JP2014205328A - Injection mold device and injection molding method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an injection mold device which does not cause partial peel off of a decorative layer from an adhesive layer in a side surface of an end part of a resin molding in a film in-mold resin injection molding process.SOLUTION: An injection mold device for molding a film in-mold molding includes: a passage 6 for suction of a film and a passage 7 for inflow of a medium, provided in a mold 2 on the decorative surface side; a product shape part 3 formed in the mold 2 on the decorative surface side; and a film clamp part 4 restricting, externally outside the product shape part 3, a decorative film 5 in the mold 2 on the decorative surface side. An opening end of the passage 7 for inflow of the medium is arranged between the product shape part 3 and the film clamp part 4.

Description

  The present invention relates to an injection mold apparatus and an injection molding method used in a film in-mold resin injection molding process.

  The decorative film used in the film-in-mold resin injection molding process has a laminated structure. Specifically, a base film, a release layer, a decorative layer, and an adhesive layer are laminated in this order, roughly classified. The material of the base film is generally PET (polyethylene terephthalate). Transfer of the decorative layer to the resin molded product is performed by bonding the adhesive layer to the resin molded product by heat when the resin is injection molded, and the decorative layer is peeled off from the release layer when the injection mold is opened. This is realized. Patent Document 1 discloses a film-in-mold injection mold apparatus that realizes such a film-in-mold resin injection molding process. In this film-in-mold injection mold apparatus, after a decorative film installed in an injection mold that is not clamped is placed along the product shape portion of the decorative surface side nesting by suction, the injection mold The mold is clamped to form a molding space, and the resin is injected into the molding space.

  7 to 8 are structural cross-sectional views of main parts of a general film-in-mold injection mold apparatus. Specifically, FIG. 7 shows a stage in which the decorative film is placed along the product shape portion of the decorative surface side nesting by suction. FIG. 8 shows the stage where the resin is injection molded. FIG. 9 shows a stage where a product (film-in-mold resin molded product) is taken out. Hereinafter, a general film-in-mold resin injection molding process will be described with reference to FIGS.

  In a general film-in-mold resin injection molding process, first, as shown in FIG. 7, a decorative film 75 set between a non-decorative surface side insert 71 and a decorative surface side insert 72 is a foil pressing plate. After being clamped by 74 and a sealed space is formed between the decorative surface side nest 72 and the decorative film 75, the air in the sealed space is supplied to the decorative surface side nest 72 by the film suction flow By being sucked through the path 76, the decorative film 75 is stretched along the product shape portion 73 of the decorative surface side nest 72.

  Next, as shown in FIG. 8, after the non-decorative surface side nesting 71 and the decorative surface side nesting 72 are clamped, in the space between the non-decorative surface side nesting 71 and the decorative film 75, The molten resin 81 is injected from the non-decorative surface side insert 71 side, and the molten resin 81 is formed in a molding space formed between the clamped non-decorative surface side insert 71 and the decorative surface side insert 72. Filled. Thereafter, the non-decorative surface side insert 71 and the decor surface side insert 72 are cooled, so that the filled molten resin 81 is solidified to form a resin molded product (film-in-mold resin molded product). At this time, the decorative film 75 along the product shape portion 73 is in close contact with the resin molded product by the adhesive force of the adhesive layer.

  Next, as shown in FIG. 9, the decorative film 75 that is in close contact with the resin molded product 91 is formed with the decorative layer by opening the non-decorative surface side insert 71 and the decorative surface side insert 72. The decorative layer separated from the release layer and transferred from the release layer is transferred to the resin molded product 91. The resin molded product 91 to which the decorative layer has been transferred is taken out from between the non-decorative surface side insert 71 and the decorative surface side insert 72 opened.

JP 2001-239525 A

  As described above, in the conventional film-in-mold injection mold apparatus, when the injection mold is opened, the resin molded product 91 is sufficiently cooled and solidified to form the resin molded product 91. The resin is at a temperature at which the resin molded product 91 can be taken out from the injection mold.

  However, in the conventional film-in-mold injection mold apparatus, when the injection mold is opened, the decorative film 75 that is in close contact with the surface of the resin molded product 91 has the same temperature as the resin constituting the resin molded product 91. The release layer is not sufficiently cooled to a temperature at which a predetermined release function is exhibited. For this reason, the peeling adhesive strength (peeling resistance) of the release layer is stronger than the force (adhesive force) at which the adhesive layer is in close contact with the decorative layer, and the side surface (resin molding) of the resin molded product 91 In the vicinity of the end face of the product 91), the decorative layer is partially peeled off from the adhesive layer.

  Further, when the injection mold is opened, as shown in FIG. 10, a force 101 is generated to leave the resin molded product 91 on the non-decorative surface side nesting 71 side and peel off the decorative film 75. At this time, the force 102 that sucks the decorative film 5 toward the decorative surface side nest 72 is generated by the residual suction pressure when sucked in the previous step. In particular, in the vicinity of the end surface of the resin molded product 91, in addition to the force 102 for attracting the decorative film 5 to the product shape portion 73 of the decorative surface side nest 72, it is applied to the mold dividing surface of the decorative surface side nest 72. A force 102 for sucking the decorative film 5 is also generated. For this reason, when the injection mold is opened, the force for peeling the decorative film 75 from the resin molded product 91 is maximized in the vicinity of the end surface of the resin molded product 91. This also causes the decorative layer to partially peel from the adhesive layer on the side surface of the end portion of the resin molded product 91.

  In the film in-mold resin injection molding process, the present invention provides an injection molding in which the decorative layer is not partially peeled from the adhesive layer on the side surface of the end portion of the resin molded product or the side surface constituting the opening hole of the resin molded product. An object is to provide a mold apparatus and an injection molding method.

