JP2014192378A - Support structure of substrate - Google Patents

Support structure of substrate Download PDF

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Publication number
JP2014192378A
JP2014192378A JP2013067316A JP2013067316A JP2014192378A JP 2014192378 A JP2014192378 A JP 2014192378A JP 2013067316 A JP2013067316 A JP 2013067316A JP 2013067316 A JP2013067316 A JP 2013067316A JP 2014192378 A JP2014192378 A JP 2014192378A
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substrate
support member
substrate support
selection
backboard
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Akikatsu Nishikawa
晃勝 西川
Atsushi Ishii
淳 石井
Nobuyuki Sato
伸之 佐藤
So Goto
創 後藤
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Saxa Inc
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Saxa Inc
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Abstract

PROBLEM TO BE SOLVED: To provide a support structure of a substrate capable of easily performing a work of attaching/detaching of a circuit board, without damaging the circuit board, with for example a device hung on a wall.SOLUTION: A support structure of a substrate includes a substrate support member 3 almost vertically provided on a bottom surface of a case 2, a backboard substrate 4 supported on one surface of the substrate support member 3, being shorter than the height of the substrate support member 3, and a plurality of selective substrates 6 which are arranged to be almost vertical to the bottom surface of the case 2 while orthogonal to the backboard substrate 4, being electrically connected to the backboard substrate 4 through connectors 5, 9. Relating to the substrate support member 3, a cut part 32 is formed at an upper end part 3a, and the selective substrate 6 is formed higher than the height of the substrate support member 3, and when connected to the backboard substrate 4 through the connectors 5, 9, it is inserted into the cut part 32 of the substrate support member 3.

Description

本発明は、基板の支持構造に係り、たとえば電話機等の装置に取り付けられる回路基板の支持構造に関する。   The present invention relates to a substrate support structure, and more particularly to a circuit board support structure attached to a device such as a telephone.

このような回路基板の支持構造としては、たとえば下記特許文献1に示すように、ほぼ垂直方向に立設された第1プリント基板と第2プリント基板を有し、第2プリント基板は、第1プリント基板に対して交差して配置されるともに、該第1プリント基板とコネクタを介して電気的に接続されるものであって、該第1プリント基板を支持する支持板に第1プリント基板の厚さ方向の微摺動を規制する切欠き溝が形成された構成が知られている。   As such a circuit board support structure, for example, as shown in Patent Document 1 below, it has a first printed board and a second printed board standing upright in a substantially vertical direction. The first printed circuit board is disposed so as to intersect the printed circuit board and electrically connected to the first printed circuit board through a connector, and a support plate for supporting the first printed circuit board is attached to the first printed circuit board. A configuration is known in which a notch groove for regulating fine sliding in the thickness direction is formed.

また、下記特許文献2に示すように、筐体の底面にガイドレールが設けられ、基板を立設させて該ガイドレールに沿わせてスライドさせ、筐体の奥行の背面に設けられた他の基板に接続させる構成が知られている。   In addition, as shown in Patent Document 2 below, a guide rail is provided on the bottom surface of the housing, and the substrate is erected and slid along the guide rail. A configuration for connecting to a substrate is known.

特開平10−135666号公報Japanese Patent Laid-Open No. 10-135666 特開2002−324993号公報JP 2002-324993 A

ところで、回路基板の取付けあるいは取り外しする装置として、たとえば電話機等のように、据え置き状態の他に、比較的高い位置に壁掛け状態で設置されるものがある。
この場合、回路基板の取付けや取り外しの作業は、往々にして、該装置を壁掛け状態のままにし、該装置のアッパーケースを外して行うことがある。
By the way, as an apparatus for attaching or removing a circuit board, for example, a telephone or the like is installed in a wall-mounted state at a relatively high position in addition to a stationary state.
In this case, the circuit board is often attached or removed by leaving the device in a wall-mounted state and removing the upper case of the device.

しかし、手探りで探す装置内のコネクタに回路基板のコネクタを嵌合させなければならず、作業性が悪いという不都合を有する。
また、装置から回路基板を取り外す場合に、回路基板を真上の方向に力を加えることにより行うが、斜めの方向に引き抜かれることも多く、コネクタに大きな力が加わり回路基板を破損させてしまう不都合も有する。
However, the connector of the circuit board must be fitted to the connector in the device to be searched for, which has the disadvantage of poor workability.
In addition, when removing the circuit board from the device, it is performed by applying a force in the direction directly above the circuit board, but it is often pulled out in an oblique direction, and a large force is applied to the connector and the circuit board is damaged. There are also disadvantages.

