JP2014224939A - Display apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a display apparatus that can efficiently radiate heat generated by circuit chips.SOLUTION: A display apparatus comprises a display panel 116 that displays pictures; a cell guide 118 that supports the display panel 116 from the rear; a metal-made bezel 120 that covers the periphery of the display panel 116 from the front; and a flexible COF 126 that is positioned between the cell guide 118 and the bezel 120, one end of which is connected to the periphery of the display panel 116 and on which a driver chip 128 is mounted. At least either of the cell guide 118 or the bezel 120 has a structure to guide the COF 126 so that the COF 126 and the bezel 120 come into contact with each other in the mounted position of the driver chip 128.

Description

  The present invention relates to a heat dissipation structure for heat generated from a circuit chip mounted on a COF (Chip On Film) connected to a display panel such as a liquid crystal panel.

  In a display device such as a liquid crystal display device, a COF is connected to one end of the periphery of the display panel. A driver circuit for supplying a display signal to the display panel is mounted on the COF. Conventionally, in order to enhance the heat dissipation effect from the COF, a method is known in which the COF is brought into contact with a bezel that is a metal frame member that covers the periphery of the display panel (see, for example, Patent Document 1). The driver circuit mounting position on the COF has the largest heat dissipation. For this reason, in order to efficiently dissipate heat, in Patent Document 1, a protrusion is provided on the bezel, and the COF and the protrusion are brought into contact with each other at the circuit chip mounting position.

JP2012-123170A

  However, in recent years, in order to reduce the thickness of the display device and improve the design of the external appearance, so-called narrowing of the frame, in which a portion of the front panel outside the display panel is thinned, has been performed. In order to narrow the display frame, it is necessary to arrange a bezel, a cell guide as a support member for supporting the display panel, and the like in a limited space. Along with this, the COF must also be arranged in a limited space. Therefore, since the COF shifts from the ideal position, it is difficult to contact the COF and the bezel at the circuit chip mounting position. For this reason, there exists a subject that heat radiation cannot be performed efficiently.

  The present invention has been made to solve the above-described problems, and an object thereof is to provide a display device that can efficiently dissipate heat generated from a circuit chip.

  In order to achieve the above object, a display device according to an aspect of the present invention includes a display panel that displays an image, a support member that supports the display panel from the back side of the display panel, and a surface of the display panel. A metal frame member that covers the periphery of the display panel from the side, a flexible member that is positioned between the support member and the frame member, one end connected to the periphery of the display panel, and a circuit chip mounted thereon And at least one of the support member and the frame member has a structure for guiding the wiring substrate so that the wiring substrate and the frame member are in contact with each other at a mounting position of the circuit chip. .

  According to this configuration, the wiring board and the metal frame member can be brought into contact with each other at the circuit chip mounting position. For this reason, the heat generated from the circuit chip can be efficiently radiated.

  For example, the above-described display device further includes a circuit board positioned between the support member and the frame member and connected to the other end of the wiring board, and the frame member is a part of the wiring board. There may be an opening for pulling out the frame member from the support member side.

  According to this configuration, a space in which the wiring board can be arranged can be expanded. For this reason, a wiring board can be arrange | positioned in an ideal position and a wiring board and a frame member can be made to contact in the mounting position of a circuit chip. Therefore, the heat generated from the circuit chip can be efficiently radiated.

  Further, the frame member may have a protruding portion that comes into contact with the wiring board at a mounting position of the circuit chip.

  According to this configuration, the wiring board and the frame member can be easily brought into contact with each other at the position where the circuit chip is mounted, as compared with the case where a planar frame member having no protruding portion is used at the position where the circuit board is contacted. Therefore, the heat generated from the circuit chip can be efficiently radiated.

  Further, the above-described display device is further located from the surface side of the display panel between the casing member that covers the frame member, the frame member and the casing member, and the other end of the wiring board. The frame member including a position where the circuit chip is mounted, from the middle of the wiring board to an end of the wiring board, from the support member side to the casing. You may have the opening for guiding to the member side.

  According to this configuration, by passing the wiring board from the support member side to the housing member side through the opening, the wiring board can be guided and the wiring board and the frame member can be brought into contact at the mounting position of the circuit chip. Therefore, the heat generated from the circuit chip can be efficiently radiated. In addition, the circuit chip can be kept away from the backlight light source arranged in the vicinity of the display panel. For this reason, the heat of the circuit chip can be radiated without being affected by the heat of the backlight light source.

