coupled as an integrated logic board that can be used within a computer or computing system. Exemplary functions include processing, providing system memory, providing system storage, and providing a system BIOS.

  In one implementation, the processing unit includes a modular motherboard having a three substrate configuration. The first circuit board includes a processor and a memory device, the second circuit board includes a system BIOS, and the third circuit board includes an electronic storage device. The processing unit may further include an exterior and a dynamic backplane that are not based on peripheral devices.

  In another implementation, the processing unit includes a modular motherboard having a four substrate configuration. The first circuit board includes a processor, the second circuit board includes a memory device, the third circuit board includes a system BIOS, and the fourth circuit board includes an electronic storage device. This processing unit can also include an exterior and a dynamic backplane that are not based on peripheral devices.

  In another implementation, modular motherboards are connected using motherboard connectors. These connectors have corresponding shapes that avoid connecting non-compliant connectors to the motherboard. The shape of the connector includes two sub-shapes: a connection sub-shape and a security sub-shape. The connection sub-shape includes the shape, form, and structure necessary to mechanically and electrically connect to another motherboard connector. The security sub-shape includes one or more security key structures to prevent the connector from matching another motherboard connector that does not have a corresponding security key structure.

  Implementations of the present invention provide a platform that can be used in connection with any type of computer enterprise. This platform allows for a large amount of modifications that can be made with minimal impact on the processing unit, thereby increasing the utility of the platform across all types of applications.

  Although the methods and processes of the present invention have proven particularly useful in the personal computing enterprise field, implement any industrial enterprise and / or such devices that utilize control systems or smart interface systems. Those skilled in the art will appreciate that the methods and processes of the present invention can be used in a variety of different applications, and in a variety of different manufacturing areas, to provide a customizable enterprise, including those that would benefit from this. Examples of such industries include, but are not limited to, the automotive industry, avionics industry, hydraulic control industry, auto / video control industry, telecommunications industry, medical industry, special application industry, and consumer electronics industry. included. Thus, the systems and methods of the present invention provide tremendous computing power to markets, including markets that have been left untouched by current computer techniques.

  FIG. 1 and the corresponding discussion are intended to provide an overview of a suitable operating environment according to an embodiment of the present invention. As discussed further below, some embodiments may use one or more modular processing units in a variety of customizable enterprise configurations, including network configurations or combined configurations as discussed below. Include.

  Embodiments of the invention include one or more computer-readable media, each medium can be configured to include or include data or computer-executable instructions for manipulating data. Computer-executable instructions are associated with data structures, objects, programs, routines, or general modular processing units that can perform a variety of different functions, or with dedicated modular processing units that can perform a limited number of functions. Other program modules that can be accessed by one or more processors are included.

  Computer-executable instructions are examples of program code means for causing a particular function or group of functions to be performed by one or more processors in an enterprise and for performing the steps of the processing method. Furthermore, the particular sequence of executable instructions provides an example of corresponding operations that can be used to perform such steps.

  Examples of computer readable media include random access memory (“RAM”), read only memory (“ROM”), programmable read only memory (“PROM”), erase and programmable read only memory (“EPROM”), Accessed by electrically erasable programmable read-only memory (“EEPROM”), compact disk read-only memory (“CD-ROM”), any solid state storage device (eg flash memory, smart media, etc.), or processing unit Any other device or component capable of providing the resulting data or executable instructions is included.

  Referring to FIG. 1, a typical enterprise includes a modular processing unit 10 that can be used as a general purpose processing unit or a dedicated processing unit. For example, the modular processing unit 10 may be a personal computer, notebook computer, personal digital assistant ("PDA") or other portable terminal, workstation, minicomputer, mainframe, supercomputer, multiprocessor system, network computer, processor base. Can be used alone as a consumer device, smart appliance or smart device, control system, etc., or can be used with one or more similar modular processing units. By using multiple processing units within the same enterprise, processing power is increased. For example, each processing unit in the enterprise can be dedicated to a particular task or can be involved together in distributed processing.

  In FIG. 1, a modular processing unit 10 can be configured to connect its various components and allows one or more buses and / or buses to exchange data between two or more components. Or an interconnect 12. Bus / interconnect 12 may include one of a variety of bus structures, including a memory bus, a peripheral bus, or a local bus using any of a variety of bus architectures. Typical components connected by bus / interconnect 12 include one or more processors 14 and one or more memories 16. In the following, the bus / interconnect 12 is used by using logic called “data manipulation system 18”, one or more systems, one or more subsystems, and / or one or more I / O interfaces. It is possible to selectively connect other components. In addition, other components are external to the bus / interconnect 12 by using logic, one or more systems, one or more subsystems, and / or one or more I / O interfaces. And / or logic such as modular processing unit 30 and / or unique device 34, one or more systems, one or more subsystems, and / or one or more I It can function as an / O interface. Examples of I / O interfaces include one or more mass storage device interfaces, one or more input interfaces, one or more output interfaces, and the like. Accordingly, embodiments of the present invention include the ability to use one or more I / O interfaces and / or the ability to change the usefulness of a product based on the logic or other data manipulation system used.

  The logic can be coupled to interfaces, parts of the system, subsystems, and / or can be used to perform certain tasks. Thus, a logic or other data manipulation system can enable, for example, IEEE 1394 (Firewire), which logic or other data manipulation system is an I / O interface. Alternatively or additionally, logic or another data manipulation system can be used that allows the modular processing unit to be coupled to another external system or subsystem. For example, an external system or subsystem that may or may not include dedicated I / O connections. Alternatively or in addition, logic or other data manipulation systems may be used without external I / O being associated with the logic. Embodiments of the present invention also include using specialized logic for vehicle ECUs, hydraulic control systems, etc., and / or using logic to inform the processor how to control a particular piece of hardware. . Moreover, those skilled in the art will appreciate that embodiments of the invention encompass a number of different systems and / or configurations that utilize logic, systems, subsystems, and / or I / O interfaces.

  As indicated above, embodiments of the invention provide the ability to use one or more I / O interfaces and / or the ability to change the usefulness of a product based on the logic or other data manipulation system used. Is included. For example, if the modular processing unit is part of a personal computing system that includes one or more I / O interfaces and logic designed for use as a desktop computer, the logic or other data manipulation system is modified. In addition, flash memory or logic can be included to perform voice encoding for music stations that want to take analog voice over two standard RCAs and broadcast them to IP addresses. Thus, a modular processing unit can be used in a system that is used as an appliance rather than a computer system, with modifications made to data manipulation systems (eg, logic, systems, subsystems, I / O interfaces, etc.) on the modular processing unit backplane. Can be part. Thus, modifying the data manipulation system on the backplane can change the usage of the modular processing unit. As a result, embodiments of the present invention include highly compatible modular processing units.

  As indicated above, the processing unit 10 includes one or more processors 14, such as a central processing unit, and optionally one or more designed to perform a particular function or task. Includes other processors. It is typical to execute instructions provided on a computer readable medium such as memory 16, magnetic hard disk, removable magnetic disk, magnetic cassette, optical disk, or from a communications connection that may also be considered a computer readable medium. There is a processor 14.

  One or more computer-readable media that may be configured to include or include data or instructions for manipulating data and that may be accessed by processor 14 via bus / interconnect 12 including. The memory 16 may include, for example, a ROM 20 that is used to permanently store information and / or a RAM 22 that is used to temporarily store information. ROM 20 may include a basic I / O system (“BIOS”) having one or more routines used to establish communication, such as during startup of modular processing unit 10. In operation, the RAM 22 may include one or more program modules, such as one or more operating systems, application programs, and / or program data.

  As shown, at least some embodiments of the present invention include a non-peripheral armor that provides a more robust processing unit that allows the unit to be used in a variety of different applications. In FIG. 1, one or more mass storage device interfaces (shown as data manipulation system 18) can be used to connect one or more mass storage devices 24 to bus / interconnect 12. . The mass storage device 24 is a peripheral device for the modular processing unit 10 and allows the modular processing unit 10 to hold large amounts of data. Examples of mass storage devices include hard disk drives, magnetic disk drives, tape drives, and optical disk drives.

  The mass storage device 24 may read from and / or write to a magnetic hard disk, a removable magnetic disk, a magnetic cassette, an optical disk, a solid state storage device (such as a flash memory storage device), or other computer readable medium. . Mass storage device 24 and its corresponding computer-readable medium may include data and / or executable data that may include one or more program modules, such as an operating system, one or more application programs, other program modules, or program data. Provides non-volatile storage of instructions. Such executable instructions are examples of program code means for performing the steps of the methods disclosed herein.

  Data manipulation system 18 may be used to allow data and / or instructions to be exchanged with modular processing unit 10 via one or more corresponding peripheral I / O devices 26. Examples of peripheral I / O devices 26 include input devices such as keyboards and / or mice, trackballs, light pens, styluses and other pointing devices, microphones, joysticks, game pads, satellite dish, scanners, camcorders, Alternative input devices such as digital cameras, sensors, and / or output devices such as monitor and display screens, speakers, printers, control systems, etc. are included. Similarly, examples of data manipulation system 18 coupled to dedicated logic that can be used to connect peripheral I / O devices 26 to bus / interconnect 12 include serial ports, parallel ports, game ports, universal serial buses ( "USB"), Firewire (IEEE 1394), wireless receivers, video adapters, audio adapters, parallel ports, wireless transmitters, any parallel or serialized I / O peripherals and other interfaces.

  The data manipulation system 18 allows information to be exchanged via one or more network interfaces 28. Examples of network interface 28 include connections that allow information to be exchanged with the processing unit, a local area network (“LAN”) or modem, a network adapter for connecting to a wireless link, a wide area network such as the Internet ( Another adapter for connecting to "WAN") is included. The network interface 28 may be integrated into the modular processing unit 10 or a peripheral device for the modular processing unit 10 and may be associated with any connection between the LAN, wireless network, WAN, and / or processing unit.

  The data manipulation system 18 enables the modular processing unit 10 to exchange information with one or more other local or remote modular processing units 30 or computing devices. The connection between the modular processing unit 10 and the modular processing unit 30 may include a wired link and / or a wireless link. Thus, embodiments of the present invention encompass direct bus-to-bus connections. This makes it possible to create a large-scale bus system. In addition, this eliminates the currently known hacking by direct bus-to-bus enterprise connection. Further, the data manipulation system 18 enables the modular processing unit 10 to exchange information with one or more unique I / O connections 32 and / or one or more unique devices 34.

  Program modules accessible to the processing unit or portions thereof may be stored in a remote memory storage device. Further, within a network system or combination configuration, modular processing unit 10 may participate in a distributed computing environment where functions or tasks are performed by multiple processing units. Alternatively, each processing unit of the combined configuration / enterprise can be dedicated to a specific task. Thus, for example, one processing unit in the enterprise can be dedicated to video data, thereby replacing a conventional video card and improving the processing capability over conventional techniques for performing such tasks.

  Those skilled in the art will appreciate that embodiments of the present invention may include a variety of configurations, but refer to FIG. 2, which shows an exemplary embodiment of a durable, dynamically modular processing unit. In the embodiment shown in FIG. 2, the processing unit 40 is durable and dynamically modular. In the illustrated embodiment, the unit 40 is a 3.5 inch (8.9 cm) cubic platform that utilizes an advanced thermodynamic cooling model that eliminates the need for cooling fans.

  However, as shown herein, embodiments of the present invention may include other cooling processes in addition to or in place of thermodynamic cooling processes, such as forced air cooling processes and / or liquid cooling processes. The use of is also included. Further, although the illustrated embodiment includes a 3.5 inch cubic platform, embodiments of the present invention encompass the use of modular processing units that are larger or smaller than the 3.5 inch cubic platform. Those skilled in the art will understand. Similarly, other embodiments include using shapes other than cubes.

  The processing unit 40 also includes a layered motherboard configuration that optimizes processing and memory ratios, and a bus architecture that improves performance and increases both hardware and software stability, each of which is further described below. Those skilled in the art will appreciate that other embodiments of the present invention also include non-layered motherboards. In addition, other embodiments of the present invention provide an embedded motherboard configuration in which motherboard components are embedded in one or more materials that provide isolation between the components and embed the components in one or more materials. And one or more of the motherboard components are mechanical, optical, electrical, or electromechanical. Further, at least some of the embodiments of the embedded motherboard configuration include mechanical, optical, electrical, and / or electromechanical components that are secured within a three-dimensional steril environment. Examples of such materials include polymers, rubbers, epoxies, and / or any non-conductive embedding material.

  Embodiments of the present invention include providing processing versatility. For example, according to at least some embodiments of the present invention, processing burden is accounted for and resolved by selectively dedicating and / or assigning processing power. For example, a specific system is defined according to a certain demand so that the processing capacity can be controlled or dedicated. Thus, dedicating one or more modular processing units to provide processing power for such specific demands (eg video, audio, one or more systems, one or more subsystems, etc.) Can do. In some embodiments, being able to provide processing power reduces the load on the central unit. Thus, processing power is driven where it is needed.

  Although the illustrated embodiment, processing unit 40 includes a 3 GHz processor and 2 GB RAM, those skilled in the art will recognize that other embodiments of the present invention may use faster or slower processors and / or more or less RAM. It will be understood to encompass In at least some embodiments of the present invention, the processor speed and amount of RAM of a processing unit depends on what the processing unit is used for.

  A highly dynamic, customizable and replaceable backplane 44 provides support for peripherals and vertical applications. In the illustrated embodiment, the backplane 44 is selectively coupled to the exterior 42 to provide one or more features, interfaces, functions, logic, and / or components that result in the unit 40 being dynamically customizable. Can be included. In the illustrated embodiment, the backplane 44 includes a DVI video port 46, an Ethernet port 48, a USB port 50 (50a and 50b), a SATA bus port 52 (52a and 52b), a power button 54, and a power port 56. The backplane 44 can also include a mechanism that electrically couples two or more modular processing units to increase the overall system throughput as indicated above and provide scale processing as further disclosed below. .

  The corresponding features, interfaces, functions, logic, and / or components along with the backplane 44 are merely representative, and embodiments of the present invention may include a variety of different features, interfaces, functions, and / or components. One skilled in the art will appreciate that it includes a backplane having Thus, a processing unit can be dynamically customized by allowing one backplane to be replaced by another backplane so that the user can selectively modify the logic, features, and / or functions of the processing unit. Is possible.

  Furthermore, embodiments of the present invention include any number and / or type of logic and / or connectors to enable use of one or more modular processing units 40 in a variety of different environments. For example, these environments include vehicle (eg, automobile, truck, motorcycle, etc.) environments, hydraulic control system environments, and other environments. As discussed further below, changing the data manipulation system on the backplane allows for vertical and / or horizontal scaling for various environments.

  Furthermore, embodiments of the present invention encompass various shapes and sizes of modular processing units. For example, in FIG. 2, the modular processing unit 40 is a smaller cube than a conventional processing unit for various reasons.

  As will be appreciated by those skilled in the art, embodiments of the present invention are more advantageous than conventional techniques, for example, because they eliminate the exterior based on the materials used, size and / or shape, logic type, and / or peripheral devices. Also easy to support.

  In the illustrated embodiment, the power button 54 includes three states for power activation: on, off, and standby. When powered on and receiving power, the unit 40 is instructed to load and start an operating system maintained in memory. When power is turned off, the process control unit 40 interrupts any ongoing process and initiates a shutdown sequence followed by a standby state in which the system waits for the power-up state to be activated.

  The USB port 50 is configured to connect a peripheral input / output device to the processing unit 40. Examples of such input or output devices include keyboards, mice and trackballs, monitors, printers, other processing units and computer devices, modems, and cameras.

  The SATA bus port 52 is configured to electronically couple and support a mass storage device that is a peripheral device for the processing unit 40. Examples of such mass storage devices include floppy disk drives, CD-ROM drives, hard drives, tape drives and the like.

  As indicated above, other embodiments of the present invention include using additional ports and means for connecting peripheral devices, as will be appreciated by those skilled in the art. Accordingly, the specific ports and means for connection specifically identified and described herein are intended to be exemplary only and not limiting in any way.

  As shown herein, the use of non-peripheral processing units has various advantages over computer units that are larger and packed with peripheral devices. As an example, users can selectively reduce the space needed to accommodate an enterprise, and still need to be enhanced by adding processing units to the system, despite the overall need for less space Provided processing power can be provided. Furthermore, each of the processing units includes solid state components rather than a perishable system so that individual units can be hidden (eg, in decorative devices such as walls, furniture, closets, watches, etc.).

  The durability of the individual processing units / cubes allows processing to take place at locations that were otherwise unthinkable by conventional techniques. For example, the treatment unit can be buried in the ground, placed in the water, spun in the sea, placed at the tip of a drill bit that cuts out several hundred feet in the ground, and placed on an unstable surface in furniture. The potential processing positions are infinite. Other benefits include "smart" that can be customized in a variety of consumer-accessible devices, including reduced noise and heat, furniture, equipment, vehicles, structures, supports, appliances, equipment, and personal items This includes being able to provide technology.

  Referring now to FIG. 3A, another view of the embodiment of FIG. 2 is shown, which includes a non-peripheral exterior, a cooling process (eg, thermodynamic convection cooling, forced air, and / or In order to more fully show the liquid cooling), the optimized layered circuit board configuration, and the dynamic backplane, the processing unit 40 is shown with the cube sidewalls removed. In the illustrated embodiment, the various substrates are bonded together by using force fitting techniques that prevent accidental substrate debonding and allow compatibility. These substrates allow for enhanced EMI distribution and / or chip / logic placement. One skilled in the art will appreciate that embodiments of the invention include any number of substrates and / or configurations. Further, the structure of the substrate can be modified for specific benefits and / or demands based on one or more applications and / or features. In FIG. 3A, a layered circuit board in which the processing unit 40 includes two parallel side plates 62 (62a and 62b) and a central plate 64 that is perpendicular to the side plates 62 and electronically couples the side plates 62. / Includes motherboard configuration 60. Although the illustrated embodiment shows a three-substrate configuration, those skilled in the art will appreciate that embodiments of the present invention include a substrate configuration having less than three substrates and a layered substrate configuration having four or more substrates. . Furthermore, embodiments of the present invention include other circuit board configurations other than the boards being at right angles to each other.

  In the illustrated embodiment, the layered mother board 60 is supported in the outer package 42 by means for coupling the mother board 60 to the outer package 42. In the illustrated embodiment, the means for coupling the motherboard 60 to the sheath 42 includes various channeled slots configured to selectively receive at least a portion of the motherboard 60 and hold the motherboard 60 in place. Including. When an upgrade is required with advanced technology, such as when replacing processor 66 with an improved processor, the corresponding board (eg, center plate 64) is removed from the exterior 42 and a new board with a new processor is removed. Insert to enable upgrade. Thus, embodiments of the present invention have been proven to assist with upgrades as needed and provide a customizable and dynamic processing unit.

  The processing unit 40 also includes one or more processors configured to perform one or more tasks. In FIG. 3A, one or more processors are shown as a processor 66 coupled to the center plate 64. As technology advances, users of processing unit 40 may want to replace processor 66 with an improved processor. Thus, the central plate 64 can be removed from the exterior 42 and a new central plate with an improved processor can be installed and used in connection with the unit 40. Accordingly, embodiments of the present invention include a dynamically customizable processing unit that provides a platform that is easily upgraded and therefore has a useful life compared to conventional techniques.

  According to some embodiments, processor 66 may be fitted with a processor cooling system. Several devices can be used to cool the processor, including heat sinks, fans, combinations thereof, and various other devices known in the art.

  Similarly, the processing unit 40 may include one or more memory devices (not shown). The memory can be coupled to the electronic circuit board in various ways, including a memory card removably coupled to a slot on the circuit board, or the memory card is directly coupled to the circuit board. In some embodiments of the present invention, the entire modular motherboard circuit board may be substantially devoted to providing one or more memory devices. As technology advances, users of processing unit 40 may want to replace memory devices with improved memory devices. Accordingly, the circuit board including the memory device can be removed from the outer casing 42, and a new circuit board having an improved processor can be installed and used in connection with the unit 40.

  The motherboard 60 of the present invention is modular and can be easily upgraded. The modular motherboard 60 consists of a plurality of electronic circuit boards that equalize the capabilities and performance of an integrated logic board with those of a non-modular motherboard having the same components. Modular motherboard 60 is comprised of several electronic circuit boards 64, 62a, and 62b, or motherboards that are interconnected to form a complete logic board. Thus, each electronic circuit board can be easily removed and replaced without substantially affecting the remaining circuit boards. For example, a user can replace a circuit board 64 having a processor 66 and replace that circuit board with another circuit board having a different processor to provide the processing unit 40 with more processing power.

  Each board includes a bus system that connects to the bus system of another circuit board. This bus system provides electronic communication between interconnected circuit boards that form a modular motherboard 60. A modular motherboard can consist of any number of circuit boards. For example, in one embodiment, the motherboard includes four circuit boards each having specific functions such as processing, providing memory, providing storage, providing BIOS, and the like. In another embodiment, the circuit board has multiple functions, such as processing capabilities and memory capabilities. In another embodiment, a single function is performed by multiple circuit boards. Additional functions performed by the individual circuit boards include, but are not limited to, providing a clock oscillator, providing a cooling system, and other motherboard functions understood by those skilled in the art.

  Modular motherboard 60 offers several advantages over single circuit board motherboards. For example, if the modular motherboard 60 does not support a particular component, the user need only replace a single circuit board with a compatible circuit board rather than replacing the entire motherboard. Further, the modular motherboard is not constrained to a single circuit board motherboard such as a two-dimensional area. Therefore, the modular motherboard 60 can be configured to fit within a narrower three-dimensional exterior. For example, if a modular motherboard includes four circuit boards, the boards can be configured to utilize a quarter of the bottom area used by an equivalent single circuit board motherboard. Finally, the modular motherboard 60 can be easily expanded. For example, a user can easily attach an additional circuit board (not shown) to an existing motherboard configuration to scale the throughput of the entire structure. Those skilled in the art will appreciate that the modular motherboard 60 provides an unlimited number of advantages when used in conjunction with a particular application and computer system.

  According to some embodiments of the processing unit of the present invention, one or more electronic storage devices are attached to the modular motherboard. By adding an electronic storage area such as a mass storage device, the processing and processing capabilities of the processing unit can be increased. For example, a processing unit having an electronic storage capacity can be used as a personal computer by simply adding essential peripheral devices such as a monitor, a mouse, and a keyboard. Also, as shown in FIGS. 14-16, a processing unit with electronic storage capacity can be effective and useful as an engine that drives / controls the operation of components, structures, assemblies, and equipment modules. For example, the processing unit can store a digital log about the function or performance of the device in electronic storage. In another example, the processing unit can both control the stereo system and store the user's digital music library.

  Referring now to FIG. 3B, another embodiment of the present invention is shown, which is shown in order to more fully illustrate a peripheral, non-peripheral exterior, multiple layered circuit boards, and a dynamic backplane 44. The processing unit 160 is shown with the side walls of the cube removed. The layered circuit board includes two parallel side plates 162 (162a and 162b) and a central plate 164 that is perpendicular to the side plates 162a and 162b and electronically couples the side plates.

  In the embodiment of FIG. 3B, central plate 164 includes processor 66 and storage devices 150a, 150b, and 150c, and side plate 162b includes a plurality of electronic storage devices 166a, 166b, and 166c. As described above, the motherboard 168 is easily upgraded by removing the side plate 162 or the central plate 164 and replacing them with another circuit board. In another embodiment, the substrate is replaced with an improved substrate having improved capabilities. A user replaces one or more circuit boards 162a, 162b, or 164 to reduce the processing capability, free memory capacity, storage capacity, or other characteristics of the processing unit 160. Such an upgrade or downgrade is possible with a modular motherboard and is easily achieved.