本発明は、このような事情に鑑みてなされたものであり、その目的は、たとえば壁掛け状態の装置に対し、回路基板の取付けや取り外しの作業を、該回路基板を破損させることなく容易に行い得る基板の支持構造を提供することにある。   The present invention has been made in view of such circumstances, and an object of the present invention is, for example, to easily attach or remove a circuit board to a wall-mounted apparatus without damaging the circuit board. It is to provide a substrate support structure to be obtained.

本発明は、以下の構成によって把握される。
(1)本発明の基板の支持構造は、筐体の底面にほぼ垂直に設けられる基板支持部材と、前記基板支持部材の一方の面に支持され、前記基板支持部材よりも高さの低いバックボード基板と、前記筐体の底面にほぼ垂直に、かつ前記バックボード基板に直交して配置され、前記バックボード基板とコネクタを介して電気的に接続される複数の選択基板と、を有し、前記基板支持部材は、上端部に切欠き部が形成され、前記選択基板は、前記基板支持部材よりも高さが高く形成され、前記バックボード基板に前記コネクタを介して接続された際に、前記基板支持部材の前記切欠き部に挿入されることを特徴とする。
(2)本発明の基板の支持構造は、(1)の構成において、前記基板支持部材は、前記切欠き部の背面側に前記選択基板が挿入される挿入孔が形成され、前記挿入孔には、前記切欠き部に前記選択基板が挿入された際に、垂直方向に工具を挿入し得る間隙部が設けられることを特徴とする。
(3)本発明の基板の支持構造は、(1)、(2)のいずれかの構成において、前記選択基板の前記基板支持部側の端側面に形成された係合部と、前記選択基板が前記バックボード基板に接続される際に、前記前記基板支持部材に形成され前記選択基板の前記係合部が係合される被係合部と、を有し、少なくとも一の選択基板の前記係合部および前記一の選択基板の前記係合部が係合される前記基板支持部材の一の被係合部は、他の選択基板の前記係合部および前記他の選択基板の前記係合部が係合される前記基板支持部の他の被係合部と、異なる位置にあることを特徴とする。
(4)本発明の基板の支持構造は、(1)、(2)、(3)のいずれかの構成において、前記基板支持部材は、前記選択基板が配置される側と反対側の面に前記バックボード基板が露出される開口を有し、露出されたバックボード基板面に前記選択基板に対応する識別符号を付与したことを特徴とする。
The present invention is grasped by the following composition.
(1) The substrate support structure of the present invention includes a substrate support member provided substantially perpendicular to the bottom surface of the housing, and a back supported by one surface of the substrate support member and having a lower height than the substrate support member. A board substrate, and a plurality of selection substrates disposed substantially perpendicular to the bottom surface of the housing and orthogonal to the backboard substrate, and electrically connected to the backboard substrate via connectors. The substrate support member is formed with a notch at the upper end, and the selected substrate is formed with a height higher than the substrate support member, and is connected to the backboard substrate via the connector. And being inserted into the notch of the substrate support member.
(2) In the substrate support structure of the present invention, in the configuration of (1), the substrate support member has an insertion hole into which the selected substrate is inserted on the back side of the notch, and the insertion hole Is characterized in that a gap is provided through which a tool can be inserted in the vertical direction when the selected substrate is inserted into the notch.
(3) The substrate support structure according to the present invention includes an engagement portion formed on an end side surface of the selection substrate on the substrate support portion side, and the selection substrate in either of the configurations of (1) and (2) Is connected to the backboard substrate, and the engaged portion is formed on the substrate support member and engaged with the engaging portion of the selected substrate. One engaged portion of the substrate support member to which the engaging portion and the engaging portion of the one selected substrate are engaged is the engagement portion of the other selected substrate and the engagement of the other selected substrate. It is characterized in that it is in a position different from other engaged parts of the substrate support part to which the joint part is engaged.
(4) The substrate support structure of the present invention is the substrate support structure according to any one of (1), (2), and (3), wherein the substrate support member is disposed on a surface opposite to the side on which the selected substrate is disposed The back board substrate has an opening through which the back board substrate is exposed, and an identification code corresponding to the selected substrate is given to the exposed back board substrate surface.

このように構成した基板の支持構造によれば、たとえば壁掛け状態の装置に対し、回路基板の取付けや取り外しの作業を、該回路基板を破損させることなく容易に行うことができるようになる。   According to the substrate support structure configured as described above, for example, the operation of mounting and removing the circuit board can be easily performed on the apparatus mounted on the wall without damaging the circuit board.

