JP2014226690A - Device and method for manufacturing diamond tool - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a device and a method for manufacturing a diamond tool that can form a minute hole more stably.SOLUTION: A method for manufacturing a diamond tool includes the step of irradiating a surface 11a of a diamond 11 with YVOlaser L1 to form a hole 16 penetrating the diamond 11. A device for manufacturing a diamond tool includes: a stage 5 for holding a diamond member 10; and a laser source for irradiating the surface 11a of the diamond 11 with the YVOlaser L1. According to the method and the device for manufacturing the diamond tool, a minute hole can be formed more stably.

Description

  The present invention relates to a method and an apparatus for manufacturing a diamond tool, and more particularly to a method and an apparatus for manufacturing a diamond tool capable of forming a fine hole more stably.

  An example of a diamond tool having fine holes is a diamond die. A diamond die is a tool for drawing a soft wire such as a copper wire or an aluminum wire or a hard wire such as a stainless steel wire or a tungsten wire through a die hole. A diamond die is manufactured by fixing a diamond with a sintered alloy in a stainless steel case and subjecting the diamond die to cutting or laser processing to form a die hole.

  For example, Japanese Patent Laid-Open No. 9-57332 (hereinafter referred to as Patent Document 1) discloses a method of manufacturing a diamond dies for thick wires that can achieve a high yield. Japanese Patent Laid-Open No. 60-82285 (hereinafter referred to as Patent Document 2) uses a YAG (Yttrium Aluminum Garnet) laser or the like as a pulse energy to form micro-diameter holes or indentations at micro-intervals. Is disclosed.

JP-A-9-57332 Japanese Patent Laid-Open No. 60-82285

  The methods disclosed in Patent Documents 1 and 2 have a problem that it is difficult to repeatedly form a fine die hole having a hole diameter of 20 μm or less, for example, with high accuracy. Therefore, conventionally, it has been difficult to manufacture a diamond die having fine die holes with a high yield.

  This invention is made | formed in view of the said subject, The objective is to provide the manufacturing method and manufacturing apparatus of a diamond tool which can form a fine hole more stably.

The method for manufacturing a diamond tool according to the present invention includes a step of irradiating the diamond surface with a YVO ₄ laser to form holes in the diamond.

The diamond tool manufacturing apparatus according to the present invention includes a holding table for holding a member containing diamond, and a laser irradiation unit for irradiating the surface of the diamond with a YVO ₄ laser.

  According to the method and apparatus for manufacturing a diamond tool according to the present invention, it is possible to provide a method and apparatus for manufacturing a diamond tool capable of forming fine holes more stably.

It is the schematic which shows the structure of the manufacturing apparatus of the diamond tool which concerns on this Embodiment. It is the schematic which expands and shows the objective lens vicinity in the manufacturing apparatus of the diamond tool which concerns on this Embodiment. It is the schematic which expands and shows the stage vicinity in the manufacturing apparatus of the diamond tool which concerns on this Embodiment. It is a flowchart which shows schematically the manufacturing method of the diamond tool which concerns on this Embodiment. It is the schematic for demonstrating the process (S10) in the manufacturing method of the diamond tool which concerns on this Embodiment. It is the schematic for demonstrating the process (S20) in the manufacturing method of the diamond tool which concerns on this Embodiment. It is another schematic diagram for demonstrating the process (S20) in the manufacturing method of the diamond tool which concerns on this Embodiment.

(Description of Embodiment of the Present Invention)
First, the contents of the embodiment of the present invention will be listed and described. The method for manufacturing a diamond tool according to an embodiment of the present invention includes a step of irradiating a diamond surface with a YVO ₄ laser to form holes in the diamond.

According to the study by the present inventor, the YAG laser conventionally used for forming holes has poor pulse intensity stability and beam intensity distribution, and it is difficult to stably form fine holes. On the other hand, in the method for manufacturing a diamond tool according to the present embodiment, a hole is formed using a YVO ₄ laser that is more excellent in pulse intensity stability and beam intensity distribution. Therefore, according to the method for manufacturing a diamond tool according to the present embodiment, fine holes can be formed more stably.

  In the method for manufacturing a diamond tool according to the present embodiment, a diamond die may be manufactured. The above-described method for producing a diamond tool capable of stably forming fine holes is suitable for producing a diamond die.

The method of manufacturing a diamond tool according to the present embodiment described above, in the step of forming a hole, and a YVO ₄ laser is irradiated such that the magnitude of the angle between the optical axis of the surface and a YVO ₄ laser diamond changes Also good. Thereby, when forming a hole, the surface state of an internal peripheral surface can be maintained favorable. As a result, fine holes can be formed with high accuracy.

In the method for manufacturing a diamond tool according to the present embodiment, in the step of forming a hole, YVO ₄ laser may be irradiated along the inner peripheral surface of the hole.