  One aspect of the injection mold apparatus of the present invention is an injection mold apparatus for forming a film-in-mold molded product, wherein a film suction channel and a medium inflow stream provided in a mold on the decorative surface side are provided. A road, a product shape portion formed in the mold on the decorative surface side, and a film clamp portion for restraining the decorative film on the mold on the decorative surface side outside the product shape portion, And the opening end of the medium inflow channel is disposed between the product shape portion and the film clamp portion.

  Another aspect of the injection mold apparatus of the present invention is an injection mold apparatus for forming a film-in-molded product, and a film suction channel provided in the mold on the decorative surface side and a medium inflow A flow path, a product shape portion formed in the mold on the decorative surface side, a film clamp portion for restraining the decorative film on the mold on the decorative surface side outside the product shape portion, The medium inflow passage is disposed so that a surface rising in the product shape portion is provided and the surface rising in the product shape portion can be cooled.

  The other side surface of the injection mold apparatus of the present invention includes a flow path configuration nest that is incorporated in the mold on the decorative surface side and forms a surface rising in the product shape portion, and the flow path configuration nest The flow path for the medium inflow is provided, and the thermal conductivity of the material constituting the flow path constituting nest is larger than the thermal conductivity of the material constituting the mold on the decorative surface side.

  Another aspect of the injection mold apparatus of the present invention is that the film suction channel and the medium inflow channel share one open end.

  One aspect of the injection molding method of the present invention is that the decorative surface is formed by a film clamp portion while an injection mold including a decorative surface side mold and a non-decorative surface side mold is opened. A step of constraining the decorative film on the mold dividing surface of the mold on the side, and forming a sealed space between the mold on the decorative surface side and the decorative film, and the gas in the sealed space A step of sucking, a step of clamping the injection molding die to form a molding space in the injection molding die, a step of injecting resin into the molding space, and a step of molding the injection molding die. And a step of supplying a cooling medium between the mold on the decorative surface side and the decorative film after the mold opening operation of the injection mold is started. .

  According to another aspect of the injection molding method of the present invention, the mold on the decorative surface side and the mold before the mold opening operation of the injection mold or after the mold opening operation of the injection mold is started. The operation for supplying the cooling medium to and from the decorative film is started.

  According to the present invention, in the film-in-mold resin injection molding process, the decorative layer is hardly peeled off from the adhesive layer on the side surface of the end portion of the resin molded product or the side surface constituting the opening hole of the resin molded product.

Configuration diagram at the time of mold opening of the injection mold apparatus according to Embodiment 1 of the present invention Configuration diagram at the time of resin filling of the injection mold apparatus in Embodiment 1 of the present invention Enlarged view of part A in FIG. The figure which shows the process in which a decoration layer is partially peeled from an adhesive layer in the side surface of the edge part of a resin molded product in the conventional film in-mold injection mold apparatus in time series The figure which shows the process in which the decorating layer adhere | attached on the resin molded product in the injection mold apparatus of Embodiment 1 of this invention peeled from a peeling layer in time series. The block diagram at the time of mold opening of the injection mold apparatus in Embodiment 2 of this invention Cross-sectional view of the structure of a general film-in-mold injection mold device during film suction Cross-sectional view of the structure of a general film-in-mold injection mold device when filling with resin Cross-sectional view of the structure of a general film-in-mold injection mold device when taking out the product Enlarged view of part B of FIG.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. However, in order to facilitate understanding, the drawings schematically show each component as a main component. In addition, the thickness, length, and the like of each illustrated component are different from actual ones for the convenience of drawing. It should be noted that the numerical values such as the material and temperature of each component shown in the following embodiments are merely examples and are not particularly limited, and various changes can be made without departing from the effects of the present invention. Is possible.

(Embodiment 1)
1 and 2 are diagrams showing a configuration example of a main part of the injection mold apparatus according to the first embodiment. Specifically, FIG. 1 shows a state where the injection mold is open. FIG. 2 shows a stage where the resin is injection-molded. This injection mold apparatus is a film in mold injection mold apparatus used for a film in mold resin injection molding process, and more specifically, on the side surface of the end of the resin molded product (near the end surface of the resin molded product). Used to produce decorative products that require a decorative layer transfer. In the injection mold apparatus of the first embodiment, the decorative layer that is in close contact with the resin molded product via the adhesive layer is separated from the release layer on the side surface of the end of the resin molded product (near the end surface of the resin molded product). Equipped with a peeling assisting structure for good peeling.

  In FIG. 1, 1 is a non-decorative surface side nesting (an example of a non-decorative surface side mold), 2 is a decorative surface side nesting (an example of a decorative surface side mold), 3 is a decorative surface side Product shape portion carved into the insert 2, 4 is a foil pressing plate, 5 is a decorative film, 6 is a film suction flow path, 7 is a flow path for medium inflow, 8 is a mold film clamping surface (of a mold dividing surface) An example). Moreover, in FIG. 2, 21 has shown the molten resin. The non-decorative surface side insert 1 and the decor surface side insert 2 are set in an injection mold. In this Embodiment 1, the non-decorative surface side nest 1 is a fixed side nest, and the decor surface side nest 2 is a movable side nest. That is, the non-decorative surface side insert 1 is set on the fixed mold of the injection mold, and the decor surface side insert 2 is set on the movable mold of the injection mold. However, the non-decorative surface side nesting 1 may be a movable side nesting, and the decorative surface side nesting 2 may be a fixed side nesting. Moreover, in this Embodiment 1, the foil pressing plate 4 which is an example of a film clamp part is equipped with the O-ring for film clamps, and the structure which presses the decoration film 5 against the metal mold | die film clamp surface 8 with the O-ring, It has become. However, the foil pressing plate may have a configuration without an O-ring.