本発明の基板の支持構造が適用される装置を示す斜視図である。It is a perspective view which shows the apparatus with which the support structure of the board | substrate of this invention is applied. 本発明の基板の支持構造が適用される装置を示す上面図である。It is a top view which shows the apparatus with which the support structure of the board | substrate of this invention is applied. 本発明の基板の支持構造が適用される装置の基板支持部材の部分の斜視図である。It is a perspective view of the part of the board | substrate support member of the apparatus with which the board | substrate support structure of this invention is applied. 図2のIV−IV線における断面図である。It is sectional drawing in the IV-IV line of FIG. 図2のV−V線における断面図である。It is sectional drawing in the VV line of FIG. 本発明の基板の支持構造が適用される装置の基板支持部材の上端部の斜視図である。It is a perspective view of the upper end part of the board | substrate support member of the apparatus with which the board | substrate support structure of this invention is applied. 本発明の基板の支持構造が適用される装置の基板支持部材(バックボード基板を取り外している)の正面図である。It is a front view of the board | substrate support member (The backboard board | substrate is removed) of the apparatus with which the board | substrate support structure of this invention is applied. 図4に対応する図で、選択基板の凹部を基板支持部材の被係合部から離脱させた状態を示す断面図である。FIG. 5 is a view corresponding to FIG. 4, and is a cross-sectional view showing a state in which a recessed portion of a selected substrate is detached from an engaged portion of a substrate support member. 基板支持部材の間隙部に工具を垂直に挿入した場合の断面図である。It is sectional drawing at the time of inserting a tool perpendicularly into the gap part of a substrate support member. 基板支持部材の間隙部に挿入した工具を操作した場合の断面図である。It is sectional drawing at the time of operating the tool inserted in the clearance gap of a board | substrate support member. 本発明の基板の支持構造が適用される装置の基板支持部材の背面図である。It is a rear view of the board | substrate support member of the apparatus with which the board | substrate support structure of this invention is applied.

以下、添付図面を参照して、本発明を実施するための形態(以下、実施形態)について詳細に説明する。なお、実施形態の説明の全体を通して同じ要素には同じ番号を付している。
(実施形態1)
図1は、本発明の基板の支持構造が適用されるたとえば電話機等の装置1を示し、該装置1のアッパーケース(図示せず)を取り外した状態の斜視図を示している。
図1において、アッパーケースとともに装置1の筐体を構成するロアーケース2の底面に基板支持部材3がほぼ垂直に設けられている。なお、装置1が壁掛け状態で設置される場合は、基板支持部材3が下側に位置する向きで設置される。
基板支持部材3は、ロアーケース2の周辺に近接して配置され、ロアーケース2の中央側の面(以下、表面と称する)にはバックボード基板4がたとえば螺子止めによって支持されている。これにより、バックボード基板4は、基板支持部材3と同様にロアーケース2の底面にほぼ垂直に立設されるようになっている。
DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments for carrying out the present invention (hereinafter referred to as embodiments) will be described in detail with reference to the accompanying drawings. Note that the same number is assigned to the same element throughout the description of the embodiment.
(Embodiment 1)
FIG. 1 shows a device 1 such as a telephone to which the substrate support structure of the present invention is applied, and shows a perspective view of the device 1 with an upper case (not shown) removed.
In FIG. 1, a substrate support member 3 is provided substantially vertically on the bottom surface of a lower case 2 that constitutes the casing of the apparatus 1 together with an upper case. In addition, when the apparatus 1 is installed in a wall-hanging state, the board support member 3 is installed in an orientation that is positioned on the lower side.
The substrate support member 3 is disposed in the vicinity of the periphery of the lower case 2, and the backboard substrate 4 is supported on a central surface (hereinafter referred to as a surface) of the lower case 2 by, for example, screwing. As a result, the backboard substrate 4 is erected almost vertically on the bottom surface of the lower case 2 in the same manner as the substrate support member 3.

ここで、バックボード基板4は、その高さが基板支持部材3よりも低く形成されている。このため、基板支持部材3の上端部3aは、正面視した場合に、バックボード基板4から露出され、この露出された部分は、ロアーケース2の中央側へバックボード基板4の表面を充分に超えて突出される突起部31として構成されるようになっている。
そして、基板支持部材3の突起部31には、水平に沿って延在する方向に、複数(図ではたとえば6個)の切欠き部32が並設されて形成されている。これら切欠き部32は、基板支持部材3の表面から背面側にかけて間隔が狭まる八の字形状となっている。この切欠き部32については、後に詳述する。
Here, the backboard substrate 4 is formed with a height lower than that of the substrate support member 3. For this reason, the upper end portion 3 a of the substrate support member 3 is exposed from the backboard substrate 4 when viewed from the front, and the exposed portion sufficiently covers the surface of the backboard substrate 4 toward the center of the lower case 2. It is configured as a protruding portion 31 protruding beyond.
The protrusion 31 of the substrate support member 3 is formed with a plurality of (for example, six in the figure) cutouts 32 arranged in parallel in a direction extending along the horizontal. These notches 32 have an eight-letter shape whose interval narrows from the front surface to the back surface of the substrate support member 3. The notch 32 will be described in detail later.