  Further, the housing member may have an opening at a position facing the circuit chip.

  According to this configuration, since the circuit chip can be disposed in the vicinity of the housing member, the opening of the housing member can efficiently release the heat of the circuit chip to the outside of the housing member. .

  The support member may have a convex portion that guides the wiring board in a curved shape so that the wiring board and the frame member are in contact with each other at the mounting position of the circuit chip.

  According to this configuration, the bending of the wiring board can be controlled by bringing the convex portion into contact with the wiring board. For this reason, a wiring board and a frame member can be made to contact in the mounting position of a circuit chip. Moreover, the wiring board can be prevented from being disconnected by guiding the wiring board in a curved line.

  Further, the convex portion may have a concave portion at a position facing the mounting position of the circuit chip.

  According to this configuration, since the gap between the convex portion and the frame member is deviated from the reference value, the circuit chip can be sunk inside the concave portion even if the gap between the convex portion and the frame member becomes narrow. The circuit chip can be prevented from coming into contact with the convex portion and being destroyed.

  Moreover, the width | variety of the said recessed part may become wide as it goes outside.

  According to this configuration, when the circuit chip is pressed from the frame member side, the circuit chip can be easily moved to the inside of the recess. For this reason, a circuit chip and a convex part can be made hard to contact.

  Moreover, the said convex part may have the flat part which removed the top part in the periphery of the said recessed part.

  According to this structure, the distance between a convex part and a frame member can be enlarged. For this reason, a circuit chip and a convex part can be made hard to contact.

  The display device described above may further include an elastic member provided inside the recess.

  According to this configuration, even if the circuit chip sinks inside the recess, the circuit chip contacts the elastic member, so that the circuit chip can be prevented from being destroyed.

  Further, the convex portion may be formed of an elastic member.

  According to this structure, the convex part is formed with the elastic member. For this reason, sinking of the wiring board can be allowed. Therefore, even if the wiring substrate and the convex portion come into contact with each other due to an impact applied to the display device, the wiring substrate can be prevented from being disconnected.

  According to the present invention, it is possible to provide a display device that can efficiently dissipate heat generated from a circuit chip.

It is a partial cross-sectional view of a conventional display device. 1 is an external view of a display device according to Embodiment 1. FIG. FIG. 3 is a cross-sectional view of the display device according to the first embodiment, taken along line AA in FIG. 2. FIG. 3 is a cross-sectional view of the display device according to the second embodiment, taken along line AA in FIG. 2. It is the figure which showed the vicinity of opening typically. It is a partial cross-sectional view of a conventional display device. It is the sectional view on the AA line in FIG. 2 of the display apparatus which concerns on Embodiment 3. FIG. It is a figure for demonstrating the determination method of the cross-sectional shape of a convex part. FIG. 6 is a cross-sectional view of the display device according to the fourth embodiment, taken along line AA in FIG. FIG. 6 is a cross-sectional view of the display device according to the fifth embodiment, taken along line AA in FIG. FIG. 9 is a cross-sectional view of the display device according to the sixth embodiment, taken along line AA in FIG. FIG. 9 is a cross-sectional view of the display device according to the seventh embodiment, taken along line AA in FIG.

(Knowledge that became the basis of the present invention)
The present inventor has found that the following problems occur with respect to the conventional display device described in the “Background Art” column.

  FIG. 1 is a partial cross-sectional view of a conventional display device (corresponding to a cross-sectional view taken along line AA in FIG. 2 described later).

  In the conventional display device, the COF 126 must be disposed in a limited space between the cell guide 118 and the bezel 120 due to the effect of narrowing the frame. For this reason, it is difficult to arrange the COF 126 along the ideal curve 126a originally assumed by the designer.

  That is, if the COF 126 can be arranged along the ideal curve 126a, the COF 126 and the protruding portion 121 of the bezel 120 at the ideal position 128a of the driver chip 128 (the position where the driver chip 128 and the protruding portion 121 are in contact). , And the heat generated from the driver chip 128 is transmitted to the bezel 120 so that the heat can be efficiently radiated.

  However, since the COF 126 cannot be disposed along the ideal curve 126a, the driver chip 128 deviates from the ideal position 128a. Therefore, the COF 126 and the protruding portion 121 of the bezel 120 cannot be brought into contact with each other at the mounting position of the driver chip 128, and the heat generated from the driver chip 128 cannot be efficiently radiated.

