JP2014222309A - Hologram overlay - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a hologram overlay capable of avoiding an effect of a gas generated from a transfer-target base material of a thermoplastic resin.SOLUTION: A hologram overlay includes: a base material 11; an anchor layer 11a selectively formed on one face of the base material; a diffraction structure formation layer 12 including at least one kind of a hologram and a diffraction grating, configured to diffract light and laminated on the one face of the base material including the anchor layer; an inorganic antireflection layer 13 sequentially laminated on the diffraction structure formation layer; and an adhesive layer 14 having a weaker adhesive force than that of the anchor layer. The hologram overlay includes: a peeling part 111 in which, when the base material is arranged on an upper face of a transfer-target base material of a thermoplastic resin so that the base material is positioned on an upper side and a thermal transfer is performed, the diffraction structure formation layer, the inorganic antireflection layer, and the adhesive layer are peeled off from the base material and transferred to the transfer-target base material; and a very fine adhesion part 112 in which the diffraction structure formation layer, the inorganic antireflection layer, and the adhesive layer are remaining on the base material interposing the anchor layer.

Description

  The present invention relates to a hologram overlay to be transferred to a required area on a personal authentication medium in securities, card media, passports, visas, etc., and is generated particularly from a transfer substrate of a thermoplastic resin used for an authentication medium. The present invention relates to a hologram overlay that prevents the influence of gas (outgas).

  In recent years, polycarbonate belonging to a thermoplastic resin has been used as a base material for securities, card media, personal authentication media, and the like. Polycarbonate can be used for a long period of time because of its durability, but when exposed to relatively high temperatures in the environment of use, for example, 50 ° C. to 80 ° C., gas (outgas) is released from its surface. It is known to occur. Therefore, the pressure-sensitive adhesive film attached to the surface of the polycarbonate has a drawback in that gas accumulates at the interface due to gas (outgas) generated from the adherend that is polycarbonate, and the pressure-sensitive adhesive film is swollen or peeled off.

  Therefore, several measures have been taken to overcome the above drawbacks.

  As a countermeasure, there has been proposed a method in which an oxidation treatment is performed in advance on the surface of the polycarbonate resin substrate itself (Patent Document 1).

  As another countermeasure, a method has been proposed in which an acrylic resin is bonded to the surface of a polycarbonate resin base material, the surface of the acrylic resin is oxidized, and an adhesive film is attached to the oxidized layer. (Patent Document 2).

  Furthermore, as another countermeasure, there has been proposed a method of effectively preventing outgassing by making the pressure-sensitive adhesive layer firm and tough and increasing the adhesive strength. (Patent Literature 3, Patent Literature 4).

  However, in the techniques of Patent Documents 1 and 2, since the surface of the polycarbonate resin base material or the surface of the acrylic resin laminated on the polycarbonate resin base material is newly subjected to the oxidation treatment, it takes time and cost for the oxidation treatment. There's a problem.

  Moreover, when applying the technique of patent document 1 thru | or the cited reference 4 to a securities | security, a card medium, and a personal authentication medium, it is desirable to perform the same process on both surfaces in consideration of curvature etc., There is no place for outgas to escape, resulting in blistering or peeling.

  In addition, a method for releasing outgas to the outside by using a continuous porous plastic film has been proposed (Patent Document 5). However, the porous film substrate has a drawback that it is soft and has low printing durability and scratch resistance. Therefore, there is a problem that it is difficult to apply to use in securities, cards, and personal authentication media.

Japanese Utility Model Publication No. 3-100429 JP 7-266523 A Japanese Patent Laid-Open No. 2003-3143 Japanese Patent No. 3033610 JP 61-141417 A

  The present invention has been made to solve the above-described problems. Even when a transfer substrate using a thermoplastic resin is subjected to a transfer treatment, the influence of the gas generated from the transfer substrate is not affected. An object is to provide a hologram overlay that is difficult to receive.

