JP2014146399A - Buffer member and electronic apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a buffer member capable of sufficiently reducing an impact to a storage device and facilitating the assembling work and replacing work, and to provide an electronic apparatus using the buffer member.SOLUTION: The buffer member 16 includes a frame body 30 and elastic pins 32 and 34. The frame body 30 includes three plate-like members 30a-30c disposed so as to cover three continuous side surfaces 12a-12c of a storage device 12, and at least one of the plate-like members is deformable. The pins 32 and 34 project inward from inner surfaces of two plate-like members 30a and 30c located on both sides of the frame body 30, and can engage with screw holes 28 as engaging holes disposed in the side surfaces 12a and 12c of the storage device 12. The buffer member 16 absorbs and reduces the impact from a housing 14 to the storage device 12.

Description

  The present invention relates to a buffer member that reduces an impact on a storage device mounted on an electronic device, and an electronic device using the buffer member.

  Storage devices such as magnetic disk devices, semiconductor memories, and optical disk devices are rapidly becoming smaller and lighter. Not only notebook personal computers (notebook PCs) but also tablet personal computers (tablet PCs) It is installed in various electronic devices such as portable music players.

  For example, a magnetic disk device writes data on a rotating magnetic disk while a slider on which a head is mounted floats at a very small interval. For this reason, when an external impact is applied in the recording operation mode, the distance between the head and the magnetic disk may change, or a positional deviation from the target track may occur, causing a write error.

  For this reason, a storage device such as a magnetic disk device itself has various impact resistance functions. However, even in an electronic device equipped with the storage device, a measure for reducing the impact on the storage device is required. . As a technique for reducing the impact on the storage device, the present applicant has proposed a configuration in which the impact of the magnetic disk device is reduced by a buffer member (see, for example, Patent Document 1).

JP 2008-282505 A

  By the way, it is desirable that an electronic device such as a notebook PC has a small amount of extra space inside the housing, so that it can easily mount and replace the storage device while having sufficient impact reduction performance. In addition, from the viewpoint of convenience and expandability, it is preferable that the storage device can be easily replaced in the electronic device.

  The present invention has been made in view of the above-described problems of the prior art, and can sufficiently reduce the impact on the storage device, and can easily perform assembly work and replacement work. And an electronic device using the buffer member.

  The shock-absorbing member according to the present invention is a shock-absorbing member that reduces an impact on the storage device mounted on the electronic device, and has three plate-like members arranged so as to surround three continuous side surfaces of the storage device. And at least one plate-like member configured to be deformable, and two plate-like members located on both sides of the frame to project inward from the inner surfaces of the frame member, and are provided on the side surface of the storage device. And an elastic pin that can be engaged with the engaging hole.

  The electronic device according to the present invention is an electronic device that is housed in a housing in a state in which the storage device is elastically supported using a buffer member, and the buffer member includes three continuous side surfaces of the storage device. A frame having three plate-like members arranged so as to surround the inner wall, and at least one plate-like member configured to be deformable, and the inner surfaces of the two plate-like members located on both sides of the frame An elastic body pin that protrudes in the direction and engages with an engagement hole provided on a side surface of the storage device, the pin being engaged with the engagement hole of the storage device, and at least the frame body The storage device is housed in the housing in a state in which upper and lower end surfaces of two plate-like members located on both sides are in contact with the housing.

  According to such a configuration, the buffer member covers the three side surfaces of the storage device with the three plate-like members while appropriately deforming the plate-like member, and engages the elastic pin with the engagement hole of the storage device. By combining them, they can be attached to a storage device. For this reason, the work of assembling and replacing the buffer member to the storage device can be performed very easily. In addition, since the pin is formed of an elastic body, the impact applied to the housing of the electronic device is absorbed by the pin and hardly transmitted to the storage device, and the impact on the storage device is sufficiently reduced. be able to.

  With the buffer member attached to the storage device, at least the upper and lower surfaces of the two plate-like members located on both sides of the frame body are above and below the upper and lower surfaces of the storage device. It is preferable to be in a protruding position. In addition, it is preferable that the upper surface and the lower surface of the storage device are in a position separated from the housing in a state where the storage device is housed in the electronic device. Then, when the storage device equipped with the buffer member is mounted in the electronic device, at least two plate-like members positioned on both sides are supported between the top plate and the bottom plate of the housing, and the storage device is an elastic body. The pin is elastically supported in a floating state in a suspended state in the casing. Therefore, even when an impact is applied to the housing, the storage device swings in a floating state, so that the impact transmitted to the storage device can be greatly reduced.