バックボード基板4には、そのロアーケース2の中央側の面(以下、表面と称する)において、複数(図ではたとえば6個)の第1コネクタ5が、搭載されている。各第1コネクタ5は、バックボード基板4上において、長手方向を上下方向にして、幅方向に並設されて配置されている。
バックボード基板4の第1コネクタ5は、それぞれ、ロアーケース2の底面にほぼ垂直に立設される選択基板6に電気的に接続されるようになっている。
ロアーケース2の底面には、バックボード基板4に直交して延在する複数(図ではたとえば6個)の案内溝7が、その延在方向と直交する方向に並設されて形成され、前記選択基板6は、その下端辺が該案内溝7に挿入されることによって位置決め配置されるようになっている。
A plurality (for example, six in the figure) of first connectors 5 are mounted on the backboard substrate 4 on the center side surface (hereinafter referred to as a surface) of the lower case 2. The first connectors 5 are arranged on the backboard substrate 4 in parallel in the width direction with the longitudinal direction being the vertical direction.
The first connectors 5 of the backboard substrate 4 are each electrically connected to a selection substrate 6 erected substantially perpendicularly to the bottom surface of the lower case 2.
A plurality of (for example, six in the figure) guide grooves 7 extending perpendicularly to the backboard substrate 4 are formed on the bottom surface of the lower case 2 so as to be juxtaposed in a direction perpendicular to the extending direction. The selection substrate 6 is positioned and arranged by inserting the lower end side of the selection substrate 6 into the guide groove 7.

図1では、一つの選択基板6が一つの案内溝7に挿入されるとともに、基板支持部材3の突起部31に形成された一つ切欠き部32に挿入されることによって、ロアーケース2の底面に立設して配置されていることを示している。
図2は、ロアーケース2の底面を上面視した図であり、基板支持部材3の突起部31に形成された切欠き部32が、案内溝7の上方に位置づけられて形成され、所定の案内溝7に挿入されて配置された選択基板6は、基板支持部材3側の側端辺において対応する切欠き部32に挿入されるようになっている。
In FIG. 1, one selection substrate 6 is inserted into one guide groove 7 and is inserted into one notch portion 32 formed in the protrusion 31 of the substrate support member 3, so that the lower case 2 is formed. It shows that they are arranged upright on the bottom.
FIG. 2 is a top view of the bottom surface of the lower case 2, and a notch 32 formed in the protrusion 31 of the substrate support member 3 is formed so as to be positioned above the guide groove 7 and has a predetermined guide. The selection substrate 6 inserted and disposed in the groove 7 is inserted into the corresponding notch 32 at the side edge on the substrate support member 3 side.

また、選択基板6は、図3に示すように、そのバックボード基板4側の側端辺において第2コネクタ9が搭載され、この第2コネクタ9はバックボード基板4に搭載された一つの第1コネクタ5に嵌合されるようになっている。バックボード基板4と選択基板6の電気的な接続は、第1コネクタ5と第2コネクタ9の嵌合によってなされるようになっている。なお、図3は、選択基板6を図1で示す方向とは反対の方向から観た場合の該選択基板6の周辺の斜視図である。
さらに、選択基板6は、図2に示すように、基板支持部材3とは反対側の側端辺において、ロアーケース2の底面に当接するように取付金具10が取り付けられ、この取付金具10は、ロアーケース2に固定された金属板11に螺子12によって固定されるようになっている。選択基板6の取付金具10は、たとえば選択基板6のアース端子に接続され、これにより該アース端子は金属板11を介して装置の外部に引き出されるようになっている。
As shown in FIG. 3, the selection board 6 has a second connector 9 mounted on the side edge of the backboard board 4, and the second connector 9 is a single first board mounted on the backboard board 4. 1 connector 5 is adapted to be fitted. Electrical connection between the backboard substrate 4 and the selection substrate 6 is made by fitting the first connector 5 and the second connector 9 together. FIG. 3 is a perspective view of the periphery of the selection substrate 6 when the selection substrate 6 is viewed from the direction opposite to the direction shown in FIG.
Further, as shown in FIG. 2, the selection board 6 is attached with a mounting bracket 10 so as to come into contact with the bottom surface of the lower case 2 on the side edge opposite to the board support member 3. The screw 12 fixes the metal plate 11 fixed to the lower case 2. The mounting bracket 10 of the selection board 6 is connected to, for example, a ground terminal of the selection board 6, and this ground terminal is drawn out of the apparatus through the metal plate 11.