  In the present disclosure, a display device capable of efficiently dissipating heat generated from a circuit chip will be described.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Each of the embodiments described below shows a preferred specific example of the present invention. Numerical values, shapes, materials, constituent elements, arrangement positions and connection forms of constituent elements, and the like shown in the following embodiments are merely examples, and are not intended to limit the present invention. The invention is specified by the claims. Therefore, among the constituent elements in the following embodiments, constituent elements that are not described in the independent claims are not necessarily required to achieve the object of the present invention, but are described as constituting more preferable embodiments. Is done. Each figure is a schematic diagram and is not necessarily illustrated exactly.

(Embodiment 1)
FIG. 2 is an external view of the display device according to the first embodiment. The display device 100 is, for example, a liquid crystal display device or a liquid crystal television receiver. Hereinafter, the width direction, the height direction, and the depth direction of the display device 100 are referred to as an x direction, a y direction, and a z direction, respectively.

  3 is a cross-sectional view of the display device 100 according to the first embodiment taken along line AA in FIG.

  The display device 100 includes a rear frame 102, a heat sink 104, an LED (Light Emitting Diode) substrate 106, a reflection sheet 110, a diffusion plate 112, an optical sheet 114, a display panel 116, a cell guide 118, and a bezel. 120, a cushion material 122, a front panel 124, a COF 126, a driver chip 128, and a relay board 130.

  The rear frame 102 is a housing that covers each component of the display device 100 from the back side of the display device 100.

  The display panel 116 is a panel for displaying an image.

  A plurality of LEDs 108 are arranged in the x direction on the LED substrate 106, and each LED 108 emits light toward the display panel 116.

  The heat sink 104 is installed on the rear frame 102 and is disposed in contact with the LED board 106 to radiate heat from the LED board 106.

  The reflection sheet 110 reflects the light emitted from the LEDs 108 toward the display panel 116.

  The diffusion plate 112 diffuses the light emitted from the LED 108.

  The optical sheet 114 is an optical film such as a polarizing film.

  The cell guide 118 is a resin support member that supports the display panel 116 from the back side of the display panel 116.

  The bezel 120 is a metal frame member that covers the periphery of the display panel 116 from the surface side of the display panel 116.

  The cushion material 122 is located between the display panel 116 and the bezel 120 and prevents the bezel 120 from coming into contact with the display panel 116, thereby preventing the display panel 116 from being damaged.

  The front panel 124 is a housing member that covers the bezel 120 from the surface side of the display panel 116.

  The COF 126 is a flexible wiring board for connecting the display panel 116 and the relay board 130. The COF 126 is located between the cell guide 118 and the bezel 120, one end is connected to the peripheral edge of the display panel 116, and the other end is connected to the relay substrate 130. A driver chip 128 is mounted on the COF 126.

  The driver chip 128 is an IC (Integrated Circuit) for driving the source bus line of the front panel 124.

  The relay board 130 is a circuit board on which a circuit for relaying a signal output from a signal processing circuit board that performs signal processing of a video signal to be displayed on the display panel 116 to the driver chip 128 is mounted. The relay board 130 includes, for example, a timing controller.

  The bezel 120 has, for example, an opening 132 for pulling out a part of the COF 126 from the cell guide 118 side of the bezel 120 in a part on the front side of the display device 100. The opening 132 is formed, for example, by cutting a part of the bezel 120 into a rectangular shape.

  Further, the bezel 120 has a protrusion 121 that contacts the COF 126 at the mounting position of the driver chip 128. The protrusion 121 has, for example, a truncated cone shape, and is formed by subjecting the bezel 120 to a drawing process or the like. Note that if the driver chip 128 and the protrusion 121 are brought into direct contact, the wiring of the driver chip 128 may be short-circuited. For this reason, the driver chip 128 and the protrusion 121 are brought into contact with each other through the film of the COF 126. However, when an insulating paint such as a solder resist is applied on the driver chip 128, the driver chip 128 and the protruding portion 121 can be brought into contact with each other through the solder resist.

  According to such a configuration, since a part of the COF 126 can be drawn out from the opening 132, the COF 126 can be disposed along the ideal curve 126a originally assumed by the designer shown in FIG. it can. Therefore, the COF 126 and the metal bezel 120 can be brought into contact with each other at the mounting position of the driver chip 128. For this reason, since the heat generated from the driver chip 128 is transmitted to the bezel 120, the heat can be efficiently radiated.

