JP2014241456A5 - - Google Patents

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JP2014241456A5
JP2014241456A5 JP2014203509A JP2014203509A JP2014241456A5 JP 2014241456 A5 JP2014241456 A5 JP 2014241456A5 JP 2014203509 A JP2014203509 A JP 2014203509A JP 2014203509 A JP2014203509 A JP 2014203509A JP 2014241456 A5 JP2014241456 A5 JP 2014241456A5
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Japan
Prior art keywords
light
substrate
light emitting
emitting element
reflecting resin
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JP2014203509A
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Japanese (ja)
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JP2014241456A (en
JP6048471B2 (en
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Priority to JP2014203509A priority Critical patent/JP6048471B2/en
Priority claimed from JP2014203509A external-priority patent/JP6048471B2/en
Publication of JP2014241456A publication Critical patent/JP2014241456A/en
Publication of JP2014241456A5 publication Critical patent/JP2014241456A5/ja
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Claims (11)

基板と、
前記基板上に載置された発光素子と、
前記発光素子の周囲を取り囲むように配され、該発光素子からの光を反射させる光反射樹脂と、
前記基板の上面に形成され前記発光素子と導通した導体配線と、
前記発光素子の上方に配置されたレンズ部材と、
前記光反射樹脂で囲まれた領域に充填された封止部材とを有し、
前記レンズ部材は、基板の外縁に達しており、かつ前記封止部材、光反射樹脂の上面及び外側面に接触していることを特徴とする発光装置。 A substrate,
A light emitting element mounted on the substrate;
A light-reflecting resin disposed so as to surround the light-emitting element and reflecting light from the light-emitting element;
Conductor wiring formed on the upper surface of the substrate and electrically connected to the light emitting element
A lens member disposed above the light emitting element;
A sealing member filled in a region surrounded by the light reflecting resin;
The light emitting device, wherein the lens member reaches an outer edge of the substrate and is in contact with the sealing member and the upper and outer surfaces of the light reflecting resin. 基板と、
前記基板上に載置された発光素子と、
前記発光素子の周囲を取り囲むように配され、該発光素子からの光を反射させる光反射樹脂と、
前記基板の上面に形成され、前記発光素子と導通した導体配線と、
前記発光素子の上方に配置されたレンズ部材とを有し、
前記基板は、導体配線から露出される露出領域を有し、
該露出領域は、少なくとも一部が前記光反射樹脂に埋設されており、
前記光反射樹脂で囲まれた領域に封止部材が充填されており、
前記レンズ部材は、基板の外縁に達しており、かつ前記封止部材、光反射樹脂の上面及び外側面に接触していることを特徴とする発光装置。 A substrate,
A light emitting element mounted on the substrate;
A light-reflecting resin disposed so as to surround the light-emitting element and reflecting light from the light-emitting element;
Conductor wiring formed on the upper surface of the substrate and electrically connected to the light emitting element;
A lens member disposed above the light emitting element,
The substrate has an exposed region exposed from the conductor wiring;
The exposed region is at least partially embedded in the light reflecting resin,
A sealing member is filled in a region surrounded by the light reflecting resin,
The light emitting device, wherein the lens member reaches an outer edge of the substrate and is in contact with the sealing member and the upper and outer surfaces of the light reflecting resin. 基板と、
前記基板上に載置された発光素子と、
該導体配線上に載置された保護素子と、
前記発光素子の周囲を取り囲むように配され、該発光素子からの光を反射させる光反射樹脂と、
前記基板の上面に形成され、前記発光素子と導通した導体配線と、
前記発光素子の上方に配置されたレンズ部材とを有し
前記保護素子は、少なくともその一部が前記光反射樹脂に埋設されており、
前記光反射樹脂で囲まれた領域に封止部材が充填されているおり、
前記レンズ部材は、基板の外縁に達しており、かつ前記封止部材、光反射樹脂の上面及び外側面に接触していることを特徴とする発光装置。 A substrate,
A light emitting element mounted on the substrate;
A protective element placed on the conductor wiring;
A light-reflecting resin disposed so as to surround the light-emitting element and reflecting light from the light-emitting element;
Conductor wiring formed on the upper surface of the substrate and electrically connected to the light emitting element;
A lens member disposed above the light emitting element, and the protective element is at least partially embedded in the light reflecting resin,
A sealing member is filled in a region surrounded by the light reflecting resin,
The light emitting device, wherein the lens member reaches an outer edge of the substrate and is in contact with the sealing member and the upper and outer surfaces of the light reflecting resin. 前記封止部材に色変換部材が含有されている請求項１〜３のいずれか１項記載の発光装置。   The light emitting device according to claim 1, wherein a color conversion member is contained in the sealing member. 前記基板は、前記導体配線から露出される露出領域を有し、該露出領域の少なくとも一部が前記光反射樹脂に埋設されている請求項１又は請求項３記載の発光装置。   The light emitting device according to claim 1, wherein the substrate has an exposed region exposed from the conductor wiring, and at least a part of the exposed region is embedded in the light reflecting resin. 前記導体配線と導通される保護素子を有し、該保護素子の少なくとも一部が前記光反射樹脂に埋設されている請求項１又は請求項４記載の発光装置。   The light-emitting device according to claim 1, further comprising a protective element that is electrically connected to the conductor wiring, wherein at least a part of the protective element is embedded in the light reflecting resin. 前記光反射樹脂は、前記基板の外縁から離間する第１の領域と、前記基板の外縁と接する第２の領域とを有する請求項１〜６のいずれか１項記載の発光装置。   The light emitting device according to claim 1, wherein the light reflecting resin includes a first region that is separated from an outer edge of the substrate and a second region that is in contact with the outer edge of the substrate. 前記第１の領域は、前記基板の一辺において、前記第２の領域に挟まれている請求項７記載の発光装置   The light emitting device according to claim 7, wherein the first region is sandwiched between the second regions on one side of the substrate. 前記第２の領域は、前記基板の角部から離間する請求項７又は請求項８記載の発光装置。   The light emitting device according to claim 7, wherein the second region is separated from a corner portion of the substrate. 前記発光素子は、少なくとも一部が前記光反射樹脂と接触している請求項１〜９のいずれか１項記載の発光装置。   The light emitting device according to claim 1, wherein at least a part of the light emitting element is in contact with the light reflecting resin. 前記レンズ部材は、さらに前記基板の上面に接触している請求項１〜１０のいずれか１項記載の発光装置。   The light emitting device according to claim 1, wherein the lens member is further in contact with an upper surface of the substrate.
JP2014203509A 2014-10-01 2014-10-01 Light emitting device Active JP6048471B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2014203509A JP6048471B2 (en) 2014-10-01 2014-10-01 Light emitting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014203509A JP6048471B2 (en) 2014-10-01 2014-10-01 Light emitting device