  In the decorative surface side insert 2, the product shape portion 3 is carved from the mold film clamp surface 8, and the mold film clamp surface 8 is closer to the non-decorative surface side insert 1 than the product shape portion 3. is there. Also, the opening end of the film suction channel 6 and the opening end of the medium inflow channel 7 are respectively formed on the mold film clamp surface 8 of the decorative surface side nest 2, located outside the product shape portion 3. ing. Specifically, the opening end of the film suction channel 6 is located between the outer peripheral end of the product shape portion 3 and the foil pressing plate 4, and the open end of the medium inflow channel 7 is the end of the product shape portion 3. It is located between the outer peripheral end and the opening end of the film suction channel 6. Note that the film suction channel 6 and the medium inflow channel 7 are provided on the condition that the film suction channel 6 functions to suck gas and the medium inflow channel 7 functions to inflow the medium. The open end may be shared.

  In this injection molding die apparatus, as shown in FIG. 1, the foil pressing plate 4 is lowered while the injection molding die is opened, and the mold of the decorative surface side nesting 2 is moved by the foil pressing plate 4. After the decorative film 5 is clamped on the mold film clamping surface 8, vacuum suction is performed in which gas is sucked into the open end of the film suction channel 6. Thereby, the gas in the sealed space formed between the decorative surface side insert 2 and the clamped decorative film 5 is sucked through the film suction flow path 6, and the decorative film 5 is stretched. However, it is along the product shape part 3 of the decorative surface side insert 2. Next, after the injection mold is clamped, the non-decorative surface side insert 1 is placed in the space between the non-decorative surface side insert 1 and the sucked decorating film 5 as shown in FIG. Molten resin 21 is injected from this side, and molten resin 21 is filled into a molding space formed inside the injection-molded mold that has been clamped.

  FIG. 3 is an enlarged view of a portion A in FIG. In FIG. 3, 31 indicates a resin molded product. The resin molded product 31 is obtained by cooling and solidifying the molten resin 21. The vacuum-decorated decorative film 5 is sucked to the product shape portion 3 of the decorative surface side insert 2 and the mold film clamp surface by the residual suction pressure during vacuum suction. In the first embodiment, before the mold opening operation of the injection mold is started, an operation for injecting the cooling medium from the opening end of the medium inflow channel 7 is started.

  Here, referring to FIG. 4A to FIG. 4E, in the conventional film-in-mold injection mold apparatus, the side surface of the end portion of the resin molded product (near the end surface of the resin molded product) is added. A phenomenon in which the decorative layer is partially peeled from the adhesive layer will be described. 4 (a) to 4 (e) show, in a time series, the process in which the decorative layer is partially peeled from the adhesive layer on the side surface of the end of the resin molded product in the conventional film-in-mold injection mold apparatus. Represents. 4A to 4E, the same components as those illustrated in FIGS. 7 to 10 are denoted by the same reference numerals as those illustrated in FIGS. 7 to 10, and description thereof is omitted.

  As already described, in the conventional film-in-mold resin injection molding process, the decorative film 75 that is in close contact with the surface of the resin molded product 91 when the injection mold is opened is a resin constituting the resin molded product 91. The release layer is not sufficiently cooled to a temperature at which the release layer exhibits a predetermined release function. For this reason, the peeling adhesive strength (peeling resistance) of the release layer is stronger than the force (adhesive force) at which the adhesive layer is in close contact with the decorative layer, and the side surface (resin molding) of the resin molded product 91 In the vicinity of the end face of the product 91), the decorative layer is partially peeled off from the adhesive layer. Further, when the injection mold is opened, the force for peeling the decorative film 75 from the resin molded product 91 is maximized in the vicinity of the end surface of the resin molded product 91. This also causes the decorative layer to partially peel from the adhesive layer on the side surface of the end portion of the resin molded product 91. Hereinafter, a detailed description will be given with reference to FIGS. 4 (a) to 4 (e).

  In FIG. 4A, 41 is an adhesive layer of the decorative film 75, 42 is a decorative layer of the decorative film 75, 43 is a release layer of the decorative film 75, and 44 is a base film of the decorative film 75. Yes. Reference numeral 45 denotes an outer peripheral standing wall of the product shape portion, and 46 denotes the vicinity of the end face of the resin molded product 91.

  FIG. 4A shows a state when the molten resin is cooled and solidified. At this time, the decorative film 75 is in a state of being sucked by the product shape portion of the decorative surface side nest 72 and the mold film clamp surface by the residual suction pressure during vacuum suction. At this time, the resin molded product 91 is obtained from the melting temperature of the resin constituting the resin molded product 91 by heat exchange with the injection mold (non-decorative surface side insert 71 and decorative surface side insert 72). It is cooled to the solidification temperature of the resin constituting the molded product 91. In a general film-in-mold resin injection molding process, the mold temperature is set to 60 ° C to 80 ° C. If the resin constituting the resin molded product 91 is a general-purpose ABS resin used in a general film-in-mold resin injection molding process, the melting temperature of the resin constituting the resin molded product 91 is 200 ° C. to 260 ° C. C, and the solidification temperature of the resin constituting the resin molded product 91 is 80 ° C. to 125 ° C. The decorative film 75 in close contact with the resin molded product 91 has a temperature equivalent to that of the resin molded product 91.