  A concave portion is provided on the inner peripheral surface of the engagement hole, and the pin is provided with a shaft portion protruding from the plate-like member, a diameter larger than the shaft portion, and provided on the distal end side. With the engaging claw portion that can be engaged, when the pin is inserted into the engaging hole, the engaging claw portion engages with the concave portion, so that the pin can be securely removed, and Since a click sound is generated between the engaging claw portion and the concave portion at the time of insertion, the engagement state can be easily grasped and the efficiency of the assembling work is further improved.

  In this case, if the engagement hole is a screw hole, the buffer member can be fixed by using a screw hole for fixing provided in a storage device such as a general magnetic disk device. In addition, if the engagement hole is a screw hole, the hole can be easily machined, and the engagement position with the pin can be provided in a plurality of stages, so that the assembly work is further facilitated and the stability after mounting is also improved. improves.

  When an elastic plate that contacts the side surface of the storage device is provided on the inner surface of the plate-like member that connects between the two plate-like members located on both sides of the frame body, the elastic plate absorbs the impact in the front-rear direction. But it can be absorbed.

  On the outer surface of the plate-like member that connects between the two plate-like members located on both sides of the frame body, there are protruding pieces having attachment holes for fixing the buffer member to the housing of the electronic device. It may be provided.

  According to the present invention, the work of assembling and replacing the buffer member to the storage device can be performed very easily. In addition, since the pin is formed of an elastic body, the impact applied to the housing of the electronic device is absorbed by the pin and hardly transmitted to the storage device, and the impact on the storage device is sufficiently reduced. be able to.

FIG. 1 is a perspective view showing a configuration of an electronic apparatus according to an embodiment of the present invention. FIG. 2 is an exploded perspective view of the storage device mounted on the electronic apparatus shown in FIG. 1 with the buffer member and the shield member according to the embodiment of the present invention removed. FIG. 3 is an exploded perspective view of the storage device shown in FIG. 2 with a shield member attached. 4 is a perspective view of the storage device shown in FIG. 3 with a buffer member attached thereto. FIG. 5 is a vertical cross-sectional view of the storage device elastically supported in a floating state on the housing via the buffer member. FIG. 6 is an operation diagram schematically showing an example of a method of attaching the buffer member to the storage device, and FIG. 6A shows a state in which one plate-like member is fixed to one side surface of the storage device. FIG. 6B is a diagram illustrating a state in which the other plate-like member is fixed to the other side surface of the storage device and the buffer member is fixed to the storage device from the state illustrated in FIG. . FIG. 7 is an enlarged vertical cross-sectional view of a main part showing a modification of the engagement hole that engages with the pin.

  Hereinafter, the buffer member according to the present invention will be described in detail with reference to the accompanying drawings by giving preferred embodiments in relation to an electronic apparatus using the buffer member.

  FIG. 1 is a perspective view showing a configuration of an electronic apparatus 10 according to an embodiment of the present invention. The electronic device 10 stores the storage device 12 including a magnetic disk device (hard disk drive: HDD) in a state in which the storage device 12 is elastically supported through the buffer member 16 in the housing 14, thereby the storage device 12 from the housing 14. The impact transmitted to the can be reduced. As the electronic device 10, various electronic devices such as a tablet PC and a portable music player can be exemplified in addition to the notebook PC. In addition to the magnetic disk device, the storage device 12 can be exemplified by various storage devices mounted on electronic equipment such as a semiconductor memory and an optical disk device.

  As illustrated in FIG. 1, the electronic device 10 is a general notebook PC, and includes a housing 14, a keyboard 18 disposed on a part of the top plate 14 a of the housing 14, and an upper surface of the housing 14. And a lid 20 that opens and closes. The housing 14 has a top plate 14a and a bottom plate 14b, and is a box that accommodates a substrate, an arithmetic device, a cooling device, a battery pack, and the like (not shown) inside, and a keyboard 18 is located above the opening of the top plate 14a. Is exposed. The lid 20 is provided so as to be rotatable with respect to the housing 14 by a hinge 22. A display 24 made of liquid crystal or the like is provided on the inner surface of the lid 20. In the case of this embodiment, the storage device 12 is housed and fixed via the buffer member 16 at a position on the right side of the keyboard 18 in the housing 14.

