JP2014138172A - Lamination type electronic component and electronic component built-in wiring plate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a lamination type electronic component in which consideration of directions of front and rear surfaces thereof is unnecessary in a loading process to a wiring plate or the like, and an electronic component built-in wiring plate incorporating the same.SOLUTION: In a lamination type electronic component which is formed by lamination while insulating a first conductor and a second conductor, first external electrodes 11, 12 conducted with the first conductor and second external electrodes 21, 22 conducted with the second conductor are respectively formed on a first principal surface A and a second principal surface B on both ends in the lamination direction. The first external electrodes 11, 12 and the second external electrodes 21, 22 are not brought into contact with each other. The first external electrode 11 and the second external electrode 21 are arranged facing diagonal corners, the first external electrode 12 is arranged facing the corner adjacent to the corner just behind the first external electrode 11, and the second external electrode 22 is arranged facing the corner diagonal to the corner faced by the first external electrode 12. In an electronic component built-in wiring plate incorporating the electronic component, a wiring pattern and the external electrode of the lamination type electronic component are connected by a via.

Description

  The present invention relates to a multilayer electronic component having a laminate in which a first conductor and a second conductor are laminated in a rectangular parallelepiped shape while being insulated from each other. More specifically, a first external electrode conducting with the first conductor and a second external electrode conducting with the second conductor on the first main surface and the second main surface, which are both ends in the stacking direction of the laminate, respectively. Regarding the multilayer electronic component in which the multilayer electronic component is formed, the electronic component built-in wiring board incorporating the multilayer electronic component is also targeted.

  As a conventional multilayer electronic component, there is one described in Patent Document 1. This type of electronic component is often mounted inside a wiring board. In the wiring board on which the multilayer electronic component is mounted, a via is formed to connect the conductor of the electronic component and the conductor pattern of the wiring board. For this reason, the external electrode for connecting with the via in the wiring board is formed on the surface of the electronic component. In the electronic component shown in FIG. 1 of Patent Document 1, a first external electrode and a second external electrode are formed on both the first main surface and the second main surface of the laminate. The first external electrode is electrically connected to the first conductor, and the second external electrode is electrically connected to the second conductor.

JP2012-080079A

  However, the conventional techniques described above have the following problems. In other words, the electronic component described in Patent Document 1 must be distinguished from the front and back when mounted inside the wiring board. This is because in the electronic component of Patent Document 1, the external electrodes connected to the same internal conductor are arranged at the same position on the front and back sides. For this reason, if the electronic parts are turned inside out and built in the wiring board, the positions of the external electrodes will be different. As a result, the connection between the via of the wiring board and the external electrode of the electronic component becomes insufficient.

  This will be described with reference to FIGS. FIG. 1 is a plan view showing the arrangement of external electrodes in a conventional electronic component. In FIG. 1, the positions of vias provided on the wiring board are overwritten so as to be connected to external electrodes. In FIG. 1, a first main surface of a conventional electronic component 101 appears. The first external electrode 102 is disposed at the upper left corner, and the second external electrode 103 is disposed at the lower right corner. In FIG. 1, via positions 104 and 105 on the wiring board on which the electronic component 101 is mounted are overwritten. The position 104 is a position where a via connected to the first external electrode 102 is formed, and the position 105 is a position where a via connected to the second external electrode 103 is formed.

  In the conventional electronic component 101, the first external electrode 102 and the second external electrode 103 are also disposed on the second main surface on the back surface side. The first external electrode 102 and the second external electrode 103 on the back surface side are respectively located directly behind the first external electrode 102 and the second external electrode 103 in FIG. Similarly, the positions 104 and 105 of the vias on the back side are also located directly behind the positions 104 and 105 in FIG.

  However, when the electronic component 101 is turned over and incorporated in the wiring board, the situation shown in FIG. FIG. 2 is a plan view when the electronic component 101 is turned upside down by half-rotating around the horizontal axis in FIG. In FIG. 2, the first external electrode 102 and the second external electrode 103 are arranged at positions different from those in FIG. 1. That is, the first external electrode 102 is disposed in the lower left corner, and the second external electrode 103 is disposed in the upper right corner. However, the via positions 104 and 105 are naturally the same as the positions in FIG. For this reason, the via protrudes from the external electrode. Even when the electronic component 101 is turned halfway around the vertical axis in FIG. 1 and turned upside down, the first external electrode 102 and the second external electrode 103 are merely interchanged in FIG. The same as FIG.