  FIG. 4B shows an initial state where the mold opening operation of the injection mold is started. The resin molded product 91 is hung on the non-decorative surface side nesting 71 by contraction of the resin constituting the resin molded product 91, and the decorative film 75 is bonded to the resin molded product 91 by the adhesive force of the adhesive layer 41. Thus, the foil holding plate restrains the mold film clamp surface of the decorative surface side insert 72, and the decorative surface side insert 72 side (the product shape portion and the mold film clamp surface) by the residual suction pressure during vacuum suction. Be sucked by. At this time, the decorative film 75 sucked to the mold film clamp surface in the vicinity of the outer peripheral end of the product shape portion (near the outer peripheral end of the outer peripheral standing wall surface 45) tries to remain on the mold film clamp surface as it is, The decorative film 75 adhered to the side surface of the resin molded product 91 in the vicinity 46 of the end surface of the resin molded product 91 tends to be separated from the decorative surface side nest 72 together with the resin molded product 91. Thereby, in the vicinity 46 of the end surface of the resin molded product 91, the force for peeling the decorative film 75 from the resin molded product 91 becomes the largest. The force acts in the direction of shearing the adhesive layer 41 and the decorative layer 42 in the vicinity 46 of the end face of the resin molded product 91. This direction is a direction parallel to the outer peripheral standing wall surface 45 of the product shape portion (a direction parallel to the surface of the decorative film 75), and the greatest peeling force is required to peel the decorative layer 42 from the peeling layer 43. Is the direction.

  FIG.4 (c) shows the state which the mold opening of the injection mold advanced further from the state of FIG.4 (b). In the vicinity 46 of the end surface of the resin molded product 91, the force in the direction of shearing the adhesive layer 41 and the decorative layer 42 is further increased. At this time, the temperature of the resin molded product 91 and the decorative film 75 is not higher than the solidification temperature of the resin constituting the resin molded product 91 and higher than the mold temperature. For example, the solidification temperature of a general-purpose ABS resin used in a general film-in-mold resin injection molding process is 80 ° C. to 125 ° C., and the mold temperature set in the general film-in-mold resin injection molding process Is 60 ° C to 80 ° C. In general, the peel adhesive strength (peel resistance) of the release layer 43 of the decorative film 75 has a property of becoming stronger as the temperature of the release layer 43 increases. That is, the peeling force required to peel the decorative layer 42 from the peeling layer 43 increases as the environmental temperature increases. For example, the peeling force at a peeling angle of 150 ° is about 6.0 N when the environmental temperature is 70 ° C., and is about 7.2 N when the environmental temperature is 90 ° C. Due to these factors, even if the force in the direction of shearing the adhesive layer 41 and the decorative layer 42 is greater than the in-layer breaking elongation limit force of the adhesive layer 41, the decorative layer 42 is sheared even if the adhesive layer 41 is sheared. Does not peel from the release layer 43. The in-layer breaking elongation limit force of the decorative layer 42 is larger than the in-layer breaking elongation limit force of the adhesive layer 41 due to the characteristics of the respective materials of the adhesive layer 41 and the decorative layer 42. For this reason, although the decoration layer 42 is finally pulled and broken (sheared), the timing is delayed from the timing when the adhesive layer 41 is pulled and broken (sheared).

  FIG.4 (d) shows the state which the mold opening of the injection mold advanced further from the state of FIG.4 (c). In the vicinity 46 of the end face of the resin molded product 91, the adhesive layer 41 has already been sheared, but the decorative layer 42 has not been sheared yet and continues to receive a force in the shearing direction. Since this shearing direction force is larger than the adhesive force (adhesion force) between the adhesive layer 41 and the decorative layer 42 and smaller than the in-layer breaking elongation limit force of the decorative layer 42, the resin molded product The decorative layer 42 is partially peeled from the adhesive layer 41 in the vicinity 46 of the end surface 91 (side surface of the end portion of the resin molded product 91). The force relationship at this time is the in-layer breaking elongation limit force of the decorative layer 42> force in the shear direction> adhesive force (adhesion force) between the adhesive layer 41 and the decorative layer 42. Thereafter, the mold opening of the injection mold further proceeds, so that the resin molded product 91 and the decorative film 75 are exposed to the atmosphere, the environmental temperature of the decorative film 75 is lowered, and the peel adhesive strength of the release layer 43 is increased. Weaken. Further, the decorative layer 42 is partially peeled from the adhesive layer 41 in the vicinity 46 of the end face of the resin molded product 91, so that the shear direction (the direction parallel to the outer peripheral standing wall surface 45 of the product shape portion, that is, the decorative film). The force acting in the direction parallel to the surface 75 changes to a force acting in the direction intersecting the outer peripheral standing wall surface 45 of the product shape portion (direction intersecting the surface of the decorative film 75). As a result, since the force in the shearing direction becomes small, the force (adhesive force) at which the adhesive layer 41 adheres to the decorative layer 42 becomes larger than the force in the shearing direction, and the decorative layer 42 peels from the adhesive layer 41. Stops. That is, the force (adhesive force) at which the adhesive layer 41 is in close contact with the decorative layer 42 at the portion X in FIG. 4D is greater than the force in the shear direction. Peeling stops.

  The range in which the decorative layer 42 is partially peeled from the adhesive layer 41 in the vicinity 46 of the end surface of the resin molded product 91 (side surface of the end of the resin molded product 91) is the above-described force relationship, that is, the layer of the decorative layer 42. Inner rupture elongation limit force> Shear direction force> Adhesive force (adhesive force) between the adhesive layer 41 and the decorative layer 42 is in a range where a force relationship is established. Generally, it is a range of about 2 to 3 mm from the end surface of the resin molded product 91 (product).

  FIG. 4E shows a state in which the decorative layer 42 that is in close contact with the resin molded product 91 via the adhesive layer 41 is completely peeled off from the decorative film 75 by opening the mold of the injection mold. The shearing of the decorative layer 42 is caused by the force of tearing the decorative layer 42 generated when the resin molded product 91 is separated from the decorative surface side insert 72 by opening the injection mold. It occurs at a position greater than the in-layer breaking elongation limit force, and is not the vicinity 46 of the end surface of the resin molded product 91 (the side surface of the end of the resin molded product 91), but the mold film clamp of the decorative surface side nest 72 Happens in terms of.