図4は、図2のIV−IV線における断面図である。図4に示すように、基板支持部材3の突起部31に形成された切欠き部32に、該切欠き部32の対向壁を連結する被係合部14が形成されている。また、選択基板6の前記切欠き部32に挿入される部分には、前記被係合部14が挿入される凹部15(この明細書では係合部と称する場合がある)が形成されている。
なお、図5は、図2のV−V線における断面図である。図5示す選択基板6は、基板支持部材3の突起部31の背部に存在するように配置されている。これにより、図5に示す選択基板6は、基板支持部材3の突起部31に形成された切欠き部32に挿入されていることが明らかになる。
図6は、基板支持部材3の突起部31を斜め上方から観た斜視図であり、該突起部31に形成された切欠き部32に被係合部14(図中、選択基板6が挿入される切欠き部32の被係合部14は図示されていない)が形成され、選択基板6には、該被係合部14を挿入する凹部15(図4参照)が形成されていることが明らかとなる。
4 is a cross-sectional view taken along line IV-IV in FIG. As shown in FIG. 4, the engaged portion 14 that connects the opposing walls of the notch 32 is formed in the notch 32 formed in the protrusion 31 of the substrate support member 3. Further, a recessed portion 15 (sometimes referred to as an engaging portion in this specification) into which the engaged portion 14 is inserted is formed in a portion of the selection substrate 6 that is inserted into the notch portion 32. .
5 is a cross-sectional view taken along the line V-V in FIG. The selection substrate 6 shown in FIG. 5 is arranged so as to exist on the back of the protrusion 31 of the substrate support member 3. Thereby, it becomes apparent that the selection substrate 6 shown in FIG. 5 is inserted into the notch 32 formed in the protrusion 31 of the substrate support member 3.
FIG. 6 is a perspective view of the protrusion 31 of the substrate support member 3 as viewed obliquely from above. The engaged portion 14 (the selected substrate 6 is inserted in the figure) is inserted into the notch 32 formed in the protrusion 31. (The engaged portion 14 of the cutout portion 32 is not shown), and the selection substrate 6 is formed with a recess 15 (see FIG. 4) into which the engaged portion 14 is inserted. Becomes clear.

また、図7は、基板支持部材3(バックボード基板4は取り外されている)を正面(ロアーケース2の中央側)から観た図で、基板支持部材3の突起部31に形成された切欠き部32には、それぞれ、被係合部14が形成され、このうち図中右側端の切欠き部32に形成されている被係合部14は、他の切欠き部32に形成されている被係合部14と比べて図中上下方向に異なった位置に形成されるようになっている。したがって、基板支持部材3の図中右側端の切欠き部32に挿入される選択基板6(図6参照)も該被係合部14に対応した位置に凹部15(図4参照)が形成されるように構成されている。
このように構成した理由は、基板支持部材3の図中右側端の切欠き部32に挿入される選択基板6は、他の切欠き部32に挿入される選択基板6と種類が異なったものとなっており、他の異なる種類の選択基板6の配置箇所に誤って配置されるのを回避できるようにするためである。
このことから、基板支持部材3の切欠き部32に形成される被係合部14の位置は、必ずしも、図7に示すようにすることはなく、選択基板6の種類に応じて異なる位置に設けるようにしてもよい。
FIG. 7 is a view of the substrate support member 3 (with the backboard substrate 4 removed) as viewed from the front (the center side of the lower case 2), and is formed on the protrusion 31 of the substrate support member 3. Each notched portion 32 is formed with an engaged portion 14, and among these, the engaged portion 14 formed in the notched portion 32 at the right end in the figure is formed in another notched portion 32. It is formed at a position different in the vertical direction in the figure as compared with the engaged portion 14. Accordingly, the selection substrate 6 (see FIG. 6) inserted into the notch 32 at the right end of the substrate support member 3 in the figure also has a recess 15 (see FIG. 4) at a position corresponding to the engaged portion 14. It is comprised so that.
The reason for this configuration is that the selection substrate 6 inserted into the notch 32 at the right end in the figure of the substrate support member 3 is different in type from the selection substrate 6 inserted into the other notch 32. This is because it is possible to avoid misplacement of other different types of selection substrates 6 at the placement locations.
For this reason, the position of the engaged portion 14 formed in the notch 32 of the substrate support member 3 is not necessarily as shown in FIG. 7 and is different depending on the type of the selected substrate 6. You may make it provide.