  For this reason, in the conventional electronic component 101, it was necessary to use for the mounting process to a wiring board in the state in which the front and back were aligned in the correct direction. Particularly in recent years, since the size of the electronic component 101 has become small enough to cut a few millimeters square in FIG. 1, the work of aligning the front and back of such a small electronic component 101 has been very complicated. It is also conceivable to devise the positions and sizes of the external electrodes and vias so that the connection between the vias and the external electrodes can be sufficiently obtained in either state of FIGS. However, it increases design constraints and is not very realistic.

  The present invention has been made to solve the above-described problems of the prior art. That is, the problem is to provide a multilayer electronic component that does not need to consider the direction of the front and back in the process of mounting on a wiring board or the like, and a wiring board with a built-in electronic component in which it is mounted.

  The multilayer electronic component of the present invention, which has been made for the purpose of solving this problem, has a laminated body in which a first conductor and a second conductor are laminated in a rectangular parallelepiped shape while being insulated from each other. A first external electrode formed on each of the first main surface and the second main surface, which are both ends in the stacking direction, and electrically connected to the first conductor in the stacked body, and on the first main surface and the second main surface Each having a second external electrode that is electrically connected to the second conductor inside the multilayer body and is not in contact with the first external electrode. The first external electrode and the second external electrode on the first main surface are: The first external electrode on the second main surface is located opposite to the corner on the first main surface facing the corner on the first main surface opposite to the corner facing the first external electrode. The second external electrode on the second main surface is arranged facing the corner located next to In which it is disposed facing the corner which is located diagonally with respect to a corner facing the first external electrode on the second major surface.

  In this multilayer electronic component, the relationship between the arrangement positions of the first external electrode and the second external electrode is constant regardless of the orientation of the front and back of the multilayer electronic component. For this reason, it is not necessary to manage the orientation of the front and back of the multilayer electronic component during the packaging process and the manufacturing process of the electronic component mounting wiring board.

  In the multilayer electronic component of the present invention, the first main surface and the second main surface are rectangular, and the first external electrode on the second main surface faces the first external electrode on the first main surface. It is desirable that it is arranged facing the corner located adjacent to the corner directly behind the corner across the long sides of the first main surface and the second main surface. This is advantageous in terms of the characteristics of the multilayer electronic component.

  In the multilayer electronic component of the present invention, the first external electrode on the first main surface, the first external electrode on the second main surface, and the first conductor are electrically connected to the first side surface of the multilayer body. A side conductor is formed, and a second external electrode on the first main surface, a second external electrode on the second main surface, and a second surface are disposed on the second side surface opposite to the first side surface in the multilayer body. It is desirable to form a second side conductor that conducts with the conductor. In this case, conduction between the first external electrode and the first conductor is established by the first side conductor. The second side conductor also has a similar function.

  In the multilayer electronic component of the present invention, the first external electrode and the second external electrode have a rectangular portion facing the corner of the first main surface or the second main surface, and the sides of the first main surface or the second main surface. It is desirable to form an L shape with a shoulder portion provided along the. This improves the mechanical strength of the multilayer electronic component. Furthermore, the multilayer electronic component of the present invention is preferably a multilayer ceramic capacitor.

  In addition, an electronic component built-in wiring board according to the present invention includes a core substrate in which a cavity opened on at least one surface is formed, any of the above-described multilayer electronic components housed in the cavity, the core substrate, And an insulating resin layer covering the surface of the mold electronic component on the side where the cavity is open, the first wiring pattern and the second wiring pattern provided on the insulating resin layer, and provided on the insulating resin layer The first via for connecting the first external electrode and the first wiring pattern and the second via for connecting the second external electrode and the second wiring pattern are provided.

  In the electronic component built-in wiring board of the present invention, further, the first via and the second via on the first main surface side of the multilayer electronic component are located at different positions as viewed from any side of the first main surface. The first via and the second via on the second main surface side of the multilayer electronic component are disposed at positions different from each other when viewed from any side of the second main surface. The first via on the first main surface side of the mold electronic component and the first via on the second main surface side are arranged at positions shifted in the direction along the side of the first main surface. It is desirable that the second via on the first main surface side and the second via on the second main surface side of the component are arranged at positions shifted in the direction along the side of the first main surface.