In order to solve the above-mentioned problem, the invention corresponding to claim 1 is a hologram overlay used for thermal transfer of a thermoplastic resin to a substrate to be transferred, which is a film or sheet-like substrate and one of the substrates An diffractive structure forming layer including at least one of a hologram and a diffraction grating for diffracting light laminated on one surface of the base material including the anchor layer, An inorganic reflective layer sequentially laminated on the upper surface of the diffractive structure forming layer, and an adhesive layer having a lower adhesive strength than the anchor layer,
When the surface of the adhesive layer is opposed to the upper surface of the substrate to be transferred, and the substrate is placed on the upper side and thermally transferred, the diffraction structure forming layer, the inorganic reflective layer, and the A peeling portion that is peeled off from the adhesive layer and transferred to the substrate to be transferred, and a minute structure in which the diffraction structure forming layer, the inorganic reflective layer, and the adhesive layer remain on the base material via the anchor layer. It is a hologram overlay characterized by having an adhesion part.

The invention corresponding to claim 2 is a hologram overlay used for thermal transfer of a thermoplastic resin to a substrate to be transferred, which is a film or sheet-like substrate and an anchor layer formed on one surface of the substrate And a release layer selectively applied on the surface of the anchor layer, and a diffraction structure including at least one of a hologram and a diffraction grating for diffracting light laminated on the surface of the anchor layer including the release layer A layer, an inorganic reflective layer sequentially laminated on the upper surface of the diffractive structure forming layer, and an adhesive layer having a lower adhesive strength than the anchor layer,
When the surface of the adhesive layer is opposed to the upper surface of the substrate to be transferred and the substrate is placed on the upper side and thermally transferred, the diffraction structure forming layer and the layer are separated from the substrate via the release layer. A peeling part from which the inorganic reflective layer and the adhesive layer are peeled off and transferred to the substrate to be transferred; the diffraction structure forming layer located in a region excluding the peeled layer; the inorganic reflective layer; and the adhesive layer; Is a hologram overlay characterized by having a minute contact portion remaining on the substrate.

  According to a third aspect of the invention, in the hologram overlay according to the first or second aspect of the invention, a corona treatment is performed on one surface of the substrate.

  The invention corresponding to claim 4 is the hologram overlay according to any one of claims 1 to 3, wherein at least the contact portion of the peeling portion and the contact portion has a dot shape or It is characterized by a thin line pattern having a line shape.

  The invention corresponding to claim 5 is the hologram overlay according to any one of claims 1 to 4, wherein a dot-shaped diameter or a line-shaped line width of the contact portion is 30 to It is characterized by being in the range of 80 μm.

  The invention corresponding to claim 6 is the hologram overlay according to any one of claims 1 to 5, wherein at least a part of areas such as securities, card media, authentication media, and booklets are transferred. A hologram overlay comprising a base material, wherein a peeled portion comprising the diffraction structure forming layer, the inorganic reflection layer, and the adhesive layer laminated on the base material is thermally transferred to the base material to be transferred. is there.

  According to the hologram overlay of the present invention, even when the transfer substrate using a thermoplastic resin such as polycarbonate is subjected to a transfer process, the hologram overlay is swollen or peeled off by the gas generated from the transfer substrate. Can be prevented.

  According to the first and second aspects of the invention, when the hologram overlay is thermally transferred to a transfer material of a thermoplastic resin such as polycarbonate, the hologram overlay is peeled off and bonded to the transfer material. A peeling part (peeling area) and an adhesion part (adhesion area) that remains on the substrate without adhering to the substrate to be transferred are provided. The adhesion part becomes a “drop” in a fine dot shape or linear shape, and is thermoplastic. The gas generated from the resin transfer substrate can be released. Therefore, it is possible to prevent the hologram overlay from being swollen or peeled off by the gas generated from the thermoplastic resin transfer substrate.

  According to the invention corresponding to claim 3, by providing a corona treatment on one surface of the base material in advance before providing the anchor layer, OH groups are generated by the corona treatment, and this is used for the hardening used for the anchor layer. The adhesive force between the anchor layer and the substrate can be increased by chemical bonding with the isocyanate agent.

  According to the invention corresponding to claim 4, since the close contact portion is composed of geometric dots or line-shaped fine line patterns, the unnaturalness of the hologram overlay surface can be alleviated, and a fine line can be formed with a loupe or the like. It is also possible to have a secondary verification role such as checking the pattern.