  Various types of electronic storage devices can be used with the processing unit 160. For example, solid state memory, such as flash memory, provides several advantages for modular processing units. Solid state memory uses low levels of power, resulting in low heat dissipation levels. As such, one or more such solid state storage devices can be included in a relatively small processing unit 160 without substantially increasing the heat dissipated by the unit. For example, in certain embodiments, the side plate 162b includes a plurality of flash memory storage devices 166a, 166b, and 166c that provide a total of 128 Gb of data storage. When configured, these storage devices use less than 5 watts of energy and generate minimal heat that is easily dissipated into the environment by natural convection or other cooling methods.

  Referring now to FIG. 3C, another embodiment of the present invention is shown, which shows the processing unit 140. The processing unit 140 includes an exterior, a modular motherboard 148, and a dynamic backplane 144. In this embodiment, the modular motherboard 148 includes three parallel side plates 62a, 62b, and 62c and a central plate 142 that is perpendicular to the side plates 62 and electronically couples the side plates 62. Unlike the three substrate configuration of FIGS. 3 and 4, this four substrate configuration includes a third parallel side plate 62c. The third parallel side plate is configured below the side plate 62b and parallel to the side plate 62b. One skilled in the art will appreciate that the four circuit boards can be configured in various orientations. In some embodiments, a four-board configuration can be set up to arrange the high temperature components nicely for maximum heat dissipation.

  According to one embodiment, the exterior 42 is lengthened to accommodate the fourth side plate 62c. In another embodiment, the central plate 142 is elongated to accommodate the fourth side plate 62c. In yet another embodiment, to accommodate the fourth side plate 62c, the side plate 62b is repositioned along the central plate 142 (as shown in FIG. 5) and the side plate 62c is positioned below it. . In yet another embodiment, the exterior can be lengthened to accommodate the fourth side plate 62c.

  Increasing the number of circuit boards in a four board configuration provides additional surface area for computer components on the modular motherboard 148. In one embodiment, the additional surface area provided by the four substrate configuration is used for additional components such as additional memory devices and additional processors. As explained above, the storage device utilizes a relatively low level of energy and thus dissipates a relatively low level of heat. Thus, in some embodiments, the storage device is stored relatively close to other computer components without generating harmful heat or requiring a specified cooling device.

  In one embodiment, one or more of the circuit boards in a four board configuration includes a storage device 65 that provides electronic storage capability to the processing unit 140. In another embodiment, the storage device 65 is a solid state storage device such as a flash memory device or other similar storage device. In another embodiment, the entire side plate 62c is substantially devoted to electronic storage such as one or more flash memory devices. Since the heat dissipated from the solid state storage device is relatively low, the gap 150 between the side plate 62c and the side plate 62b is narrow and compact. Accordingly, the relative size of the processing unit 140 is relatively similar to or equal to the size of the processing unit that does not include an electronic storage device.

  Storage device 65 or multiple storage devices may provide processing unit 140 with sufficient electronic storage for processing unit 140 to perform one or more specified functions. According to one embodiment, the one or more storage devices can provide sufficient electronic storage to use the processing unit 140 as a personal computer. For example, a plurality of storage devices 65 can be included on the side plate 62c to provide a 16 Gb to 256 Gb electronic storage area to the processing unit. In another embodiment, the storage device 65 provides only 256 Mb of electronic storage and uses the processing unit 140 to control the functionality of the home appliance.

  In the illustrated embodiment, the dynamic backplane 144 includes a single port 146. It will be appreciated that any number of ports, buttons, switches, or other similar components may be included in the dynamic backplane 144. For example, in one embodiment, the dynamic backplane can have wireless communication capabilities. In another embodiment, the dynamic backplane 144 includes only a single port that can be configured to connect to several external devices. In one embodiment, the single port 146 is configured to connect to a power source, a personal computer, a computer server, a docking station, or other external device understood by those skilled in the art. Finally, in one embodiment, the single port 146 is a unique port that connects to a unique docking station. 6 and 9 show an exemplary device that can function as a docking station.

  Referring now to FIG. 4, a representative enterprise 70 is shown, in which a dynamically modular processing unit 40 having an exterior that is not based on peripheral devices is used alone within a personal computing enterprise. In the illustrated embodiment, the processing unit 40 includes a power connection 71 and uses wireless technology for peripheral devices in the enterprise 70. Peripheral devices include a monitor 72 having a hard disk drive 74, a speaker 76, and a CD ROM drive 78, a keyboard 80, and a mouse 82. Those skilled in the art will appreciate that embodiments of the present invention also encompass personal computing enterprises that use technologies other than wireless technologies.

  The processing unit 40 is the driving force of the enterprise 70 because the processing unit 40 provides the processing power to manipulate data to perform tasks. The dynamic and customizable nature of the present invention allows a user to easily increase processing power. In this embodiment, processing unit 40 is a 3.5 inch (8.9 cm) cube that utilizes thermodynamic cooling to optimize processing and memory ratios. However, as shown herein, embodiments of the present invention may include other cooling processes in addition to or in place of thermodynamic cooling processes, such as forced air cooling processes and / or liquid cooling processes. The use of is also included. Further, although the illustrated embodiment includes a 3.5 inch cubic platform, embodiments of the present invention encompass the use of modular processing units that are larger or smaller than the 3.5 inch cubic platform. Those skilled in the art will understand. Similarly, other embodiments include using shapes other than cubes.

  Specifically, the processing unit 40 of the illustrated embodiment includes a 3 GHz processor, 2G RAM, 512 L2 cache, and a wireless network interface. Thus, for example, if a user of enterprise 70 determines that enterprise 70 is required to have higher processing power, the user does not have to purchase a new system as required by some prior art. Can simply add one or more modular processing units to the enterprise 70. Processing units / cubes can be selectively assigned as desired by the user to perform processing. For example, processing units can be used to perform distributed processing, and each unit can be assigned to perform a specific task (eg, dedicating a unit to processing video data or other tasks) Multiple modular units may function together as one processing unit.

  While this example includes a processing unit that includes a 2 GHz processor, 1.5 G RAM, and 512 L2 cache, those skilled in the art will appreciate that other embodiments of the present invention are faster or slower processors, more or less It will be understood to encompass the use of RAM and / or different caches. In at least some embodiments of the present invention, the capabilities of a processing unit depend on what the processing unit is used for.

  FIG. 4 shows the processing unit 40 on the illustrated desk, but the robust nature of this processing unit / cube can be found in walls, under a desk, in a decorative device or object, etc. It makes it possible to place the unit 40 in an unseen place instead. Thus, the illustrated embodiment eliminates conventional towers that tend to hit the feet and tend to generate sound from the cooling system inside the tower. When convection cooling or liquid cooling is used, no sound is emitted from unit 40 because all internal components are in solid state.

  Referring now to FIG. 5, another example of using a modular processing unit within a computing enterprise is shown. FIG. 5 shows that the modular processing unit 40 can function as a load bearing member. For example, a modular processing unit can be used to connect two or more structures together and contribute to the overall structural support and stability of the structure or enterprise. In addition, the modular processing unit can withstand loads directly associated with the main support. For example, a modular processing unit can physically support a computer screen or monitor and control the process. In the illustrated embodiment, a monitor 90 is attached to the modular processing unit 40, and further the modular processing unit 40 is attached to a stand 92 having a pedestal 94.

  Referring now to FIG. 6, another representative enterprise is shown, where a dynamically modular processing unit 40 having an exterior that is not based on peripheral devices is the computing enterprise used. In FIG. 6, a representative enterprise is similar to the embodiment shown in FIG. 5, but with one or more modular peripheral devices selectively coupled to the enterprise. Specifically, FIG. 6 shows a mass storage device 93 that is selectively coupled to the enterprise as a peripheral device. One skilled in the art will appreciate that any number (eg, less than two, three or more) and / or types of peripheral devices can be used. Examples of such peripheral devices include mass storage devices, I / O devices, network interfaces, other modular processing units, unique I / O connections, unique devices, and the like.

  Referring now to FIG. 7, another exemplary embodiment is shown in which a dynamically modular processing unit 40 having an exterior that is not based on peripheral devices is used in the enterprise. According to at least some embodiments of the present invention, a modular processing unit having an exterior that is not based on a peripheral device is placed in a central processing unit or in a television, stereo system, recording unit, set-top box, or any other It can be used in other electronic devices, including electronic devices. Thus, modular processing units can be selectively used within the enterprise for monitoring, alerting, information provision, control, management, recording, recognition, and the like. In FIG. 7, a modular processing unit is coupled to a power source 94, one or more other peripheral devices 95, and connections 96 for use within the enterprise.

  As shown herein, embodiments of the present invention encompass various shapes and sizes of modular processing units. Referring now to FIG. 8, a modular processing unit 40 is shown for use as a handheld computing enterprise such as a personal digital assistant (“PDA”). An I / O peripheral device 97 is coupled to the modular processing unit 40. In the illustrated embodiment, the I / O peripheral device 97 includes a monitor and stylus to enable I / O. One skilled in the art will appreciate that additional peripheral devices may be included, such as speakers, microphones, cell phones, keyboards, and any other type of peripheral device as illustrated below.

  In the embodiment of FIG. 8, the dimensions of the handheld computing enterprise are 3.5 inches × 4.75 inches × 0.75 inches, but the present invention encompasses embodiments that are larger or smaller than the illustrated embodiment. Will be understood by those skilled in the art. In FIG. 8, the I / O peripheral device 97 is a sliding engagement piece that is selectively coupled to the modular processing unit 40, which is non-layered that allows the unit 40 to be thinner. Includes board design. Additional peripheral devices include power supplies and mass storage devices. In one embodiment, the mass storage device is a 40G hard drive that allows the user to always have all of their files. Thus, the embodiment of FIG. 8 allows a user to use a complete computer in his / her palm. Furthermore, thanks to the solid state components, the embodiment of FIG. 8 is more durable than the prior art. Further, in at least some embodiments, the exterior includes a metal to increase durability. Therefore, even if the unit 40 is dropped, the core is not broken.

  Referring now to FIG. 9, another representative enterprise is shown that includes a dynamically modular processing unit 40 having an exterior that is not based on peripheral devices. In FIG. 9, a processing unit 40 having an I / O peripheral device 97 is selectively coupled to a peripheral device 98 to allow a representative enterprise to function as a high performance laptop computer. For example, using liquid cooling techniques, the processing unit 40 can be a very powerful handheld machine. As shown in FIG. 9, the unit 40 is selectively like a cartridge in a large I / O peripheral 98 that includes a keyboard, monitor, speakers, and optionally logic depending on the end user's application. Can be inserted. When the unit 40 is decoupled / removed from the peripheral device 98, the unit 40 can hold the file so that the user can always have his own file with the unit 40. Thus, since unit 40 includes all files, it is not necessary to synchronize unit 40 with peripheral device 98. While the embodiment shown in FIG. 9 includes one modular processing unit, other embodiments of the present invention include utilizing multiple processing units.

  Similarly, the modular processing unit 40 can be inserted or otherwise coupled to various other types of peripheral devices, including in-car, home, office, etc. enterprises. Unit 40 may be used to store and provide music, movies, photos, or any other audio and / or video.

  Referring now to FIGS. 10-11, another representative enterprise is shown in which a dynamically modular processing unit 40 having a non-peripheral exterior is used within a personal computing enterprise. Yes. 10-11, the modular processing unit 40 is coupled to a flip-up peripheral device 99 that includes a monitor, thumb keyboard, and mouse device. The flip-up peripheral device 99 runs at maximum speed with the handtop computer and performs spreadsheets, surfing the net, and other functions and / or tasks. The embodiment shown in FIGS. 10-11 activates a full version of the operating system when the flip-up lid is open. In another embodiment, the enterprise launches a full version of the operating system when the flip lid is open and executes a modified version that operates with minimal power and processing power when closed. A flip-up peripheral device 99 and an I / O peripheral device 97 are simultaneously coupled to the same modular processing device.

  In a further embodiment, the modular processing unit is used as an MP3 player and / or a video player. In another embodiment, a camera is used as a peripheral device and images / videos are stored on a modular processing unit.

  As indicated above, embodiments of the present invention are extremely versatile. As a further example, the process control unit 40 is used to physically support various equipment or devices such as lighting fixtures (FIG. 12), electrical outlets (FIG. 13), breaker boxes (FIG. 14), and They can / or be provided with processing. As shown herein, at least some embodiments of the present invention include a modular processing unit that functions as an engine that drives / controls the operation of various components, structures, assemblies, equipment modules, and the like.

  Referring now to FIG. 12, a representative enterprise is shown, where a dynamically modular processing unit is used in a typical consumer electronics. In FIG. 12, the modular processing unit 40 is incorporated in the luminaire 100. For example, the modular processing unit 40 monitors the wattage used by the lighting fixture 100 on / off, dimming, and incandescent bulbs, and any maintenance or other desired information required by the lighting fixture 100. Can be used to control other attributes, such as notifying the control center. In the illustrated embodiment, the modular processing unit 40 is attached to the ceiling structure by means of a sliding engagement fitting 102 and is slid into a sliding receiver (not shown) located within the main support of the modular processing unit 40. It is attached to the luminaire 100 using the bracket sliding engagement type illumination module 104. As shown, the lighting module 104 can support one or more bulbs. In the illustrated embodiment, the modular processing unit 40 is also attached to a sliding engagement dimmer 194.

  Referring to FIG. 13, a representative enterprise is shown, in which a dynamically modular processing unit 40 having an exterior that is not based on peripheral devices is used in another representative electrical device. Such devices are electrical outlets or plugs used for 802.11x distribution. In FIG. 13, the modular processing unit 40 is coupled to an AC interface 107, an AC plug peripheral device 108, and a mounting bracket 109. The AC plug peripheral device 108 and the mounting bracket 109 are sliding engagement type peripheral devices. The modular processing unit 40 is powered by ac power distribution into the unit 40 and is used as a smart plug to monitor, control, supervise and / or distribute power distribution.

  In one embodiment, unit 40 is used as a router. In another embodiment, unit 40 is used as a security system. In another embodiment, unit 40 monitors power distribution and shuts off power as needed to ensure safety. For example, the unit 40 can detect that an individual contacts power distribution and automatically shuts off power. In some embodiments, multiple enterprises, such as those shown in FIG. 13, are connected via copper wires using technologies such as X10-based technology and other technologies. In further embodiments, multiple enterprises exchange data via, for example, TCP / IP or other protocols.

  Accordingly, embodiments of the present invention include utilizing a modular processing unit in conjunction with everyday products to form smart products. Other examples of products, systems and devices that can be used together to provide smart products, systems, and / or devices using modular processing units include heating systems, cooling systems, water distribution systems, power distribution Systems, furniture, equipment, equipment, tools, drills, tools, buildings, artificial intelligence, vehicles, sensors, video and / or audio systems, security systems, and many more products, systems, and / or devices are included.

  For example, a modular processing unit associated with the furnace can be used to control the efficiency of the furnace system. If the efficiency drops, the modular processing unit can be programmed to communicate to the building owner via email, such as replacing the filter, servicing the system, identifying the fault, etc. it can. Similarly, a modular treatment unit in connection with water supply can be used to monitor multiple waters and provide alerts when contamination occurs. Similarly, appliances (eg, washing machines, dryers, automatic dishwashers, refrigerators, etc.) can be smart when used in connection with modular processing units. In addition, modular processing units should be used in connection with systems that provide safety, including detecting carbon monoxide, anthrax and other biological factors, radiators, or other agents or harmful substances. Can do. Furthermore, thanks to the stability and versatility of the processing unit, the modular processing unit can be placed in a location that was not previously available. In at least some embodiments, the modular processing unit is used with a superstructure to allow the modular processing unit to take on the quality of the superstructure.

  Referring now to FIG. 14, a representative enterprise is shown, in which one or more dynamically modular processing units are used in another representative device, a voltage monitoring breaker box. In the illustrated embodiment, the modular processing unit 40 is used to convert the standard breaker box 114 into a voltage monitoring breaker box 110. The dual redundant modular processing unit 40 in the breaker box 110 and throughout the house functions to process control the breaker box 110 and monitor the voltage in real time. A voltage monitoring back plate 112 is attached to each modular processing unit 40, and the back plate 112 is attached using a slide receiver. Although the illustrated embodiment comprises two modular processing units, those skilled in the art will appreciate that other embodiments include the use of one modular processing unit or more than two processing units.

  Referring now to FIG. 15, another representative enterprise is shown, where one or more dynamically modular processing units are used in a representative apparatus. In FIG. 15, the modular processing unit 40 is used in the load bearing configuration of the table assembly 120, and the table assembly 120 is coupled to the respective slide receiver on the corresponding modular processing unit 40 to connect the table assembly 120. A sliding engagement type leg mount 122 constituting the leg is used. In the illustrated configuration, a plurality of modular processing units 40 are physically and electronically coupled together to form the main physical structure of the table assembly 120. Also illustrated is a sliding engagement DVD and hard drive module 124 that allows the table assembly 120 to perform certain functions. Also shown is a connector 126 that supports a plurality of modular processing units.

  These examples are merely illustrative of the functionality of one or more modular processing units according to embodiments of the present invention. Indeed, those skilled in the art will appreciate that embodiments of the invention include many other configurations, environments, and settings, all of which are intended to be within the scope of embodiments of the invention.

  As shown herein, the dynamic and modular nature of the processing unit allows for one or more processing units that can be used with any type of enterprise. Referring now to FIG. 16, enterprise 130 is a server array configured for server clustering, each having an exterior that is not based on peripheral devices housed in cabinet 134, and can be used for data processing. A dynamically modular processing unit 132 is included. In the illustrated embodiment, the cabinet 134 includes a drawer that receives the modular processing unit 132. Enterprise 130 further includes a mass storage device 136 for storing data.

  Although FIG. 16 shows a cabinet that includes drawers configured to receive individual processing units / cubes, other embodiments of the present invention may be used with units / cubes to mount processing units / cubes on bars. Including using mounting hardware that can be used in conjunction. The illustrated embodiment further includes a cooling system (not shown) that allows for temperature management within the cabinet 134 and utilizes vents 138.

  The modular nature of the processing unit / cube is shown by using processing units in the various representative enterprises shown. Embodiments of the present invention can chain units / cubes in copper and / or Fiber Channel designs, combine cubes in series or parallel, and specify individual cubes to perform specific processing tasks As well as other processing configurations and / or assignments.

  Each unit / cube includes a fully reconfigurable motherboard. In one embodiment, one or more processors are located on the motherboard backplane and the RAM module is located on a plane perpendicular to the motherboard backplane. In a further embodiment, the module is directly coupled to the substrate rather than using a conventional socket. The unit clock cycle is optimized for the RAM module.

  One way to improve the processing power of the enterprise includes adding one or more additional processing units / cubes to the enterprise, while another way is to add a specific unit / cube motherboard surface. Replacing the face with the upgraded module. Similarly, the interfaces available in each unit / cube can be renewed by selectively replacing the unit / cube panels. In addition, by replacing one or more panels, a 32-bit bus can be upgraded to a 64-bit bus, new functions can be provided, new ports can be provided, Systems can be provided / renewed and other such modifications, upgrades, and enhancements can be added to individual processing units / cubes.

  FIGS. 21-26 illustrate a modular motherboard assembly having three electronic circuit boards 310, 312, 314. These electronic circuit boards 310, 312, 314 are operatively connected using a connector 316. These drawings also show the assembly of the computer system, where the modular motherboard is inserted into a housing 322, 320 having two end caps / plates 324.

  Thus, in one aspect, a modular motherboard includes a first electronic circuit board that performs a first function and a second electronic circuit board that performs a second function, and includes an integrated logic board for a computer system. To provide, the first substrate and the second substrate are operably connected.

  Modular motherboard implementations include one or more of the following features. The third electronic circuit board may perform the third function. The third electronic circuit board can be operatively connected to the first electronic circuit board. The first, second, and third electronic circuit boards can form a three-board configuration. The first function and the second function may include at least one of (i) electronic storage, (ii) electronic memory, (iii) processing functions, and (iv) a basic I / O system. The first electronic circuit board can include a first bus operably connected to a second bus of the second electronic circuit board.

  In another aspect, a modular processing unit includes an exterior and a plurality of interconnected circuit boards coupled to the exterior, wherein the first circuit board of the plurality of interconnected circuit boards is a first. The second circuit board of the plurality of interconnected circuit boards performs the second function.

  Modular motherboard implementations include one or more of the following features. The first function may include an electronic storage area, and the second function may include a processor. The exterior is an exterior that is not based on peripheral devices. The modular motherboard can further include a replaceable backplane coupled to the exterior. A third circuit board of the plurality of circuit boards can include a basic I / O system. The first circuit board of the plurality of circuit boards may further include an electronic memory. A fourth circuit board of the plurality of circuit boards may include an electronic memory. The plurality of interconnected circuit boards may have a three board configuration. The plurality of interconnected circuit boards may have a four board configuration. A first substrate and a second substrate of the plurality of interconnected circuit boards can be coupled to the sheath independently and interchangeably. A second substrate of the plurality of interconnected circuit boards can be removed from the exterior and replaced with a new circuit board. The plurality of interconnected circuit boards can include three interconnected circuit boards.

  In another aspect, a method of providing a modular motherboard includes providing a first electronic circuit board in a first plane, the first electronic circuit board having a first bus system. Providing a circuit board; and providing a second electronic circuit board in a second plane, the second electronic circuit board having a second bus system, and providing a second electronic circuit board. And mechanically coupling the first electronic circuit board to the second electronic circuit board, and electrically interconnecting the first bus system to the second bus system, the motherboard comprising: Perform logic functions for computer systems.

  Modular motherboard implementations include one or more of the following features. The first electronic circuit board can have a first function, and the second electronic circuit board has a second function. The first function and the second function may include at least one of (i) electronic storage, (ii) electronic memory, (iii) processing functions, and (iv) a basic I / O system. The method can further include providing a third circuit board in a third plane, the third circuit board having a third function. The method can further include providing a dynamic backplane.

Modular Motherboard Connector In some embodiments, the modular processing unit includes a modular motherboard consisting of two or more electronic circuit boards connected using one or more motherboard connectors (“connectors”). The connector provides electronic connection and mechanical support to the interconnected circuit board. In some embodiments, a connector provides a high speed electronic communication function between two interconnected circuit boards. Using high-speed connectors, the modular motherboard functions like a non-modular motherboard. An example of a motherboard connector is shown in FIGS.

  Referring now to FIG. 19, a modular motherboard 200 is shown that includes a first electronic circuit board 202 and a second electronic circuit board 204. On the electronic circuit boards 202 and 204, several motherboard components 206, 208, 210, 212, and 214 are included. The first circuit board 202 includes a first connector 216, and the second circuit board 204 includes a second connector 218. As shown, these connectors are not engaged, but by moving the first circuit board 202 in the direction of arrow 219, the connectors engage each other and a connection is established. The connection of the two circuit boards forms a single modular motherboard.

  In other embodiments, the modular motherboard 200 includes three or more circuit boards (not shown), each connected to another circuit board by one or more motherboard connectors. In yet another embodiment, the modular motherboard includes more than two circuit boards (not shown), and only two of the three more boards are connected by motherboard connectors.