  According to the present invention, there are provided a multilayer electronic component that does not need to consider the orientation of the front and back sides in the process of mounting on a wiring board or the like, and an electronic component built-in wiring board in which it is mounted.

It is a top view which shows the problem by arrangement | positioning of the external electrode in the conventional wiring board (at the time of normal placement). It is a top view (at the time of backing) which shows the problem by arrangement of the external electrode in the conventional wiring board. 1 is a perspective view showing a multilayer electronic component according to an embodiment. It is sectional drawing of the multilayer electronic component which concerns on embodiment. 1 is a plan view of a multilayer electronic component according to an embodiment. It is sectional drawing which shows the structure of the wiring board which mounted the multilayer electronic component which concerns on embodiment inside. It is a top view of the multilayer electronic component which concerns on the modification of embodiment.

  DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments embodying the present invention will be described below in detail with reference to the accompanying drawings. The multilayer electronic component according to this embodiment is configured as shown in FIG. FIG. 3 is a perspective view showing the multilayer electronic component 1 according to this embodiment as seen through. In FIG. 3, the internal configuration of the multilayer electronic component 1 is omitted, and external electrodes and the like provided on the surface are shown. The inside of the multilayer electronic component 1 is a known multilayer ceramic capacitor, which is a rectangular parallelepiped laminate in which the first conductor layer and the second conductor layer are laminated while being insulated from each other.

  Among the six surfaces in FIG. 3, two surfaces having the largest area are both ends in the stacking direction of the first conductor, the second conductor, and the interlayer insulating layer in the multilayer electronic component 1. These two surfaces are called main surfaces of the multilayer electronic component 1. The main surface on the upper side (arrow A level) in FIG. 3 is called a first main surface A, and the main surface on the lower side (arrow B level) is called a second main surface B. The first main surface A and the second main surface B are both rectangular. In the multilayer electronic component 1, the long side of the first main surface A is about 900 to 1200 μm, the short side is about 700 to 800 μm, and the thickness is about 50 to 100 μm.

  On the first main surface A, the first external electrode 11 and the second external electrode 21 are formed. The first external electrode 11 is arranged facing the upper right corner in the first main surface A in FIG. The second external electrode 21 is disposed facing the lower left corner in the first main surface A. That is, the first external electrode 11 and the second external electrode 21 are disposed on the first main surface A so as to face corners that are located diagonally to each other. Of course, the first external electrode 11 and the second external electrode 21 are not in contact with each other. The first external electrode 11 and the second external electrode 21 are of a size having a side length of about 250 to 300 μm.

  The first external electrode 12 and the second external electrode 22 are also formed on the second main surface B which is the back surface of the first main surface A. The first external electrode 12 is disposed facing the upper left corner in the second main surface B in FIG. This position is not a position directly behind the position of the first external electrode 11 on the first main surface A. This is the position facing the corner located next to the corner at the true back side across the long side of the second main surface B. The second external electrode 22 on the second main surface B is disposed facing the lower right corner in the second main surface B. This position is also not a position directly behind the position of the second external electrode 21 on the first main surface A, but a corner located adjacent to the corner of the position directly behind the long side of the second main surface B. It is a position to face. Of course, also on the second main surface B, the first external electrode 12 and the second external electrode 22 are disposed so as to face corners located diagonally to each other. Further, the first external electrode 11 and the second external electrode 21 are not in contact with each other. Furthermore, the first external electrode 11, the second external electrode 21, the first external electrode 12, and the second external electrode 22 are all rectangular.

  In the multilayer electronic component 1, a first side conductor 13 and a second side conductor 23 are further formed on the side surface. The first side conductor 13 and the second side conductor 23 are provided on the side surfaces facing each other in the multilayer electronic component 1. That is, the first side conductor 13 and the second side conductor 23 are located opposite to each other on the first main surface A or the second main surface B. The side surface on which the first side conductor 13 is provided and the side surface on which the second side conductor 23 is provided are both side surfaces connected to the long sides of the first main surface A and the second main surface B. The first external electrode 11 and the first external electrode 12 are connected to the first side conductor 13, and the second external electrode 21 and the second external electrode 22 are connected to the second side conductor 23.

