JP2014151017A5 - - Google Patents

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Publication number
JP2014151017A5
JP2014151017A5 JP2013023767A JP2013023767A JP2014151017A5 JP 2014151017 A5 JP2014151017 A5 JP 2014151017A5 JP 2013023767 A JP2013023767 A JP 2013023767A JP 2013023767 A JP2013023767 A JP 2013023767A JP 2014151017 A5 JP2014151017 A5 JP 2014151017A5
Authority
JP
Japan
Prior art keywords
filth
boundary surface
filth receiving
water
direction perpendicular
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2013023767A
Other languages
Japanese (ja)
Other versions
JP2014151017A (en
Filing date
Publication date
Application filed filed Critical
Priority to JP2013023767A priority Critical patent/JP2014151017A/en
Priority claimed from JP2013023767A external-priority patent/JP2014151017A/en
Publication of JP2014151017A publication Critical patent/JP2014151017A/en
Publication of JP2014151017A5 publication Critical patent/JP2014151017A5/ja
Pending legal-status Critical Current

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Description

第4の発明は、第3の発明において、前記ボウル部は、前記溜水面よりも上方に設けられ汚物を受ける汚物受け部と、前記溜水面と前記汚物受け部との間に設けられた凹部と、を有し、前記複数の照射部のうちの少なくとも2本は、前記汚物受け部と前記凹部との境界面を前記境界面に対して垂直な方向に前記裏面に向けて投影させた投影領域の範囲内に配置されたことを特徴とするトイレ装置である。

In a fourth aspect based on the third aspect, the bowl portion includes a filth receiving portion that is provided above the pooled water surface and receives the filth, and a recess provided between the pooled water surface and the filth receiving portion. And at least two of the plurality of irradiating portions project a boundary surface between the filth receiving portion and the concave portion toward the back surface in a direction perpendicular to the boundary surface. The toilet device is arranged within a region.

Claims (1)

前記ボウル部は、
前記溜水面よりも上方に設けられ汚物を受ける汚物受け部と、
前記溜水面と前記汚物受け部との間に設けられた凹部と、
を有し、
前記複数の照射部のうちの少なくとも2本は、前記汚物受け部と前記凹部との境界面を前記境界面に対して垂直な方向に前記裏面に向けて投影させた投影領域の範囲内に配置されたことを特徴とする請求項3記載のトイレ装置。
The bowl part is
A filth receiving portion that is provided above the water surface and receives filth;
A recessed portion provided between the water storage surface and the filth receptacle,
Have
At least two of the plurality of irradiating units are disposed within a range of a projection region in which a boundary surface between the filth receiving unit and the recess is projected toward the back surface in a direction perpendicular to the boundary surface. by claim 3 Symbol mounting of the toilet apparatus, characterized in that the.
JP2013023767A 2013-02-08 2013-02-08 Toilet device Pending JP2014151017A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2013023767A JP2014151017A (en) 2013-02-08 2013-02-08 Toilet device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013023767A JP2014151017A (en) 2013-02-08 2013-02-08 Toilet device

Publications (2)

Publication Number Publication Date
JP2014151017A JP2014151017A (en) 2014-08-25
JP2014151017A5 true JP2014151017A5 (en) 2016-03-10

Family

ID=51573496

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013023767A Pending JP2014151017A (en) 2013-02-08 2013-02-08 Toilet device

Country Status (1)

Country Link
JP (1) JP2014151017A (en)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02243121A (en) * 1989-03-17 1990-09-27 Inax Corp Cleaning device of toilet bowl by ozone
JP2002355194A (en) * 2001-05-30 2002-12-10 Shinei Kogyo:Kk Irradiation device for inside of toilet to accelerate photocatalytic reaction
JP2002364055A (en) * 2001-06-12 2002-12-18 Aisin Seiki Co Ltd Sanitary flushing seat device
JP2006316607A (en) * 2005-04-13 2006-11-24 Inax Corp Stainproof equipment and ultraviolet rays irradiation device
JP2013023766A (en) * 2011-07-26 2013-02-04 Hitachi Chemical Co Ltd Surface treatment method for conductive base material for mounting tape carrier-fitted semiconductor, conductive base material for mounting tape carrier-fitted semiconductor obtained by using the treatment method, and semiconductor package

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