  Next, the structure of the buffer member 16 according to the present embodiment and the support structure of the storage device 12 using the same will be described.

  FIG. 2 is an exploded perspective view of the storage device 12 mounted on the electronic apparatus 10 shown in FIG. 1 with the buffer member 16 and the shield member 26 according to an embodiment of the present invention removed. 3 is an exploded perspective view of the storage device 12 shown in FIG. 2 with the shield member 26 attached thereto, and FIG. 4 is a perspective view of the storage device 12 shown in FIG. 3 with the buffer member 16 attached. It is. FIG. 5 is a longitudinal sectional view in a state where the storage device 12 is elastically supported by the housing 14 in a floating state via the buffer member 16.

  As described above, in the case of this embodiment, the storage device 12 is a magnetic disk device (hard disk drive: HDD), and two screw holes (engagement holes) 28 are provided on each of the left and right side surfaces 12a and 12c. ing. The screw hole 28 is a standard mounting hole generally provided in a magnetic disk device. In the storage device 12, the side surface 12b that is the rear surface in FIG. 2 is a flat surface, and the terminal block 29 to which a wiring connector (not shown) provided in the electronic device 10 is attached to and detached from the side surface 12d that is the front surface in FIG. Is provided.

  The shield member 26 is a thin metal electromagnetic shield film. The shield member 26 is fixed to the side surfaces 12a to 12c and the lower surface 12f of the storage device 12 excluding the side surface 12d and the upper surface 12e with a double-sided tape, an adhesive, or the like (see FIG. 3). The shield member 26 is formed with an escape hole 26 a for exposing the screw hole 28 of the storage device 12.

  As shown in FIGS. 2 to 4, the buffer member (impact absorbing bracket) 16 includes a U-shaped frame 30 formed by three plate-like members 30 a, 30 b, and 30 c, and both side portions of the frame 30. It comprises elastic pins 32 and 34 projecting inward and backward from the inner surfaces of the two plate-like members 30a and 30c facing each other at both ends.

  The frame body 30 is disposed so as to surround the three side surfaces 12a to 12c in which the three plate-like members 30a to 30c are continuous with respect to the storage device 12, respectively. The plate-like members 30a to 30c are integrally formed by, for example, a thin plate made of a resin material or a metal material, and the ends of the adjacent plate-like members 30a to 30c are bent at right angles to form a U-shape. The frame 30 is configured. Since the plate-like members 30a to 30c made of three thin plates are integrally formed, each of the plate-like members 30a to 30c can be elastically deformed at least in the swinging direction intersecting the longitudinal direction.

  That is, when the plate-like members 30a and 30c on both sides are grasped by hand and spread apart to both sides, the plate-like members (arms) 30a and 30c on both sides and the plate-like member (base) 30b on the center. The plate-like members 30a to 30c are elastically deformed with the base portion of the base as a base point, and the frame body 30 can be easily expanded (see also the two-dot chain line in FIG. 3 and FIG. 6). The frame body 30 may be configured as three plate-like members 30a to 30c by bending one long thin plate at a right angle at two locations.

  A protruding plate 36 is provided on the upper end surface of each plate-like member 30a-30c so as to protrude upward over most of the longitudinal direction. In the state where the buffer member 16 is attached to the storage device 12, the protruding plate 36 has a top end surface 37 a protruding above the upper surface 12 e of the storage device 12, for example, by about 0.75 mm, and the top plate 14 a of the housing 14. (See FIG. 5). Further, as is apparent from FIG. 5, the lower end surface 37 b of the plate-like members 30 a to 30 c protrudes below the lower surface 12 f of the storage device 12, for example, by about 0.75 mm with the buffer member 16 attached to the storage device 12. And comes into contact with the bottom plate 14b of the housing 14. By providing the protruding plate 36, the buffer member 16 can be easily positioned on the casing 14 (top plate 14a), and the shock absorbing performance is improved. Of course, the protruding plate 36 may be omitted, and the lower end surface of the frame 30 may be provided with the same material as the protruding plate 36.