  A sectional view of the multilayer electronic component 1 is shown in FIG. FIG. 4 is a cross-sectional view of the multilayer electronic component 1 at the position XX in FIG. As shown in FIG. 4, the inside of the multilayer electronic component 1 is formed by alternately laminating the first conductor layers 14 and the second conductor layers 24 with the interlayer insulator 30 interposed therebetween. The first conductor layer 14 is connected to the first side conductor 13, the first external electrode 11, and the first external electrode 12. The second conductor layer 24 is connected to the second side conductor 23, the second external electrode 21, and the second external electrode 22. Thereby, the multilayer electronic component 1 functions as a multilayer capacitor. In FIG. 4, the thicknesses of the first side conductor 13, the first external electrode 11, the second side conductor 23, and the second external electrode 22 are exaggerated from the actual values for easy understanding. Further, the number of first conductor layers 14 and second conductor layers 24 is actually larger.

  In the multilayer electronic component 1, the first external electrode 11, the first external electrode 12, the second external electrode 21, and the second external electrode 22 are portions where vias are formed in the wiring board on which the multilayer electronic component 1 is mounted. is there. FIG. 5 is a plan view showing the positional relationship between these external electrodes and vias in the multilayer electronic component 1. In FIG. 5, a position 31 is a position where a via connected to the first external electrode 11 on the first main surface A is formed. Another position 33 on the first main surface A side is a position where a via connected to the second external electrode 21 is formed. On the second main surface side, a position 32 is a via formation position connecting to the first external electrode 12, and a position 34 is a via formation position connecting to the second external electrode 22.

  As can be seen from FIG. 5, when attention is paid to the two via positions 31 and 33 on the first main surface A side, these are offset arrangements having different distances when viewed from either the long side or the short side of the first main surface A. It has become. Similarly, also on the second main surface B side, the two via positions 32 and 34 are offset from each other with different distances when viewed from either the long side or the short side. Further, when focusing on the via positions 31 and 32 connected to the first conductor layer 14, they are not in a back-to-back relationship with each other, but are shifted in a direction along the long side (first side conductor 13). is there. In addition, the via positions 33 and 34 connected to the second conductor layer 24 are not directly opposite to each other but are shifted in the direction along the long side (second side conductor 23).

  Next, FIG. 6 shows a cross-sectional view of an electronic component built-in wiring board in which the multilayer electronic component 1 is mounted. A wiring board 40 in FIG. 6 includes the multilayer electronic component 1 and a core substrate 41. The core substrate 41 is formed with a cavity portion 42 that is a through hole. In the wiring board 40, the multilayer electronic component 1 is accommodated in the cavity portion 42. A portion of the cavity portion 42 that is not occupied by the multilayer electronic component 1 is filled with the filling resin 43.

  Interlayer insulating layers 44 and 45 are formed on the front and back surfaces of the core substrate 41 and the multilayer electronic component 1. Upper conductive layers 46 and 47 are further formed on the interlayer insulating layers 44 and 45. Intermediate conductor layers 48 and 49 are formed between the core substrate 41 and the interlayer insulating layers 44 and 45.

  FIG. 6 shows a cross-section at the YY position in FIG. A first via 35 is formed at a position on the first external electrode 11 of the multilayer electronic component 1 in the interlayer insulating layer 44. Needless to say, the first via 35 establishes electrical continuity between the first external electrode 11 and a part of the pattern 46A (first wiring pattern) in the upper conductor layer 46, and is located above the position 31 shown in FIG. is there. A second via 37 is formed at a position on the second external electrode 21 of the multilayer electronic component 1. The second via 37 is for establishing electrical connection between the second external electrode 21 and another pattern 46B (second wiring pattern) in the upper conductor layer 46, and is located on the position 33 shown in FIG. Although the first via 35 and the second via 37 are drawn side by side in FIG. 6, the first via 35 and the second via 37 are actually arranged offset with respect to both the long side and the short side as described in FIG. 5. Yes.