  As shown in FIG. 19, connectors 216 and 218 have corresponding shapes. This correspondence allows connectors 216 and 218 to fully engage. In some embodiments, the shape of each connector includes two or more functional connections or “sub-shapes” of the shape. In this specification, one such subordinate shape is referred to as a “connected subordinate shape”. The connection sub-shape includes the required shape and structure used to electrically and mechanically connect to a connector having a corresponding connection sub-shape. For example, the “connection sub-shape” of FIG. 19 includes slots 213a, 213b, 213c, 213d, and 213e, and elongated protrusions 215a, 215b, and 215c. The slot 213 is configured to securely receive the elongated protrusion 215 to provide mechanical and electrical connections.

  As will be appreciated by those skilled in the art, the connection sub-shape of the motherboard connector can have various forms and shapes to provide a means for mechanical connection with the corresponding connector. FIGS. 19-22 show a connector having protrusions and slots, but other mechanical and / or electrical connectors of any other type capable of mechanically and electrically connecting two electrical circuit boards. Can be used. In some embodiments, the connecting sub-shape is a finger-like protruding portion and cavity, crest and trough, plug and receptacle, latch, fixture, securing device, or any other set of known fits. One or more of the mating structures can be included.

  In some embodiments, the electrical connection is established by contacting electrical contacts disposed on connectors 216 and 218. As used herein, the term “electrical contact” refers to any structure disposed on a connector for establishing an electrical connection between two connectors, as known to those skilled in the art. For example, the contact may be a metal contact pad, such as a copper contact pad. In some embodiments, the motherboard connector includes a ground connector and a plurality of electrical contacts (not shown). In other embodiments, the slot 213 and the elongated protrusion 215 include a plurality of electrical contacts. In some embodiments, electrical contacts are located at the distal end of the protrusion 215 and the internal recess of the slot 213. In other embodiments, the electrical contacts are located throughout the length of the protrusion 215 and the slot 213. In some embodiments, the electrical connector is operable only when the motherboard connector is fully engaged. If the motherboard connector is restricted from being fully engaged, the electrical connector does not provide sufficient electrical communication with the motherboard connector.

  Further examples of connection sub-shapes are shown in FIGS. 20 to 22 and described below.

  In some embodiments, the shape of the connector includes a second sub-shape, “security sub-shape”. The security sub-shape includes one or more security key structures included in the connector shape. The security key structure limits the ability of the connector to connect to any connector that does not have a corresponding security key structure. In some embodiments, some or all of the “security sub-shape” is formed in or on the shape or structure of the connection sub-shape. In other embodiments, the security sub-shape is placed on a separate connector portion from the connection sub-shape. By analogy, the security sub-shapes of the two motherboard connectors act like notches and grooves in the key and keyhole. Like notches and grooves, the security sub-shape places restrictions on mating with a motherboard connector that does not have a corresponding security sub-shape or a corresponding “key configuration”.

  FIG. 20 illustrates a side view of one embodiment of a pair of motherboard connectors 222 and 224. The shapes of the connectors 222 and 224 correspond so that the first connector 222 can mate with the second connector 224 to provide mechanical and electrical connections. The shape of each connector includes a connection sub-shape and a security sub-shape. The connection subordinate shape of the first connector includes a plurality of protrusions 246a-e and a plurality of slots 246a-d. The connection subordinate shape of the second connector 224 includes a plurality of protrusions 248a-d and a plurality of slots 244a-e.

  The shape of each connector includes a security sub-shape. The security sub-shape of the first connector 222 includes a plurality of security key structures 226, 230, 234, and 238. The security sub-shape of the second connector 224 includes a plurality of security key structures 228, 232, 236, and 240. Security sub-shapes of the first connector 222 and the second connector 224 so that the shapes of the first connector 222 and the second connector 224 can mesh and provide an electrical and mechanical connection between the two circuit boards. Corresponds.

  It should be pointed out that if either the first connector 222 or the second connector 224 does not include its security key structure, the two connectors cannot fully engage. Therefore, the security key structure places a limit on mating with a connector that does not have a corresponding security key structure. For example, if the protrusion 246 c of the first connector 222 does not have the security key structure 238, the security mechanism 240 in the slot 244 c restricts the first connector from fully mating with the second connector 224. Provide. Similarly, if the protrusion 248 d does not have the security key structure 232, the second connector 224 cannot fully engage with the first connector 222. The same applies to the other security key structures 226, 228, 234, and 236 of the two connectors 222 and 224.

  FIG. 21 shows a three-dimensional view of another embodiment of two corresponding motherboard connectors 260 and 262. The first connector 260 includes a number of elongated protrusions 264 and slots 266. Similarly, the second connector 262 includes a number of elongated protrusions 270 and slots 268. These protrusions and slots include a connection sub-shape of each connector corresponding to the connection sub-shape of the other connector. Each connector includes several security key structures that make up its security sub-shape. For example, the first connector 260 includes three security key structures 272, 274, and 276. Similarly, the second connector 262 includes three security key structures 278, 280, and 282 corresponding to the security key structure of the first connector 260. Like the security key structure of FIG. 20, the security key structures of FIG. 21, these security key structures place restrictions on fully mating with another connector that does not have a corresponding security key structure. Note that security key structures 272 and 280 prevent any degree of mating with a connector that does not have a corresponding key structure.

  FIG. 22 shows another three-dimensional embodiment of two corresponding motherboard connectors 290 and 292. Motherboard connectors 290 and 292 include corresponding shapes, including corresponding connection sub-shapes and security sub-shapes. These connectors, like the connectors of FIGS. 20-21, have a connecting sub-shape that includes several corresponding elongated protrusions and slots. These connectors also have a corresponding security sub-shape that includes several security key structures 294, 296, 298, 300, 302, and 304. The security key structure is a kind of notch and groove that is uniquely arranged on the protrusion of the connector to prevent it from engaging with any connector having a non-corresponding shape.

  As will be appreciated by those skilled in the art, the security sub-shape of the motherboard connector can take a variety of forms or shapes. In some embodiments, the security sub-shape includes several different types of security key structures as in FIG. In other embodiments, the security sub-shape includes a single type of security key structure, as in FIG. 22, which includes only notches and grooves.

  Various security key structures can be combined with any security sub-shape. For example, FIG. 20 shows several security key structure types, such as a recessed protrusion 228, an elongated protrusion 236, a first key protrusion 232, and a second key protrusion 238. Each of these security key structures has a corresponding key structure on the opposite connector. FIG. 21 shows another type of security key structure: a curvilinear cutout 272, a triangular cutout 274, and a triangular elongated protrusion 282. FIG. Each of these security key structures has a corresponding security key structure on the opposite connector. FIG. 22 shows various notches 300, 302, and 304 with their corresponding grooves 294, 296, and 298. Those skilled in the art will appreciate that this list of security key structure types is not exhaustive and that a wide variety of security key structures and structure types can be incorporated into the present invention.

  The unique arrangement, size, and shape of the security key structure provides a unique key configuration for the motherboard connector. By changing any one of these features, alternative key configurations can be created. As explained above, in some embodiments, the motherboard connector must be fully engaged in order to establish a sufficient electrical connection. Therefore, if the security key structure prevents two non-corresponding motherboard connectors from fully engaging, those connectors cannot establish an electrical connection and no telecommunications. In some embodiments, the motherboard connector must be fully engaged to establish a secure mechanical connection. For example, the connection sub-shape may include latches, hooks, indentations, etc. that secure the connector when fully engaged. In this way, the security key structure limits the connectivity of the connector that mates with the corresponding security sub-shape.

  In some embodiments, the motherboard connector includes a housing for housing the internal mechanism of the connector. In some embodiments, the housing includes a plurality of internal parallel circuit boards. Each internal circuit board includes at least one signal line and a ground line. The signal line and the ground line are incorporated on the circuit board. These wires connect to the housing at the circuit board interface and at the mating interface. The mating interface provides an electrical connection to the electrical portion of the connector sub-shape of the connector. The circuit board interface connects and transmits electrical signals from the circuit board via connectors. Thus, when two motherboard connectors are interconnected, electrical signals are routed to the mating interface via the circuit board interface of the first connector and then via the signal line. At the mating interface, the electrical signal is sent via electrical contacts on the connected sub-shape of the mated connector. This signal is then routed to the board connector via the signal line via the mating interface of the second motherboard connector, where it is routed to the appropriate electrical component of the second circuit board. In this way, communication signals are transferred between circuit boards interconnected in the modular motherboard system.

  Thus, as discussed herein, embodiments of the present invention encompass systems and methods for providing a dynamically modular processing unit. In particular, embodiments of the invention relate to providing a modular processing unit that is configured to be selectively oriented with one or more additional units within an enterprise. In at least some embodiments, the modular processing unit includes a non-peripheral exterior, a cooling process (eg, a thermodynamic convection cooling process, a forced air cooling process, and / or a liquid cooling process), an optimized layered print Includes a dynamic backplane that provides additional flexibility and support for circuit board configurations, optimized processing and memory ratios, and peripherals and applications.

  The present invention may be embodied in other specific forms without departing from the spirit or essential characteristics of the invention. The described embodiments are to be considered in all respects only as illustrative and not restrictive. The present invention may be embodied in other specific forms without departing from the spirit or essential characteristics of the invention. The described embodiments are to be considered in all respects only as illustrative and not restrictive. The scope of the invention is, therefore, indicated by the appended claims rather than by the following description. All changes that come within the meaning and range of equivalency of the claims are to be embraced by the claims.

  In one aspect, the modular processing unit is a modular motherboard having a first electronic circuit board and a second electronic circuit board, wherein the first electronic circuit board includes a first motherboard connector, and the second electronic circuit The board is a modular motherboard including a second motherboard connector operably connected to the first motherboard connector, and a dynamic backplane coupled to the modular motherboard, the communication between the modular motherboard and an external device Including a dynamic backplane.

  Modular processing unit implementations can include one or more of the following features. The first motherboard connector has a security key structure that restricts the engagement of the first subordinate shape that is surely engaged with the second motherboard connector and the second motherboard connector that does not have a corresponding security key structure. And a second sub-shape having a first shape. The second motherboard connector has a third subordinate shape that securely meshes with the first motherboard connector and a fourth subordinate shape that has a security key structure corresponding to the security key structure of the first motherboard connector. A second shape can be included, including a shape. The first electronic circuit board can be in a first plane and the second electronic circuit board is in a second plane. The modular processing unit can further include a non-peripheral exterior that is coupled to the modular motherboard.

Customizable Computer Processing Unit With particular reference to FIGS. 27 and 28, the present invention features a unique non-peripheral device or a non-peripheral processing control unit 402 shown in perspective view in an exemplary embodiment, These drawings show. In its simplest form, the process control unit 402 includes a unique exterior module 410 as well as a unique printed circuit board design (shown in FIG. 34). The processing control unit 402 provides unique computer processing advantages and features not found in prior art processing units or computers due to the constant and calculated design of the exterior module 436. Indeed, the process control unit of the present invention described and claimed herein produces a complete conceptual change or paradigm shift from a conventional computer or process control unit. This paradigm shift will become apparent from the following disclosure, which is embodied in the appended claims.

  27 and 28 show the process control unit 402 in a fully assembled state, and many of the main components of the process control unit 402 are shown generally. As previously mentioned, the process control unit 402 includes an exterior module 410 that itself has a very unique and unique support structure and geometric configuration or design that will be described more fully with respect to FIG. In certain exemplary embodiments and presently preferred embodiments, the exterior module 410 includes a sealed housing or exterior for one or more processing components such as printed circuit boards, processing chips, circuits, and other computer components. A main support chassis 414, a first insertion portion 466, a second insertion portion 470, a third insertion portion 474 (not shown), a dynamic backplane 434 (not shown), and a first end plate 438 are provided. , A second end plate 442 (not shown), a first end cap 446, and a second end cap 450.

  FIGS. 29 and 30 illustrate an exemplary embodiment of a main support chassis 414 and some of the components of the exterior module 410 that are designed to be added to or coupled to the main support chassis 414. Preferably, these components are attached to the main chassis 414 as shown to enable some of the unique features and functions of the process control unit 402 described and described herein. Removably connect. The main support chassis 414 serves as a main support structure for the exterior module 410 and the process control unit 402. The small size and unique design of the main support chassis provides advantages and benefits not found in prior art designs. In essence, the main support chassis 414 is known not only to provide structural support to the components of the process control unit 402, including any additional physical appendages, processes and other circuit board components. It enables the processing control unit 402 to be adapted to any kind of environment, such as incorporation into any existing structure or system, or use in clustered and multiplex environments.

  Specifically, as shown in FIGS. 29 and 30, the process control unit 402, particularly the exterior module 410, is configured with a substantially cube-shaped design, and includes a first side wall support 418, a second side support 418 of the main support chassis 414. When attached together with the side wall support 422 and the third side wall support 426, the dynamic backplane 434 constitutes the four sides of the exterior module 410, and a connecting module or junction center 54 is disposed at each corner of the exterior module 410. .

  In some embodiments, the junction center 454 not only integrally couples the first sidewall support 418, the second sidewall support 422, and the third sidewall support 426, but also attaches the end plates discussed below. It serves to provide a base that can. The end plate is coupled to the main support chassis 414 using attachment means inserted into the attachment receptacle 490, which is shown as a gap in FIG. It does not have to depend on the type of attachment means.

  In some embodiments, as discussed below, the junction center 54 further provides main support and junction center for at least a portion of the unique printed circuit board design within the process control unit 402. As shown in FIG. 29 (and as described in more detail below with respect to FIG. 36), a printed circuit board or a substrate that supports the printed circuit board (both not shown in FIG. 29) is connected to one or more channels. It can be inserted into the board support 462 and fixed therein. The particular designs shown in the drawings and described herein are merely examples of one embodiment or means for securing or engaging a printed circuit board within the process control unit 402. As will be appreciated by those skilled in the art, other designs, assemblies, or devices are contemplated and can be used. For example, means for securing the processing components may include screws, rivets, interference fits, and other means commonly known.

  The main support chassis 414 is used to combine two or more process control units, or one to allow the process control unit to be mounted in another structure, such as a Tempest superstructure. Or a plurality of slide receivers 482 designed to receive a plurality of inserts, dynamic backplanes, or corresponding inserts located on some mounting bracket. The slide receiver 482 can also be used to receive or receive a suitable element of the structure or the structure itself or the device itself, and the process control unit, particularly the exterior module, acts as a load bearing member. The ability of the process control unit 402 to act as a load bearing member stems from its unique chassis design. For example, the process control unit 402 can be used to link two structures together and contribute to the overall structural support and stability of the structure. In addition, the process control unit 402 can withstand loads directly associated with the main support chassis 414. For example, the process control unit 402 can physically support a computer screen or monitor and control the process. As a further example, the process control unit 402 can be used to physically support and process control various household equipment such as lighting fixtures, breaker boxes. Further, if necessary, additional heat sink assemblies can be coupled in a similar manner to the exterior of the process control unit 402. Many other possible load-bearing situations or environments are possible and are contemplated herein. Accordingly, what is explicitly listed herein is by no means limiting and is merely exemplary. The slide receiver 482 is illustrated as a generally cylindrical channel that extends from end to end of the junction center 454 of the main support chassis 414. The slide receiver 482 only includes one means for coupling external components to the main support chassis 414. As will be appreciated by those skilled in the art, other designs or assemblies are also contemplated and can be used to perform the intended function, providing a means for attaching the various components as described above.

  FIGS. 29 and 30 further illustrate the concave nature of the main support chassis 414, particularly the first sidewall support 418, the second sidewall support 422, and the third sidewall support 426. The first insertion member 466, the second insertion member 470, and the third insertion member 474 include corresponding concave designs. Each of these components further includes a well-calculated radius of curvature, so that the first sidewall support 418 includes a radius of curvature 420 corresponding to the radius of curvature of the counterpart incorporated in the first insert 466. . Similarly, the second side wall support 422 includes a radius of curvature 424 corresponding to the radius of curvature of the counterpart to be included in the second insertion portion 470, and the third side wall support 426 is within the third insertion portion 474. A radius of curvature 428 corresponding to the radius of curvature of the counterpart to be included is included. As shown in FIGS. 31 and 32, end plates 438 and 442 and end caps 446 and 450 each include a similar design profile to match the concave design profile of main support chassis 414. In the embodiment shown in FIGS. 29 and 30, the sidewall support includes a radius of curvature of approximately 2.8 inches and the insert member includes a radius of curvature of approximately 2.7 inches. The concave design and calculated radius of curvature contribute to the overall structural rigidity and strength of the main support chassis 414, respectively, and contribute to the thermodynamic heat dissipation characteristics of the process control unit 402. For example, in the natural convection cooling system described in more detail below, the concave design facilitates the distribution of hot air outside the exterior module 410, primarily in the upper corners, thereby dissipating heat or hot air into the processing control unit 402. Allows to dissipate from the top and center of the interior towards the upper right corner and the upper left corner, where heat or hot air can escape through the ventilation port 498 (FIG. 31), or where heat or Hot air can be further guided through the top of the exterior module 410. Other embodiments are possible where the radii of curvature of these elements can differ from one another in order to achieve an optimal design of the exterior module 410 as required.

  In a preferred embodiment, the main support chassis 414 includes a fully metal chassis that is configured and designed to provide a very strong support structure for the process control unit 402 and the components contained therein. Under normal circumstances, and even under extreme conditions, the main support chassis 414 may cause scratches or dents that would normally cause the conventional associated computer exterior to be damaged, It can withstand the very strong forces and impact forces applied from various external sources, such as the forces that limit its use in the environment.

  In essence, the main support chassis 414 is the main contributor to providing the process control unit 402 with a virtually unbreakable computer enclosure. This unique feature in the computer exterior is directly related to the specific design of the components used to construct the exterior module 410, which includes the geometric design of those components, their Other factors such as how the components combine, the material composition of those components, and the thickness of the material are included. In particular, the exterior module 410 is preferably made entirely round, and almost all existing features and elements include rounds. This rounding principle is utilized so that any load applied to the process control unit 402 functions to be transferred to the outer edge of the process control unit 402. Therefore, when a load or pressure is applied to the upper part of the exterior module 410, the load is transmitted along the side to the upper surface and the bottom surface, and finally transmitted to the corner of the exterior module 410. In essence, any applied load is transferred to the corner of the process control unit 402 where the maximum strength is concentrated.

  The processing control unit 402 and its components, namely the exterior module 410, the main support chassis 414, the inserts 466, 470, and 474, the dynamic backplane 434, and the end plates 438 and 442 are preferably using an extrusion process. Each is manufactured from metal. In an exemplary embodiment, the main support chassis 14, the first insert 466, the second insert 470, and the third insert 474, dynamic to provide the exterior module 410 with strong yet lightweight features. The backplane 34, as well as the first end plate 38 and the second end plate 42 are made of good quality aluminum. Furthermore, the use of a metal sheath provides excellent heat transfer properties. Preferably constructed from aluminum or various grades of aluminum and / or aluminum composites, but depending on the user's specific needs and / or desires, titanium, copper, It is contemplated that various other materials can be used, such as magnesium, newly realized mixed metal alloys, iron, and other metals and metal alloys, and plastics, graphite, composites, nylon, or combinations thereof.

  In essence, the environment in which the process control unit is to be used greatly affects the specific material composition of its components. As mentioned above, an important feature of the present invention is that the process control unit can be adapted and used in several applications and in several different and / or extreme environments. As such, the specific design of the process control unit relies on every effort to utilize the appropriate material. In other words, the process control unit of the present invention intends to use and include a predetermined and clearly specified material composition that best meets its needs in light of the intended application. . For example, in a liquid cooling model or liquid cooling design, a denser metal such as titanium can be used to give the process control unit better thermal insulation properties.

  Given its preferred aluminum composition, the exterior module 410 is very strong, lightweight, and easy to move, resulting in significant benefits for both end users and manufacturers. For example, from the end user's perspective, the processing control unit 402 can be adapted for use in a variety of environments where a conventional associated computer has not been found. In addition, the end user essentially hides and covers the processing control unit 402 in order to achieve a more aesthetically pleasing room or a more aesthetically attractive workstation, Or can be camouflaged.

  From a manufacturing point of view, the exterior module 410 and the process control unit 402 are such as automatic aluminum extrusion process combined with an automatic robotics process to install or assemble each of the components as revealed above. It can be manufactured using one or more automated assembly processes. Equally advantageous is that the exterior module 410 can be readily mass produced for applicability to extrusion and robotic assembly processes. Of course, the process control unit 402 is manufactured using other known methods, depending on the specific features desired and the specific intended use of the process control unit, such as die casting, injection molding, manual assembly, etc. You can also

  Furthermore, since the exterior module 410 is small and relatively light, transportation costs and manufacturing costs are also very low.

  With continued reference to FIG. 30, there are shown the main parts of the exterior module 10, namely the main support chassis 414, and several inserts designed to be removably added or coupled to the sides of the main support chassis 414. ing. FIG. 26 also shows an exemplary embodiment of a dynamic backplane 434 that is designed to be removably added or coupled to the rear end of the main support chassis 414.

  Specifically, the first insertion portion 466 is added to the first side wall support 418. A second insert 470 is added to the second sidewall support 422. The third insertion portion 474 is added to the third side wall support 426. Further, each of the first insertion portion 466, the second insertion portion 470, and the third insertion portion 474, and the first side wall support 418, the second side wall support 422, and the third side wall support 426, Includes approximately the same radius of curvature to engage or combine in a nested or mating relationship.

  Each of the first insertion portion 466, the second insertion portion 470, and the third insertion portion 474 includes means for coupling to the main support chassis 414. In one exemplary embodiment, as shown in FIG. 30, each insert includes two insert engagement members 478 located at opposite ends of the insert. The engaging member 478 is designed to fit within a means for engaging or coupling to various external devices, systems, objects, etc. (hereinafter external objects), the means for engaging being the main support chassis. 414 is formed. In the illustrated exemplary embodiment, the means for engaging the external object includes a plurality of slide receivers 82 located along the main support chassis 414, as shown in FIG. 29 and revealed above. Other means are also contemplated, such as utilizing various mounting components that span snaps, screws, rivets, interlock systems, and any other means commonly known in the art.

  The dynamic backplane 434 is also designed or removably coupled to the main support chassis 414 so that it can be removed. The dynamic backplane 434 includes means for engaging the main support chassis 414. In the illustrated exemplary embodiment, the means for engaging consists of two engaging members 486 located at opposite ends of the dynamic backplane 434. In order to removably attach the dynamic backplane 434 to the main support chassis 414, the engagement members 486 are within the channeled substrate receiver 462 at respective positions along the rear end of the main support chassis 414 (shown as a space 430). Get stuck. Accordingly, in at least some embodiments, the dynamic backplane 434 can be slidably received within the main support chassis 414 and slidably removed from the main support chassis 414. These particular features are intended as one of several possible configurations, designs, or assemblies. Accordingly, those skilled in the art will recognize other means that can be used to attach the dynamic backplane 434 to the main support chassis 414, other than those clearly shown in the drawings and described herein.

  Means for engaging external objects, in particular sliding receivers 482, can vary from inserts 466, 470, and 474, fittings, other process control units, any other required devices, structures, assemblies, etc. Various types of external objects can be combined. As shown in FIG. 30, the slide receiver 482 engages removably on the corresponding engagement member 478 to allow each insert to slide in and out as required. . As previously mentioned, other means for coupling the main support chassis 414 and other means for engaging external objects are contemplated herein and will be apparent to those skilled in the art.