  Thereby, when forming a hole, the surface state of an internal peripheral surface can be maintained more favorably. As a result, fine holes can be formed with higher accuracy.

In the diamond tool manufacturing method according to the present embodiment, in the step of forming a hole, a YVO ₄ laser having a pulse width of 0.1 ns or more and 30 ns or less may be irradiated.

According to the study of the present inventor, when a hole is formed using a laser having a large pulse width like a conventional YAG laser, the surface roughness on the inner peripheral surface of the hole is deteriorated. On the other hand, in the method for manufacturing a diamond tool according to the present embodiment, by using a YVO ₄ laser having a small pulse width, the deterioration of the surface roughness on the inner peripheral surface is suppressed when the hole is formed. Can do.

In the method for manufacturing a diamond tool according to the present embodiment, the YVO ₄ laser may be a SHGYVO ₄ laser. Thereby, a fine hole can be formed more easily.

Here, “SHGYVO ₄ laser” means that the wavelength of YVO ₄ (Yttrium Vanadate) laser (wavelength: 1064 nm) has been reduced to ½ (wavelength: 532 nm) by second harmonic generation (SHG: Second Harmonic Generation). Means things.

An apparatus for manufacturing a diamond tool according to an embodiment of the present invention includes a holding table that holds a member containing diamond, and a laser irradiation unit that irradiates the diamond surface with a YVO ₄ laser.

The diamond tool manufacturing apparatus according to the present embodiment includes a laser irradiation unit that irradiates a YVO ₄ laser, which has superior pulse intensity stability and beam intensity distribution compared to a YAG laser. Thereby, a fine hole can be more stably formed compared with the conventional manufacturing apparatus provided with a YAG laser.

  Here, the “member containing diamond” may be a single diamond or a composite member composed of diamond and another member. Examples of the composite member include diamond fixed to a stainless steel case with a sintered alloy.

  The diamond tool manufacturing apparatus according to the present embodiment may be an apparatus for manufacturing a diamond die. The above diamond tool manufacturing apparatus capable of stably forming fine holes is suitable for manufacturing diamond dies.

The diamond tool manufacturing apparatus according to the present embodiment may further include an angle adjusting unit that changes the size of the angle formed by the surface of the diamond and the optical axis of the YVO ₄ laser. Thereby, when forming a hole, the surface state of an internal peripheral surface can be maintained favorable. As a result, fine holes can be formed with high accuracy.

In the diamond tool manufacturing apparatus according to the present embodiment, the angle adjustment unit operates the laser irradiation unit so that the angle formed by the surface of the diamond and the optical axis of the YVO ₄ laser changes. One movable member may be used. The angle adjusting unit may be a second movable member that operates the holding table so that the angle formed by the surface of the diamond and the optical axis of the YVO ₄ laser changes. Thus, various configurations can be employed for the angle adjusting unit.

In the diamond tool manufacturing apparatus according to the present embodiment, the pulse width of the YVO ₄ laser may be not less than 0.1 ns and not more than 30 ns.

  Thereby, when forming a hole, the deterioration of the surface roughness in an internal peripheral surface can be suppressed.

In the diamond tool manufacturing apparatus according to the present embodiment, the YVO ₄ laser may be a SHGYVO ₄ laser. Thereby, a fine hole can be formed more easily.

(Details of the embodiment of the present invention)
Next, a specific example of a method and apparatus for manufacturing a diamond tool according to an embodiment of the present invention will be described with reference to the drawings. In the following drawings, the same or corresponding parts are denoted by the same reference numerals, and description thereof will not be repeated.

  First, a diamond tool manufacturing apparatus according to this embodiment will be described using a diamond die manufacturing apparatus as an example. Referring to FIG. 1, a diamond tool manufacturing apparatus (laser processing apparatus) 1 according to the present embodiment is used for forming a die hole by performing laser processing on diamond 11 in manufacturing a diamond die. Is. The laser processing apparatus 1 includes a laser light source (laser irradiation unit) 2, a beam expander 3, an objective lens 4, a stage 5 (holding table), a laser light source movable member 6 (first movable member), and a stage movable member. 7 (second movable member).

The laser light source 2 emits a YVO ₄ laser L 1 and irradiates the surface of the diamond 11 included in the diamond member 10 with the laser L 1. The output of the laser L1 is, for example, 8 W, the frequency is 10 to 50.6 kHz (for example, 20 kHz), and the pulse width is, for example, 0.1 ns to 30 ns.

  The beam expander 3 is for enlarging the beam diameter of the laser L1, and is disposed on the optical path of the laser L1. The objective lens 4 focuses the laser L1 and irradiates the surface of the diamond 11. The magnification of the objective lens 4 is 5 times, for example. The stage 5 holds the diamond member 10 on the surface 5a.