  Further, in FIG. 6, the vias are drawn as if the vias exist at positions directly behind the first via 35 and the second via 37. However, this gives priority to intuitive comprehension. Actually, the vias on the back side exist at the positions indicated as positions 32 and 34 in FIG. That is, it exists in the position which deviated from the position of the back of the first via 35 and the second via 37. In FIG. 6, the first conductor layer 14 and the second conductor layer 24 (see FIG. 4) inside the multilayer electronic component 1 are omitted.

  The multilayer electronic component 1 of the present embodiment has the following advantages due to the arrangement of the first external electrode 11, the second external electrode 21, the first external electrode 12, and the second external electrode 22 described above. In other words, there is no need to worry about both sides. Even if the multilayer electronic component 1 is turned upside down, the arrangement of the first external electrode 11, the second external electrode 21, the first external electrode 12, and the second external electrode 22 is substantially the same.

  Considering this in FIG. 3, it is as follows. Assume that the multilayer electronic component 1 in FIG. 3 is turned halfway around the VV axis. However, in this case, the first external electrode 11 and the first external electrode 12 are interchanged, and only the second external electrode 21 and the second external electrode 22 are interchanged, which is substantially equivalent to the state shown in FIG. . Further, it is assumed that the multilayer electronic component 1 in FIG. 3 is turned over by half rotation around the LL axis. Even in this case, the pair of the first external electrode 11 and the second external electrode 22, the pair of the first external electrode 12 and the second external electrode 21, the pair of the first side conductor 13 and the second side conductor 23 are included. Only three pairs are swapped. This is also substantially equivalent to the state of FIG. In addition to the case of turning over, the same is true for a case of half rotation in the plane. Therefore, when manufacturing the wiring board 40 of FIG. 6, it is not necessary to care about the front and back of the multilayer electronic component 1 in the process of housing the multilayer electronic component 1 in the cavity portion 42 of the core substrate 41.

  As described above in detail, in the multilayer electronic component 1 according to the present embodiment, the arrangement of the first external electrode 11, the second external electrode 21, the first external electrode 12, and the second external electrode 22 is as described above. It is arranged. For this reason, even if it is mounted on the wiring board 40 in an inverted state, there is no problem in via connectivity. Therefore, the multilayer electronic component 1 that is surely connected to the formed via is realized regardless of the orientation of the multilayer electronic component 1 at the time of mounting. Further, by arranging the vias in the wiring board 40 in the above-described offset arrangement, the electronic component built-in wiring board 40 with high reliability of via connection to the multilayer electronic component 1 is realized.

  For this reason, it is not necessary to manage the orientation of the front and back of the multilayer electronic component 1 in the manufacturing process of the wiring board 40. There is no need to correct the direction of the front and back of the multilayer electronic component 1 that is turned over. Similarly, when the manufacturer of the multilayer electronic component 1 ships the multilayer electronic component 1 to the manufacturer of the wiring board 40, the front and back of the multilayer electronic component 1 are managed when packaging and packaging the multilayer electronic component 1. There is no need.

  Note that this embodiment is merely an example, and does not limit the present invention. Therefore, the present invention can naturally be improved and modified in various ways without departing from the gist thereof. For example, the shape of the first external electrode and the second external electrode on the main surface of the multilayer electronic component 1 may be as shown in FIG. In the example of FIG. 7, shoulder portions 15 and 25 are added to the rectangular first external electrode 11 and second external electrode 21 along the side of the first main surface A or the second main surface B, respectively. ing. Here, the shoulder portions 15 and 25 are provided along the side along the first side conductor 13 and the second side conductor 23, that is, along the long side of the first main surface A or the second main surface B. The shoulder portions 15 and 25 also form part of the external electrodes of the multilayer electronic component 1. As a result, the overall shape of each external electrode is L-shaped. As a result, the mechanical strength of the multilayer electronic component 1 is improved as a whole, and cracks are less likely to occur during the mounting process on the wiring board 40 and the like.

  Further, the first side conductor 13 and the second side conductor 23 are not essential. Instead of providing the first side conductor 13 and the second side conductor 23, a through hole may be provided in the multilayer electronic component 1 to ensure conduction between the external electrode and the internal conductor.