  By allowing each insert and dynamic backplane 434 to be removably or detachably coupled to the main support chassis 414, several significant advantages for the processing control unit 402 over the conventional associated computer exterior. Is achieved. For example, it is not intended to be limiting in any way, and the first insert 466, the second insert 470, and the third insert 474 may be removed, replaced, or replaced for aesthetic purposes. it can. These inserts can have a variety of colors and / or textures, thereby making the process control unit 402 customizable to suit a particular hobby or to suit a given environment or setting. . In addition, greater versatility is achieved by allowing each end user to specify the look and overall impression of his particular unit. The removable or replaceable insertion member also provides the ability to brand the process control unit 402 (eg, with a logo or trademark) to any company entity or individual that uses the unit. Since these inserts are external to the main support chassis 414, the inserts can take on any form or branding as desired.

  Apart from beauty, there are other benefits. For example, the dynamic backplane 434 can be removed, replaced (as discussed below), and replaced with another dynamic backplane so that the processing control unit 402 is process coupled with various external devices. Can be easily customized.

  At another level of versatility, the means for engaging external objects provides the processing control unit 402 with the ability to be robust and customizable to create smart objects. For example, the process control unit can be docked with a mobile setting or with its own docking station, where the process control unit could not include boats, cars, airplanes, and previously process control units or processes It can act as a control unit for any conceivable object, such as other items or devices that were difficult or impractical to include.

  Referring to FIG. 31, means for coupling to each of first end 440 and second end 444 of main chassis 414 to allow air to flow in or out of processing control unit 402 inside and outside. A view of one of the first end plate 438 or the second end plate 442 that serves to provide First end plate 438 and second end plate 442 function in conjunction with first end cap 446 and second end cap 450 (shown in FIG. 32), respectively, to provide a protective and functional cover. To module 410. First end plate 438 and second end plate 442 are attached to main support chassis 414 using attachment means 510 (as shown in FIG. 27). The attachment means 510 typically includes various types of screws, rivets, and other fasteners commonly known in the art, but the first end cap 446 and the second end cap 450. In addition, other systems or devices commonly known in the art for attaching the first end plate 438 and the second end plate 442 to the main support chassis 414 may be included. In the exemplary embodiment, attachment means 510 includes screws that can fit within respective attachment receptacles 490 located in junction centers 454 at four corners of main support chassis 414 (attachment receptacle 490 and junctions). The center 454 is shown in FIG. 29).

  Structurally, the first end plate 438 and the second end plate 442 include a geometric shape and design that matches the geometric shape and design of the end portions 440 and 444 of the main support chassis 414. In particular, as shown in FIG. 31, the cross-sections of the outer edges of the first end plate 438 and the second end plate 442 include a series of concave edges, which are the side wall support and dynamic Each has a radius of curvature that matches the radius of curvature of the backplane. In essence, the end plates 438 and 442 serve to close the end of the outer module 410 by adapting to the shape of the outer module 410 no matter what.

  One of the primary functions of the first end plate 438 and the second end plate 442 is to facilitate or enable air inflow into and out of the exterior module 410. Is to provide. In the exemplary embodiment shown in FIG. 31, such means includes a plurality of openings or ventilation ports that are intermittently spaced along the surfaces or faces of end plates 438 and 442 and extend across end plates 438 and 442. 498.

  In one embodiment, the process control unit 402 utilizes natural convection to cool the process components contained therein. By providing ventilation ports 498 on the end plates 438 and 442, ambient air can enter the interior of the process control unit 402, while hot air arising from the processor and other components located within the process control unit 402 is Can escape or flow from inside to outside environment. Due to natural physics, the hot air rises and is pushed out of the exterior module 410 when cooler air is drawn into the exterior module 410. Each of the ambient air inflows and hot air outflows is performed by the process control unit 402 utilizing a natural convection cooling system, an internal heat sink (discussed below), and other internals that function or operate within the process control unit 402. Allows the component to be cooled. Ventilation ports 498 are preferably numerous and extend over most of the surface area of endplates 438 and 442, especially the outer peripheral region, thereby enabling enhanced and efficient cooling of all internal components in the air-cooled model. To do.

  In some embodiments, the ventilation port 498 is machined to precise specifications to optimize airflow and reduce partial flow into the exterior module 410. Suppressing some flow prevents dust and other deposits or particles from entering the exterior module 410, which can damage the processing control unit 402 and degrade performance. In fact, the ventilation port 498 is preferably sized so that only air particles can flow through it.

  Since the exterior module 410 is preferably made of metal, the entire structure or part of the structure can be positively or negatively charged to prevent dust or other particles or deposits from being attracted to the exterior. Such charging also prevents the possibility of electrostatic charges jumping over dust and other elements and damaging the main board. Bringing up the charge is similar to ion filtering, just the opposite. By charging the exterior module 410 negatively, all positively charged ions (that is, dust, dust, etc.) do not come close.

  FIG. 6 illustrates a first end cap 446 and a first end cap 446 designed to fit into the first end plate 438 and the second end plate 442, respectively, and a portion of each end 440 and 444 of the main support chassis 414. A second end cap 450 is shown. These end caps are preferably made from a type of shock absorbing plastic or rubber, thereby providing a protective barrier to the process control unit 402 and serving to enhance the overall appearance and impression of the process control unit 402.

  In one presently preferred embodiment, the processing control unit 402 is configured with a rather small bottom area or size compared to a conventional computer exterior. For example, in the presently preferred embodiment, the process control unit 402 is approximately 3.6 inches long, 3.6 inches wide, and 3.6 inches high, and is suitable for desktop computers or even the most portable. Much smaller than previous related conventional processing control units, such as working computers and laptops. In addition to its reduced dimensional characteristics, the process control unit 402 also includes inherent geometric characteristics. Figures 27 and 28 illustrate this unique shape or geometry, most of which are discussed above. These dimensional and geometric characteristics are formally unique and contribute to the specific and unique functional aspects and performance of the process control unit 402. They also provide or serve significant features and advantages not found in conventional associated process control units. In other words, the unique design of the process control unit 402 described and illustrated herein functions in a way that the process control unit 402 would otherwise be impossible with previous associated conventional computer exterior and processing units. And allow it to operate in an otherwise impossible environment.

  It is important to note that the process control unit 402 may take on any size and / or geometric shape. In the preferred embodiment, the process control unit 2 has a generally cubic shape having a size of about 3.6 inches x 3.6 inches x 3.6 inches, although other sizes and shapes are within the scope of the present invention. Intended to be included. For example, the process control unit can be approximately rectangular, cylindrical, triangular, polygonal, irregularly shaped, etc. In particular, as described herein, the process control unit can be adapted for use with a variety of structures or superstructures, such as any contemplated by those skilled in the art. In that sense, the process control unit 402 must be able to configure the appropriate size and structure so that it can exhibit the physical attributes of its intended environment. For example, if the process control unit is used in a thin mobile terminal, the process control unit is constructed with a physical design that has a thin cross-section, thus leaving the cube-like shape of the preferred embodiment. As such, the various computer and processing components used within the processing control unit 402 are also capable of associated sizes and shapes and designs.

  As is apparent from its size, in some embodiments, the processing control unit 402 does not include peripheral components that are typically in some prior art computer enclosures, such as desktops, personal computers, laptops, and the like. Thus, in some embodiments, the process control unit 402 is referred to as “not based on peripheral devices”. In fact, the process control unit 402 includes its own non-peripheral design, and the term “peripheral device” is commonly known in the art and includes several existing types that are generally housed within prior art computer enclosures. Refers to any one or all of the components. In some preferred embodiments, any peripheral devices are process-coupled to the process control unit 402 but are not physically included in the unit structure. Peripheral devices can be attached or coupled using the methods described herein, such as by a sliding engagement system or a snap engagement system. Obviously, however, the processing control unit 402 can be designed as needed to include any conventional peripheral devices found in the prior art, such as hard drives, CD-ROM drives, memory storage devices, and the like. Thus, the present invention is not limited to non-peripheral designs.

  Some of the most common types of peripheral devices or peripheral components are mass storage devices or media storage devices (eg, hard disk drives, magnetic disk drives, magnetic cassette drives, solid state memory drives, floppy disk drives, CD-ROMs) Drive, DVD drive, Zip drive, etc.), video card, sound card, and built-in modem. All of these types of peripheral devices or components are typically not physically supported by the exterior module 410 and processing control unit 402, or even if not actually physically within them. It is still intended that the process control unit 402 still correspond to the design, be functional and / or operable. It should be noted that these described devices are typically considered peripheral devices. However, these items may be integrated or embedded within the printed circuit board design of the process control unit 402, and that item does not constitute a peripheral device or is not considered a peripheral device, but rather a printed circuit board of the process control unit 402. Part of the logic associated with the design. For example, a video card and a sound card may be part of one or more logic on a printed circuit board (discussed below) disposed within the processing control unit 402.

  Although it is preferred not to include internal peripherals as revealed above, the processing control unit 402 nevertheless preferably includes a system bus as part of its internal architecture. The system bus is designed to function as is generally known in the art and is configured to connect and operate various external components and peripheral devices that are otherwise internal. The system bus also allows data to be exchanged between these components and the processing components of the processing control unit 402.

  The system bus may include one of a variety of bus structures including a memory bus or memory controller, a peripheral bus, or a local bus using any one of a variety of bus architectures. Typical components connected by the system bus include a processing system and memory. Other components may include one or more mass storage device interfaces, one or more input interfaces, one or more output interfaces, and / or one or more network interfaces.

  Although designed or intended to outperform conventional related computer systems, the processing control unit 402 is designed to be at least as functional as these computer systems. Thus, everything a user can do on a typical or commonly known computer system (eg, a desktop computing system) can be done on the computer system of the present invention. From a practical point of view, this means that many functions are obtained without sacrificing any function or operation. Thus, in order to achieve this using the unique design described herein, the processing control unit 402 must be able to perform similar tasks as a conventional associated computer or computer processor, and It must have access or access to the components necessary to perform such tasks.

  In order to function as a computing unit, the process control unit 402 may identify these various peripheral devices and other hardware components, even if they are located outside or away from the exterior module 410. Even if it is preferably located, it includes the means necessary to connect. Accordingly, the processing control unit 402 of the present invention includes various connection means for providing the required links between each peripheral device and the processing components included within the processing control unit 402.

  For example, one or more mass storage device interfaces may be used to connect one or more mass storage devices to the process control unit 402 system bus. A mass storage device and its corresponding computer-readable medium includes data and / or executable instructions that may include one or more program modules, such as an operating system, one or more application programs, other program modules, or program data. Provides non-volatile storage. Such a mass storage device is preferably a peripheral device for the processing control unit 402, but allows the processing control unit 402 to hold large amounts of data.

  As noted above, examples of mass storage devices include hard disk drives, magnetic disk drives, tape drives, solid state memory drives, and optical disk drives. Mass storage devices can be read from and / or written to solid state memory units, magnetic hard disks, removable magnetic disks, magnetic cassettes, optical disks, or other computer readable media.

  In a presently preferred example of a suitable mass storage device, FIG. 33 illustrates a mass storage device that includes an expandable memory device 470. In other words, FIG. 33 illustrates one or more peripheral memory components 472 ′, 472 ″, and 472 ′ ″ (collectively and individually with memory components 472 and at least two electrical connectors). 1 illustrates an exemplary embodiment of a peripheral memory device. As shown in FIG. 33, the electrical connector allows the first peripheral memory component 72 ′ to be physically and electrically attached to the processing control unit 402 and other peripheral memory components 472 ″. To do. Although each peripheral memory component 472 can include any suitable number or type of electrical connectors, FIG. 33 illustrates a conventional male connector 474 (where each memory component 472 is disposed on a first surface). FIG. 6 illustrates an embodiment including a male USB connector) and a female connector 476 (eg, a female USB port) disposed on a second surface opposite the first surface. In yet another embodiment (not shown), each memory component 472 includes two male electrical connectors and two female electrical connectors. In such an embodiment, multiple male and female electrical connectors help to speed up the transmission of information to and from various memory components.

  When the processing control unit includes an expandable memory, the individual memory components 472 may have any suitable characteristics. In one example, individual memory components 472 include solid state memory drives, small magnetic hard disk drives, or other computer readable media. However, in some preferred embodiments, each memory component includes a solid state memory drive, such as a flash memory drive, an SRAM-based memory drive, a DRAM-based memory drive, and the like.

  In another example, individual memory components 472 can be stacked to any suitable height. For example, peripheral memory components 472 can be stacked together so that two, three, four, five or more memory components can be stacked and process coupled together. In yet another example, each memory component can include any suitable amount of memory (eg, 32 gigabytes, 64 gigabytes, 100 gigabytes, etc.).

  In yet another example, the memory of expandable memory 470 can be repartitioned manually or automatically. However, in some preferred embodiments, each time an individual memory component 472 is connected to or removed from another memory component 472 connected to the processing control unit 402. In addition, the memory of the expandable memory device is repartitioned automatically or on the fly.

  This expandable memory device can provide several beneficial properties. In one example, the amount of memory available to the processing control unit 402 can be easily increased by connecting another single memory component 472 to the expandable memory 470. In contrast, the amount of memory in the expandable memory 470 can be easily reduced by removing or otherwise removing one or more memory components 472 from the expandable memory 470. In another example, the expandable memory 470 adds outside the processing control unit 402 (eg, via the dynamic backplane 434) so that the expandable memory 470 significantly heats the interior of the processing control unit 402. Does not work. In yet another example, FIG. 33 shows that electrical connectors 474 and 476 serve to physically separate individual memory components 472. In this way, air can flow between the individual memory components 472 by natural convection to cool the memory components.

  Although the expandable memory device 470 has been described above in the context of peripheral devices for the processing control unit 402, the expandable memory 470 is external to any suitable computer, computer system, or other electronic device, Or it should be noted that one skilled in the art will understand that it can be used internally.

  Referring back to the process control unit 402, some embodiments of the process control unit 402 allow a user to enter data and / or instructions into the process control unit 402 via one or more corresponding input devices. Including one or more input interfaces. Examples of such input devices include keyboards and alternatives such as mice, trackballs, light pens, styluses and other pointing devices, microphones, joysticks, game pads, satellite dish, scanners, camcorders, digital cameras, etc. An input device is included. Similarly, examples of input interfaces that can be used to connect input devices to the system bus include serial ports, parallel ports, game ports, universal serial bus (“USB”), firewire (IEEE 1394), An Ethernet connector (RJ-45), or any other suitable interface is included.

  One or more output interfaces can also be used to connect one or more corresponding output devices to the system bus. Examples of the output device include a monitor screen, a display screen (for example, a viewer), a speaker system, a printer, and the like. These specific output devices are also peripheral devices (external) for the processing control unit 402. Examples of the output interface include a video adapter (eg, DVI connector, DVI-I connector, HDMI connector, etc.), an audio adapter (eg, speaker adapter, microphone adapter, etc.), a parallel port, and the like.

  In another embodiment, any peripheral device used is connected directly to the system bus without requiring an interface. This embodiment is filed on Oct. 22, 2003 and is hereby incorporated by reference in its entirety, US Pat. No. 7,075, entitled “Systems and Methods for Providing a Dynamically Modular Processing Unit”. Is fully described in the '784 specification.

  Providing a non-peripheral computer system provides the user with many advantages over a computer unit that is larger and packed with peripheral devices. Some of those advantages may be that the user can reduce the space required to accommodate the computer unit and system. Indeed, the process control unit of the present invention can be placed directly on the desk or completely hidden from view. There are endless potential storage locations. The processing control unit 402 can even camouflage in some kind of desktop component, such as a watch, to hide from view. Other features include a reduction in relative noise and heat generation, and intelligence or “ General applications for incorporating “smart” technology may be included. These and other examples will be apparent from the disclosure herein.

  As described above, the process control unit 402 of the present invention was designed to have certain mainstream components outside the exterior module 410 for a number of reasons. First, because of its small but powerful processing capabilities, the processing control unit 402 can be implemented therein to enhance various devices, systems, vehicles, or assemblies as needed. . Conventional computer workstations can use common peripherals such as dedicated displays, keyboards, etc., but the processing control unit 402 may not have peripherals and is a control unit for many items, systems, etc. It can be customized to be That is, the process control unit 402 may be used to incorporate “smart” technology within any conceivable type of product (external object) so that the external object can perform one or more smart functions. it can. As used herein, a “smart function” is performed by a computer, which can be performed by the external object as a result of the external object being operatively connected and / or physically coupled to the computing system, ie, the processing control unit 402. Can be defined as any kind of function.

  Second, with respect to cooling issues, the majority of the heat generated inside a conventional computer comes from two places: the computer processor and the hard drive. By removing the hard drive from the exterior module 410 and placing it outside the process control unit 402, better and more efficient cooling is achieved. By improving the cooling characteristics of the system, the useful life or life of the CPU itself is increased, and as a result, the useful life and life of the entire computer processing system is increased.

  Third, the process control unit 402 preferably includes an isolated power source. By isolating the power supply from other peripheral devices, the same voltage is used to power the CPU in addition to one or more peripheral components such as hard drives and / or CD-ROMs present in the system In contrast, more of the supply voltage can be used for processing only. In the workstation model, the peripheral components are present without the processing control unit 402 and are preferably powered by the monitor power supply.

  Fourth, in some presently preferred embodiments, no lights or other indicators are used to indicate whether the processing control unit 402 is on or off, or whether there is any disk activity. Operation lights or power lights may still be used, but they are preferably located on a monitor or other peripheral housing device. This system is intended for use in many applications where the light is invisible or useless, or in applications where the light is harmful, such as in dark rooms or other light sensitive environments. Design is preferred. Obviously, however, if so desired, an external light, such as found in conventional computer systems, to indicate power on, disk usage, etc. may be implemented or incorporated within the actual processing control unit 402. .

  Fifth, rather than requiring a type of mechanical or forced air system, such as a blower or fan, a passive cooling system such as a natural convection system can be used to dissipate heat from the process control unit. Of course, such forced air systems are also contemplated for use in some specific embodiments. It should be noted that these advantages are not all inclusive. Other features and advantages will be appreciated by those skilled in the art.

  Referring to FIG. 34, the process control unit 402, in particular, the first end plate 438 and the second end plate 442 (not shown), the first end cap 446 and the second end cap 450, the insertion portions 466, 470 are shown. The assembled exterior module 410 is illustrated with a dynamic backplane 434 attached to the exterior module 410 (not shown) and 874 (not shown). The dynamic backplane 434 is a required port used to couple various I / O devices and power cords to the processing control unit 402 to allow the processing control unit 402 to function specifically within the workstation environment. And related connection means. Although all types of ports that can be used are not specifically illustrated and described herein, any existing port, along with any other type of port that will appear in the future, or essentially its own port, may be the processing control unit 402. It is intended that it can be designed within the process control unit 402 and can function with the process control unit 402.

  The dynamic backplane 434 can include only one type of I / O port (eg, USB port) that requires one type of logic to interface with the CPU of the processing control unit 402, but in the preferred embodiment The dynamic backplane 434 includes a plurality of I / O ports that require a plurality of different logics to interface with the CPU. Thus, it is contemplated that the processing control unit 402 can include any suitable number of ports that require any suitable type of logic. In one presently preferred embodiment, the dynamic backplane 434 includes as many as 14 USB ports, 6 SATA ports, and 2 XGP ports. However, it is anticipated that any desired combination of ports can be provided for the desired application. By way of example only, in one embodiment, the dynamic backplane 434 may include only USB ports and have as many USB ports as can fit within the area of the dynamic backplane 434.

  As mentioned above, the dynamic backplane 434 can be designed in various ways and can be replaced as needed to customize the processing control unit 402 for a particular application. 34-38 illustrate some embodiments of a replaceable backplane 434. FIG.

  Specifically, FIG. 33 shows that the dynamic backplane 434 has a DVI video port 520, 10/100 Ethernet port 524, USB ports 528 and 532, SATA bus ports 536 and 540, a power button 544, and a power source. One embodiment including a port 548 is shown.

  Similarly, FIG. 34 shows that the dynamic backplane 434 includes HD audio I / O ports 500, 502, and 504, USB ports 528, 529, 530, 531, 532, and 533, eSATA ports 536 and 540, and DVI-I. An exemplary embodiment is shown including a port 521, an XGP (ATI XGP) port 522, an RJ-45 Ethernet port 523, an ePCIe port 525, a power button 544, a reset button 546, and a power port 548.

  The embodiment of the dynamic backplane 434 shown in FIGS. 36-38 is similar to the embodiment shown in FIG. 35, but the embodiment shown in FIGS. 36-38 differs from the embodiment shown in FIG. It is different. In one example, the embodiment shown in FIG. 36 includes a second XGP port 527 instead of the ePCLe port 525. In the second example, the embodiment shown in FIG. 37 lacks the reset button 546 and the ePCLe port 525, but further includes an additional USB port 538 and includes an HDM-C port 149. In the last example, in the embodiment shown in FIG. 38, the dynamic backplane 434 lacks the XGP port 527 and electrically couples the HDMI-A port 535 as well as multiple processing units to increase the overall system throughput. It further includes a unique universal port 537 that allows it to.

  Various embodiments of the dynamic backplane 434 (eg, those shown in FIGS. 8A-38) allow the processing control unit 402 to be customized for various applications. In one example, FIG. 35 illustrates that in at least one embodiment, the ePCLe port 525 allows an expandable memory device 470 (eg, a 32 GB SDD hard drive) to be electrically attached to the dynamic backplane 434.

  In another example, the various backplanes 434 shown in FIGS. 34-38 are configured so that the processing control unit 402 can control various numbers of display devices (eg, monitors). For example, FIG. 39 shows an embodiment where the processing control unit 402 includes the dynamic backplane 434 shown in FIG. Specifically, FIG. 39 shows that such a dynamic backplane allows the processing control unit 2 to control up to six monitors 601, 602, 603, 604, 605, and 606 simultaneously. In particular, FIG. 39 shows that the processing control unit 402 can control the two display devices 601 and 602 via its own DVI-I port 521 (shown in FIG. 36). In addition, FIG. 39 shows that the processing control unit 402 can communicate with the other two exteriors via the first XGP port 522 and the second XGP port 527 (shown in FIG. 36), which are Graphical control units 700 and 704 are included, respectively. In turn, each graphical control unit 700 and 704 displays two processing control units 402 via a DVI output port or any other suitable type of port located on each graphical control unit 700 and 704. Allows control of devices (ie displays 603, 604, 605, and 606).

  It should also be noted that the location of various I / O ports within the dynamic backplane 434 may be beneficial for several reasons. By way of example, the I / O port placement in the embodiment of the dynamic backplane 434 shown in FIGS. 34-38 is such that the port placement is optimal routing efficiency on an electrical printed circuit board (described below) within the unit 402. Some preferred embodiments that result in For example, the various I / O port arrangements on the dynamic backplane 434 allow some ports to be directly and electrically connected to one or more printed circuit boards in the module 410.

  While the various components of the dynamic backplane 434 can perform any suitable function, in some embodiments, SATA bus ports 536 and 540 provide storage media peripheral components such as CD-ROM drives and hard drives. Designed to electronically couple and support. In another example, USB ports 528, 529, 530, 531, 532, 533, and 534 provide processing control unit 402, peripheral components such as a keyboard, mouse, and 56k modem, tablet, digital camera, network card. Designed to connect to any other peripheral components, such as a monitor.

  If the dynamic backplane 434 includes a power button, the power button (eg, button 544) can have any suitable characteristics. For example, in some embodiments, the power button 544 has three states: system on for power activation, system off, and system standby. The first two states, system on and system off, indicate whether the process control unit 402 is powered on or powered off, respectively. The system standby state is an intermediate state. Upon powering up and receiving power, the system is instructed to load and boot a supported operating system on the processing control unit 402. When the power is turned off, the process control unit 402 interrupts any ongoing process and initiates an immediate shutdown sequence followed by a standby state, where the system waits for the power-on state to be activated. It remains inactive.