  Although not shown in FIG. 5, not only the upper end surface 37a and the lower end surface 37b of the plate members 30a and 30c on both sides, but also the upper end surface 37a and the lower end surface 37b of the central plate member 30b are provided. The body 14 is in contact with and supported by the top plate 14a and the bottom plate 14b. However, the central plate-like member 30b does not necessarily need to be abutted and supported on the casing 14, and the plate-like members 30a and 30c on both sides provided with at least pins 32 and 34 are abutted and supported on the casing 14. It only has to be.

  A projecting piece 38 made of a thin metal plate projecting outward is provided at the center of the outer surface of the central plate-like member 30b. The protruding piece 38 is fixed to the plate-like member 30b by inserting the base end portion 38a into a hole 39 formed in the center of the plate-like member 30b and bending it vertically and horizontally (see FIG. 2). . A mounting hole 38b penetrating in the plate thickness direction is formed substantially at the center of the protruding piece 38 (see FIG. 3). The mounting hole 38b is a hole through which the fixing screw 40 is inserted when the storage device 12 to which the buffer member 16 is mounted is fixed to the housing 14 of the electronic device 10 (see FIGS. 1 and 5).

  On the inner surface of the central plate-like member 30b, a pair of elastic plates 41, 41 are provided on both sides of the hole 39 serving as a mounting portion for the protruding piece 38. The elastic plate 41 is a thin plate-like rubber sheet fixed to the plate-like member 30b, and is fixed to the plate-like member 30b by two-color molding similarly to the base portion 42 described later.

  Next, as shown in FIG. 2, the pins 32 and 34 protrude inward from two front and rear locations on the inner surface of the band-like base 42 fixed to the plate-like members 30 a and 30 c on both sides. . The pins 32 and 34 and the base 42 are formed of an elastic body made of a rubber material or the like. The pins 32 and 34 and the base 42 are fixed to the plate-like members 30a and 30c on both sides by two-color molding (double molding), and the pins 32 and 34 and the base 42 are integrally molded. More specifically, as shown in FIG. 5, the base portion 42 is formed in two colors so as to fill the stepped hole portion 44 in the plate thickness direction formed along the longitudinal direction of the plate-like members 30a and 30c. Pins 32 and 34 are projected on the inner surface side.

  As shown in FIG. 5, the pins 32 and 34 formed of an elastic body are provided on the distal end side with a shaft portion (intermediate portion) 46 protruding from the base portion 42 and a diameter larger than that of the shaft portion 46. An engagement claw portion (fitting portion, diameter-expanded portion) 48 that can be engaged with the concave portion 28 a of the screw hole 28 of the storage device 12 is provided. As a result, the pins 32 and 34 have a smooth stepped shape in which the diameter is once reduced by the shaft portion 46 from the proximal end side (base portion 42 side) to the distal end side, and then the diameter is increased again by the engaging claw portion 48. It has become. The shape of the pins 32 and 34 may be a shape provided with a ring-shaped engaging claw portion that extends from the proximal end side toward the distal end side with the same diameter and is expanded only at the distal end. A cylindrical shape having the same diameter or substantially the same diameter from the side to the tip side may be used.

  FIG. 6 schematically shows an example of a method for attaching the buffer member 16 to the storage device 12.

  When attaching the buffer member 16 to the storage device 12, first, of the plate-like members 30a and 30c on both sides, one plate-like member 30c is connected to the side surface 12c of the storage device 12 as shown in FIG. The pins 32 and 34 on the inner surface thereof are inserted into the screw holes 28 to enter appropriate positions, and the engaging claw portion 48 is engaged with the predetermined recess 28a. Prior to attaching the buffer member 16, a shield member 26 is attached to the storage device 12 in advance.

