JP2014216311A5 - - Google Patents

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JP2014216311A5
JP2014216311A5 JP2013193605A JP2013193605A JP2014216311A5 JP 2014216311 A5 JP2014216311 A5 JP 2014216311A5 JP 2013193605 A JP2013193605 A JP 2013193605A JP 2013193605 A JP2013193605 A JP 2013193605A JP 2014216311 A5 JP2014216311 A5 JP 2014216311A5
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JP
Japan
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dopant gas
enriched
ritomi
flow rate
ion source
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JP2013193605A
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Japanese (ja)
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JP5775551B2 (en
JP2014216311A (en
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Priority claimed from US13/869,456 external-priority patent/US8883620B1/en
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第一の態様において、イオン源の安定性を維持するのに十分な流量で富化ドーパントガスを導入し、ここ該富化ドーパントガスは、その中に、天然存在量レベル90%以上の同体の富化レベルを有し;該流量において対応するあまり富化されていないまたは非富化ドーパントガスで利用される電力レベルと比較して、イオン源の低下した全電力レベルで操作し;次いで、ドーパントガスをイオン化して、該流量において対応するあまり富化されていないまたは非富化ドーパントガスを用いて生じるビーム電流を発生させ、かつそれを維持することを含む、富化ドーパントガスを用いる方法が提供される。 In a first embodiment, by introducing enriched dopant gas at a rate sufficient to maintain the stability of the ion source, wherein, 該富 of dopant gas therein, the natural abundance level of 90% or more has a wealth levels of isotopes; compared corresponding linseed Ritomi of which are not or not enriched dopant gas utilized is the power level in the flow rate, the total power level with reduced ion source operate; then includes a dopant gas is ionized, the beam current generated by using the corresponding non-sweet Ritomi or non-enriched dopant gas is generated in the flow rate, and to keep it, wealth A method using a fluorinated dopant gas is provided.

第三の態様において、ウエハに注入すべき原子種を有するドーパントガスを選択し;該ドーパントガスの質量同位体を、その中に天然存在量レベルを超える少なくとも90%に富化されるように選択し;亜大気圧貯蔵および送達容器中に該ドーパントガスの質量同位体を供し;イオン源の安定性を維持するのに十分な流量にて該ドーパントガスの質量同位体を導入し;対応するあまり富化されていないまたは非富化ドーパントガスで利用される電力レベルと比較して、該イオン源の低下した電力レベルで操作し;次いで、該ドーパントガスをイオン化して、該流量において対応するあまり富化されていないまたは非富化ドーパントガスを用いて生じたビーム電流を維持する工程を含む、イオン注入プロセス用の同位体的に富化されたドーパントガスを用いる方法が提供される。 In a third embodiment, a dopant gas having an atomic species to be implanted into the wafer is selected; the mass isotope of the dopant gas is selected to be enriched therein by at least 90% above the natural abundance level Providing the dopant gas mass isotope in a subatmospheric storage and delivery vessel; introducing the dopant gas mass isotope at a flow rate sufficient to maintain ion source stability; compared to Ritomi of which are not or not enriched dopant gas utilized is the power level, by operating at a reduced power level of the ion source; then, the dopant gas is ionized, corresponds in the flow rate comprising the step of maintaining the beam current generated by using sweet Ritomi of which are not or not enriched dopant gas, which is isotopically enriched for ion implantation process dopant A method using a gas is provided.

JP2013193605A 2013-04-24 2013-09-19 Method of using isotopically enriched levels of dopant gas composition in an ion implantation process Expired - Fee Related JP5775551B2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/869,456 US8883620B1 (en) 2013-04-24 2013-04-24 Methods for using isotopically enriched levels of dopant gas compositions in an ion implantation process
US13/869,456 2013-04-24

Publications (3)

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JP2014216311A JP2014216311A (en) 2014-11-17
JP2014216311A5 true JP2014216311A5 (en) 2015-06-25
JP5775551B2 JP5775551B2 (en) 2015-09-09

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US (1) US8883620B1 (en)
EP (1) EP2796590A1 (en)
JP (1) JP5775551B2 (en)
KR (1) KR101586122B1 (en)
CN (1) CN104124141B (en)
SG (1) SG2013069778A (en)
TW (1) TWI487008B (en)

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US11062906B2 (en) 2013-08-16 2021-07-13 Entegris, Inc. Silicon implantation in substrates and provision of silicon precursor compositions therefor
CN105239048B (en) * 2015-10-09 2018-11-09 北京大学深圳研究生院 A kind of metal plasma source and its application
US9818570B2 (en) * 2015-10-23 2017-11-14 Varian Semiconductor Equipment Associates, Inc. Ion source for multiple charged species
US20170292186A1 (en) 2016-04-11 2017-10-12 Aaron Reinicker Dopant compositions for ion implantation
CN207458886U (en) * 2017-06-16 2018-06-05 上海凯世通半导体股份有限公司 Line ratio detection device
US10597773B2 (en) * 2017-08-22 2020-03-24 Praxair Technology, Inc. Antimony-containing materials for ion implantation
US11299802B2 (en) 2018-05-17 2022-04-12 Entegris, Inc. Germanium tetraflouride and hydrogen mixtures for an ion implantation system
US10923309B2 (en) * 2018-11-01 2021-02-16 Applied Materials, Inc. GeH4/Ar plasma chemistry for ion implant productivity enhancement
EP3895198A4 (en) * 2018-12-15 2022-10-05 Entegris, Inc. Fluorine ion implantation method and system
US10748738B1 (en) 2019-03-18 2020-08-18 Applied Materials, Inc. Ion source with tubular cathode

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