  In particular, since the protruding portion 121 is formed on the bezel 120, the COF 126 and the bezel are mounted at the mounting position of the driver chip 128 as compared with the case where the planar bezel 120 that does not have the protruding portion 121 is used at the contact position with the COF 126. 120 can be easily brought into contact. Therefore, the heat generated from the driver chip 128 can be efficiently radiated.

(Embodiment 2)
In Embodiment 1, an opening is provided in the bezel, and a part of the COF is drawn out from the opening. The second embodiment is similar to the first embodiment in that an opening is similarly provided in the bezel. However, the second embodiment is different from the first embodiment in that not only a part of the COF but also a relay substrate is drawn from the opening.

  Hereinafter, a description will be given focusing on differences from the first embodiment. The same components as those in the first embodiment are denoted by the same reference numerals. Since the functions and names are also the same, detailed description thereof will not be repeated here.

  The external view of the display device according to Embodiment 2 is the same as FIG.

  4 is a cross-sectional view of the display device 100 according to the second embodiment, taken along line AA in FIG.

  An opening 133 is formed in the bezel 120. The opening 133 is formed, for example, by cutting a part of the bezel 120 into a rectangular shape.

  FIG. 5 is a diagram schematically showing the vicinity of the opening 133.

  4 and 5, the opening 133 guides from the cell guide 118 side to the front panel 124 side from the middle of the COF 126 to the end of the COF 126 including the position where the driver chip 128 is mounted. To do. Accordingly, the relay board 130 connected to the end of the COF 126 is also arranged on the front panel 124 side of the bezel 120. The relay board 130 is fixed to the bezel 120 in a state where the COF 126 is pulled in the z direction so that the COF 126 and the bezel 120 come into contact with each other at the mounting position of the driver chip 128. The relay board 130 is fixed to the bezel 120 with, for example, screws. The COF 126 is fixed so as to come into contact with the bezel 120 with an aluminum heat dissipation tape or the like. The bezel 120 does not have the protruding portion 121 shown in FIG. Thereby, it becomes easy to make the COF 126 and the bezel 120 contact each other.

  The front panel 124 has a slit 134 which is an example of an opening at a position facing the driver chip 128.

  According to such a configuration, the COF 126 is guided from the cell guide 118 side to the front panel 124 side through the opening 133, thereby guiding the COF 126 and bringing the COF 126 and the bezel 120 into contact at the mounting position of the driver chip 128. it can. Therefore, the heat generated from the driver chip 128 can be efficiently transmitted to the bezel 120 and radiated. Further, the driver chip 128 can be moved away from the LED substrate 106 and the LED 108. For this reason, the heat of the driver chip 128 can be radiated without being affected by the heat of the LED substrate 106 and the LED 108.

  Further, since the driver chip 128 can be disposed in the vicinity of the front panel 124, the heat of the driver chip 128 can be efficiently discharged to the outside of the front panel 124 from the slit 134 provided in the front panel 124.

(Embodiment 3)
In the first and second embodiments, the COF is guided by providing an opening in the bezel. In the third embodiment, a configuration for guiding the COF without providing an opening in the bezel 120 will be described.

  FIG. 6 is a partial cross-sectional view (corresponding to a cross-sectional view taken along the line AA of FIG. 2) of a conventional display device. The COF 126 has flexibility. For this reason, even if the COF 126 is disposed so that the COF 126 and the bezel 120 are in contact with each other at the mounting position of the driver chip 128 at the time of manufacturing the display device, the COF 126 may be displaced due to movement of the display device or the like. Or the bezel 120 may be out of contact with each other at the mounting position of the driver chip 128.

  Therefore, in the third embodiment, by guiding the COF 126 from the cell guide 118 side, the COF 126 and the bezel 120 are reliably brought into contact at the mounting position of the driver chip 128.

  The external view of the display device according to Embodiment 3 is the same as FIG.

  7 is a cross-sectional view of the display device 100 according to the third embodiment taken along line AA in FIG. In FIG. 7, only main components of the display device 100 are illustrated.

  The cell guide 118 has a convex portion 136 that guides the COF 126 in a curved shape so that the COF 126 and the bezel 120 come into contact with each other at the mounting position of the driver chip 128. The convex portion 136 may be integrally formed with the cell guide 118.

  The convex portion 136 has a concave portion 138 at a position facing the mounting position of the driver chip 128.