  Referring to FIG. 2, the focal length f (mm) of the objective lens 4 is, for example, 40 mm. The beam diameter D (mm) of the laser L1 (after being expanded by the beam expander) is, for example, 4 mm. The wavelength λ (μm) of the laser L1 is 1.064 (μm). Thus, the spot diameter d of the laser L1 after passing through the objective lens 4 is 13.5 μm according to the relational expression d = 1.27 × f × λ / D.

  Referring to FIG. 3, laser processing apparatus 1 changes the angle (angle) θ formed by surface 11a of diamond 11 and the optical axis of laser L1 (indicated by a solid line arrow and a dotted line arrow in FIG. 3). An angle adjustment unit is provided. More specifically, referring to FIG. 1, the laser processing apparatus 1 includes a laser light source movable member 6 (first movable member, angle adjusting unit) for operating the laser light source 2 so that the angle θ changes. I have. In addition, the laser processing apparatus 1 includes a stage movable member 7 (second movable member, angle adjusting unit) that moves the stage 5 so that the angle θ changes. As shown in FIG. 1, the laser processing apparatus 1 may include both the laser light source movable member 6 and the stage movable member 7, or one of the laser light source movable member 6 and the stage movable member 7. May be.

  Next, a method for manufacturing a diamond tool according to the present embodiment will be described using a method for manufacturing a diamond die as an example. Referring to FIG. 4, in the method for manufacturing a diamond tool according to the present embodiment, steps (S10) to (S30) are sequentially performed, and in step (S20), the diamond tool according to the present embodiment is manufactured. An apparatus (laser processing apparatus 1) is used.

  First, as a step (S10), a step of preparing a diamond member is performed. In this step (S10), referring to FIG. 5, first, natural diamond 11 and stainless steel die base 12 are prepared. And the diamond 11 is arrange | positioned on the bottom face 12a of the die base part 12. FIG. Moreover, the diamond 11 may be arrange | positioned on the bottom face 12a via a pellet (not shown). The thickness of the diamond 11 is 0.6 mm, for example. The die pedestal 12 has a thickness of 8 mm, for example, and an outer diameter of 25 mm, for example.

  Next, an alloy powder containing nickel (Ni) and chromium (Cr) is filled into the die base 12. And the die base part 12 is sintered while the said alloy powder is pressed. Thereby, the diamond member 10 in which the diamond 11 is fixed by the sintered bond 13 in the die pedestal portion 12 is obtained. Then, after the sintering process is completed, the diamond member 10 is allowed to cool.

  Next, as a step (S20), a step of forming a die hole is performed. In this step (S20), referring to FIG. 6, first, the diamond member 10 is turned to form the introduction port 14 and the escape port 15, respectively.

  Next, referring to FIG. 1, the diamond member 10 on which the turning process has been performed is placed on the stage 5 of the laser processing apparatus 1. Then, the surface of the diamond 11 is irradiated with the laser L1. Thereby, as shown in FIG. 6, the die hole 16 penetrating the diamond 11 in the thickness direction is formed. The pulse width of the laser L1 is, for example, not less than 0.1 ns and not more than 30 ns.

  Referring to FIG. 7, die hole 16 includes a bell portion (entrance portion) 16b, an approach portion 16c, a reduction portion 16d, a bearing portion 16e, a back relief portion 16f, and an exit portion 16g. . The bearing portion 16e is a portion where the diameter of the die hole 16 is minimized. The diameter D1 of the bearing portion 16e is less than 50 μm, more preferably 20 μm or less. Further, the reduction angle θ1 is an angle for narrowing a wire to be drawn on the inlet side of the bearing portion 16e, and is 2.5 ° or more and 20 ° or less, preferably 10 ° or less.

  Referring to FIG. 3, in this step (S20), at least one of laser light source 2 and stage 5 (see FIG. 1) is operated to form an angle formed by surface 11a of diamond 11 and the optical axis of laser L1. The laser L1 is irradiated so that the magnitude (angle) θ of the laser beam changes. More specifically, referring to FIG. 7, the laser L1 is irradiated along the inner peripheral surface 16a by irradiating the laser L1 while changing the angle θ. “Laser L1 is along inner peripheral surface 16a” means that the outer edge of the laser L1 beam (shown by a broken line in FIG. 7) is tangent to inner peripheral surface 16a as shown in FIG. means.

  Next, a finishing step is performed as a step (S30). In this step (S30), the inner peripheral surface 16a of the die hole 16 is polished. The diamond dies 10A (see FIG. 6) are manufactured by performing the steps (S10) to (S30) as described above, and the manufacturing method of the diamond tool according to the present embodiment is completed.