  Subsequently, as shown in FIG. 6A, the central plate-like member 30b and the other plate-like member 30a are deformed outward with the plate-like member 30c fixed to the side surface 12c of the storage device 12 as a base point. However, the inner surfaces of these plate-like members 30 a and 30 b are arranged corresponding to the side surfaces 12 a and 12 b of the storage device 12. In addition, in this embodiment, although the structure which all the plate-shaped members 30a-30c can deform | transform is illustrated, at least 1 is deformable among three plate-shaped members 30a-30c so that it may become clear from FIG. If so, it is possible to dispose the buffer member 16 (frame body 30) around the storage device 12.

  Then, as shown in FIG. 6B, the elastic plate 41 on the inner surface of the central plate member 30b is brought into contact with the side surface 12b of the storage device 12, and the pins 32 on the inner surface of the other plate member 30a. 34 is inserted into each screw hole 28 on the side surface 12a of the storage device 12 to enter an appropriate position, and the engagement claw portion 48 is engaged with a predetermined recess 28a. Thereby, since the buffer member 16 is fixed to the storage device 12, the plate-like members 30a and 30c on both sides are further pressed toward the storage device 12 side as necessary, and the plate-like members 30a and 30c are wobbled. The pins 32 and 34 are pushed into the inner part of the screw hole 28 to the position where they are not, and are engaged with the recess 28a.

  Thus, the fixing of the buffer member 16 to the storage device 12 is completed (see FIGS. 4, 5, and 6B).

  Subsequently, when attaching the storage device 12 to which the buffer member 16 is mounted to the electronic device 10, first, with the bottom plate 14b of the housing 14 removed, as shown in FIG. The storage device 12 on which the buffer member 16 is mounted is placed at a predetermined position. Then, the fixing screw 40 is inserted into the mounting hole 38b of the protruding piece 38 and fastened to a screw hole (not shown) on the top plate 14a side. If it does so, it will be in the state where the upper end surface 37a of plate-shaped member 30a-30c landed on the inner surface of the top plate 14a.

  Therefore, by fixing the bottom plate 14b using a set screw or the like (not shown), the lower end surfaces 37b of the plate-like members 30a to 30c are landed on the inner surface of the bottom plate 14b. It is pinched and supported while being stretched between the two. As a result, as shown in FIG. 5, the storage device 12 is elastically supported in a floating state in a suspended state in the housing 14 by the pins 32 and 34 that are elastic bodies. Therefore, even when an impact is applied to the housing 14, the storage device 12 swings in a floating state as indicated by an arrow in FIG. 5, so that the transmitted impact is greatly reduced. Become.

  As described above, the shock-absorbing member 16 according to the present embodiment has the three plate-like members 30a to 30c arranged so as to surround the three continuous side surfaces 12a to 12c of the storage device 12, and has at least one. Projecting inward from the inner surfaces of the frame 30 and the two plate-like members 30a and 30c located on both sides of the frame 30 and provided on the side surfaces 12a and 12c of the storage device 12, respectively. And elastic pins 32 and 34 that can be engaged with the screw holes 28 that are the engagement holes.

  Therefore, in the buffer member 16, the three plate members 30 a to 30 c are appropriately deformed, and the three plate members 30 a to 30 c cover the three side surfaces 12 a to 12 c of the storage device 12, and the elastic pins 32, 34 can be attached to the storage device 12 by engaging with the screw hole 28 of the storage device 12 (see FIG. 6). For this reason, the work of assembling and replacing the buffer member 16 to the storage device 12 can be performed very easily. In addition, since the pins 32 and 34 are made of an elastic body, the impact applied to the housing 14 of the electronic device 10 is absorbed by elastic shear deformation at the pins 32 and 34, and thus to the storage device 12. Is hardly transmitted, and the impact on the storage device 12 can be sufficiently reduced.

  Since the buffer member 16 forms a U-shaped frame 30 by the three plate-like members 30a to 30c, it is easy for an operator to hold it by hand and can be assembled to the storage device 12. Easy. On the other hand, when removing it from the storage device 12, it is necessary for an operator or the like to intentionally pull out the pins 32 and 34 of the plate-like members 30 a and 30 c on both sides from the screw holes 28. For this reason, it is possible to prevent the buffer member 16 from being unintentionally detached from the storage device 12, and when it is intended to be removed, it is only necessary to pull out the pins 32 and 34 from the screw hole 28. Therefore, replacement work and the like are easy.