  In this preferred embodiment, the process control unit 402 also includes a unique system or assembly for powering up the system. The system is designed to be active when the power cord and corresponding clip are snapped into the appropriate ports located on the dynamic backplane 434. Once the power cord and corresponding clip are snapped into the power port 548, the system will operate and begin to boot. Even if a power source is connected and the power cord is connected to a conductor in the power port 548, the clip is important because the processing control unit 402 is not powered on until the clip is snapped into place. An indicator may be provided on the monitor or the like to warn or notify the user that the power cord is not fully plugged or not in the proper position.

  A highly dynamic, customizable and replaceable backplane 434 provides support for peripherals and vertical applications. In the embodiment shown in FIGS. 34-38, the backplane 434 provides one or more features, interfaces, functions, logic, and / or components that can make the processing control unit 402 dynamically customizable. Including. The dynamic backplane 434 also includes any suitable mechanism (eg, universal port 537) that electrically couples two or more modular processing units to increase overall system throughput and provide scale processing and symmetric multiprocessing. Can be included. As used herein, the term symmetric multiprocessing can refer to an embodiment in which two or more processing control units that include substantially the same CPU are connected to a shared memory device.

  The corresponding features, interfaces, functions, logic, and / or components along with the illustrated embodiment of the backplane 434 are merely representative, and other embodiments of the invention may include a variety of different features, interfaces, One skilled in the art will appreciate that it includes a backplane having functions and / or components. Accordingly, the processing control unit 402 is enabled by allowing one backplane to be replaced by another backplane in order to allow a user to selectively modify the logic, features, and / or functions of the processing control unit 402. Is dynamically customizable.

  Furthermore, embodiments of the present invention include any number and / or type of logic and / or connectors to enable use of one or more modular processing control units in a variety of different environments. For example, some environments may include vehicle (eg, automobile, truck, motorcycle, etc.) environments, hydraulic control system environments, structural environments, and other environments. Changing the data manipulation system on the dynamic backplane allows scaling vertically and / or horizontally for various environments.

  It should be noted that in one exemplary embodiment, the design and geometry of the exterior module 410 provides natural indentations for the interface of these ports. FIG. 34 shows this indentation. Thus, indentations formed in the dynamic backplane 434 protect these ports so that inadvertent drops or any other impact on the process control unit 402 and the exterior module 410 will not damage the system. The first end cap 446 and the second end cap 450 also help protect the system from damage.

  The present invention also contemplates a snap-in peripheral device that fits into the dynamic backplane 434 by a snap-in connection system and couples to the system bus of the processing control unit 402. Indeed, in at least some embodiments, the expandable memory 470 is attached to the process control unit 402 as a snap-on peripheral.

  Referring to FIG. 40, the processing control unit 402 of the present invention includes its own computer processing system 550, and the exterior module 410 is designed to operate and function within the processing control unit 402 and the electrical system. Includes unique design and structural arrangement to accommodate printed circuit boards.

  In essence, the processing system 550 includes one or more electrical printed circuit boards. In practice, the processing system 550 can include one, two, three, four, five, or more printed circuit boards. However, unlike many conventional computers that include a single printed circuit board (e.g., a motherboard) that is required for the computer to function, in some preferred embodiments, the process control unit 402 includes Includes at least two separate printed circuit boards that need to be turned on or electrically connected to function in other ways. In addition to these substrates, the process control unit, like many conventional computers, can include one or more optional substrates (eg, daughter boards).

  By including multiple required printed circuit boards, as opposed to a single motherboard, the processing system 550 can provide several significant advantages over certain prior art board configurations. As one advantage, the processing system 550 can be configured as a two-layer, three-layer, four-layer or more multi-layer mainboard instead of one main board as found in some conventional computer systems. it can. Further, since the substrate can be arranged on various surfaces, a smaller area is occupied. Further, to upgrade a computer, it may be necessary to replace the entire motherboard of a conventional computer, but since the process control system 550 includes multiple required boards, one board (for example, the latest board) While replacing, the other necessary boards of the system may not be replaced. Therefore, the process control unit 402 can be upgraded at a lower cost than a conventional specific computer, and can be upgraded in a manner that is not possible with a conventional specific computer.

  In some embodiments, the processing control unit 402 includes two printed circuit boards that are required for the function of the unit, but FIG. One embodiment is shown including a substrate 554, a second electrical printed circuit board 558, and a third electrical printed circuit board 562.

  In embodiments that require three substrates for the processing system 550 to function, the various substrates can perform any suitable function. In one example, one of the boards (eg, the first board 554) functions as a north bridge to handle communication between the CPU, RAM, AGP and other electrical components of the processing system 550, or including. In another example, one of the boards (eg, the first board 554) functions as a power board, and one or more I / O ports (eg, one or more DVI connectors, Ethernet connectors, logic for an ePCIe connector, etc.).

  In another example, one or more of the substrates (eg, second substrate 558) is designed to perform at least one central processing unit, and optionally one or more specific functions or tasks. One or more other processors. As a result, the processing system 550 functions to perform the operations of the processing control unit 402, among other things, memory devices, magnetic hard disks, removable magnetic disks, magnetic cassettes, expandable memory devices (eg, CD-ROM, DVD, It functions to execute any instructions provided on a computer readable medium, such as a disk (such as a floppy disk), or from a telecommunications connection that can also be considered a computer readable medium. These computer readable media are preferably located external to or without the processing control unit 402, but the processing system 450 controls the instructions on such devices as generally known, The only difference is that such execution is remotely performed via one or more means for electrically connecting such peripheral components or I / O devices to the processing control unit 2. Is to be done.

  In yet another example of a suitable function of a circuit board within the processing system 550, one or more of the boards (eg, the third board 562) functions as or includes a south bridge or I / O controller hub. In this example, a separate south bridge circuit board (eg, third board 562) includes logic for some or all of the I / O ports on dynamic backplane 434. For example, the south bridge can include logic for one or more XGP connectors, eSATA connectors, USB connectors, audio connectors, and the like.

  Separating functions on multiple substrates (eg, first substrate 554, second substrate 558, and third substrate 562) upgrades the system in a way not previously available in the art, Makes it possible to modify. In conventional motherboards, the motherboard typically includes a CPU socket (and CPU), north bridge or equivalent function, and south bridge or equivalent function all on the same board. This configuration has led to difficulties in ensuring continued operability for upgrading components and has restrained manufacturers' efforts to provide system upgrades. This difficulty can be traced, in part, to the cost of developing new substrate and chip placement / configuration to fully accommodate new upgrades.

  For example, in the past, if a new Northbridge was under development by a manufacturer, the manufacturer would generally invest in costs to ensure that the new Northbridge is compatible with old CPUs and old Southbridge. I hated it. For each possible combination of North Bridge, South Bridge, and CPU, a thorough examination of compatibility with each new upgrade of one of those components can be prohibitively expensive. This has led to the practice of simultaneously developing new components (eg, delaying the development of specific components) so that upgrades can occur together. This practice leads to development delays.

  Separating functions on multiple substrates in an embodiment of the present invention allows for immediate upgrade of each component separately, allowing one of three substrates to be configured for inspection. By simply exchanging one with the elements, it becomes possible to easily check the compatibility with older systems and components. For example, consider an embodiment in which the first circuit board 554 includes a south bridge and the second circuit board 558 includes a north bridge and a socket for the CPU. The third circuit board 562 includes an I / O function for the system. The first board and the third board (554, 562) are connected to the second circuit board 558 by a riser connector similar to those known in the art, the riser connector being As is known in the art, more functions are transferred from board to board than standard daughter board connectors.

  For example, all Northbridge functions can be routed via a riser connector between the first circuit board 554 and the second circuit board 558, so that the Northbridge functions are on the first circuit board 558. It becomes available to the components of Similarly, the function of the south bridge passes through the riser connector between the first circuit board 554 and the second circuit board 558, traverses the second circuit board 558, and the second circuit board 558 and the second circuit board 558. To the riser connector between the third circuit board 562 and to the third circuit board 562, the function of the south bridge is made available to the components on the third circuit board 562. In this way, if a compatibility test between a new component such as a North Bridge, South Bridge, CPU, etc. and an old component is desired, the manufacturer will have one new board or configuration containing the item to be tested. All that is required is to make the element, and that substrate or component can be easily and inexpensively inspected for any number of old components on other substrates by replacing the substrate several times.

  Thus, one unique feature of embodiments of the present invention is that there is a riser connector and the end of the circuit board having multiple unrelated I / O connections. In a given example, each board may have an I / O connection for PCI, USB, AGP, etc. Of course, the exact distribution of components across the various substrates may vary, and still be included in the principles discussed herein, and the separations described are intended to be illustrative rather than limiting.

  Where the processing system 550 includes multiple printed circuit boards, the printed circuit boards (eg, 554, 558, and 562) can have any suitable configuration within the exterior module 410. In one example, the processing system 550 includes a layered configuration in which the printed circuit boards are substantially parallel to each other in a multi-sided configuration. However, in another example, FIG. 40 illustrates one embodiment in which the first circuit board 554, the second circuit board 558, and the third circuit board 562 are arranged in a three-board configuration. In particular, FIG. 40 shows that the first circuit board 554 and the third circuit board 562 are substantially perpendicular to the second circuit board 558.

  The various circuit boards of the processing system 550 can be supported within the main support chassis 414 by any suitable means for engaging, coupling, or supporting an electrical printed circuit board. Referring to FIG. 40, this figure shows a series of substrate receiving channels 462 in which the means for engaging the electrical printed circuit board are located in junction centers 454 located on opposite sides of the second sidewall support 422. A representative embodiment comprising

  In some embodiments, the printed circuit board (eg, second substrate 558) of the processing system is received directly in the substrate receiving channel 462 located on the side of the second sidewall support 422. However, FIG. 40 illustrates that in the presently preferred embodiment, a support card 570 is received in a substrate receiving channel 462 on either side of the second sidewall support 422 and the support card 570 receives a circuit board (eg, a second board 558). Indicates that is attached.

  In another example of means for engaging an electrical printed circuit board, in some embodiments, the dynamic backplane 434 is configured to support one or more printed circuit boards. Indeed, in some embodiments, the dynamic backplane is integrally formed with one or more printed circuit boards (eg, first board 554 and / or third board 562) to form a single unit. Connecting. As an example, FIG. 40 illustrates one embodiment of connecting a dynamic backplane integrally to a third printed circuit board 562. Thus, when logic for I / O ports on the dynamic backplane 434 is located on the dynamic backplane 434 and / or the third printed circuit board 562, the first board 554 or the second board 558. Without changing the dynamic backplane 434 and the third substrate 562 can be replaced with another dynamic backplane 434 and a third substrate 562 having different I / O permutations and logic requirements. Conversely, in this example, the first substrate 554 and the second substrate 558 can be replaced with another substrate while leaving the original third substrate 562 and the dynamic backplane 434 unchanged. Thus, the processing control unit can be upgraded without replacing the entire processing system 550.

  Referring again to FIG. 40, this drawing shows another example of suitable means for engaging an electrical printed circuit board. Specifically, FIG. 40 illustrates one embodiment where the dynamic backplane 434 includes circuit board attachment points 574. While the circuit board mounting 574 may include any characteristic that allows the circuit board to be supported, FIG. 40 illustrates a notch in which the board mounting 574 receives a termination of a printed circuit board (eg, the first board 554). One embodiment is shown.

  The printed circuit boards in the processing system 550 can be electrically connected to each other in any suitable manner, including using physical and / or ribbon connectors between the boards. However, physical connectors between boards require less space, provide a stronger connection, and allow for more efficient routing on printed circuit boards, so in some embodiments such connectors are preferable. As an example, FIG. 40 shows an embodiment in which a first board 554 and a third board 562 are physically and electrically attached to a second board 558 by a physical connector 578 between the boards.

  When printed circuit boards in processing system 550 are connected to each other by physical connectors between one or more boards, the physical connectors can have any suitable characteristics. By way of example, a physical connector uses a contact pad / finger protruding portion (edge board contact) along the edge that mates with a pin in the area of the connector (referred to as a card edge connector), and a printed circuit board (E.g., the first substrate 554 or the third substrate 562). In another embodiment, the physical connection includes two unique connectors, one male and one female, configured to mate with each other. In yet another embodiment, the physical connection includes one or more connectors, each connector being asexual, so that each connector connects to itself.

  The first electric printed circuit board 554, the second electric printed circuit board 558, and the third electric printed circuit board 562 are joined in the manner shown in FIG. The possibility of deviating from its proper position within 414 and the exterior module 410 is significantly reduced. In virtually any situation and condition to which the processing control unit 402 is exposed, the first printed circuit board 554, the second printed circuit board 558, and the third printed circuit board 562 are in an original and normally functioning state. Remain, thereby maintaining or maintaining the integrity of the system. The same can be said for impact and load conditions.

  In some embodiments, the printed circuit board of the processing system 550 is not supported by any of the side wall supports of the main chassis 414, and preferably does not rest on any of them. Indeed, in some embodiments, the main chassis 414 faces each of the electrical printed circuit boards to allow proper air flow within the processing control unit 402 with the inherent natural convection cooling characteristics shown herein. Designed to provide a gap or space between the supporting side walls. Therefore, each curvature radius calculated for each side wall support is designed in consideration of this limitation.

  The processing system may be assembled in any suitable manner, but the first electrical printed circuit board 554 and the second electrical printed circuit board 558 are preferably manufactured and before being placed in the exterior module 410. Attached to each other. When the first board 554 and the second board 558 are assembled, inserted into the main support chassis 414, and fixed to the main support chassis 414, the dynamic backplane 434 and the third board 562 are inserted as shown in FIG. .

  In addition to the components described above, the processing system 550 can include any component or characteristic suitable for use with the processing control unit 402. In one example, one or more of the electrical circuit boards in processing system 550 includes a security chip (eg, an application specific integrated circuit). For example, FIG. 42 illustrates an exemplary embodiment in which the first electrical circuit board 554 includes a security chip 582.

  The security chip 582 can function in various ways. In one example, the security chip 582 prevents software that is not approved for use on a particular processing control unit 402 from being used within that unit. In this example, a software program licensed or otherwise approved for a particular processing unit 402 can only be used on a processing unit that has a security chip that includes an appropriate unique identifier. Thus, certain software is prevented from being used on unauthorized processing control units.

  In another example, the security chip 582 prevents unauthorized hardware from being used with the process control unit 402. Although the security chip can achieve this feature in any suitable manner, in some embodiments, the security chip 582 is configured to communicate with at least one other security chip associated with the processing control unit. To ensure that the other chip has an authorized unique identifier. For example, if the first electrical circuit board 554, the second electrical circuit board 558, and the third electrical circuit board 562 each include its own security chip 582, the security chips communicate with each other and each other's unique identifier And determine if each of the electrical circuit boards is authorized to be used together. In such cases, one or more of the security chips can determine whether any of the electrical circuit boards do not belong to the process control unit 402. Accordingly, the security chip 582 can determine whether a circuit board or other hardware component that includes the security chip 582 has been replaced with another circuit board or other hardware from another processing control unit. . Similarly, the security chip 582 can prevent hardware (eg, circuit boards) made from unauthorized assembly parts (eg, illegal copies) from being used with the process control unit 402.

  In yet another example, the security chip serves to prevent unauthorized software and hardware from being used on a particular processing control unit.

  In another example of suitable components associated with the processing system 550, one or more of the electrical circuit boards in the processing system are suitable for use with the process control unit 2, and one or more on the electrical circuit board. Any heat sink that can absorb heat from and dissipate heat from these components can be included. FIG. 42 shows an exemplary embodiment of a suitable heat sink including rails 588. Although the heat sink rail 188 can have any suitable characteristic, FIG. 42 illustrates that the rail 588 is curved so that it can contact one or more hot surfaces on an electrical circuit board (eg, the first board 554). One embodiment is shown. Further, FIG. 42 shows that the rail 588 includes one or more holes 592 to allow a longitudinal structure on the electrical circuit board (eg, a portion of the security chip 582) to pass. Furthermore, although rail 588 can include any protrusions (eg, fins, protrusions, etc.) that allow heat to be dissipated more quickly, FIG. 1 shows an attached embodiment.

  The heat sink 588 can be secured to the electrical circuit board by any suitable method, including using soldering, adhesives, mechanical fasteners (eg, rivets, screws, etc.), and the like. However, in some presently preferred embodiments, the heat sink rail 588 fits on the electrical circuit board or remains clipped. Although the heat sink can be clipped or fitted onto the electrical circuit board in any suitable manner, FIG. 42 shows that the rail 588 extends across the first surface 596 of the first circuit board 554, One embodiment is shown configured to snap into notches 600 provided on two opposing ends of the first substrate 554. Such an embodiment may be beneficial for a number of reasons, including the ability to connect the rails without piercing the circuit board 554, riveting, etc.

  In addition to the features described above, the process control unit 402 can include any other suitable features. By way of example, in some embodiments, a processing control unit may require that an appropriate password be entered each time and only when the processing control unit is connected to a power source (eg, a local power grid). Configure. In such embodiments, the process control unit 402 locks out certain data and applications in the unit until an appropriate password is entered in the unit. Therefore, even if the processor control unit is stolen, the unit does not function and the data of the unit is safely protected.

  In addition to the many advantages described above, the present invention features other significant advantages, one of which is in the form of electromagnetic interference (EMI) because the exterior module 410 includes a fully metal chassis or main support chassis 414. There is very little or no radiation. This is mainly due to the material properties, small size, structural thickness, and proximity of the processing components to the structural components of the exterior module 410. Whatever EMI is generated by a processing component, it is absorbed by the exterior module 410 regardless of the processing capability of the processing component.

  Another significant advantage is that the exterior module 410 allows for a much cleaner and sterile interior than prior art computer exterior designs. Due to the design of the exterior module 410, especially the small size, ventilation ports, and heat dissipation characteristics, it is very difficult for dust particles and other types of foreign objects to enter the exterior. This is especially true for liquid-cooled models where the entire exterior can be sealed. A more sterile interior is important because various types of foreign objects and deposits can damage the components of the process control unit 402 and / or degrade the performance of the process control unit 402.

  In one exemplary embodiment, the process control unit 402 uses natural convection, but does not force air in, so the natural inflow and outflow of air during the natural convection process may cause dust particles or other deposits. The flow of objects into the process control unit 402 is greatly reduced. In the natural convection cooling system described herein, air particles enter the interior of the exterior module 410 according to natural physical principles and are not prone to carry heavier foreign objects because there is not enough force to do so. This is advantageous in environments that contain such heavier foreign objects, as do most environments.

  The inherent cooling technique of the process control unit 402 allows the process control unit 402 to be more adaptable to environments where conventional associated exteriors could not be placed.

  Yet another significant advantage of the process control unit 402 of the present invention is its durability. Due to its compact design and roundness-based structure, the exterior module 410 can withstand a large amount of impact and applied force, which also allows the process control unit 402 to be adapted to any conceivable environment of any kind. This is a contributing feature. The exterior module 410 can withstand weak and strong impact forces with little impact on its structural integrity or electrical circuitry, and the small size and portability of the processing control unit 402 is one of many that are possible. This is an important advantage because it is associated with an environment that can be extremely harsh.

  In addition to being very durable on the structural components of the exterior module 410, the electrical printed circuit board and associated circuitry are also extremely durable. In some embodiments, once inserted, one or more of the printed circuit boards are very difficult to dislodge, particularly as a result of inadvertent forces such as dropping the exterior or impacting the exterior. Furthermore, these substrates are extremely lightweight and do not have sufficient mass to break when dropped. That said, obviously, the exterior 410 is not completely indestructible. In most situations, the exterior module 410 is more durable than the substrate configuration, and thus the overall durability of the processing control unit 402 is limited by the substrate configuration and the circuitry therein.

  In summary, the armor module 410 includes a high degree of durability not found in conventional related armor designs. In fact, conventional related exterior designs break and often break with very little impact or applied force. Such is not the case with the process control unit 402 described herein.

  The durability of the exterior module 410 is derived from two main characteristics. First, the exterior module 410 is preferably made rounded. Each structural component and its design consists of one or more rounds. This significantly increases the strength of the exterior module 410, as the rounding-based structure provides one of the strongest designs available. Second, the preferred overall shape of the exterior module 410 is a cube, which provides considerable rigidity. The structural components based on roundness coupled with the rigidity of the cube design provide a very durable yet functional exterior.

  The durability of the individual processing units / cubes allows processing to take place at locations that were otherwise unthinkable by conventional techniques. For example, a processing unit is buried in the ground, placed in the water, spun in the sea, placed at the tip of a drill bit that cuts hundreds of feet underground, mounted on an unstable surface, attached to an existing structure, It can be arranged in. The potential processing positions are infinite.

  The process control unit of the present invention uses means for attaching and engaging external objects (each preferably including a sliding receiver 482 on each side wall support of the main support chassis 414), It is further characterized in that it can be attached to or placed on any structure, device, or assembly. Any external object that can engage the process control unit 402 in any way such that both are operatively connected is contemplated for protection herein. Further, those skilled in the art will appreciate that the exterior module 410 may include other designs or structures as a means for engaging external objects in addition to the sliding receiver 482.

  In essence, no matter how it is accomplished, the significance of providing process control units with implementability allows process control units 402 to be integrated into any type of environment discussed herein. Or allowing various items or objects (external objects) to be coupled or attached to the processing control unit 402. This unit is not only designed to be attached to various inanimate items such as multiplex processing centers and transport vehicles, but also receives various peripheral devices that are directly attached to the processing control unit 402, such as monitors and LCD screens. Designed as such.

  This mountability feature is designed to be a built-in feature, including that the process control unit 402 includes means for engaging external objects created directly within its structural components. Means. In addition to mounting using an independent mounting bracket (for example, one that functions as an adapter for completing the connection between the host and the processing control unit), mounting directly to the host (for example, this unit instead of a car stereo) Mounting in a car) is also intended for protection herein.

  The benefits that can be obtained with the mounting features can be illustrated with respect to FIG. 43, which shows the relationship between an existing mobile computer (existing COW 800) and a new COW 802 that uses the features described herein. A comparison of is shown schematically. Existing COW 800 includes a standard bulky processing unit 804 powered by a battery 806. Existing COW 800 also includes a standard monitor 808 and an input platform 810 that typically includes a keyboard, mouse, and the like. While these devices are functional and have drastically changed records management in hospital-like environments, these devices are limited by their size and power usage. For example, a standard processing unit 804 and monitor 808 each consume approximately 60 watts of energy, and battery 806 is often exhausted quickly.

  In contrast, the new COW 802 provides many advantages over the existing COW 800. First, the process control unit 402 of the illustrated embodiment may use only 22 watts of energy, for example. Thus, the new COW 802 battery 812 can be made smaller or, if kept the same size as the existing COW 800 battery 806, can allow the new COW 802 to operate over a much longer period between charges. The dynamic backplane 434 of the processing control unit 402 of this embodiment may comprise any type of pico projector currently known or later invented that projects onto a glass touch-sensitive screen 814. This projection function on the touch-sensitive screen 814 provides complex I / O with very little power usage. Alternatively, the pico projector may project onto a standard screen and input can be made using a standard keyboard and mouse. Nevertheless, the new COW 802 is easier to move around, and because of its lower wattage, it works longer on a single charge and is less expensive to transport and support.

  Certain embodiments of the present invention can utilize similar picoprojection techniques to make the processing control unit 802 available for identification and 3-D gaming purposes. FIG. 44 schematically illustrates components that can be incorporated into the dynamic backplane 434 to provide such functionality. In FIG. 44, other ports and functions of the dynamic backplane 434 are omitted for clarity, but may be any port and / or function discussed herein along with the functions described with respect to FIG. You should understand that.