  Next, the cross-sectional shape of the convex part 136 is demonstrated. FIG. 8 is a diagram for explaining a method for determining the cross-sectional shape of the convex portion 136. The cross-sectional shape of the convex portion 136 can be a part of an elliptical shape, for example. A connection point between the relay substrate 130 and the COF 126 is defined as A point, and a contact point between the COF 126 and the bezel 120 at the mounting position of the driver chip 128 is defined as B point. When the distance a (a> 0) from the center of the ellipse to the point A is the short side of the ellipse and the distance b (b> 0) from the center of the ellipse to the point B is the long side of the ellipse, the point on the ellipse P (y, z) can be expressed by the following Equation 1.

  Since the COF 126 can be smoothly bent by setting the cross-sectional shape of the convex portion 136 to the shape of a part of the ellipse shown in Formula 1, disconnection of the COF 126 can be prevented.

  According to such a configuration, the bending of the COF 126 can be controlled by bringing the convex portion 136 into contact with the COF 126. For this reason, the COF 126 and the bezel 120 can be brought into contact with each other at the mounting position of the driver chip 128.

  Further, when the concave portion 138 is not provided in the convex portion 136, the following problem occurs. That is, when the interval between the convex portion 136 and the bezel 120 is deviated from the reference value due to the influence of tolerance or the like, and the interval between the convex portion 136 and the bezel 120 becomes narrow, the driver chip 128 contacts the convex portion 136. Thus, the driver chip 128 is destroyed. However, in the third embodiment, the concave portion 138 is provided in the convex portion 136. For this reason, even if the interval between the convex portion 136 and the bezel 120 is narrowed, the driver chip 128 can be sunk inside the concave portion 138, so that the driver chip 128 contacts the convex portion 136 and is destroyed. Can be prevented.

(Embodiment 4)
The display device according to the fourth embodiment differs from the display device 100 according to the third embodiment shown in FIG.

  The external view of the display device according to Embodiment 4 is the same as FIG.

  9 is a cross-sectional view of the display device 100 according to the fourth embodiment, taken along line AA in FIG. In FIG. 9, only main components of the display device 100 are illustrated.

  The recess 138 has a shape in which the width of the opening becomes wider toward the outside, that is, in the negative direction of the z-axis.

  According to such a configuration, even if the driver chip 128 is slightly displaced in the x direction, the driver chip 128 and the convex portion 136 do not contact each other. Further, when the driver chip 128 is pressed from the bezel 120 side, the driver chip 128 can be easily moved into the recess 138. For this reason, it is possible to make it difficult for the driver chip 128 and the convex portion 136 to come into contact with each other.

(Embodiment 5)
The display device according to the fifth embodiment is different from the display device 100 according to the third embodiment shown in FIG.

  The external view of the display device according to Embodiment 5 is the same as FIG.

  FIG. 10 is a cross-sectional view of the display device 100 according to the fifth embodiment, taken along line AA in FIG. In FIG. 10, only main components of the display device 100 are illustrated.

  The convex portion 136 has a flat portion from which the top portion is removed at the periphery of the concave portion 138, that is, at the top portion of the convex portion 136. That is, the distance between the convex portion 136 and the bezel 120 of the display device 100 according to Embodiment 3 shown in FIG. 7 is d1, and the distance between the convex portion 136 and the bezel 120 in FIG. 10 is d2. In this case, the top of the convex 136 is cut so that d2> d1.

  According to such a configuration, even if the driver chip 128 is slightly displaced in the x direction, the driver chip 128 and the convex portion 136 do not contact each other. Further, since the distance between the convex portion 136 and the bezel 120 is large, even when the driver chip 128 is pressed from the bezel 120 side, the driver chip 128 and the convex portion 136 may be difficult to contact. it can.

(Embodiment 6)
The display device according to the sixth embodiment is different from the display device 100 according to the third embodiment shown in FIG. 7 in that an elastic member is provided in the recess 138.

  The external view of the display device according to Embodiment 6 is the same as FIG.

  11 is a cross-sectional view of the display device 100 according to the sixth embodiment, taken along line AA in FIG. In FIG. 11, only main components of the display device 100 are illustrated.

  An elastic member 140 is disposed inside the recess 138. The elastic member 140 is made of a material such as urethane or rubber, for example.

  According to such a configuration, even if the circuit chip sinks inside the recess 138 due to the deformation of the display device 100 or the positional deviation of the bezel 120 and the cell guide 118, the circuit chip contacts the elastic member 140. Therefore, the circuit chip can be prevented from being destroyed.