  According to the invention corresponding to claim 5, the dot shape diameter or the line width of the contact portion is within a range of 30 to 80 μm so that the dot shape or the line shape is not visually recognized at a glance. Thus, the visibility of the diffractive structure included in the diffraction grating forming layer can be enhanced, and the gas generated from the transferred substrate can be easily released to the outside.

1 is a cross-sectional view schematically showing an embodiment of a hologram overlay according to the present invention. Sectional drawing which shows schematically another embodiment of the hologram overlay which concerns on this invention. FIG. 2 is a cross-sectional view schematically showing a state when the hologram overlay shown in FIG. 1 is thermally transferred to a transfer substrate. The top view which shows roughly an example of the to-be-transferred base material (transfer body) produced by thermally transferring a hologram overlay.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In each figure, the same reference numerals are given to the constituent elements that exhibit the same or similar functions throughout all the drawings, and the duplicate description is omitted.

  FIG. 1 is a sectional view schematically showing one embodiment of a hologram overlay according to the present invention.

  The hologram overlay 10 includes a base material 11 for laminating a plurality of layers, a diffraction grating forming layer 12, an inorganic reflective layer 13, and an adhesive layer 14.

  On one side of the base material 11, the peeling portions 111 and the close contact portions 112 are alternately arranged. As described above, the diffraction grating forming layer 12, the inorganic reflective layer 13, and the adhesive layer 14 are sequentially laminated on the upper surfaces of the peeling portion 111 and the adhesion portion 112.

  The peeling part 111 and the adhesion part 112 of the base material 11 are divided according to the presence or absence of the anchor layer 11a. That is, the region where the anchor layer 11a is applied by printing or the like becomes the adhesion portion 112, and the region where the anchor layer 11a is not applied becomes the peeling portion 111.

  FIG. 2 is a sectional view schematically showing another embodiment of the hologram overlay according to the present invention.

  In order to further improve the releasability of the peeling portion 111 of the base material 11 shown in FIG. 1, the hologram overlay 10 is provided with an anchor layer 11a on the entire surface of the base material 11, and then the upper surface of the anchor layer 11a. The separation layer 11b is selectively provided at a necessary interval.

  Therefore, in this embodiment, a region where the release layer 11b is not coated (laminated) on the anchor layer 11a becomes the adhesion portion 112, and a region where the release layer 11b is coated (laminated) on the anchor layer 11a. Becomes the peeling portion 111. In addition, the peeling layer 11 has a light transmittance, and is typically transparent. Examples of the material of the release layer 11b include thermoplastic acrylic resin, chlorinated rubber resin, vinyl chloride vinyl acetate copolymer resin, cellulose resin, chlorinated polypropylene resin, or oil silicone, fatty acid amide, and zinc stearate. The added one can be used. In addition to these organic materials, an appropriate inorganic material may be used. The thickness of the release layer 11b is preferably in the range of 0.5 μm to 5 μm.

  Next, each constituent layer used in each embodiment described above will be described in detail.

  The base material 11 is, for example, a resin film or a sheet. For the base material 11, for example, a material having excellent heat resistance such as polyethylene terephthalate is used.

  The anchor layer 11 a has a function of increasing the adhesive strength between the base material 11 and the diffraction structure forming layer 12, the inorganic reflective layer 13, and the adhesive layer 14 laminated on one surface of the base material 11. The reason is that when the hologram overlay 10 is thermally transferred to the substrate to be transferred, the diffraction grating forming layer 12 and the inorganic reflective layer 13 laminated on the adhesion portion 112 of the substrate 11 need to remain on the substrate 11. Because there is. Therefore, the anchor layer 11a is required to have stronger adhesive force than the adhesive layer 14.

  As a material for the anchor layer 11a, it is preferable to use a two-component curable resin whose adhesive strength is increased by chemical bonding. Examples of the main component of the anchor layer 11a include polyester polyols, polyether polyols, polycarbonate polyols, acrylic polyols, and polyurethanes. As the curing agent, it is possible to use an isocyanate in an amount that is equal to or greater than 2 equivalents. Is preferred.

  If the resin film or sheet of the substrate 11 is subjected to corona treatment in advance before printing the anchor layer 11a, OH groups are generated by the corona treatment, and the curing agent isocyanate used for the anchor layer 11a. Are chemically bonded to each other, and the adhesive force between the anchor layer 11a and the resin film or sheet of the substrate 11 can be increased.