  Further, the place where the first side conductor 13 and the second side conductor 23 are provided may be the short side surface instead of the long side surface described above. However, it is better to provide the first side surface conductor 13 and the second side surface conductor 23 on the long side surface as in the above-described embodiment. This is because the inductance of the multilayer electronic component 1 is generally lower, which is advantageous in terms of power consumption and high frequency characteristic capacity.

  Further, the wiring board 40 does not necessarily require all four vias connected to the external electrodes of the multilayer electronic component 1. At least one for the first external electrode 11 and the first external electrode 12 and at least one for the second external electrode 21 and the second external electrode 22 can be formed as the wiring board 40. Further, the cavity portion 42 may not be a through hole but may be a bottomed hole. Furthermore, the multilayer electronic component 1 may be mounted not on the core substrate 41 but on the plate surface.

1 Laminated electronic components (laminated body)
11 and 12 First external electrode 13 First side conductor 14 First conductor layer 15 Shoulder portions 21 and 22 Second outer electrode 23 Second side conductor 24 Second conductor layer 25 Shoulder portion 35 First via 37 Second via 40 Wiring Plate 46 Upper conductor layer A First main surface B Second main surface

Claims (7)

In a multilayer electronic component having a laminate in which a first conductor and a second conductor are laminated in a rectangular parallelepiped shape while being insulated from each other,
A first external electrode formed on each of the first main surface and the second main surface, which are both ends in the stacking direction of the stacked body, and electrically connected to the first conductor in the stacked body;
A second external electrode formed on each of the first main surface and the second main surface, electrically connected to the second conductor inside the laminate, and not in contact with the first external electrode;
The first external electrode and the second external electrode on the first main surface are arranged facing corners located diagonally on the first main surface,
The first external electrode on the second main surface is arranged facing a corner located next to a corner directly behind the corner on which the first external electrode on the first main surface faces,
The laminated type wherein the second external electrode on the second main surface is disposed facing a corner located diagonally with respect to the corner on which the first external electrode on the second main surface faces Electronic components. The multilayer electronic component according to claim 1,
The first main surface and the second main surface are rectangular;
The first external electrode on the second main surface has a long side of the first main surface and the second main surface with respect to a corner directly behind the corner facing the first external electrode on the first main surface. A multilayer electronic component characterized by being disposed facing a corner located next to each other. In the multilayer electronic component according to claim 1 or 2,
A first side surface conductor is formed on the first side surface of the multilayer body to electrically connect the first external electrode on the first main surface, the first external electrode on the second main surface, and the first conductor. ,
A second external electrode on the first main surface, a second external electrode on the second main surface, and the second conductor on a second side surface opposite to the first side surface in the laminate. A multilayer electronic component, wherein a second side conductor to be conducted is formed. In the multilayer electronic component according to any one of claims 1 to 3,
The first external electrode and the second external electrode are provided along a rectangular portion facing a corner of the first main surface or the second main surface, and a side of the first main surface or the second main surface. A laminated electronic component characterized in that the shoulder portion is L-shaped. In the multilayer electronic component according to any one of claims 1 to 4,
The multilayer electronic component according to claim 1, wherein the multilayer body is a multilayer ceramic capacitor. A core substrate having a cavity open on at least one surface;
The multilayer electronic component according to any one of claims 1 to 5, which is housed in the cavity,
In the electronic component built-in wiring board having the core substrate and the insulating resin layer covering the surface of the multilayer electronic component on the side where the cavity is opened,
A first wiring pattern and a second wiring pattern provided on the insulating resin layer;
A first via that is provided in the insulating resin layer and connects the first external electrode and the first wiring pattern; and a second via that connects the second external electrode and the second wiring pattern. An electronic component built-in wiring board. In the electronic component built-in wiring board according to claim 6,
The first via and the second via on the first main surface side of the multilayer electronic component are arranged at positions different from each other when viewed from any side of the first main surface,
The first via and the second via on the second main surface side of the multilayer electronic component are arranged at positions different from each other when viewed from any side of the second main surface,
The first via on the first main surface side and the first via on the second main surface side of the multilayer electronic component are arranged at positions shifted in a direction along the side of the first main surface. And
The second via on the first main surface side and the second via on the second main surface side of the multilayer electronic component are arranged at positions shifted in a direction along the side of the first main surface. An electronic component built-in wiring board, characterized in that

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