  Due to the peeling behavior of the decorative film 75 described above, in the conventional film-in-mold resin injection molding process, the decorative layer 42 is bonded in the vicinity 46 of the end surface of the resin molded product 91 (side surface of the end of the resin molded product 91). Partially peels off layer 41. On the other hand, in the injection mold apparatus of the first embodiment, when the mold opening operation of the injection mold is started, the cooling medium having a temperature lower than the temperature of the decorative film 5 is a resin molded product. In the vicinity of the end face 31, the medium is introduced from the medium inflow channel 7 between the decorative film 5 and the decorative surface side insert 2. With this configuration, in the vicinity of the end surface of the resin molded product 31 (side surface of the end of the resin molded product 31), the decorative film 5 and the resin molded product 31 are cooled by the inflow of the cooling medium, and the adhesive layer becomes the decorative layer. The peel adhesion strength of the release layer is smaller than the force (adhesive force) that adheres to the surface. Thereby, in the vicinity of the end surface of the resin molded product 31 (side surface of the end portion of the resin molded product 31), the decorative layer is hardly peeled off from the adhesive layer.

  5 (a) to 5 (e) show a decorative layer adhered to the resin molded product 31 by an adhesive layer when the injection mold is opened in the injection mold apparatus of the first embodiment. Shows the process of peeling from the release layer in time series. 5A to 5E, the same components as those illustrated in FIGS. 1 to 3 are denoted by the same reference numerals as those illustrated in FIGS. 1 to 3, and description thereof is omitted.

  In Fig.5 (a), 51 shows the contact bonding layer of the decorating film 5, 52 shows the decorating layer of the decorating film 5, 53 shows the peeling layer of the decorating film 5, 54 shows the base film of the decorating film 5 Yes. Further, 55 indicates the vicinity of the end face of the resin molded product 31, and 56 indicates a cooling medium.

  FIG. 5A shows a state when the molten resin is cooled and solidified. At this time, the decorative film 5 is in a state of being sucked to the product shape portion of the decorative surface side nest 2 and the mold film clamp surface by the suction residual pressure during vacuum suction. In addition, the decorative film 5 is bonded to the resin molded product 31 by the adhesive force of the adhesive layer 51, while being restrained on the mold film clamp surface by a foil pressing plate. At this time, the resin molded product 31 is obtained from the melting temperature of the resin constituting the resin molded product 31 by heat exchange with the injection mold (non-decorative surface side insert 1 and decorative surface side insert 2). The resin 31 is cooled to the solidification temperature of the resin. The decorative film 5 in close contact with the resin molded product 31 has a temperature equivalent to that of the resin molded product 31. Thereafter, an inflow pressure for allowing the cooling medium 56 to flow from the medium inflow passage 7 between the mold film clamp surface of the decorative surface side insert 2 and the decorative film 5 acts on the decorative film 5. Thereby, the force which separates the decorating film 5 from the mold film clamp surface of the decorating surface side insert 2 is given to the decorating film 5, and the decorating film 5 is in the vicinity 55 of the end face of the resin molded product 31, Release from residual suction pressure.

  FIG. 5B shows an initial state where the mold opening operation of the injection mold is started. The resin molded product 31 is hung on the non-decorative surface side nesting 1 by shrinkage of the resin constituting the resin molded product 31, and the decorative surface side together with the non-decorative surface side nesting 1 by the mold opening of the injection mold. Move away from nesting 2. At this time, the force that separates the decorative film 5 from the mold film clamp surface 8 is given to the decorative film 5 by the inflow pressure for allowing the cooling medium 56 to flow from the medium inflow passage 7. As the decorative surface side insert 1 moves away from the decorative surface side insert 2, the cooling medium 56 can flow from the medium inflow channel 7 between the mold film clamp surface 8 and the decorative film 5 and flows in. The The cooling medium 56 that has flowed in is at a lower temperature than the decorative film 5, and further cools the resin molded product 31 and the decorative film 5 that have been cooled to the solidification temperature of the resin that forms the resin molded product 31. For example, when a gas of 20 ° C is used as the cooling medium 56, the mold temperature set in a general film-in-mold resin injection molding process is 40 ° C which is lower than the mold temperature of 60 ° C to 80 ° C. The resin molded product 31 and the decorative film 5 are cooled in the vicinity 55 of the end surface of the resin molded product 31 to ˜50 ° C. Thereby, the peeling adhesive strength (peeling resistance) of the peeling layer 53 is weakened, and the decorative layer 52 is peeled off from the peeling layer 53 rather than the force (adhesive force) that the adhesive layer 51 adheres to the decorative layer 52. The required force (peeling force) is reduced, and the decorative layer 52 is less likely to be peeled off from the adhesive layer 51 in the vicinity 55 of the end surface of the resin molded product 31 (side surface of the end of the resin molded product 31).

  Further, the decorative film 5 is separated from the mold film clamp surface 8 by the inflowing cooling medium 56 and follows the resin molded product 31. For this reason, in the vicinity 55 of the end surface of the resin molded product 31, a force in the shearing direction generated in the conventional film-in-mold resin injection molding process is hardly generated.