そして、図8に示すように、基板支持部材3に形成された被係合部14を凹部15に挿入するようにして配置された選択基板6は、基板支持部材3から突出した選択基板6の側面を基板支持部材3の突起部31を押しながら反対の方向、すなわち、後方(図中α方向)に僅かにずらすことにより、該凹部15は該被係合部14から離脱させることができるようになっている。   Then, as shown in FIG. 8, the selection substrate 6 arranged so as to insert the engaged portion 14 formed on the substrate support member 3 into the recess 15 corresponds to the selection substrate 6 protruding from the substrate support member 3. The concave portion 15 can be detached from the engaged portion 14 by slightly shifting the side surface in the opposite direction, that is, in the backward direction (α direction in the figure) while pushing the protruding portion 31 of the substrate supporting member 3. It has become.

さらに、基板支持部材3は、図6に示すように、その上端部3aにおいて、切欠き部32の背面側に選択基板6が挿入される挿入孔17が形成され、該挿入孔17には、切欠き部32に選択基板6が挿入された際に、間隙部17’が設けられている。この間隙部17’は、たとえばドライバからなる工具の先端部をほぼ垂直方向に挿入する孔となっている。
選択基板6を、基板支持部材3に形成された切欠き部32に挿入させた状態でバックボード基板4に電気的に接続させた後において、基板支持部材3から容易に取り外すことができなかった場合に、工具を前記間隙部17’に挿入し、該工具を手前の方向に操作することによって、選択基板6を容易に取り出すことができるようになっている。
Further, as shown in FIG. 6, the substrate support member 3 has an insertion hole 17 into which the selection substrate 6 is inserted at the upper end portion 3 a on the back side of the notch 32. When the selection substrate 6 is inserted into the notch 32, a gap 17 'is provided. The gap portion 17 ′ is a hole for inserting a tip portion of a tool made of a driver, for example, in a substantially vertical direction.
After the selection substrate 6 was electrically connected to the backboard substrate 4 in a state of being inserted into the notch 32 formed in the substrate support member 3, it could not be easily removed from the substrate support member 3. In this case, the selection substrate 6 can be easily taken out by inserting a tool into the gap 17 'and operating the tool in the front direction.

図9は、図4に対応づけて描いた図であり、基板支持部材3に形成された間隙部17’にたとえばドライバ20からなる工具の先端部を挿入した場合を示している。間隙部17’は、基板支持部材3に形成された切欠き部32の背面に設けられていることから、基板支持部材3に邪魔されて間隙部17’が目視できなくても、容易に工具の先端部を該間隙部17’に挿入できるようになる。
図10は、ドライバ20を図中β方向に操作することによって、選択基板6が後方(図中α方向)へ容易に移動することを示している。ドライバ20を図中β方向に操作することによって、ドライバ20は、それが挿入された間隙部17’孔の近傍を支点として図中β方向に回動し、選択基板6の側端面に当接し、該選択基板6を前記切欠き部32(図6参照)から離脱する方向(図中α方向)へ押圧するようになる。したがって、選択基板6を基板支持部材3から容易に取り外せるようになっている。
FIG. 9 is a view drawn in association with FIG. 4, and shows a case where a tip portion of a tool composed of, for example, a driver 20 is inserted into a gap portion 17 ′ formed in the substrate support member 3. Since the gap portion 17 ′ is provided on the back surface of the cutout portion 32 formed in the substrate support member 3, even if the gap portion 17 ′ cannot be viewed by being obstructed by the substrate support member 3, the tool can be easily used. Can be inserted into the gap 17 '.
FIG. 10 shows that the selection substrate 6 can easily move backward (α direction in the figure) by operating the driver 20 in the β direction in the figure. By operating the driver 20 in the β direction in the figure, the driver 20 rotates in the β direction in the figure with the vicinity of the gap 17 ′ hole into which the driver 20 is inserted as a fulcrum, and comes into contact with the side end surface of the selection substrate 6. Then, the selection substrate 6 is pressed in a direction (α direction in the figure) to be removed from the notch 32 (see FIG. 6). Therefore, the selection substrate 6 can be easily detached from the substrate support member 3.