  The thickness of the anchor layer 11a is preferably in the range of 0.5 μm to 5 μm. If the thickness of the anchor layer 11a is less than 0.5 μm, the adhesiveness is too low, and a portion that is transferred even at the close contact portion 112 is not preferable. When the anchor layer 11a is thicker than 5 μm, it is difficult to print, and even if printing is possible, printing unevenness occurs, which is not preferable.

  The contact portion 112 of the base material 11 is formed by a gravure printing method. In particular, the adhesion layer 112 typically has a plurality of independent dot (point) shapes. The dot shape of the adhesion layer 112 is formed by forming a recess on the gravure plate by cutting with a cutting tool in a cylinder by an electronic engraving gravure method or the like, and a resin for forming the adhesion layer 112 attached to the recess is a base material 11 is formed by transferring onto the substrate 11.

  Further, in order to improve the foil breakage between the close contact portion 112 and the peeling portion 111, the dot shape is preferably an elliptical shape or a rhombus shape. In addition, if the major axis side of this elliptical shape or rhombus is parallel to the peeling direction, it is preferable that the contact portion 112 and the peeling portion 111 are easy to break the foil.

  The contact portion 112 may be a continuous line shape. In order to form the contact portion 112 in a continuous line shape, a resin is formed on the gravure plate by etching the cylinder by laser drawing, and the resin for forming the contact portion 112 attached to the recess is the base material 11. It is formed by transferring it upward.

  Furthermore, as another example for improving the foil breakage between the adhesion part 112 and the peeling part 111, the direction of the line of the adhesion part 112 and the peeling direction of the peeling part 111 are aligned (the tangent line between the peeling direction and the line). Is preferably within 45 degrees), it is preferable that the adhesion portion 112 and the peeling portion 111 easily break the foil.

  It is desirable that the dot-shaped diameter or the line width of the contact portion 112 is typically in the range of 30 to 80 μm. If the dimensions are within this range, the dot shape or the line shape is a size that cannot be seen at a glance, and the visibility of the diffraction structure included in the diffraction grating forming layer 12 is not hindered.

  If the size of the dot diameter or line width is larger than 80 μm, the resolution of the image formed by the hologram and / or diffraction grating formed on the diffraction grating forming layer 12 is deteriorated. On the other hand, when the size of the dot diameter or the line width is smaller than 30 μm, it becomes difficult to completely release the outgas generated from the polycarbonate resin used as the substrate to be transferred (transfer target).

  Further, the close contact portion 112 has a width (pitch) of adjacent dot shapes or line shapes within a range of 2 to 5 times the diameter of the dot shape or the line width of the line shape. If this width (pitch) is increased, it will be difficult to completely release the outgas generated from the polycarbonate resin substrate used as the substrate to be transferred to the outside. Conversely, if the width (pitch) is decreased, the diffraction grating forming layer will be reduced. Accordingly, the resolution of the image formed by the hologram and / or diffraction grating formed on 12 is deteriorated.

  The close contact portion 112 of the base material 11 may be configured with a geometric fine line pattern. In this case, the unnaturalness on the surface of the hologram overlay 10 can be alleviated, and the role of secondary verification can be provided such that the authenticity can be determined by confirming the fine line pattern with a loupe or the like.

  The diffraction grating forming layer 12 is formed on the upper surface of the peeling portion 111 and the close contact portion 112 provided on the base material 11. The diffraction grating forming layer 12 includes at least one of a hologram and a diffraction grating as a diffraction structure.

  The material of the diffraction grating forming layer 12 is preferably a transparent resin having a refractive index of about 1.3 to 1.5. Specifically, for example, thermoplastic resins such as urethane resin, polycarbonate resin, polystyrene resin, polyvinyl chloride resin, unsaturated polyester resin, melamine resin, epoxy resin, urethane (meth) acrylate, polyester (meth) acrylate, epoxy Thermosetting resins such as (meth) acrylate, polyol (meth) acrylate, melamine (meth) acrylate, and triazine (meth) acrylate, or mixtures thereof, and thermoformable materials having radically polymerizable unsaturated groups It can be used. As a material of the diffraction grating forming layer 12, it is preferable to use acrylic polyol / isocyanate that is chemically bonded to the isocyanate of the anchor layer 11a laminated on the substrate 11.