  FIG.5 (c) shows the state which the mold opening of the injection mold advanced further from the state of FIG.5 (b). In the vicinity 55 of the end face of the resin molded product 31, the adhesive layer 51 and the decorative layer 52 are ruptured, and the decorative layer 52 is attached to the decorative film 5 (release layer) with the decorative layer 52 and release layer 53 as a boundary. 53). Specifically, the decorative film 5 swelled by the cooling medium 56 is restrained by the mold film clamp surface 8 by the foil pressing plate 4 outside the opening end of the medium inflow passage 7 and inside the product shape portion 3. It is sandwiched between the decorative surface side insert 2 and the resin molded product 31. For this reason, the decorative film 5 cannot follow the resin molded product 31 that moves away from the decorative surface side insert 2 due to the mold opening of the injection mold, and the adhesive layer 51 starts from the end surface of the resin molded product 31. At the same time as the decorative layer 52 is broken by the tensile force, the decorative layer 52 is peeled off from the release layer 53. At this time, in the vicinity 55 of the end face of the resin molded product 31, the resin molded product 31 and the decorative film 5 are cooled to the mold temperature or lower, and the force ( The peeling force) does not become larger than the adhesive force between the adhesive layer 51 and the decorative layer 52.

  FIG.5 (d) shows the state which the mold opening of the injection mold advanced further from the state of FIG.5 (c). At this time, the peeling from the peeling layer 53 of the decorative layer 52 that is in close contact with the resin molded product 31 via the adhesive layer 51 further proceeds.

  FIG.5 (e) shows the state which the resin molded product 31 slipped out from the decorating surface side nest | insert 2 by the mold opening of the injection mold. Thereafter, until the decorative layer 52 that is in close contact with the resin molded product 31 via the adhesive layer 51 is completely separated from the decorative film 5, the peeling of the decorative layer 52 from the release layer 53 proceeds.

  As described above, the injection mold apparatus includes the outer peripheral end of the product shape portion 3 formed on the decorative surface side mold (decorative surface side insert 1), the film clamp member (the foil pressing plate 4), and In this configuration, a film clamp member (between the mold part (decorative surface side insert 1) constituting the product shape portion 3 and the decorative film 5 is provided. A sealed space is formed by the foil pressing plate 4), and vacuum suction control and cooling medium inflow control are performed, whereby the decorative film 5 can be cooled and the decorative film 5 can be peeled. Specifically, when the injection mold is opened, the force required to peel the decorative layer 52 from the release layer 53 is smaller than the adhesive force between the adhesive layer 51 and the decorative layer 52. It becomes possible to lower the temperature of the decorative film 5 that is in close contact with the resin molded product 31 up to the temperature. In addition, when the injection mold is opened, the decorative film 5 is made to follow the resin molded product 31 that is separated from the decorative surface side insert 2 together with the non-decorative surface side insert 1, while the film clamp member (the foil pressing plate 4 ), The decorative film 5 is restrained, and the decorative layer 52 that is in close contact with the resin molded product 31 through the adhesive layer 51 can be peeled off from the release layer 53. Thereby, since the force which shears the contact bonding layer 51 and the decoration layer 52 which generate | occur | produces in the vicinity 55 of the end surface of the resin molded product 31 when an injection mold opens is reduced, it is the vicinity 55 of the end surface of the resin molded product 31. The decorative layer 52 is unlikely to be peeled off from the adhesive layer 51 at the side surface of the end of the resin molded product 31.

  As described above, according to the first embodiment, the film in which the decorative layer 52 of the decorative film 5 is required to be transferred to the side surface of the end portion of the resin molded product 31 (near the end surface 55 of the resin molded product 31). In the in-mold resin injection molding process, when the decorative layer 52 that adheres to the resin molded product 31 through the adhesive layer 51 is peeled off from the decorative film 5, the temperature control of the decorative film 5 that adheres to the resin molded product 31; The peeling behavior of the decorative film 5 can be controlled, and the decorative layer 52 is hardly peeled off from the adhesive layer 51 in the vicinity 55 of the end surface of the resin molded product 31 (side surface of the end of the resin molded product 31).

  Note that the injection mold apparatus in which the opening end of the film suction channel 6 is formed on the mold film clamping surface 8 of the decorative surface side insert 2 has been described, but the opening end of the film suction channel 6 is disposed. The position to be performed is not limited to the position described in the first embodiment. For example, even if the opening end of the film suction channel 6 is positioned in the product shape portion 3 of the decorative surface side insert 2. I do not care. The medium inflow channel 7 may be provided so that the side surface of the end portion of the resin molded product 31 can be cooled. Accordingly, the decorative layer 52 is unlikely to be peeled off from the adhesive layer 51 in the vicinity 55 of the end surface of the resin molded product 31 (side surface of the end of the resin molded product 31). The position of the opening end of the medium inflow passage 7 is not particularly limited as long as the medium inflow passage 7 can cool the side surface of the end portion of the resin molded product 31. However, it is preferable that the opening end of the medium inflow channel 7 is positioned on the mold film clamp surface 8 in the vicinity 55 of the end surface of the resin molded product 31. Thereby, in the vicinity 55 of the end face of the resin molded product 31, it is difficult to generate a force in the direction of shearing the adhesive layer 51 and the decorative layer 52.

  In the first embodiment, the operation for injecting the cooling medium 56 between the decorative surface side insert 2 and the decorative film 5 is started before the mold opening operation of the injection mold is started. After the mold opening operation of the injection mold is started (in the middle of the mold opening), an operation for allowing the cooling medium 56 to flow between the decorative surface side insert 2 and the decorative film 5 may be started. . In this case, immediately after the start of the mold opening operation of the injection mold, in the vicinity of the end face of the resin molded product, the force for peeling the decorative film from the resin molded product is locally increased, and FIG. As shown in Fig. 2, the adhesive layer and the decorative layer are bent at the side surface of the end portion of the resin molded product. And after this, as shown in FIG.5 (b), with the cooling medium 56, the decorating film 5 swells in the opposite direction to the bending direction. Thereby, the fracture | rupture of the contact bonding layer 51 and the decoration layer 52 which started from the end surface of the resin molded product 31 occurs more reliably.