図11は、基板支持部材3を裏側(選択基板6が配置される側と反対側)から観た図である。図11において、選択基板6が配置される箇所に対応させて複数の透孔18が形成されている。図11では、選択基板6の数に相当する6個の透孔18が形成されている。しかし、この数に限定されることはなく、たとえば1個であってもよい。
基板支持部材3に形成された透孔18を通して、バックボード基板4の一部が目視されるようになっており、この部分に当該選択基板に対応する識別番号(識別符号)A〜Fが付与されるようになっている。このようにした場合、工事者がバックボード基板4に対して複数の選択基板6をどこの位置に接続すればよいかを確認し易くなるという効果を奏する。
FIG. 11 is a view of the substrate support member 3 as viewed from the back side (the side opposite to the side where the selection substrate 6 is disposed). In FIG. 11, a plurality of through holes 18 are formed corresponding to locations where the selection substrate 6 is disposed. In FIG. 11, six through holes 18 corresponding to the number of the selection substrates 6 are formed. However, it is not limited to this number and may be one, for example.
A part of the backboard substrate 4 can be seen through the through hole 18 formed in the substrate support member 3, and identification numbers (identification codes) A to F corresponding to the selected substrate are given to this portion. It has come to be. In such a case, there is an effect that it becomes easy for a construction worker to confirm where to connect the plurality of selected substrates 6 to the backboard substrate 4.

このように構成した基板の支持構造によれば、工事者が選択基板6を取り付ける際に、基板支持部材3より選択基板6の方が高さを有するため、壁に設置され、下から作業を行う場合でも、選択基板6を基板支持部材3の切欠き部32を目安にし、該切欠き部32に選択基板6を挿入でき該選択基板6をバックボード基板4に電気的に接続することができる。このため、作業性が向上できるという効果を奏する。
また、選択基板6を取り外す際には、基板支持部材3の突起部31を押しながら選択基板6を反対方向に押し出すことにより、容易に、選択基板6を取り外すことができるようになる。このため、斜めに引き抜かれることが回避され、コネクタ等の選択基板6の損傷を免れることができるようになる。
According to the substrate support structure configured as described above, when the construction worker attaches the selection substrate 6, the selection substrate 6 has a height higher than the substrate support member 3, so that it is installed on the wall and works from below. Even when the selection is performed, the selection substrate 6 can be inserted into the cutout portion 32 by using the cutout portion 32 of the substrate support member 3 as a guide, and the selection substrate 6 can be electrically connected to the backboard substrate 4. it can. For this reason, there exists an effect that workability | operativity can be improved.
Moreover, when removing the selection board | substrate 6, it becomes possible to remove the selection board | substrate 6 easily by pushing out the selection board | substrate 6 in the opposite direction, pressing the projection part 31 of the board | substrate support member 3. FIG. For this reason, it is avoided that the connector is pulled out at an angle, and damage to the selection substrate 6 such as a connector can be avoided.

以上、実施形態を用いて本発明を説明したが、本発明の技術的範囲は上記実施形態に記載の範囲には限定されないことは言うまでもない。上記実施形態に、多様な変更または改良を加えることが可能であることが当業者に明らかである。また、その様な変更または改良を加えた形態も本発明の技術的範囲に含まれ得ることが、特許請求の範囲の記載から明らかである。   As mentioned above, although this invention was demonstrated using embodiment, it cannot be overemphasized that the technical scope of this invention is not limited to the range as described in the said embodiment. It will be apparent to those skilled in the art that various modifications or improvements can be added to the above-described embodiments. Further, it is apparent from the description of the scope of claims that embodiments with such changes or improvements can also be included in the technical scope of the present invention.

1……装置、
2……ロアーケース、
3……基板支持部材、
3a……上端部、
31……突起部、
32……切欠き部、
4……バックボード基板、
5……第1コネクタ、
6……選択基板、
7……案内溝、
9……第2コネクタ、
10……取付金具、
11……金属板、
12……螺子、
14……被係合部
15……凹部(係合部)
17……挿入孔、
18……透孔、
20……ドライバ。
1 …… Device,
2 ... Lower case,
3 …… Substrate support member,
3a: upper end,
31 …… Protrusions,
32 …… Notch,
4 …… Backboard board,
5 …… First connector,
6 …… Selected board
7 …… Guide groove,
9 …… Second connector,
10 …… Mounting bracket,
11 …… Metal plate,
12 ... Screw,
14 ... engaged portion 15 ... recessed portion (engaging portion)
17 …… Insertion hole,
18 …… Through holes,
20: Driver.