  The shape of the recess 138 is not limited to that shown in FIG. For example, it may have the same shape as the recess 138 shown in FIG.

(Embodiment 7)
The display device according to the seventh embodiment is different from the display device 100 according to the third embodiment shown in FIG. 7 in that the convex portions provided on the cell guide 118 are not made of resin but are formed of an elastic member. Is different.

  The external view of the display device according to the seventh embodiment is the same as FIG.

  12 is a cross-sectional view of the display device 100 according to the seventh embodiment, taken along line AA in FIG. In FIG. 12, only main components of the display device 100 are illustrated.

  The cell guide 118 is formed with a convex portion 142 having the same shape as the convex portion 136 shown in FIG. However, the convex portion 142 is formed of an elastic member such as rubber. The convex portion 142 is fixed to the cell guide 118 with, for example, an adhesive.

  According to such a configuration, the convex portion 142 is formed of an elastic member. For this reason, the sinking of the COF 126 can be allowed. Therefore, even if the COF 126 and the convex portion 142 come into contact with each other due to an impact or the like applied to the display device 100, it is possible to prevent the COF 126 from being disconnected.

  Although the display device 100 according to the embodiments of the present invention has been described above, the present invention is not limited to these embodiments.

  For example, the cross-sectional shape of the convex portion 136 or the convex portion 142 provided in the cell guide 118 described in Embodiments 3 to 7 may be a curved shape, and may not be a partial shape of an ellipse. For example, it may be a partial shape of a quadratic curve.

  Further, the above embodiments may be combined. For example, in the configuration of the display device 100 according to the first embodiment illustrated in FIG. 3, the cell guide 118 is provided with the convex portion 136 as illustrated in FIG. 7, and the COF 126 and the bezel 120 are mounted at the mounting position of the driver chip 128. You may guide COF126 so that the protrusion part 121 may contact.

  Moreover, you may form the convex part 136 shown in FIGS. 9-11 with an elastic member.

  The present invention can be applied to a liquid crystal television receiver, an organic EL (Electro Luminescence) television receiver, or the like as a reproducing apparatus.

100 Display Device 102 Rear Frame 104 Heat Sink 106 LED Substrate 108 LED
110 Reflective sheet 112 Diffusion plate 114 Optical sheet 116 Display panel 118 Cell guide 120 Bezel 121 Projection 122 Cushion material 124 Front panel 126 COF
126a Ideal curve 128 Driver chip 128a Ideal position 130 Relay board 132, 133 Opening 134 Slit 136, 142 Convex part 138 Concave part 140 Elastic member

Claims (11)

A display panel for displaying images,
From the back side of the display panel, a support member that supports the display panel;
From the surface side of the display panel, a metal frame member that covers the periphery of the display panel;
A flexible wiring board that is positioned between the support member and the frame member, has one end connected to a peripheral edge of the display panel, and a circuit chip mounted thereon;
At least one of the support member and the frame member has a structure for guiding the wiring board so that the wiring board and the frame member are in contact with each other at a mounting position of the circuit chip. further,
A circuit board located between the support member and the frame member and connected to the other end of the wiring board;
The display device according to claim 1, wherein the frame member has an opening for pulling out a part of the wiring board from the support member side of the frame member. The display device according to claim 2, wherein the frame member has a protrusion that contacts the wiring board at a mounting position of the circuit chip. further,
A housing member that covers the frame member from the surface side of the display panel;
A circuit board located between the frame member and the housing member and connected to the other end of the wiring board;
The frame member includes an opening for guiding from the middle of the wiring board to the end of the wiring board from the support member side to the housing member side, including a position where the circuit chip is mounted. The display device according to claim 1. The display device according to claim 4, wherein the housing member has an opening at a position facing the circuit chip. The display device according to claim 1, wherein the support member has a convex portion that guides the wiring board in a curved shape so that the wiring board and the frame member come into contact with each other at a mounting position of the circuit chip. The display device according to claim 6, wherein the convex portion has a concave portion at a position facing the mounting position of the circuit chip. The display device according to claim 7, wherein the concave portion has a wider opening as it goes outward. The display device according to claim 7, wherein the convex portion has a flat portion from which a top portion is removed around the concave portion. further,
The display device according to claim 7, further comprising an elastic member provided inside the recess. The display device according to claim 7, wherein the convex portion is formed of an elastic member.

Images