  The dynamic backplane 434 in FIG. 44 includes a camera 820 and a pico projector 822. The pico projector of this embodiment projects a laser grid onto the user's face or any other object. The camera 820 captures image information including the projection grid. The processing control unit 402 obtains three-dimensional information from the camera image using the image information and grid information. This information can be used for identification purposes, for 3D games (eg, for detecting motion related to the game), and for any other purpose where 3D information is desired.

  Although embodiments of the present invention have been described herein with respect to a processing control unit 402 having various processors including a CPU, the processing control unit 402 includes any of a variety of processors including a graphical processing unit (GPU). Emphasize that you get. GPUs are commonly used to process polygons and are well suited for performing certain tasks that are not necessarily processed to the same extent by standard CPUs. If the processing control unit includes a GPU, it can be considered as a graphical control unit or GCU. The use of such units is briefly discussed above with respect to FIGS. 8C and 9, in which one processing control unit 402 communicates with two GCUs (700 and 704) using the XGP port. , 6 monitors (601-606) are controlled. As will be appreciated, in such a configuration, multiple monitors can be arranged like tiles to achieve a very large display device.

  FIG. 45 shows a schematic diagram of a system configuration between the processing control unit 402 and two GPUs 824. The processing control unit 402 can have a standard CPU and can have multiple AGP ports or connectors 826, each of which can have, for example, 8 lanes of available PCI-E communication. Two GPUs 824 (each containing a GPU) are connected in series to one AGP port 826 of the processing control unit 402 as shown to effectively provide supercomputing type processing power to the expanded processing control unit system. Or may be connected in parallel (not shown in the state where 4 lanes are used). This type of processing can be used in environments where supercomputing functionality was previously unavailable, including personal supercomputing and supercomputing for education. Thus, one function of this processing control unit is that it can be extended with other units to provide computing power that was not previously available.

  Another function of the process control unit 402 is that it can be mounted and mounted in a superstructure, such as the Tempest superstructure, when further curing of the exterior module is achieved. In such a configuration, a process control unit 402 is mounted in the structure as described herein and functions to process control the components of the structure or peripheral components. The processing control unit 402 also functions as a load bearing member of a physical structure as necessary. All types of different superstructures are contemplated herein and may be made from any type of material, such as plastic, wood, metal alloys, and / or composites thereof.

  Other benefits include reduced noise and heat. Further advantages include the ability to introduce customizable “smart” technology within various devices such as furniture, equipment, vehicles, structures, supports, appliances, equipment, and personal items. A more detailed description of using the process control unit 402 to introduce smart technology in a device was filed on July 9, 2007, and is a SYSTEMS AND, the entire disclosure of which is incorporated herein by reference. See US patent application Ser. No. 11 / 827,360 entitled METHODS FOR PROVIDING A ROBUST COMPUTER PROCESSING UNIT.

  Thus, in one aspect, a customizable computer includes a first electrical printed circuit board, a second electrical printed circuit board having a central processing unit, and a plurality of ports for electrically connecting peripheral devices to the computer. A plurality of ports that require a plurality of different logics to interface with the central processing unit, and unless the first printed circuit board is electrically connected to the second printed circuit board The computer will not turn on.

  In another aspect, a customizable computer includes a dynamic backplane that includes a plurality of ports for electrically connecting peripheral devices to the computer, a first printed circuit board, and a second print that includes a central processing unit. And the plurality of ports require a plurality of different logics to interface with the central processing unit, and the plurality of different logics required by the plurality of ports are the first printed circuit board, the dynamic backplane , And combinations thereof, the computer will not turn on unless the first printed circuit board is electrically connected to the second printed circuit board.

  In another aspect, a computer includes a security chip having a unique identifier, wherein the security chip is fully functional with a computer selected from unauthorized software, unauthorized hardware, and combinations thereof. To prevent. Some implementations of the computer can further include a first electrical printed circuit board and a second electrical printed circuit board, both of which are security devices, respectively. Computers only work if they include a chip.

  In another aspect, the computer includes a central processing unit and means for requesting a password only after the computer is disconnected from the power source and reconnected to the power source.

  In another aspect, an expandable memory device includes a first peripheral memory component capable of storing digital information, the first peripheral memory component translating the first peripheral memory component into a computer system. A first electrical connector for physically and electrically connecting to the first peripheral memory component and a second electrical for physically and electrically connecting the first peripheral memory component to the second peripheral memory component The expandable memory device includes a second peripheral memory component electrically connected to the first peripheral memory component or electrically disconnected from the first peripheral memory component. When it repartitions its own memory automatically.

Customizable Chassis Design In some implementations, the exterior module 410 as shown in FIGS. 27 and 28 can be customized according to various user needs and preferences. For example, the user can be given the option of modifying the color, shape, or other decorative aspects of the exterior module 410. For example, in some cases, end caps 438, 442 as shown in FIG. 31 can have a variety of possible hole 498 shapes and configurations. These holes can include circular, rectangular, honeycomb, or other shaped holes. These holes can also have various patterns, orientations, or designs.

  In some cases, the user is given the option to change the exterior color of the exterior module 410 or a portion of the exterior module 410. In addition or alternatively, the user can be given the option of adding designs, logos, images, text, or other such features to the exterior module 410 or other portions of the processing control unit 402.

  In some cases, the exterior module 410 is engraved, which can be a design, image, text, or other such engraving. In one non-limiting example, the user is given the option of submitting an image, text, or other design that is engraved and etched (eg, laser etched) on the exterior module 410. Similarly, other such decorative design options for modifying external features of the exterior module are contemplated by the present invention.

  In some embodiments, the exterior module 410 is labeled with a barcode, unit identification number, or such identification (ID) mark, etched, engraved, or otherwise marked. Such marking can be used in the inventory management system of the user's organization. For example, an organization such as a company may have many computer devices such as a processing control unit 402, a personal computer, and a printer. In order to manage at least the process control unit 402, the organization may have a plurality of process control units 402 having readers, management software, and ID marks. These ID marks can be etched on the process control unit 402, such as laser etching, and each ID mark is unique to each process control unit 402. When a process control unit 402 is replaced, moved, upgraded, purchased, etc., the organization may scan the ID mark and use a management system to reveal what is happening to each process control unit 402. it can. Furthermore, since each processing control system is modular, an ID mark is placed on each of the modular components of the processing control unit 402, including the exterior module 410, the back plate 434, and the motherboard components 62a, 62b, and 64, respectively. Can do. When these components are replaced, replaced, discarded, or purchased, the organization can scan those parts and register changes, locations, or other such information. Thus, this ID marking system gives the organization the ability to track / manage multiple process control units 402.

Load balanced modular cooling system Metal heat sinks can be utilized to dissipate the heat generated by power components such as transistors as effectively as possible, thereby avoiding overheating of the associated components . Such heat sinks have a heat sink contact surface that contacts the associated component through a thermally conductive connection. The heat sink absorbs component heat and releases it to the surroundings due to its excellent thermal conductivity, its mass, and its surface area.

  A wide variety of heat sinks are available, each of which is tailored to the nature and shape of the electronic component to be cooled, and its purpose, particularly the amount of heat to be removed, the space available, and the mounting feasibility. When assembling more complex circuits with many different power components, a corresponding number of different types of heat sinks with different dimensions and shapes must therefore be available. Each electronic component that generates heat is attached to a heat sink, thereby assisting in the dissipation of heat generated by the electronic component. If the space is limited, the size, shape and / or size of the heat sink is adjusted to fit the space in which the component is placed. Such an adaptation can result in limiting heat dissipation or efficiency of the heat sink. In addition, the heat sink size requirement is only required during peak operation of the electronic components, which may result in periods when the space occupied by the heat sink is not actively removing heat from the electronic system. .

  Thus, there are still techniques used to remove thermal energy from electronic systems, but challenges still exist. Thus, it is an advance in the art to augment and even replace current techniques with other techniques. Accordingly, one aspect of the invention relates to a system and method for dissipating heat from a plurality of heat generating components of a computing device. Specifically, the present invention has a customized receiving surface for interfacing with a plurality of heat generating components and a modular surface for receiving a heat diffusion layer for dissipating heat from the plurality of components. The present invention relates to a heat sink device. The invention further relates to a system and method for optimizing airflow through a computing device.

  In some implementations, a unitary heat sink apparatus is provided having a first surface for receiving a plurality of heat generating components and a second surface having a diffusion duct surface. In another implementation, a modular heat sink device is provided having a receptacle and a diffusion duct plate. The receptacle has a first surface for receiving a plurality of heat generating components and a second surface for receiving a diffusion duct plate. The diffusion duct plate has a first surface for forming an interface with the second surface of the receiver, and a second surface having a heat diffusion function. This receptacle thus provides a universal surface on which any desired diffusion duct plate can be interchangeably coupled.

  Referring to FIG. 46, a cross section of computing device 910 is shown. In some embodiments, the computing device 910 includes various heat generating components such as a CPU, Northbridge 912, video processor 914, memory 916, and the like. The heat generating components 912, 914, and 916 are operably connected to the printed circuit board 920 according to standard techniques known in the art. For example, in some embodiments, the heat generating component is operably connected to the PCB 920 by pin coupling 956. In other embodiments, an interposer 958 is disposed between the heat generating component 912 and the PCB, and the interposer 958 allows the PCA component 912 to be coupled to the PCB via a BCA connection type.

  The heat generating components 912, 914, and 916 generally have different shapes, sizes, and dimensions to accommodate the various functions and capabilities of the individual components. The computing device 910 can further include non-heat generating components to provide a computing device that operates, such as exterior, bus architecture, cooling fan, ROM, mass storage, Includes executable software programs, input devices, output devices, RAM, and other components known in the art.

  As discussed above, the heat generating components 912, 914, and 916 include a size, shape, selected to correspond to the environment of the computing device 910 and the heat dissipation demand and size limitations of the individual components, Individual heat sink devices are generally attached having and dimensions. However, as shown in FIG. 47, in some embodiments, a unitary single heat sink device 930 is attached to the heat generating components 912, 914, and 916.

  Referring now to FIG. 47, a unitary heat sink device 930 is shown coupled to the PCB 920 and the heat generating components 912, 914, and 916. In some embodiments, a unitary heat sink device 930 is provided having a plurality of receiving surfaces 950, 952, and 954 that are arranged to coincide with the location of the heat generating components 912, 914, and 916, respectively. . In some embodiments, the receiving surfaces 950, 952, and 954 each define an independent plane corresponding to the distance from the PCB 920, the distance being approximately equal to the height of the respective component 912, 914, and 916. . In other embodiments, the receiving surface 952 includes a plurality of parallel and vertical surfaces to correspond to the non-linear top surface of the heat generating component 914. Thus, in some embodiments, the heat sink 30 is designed and manufactured for a specific chipset configuration of the computing device 910.

  In some embodiments, the receiving surfaces 950, 952, and 954 interface with their respective heat generating components 912, 914, and 916, thereby providing a means for dissipating heat from the computing system 910. To do. The interface between the unitary heat sink 930 and the corresponding components 912, 914, and 916 is precisely aligned to eliminate voids caused by surface roughness effects, defects, and misalignment. In some embodiments, a heat-conducting material (not shown) is further applied to the receiving surfaces 950, 952, and 954 to expel air between them. Thermally conductive materials can include thermal grease, thermal pastes, epoxies, phase change materials, polyimides, graphite and aluminum tapes, silicon coated fabrics, and other gap filling agents known in the art.

  Unit heat sink 930 further includes a heat diffusion duct surface 960. In some embodiments, the duct surface 960 includes a plurality of pins or fins 962. In other embodiments, the duct surface 960 includes at least one of a water cooling system, a heat pipe system, and a phase change cooling system. In some embodiments, the duct surface 960 further includes a cooling fan (not shown). In other embodiments, the computing system 910 further includes an external fan (not shown) used in combination with the unitary heat sink 930.

  In some embodiments, pins 932 couple heat sink 930 directly to PCB 920. For example, in some embodiments, the PCB 920 includes a plurality of holes 922 arranged in a predetermined pattern to accommodate fastening of the heat sink 930. In some embodiments, pin 932 includes a push pin with a compression spring. In other embodiments, pin 932 includes a threaded standoff having a compression spring. Further, in some embodiments, the pin 932 includes a standard machine screw. Still further, in some embodiments, the heat sink 930 is secured to the PCB 920 with a clip (not shown).

  In some embodiments, the heat sink 930 includes a plurality of “thermal zones” corresponding to a portion of the heat sink adjacent to the heat generating component. For example, the heat sink 930 includes a first thermal region 934 adjacent to the CPU 912, a second thermal region 936 adjacent to the video processor 914, and a third thermal region 938 adjacent to the memory 916. In general, when a heat generating component begins to generate heat, heat is removed from the component by a corresponding adjacent heat zone. However, in some embodiments where the first exothermic component actively generates heat and the second adjacent exothermic component does not actively generate heat, the heat from the first exothermic component is Diffused and / or dissipated first by the thermal region adjacent to the exothermic component and then by the thermal region of the inactive exothermic component. In this way, excess heat is removed from the heat generating component in the active state by the heat regions of both the first heat generating component and the second heat generating component. Thus, this shared configuration of unitary heat sink 930 provides enhanced heat dissipation capability for any single heat generating component 912, 914, or 916 that actively generates heat.

  For example, it is unlikely that all of the exothermic components will heat up simultaneously. If only the CPU 912 is actively heating, the first thermal region 934, the second thermal region 936, and the third thermal region 938 provide further diffusion and dissipation of heat, thereby increasing the cooling rate of the CPU 912. Specifically, the CPU 912 forms a “bloom” of heat when heating, and this bloom fills the thermal region 934 first until it reaches the heat capacity of the thermal region 934. The thermal “bloom” is then dissipated between adjacent thermal regions 936 and 938. Similarly, when only the video processor 914 is actively heating, the first thermal region 934, the second thermal region 936, and the third thermal region 938 provide further diffusion and dissipation of the video processor thermal bloom. Thereby, the cooling rate of the video processor 914 is increased. Thus, the heat sink 930 provides even higher heat dissipation characteristics for a single heat generating component than would otherwise be possible with a conventional heat sink configuration.

  One skilled in the art further understands that the thickness of the thermal region directly affects the rate at which the thermal bloom fills each thermal region of the active heating component before being dissipated into the adjacent thermal region. Thus, in some embodiments, the thermal zone thickness is modified in anticipation of the cooling demand and heating frequency / pattern of a given exothermic component.

  Referring now to FIG. 48, a modular heat sink device 970 having a receptacle 972 coupled to the PCB 920 and forming an interface with the heat generating components 912, 914, and 916 is shown. In some embodiments, the receptacle 972 includes an adapter having a plurality of receiving surfaces 950, 952, and 954 that are arranged to coincide with the positions of the heat generating components 912, 914, and 916, respectively. The receptacle 972 further includes an adapter surface 974 having a generally uniform plane for receiving the diffusion duct plate thereon.

  In some embodiments, the receiving surfaces 950, 952, and 954 each define an independent plane corresponding to the distance from the PCB 920, the distance being approximately equal to the height of the respective component 912, 914, and 916. . In other embodiments, the receiving surface 952 includes a plurality of parallel and vertical surfaces to correspond to the non-linear top surface of the heat generating component 914. Thus, in some embodiments, receptacle 972 is designed and manufactured for a specific chipset configuration of computing device 910.

  The effect of the receiver 972 has various receiving surfaces 950, 952, and 954 to accommodate the various dimensions, shapes, and heights of the heat generating components 912, 914, and 916, and the heat diffusion duct component 976 It is an object of the present invention to provide a heat dissipation adapter having an adapter surface with a generally uniform surface for receiving. Accordingly, the receptacle 970 provides a uniform adapter surface 974 regardless of the specific height of the heat generating component.

  Modular heat sink 970 further includes a diffusion duct plate 976. In some embodiments, the duct plate 976 includes an adapter surface 978 having a generally uniform plane for interfacing with the adapter surface 974 of the receiver 972. Duct plate 976 further includes a diffusion duct surface 980 having a structure and function for dissipating heat from components 912, 914, and 916 through receptacle 972.

  The interface between the duct plate 976 and the receiver 972 is precisely aligned to eliminate voids caused by surface roughness effects, defects, and misalignment. In some embodiments, a thermally conductive material (not shown) is further applied between the two adapter faces 974 and 978. Thermally conductive materials can include those discussed above as well as other materials known in the art.

  In some embodiments, the duct surface 980 includes a plurality of pins or fins 962. In other embodiments, the duct surface 980 includes at least one of a water cooling system, a heat pipe system, and a phase change cooling system. In some embodiments, the duct surface 980 further includes a cooling fan (not shown). In other embodiments, the computing system 910 further includes an external fan (not shown) used in combination with the unitary heat sink 970.

  In some embodiments, screws 924 couple duct plate 976 directly to receptacle 972. For example, in some embodiments, the adapter surface 974 includes a plurality of holes 922 that are arranged in a predetermined pattern to accommodate fastening of the duct plate 976. Thus, as shown in FIG. 49, the user can replace the duct plate 976 to be compatible with another desired heat dissipation duct plate 982 or modularly.

  Referring now to FIG. 50, there is shown a PCB 1100 having a first substrate 920 on a horizontal plane and a second substrate 926 on a vertical plane. In some embodiments, the second substrate 926 includes a heat generating component 918 such as an I / O processor or south bridge. Accordingly, in some embodiments, the diffusion duct plate 976 is modified to include an auxiliary contact pad 984 having an interface surface 986 for contacting the component 918. The dimensions and height of the contact pads 984 are selected so that the interface surface 986 is precisely aligned with the heat generating component 918 when the duct plate 976 is coupled to the receptacle 972. In this way, the modular heat sink 970 is further implemented in dissipating unwanted heat provided by the component 918.

  Referring to FIG. 51, in some embodiments, adapter surfaces 974 and 978 are modified to include an alignment mechanism 990. The alignment mechanism 990 can include any combination of mechanisms to allow proper installation of the duct plate 976 and the receiver 972, and when the alignment mechanism 990 is engaged, a hole for insertion of the screw 924. 922 is properly aligned.

  Those skilled in the art will appreciate that the present invention can be implemented in a computing environment, but those skilled in the art will also understand that the present invention can be implemented in any field where heat dissipation is desired. For example, in some embodiments, the present invention is used to remove unwanted heat from a refrigeration system. In other embodiments, the present invention is used to remove unwanted heat from an air conditioning system. Further, in some embodiments, the present invention is used to remove unwanted heat from optoelectronic devices such as high power lasers and light emitting diodes.

  In some embodiments, it is desirable to increase the cooling of the computer system by increasing the air flow around the heat generating component. Referring now to FIG. 52, in some embodiments, a plurality of operatively interconnected computer devices 910 are arranged such that adjacent computer devices 910 form a wind tunnel 1000. In some embodiments, after removing the end plate (not shown), the computing devices 910 are stacked end to end. When configured, adjacent devices 910 form a tunnel 1000 through which air 998 is forced to cool various heat generating components. In some embodiments, the increased air flow further removes dust and other deposits that may otherwise collect in the computing device 910. When air is passed through the tunnel or wind tunnel 1000, the heat 1004 in the wind tunnel 1000 is removed and exhausted from the path 1000. In some embodiments, a fan unit (not shown) is placed outside path 1000 to provide airflow 998. In other embodiments, an air pressure gradient is provided across the wind tunnel 1000 so that air is moved through the path 1000 with positive or negative air pressure.

  Referring now to FIG. 53, in some embodiments, a plurality of operatively connected computer devices 910 are placed in a storage container 1020 having a cooling system 1030 such as an air conditioning unit. Accordingly, the cooling system 1030 and the storage container 1020 are optimized to provide sufficient cooling and airflow to maintain an optimal operating temperature for the computing device 910.

  Referring now to FIG. 54, in some embodiments, a plurality of operatively connected computer devices 910 are arranged in a honeycomb shape within the housing 1010. When so configured, airflow is passed through both the wind tunnel 1000 and the lumen 1102 interposed between the computing device 910 and the housing 1010, thereby providing additional airflow and cooling.

  In some embodiments, as shown in FIG. 55, a rail 1040 operably connects the computing device 910 to a further computing device (not shown). In some embodiments, a slidable fixture 1042 is provided for infinite adjustment along the rail 1040. In other embodiments, an adapter 1044 is interposed between the computing device 910 and the fixture 1042. In other embodiments, adapter 1044 is connected to fixture 1042 and rail 1040 in a wire fashion. In other embodiments, the computing device 910 is slidably and operatively coupled to at least one of the fixture 1042 and the adapter 1044 without the use of external wires.

  Referring now to FIG. 56, in some embodiments, multiple PCBs 920 are coupled directly to the rail system 914. As such, PCB 920 does not have any housing, thereby increasing maximum exposure to air flow and cooling. Further, in some embodiments, a rack system 944 is implemented to operably couple a plurality of PCBs 920 as shown in FIG. In some embodiments, the rack system 44 is placed in a housing (not shown) by alignment within the rails 914.

  Referring to FIG. 58, in some embodiments, a plurality of computing devices 910 are arranged in a linear configuration to form the wind tunnel 1000 discussed above. In some embodiments, the device 910 is coupled to the lower rail 914 by a compatible groove. In other embodiments, the device 910 is operatively coupled by a connecting line 1016 extending from the upper rail 914 to the computer device 910. Thus, the plurality of computing devices 910 are compatible or dynamically interconnected by line 1016.

  In one aspect, the heat sink is a receptacle having a plurality of receiving surfaces for interfacing with the plurality of heat generating components, the adapter further comprising an adapter surface for interfacing with the adapter and the adapter surface of the receptacle. A diffusion duct plate having an adapter surface, further including a diffusion duct surface.

System and Method for Mounting As shown in FIG. 30, an exterior module 410 can be used to combine two or more process control units, or the process control units can be implemented in another structure, such as a Tempest superstructure. A plurality of slide receivers 482 designed to receive one or more insert members, a dynamic backplane, or corresponding inserts located on some mounting bracket. FIG. 30 also shows that the one or more inserts 466, 470, 474 include two insert engagement members 478 located at opposite ends of the insert. The engaging member 478 is designed to fit within a means for engaging or coupling to various external devices, systems, objects, etc. (hereinafter external objects), the means for engaging being the main support chassis. 414 is formed.

  FIG. 59 shows one embodiment of a fitting 1200 that can be selectively inserted into a means for engaging an external object, in particular a slide receiver 482. The mounting bracket 1200 and the engagement means use means for attaching and engaging external objects, each preferably including a slide receiver 482 on each side wall support of the main support chassis 414. Attached to any structure, device, or assembly, and provides the processing control unit 402 with the ability to mount them. Any external object that can engage the process control unit 402 in any way such that both are operatively connected is contemplated for protection herein. Further, those skilled in the art will appreciate that the exterior module 410 may include other designs or structures as a means for engaging external objects in addition to the sliding receiver 482.

  In some cases, no matter how it is accomplished, providing the attachment function to the process control unit 402 allows the process control unit 402 to be integrated into any type of environment discussed herein. Or allowing various items or objects (external objects) to be coupled or attached to the processing control unit 402. This unit is not only designed to be attached to various inanimate items such as multiplex processing centers and transport vehicles, but also includes various peripheral devices that can be directly attached to the processing control unit 402, such as monitors and LCD screens 1220. Designed to receive.