Claims (4)

筐体の底面にほぼ垂直に設けられる基板支持部材と、
前記基板支持部材の一方の面に支持され、前記基板支持部材よりも高さの低いバックボード基板と、
前記筐体の底面にほぼ垂直に、かつ前記バックボード基板に直交して配置され、前記バックボード基板とコネクタを介して電気的に接続される複数の選択基板と、を有し、
前記基板支持部材は、上端部に切欠き部が形成され、
前記選択基板は、
前記基板支持部材よりも高さが高く形成され、
前記バックボード基板に前記コネクタを介して接続された際に、前記基板支持部材の前記切欠き部に挿入されることを特徴とする基板の支持構造。
A substrate support member provided substantially perpendicular to the bottom surface of the housing;
A backboard substrate supported on one surface of the substrate support member and having a lower height than the substrate support member;
A plurality of selection boards that are arranged substantially perpendicular to the bottom surface of the housing and orthogonal to the backboard board, and are electrically connected to the backboard board via connectors;
The substrate support member is formed with a notch at the upper end,
The selection substrate is:
The height is formed higher than the substrate support member,
A board support structure, wherein the board support structure is inserted into the notch of the board support member when connected to the backboard board via the connector.
前記基板支持部材は、
前記切欠き部の背面側に前記選択基板が挿入される挿入孔が形成され、
前記挿入孔には、前記切欠き部に前記選択基板が挿入された際に、ほぼ垂直方向に工具を挿入し得る間隙部が設けられることを特徴とする請求項1に記載の基板の支持構造。
The substrate support member is
An insertion hole into which the selection substrate is inserted is formed on the back side of the notch,
2. The substrate support structure according to claim 1, wherein the insertion hole is provided with a gap portion into which a tool can be inserted in a substantially vertical direction when the selection substrate is inserted into the notch. .
前記選択基板の前記基板支持部側の端側面に形成された係合部と、
前記選択基板が前記バックボード基板に接続される際に、前記前記基板支持部材に形成され前記選択基板の前記係合部が係合される被係合部と、を有し、
少なくとも一の選択基板の前記係合部および前記一の選択基板の前記係合部が係合される前記基板支持部材の一の被係合部は、
他の選択基板の前記係合部および前記他の選択基板の前記係合部が係合される前記基板支持部の他の被係合部と、異なる位置にあることを特徴とする請求項1、2のいずれかに記載の基板の支持構造。
An engagement portion formed on an end side surface of the selection substrate on the substrate support portion side;
An engagement portion formed on the substrate support member and engaged with the engagement portion of the selection substrate when the selection substrate is connected to the backboard substrate;
One engaged portion of the substrate support member to which the engaging portion of at least one selected substrate and the engaging portion of the one selected substrate are engaged is,
2. The position of the engaging portion of another selected substrate and the other engaged portion of the substrate supporting portion to which the engaging portion of the other selected substrate is engaged are different from each other. 3. The substrate support structure according to any one of 2 above.
前記基板支持部材は、
前記選択基板が配置される側と反対側の面に前記バックボード基板が露出される開口を有し、
露出されたバックボード基板面に前記選択基板に対応する識別符号を付与したことを特徴とする請求項1、2、3のいずれかに記載の基板の支持構造。
The substrate support member is
An opening through which the backboard substrate is exposed on a surface opposite to the side on which the selection substrate is disposed;
4. The substrate support structure according to claim 1, wherein an identification code corresponding to the selected substrate is given to the exposed backboard substrate surface.
JP2013067316A 2013-03-27 2013-03-27 Support structure of substrate Pending JP2014192378A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017062873A (en) * 2015-09-23 2017-03-30 豊田合成株式会社 Receiving connector illumination apparatus

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JPS62134289U (en) * 1986-02-18 1987-08-24
JPH02108386U (en) * 1989-02-16 1990-08-29
JPH10135666A (en) * 1996-10-30 1998-05-22 Yokogawa Electric Corp Printed board supporting device
JP2001111264A (en) * 1999-10-13 2001-04-20 Fuji Electric Co Ltd Information processor
JP2004088018A (en) * 2002-08-29 2004-03-18 Tdk Corp Electronic apparatus

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Publication number Priority date Publication date Assignee Title
JPS62134289U (en) * 1986-02-18 1987-08-24
JPH02108386U (en) * 1989-02-16 1990-08-29
JPH10135666A (en) * 1996-10-30 1998-05-22 Yokogawa Electric Corp Printed board supporting device
JP2001111264A (en) * 1999-10-13 2001-04-20 Fuji Electric Co Ltd Information processor
JP2004088018A (en) * 2002-08-29 2004-03-18 Tdk Corp Electronic apparatus

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017062873A (en) * 2015-09-23 2017-03-30 豊田合成株式会社 Receiving connector illumination apparatus

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