  The inorganic reflective layer 13 is formed on the diffraction grating forming layer 12. Although the inorganic reflective layer 13 can be omitted, the visibility of the image displayed by the diffraction structure formed on the diffraction grating forming layer 12 can be improved by providing the inorganic reflective layer 13.

  As the inorganic reflection layer 13, for example, a transparent reflection layer or an opaque metal reflection layer can be used. For example, a thin film forming method such as a vacuum deposition method, a sputtering method, or an ion plating method can be applied to the inorganic reflective layer 14, and the layer thickness is preferably in the range of 10 to 50 nm. If the layer thickness is less than 10 nm, sufficient reflection performance cannot be obtained. On the other hand, if the layer thickness is more than 50 nm, cracking and peeling are likely to occur in the reflection layer 14 itself, which is not preferable.

As the material of the inorganic reflective layer 13, a material having a refractive index higher than that of the diffraction grating forming layer 12 and having transparency is suitable. In particular, it is desirable to use ZnS, TiO ₂ , PbTiO ₂ , ZrO, ZnTe, PbCrO ₄ or the like having a refractive index of 2.0 or more. This is because if the refractive index with the diffraction grating forming layer 12 is small, the visual effect of the diffracted light by the hologram or diffraction grating of the diffraction grating forming layer 12 is weakened. Specifically, the difference in refractive index between the diffraction grating forming layer 12 and the transparent film is preferably at least 0.5 or more.

The adhesive layer 14 is formed on the surface of the inorganic reflective layer 13.
Examples of the material of the adhesive layer 14 include any one or a mixture of thermoplastic resins such as polypropylene resin, polyethylene terephthalate resin, polyacetal resin, and polyester resin.

  Further, when there is a possibility that delamination between the adhesive layer 14 and the inorganic reflective layer 13 may occur, it is necessary to weaken the adhesive force of the adhesive layer 14. When delamination may occur, the material of the adhesive layer 14 is, for example, 10 parts by weight of a thermoplastic resin such as polypropylene resin, polyethylene terephthalate resin, polyacetal resin, polyester resin, or a mixture thereof. For example, nitrocellulose, cellulose acetate, cellulose acetate propionate, silica filler, silicone filler, polytetrafluoroethylene filler, polyethylene wax, polypropylene wax, silicone oil or a mixture of a plurality of them in a ratio of 1 to 100 parts by weight It is preferable to use a mixture. The layer thickness of the adhesive layer 14 is preferably 0.2 to 1.0 μm. When the thickness of the adhesive layer 14 is thinner than 0.2 μm, sufficient adhesive strength cannot be obtained, and when it is thicker than 1.0 μm, it is not preferable that uneven thickness is easily recognized.

  FIG. 3 schematically shows a state in which a hologram, a card medium, a personal authentication medium, and a booklet are obtained by thermally transferring the hologram overlay 10 according to the present invention to a substrate 20 to be transferred using a thermoplastic resin such as polycarbonate. It is sectional drawing to represent.

  Hereinafter, a procedure for producing the transfer base material 20 to be transferred to a partial area such as a security, a card medium, a personal authentication medium, and a booklet will be described.

  First, as shown in FIG. 3A, the hologram overlay 10 is placed on the surface of the transfer base material 20 so that the base material 11 of the hologram overlay 10 is on the upper side. That is, the adhesive layer 14 constituting the hologram overlay 10 is placed on the surface of the substrate 20 to be transferred. Thereafter, a hot pressure 21 indicated by an arrow in the figure is applied between the broken lines 22 on the upper surface of the substrate 11 of the hologram overlay 10.

  Next, as shown in FIG. 3B, when the region 22 to which the hot pressure 21 is applied is peeled off from the transferred substrate 20, the region 22 to which the hot pressure 15 is applied corresponds to the peeling portion 111. Peeling occurs between the base material 11 set in the region to be formed and the diffraction grating forming layer 12, and the diffraction grating forming layer 12, the inorganic reflective layer 13, and the adhesive layer 14 set in the region corresponding to the contact portion 112 are the base material. 11 remains as it is.