As described above, in the method for manufacturing a diamond tool according to the present embodiment, the die hole 16 is formed using the YVO ₄ laser L1 having excellent pulse intensity stability and beam intensity distribution. As a result, the fine die hole 16 can be stably formed as compared with the case where the die hole is formed using a YAG laser having poor pulse intensity stability and beam intensity distribution. In the method of manufacturing a diamond tool according to the present embodiment, a YVO ₄ laser L1 such that the magnitude of the angle θ is changed formed between the optical axis of the surface 11a and a YVO ₄ laser L1 diamond 11 is irradiated with a die A hole 16 is formed. Thereby, when forming the die hole 16, the surface state of the inner peripheral surface 16a can be favorably maintained. Therefore, according to the method for manufacturing a diamond tool according to the present embodiment, fine die holes 16 can be formed with high accuracy.

In the diamond tool manufacturing apparatus and manufacturing method according to the present embodiment, the laser light source 2 may irradiate the SHGYVO ₄ laser L1. In this case, the spot diameter d (see FIG. 2) of the laser L1 is 6.8 μm, and when the same processing as in the case of the present embodiment is performed, the diameter D1 of the bearing portion 16e is 5 μm or more and 20 μm or less. The angle θ1 is 2.5 ° or more and 20 ° or less.

  In the above-described embodiment, the diamond die manufacturing apparatus and manufacturing method have been described as an example. However, the diamond tool manufacturing apparatus and manufacturing method of the present invention are not limited thereto. The diamond tool manufacturing apparatus and manufacturing method of the present invention may be applied to other diamond tool manufacturing apparatuses and manufacturing methods such as a diamond nozzle.

  The embodiment disclosed this time is to be considered as illustrative in all points and not restrictive. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

  The diamond tool manufacturing apparatus and manufacturing method of the present invention can be particularly advantageously applied to a diamond tool manufacturing apparatus and manufacturing method that require stable formation of fine holes.

DESCRIPTION OF SYMBOLS 1 Laser processing apparatus, 2 Laser light source, 3 Beam expander, 4 Objective lens, 5 Stage, 5a, 10a, 11a Surface, 6 Laser light source movable member, 7 Stage movable member, 10 Diamond member, 10A Diamond die, 11 Diamond, 12 Die base, 12a bottom, 13 sintered bond, 14 inlet, 15 escape port, 16 die hole, 16a inner peripheral surface, 16b bell (entrance), 16c approach, 16d reduction, 16e bearing, 16f Back relief part, 16g exit part, D beam diameter, f focal length, d spot diameter, L1 laser ((SHG) YVO ₄ laser), θ angle, θ1 reduction angle, D1 diameter.

Claims (13)

A method for manufacturing a diamond tool, comprising the step of irradiating a surface of diamond with a YVO ₄ laser to form holes in the diamond.   The method for manufacturing a diamond tool according to claim 1, wherein a diamond die is manufactured. 3. The diamond according to claim 1, wherein in the step of forming the hole, the YVO ₄ laser is irradiated so that an angle formed by a surface of the diamond and an optical axis of the YVO ₄ laser is changed. Tool manufacturing method. The method for producing a diamond tool according to any one of claims 1 to 3, wherein in the step of forming the hole, the YVO ₄ laser is irradiated along an inner peripheral surface of the hole. 5. The method for manufacturing a diamond tool according to claim 1, wherein in the step of forming the hole, the YVO ₄ laser having a pulse width of 0.1 ns to 30 ns is irradiated. The YVO ₄ laser is SHGYVO ₄ laser, a manufacturing method of the diamond tool according to any one of claims 1 to 5. A holding table for holding a member containing diamond;
A diamond tool manufacturing apparatus comprising: a laser irradiation unit configured to irradiate a surface of the diamond with a YVO ₄ laser.   The diamond tool manufacturing apparatus according to claim 7, which is an apparatus for manufacturing a diamond die. The diamond tool manufacturing apparatus according to claim 7 or 8, further comprising an angle adjusting unit that changes a magnitude of an angle formed by the surface of the diamond and the optical axis of the YVO ₄ laser. Said angle adjustment unit is a first movable member for operating said laser irradiation unit so that the magnitude of the angle between the optical axis of the surface and the YVO ₄ laser of the diamond is changed, according to claim 9 Diamond tool manufacturing equipment. Said angle adjustment unit is a second movable member operating the supporting table such that the magnitude of the angle between the optical axis of the surface and the YVO ₄ laser of the diamond is changed, according to claim 9 or 10 Diamond tool manufacturing equipment. 12. The diamond tool manufacturing apparatus according to claim 7, wherein a pulse width of the YVO ₄ laser is 0.1 ns or more and 30 ns or less. The diamond tool manufacturing apparatus according to any one of claims 7 to 12, wherein the YVO ₄ laser is a SHGYVO ₄ laser.

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