JP2014241313A5 - LED device and manufacturing method thereof - Google Patents

LED device and manufacturing method thereof Download PDF

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Publication number
JP2014241313A5
JP2014241313A5 JP2013122367A JP2013122367A JP2014241313A5 JP 2014241313 A5 JP2014241313 A5 JP 2014241313A5 JP 2013122367 A JP2013122367 A JP 2013122367A JP 2013122367 A JP2013122367 A JP 2013122367A JP 2014241313 A5 JP2014241313 A5 JP 2014241313A5
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Prior art keywords
led
led device
sealing resin
chromaticity
die
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JP2013122367A
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JP6077392B2 (en
JP2014241313A (en
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Description

そこで本発明は、この課題を解決するため、簡単な追加工で得られる構造であっても発光色の補正が可能なLED装置及びその製造方法を提供することを目的とする。
In order to solve this problem, an object of the present invention is to provide an LED device capable of correcting a luminescent color even with a structure obtained by a simple additional process , and a manufacturing method thereof.

上記課題を解決するため本発明のLED装置の製造方法は、蛍光体を含有した樹脂でLEDダイを封止したLED装置を準備し、前記LED装置を発光させその色度を測定し、前記色度と目標とする色度との差を求め、補正テーブルに基づく条件に従って前記LED装置の上部からサンドブラスト法により拡散材を吹き付けることを特徴とする。
上記課題を解決するため本発明のLED装置は、LEDダイと、前記LEDダイの上面を被覆し、蛍光体を含有する封止樹脂と、前記封止樹脂の上部に内在し拡散材を含む拡散層とを備えたことを特徴とする。
In order to solve the above problems, a method for manufacturing an LED device according to the present invention is to prepare an LED device in which an LED die is sealed with a resin containing a phosphor, emit light from the LED device, measure its chromaticity, and The difference between the degree and the target chromaticity is obtained, and a diffusion material is sprayed from the upper part of the LED device by a sandblast method according to a condition based on a correction table.
In order to solve the above-described problems, an LED device of the present invention includes an LED die, a sealing resin that covers the upper surface of the LED die, contains a phosphor, and a diffusion that is included in the upper portion of the sealing resin and includes a diffusing material. And a layer.

Claims (6)

蛍光体を含有した樹脂でLEDダイを封止したLED装置を準備し、Preparing an LED device in which an LED die is sealed with a resin containing a phosphor,
前記LED装置を発光させその色度を測定し、  Illuminate the LED device and measure its chromaticity;
前記色度と目標とする色度との差を求め、  Find the difference between the chromaticity and the target chromaticity,
補正テーブルに基づく条件に従って前記LED装置の上部からサンドブラスト法により拡散材を吹き付ける  A diffusing material is sprayed from the top of the LED device by sandblasting according to the conditions based on the correction table.
ことを特徴とするLED装置の製造方法。A method for manufacturing an LED device.
LEDダイと、
前記LEDダイの上面を被覆し、蛍光体を含有する封止樹脂と、
前記封止樹脂の上部に内在し拡散材を含む拡散層とを
備えたことを特徴とするLED装置。
An LED die,
A sealing resin that covers the upper surface of the LED die and contains a phosphor;
An LED device comprising: a diffusion layer that is present above the sealing resin and includes a diffusion material.
前記封止樹脂の上面が粗面であることを特徴とする請求項に記載のLED装置。 The LED device according to claim 2 , wherein an upper surface of the sealing resin is a rough surface. 前記LEDダイがマザー基板に接続するための外部接続電極を備えていることを特徴とする請求項又はに記載のLED装置。 LED apparatus as claimed in claim 2 or 3, wherein the LED die is provided with an external connection electrode for connecting to the mother board. 周囲に反射枠を備え、前記反射枠の一部が斜面になっていることを特徴とする請求項2からのいずれか一項に記載のLED装置。 A reflecting frame around, LED device according to claim 2 in any one of the 4 a part of the reflective frame is characterized in that it is on the slope. 前記封止樹脂がドーム状であることを特徴とする請求項からのいずれか一項に記載のLED装置。 LED apparatus as claimed in any one of claims 2 to 5, wherein the sealing resin is characterized in that it is a dome-shaped.
JP2013122367A 2013-06-11 2013-06-11 Manufacturing method of LED device Active JP6077392B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2013122367A JP6077392B2 (en) 2013-06-11 2013-06-11 Manufacturing method of LED device

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Application Number Priority Date Filing Date Title
JP2013122367A JP6077392B2 (en) 2013-06-11 2013-06-11 Manufacturing method of LED device

Publications (3)

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JP2014241313A JP2014241313A (en) 2014-12-25
JP2014241313A5 true JP2014241313A5 (en) 2016-01-07
JP6077392B2 JP6077392B2 (en) 2017-02-08

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Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6418200B2 (en) 2016-05-31 2018-11-07 日亜化学工業株式会社 Light emitting device and manufacturing method thereof
JP6536560B2 (en) 2016-12-27 2019-07-03 日亜化学工業株式会社 Light emitting device and method of manufacturing the same
CN109935717B (en) * 2017-12-15 2021-05-25 京东方科技集团股份有限公司 Packaging structure, packaging method, electroluminescent device and display device

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JP2004221163A (en) * 2003-01-10 2004-08-05 Nichia Chem Ind Ltd Light emitting device, its forming method, planar light emitting device using the light emitting device
JP2009130301A (en) * 2007-11-27 2009-06-11 Sharp Corp Light-emitting element and method of manufacturing the same
JP2009158541A (en) * 2007-12-25 2009-07-16 Citizen Electronics Co Ltd Manufacturing method of light emitting diode

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