  By performing the thermal transfer process as described above, only the close contact portion 112 of the hologram overlay 10 to which the thermal pressure 21 is applied is transferred onto the surface of the substrate 20 to be transferred, as shown in FIG.

  Further, in order to enhance the adhesion between the substrate 20 to be transferred and the adhesion portion 112 of the hologram overlay 10, heat pressure is applied to the surface of the diffraction grating forming layer 12 transferred onto the surface of the substrate 20 to be transferred from the direction of the arrow shown in the drawing. It is desirable to add 23 again and post cure.

  FIG. 4 is a plan view schematically showing an example of a card medium 30 produced by thermally transferring the hologram overlay 10. For thermal transfer, for example, a hot stamp is used. Note that thermal transfer using a heat roll may be performed instead of thermal transfer using a hot stamp.

  In FIG. 4A, the contact portion 112 has a linear shape, and in FIG. 4B, the contact portion 112 has a dot shape. The peeling direction of the transfer foil is the left-right direction of the drawing.

  With regard to the securities, the card medium 30, the personal authentication medium, and the booklet produced as described above, a continuous image using a hologram and / or a diffraction grating can be observed in normal observation. Further, when the securities, the card medium 30, the personal authentication medium, and the booklet as described above are observed with a magnifying glass or the like, a geometrical dot shape or a linear thin line pattern can be confirmed.

  Hereinafter, the production of the card medium 30 shown in FIG. 4 using the hologram overlay 10 according to the present invention will be specifically described.

(A) First, the hologram overlay 10 is produced.
A polyethylene terephthalate film having a thickness of 12 μm to be the substrate 11 was prepared. After this substrate 11 was subjected to corona treatment, an anchor layer 11a was formed on the substrate 11 using a gravure coater and dried in an oven. As the material of the anchor layer 11a at this time, an equivalent mixture of polyester polyol / isocyanate was used. The thickness of the anchor layer 11a after drying is 1.0 μm.

  Next, the peeling layer 11b was formed on the surface of the anchor layer 11a by gravure printing, and this was dried in an oven. A 200 line / inch helio plate was used for the gravure printing plate. An acrylic resin was used as the material for the release layer 11b. The thickness of the release layer 11b after drying is 0.5 μm.

  Thereafter, the diffraction grating forming layer 12 was formed on the base material 11 on which the anchor layer 11a and the release layer 11b were laminated, using a gravure coater, and dried in an oven. At this time, acrylic polyol was used as the material of the diffraction grating forming layer 12. The thickness of the diffraction grating forming layer 12 after drying is 0.7 μm.

  Next, a diffraction structure as a hologram was formed on the surface of the diffraction grating forming layer 12 by hot pressing using a roll embossing apparatus. At this time, the plate surface temperature of the roll embossing device is 165 degrees.

  Subsequently, an inorganic reflective layer 13 made of zinc sulfide was formed on the diffraction structure of the diffraction grating forming layer 12 by vapor deposition. The film thickness of the inorganic reflective layer 13 was 50 nm.

  Finally, the adhesive layer 14 was formed on the inorganic reflective layer 13 by gravure printing a polyester resin which is a thermoplastic resin. The thickness of the adhesive layer is 0.5 μm.

  The hologram overlay 10 (see FIG. 2) was produced according to the above procedure.

(B) Next, the card medium 30 shown in FIG. 4 is produced.
First, a polycarbonate resin substrate for a card used for the transfer substrate 20 was prepared.
Thereafter, the hologram overlay 10 of FIG. 2 prepared in the above item (a) is placed on the surface of the polycarbonate resin substrate so that the substrate 11 of the hologram overlay 10 is on the upper side, and the substrate 11 side of the hologram overlay 10 is placed. To perform thermal transfer by hot stamping. At this time, the temperature of thermal transfer is 160 degrees.

  Next, the base material 11 of the hologram overlay 10 was peeled from the polycarbonate resin base material in a direction along the plane of the helio plate, and it was confirmed that the peeling portion 111 of the hologram overlay 10 was adhered to the polycarbonate resin base material. Thereafter, the cured hologram overlay 10 was post-cured. At this time, a 25 μm PET film was placed on the side of the polycarbonate resin substrate on which the hologram overlay 10 was transferred, and thermal transfer was performed from above using a 180 ° hot stamp.