  This mountability feature is designed to be a built-in feature, including that the process control unit 402 includes means for engaging external objects created directly within its structural components. Means. In addition to mounting using an independent mounting bracket (for example, one that functions as an adapter for completing the connection between the host and the processing control unit), mounting directly to the host (for example, this unit instead of a car stereo) Mounting in a car) is also intended for protection herein.

  59-65, an exemplary embodiment of a mounting bracket assembly or structure 1200 for the main support chassis 414 of the process control unit 402 is shown. As briefly discussed above, the slide receiver 482 can be coupled to the support chassis 414 so that various types of external members, including mounting bracket assemblies or structures, can be removed.

  In general, both mounting bracket assemblies 1200 shown in FIGS. 59-65 preferably include an aluminum metal composition for the same reason that the chassis is made of an aluminum metal composition. That is, to provide the mounting assembly 1202 with strong yet lightweight characteristics as well as excellent heat transfer characteristics. Furthermore, the aluminum finish preserves the aesthetic appearance of the process control unit chassis 414, end plates 438, 442, and end caps 446, 450. To this end, the mounting assembly 1200 can be anodized or otherwise finished or personalized to harmonize with or enhance the chassis, and the chassis can be anodized or otherwise as desired. In the same way, it can be finished or individualized. Similarly, mounting assembly 1200 and backplate 1206 are curved or otherwise shaped to enhance chassis 414. In addition, the aluminum metal composition of the mounting assembly 1200 retains the structural integrity necessary to support the many applications and mounting configurations that the present invention envisions.

  However, in some embodiments, mounting assembly 1200 is preferably constructed from aluminum or various grades of aluminum and / or aluminum composites, but in other embodiments, depending on the specific needs and / or desires of the user. Other materials such as titanium, copper, magnesium, newly realized mixed metal alloys, iron, and other metals and metal alloys, and plastics, graphite, composites, nylon, or combinations thereof You may make from Similarly, in some embodiments, mounting assembly 1200 can be made from a suitable material and subsequently coated with an insulating material if desired. For example, if it is desirable to charge the chassis 414, but it is not desirable to charge the mounting assembly, or it is desirable to insulate the charged chassis 1214 from the surrounding environment, by making the mounting assembly 1200 from an insulating material. This can be accomplished by coating the mounting assembly 1200 with an insulating material.

  With specific reference to FIG. 59, a first exemplary mounting assembly 1200 is shown. As shown, the mounting assembly 1200 includes an insert 1202 of the same type as the first insert 466, the second insert 470, and the third insert 474 of FIG. Specifically, the mounting assembly insert 1202 includes substantially the same radius of curvature so that any of the concave sidewall supports 418, 422, and 426 engage or combine in a nested or mating relationship. Indeed, the mounting assembly 1200 can engage any of the sidewall supports 418, 422, or 426 as desired, depending on the most efficient or appropriate orientation for mounting the process control unit 402. In addition, the insertion portion 1202 also includes an engagement member 478 so that the insertion portion 1202 can be inserted into and out of the corresponding sliding receiver 482 to allow the insertion portion 1202 to slide in and out as required. Can be slidably engaged or received.

  In some embodiments, the end plates 438, 442 and end caps 446, 450 must be removed before the insert 1202 can be slid into or out of the receptacle 482 as required. Don't be. That is, when the chassis 414 is fully assembled, the plates 438, 442 and the end caps 446, 450 obscure or otherwise obstruct access to the slide receivers 482, thereby preventing the plates / end caps from The item cannot be inserted into or removed from the receptacle 482 unless it is removed. In this way, the insert 1202 remains securely fixed to the chassis of the process control unit 402 during use. Further, the end plates 438, 442 and the end caps 446, 450 can be provided with anti-tampering features so that it becomes obvious if someone removes the plates / end caps without permission. Again, such a function increases the security of the process control unit 402. However, if the plates 438, 442 and end caps 446, 450 are removed, the insert 1202 can be conveniently inserted or removed as desired.

  Similar to inserts 466, 470, and 474, generally known in the art over snaps, screws, rivets, interlock systems, two insert engagement members 78 located at opposite ends of insert 1202 Other means for coupling the chassis 414 to the insert 1202 are also contemplated, such as utilizing various attachment components that span any other means.

  As shown, the insert 1202 has a formed or machined hole 1204 corresponding to the mounting hole 1208 found in the backplate 1206. Further, the insertion portion 1202 is fixed to the back plate 1206 using the attachment means 1210. In addition, these holes 1204 are provided so that the attachment means 1210 does not protrude from the proximal surface of the insert 1202 or protrude from the surface of the insert 1202 and the surface between the side wall supports 418, 422, or 426. Make a countersink. In this way, in use, the attachment means 1210 does not prevent nested engagement between the insert 1202 and the concave sidewall support 418, 422, or 426. In addition, the hole 1208 is also countersunk in the back plate 1206 so that the back plate 1206 can be mounted flush with the surface of another object such as a wall. In this way, the attachment means 1210 securely secures the attachment assembly 400 as a whole without interfering with the surrounding environment or the process control unit 402.

  FIGS. 59-65 also show several holes 1212 at various locations within the backplate 1206. Hole 1212 is for convenience in attaching assembly 1200 to the appropriate environment. Thus, depending on the intended application of the mounting assembly 1200, the holes 1212 can be in any suitable location and any suitable number of holes may be provided. The hole 1212 allows any suitable attachment means (not shown) to be used to secure the attachment assembly 1200, and consequently the chassis 414, to the desired environment or position. Similar to holes 1204 and 1208, hole 1212 can be countersunk as desired.

  With reference to the mounting assembly shown in FIGS. 459-65, a representative smaller backplate 1206 is shown. When the chassis 414 is connected to the insertion portion 1202, the main body of the chassis 414 covers the attachment means (not shown), so that the size of the back plate 1206 prevents the hole 1212 from reaching. In this way, the process control unit 402 can be mounted in a particular location or otherwise secured so that it cannot be easily removed or tampered with. For example, during the assembly process, the process control unit 2 may be attached to a computer monitor 1220 or other surface as shown and the process control unit 402 may not be easily removed from the corresponding computer monitor or other location as is to the end user. Can be shipped to. At the very least, the anti-tampering function makes it obvious to unauthorized removal or tampering of the mounting assembly. Again, such a function increases the security of the process control unit 2. However, if the plates 438, 442 and the end caps 446, 450 are removed, the insert 1202 can be conveniently inserted or removed as desired, and the back plate 1206 can be conveniently attached or removed from the corresponding environment. it can.

  Referring now to FIG. 63, an exemplary embodiment of a larger back plate 1206b is shown. The back plate 1206 b includes the same pattern of holes 1208 as the back plate 1206 a of FIG. 59 and can be connected to the insertion portion 1202. However, as shown, the back plate 1206 is large enough so that even when the back plate 1206 is connected to the chassis 414 (both not shown) by the insert 1202, the user still holds the back plate 1206 in place, As a result, attachment means (not shown) for securing the entire assembly can be reached at a specific location or on a specific surface. In this way, the completed assembly, including chassis 414 and mounting assembly 1200, can be conveniently attached or removed from a particular location as a single unit without having to disassemble chassis 414.

  With respect to any of the mounting assembly embodiments 1200 discussed above and other embodiments contemplated by the present disclosure, the chassis 414 attaches or adds to any suitable location, including any stationary or dynamic position. be able to. Further, in some embodiments, the Video Electronics Standards Association (VESA) has established that the backplate 1206a can be directly attached to a computer monitor and other computer components, thereby allowing the chassis 414 to be securely attached thereto. Each of the back plates 1206a is manufactured according to the standard. Further, although the backplates 1206a and 1206b are illustrated as being substantially flat or planar, in some embodiments, the backplate 406a / 406b can be any desired roundness or configuration, size or shape to suit the intended use. Can be bent or bent.

  Another function of the process control unit 402 is that it can be mounted and mounted in a superstructure, such as the Tempest superstructure, when further curing of the exterior module is achieved. In such a configuration, the process control unit 2 is mounted in the structure as described herein and functions to process control the components of the structure or peripheral components. The processing control unit 402 also functions as a load bearing member of a physical structure as necessary. All types of different superstructures are contemplated herein and may be made from any type of material, such as plastic, wood, metal alloys, and / or composites thereof.

  FIG. 60 shows a back plate 1206 of a fixture 1200 mounted on a computer device such as a monitor screen or display screen 1220. A computer device / system such as the process control unit 402 is attached to the fixture. FIG. 65 illustrates another embodiment of a thinner fixture, according to some embodiments.

Providing Computing Resources Using Modular Devices Existing devices such as storage devices have traditionally utilized a single bus system (eg, PATA, SATA, PCIe, etc.) and are generally single media (eg, rotating disk storage media) Or solid state storage media). These devices may be available in various storage capacities and / or functions, and various physical sizes and / or form factors. Currently, media selection is generally determined by weighing various factors such as desired access speed, storage size, physical size, and cost.

  Considerations associated with making a selection from available devices are further constrained in situations where a selection is made from an external device such as an external storage system. Such systems are typically connected to a central computer device by external cables (eg, USB, IEEE 1394 (Firewire), PCIe, eSATA, etc.) and are often constrained or limited to a single device or function. The size limits of such devices can be more stringent than the size limits discussed above.

  Many devices utilize printed circuit boards (PCBs) or other functional and / or structural boards to provide specific mounting functions. In such devices, it is common to attach device components only to one side of a PCB or other substrate.

  One implementation of the present invention provides a modular computing device having a housing that defines an internal volume. A printed circuit board is mounted in the housing. The printed circuit board has a first large surface and an opposite second large surface, the first computing component being communicatively connected to the printed circuit board and disposed along the first large surface. Is done. The printed circuit board is communicatively connected to the printed circuit board and is configured to receive a second computing component disposed along the second large surface, optionally, the second computing A component is communicatively connected to the printed circuit board and disposed along the second large surface.

  Embodiments of the present invention provide a modular computing device having a housing that defines an internal volume. A printed circuit board is mounted in the housing. The printed circuit board has a first large surface and an opposite second large surface, the first computing component being communicatively connected to the printed circuit board and disposed along the first large surface. Is done. The printed circuit board is communicatively connected to the printed circuit board and is configured to receive a second computing component disposed along the second large surface, optionally, the second computing A component is communicatively connected to the printed circuit board and disposed along the second large surface.

  The following description is divided into several headings for the purpose of enhancing the understanding of the description, but is not intended to be limiting in any way.

Exemplary Operating Environment The following description of the operating environment should be understood to be illustrative of the types of environments that can be utilized and implemented with embodiments of the present invention, and all embodiments of the present invention are It is not intended to include all features discussed in this specification or to be utilized within an environment that includes all features discussed herein. Accordingly, the following content is solely for the purpose of assisting in understanding various embodiments of the present invention.

  66 and the corresponding discussion are intended to provide an overall description of a suitable operating environment in which embodiments of the present invention can be implemented, in conjunction with the disclosure of related applications incorporated herein by reference. Those skilled in the art will appreciate that embodiments of the invention may be implemented with one or more computing devices and in various system configurations, including networked configurations. However, while the methods and processes of the present invention have proven particularly useful in connection with systems that include general purpose computers, embodiments of the present invention can be applied to embedded systems, digital / media signal processors having general purpose processing units. (DSP / MSP), application specific integrated circuits (ASICs), stand-alone electronic devices, and utilizing such methods and processes within a variety of other electronic environments.

  Embodiments of the invention include one or more computer-readable media, each medium can be configured to include or include data or computer-executable instructions for manipulating data. Computer-executable instructions include data structures, objects, programs, routines, or those associated with a general purpose computer that can perform a variety of different functions, or those associated with a dedicated computer that can perform a limited number of functions. Other program modules that can be accessed by the system are included. Computer-executable instructions are examples of program code means for causing a processing system to perform a specific function or group of functions, and for performing the steps of the methods disclosed herein. Furthermore, the particular sequence of executable instructions provides an example of corresponding operations that can be used to perform such steps. Examples of computer readable media include random access memory (“RAM”), read only memory (“ROM”), programmable read only memory (“PROM”), erase and programmable read only memory (“EPROM”), Electrically erasable programmable read-only memory (“EEPROM”), compact disk read-only memory (“CD-ROM”), or any other device that can provide data or executable instructions that can be accessed by the processing system or Contains components. Although embodiments of the invention encompass the use of all types of computer readable media, the specific embodiments described in the claims are limited to the use of tangible, non-transitory computer readable media. The phrases “tangible computer readable medium” and “non-transitory computer readable medium” (or plural variants) as used herein are intended to exclude the temporary propagated signal itself. To do.

  With reference to FIG. 66, an exemplary system for implementing an embodiment of the invention includes a computing device 1310, which can be either a general purpose or special purpose computer or various consumer electronics devices. For example, the computer device 1310 may be a personal computer, notebook computer, netbook, personal digital assistant (“PDA”) or other portable terminal, workstation, minicomputer, mainframe, supercomputer, multiprocessor system, network computer, It may be a processor-based consumer electronics, a modular computer disclosed in related applications, and the like.

  Computer device 1310 can be configured to connect various components of computer device 1310 and includes a system bus 1312 that allows data to be exchanged between two or more components. The system bus 1312 can include one of a variety of bus structures including a memory bus or memory controller, a peripheral bus, or a local bus using any of a variety of bus architectures. Typical components connected by system bus 1312 include processing system 1314 and memory 1316. Other components may include one or more mass storage device interfaces 1318, input interfaces 1320, output interfaces 1322, and / or network interfaces 1324, each of which is described below.

  The processing system 1314 includes one or more processors, such as a central processing unit, and optionally one or more other processors designed to perform a particular function or task. It is typical to execute instructions provided on a computer readable medium such as memory 1316, magnetic hard disk, removable magnetic disk, magnetic cassette, optical disk, or from a communications connection that may also be considered a computer readable medium. There is a processing system 1314.

  Memory 1316 can be configured to include or include data or instructions for manipulating data, and includes one or more computer-readable media that can be accessed by processing system 1314 via system bus 1312. Including. The memory 1316 may include, for example, a ROM 1328 that is used to permanently store information, a RAM 1330 that is used to temporarily store information, and / or a hybrid memory 1331. ROM 1328 may include a basic I / O system (“BIOS”) having one or more routines used to establish communication, such as during startup of computing device 1310. The RAM 1330 can include one or more program modules, such as one or more operating systems, application programs, and / or program data. The hybrid memory 1331 can have features and functions hybridized from the features and functions of the ROM 1328 and RAM 1330.

  One or more mass storage device interfaces 1318 may be used to connect one or more mass storage devices 1326 to the system bus 1312. The mass storage device 1326 may be incorporated into the computer device 1310 or a peripheral device for the computer device 1310 to allow the computer device 1310 to hold a large amount of data. Optionally, one or more mass storage devices 1326 may be removable from computing device 1310. Examples of mass storage devices include hard disk drives, magnetic disk drives, tape drives, solid state drives / flash drives, hybrid drives that utilize multiple storage types, and optical disk drives. The mass storage device 1326 can read from and / or write to a magnetic hard disk, a removable magnetic disk, a magnetic cassette, an optical disk, or other computer-readable medium. Mass storage device 1326 and its corresponding computer readable media may include data and / or executables that may include one or more program modules, such as an operating system, one or more application programs, other program modules or program data. Provides non-volatile storage of instructions. Such executable instructions are examples of program code means for performing the steps of the methods disclosed herein.

  One or more input interfaces 1320 may be used to allow a user to enter data and / or instructions into the computing device 1310 via one or more corresponding input devices 1332. Examples of such input devices include keyboards and alternatives such as mice, trackballs, light pens, styluses and other pointing devices, microphones, joysticks, game pads, satellite dish, scanners, camcorders, digital cameras, etc. An input device is included. Similarly, examples of input interfaces 1320 that can be used to connect the input device 1332 to the system bus 1312 include serial ports, parallel ports, game ports, universal serial bus (“USB”), integrated circuits, fires A wire (IEEE 1394) or other interface is included. For example, in some embodiments, the input interface 1320 includes an application specific integrated circuit (ASIC) designed for a specific application. In a further embodiment, the ASIC is embedded in existing circuit building blocks and connects them.

  One or more output interfaces 1322 may be used to connect one or more corresponding output devices 1334 to the system bus 1312. Examples of the output device include a monitor screen, a display screen, a speaker, a printer, a multifunction peripheral device, and the like. The particular output device 1334 may be incorporated into the computer device 1310 or a peripheral device for the computer device 1310. Examples of output interfaces include video adapters, audio adapters, parallel ports, and the like.

  One or more hybrid media interfaces 1323 may be used to connect one or more hybrid media devices 1335 to the system bus 1312. The hybrid media interface 1323 may include multiple single I / O ports and / or buses that are combined on a single connector to provide added value. Non-limiting examples of port / bus types that can be combined in the hybrid media interface 1323 and / or associated bus / ports include PCIe, I2C, power, proprietary secure bus, SATA, USB, etc. The hybrid media device 1335 so connected to the computer device 1310 may include various peripheral devices, storage systems, PCIe devices, USB devices, SATA devices, and the like.

  One or more network interfaces 1324 are over a network 1338 where computing device 1310 may include wired and / or wireless links with one or more other local or remote computing devices illustrated as computing device 1336. To exchange information. Examples of network interfaces include a local area network (“LAN”) or modem, a network adapter for connecting to a wireless link, or other adapter for connecting to a wide area network (“WAN”) such as the Internet. . The network interface 1324 may be incorporated into the computer device 1310 or a peripheral device for the computer device 1310. In a networked system, accessible program modules or portions thereof can be stored in a remote storage device. Further, in a networked system, computing device 1310 can participate in a distributed computing environment where functions or tasks are performed by multiple networked computing devices.

  Thus, those skilled in the art will appreciate that embodiments of the present invention can be implemented in a variety of different environments having many types of system configurations, but FIG. 67 is a representative that can be used in connection with embodiments of the present invention. Shows a networked system configuration. The exemplary system of FIG. 67 connects to one or more other computer devices (shown as clients 1342) and one or more peripheral devices (shown as a multifunction peripheral (MFP) MFP 1346) via a network 1338. A computer device shown as client 1340.

  Although FIG. 1367 shows an embodiment that includes a client 1340 connected to a network 1338, two additional clients 1342, an MFP 1346, and optionally a server 1348, which may be a print server, an alternative embodiment is shown in FIG. More or fewer clients connected to 1338, multiple peripherals, zero peripherals, zero servers 1348, and / or multiple servers 1348. 67 is a copending provisional application 61 / 407,904 filed Oct. 28, 2010 and entitled “MODURAR VIRTUALIZATION IN COMPUTER SYSTEMS” (Attorney Docket Number). The features discussed in any of the related applications can be utilized and / or incorporated, such as the base module and peripheral modules discussed in 11072.268). Accordingly, any of computing device 1310, client 1340, client 1342, server 1348, etc. can include or consist of the base modules and / or peripheral modules disclosed in that application. Other embodiments of the present invention include a local environment, a networked environment, or a peer-to-peer environment where one or more computing devices can be connected to one or more local or remote peripheral devices. Furthermore, embodiments according to the present invention also encompass a single electronic consumer device, a wireless networked environment, and / or a wide area networked environment such as the Internet.

Providing Computing Resources Using Modular Devices As shown in FIG. 68, certain embodiments of the present invention allow multiple devices to be integrated within a single modular device 1350. As shown in the depiction of FIG. 68, the modular device 1350 can include a variety of devices and can be configured in a variety of ways. FIG. 68 shows six different conceptual configurations of modular device 1350, each further illustrating several potentially different types of modular device 1350. Each modular device 1350 has various communication connections (eg, USB, PCIe, IEEE 1394, eSATA, hybrid media bus, fiber optic or any other standard or proprietary wired connection, such as WiFi, WiFi, infrared, etc. Or any other standard or proprietary wireless connection, and any other type of communication connection existing or later invented) to the computer device 1310 selectively. Can be added. Modular device 1350 may be communicatively connected to computer device 1310 directly or via one or more additional communication connections, such as via a network or modular computer system discussed in part of a related application.

  Each modular device 1350 includes one or more devices that provide some functionality to the computing device. For example, as shown in the upper left diagram of FIG. 68, modular device 1350 may include one or more of one or more of input devices 1332 and one or more of output devices 1334. Alternatively, as shown in the upper center view of FIG. 68, the modular device 1350 may include one or more of one or more of the input devices 1332 and one or more of the hybrid media devices 1335. Alternatively, as shown in the upper right diagram of FIG. 68, the modular device 1350 can include one or more of one or more of the output devices 1334 and one or more of the hybrid media devices 1335. Alternatively, as shown in the lower left diagram of FIG. 68, the modular device 1350 can include one or more of one or more of the input devices 1332 and one or more of the mass storage devices 1326. Alternatively, as shown in the lower center view of FIG. 68, the modular device 1350 can include one or more of one or more of the output devices 1334 and one or more of the mass storage devices 1326 or combinations thereof. . Alternatively, as shown in the lower right diagram of FIG. 68, modular device 1350 may include one or more of one or more of mass storage devices 1326 and one or more of hybrid media devices 1335. it can. The particular modular device 1350 shown and described with respect to FIG. 68 is intended to be exemplary only.

  In at least some embodiments, the modular device 1350 is “modular” in that it includes a single chassis or housing that includes some, most, or all of the components that make up the modular device. By connecting the modular device 1350 to the computer device 1310 in a communicable manner, the computer device 1310 can use the resources of the modular device 1350. Because embodiments of modular device 1350 include or have the ability to include multiple devices, using a single communication connection and using a single effective modular device, Resources can be made available to the computer device 1310.

  FIG. 69 shows a perspective view of one exemplary embodiment of a housing 1352 that can be used with the modular device 1350. As seen in this figure, the housing 1352 includes an outer structural shell 1354 and two end caps 1356. Structural shell 1354 and end cap 1356 serve to seal and protect the components of modular device 1350. The structural shell 1354 can be made from a variety of materials, including plastics and metals including aluminum and / or metal alloys, and can be formed in a manner that provides structural functionality as discussed in the related applications. Further, the structural shell 1354 can be formed to mate with the structure of other modular devices 1350 or other computer components as shown in FIG. Any port provided in the modular device 1350 may be provided at either end (eg, through one or more of the end caps 1356) or (eg, at the open end of the shell 1354, or as shown in FIG. 71). It can be provided along one of the ends of the modular device (through the opening in the cover plate 58 closing the open end of the shell 1354).

  70 and 71 show an end view and a perspective view of the housing 1352, respectively. In these drawings, and in the drawing of FIG. 69, some features of the structural shell 1354 can be seen showing one way in which fitting with other devices can be achieved. As seen in FIGS. 69 and 70, the structural shell 1354 can be formed (eg, extruded) with a pair of mating protrusions 1360 on one large side of the housing 1352. As seen in FIG. 71, the opposite large side of the structural shell 1354 of this embodiment is formed to have a pair of corresponding mating channels 1362 that can receive mating protrusions 1360. As further seen in FIGS. 69-71, end cap 1356 does not include a mating protrusion 1360 nor a corresponding mating channel 1362. As shown in FIG. 73, another device includes a corresponding mating channel 1362 or mating protrusion 1360 on at least one of its sides (but again not on its corresponding end cap).

  To structurally attach the modular device 1350 to some other device, such as the computer device 1310 in the manner shown in FIG. 72, remove the end cap 1364 of the computer device 1310 (anti-tamper fastening to prevent theft or destruction) The mating protrusions 1360 of the modular device 1350 are slidably engaged with the corresponding mating channels 1362 of the computing device 1310. Modular device 1310 slides until it is fully engaged with computer device 1310. The end cap 1364 of the computer device 1310 is reattached to the computer device 1310, thereby securing the modular device 1350 to the computer device 1310. Using the mating channel 1362 of the modular device 1350 or the mating channel 1362 on the opposite side of the computer device 1310 as desired, with the corresponding end cap (1356 or 1380) removed to facilitate installation, Additional modular devices 1350 or other components can be attached to the system.