(Embodiment 2)
Subsequently, regarding the second embodiment, matters different from the matters described in the first embodiment will be described. The injection mold apparatus in the second embodiment is also a film-in-mold injection mold apparatus as in the first embodiment described above, and peels off the decorative layer that is in close contact with the resin molded product via the adhesive layer. As a peeling assisting structure for peeling off from the layer satisfactorily, a medium inflow passage provided in the decorative surface side nest is provided. As in the first embodiment described above, the injection mold apparatus in the second embodiment also has a medium inflow flow when the decorative layer that adheres to the resin molded product through the adhesive layer is peeled off from the release layer. The cooling medium is allowed to flow in from the path so that the temperature control of the decorative film closely contacting the resin molded product and the peeling behavior control of the decorative film can be performed.

  FIG. 6 is a diagram showing a configuration example of a main part of the injection mold apparatus according to the second embodiment. In addition, about the member corresponding to the member demonstrated in Embodiment 1 mentioned above, the code | symbol same as the code | symbol provided in Embodiment 1 mentioned above is attached | subjected, and the description is abbreviate | omitted. In FIG. 6, reference numeral 61 denotes a flow path nesting.

  In the second embodiment, the decorative surface side nest 2 and the flow path configuration nest 61 are separate parts. The film suction channel 6 and the medium inflow channel 7 are formed in a channel configuration nest 61. Note that the film suction channel 6 and the medium inflow channel 7 are provided on the condition that the film suction channel 6 functions to suck gas and the medium inflow channel 7 functions to inflow the medium. The open end may be shared.

  The front end portion of the flow path component nest 61 set in the decorative surface side nest 2 protrudes from the product shape portion 3, and the outer surface of the front end portion of the flow path structure nest 61 rises in the product shape portion 3. Configure. An opening hole portion of the product is formed by the distal end portion of the flow path constituting nest 61. That is, when the injection mold is clamped, the top surface of the flow path component nest 61 comes into contact with the non-decorative side nest 1. Therefore, the molten resin does not flow into the respective channels of the film suction channel 6 and the medium inflow channel 7 from the top surface of the channel structure nest 61. The materials of the decorative surface side insert 2 and the flow path structure insert 61 are different materials. Preferably, the material of the decorative surface side nest 2 and the flow path component nest 61 is such that the heat conductivity of the material constituting the flow channel nest 61 is the heat conductivity of the mold material constituting the decorative surface nest 2. It is selected to be greater than the rate. For example, the material of the channel structure insert 61 is copper (thermal conductivity at 20 ° C. is 372 w / mk), and the mold material of the decorative surface side insert 2 is carbon steel (thermal conductivity at 20 ° C. is 53 w / mk). ), The thermal conductivity of the material of the flow path component nest 61 is about 7 times the thermal conductivity of the mold material of the decorative surface side nest 2, and the flow channel component nest 61 is nested on the decorative surface side nest 61. Heat can be transmitted more easily than 2.

  Conventionally, the shape of a resin molded product used for an exterior of a display or the like is often a rectangular frame shape having an opening hole at the center. The opening hole of this resin molded product is formed at the center of the product shape portion 3 of the decorative surface side insert 2. When a plurality of resin molded products are continuously molded, the central portion of the product shape portion 3 is more likely to store heat than the outer peripheral portion of the product shape portion 3, so the surface (side surface) constituting the opening hole portion is decorated. The layer is easy to peel off from the adhesive layer.

  On the other hand, according to the second embodiment, the medium inflow channel 7 is provided so as to cool the outer surface (the surface rising in the product shape portion 3) of the distal end portion of the channel structure insert 61. . That is, the medium inflow channel 7 can cool the side surface (in the vicinity of the outer peripheral end of the opening hole portion of the resin molded product) constituting the opening hole portion of the resin molding product. Therefore, when the decorative layer that is in close contact with the resin molded product via the adhesive layer is peeled off from the release layer, the temperature control of the decorative film 5 that is in close contact with the side surface constituting the opening hole of the resin molded product is performed. The decorative layer is unlikely to be peeled off from the adhesive layer on the side surface constituting the opening hole of the resin molded product. Furthermore, since the portion where heat storage is likely to occur has a nested structure made of a material having good thermal conductivity (a material having higher thermal conductivity than the mold material), the temperature of the decorative film 5 due to heat storage The rise is suppressed. Thereby, a decoration layer becomes difficult to peel from an adhesive layer in the side surface which comprises the opening hole part of a resin molded product. Further, since the flow path 7 for medium inflow is provided inside the flow path structure insert 61, the temperature of the flow path structure insert 61 itself can be controlled by the cooling medium, and the side surface constituting the opening hole portion of the resin molded product The decorative layer becomes even more difficult to peel off from the adhesive layer.

  Further, according to the second embodiment, the cooling medium flows from the top surface of the flow path structure nest 61 for forming the opening hole portion of the resin molded product, and is adhered to the resin molded product by the adhesive layer. The direction in which the force is generated when the decorative layer is peeled from the release layer is controlled, and the force in the direction of shearing the adhesive layer and the decorative layer is weakened in the vicinity of the outer peripheral end of the opening hole of the resin molded product.

  As described above, according to the second embodiment, the resin molded product and the decorative film 5 that is in close contact with the resin molded product are cooled, and the force necessary to peel the decorative layer from the release layer is increased. The direction in which the force is generated when the decorating layer that adheres to the resin molded product through the adhesive layer is peeled off from the release layer is smaller than the adhesive force between the adhesive layer and the decorating layer, Since the force in the direction of shearing the adhesive layer and the decorative layer is reduced in the vicinity of the outer peripheral edge of the opening hole portion of the resin molded product, the side surface of the opening hole portion of the resin molded product (of the opening hole portion of the resin molded product) In the vicinity of the outer peripheral edge), the decorative layer is hardly peeled off from the adhesive layer.