  The buffer member 16 includes a frame body 30 and pins 32 and 34 fixed to the frame body 30, and has a structure of only one part in handling. For this reason, the buffer member 16 can be easily attached to the storage device 12 and has high mass productivity at the time of manufacture. Moreover, even when the buffer member 16 is attached to the storage device 12, only the thickness of the thin plate-like members 30a to 30c increases, and the increase in weight is small. For this reason, even if the storage space inside the housing 14 is small, the storage device 12 to which the buffer member 16 is attached can be easily stored, and the electronic device 10 can be reduced in size, thickness, and weight. It becomes possible.

  As shown in FIG. 5, the upper end surface 37a and the lower end surface 37b of at least two plate-like members 30a and 30c located on both sides of the frame 30 are stored in a state where the buffer member 16 is attached to the storage device 12. The positions of the device 12 protrude upward and downward from the upper surface 12e and the lower surface 12f, respectively. In other words, the upper surface 12e and the lower surface 12f of the storage device 12 are in a position separated from the housing 14 by, for example, about 0.75 mm in a state where the storage device 12 is housed in the electronic device 10.

  As a result, when the storage device 12 with the buffer member 16 mounted is mounted in the electronic apparatus 10, the plate-like members 30a and 30c are sandwiched and held between the top plate 14a and the bottom plate 14b of the housing 14. The storage device 12 is supported in a floating state in a suspended state in the housing 14 by the pins 32 and 34 that are supported and are elastic bodies. Therefore, even when an impact is applied to the housing 14, the storage device 12 swings in a floating state, so that the impact transmitted to the storage device 12 can be greatly reduced. In other words, in the buffer member 16, the spring constants of the pins 32 and 34 can be set and changed as appropriate simply by changing the diameters of the pins 32 and 34. Therefore, the cushioning member 16 is optimal for the storage device 12 having various weights and external shapes. It is possible to easily construct an impact absorbing structure having a large spring constant.

  A concave portion 28 a is provided on the inner peripheral surface of the screw hole 28 of the storage device 12, and the pins 32 and 34 have a shaft portion 46 protruding from the plate-like members 30 a and 30 c and a diameter larger than that of the shaft portion 46. And an engagement claw portion 48 that is provided on the distal end side and can be engaged with the recess 28a. Thereby, when the pins 32 and 34 are inserted into the screw holes 28, the engaging claws 48 engage with the recesses 28a, so that the pins 32 and 34 can be reliably prevented from coming off. Further, when the pins 32 and 34 are inserted, a click sound is generated between the engaging claw portion 48 and the uneven shape of the screw hole 28, so that the engagement state can be easily grasped and the efficiency of the assembling work is further improved. In addition, since the pins 32 and 34 are provided with a large-diameter engaging claw portion 48 on the tip side, the pins 32 and 34 are easily assembled to the screw holes 28 and are not easily detached. Stability is further improved.

  In this case, assuming that the engaging hole of the storage device 12 with which the pins 32 and 34 are engaged is the screw hole 28, the buffer member 16 is attached using the fixing screw hole 28 provided in a general magnetic disk device. Can be fixed and highly versatile. Further, when the engagement hole is the screw hole 28, the hole processing is facilitated, and the engagement position with the pins 32 and 34 can be provided in a plurality of stages, so that the engagement position can be easily adjusted. Further, since the clicking sound at the time of engagement is continuously generated, the assembling work is further facilitated.

  The engaging hole on the storage device 12 side for engaging the pins 32 and 34 may be other than the screw hole 28, and may be a hole having an uneven shape that can be engaged with the engaging claw portion 48 of the pins 32 and 34. That's fine. For example, as shown in FIG. 7, instead of the screw hole 28, a recess 50a may be formed as an engagement hole 50 formed at one place on the back side. Further, since the pins 32 and 34 and the engagement holes only need to be engageable (fitable) with each other, the uneven shapes (engagement claw portion 48 and recesses 28a and 50a) are not necessarily required. For example, a configuration in which the outer diameter of the pin, which is an elastic body, is formed to be slightly larger than the inner diameter of the engagement hole to prevent the pin from coming off may be employed.