Related Parent Applications (1)

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JP2012235723A Division JP5855554B2 (en) 2012-10-25 2012-10-25 Light emitting device

Publications (3)

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JP2014241456A JP2014241456A (en) 2014-12-25
JP2014241456A5 true JP2014241456A5 (en) 2015-11-05
JP6048471B2 JP6048471B2 (en) 2016-12-21

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JP (1) JP6048471B2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6458793B2 (en) 2016-11-21 2019-01-30 日亜化学工業株式会社 Method for manufacturing light emitting device
KR102546556B1 (en) * 2018-05-28 2023-06-22 엘지이노텍 주식회사 Semiconductor device package and light irradiation apparatus including the same
WO2022114020A1 (en) 2020-11-25 2022-06-02 シチズン電子株式会社 Light emitting device

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3985332B2 (en) * 1998-04-02 2007-10-03 松下電器産業株式会社 Semiconductor light emitting device
JP4193446B2 (en) * 2001-08-22 2008-12-10 日亜化学工業株式会社 Light emitting device
US7936418B2 (en) * 2005-09-29 2011-05-03 Kabushiki Kaisha Toshiba White light-emitting device and manufacturing method thereof, and backlight and liquid crystal display device using the same
JP2007109908A (en) * 2005-10-14 2007-04-26 Nichia Chem Ind Ltd Support for mounting light emitting device
JP4857735B2 (en) * 2005-11-28 2012-01-18 日亜化学工業株式会社 Light emitting device

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