  In addition, although the description has been given of the injection mold apparatus in which the opening end of the film suction channel 6 is formed on the top surface of the channel configuration nest 61, the position where the opening end of the film suction channel 6 is arranged is For example, the opening end of the film suction channel 6 may be positioned on the mold film clamp surface 8 of the decorative surface side insert 2. Further, the medium inflow channel 7 may be provided so that the surface rising in the product shape portion 3 (for example, the side surface constituting the opening hole portion of the resin molded product) can be cooled. Thereby, a decoration layer becomes difficult to peel from an adhesive layer in the surface which stands | starts up in the product shape part 3. FIG. The position of the opening end of the medium inflow passage 7 is not particularly limited as long as the surface where the medium inflow passage 7 rises in the product shape portion 3 can be cooled. However, it is preferable that the opening end of the medium inflow channel 7 is positioned on a surface connected to the upper end of the surface rising in the product shape portion 3 (for example, the top surface of the protruding portion protruding in the product shape portion). This is because the force in the direction of shearing the adhesive layer and the decorative layer is hardly generated in the vicinity of the upper end of the surface rising in the product shape portion 3.

  Moreover, in order to form the opening hole part of a resin molded product, a part of product shape part 3 may become a shape which protrudes corresponding to the opening hole part of a resin molded product. However, as described in the second embodiment, in order to form the opening hole portion of the resin molded product, it is made of a material having a good thermal conductivity (a material having a higher thermal conductivity than the mold material). By adopting the nesting structure, the decorative layer is more unlikely to be peeled off from the adhesive layer on the side surface constituting the opening hole of the resin molded product.

  In addition, as described in the first embodiment, before starting the mold opening operation of the injection mold, an operation for supplying the cooling medium between the decorative surface side insert 2 and the decorative film 5 is started. Alternatively, after the mold opening operation of the injection mold is started (in the middle of mold opening), the operation for supplying the cooling medium between the decorative surface side insert 2 and the decorative film 5 is started. May be.

  Two embodiments of the present invention have been described above. However, the present invention is not limited to the two embodiments described above. Many other specific structures that realize the gist of the present invention are conceivable, and modifications to these other structures are easy for those skilled in the art, and these are included in the scope of the present invention.

  An injection mold apparatus and an injection molding method according to the present invention provide a decorative layer on a side surface of an end portion of a resin molded product or an opening hole of a resin molded product in a film-in-mold resin injection molding process. Useful for film-in-mold resin injection molding processes that produce decorative products that require the transfer of a decorative layer on the side surface of the end of the resin molded product or the side of the opening hole of the resin molded product. It is.

DESCRIPTION OF SYMBOLS 1 Non-decorative surface side nesting 2 Decorative surface side nesting 3 Product shape part 4 Foil pressing board 5 Decorative film 6 Film suction flow path 7 Medium inflow flow path 8 Mold film clamp surface 21 Molten resin 31 Resin molding 41 Adhesive layer 42 Decorating layer 43 Peeling layer 44 Base film 45 Standing outer peripheral wall of the product-shaped portion 46 Near the end face of the resin molded product 51 Adhesive layer 52 Decorating layer 53 Peeling layer 54 Base film 55 Near the end face of the resin molded product 56 Cooling medium 61 Channel structure insert 71 Non-decorative surface side insert 72 Decorated surface side insert 73 Product shape portion 74 Foil retainer plate 75 Decorated film 76 Film suction channel 81 Molten resin 91 Resin molded product

Claims (6)

  In an injection mold apparatus for molding a film-in-mold molded product, a film suction channel and a medium inflow channel provided in a mold on the decorative surface side, and a mold on the decorative surface side are formed. The product shape portion, and a film clamp portion for restraining the decorative film on the mold on the decorative surface side outside the product shape portion, and the product shape portion and the film clamp portion. An injection mold apparatus, characterized in that an opening end of the medium inflow channel is disposed therebetween.   In an injection mold apparatus for molding a film-in-mold molded product, a film suction channel and a medium inflow channel provided in a mold on the decorative surface side, and a mold on the decorative surface side are formed. The product shape portion, a film clamp portion for restraining the decorative film on the mold on the decoration surface side outside the product shape portion, and a surface rising in the product shape portion, The injection mold apparatus is characterized in that the medium inflow passage is arranged so that the surface rising in step S can be cooled.   A flow path component nest that forms a surface that rises in the product shape portion by being incorporated in the mold on the decorative surface side, and the medium inflow channel is provided in the flow channel nest; The injection mold apparatus according to claim 2, wherein the thermal conductivity of the material constituting the path nesting is larger than the thermal conductivity of the material constituting the mold on the decorative surface side.   The injection mold apparatus according to any one of claims 1 to 3, wherein the film suction channel and the medium inflow channel share one open end. While the injection mold including the mold on the decorative surface side and the mold on the non-decorative surface side is opened, the film clamp part adds to the mold dividing surface of the mold on the decorative surface side. Restraining the decorative film, forming a sealed space between the decorative surface side mold and the decorative film;
Sucking gas in the sealed space;
Clamping the injection mold and forming a molding space in the injection mold; and
Injecting resin into the molding space;
Opening the injection mold, and
Supplying a cooling medium between the mold on the decorative surface side and the decorative film after the mold opening operation of the injection mold is started;
An injection molding method comprising:   In order to supply a cooling medium between the mold on the decorative surface side and the decorative film before the start of the mold opening operation of the injection mold or after the mold opening operation of the injection mold. 6. The injection molding method according to claim 5, wherein the operation is started.

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