  The card medium 30 produced as described above was left in a constant temperature and humidity chamber at 80 ° C. and 85% for 24 hours, and then the card medium 30 was taken out and observed. Has come out of the dot shape or the line shape arranged in the close contact portion 112, and no abnormality such as blistering has been confirmed. As a result, the card medium 30 including the thermally transferred hologram overlay 10 that is not affected by the gas generated from the polycarbonate resin substrate can be realized.

  In addition, the said embodiment and Example are shown as an example and are not intending limiting the range of invention. Each of the above embodiments and examples can be implemented in various other forms, and various omissions, replacements, and changes can be made without departing from the spirit of the invention. These embodiments, examples, and modifications thereof are included in the scope and gist of the invention, and are included in the invention described in the claims and the equivalents thereof.

  DESCRIPTION OF SYMBOLS 10 ... Hologram overlay, 11 ... Base material, 11a ... Anchor layer, 11b ... Release layer, 12 ... Diffraction grating formation layer, 13 ... Inorganic reflective layer, 14 ... Adhesive layer, 20 ... Substrate to be transferred, 21 ... Hot pressure, 22 ... Area where hot pressure is applied, 23 ... Hot pressure, 30 ... Card medium, 111 ... Peeling part, 112 ... Adhesion part.

Claims (6)

In hologram overlay used for thermal transfer of thermoplastic resin to the substrate to be transferred,
A film or sheet-like substrate, an anchor layer formed on one surface of the substrate with a predetermined interval, a hologram for diffracting light laminated on one surface of the substrate including the anchor layer, and A diffractive structure forming layer including at least one kind of diffraction grating, an inorganic reflective layer sequentially laminated on the upper surface of the diffractive structure forming layer, and an adhesive layer having a lower adhesive strength than the anchor layer,
When the surface of the adhesive layer is opposed to the upper surface of the substrate to be transferred, and the substrate is placed on the upper side and thermally transferred, the diffraction structure forming layer, the inorganic reflective layer, and the A peeling part that peels off the adhesive layer and is transferred to the substrate to be transferred, and an adhesion part where the diffraction structure forming layer, the inorganic reflective layer, and the adhesive layer remain on the base material via the anchor layer And a hologram overlay. In hologram overlay used for thermal transfer of thermoplastic resin to the substrate to be transferred,
A film- or sheet-like substrate, an anchor layer formed on one surface of the substrate, a release layer selectively applied on the surface of the anchor layer, and the anchor layer including the release layer A diffractive structure forming layer including at least one of a hologram and a diffraction grating that diffracts the light laminated on the surface, and an inorganic reflective layer and an anchor layer that are sequentially laminated on the upper surface of the diffractive structure forming layer and have a lower adhesion With an adhesive layer,
When the surface of the adhesive layer is opposed to the upper surface of the substrate to be transferred and the substrate is placed on the upper side and thermally transferred, the diffraction structure forming layer and the layer are separated from the substrate via the release layer. A peeling part from which the inorganic reflective layer and the adhesive layer are peeled off and transferred to the substrate to be transferred; the diffraction structure forming layer located in a region excluding the peeled layer; the inorganic reflective layer; and the adhesive layer; Having a close contact portion remaining on the substrate.   The hologram overlay according to claim 1, wherein a corona treatment is performed on one surface of the substrate.   4. The hologram overlay according to claim 1, wherein at least the close contact portion of the peeling portion and the close contact portion is configured by a fine line pattern having a dot shape or a linear shape. 5. .   5. The hologram overlay according to claim 1, wherein a dot shape diameter or a line width of the contact portion is in a range of 30 to 80 μm. In the hologram overlay according to any one of claims 1 to 5,
The diffractive structure forming layer and the inorganic reflective layer in which at least a part of areas such as securities, card media, authentication media, and booklets are composed of the substrate to be transferred, and are laminated on the substrate to be transferred. A hologram overlay characterized by thermally transferring a peeled portion comprising the adhesive layer and the adhesive layer.

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