  The illustrated embodiments shown in FIGS. 69-72 are merely illustrative of how the embodiments may be constructed to allow structural connections between modules and between other devices. Thus, for example, the illustrated housing 1352 has a mating protrusion 1360 on one large side and a mating channel 1362 on the other large side, but another outer structural shell 1354 shown in FIG. Another embodiment may have mating channels 1362 on both large sides, as shown in the end view depiction of FIG.

  As disclosed in one or more of the related applications, Mei's structural shell 1354 is load bearing. Thus, the modular device 1350 can be used as a fixture from which a monitor or other device is hung, can be embedded or mounted in a wall, can be part of a frame, and in related applications. Any of the disclosed structural functions can be performed. For example, a plate can be mounted on the wall, another plate can be attached to the monitor, and the two plates can be joined by the structural features of the modular device.

  In order to allow the housing 1352 to include multiple devices as shown in FIG. 68, embodiments of the present invention provide a bidirectional printed circuit that can be mounted within the housing 1352 as shown in FIGS. A substrate (PCB 1366) is used. The PCB 1366 can be mounted within a channel (not shown) or other mounting structure provided within the shell 1354 so that it is centrally mounted to some extent within the housing 1352. PCB 1366 provides structural support for mounting any component or device thereon, communication coupling between any component or device mounted thereon, and communication between components or devices 1 It provides both a communication coupling to one or more ports 1368 or other communication devices, and a communication coupling to any computing device communicatively connected to the modular device 1350.

  Mounting the PCB 1366 in the center allows components and / or devices to be mounted on both sides of the PCB 1366 in a novel manner. This attachment facilitates the compact modular device 1350 providing functions not available with current devices. For example, in a modular device 1350 that primarily provides storage functions, a mass storage device 1326 is mounted on both sides of the PCB 1366, thereby using a single PCB 1366 to store two mass storage devices in a compact space within the same housing. A device 1326 can be provided. On the other hand, if the storage capabilities of multiple mass storage devices 1326 are not required, the same PCB 1366 can be used in conjunction with a single mass storage device 1326.

  One way in which this configuration can be achieved can be understood by referring to FIGS. 77-79, which show diagrams of exemplary embodiments of PCB 1366. FIG. 77 shows a side-by-side comparison of the front and back views of PCB 1366, while FIG. 78 shows a larger front view of PCB 1366 and FIG. 79 shows a larger back view only. As can be seen in these drawings, connectors 1370 for connecting mass storage devices (hard drives, solid state drives, hybrid drives, etc.) are provided on the front and back of the PCB 1366, respectively. In the illustrated embodiment, the connector 1370 is disposed on the back-to-back longitudinal ends of the PCB 1366 as well as on both sides of the PCB 1366, but in other embodiments, the connector 1370 may be disposed on a single longitudinal end.

  One side of the PCB 1366 also includes a port connector 1372 that provides the port 1368 discussed above. The illustrated port 1368 and / or port connector 1372 is intended to be exemplary only, and a plurality of ports 1368 and / or port connectors 1372 may be provided, and these ports 68 and / or port connectors 1372 may be other than the PCB 1366. , And / or on other surfaces, any type of port 1368 and / or port connector 1372 may be provided, or if using some other communication mechanism, port 1368 or It should be noted that the port connector 1372 may not be provided.

  The other side of the PCB 1366 in the illustrated embodiment includes an additional device connector 1374 that may be similar to or different from the connector 1372. For example, the device connector 1374 can be of a type optimized for connecting devices other than mass storage devices. Similar to port connector 1372, the types, locations, and numbers of device connectors 1374 shown in FIGS. 77-79 are merely exemplary, and various types and numbers of device connectors, including embodiments that do not have device connectors 1374. 1374 may be provided.

  In order to facilitate attaching one or more devices to the PCB 1366, the PCB 1366 of the illustrated embodiment includes several features. The first feature is a plurality of direct mounting holes 1376 that penetrate the PCB 1366. The number and arrangement of the direct attachment holes 1376 shown in FIG. 77 are merely examples, and can be changed according to the specific needs of each embodiment. In certain embodiments, direct attachment holes 1376 are not provided, and in other embodiments there can be any number of direct attachment holes 1376 greater than zero.

  Direct mounting hole 1376 can be used to mount a component or device directly to PCB 1366. For example, the illustrated embodiment uses a more centrally located direct mounting hole 1376 by inserting a fastener, such as a threaded part, through a direct mounting hole 1376 into a corresponding screw hole on a smaller component. Thus, smaller components can be attached to one side of the PCB 1366. By inserting the fasteners reversely into corresponding screw holes on the larger component via direct mounting holes 1376, the outer component is mounted on the opposite side of the PCB 1366 using the outer direct mounting holes 1376. Can be attached. Any potential short circuit problems that could possibly be caused by one of the mounted components coming into contact with the fastener (as long as it is avoided by spacers, insulation, etc., using the direct mounting holes 1376 to achieve the two configurations Elements or devices can thus be attached directly to either or both sides of PCB 1366.

  Of course, if a single component or device is required, it will be appreciated that only one set of direct mounting holes 1376 is used and the component or device is located on only one side of the PCB 1366. The opposite side of the PCB 1366 remains usable for later installation of another device. Depending on the type of device or component and its / their communication and / or power connection to the PCB 1366, the installation procedure involves first inserting the device / component into an appropriate connector (eg, connector 1370), The device / component may then be secured to the PCB 1366, or a communication / power connection between the device / component and the appropriate connector may be made before or after the device / component is attached to the PCB 1366. Separate establishment may be involved.

  Direct mounting holes 1376 allow a wide variety of devices to be attached to PCB 1366 and may even allow devices to be mounted on either or both sides of the PCB as discussed above, but using direct mounting holes 1376, PCB 1366 may be used. It is expected that it may not be possible in all situations to install the device on both sides of the device. For example, the first installed component or device may obstruct the installation of the second component or device by obscuring one or more required direct mounting holes 1376. Accordingly, embodiments of the present invention utilize indirect mounting slots 1378 as shown in FIGS. 77-79. The mounting slot 1378 is adapted to receive a T-shaped connector 1380 shown in FIG. T-connector 1380 is a plate-like element having a narrow end 1382 that is inserted into and received by indirect mounting slot 1378 and a wide end 1384 that is wider than indirect mounting slot 1378. . Thus, the narrow end 1382 of the T-connector can be inserted into the indirect mounting slot 1378 until the wide end 1384 contacts the PCB 1366 and stops further insertion of the T-connector. In at least some embodiments, the T-connector can be soldered in place after insertion into the indirect mounting slot 1378.

  Narrow end 1382 and wide end 1384 both have at least one connector mounting hole 1386 therein. As shown in FIG. 80, various embodiments of the T-connector can include more or fewer connector mounting holes 1386 arranged to be on each side of the PCB 1366. Of course, the lower version of the T-shaped connector 1380 shown in FIG. 80 may allow additional components or devices to be mounted on each side of the PCB 1366, but this version of the T-shaped connector 1380 shown in FIG. Requires a housing 1352 with a larger internal volume than the above version. Connector mounting hole 86 receives fasteners, such as threaded parts, through the hole and into one or more components that are mounted indirectly on PCB 1366 by T-connector 80. Although two embodiments of a T-shaped connector 1380 are shown in FIG. 80, other embodiments can have more connector mounting holes 1386 than the number shown, and yet other embodiments have a wide end 1384. In contrast, the number of connector mounting holes 1386 on the narrow end 1382 can be different.

  In certain embodiments, a T-connector 1380 can be used in conjunction with a direct mounting hole 1376 to attach multiple devices / components on both sides of the PCB 1366, or multiple devices / components on both sides of the PCB 1366. Can be used independently of the direct attachment hole 1376 (if any). When using the direct attachment hole 1376, the first component is first attached to the PCB 1366 using the direct attachment hole 1376. Thereafter, a second device is attached to the opposite side of PCB 1366 using T-connector 1380. If the T-connector 1380 allows for the attachment of further devices / components, it can be attached in a similar manner.

  For example, many hard drives have threaded receptacles on both the bottom and side of the hard drive. The screw receiving port on the bottom surface can be used in combination with at least a part of the direct mounting hole 1376, and the screw type receiving port on the side surface can be used in combination with at least a part of the T-shaped connector 1380. Of course, the placement of the direct mounting holes 1376 and indirect mounting slots 1378 can be chosen to facilitate mounting in the manner described. As will be appreciated, depending on the devices / components expected to be used within the modular device 1350, the size of the modular device 1350, PCB 1366, and various hole and connector arrangements may be varied as desired. You can choose.

  Embodiments of the present invention can be used in a wide variety of ways to provide benefits not currently available in the art. The additional three-dimensional connection configuration provided by embodiments of the present invention reduces the volume required for the instrument while still allowing sufficient air flow and cooling capacity. In addition, as discussed above with respect to FIG. 68, such a configuration allows different types of devices within a single component to be connected.

  As another example, modular device 1350 can be configured as a storage device. While the modular device 1350 can essentially function as a standard enclosure for a single mass storage device, the modular device 1350 can also provide currently unavailable storage options in a single package. it can. For example, if the modular device 1350 is configured to include up to two mass storage devices, the first mass storage device can be selected depending on the first desired performance or other characteristics, while the first Depending on the desired performance or other characteristics of the second, the second mass storage device can be selected. As a specific example, a user may want a solid state drive to store an operating system (OS) and application programs, while hoping for the inexpensive and large storage capability of a rotating magnetic drive to store all other data. May desire high performance characteristics. Other users may only want maximum capacity, while other users may only want maximum performance.

  Embodiments of the present invention respond to these specific desires in a flexible manner. The modular device simply comprises two drives: an appropriately sized solid state drive for the OS and application programs, and an appropriately sized rotating magnetic drive for other data. Of course, different users may require two drives of different sizes, and the capacity of their own drives can be chosen to be different so that they can be customized accordingly. Further benefits are also obtained: Existing hybrid drives typically have limited solid state capacity, which capacity can never be changed, but any size solid state drive can be initially selected for the modular device 1350 and the modular device 1350 overall Can be easily swapped out to a drive of a different size at a later point in time without having to be replaced. Similarly, similar changes are made if the user later requires additional capacity of the rotating magnetic drive, or later desires higher performance of the solid state drive.

  Another example may be realized by a combination of different types of devices or components within the modular device 1350. For example, an embodiment may be provided that provides functionality related to digital video recording (DVR) technology. Thus, one of the devices or components within the modular device 1350 can be a mass storage device and the other device or component can be a video capture component. In such embodiments, a port can be provided for receiving video signals (eg, from an antenna or cable device), or the modular device 1350 can be equipped with an internal or external antenna.

  As another example, a wireless card or device can be attached to one side of the PCB 1366, allowing the modular device 1350 to communicate wirelessly with one or more remote devices. Some embodiments may include a graphics card or graphics device attached to one side of the PCB 1366 for outputting video signals. In fact, any device that can be plugged into any port or connector (eg, mini PCI, mini PCIe, etc.) provided on the PCB 1366. Supporting mechanical and electronic devices can be connected to the modular device 1350 as desired to provide additional features and functions.

  As another example, modular device 1350 may include a mass storage device and a dual-band wireless device on both sides of PCB 1366. As shown in FIG. 81, a dual-band wireless device may include other devices in the immediate vicinity of modular device 1350 (eg, PDA 1388, phone 1390, display 1392, tablet computer 1394 (or any other computing device)) and controller 1396. While providing a local WiFi connection to), a longer distance WiMAX connection can be provided simultaneously to allow access to external content. On the other hand, mass storage devices can provide storage and applications, including for external modules that rely on modular device 1350 to provide computing power.

  Thus, embodiments of the present invention can be customized to provide the best price and performance within a single package. Embodiments also make it possible to pair functions within a single modular component that might otherwise not be used. Embodiments of the present invention may be particularly useful with the systems and methods described in some of the related applications.

Software installed on portable hardware device Reference is now made to FIG. This figure shows a hardware device 1402 with a software application 1404 installed. One advantage of this system is that the software application 1404 and hardware device 1402 can be mobile, and for various computer systems 1406 that can access the software application 1404 while connected to the hardware device 1402. Can be connected and disconnected. Thus, hardware device 1402 connects to individual computer system 1406 (as shown in FIG. 82) or to network computer system 1406 (as shown in FIG. 83) and executes software application 1404 from hardware device 1402. Can give each system the ability to In some embodiments, the software application 1404 is preinstalled on the processing control unit 402, the modular device 1350, and / or other hardware devices 1402. Software application 1404 may be installed on a storage device or other component of hardware device 1402.

  In some embodiments, the software application 1404 has one or more security features that require it to remain on that particular hardware device 1402. For example, one or more security features may disable software application 1404 if software application 1404 is removed from that particular hardware device 1402. In some cases, software may be recognized to recognize a particular hardware device 1420 and disable the software application 1404 if the software application 1404 has been tampered with or removed from that particular hardware device 1402. A software license for application 1404 is programmed. In other cases, the pre-installed software application 1404 can be removed from the hardware device 1402 and transferred to another hardware device 1402.

  In some embodiments, the hardware device 1402 includes two or more software applications 1404 installed on the hardware device 1402. These software applications 1404 can be related. For example, the two or more software applications 1404 can relate to finance, design, email, etc. Inclusion of more than one software application 1404 on a single hardware device 1402 can maximize the use of the single hardware device 1402 and consolidate network resources into a single device. Further, the two or more software applications 1404 can be dependent on each other or used together.

  As shown in FIG. 1, in some embodiments, a hardware device 1402 is electronically connected to another computer system 1406, such as a personal computer. For example, the hardware device 1402 can be connected to the computer system 1406 via a USB port or other similar port. Computer system 1406 can access hardware device 1402 and execute software application 1404 from hardware device 1402 without having to install software application 1404 on hardware device 1402. In some configurations, computer system 1406 recognizes hardware device 1402 as a separate drive that communicates software application 1404 to personal computer system 1406. In addition, the hardware device 1042 can be disconnected from the first computer system 1406 and connected to the second computer system 1406. In this way, the hardware device 1402 can provide mobile software that can be used by any computer system 1406 connected to the hardware device 1402. This system may be particularly useful with expensive software programs or programs that use hardware intensively, which are expensive to install on multiple computers (as described below).

  If the hardware device includes processing power and the software application 1204 is executed on the hardware device 1402, the functionality described above can be enhanced. In some embodiments, as described above, the hardware device 1402 is a processing control unit 402 having a processor, memory, storage, BIOS, and operating system as described herein. Therefore, the hardware device 1402 can execute the software application 1404 independently of the computer system 1406. In some embodiments, hardware device 1402 is customized to have the necessary components necessary to run a software application. Thus, a simple software application with low hardware requirements can configure hardware device 1402 with components that meet those low requirements but do not greatly exceed, thereby saving costs. In other cases, other programs may use hardware intensively and require a relatively large amount of processing power, storage, memory, video processing, and the like. In such a case, the hardware device 1402 can be configured with necessary components. Thus, in some configurations, the hardware device 1402 can be customized or customizable to be specific to the software application. Therefore, this system can be used to execute a software program 1404 that uses hardware intensively on a system that cannot execute such a program alone.

  In a non-limiting example, hardware device 1402 is a processing control unit 402 having a processor, memory, storage, and I / O. Processing control unit 402 is coupled to computer system 1406 via a port, such as a USB port, and connection 1408. The hardware device 1402 stores and executes a software application 1404 that uses hardware intensively, such as a machine drafting software application 1404. The hardware device 1402 is made up of the necessary components necessary to execute a software application that may include processing and memory intensive functions. Configured as such, the hardware device 1402 can connect to the computer system 1406, the computer system 1406 accesses the software application 1404, and the software application 1404 is executed on the hardware device 1402, while the software application 1404. Is used. In this example, hardware device 1402 executes software application 1404 that is simply displayed on computer system 1406 and controlled by computer system 1406. In some cases, a user may store a machine drafting file or other data related to software application 1404 on hardware device 1402. One benefit of hardware device 1402 is that hardware device 1402 can be disconnected from computer system 1406 and then connected to a separate computer system 1406 that executes software application 1404. Thus, as noted above, this system can be useful in expensive software applications because a single software application can be used on multiple computer systems 1406 with only one license.

  In some embodiments, it will be appreciated that the user can upgrade the entire hardware device 1402 rather than upgrading the software application 1402. Alternatively, the user can upgrade a portion of the hardware device 1402, such as the software application 1402, or one of the modular motherboard components described above.

  FIG. 83 illustrates one embodiment of a hardware device 1402 in the network system. When used in a network, hardware devices 1402 can be accessed by multiple client computer systems 1406 simultaneously or one at a time. When connected to the client computer system 1406, the software application 1404 can function as if it is running on a conventional network device such as the server 1412. Separating this software application 1404 from the server 1412 can provide a number of benefits to the network as described below.

  As shown, a hardware device 1402, sometimes referred to as an application box, is indirectly connected to a client computer system 1406. A network device 1410 is arranged between the hardware device 1402 and the client computer system 1406. Network device 1410 can direct network traffic between devices over the network. In some embodiments, network device 1410 is a switch or other such device. The network also includes a server 1412 that communicates with the network device 1410.

  Since the software application 1404 is installed on a separate hardware device 1402 rather than on the server 1412, the software application 1402 may cause the networking system to run on multiple devices and execute multiple software applications. Many software and / or hardware conflicts can be avoided. This is because the software application 1404 is executed on a separate device, the hardware device 1402. This separation allows the software application 1404 and / or the hardware device 1402 to become computer viruses, worms, Trojan horses, spyware, rogue adware, scareware, crimeware, or other forms of malware or desired Can limit or eliminate the possibility of infection with no software or programs.

  In some embodiments, a majority of the entire network system or the entire network system itself is replaced with a plurality of hardware devices 1402, each having one or more network software applications 1404 used by the client computer system 1406. can do. Thus, in some configurations, one hardware device 1402 includes a hardware component for a network email system and a software application 1404, while another hardware device 1402 includes a hardware component for a document storage system and A software application 1404 is included. Other such network systems can be created to reduce the demand or demand for a single serve 1412. Thus, in some cases, the need for a server room is replaced by the ability to place different application boxes at different locations on the network.

  These descriptions are merely examples of the functionality of one or more modular processing units according to embodiments of the present invention. Indeed, while exemplary embodiments of the invention have been described herein, the invention is not limited to the various preferred embodiments described herein, but rather will be understood by one of ordinary skill in the art based on the present disclosure. Any and all embodiments having modifications, omissions, combinations (eg, aspects of the various embodiments), adaptations, and / or modifications. The limitations in the claims should be construed broadly based on the language used in the claims, and are not limited to the examples described in this specification or in the application process of this application. The example should be considered non-exclusive. For example, in the present disclosure, the term “preferably” is non-exclusive and means “preferably but not limited to”. Means plus function or step plus function limitation applies only if all of the following conditions are met for the limitation of a specific claim: a) "means for" And b) that the corresponding function is specified.

  The present invention may be embodied in other specific forms without departing from the spirit or essential characteristics of the invention. The described embodiments and examples are to be considered in all respects only as illustrative and not restrictive. The scope of the invention is, therefore, indicated by the appended claims rather than by the following description. All changes that come within the meaning and range of equivalency of the claims are to be embraced by the claims.

Claims (20)

A first electronic circuit board that performs a first function;
A second electronic circuit board that performs a second function, wherein the first board and the second board are operatively connected to provide an integrated logic board for a computer system.
Modular motherboard. The modular motherboard of claim 1, further comprising a third electronic circuit board that performs a third function, the third electronic circuit board being operatively connected to the first electronic circuit board.   The modular motherboard of claim 2, wherein the first, second, and third electronic circuit boards form a three-board configuration. The first function and the second function include
(I) electronic storage,
(Ii) electronic memory,
The modular motherboard of claim 1, comprising at least one of (iii) processing functions, and (iv) a basic I / O system.   The first electronic circuit board includes a first motherboard connector, and the second electronic circuit board includes a second motherboard connector operably connected to the first motherboard connector. The described modular motherboard.   Security that restricts the first motherboard connector from mating with the first subordinate shape that is configured to securely mesh with the second motherboard connector and the second motherboard connector that does not have a corresponding security key structure. 6. A modular processing unit according to claim 5, comprising a first shape including a second sub-shape having a key structure.   The second motherboard connector is shaped to have a third subordinate shape that securely meshes with the first motherboard connector, and a security key structure that corresponds to the security key structure of the first motherboard connector. The modular processing unit of claim 6, comprising a second shape including a fourth sub-shape. A receptacle having a plurality of receiving surfaces for interfacing with a plurality of heat generating components, further comprising an adapter surface;
The modular of claim 1, further comprising a heat sink including a diffusion duct plate having an adapter surface for fitting and interfacing with the adapter surface of the receptacle, the diffusion duct plate further comprising a diffusion duct surface. Motherboard. The first electronic circuit board circuit board has a first large surface and an opposite second large surface;
A first computing component communicatively connected to the printed circuit board and disposed along the first large surface;
The modular motherboard of claim 1, further comprising a second computing component communicatively connected to the printed circuit board and disposed along the second large surface.   The modular computing device of claim 9, wherein the first and second computing components include mass storage devices.   The modular computing device of claim 10, wherein the first computing component includes a solid state drive and the second computing component includes a rotating magnetic media drive.   A communication connection for providing communication between the first computing component and the second computing component and an external computing device, the communication connection including a port on the printed circuit board; The modular computing device of claim 9.   The modular motherboard further includes a dynamic backplane having a plurality of ports for electrically connecting peripheral devices to the modular motherboard, the second motherboard having a central processing unit. Modular motherboard.   The plurality of ports require a plurality of different logics to interface with the central processing unit and the computer is turned on unless the first printed circuit board is electrically connected to the second printed circuit board. And wherein the plurality of different logic required by the plurality of ports is disposed on a component selected from the first printed circuit board, the dynamic backplane, and combinations thereof. The described modular motherboard.   A security chip having a unique identifier, wherein the security chip prevents a component selected from unauthorized software, unauthorized hardware, and combinations thereof from functioning fully with the computer; The modular motherboard of claim 14, wherein the computer functions only when both one circuit board and the second circuit board each include the security chip.   The modular motherboard of claim 14 further comprising means for requesting a password only after the computer is disconnected from the power source and reconnected to the power source.   And further comprising a customizable exterior housing the first electronic circuit board and the second electronic circuit board, wherein one or more of the components of the customizable exterior are customized colors, designs, or logos The modular motherboard of claim 1, decorated with a label, or text. An expandable memory device including a first peripheral memory component capable of storing digital information, the first peripheral memory component comprising:
A first electrical connector for physically and electrically connecting the first peripheral memory component to a computer system;
A second electrical connector for physically and electrically connecting the first peripheral memory component to a second peripheral memory component, wherein the expandable memory device comprises the second peripheral Automatically repartitioning its memory when a memory component is electrically connected to or disconnected from the first peripheral memory component;
An expandable memory device. A hardware device;
A software application stored in the hardware device;
A security function that prevents the software application from being removed from the hardware device;
A computer system comprising a communication interface for communicating input data and output data for a software application on a separate computer system.   The hardware includes a processor for executing the software application, one or more memory devices, one or more storage devices, and one or more input / output (I / O) devices. The computer system according to claim 19.

Images