  In the buffer member 16, an elastic plate 41 that contacts the side surface 12 b of the storage device 12 is provided on the inner surface of the central plate member 30 b that connects between the plate members 30 a and 30 c on both sides of the frame 30. For this reason, it is possible to effectively reduce the impact in the up / down / left / right and front / rear directions on the storage device 12 by the pins 32 and 34 of the left and right plate-like members 30a and 30c, and to further reduce the impact in the front / rear direction by the elastic plate 41. It becomes possible to do.

  It should be noted that the present invention is not limited to the above-described embodiment, and it is needless to say that the present invention can be freely changed without departing from the gist of the present invention.

  For example, in the said embodiment, the plate-shaped members 30a-30c which comprise the frame 30 of the buffer member 16 are integrally shape | molded by a thin plate member, and the structure which ensures the deformability at the time of the attachment to the memory | storage device 12. It was. However, for example, each of the plate members 30a to 30c is configured as a separate part, and the base portions of the plate members 30a and 30c on both sides and the center plate member 30b are connected by a hinge made of a thin plate member or the like. Further, it may be configured to ensure the deformability when attached to the storage device 12.

  In the above-described embodiment, the configuration in which the storage device 12 with the buffer member 16 attached is mounted and fixed in the housing 14 of the electronic device 10 is illustrated, but the storage device 12 is not provided in the housing 14. A structure that can be inserted into and removed from the slot may be used. In this structure, the protruding piece 38 can be used as a handle for pulling out the storage device 12.

DESCRIPTION OF SYMBOLS 10 Electronic device 12 Memory | storage device 12a-12d Side surface 12e Upper surface 12f Lower surface 14 Case 14a Top plate 14b Bottom plate 16 Buffer member 28 Screw hole 28a, 50a Recess 30 Frame body 30a-30c Plate-shaped member 32, 34 Pin 36 Projection plate 37a Top End face 37b Lower end face 38 Projection piece 38a Base end part 38b Mounting hole 40 Fixing screw 41 Elastic plate 42 Base part 46 Shaft part 48 Engagement claw part 50 Engagement hole

Claims (8)

A buffer member that reduces the impact on a storage device mounted on an electronic device,
A frame having three plate-like members arranged so as to surround three continuous side surfaces of the storage device, and configured to deform at least one plate-like member;
An elastic pin that protrudes inward from the inner surfaces of the two plate-like members located on both sides of the frame, and is engageable with an engagement hole provided on a side surface of the storage device;
A shock-absorbing member comprising: The shock-absorbing member according to claim 1,
With the buffer member attached to the storage device, at least the upper and lower surfaces of the two plate-like members located on both sides of the frame body are above and below the upper and lower surfaces of the storage device. A buffer member characterized by being in a protruding position. The shock-absorbing member according to claim 1 or 2,
A concave portion is provided on the inner peripheral surface of the engagement hole,
The pin has a shaft portion projecting from the plate-like member, and a buffer member having an engagement claw portion that is larger in diameter than the shaft portion and provided on the distal end side and engageable with the concave portion. . The shock-absorbing member according to claim 3,
The cushioning member, wherein the engagement hole is a screw hole. In the buffer member according to any one of claims 1 to 4,
A shock-absorbing member, characterized in that an elastic plate that abuts against a side surface of the storage device is provided on an inner surface of a plate-like member that connects between two plate-like members located on both sides of the frame. In the buffer member according to any one of claims 1 to 5,
On the outer surface of the plate-like member that connects between the two plate-like members located on both sides of the frame body, there are protruding pieces having attachment holes for fixing the buffer member to the housing of the electronic device. A shock-absorbing member provided. An electronic device that is housed inside a housing in a state in which the storage device is elastically supported using a buffer member,
The buffer member has three plate-like members arranged so as to surround three continuous side surfaces of the storage device, and a frame body configured to be capable of deforming at least one plate-like member;
An elastic pin that protrudes inward from the inner surfaces of the two plate-like members located on both sides of the frame body and is engageable with an engagement hole provided on a side surface of the storage device;
In the state where the pin is engaged with the engagement hole of the storage device and at least the upper and lower end surfaces of two plate-like members located on both sides of the frame body are in contact with the housing. Is housed in the housing. The electronic device according to claim 7, wherein
An electronic device, wherein the storage device is housed inside the electronic device, and an upper surface and a lower surface of the storage device are located apart from the housing.

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