JP2014129905A - Refrigeration device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To make it possible to cool an electronic component more effectively in a refrigeration device including a cooler that cools the electronic component.SOLUTION: A refrigeration device includes: a compressor (2); a condenser (3); an expansion valve (4); and an evaporator (5), and also includes: a power supply device (P) for supplying electric power to a drive motor (2b) of the compressor (2); and a cooler (30) including a channel (37) for circulating refrigerant, and for cooling electronic components (Tr, Dw, Dr) by introducing liquid-based refrigerant into the channel (37) and flowing out gas-based refrigerant. The electronic components (Tr, Dw, Dr) are attached to face the channel (37) below the cooler (30).

Description

  The present invention relates to a refrigeration apparatus, and more particularly to a refrigeration apparatus including a cooler that cools electronic components of a power supply apparatus that supplies electric power to a compressor driving motor.

  Conventionally, in a refrigeration apparatus such as an air conditioner, a power supply circuit to which a power device such as a diode or a transistor is connected is used as a power supply apparatus that supplies power to a compressor or the like. Since these power devices generate heat during the energization operation and become high temperature, some of the refrigeration apparatuses employ a configuration in which the power device is cooled by the refrigerant downstream of the condenser in the refrigerant circuit (for example, patents). Reference 1).

JP-A-62-69066

  The refrigerant in the refrigerant circuit may flow in a two-phase state of a gas refrigerant and a liquid refrigerant. Since the liquid refrigerant has a higher density than the gas refrigerant and can evaporate and absorb heat, the liquid refrigerant is more gas refrigerant. The electronic component can be cooled more effectively than the above. Therefore, when the electronic component attached to the cooler exchanges heat with the gas refrigerant when the refrigerant is in a two-phase state, the size of the cooler is increased in order to cool the electronic component well. It is not preferable because measures such as these are required.

  The present invention has been made paying attention to the above points, and in the refrigeration apparatus including the cooler for cooling the electronic parts of the power supply apparatus that supplies power to the motor for driving the compressor, the electronic parts are more effective. The purpose is to be able to cool.

In order to solve the above-mentioned problem, the first invention
A power supply device (P) that includes a compressor (2), a condenser (3), an expansion valve (4), and an evaporator (5), and supplies power to the drive motor (2b) of the compressor (2) ), And a flow path (37) for circulating the refrigerant, the refrigerant containing the liquid is introduced into the flow path (37), and the refrigerant containing the gas flows out to constitute the power supply device (P). In a refrigeration system equipped with a cooler (30) for cooling electronic components (Tr, Dw, Dr),
The electronic parts (Tr, Dw, Dr) are mounted on the lower side of the cooler (30) so as to face the flow path (37).

  In this configuration, when the refrigerant is in a two-phase state, the liquid refrigerant is in contact with the channel (37) and the gas refrigerant is in contact with the channel (37). That is, the electronic component (Tr) exchanges heat with the liquid refrigerant.

In addition, the second invention,
In the refrigeration apparatus of the first invention,
In the cooler (30), an electronic component (Dr) having a heat generation density smaller than that of the electronic component (Tr) attached to the lower side is attached so as to face the upper side of the flow path (37). Features.

  In this configuration, the electronic component (Dr) having a smaller heat generation density than the electronic component (Tr) attached to the lower side exchanges heat with the gas refrigerant.

In addition, the third invention,
In the refrigeration apparatus of the first or second invention,
The cooler (30) has a plurality of flow paths (37) formed therein.

  According to the first invention, since the electronic component (Tr) reliably exchanges heat with the liquid refrigerant, the electronic component (Tr) can be cooled more effectively.

  Further, according to the second invention, the electronic component (Dr) attached to the upper side of the cooler (30) has a lower heat generation density than the electronic component (Tr) attached to the lower side, so that the gas refrigerant can also be used. Desired cooling can be performed.

FIG. 1 shows a refrigerant circuit of a refrigeration apparatus according to an embodiment of the present invention. FIG. 2 shows an electric circuit of a power supply device that supplies power to the motor. FIG. 3 is a perspective view of the cooler. FIG. 4 is a cross-sectional view of the cooler. FIG. 5 is a longitudinal sectional view of the cooler. FIG. 6 shows an electronic component package attached state. FIG. 7 is a perspective view illustrating an attachment state of the electronic component package (switching element) to the cooler. FIG. 8 is a perspective view illustrating an attachment state of the electronic component package (diode) to the cooler. FIG. 9 shows the state of the refrigerant in the cooler when the refrigerant is in a two-phase state.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. The following embodiments are essentially preferable examples, and are not intended to limit the scope of the present invention, its application, or its use.

<< Embodiment of the Invention >>
FIG. 1 shows a refrigerant circuit of a refrigeration apparatus according to an embodiment of the present invention. The refrigeration apparatus in the figure shows a refrigerant circuit of a large air conditioner used in a large-scale facility such as a factory. The air conditioning apparatus (1) (refrigeration apparatus) shown in the figure includes a compressor (2), a condenser (3), an expansion valve (4), an evaporator (5), and a controller (7).

  The compressor (2) houses therein a compression mechanism (2a) and a three-phase motor (2b) that rotationally drives the compression mechanism (2a) as indicated by broken lines. The condenser (3) is an air-cooled condenser and is disposed outdoors. An air cooling fan (3a) is provided in the vicinity of the condenser (3). The expansion valve (4) is an electric expansion valve with a variable opening degree whose valve body is driven by a pulse motor. The evaporator (5) is an air-cooled evaporator and is disposed indoors. An air cooling fan (5a) is provided in the vicinity of the evaporator (5).

  In the air conditioner (1), the compressor (2), the condenser (3), the expansion valve (4), and the evaporator (5) are sequentially connected to the closed circuit by the refrigerant pipe (6). (10), and the refrigerant is sent from the compressor (2) to the condenser (3). The condenser (3) exchanges heat with the outside air to dissipate the heat. While adjusting the pressure with the expansion valve (4), heat is exchanged with the indoor air by the evaporator (5) to absorb the heat and return to the compressor (2) as a gas refrigerant.

  A controller (7) is connected to the compressor (2), the air cooling fan (3a) of the condenser (3), the expansion valve (4), and the air cooling fan (5a) of the evaporator (5). 7) controls the number of revolutions of the three-phase motor (2b) of the compressor (2), the number of revolutions of the air cooling fans (3a, 5a), and the opening degree of the expansion valve (4).

  Next, FIG. 2 shows an electric circuit of the power supply device (P) that supplies power to the motor (2b) that rotationally drives the compression mechanism (2a) of the compressor (2). As shown in the figure, the power supply device (P) includes a converter unit (11), a smoothing capacitor (12), and an inverter (13).

  The converter unit (11) is configured by connecting six diodes (Dr) in a bridge shape, and converts the three-phase AC of the three-phase AC power source (15) into DC. The smoothing capacitor (12) smoothes the DC voltage converted by the converter unit (11). The inverter (13) converts the DC voltage smoothed by the smoothing capacitor (12) into a three-phase AC voltage. In this example, the inverter (13) has six switching elements (Tr) and six free-wheeling diodes (Dw) connected in antiparallel to each of the switching elements (Tr). The switching element (Tr) is composed of, for example, an IGBT (Insulated Gate Bipolar Transistor).

  In this example, it is assumed that a plurality of sets of switching elements (Tr) and freewheeling diodes (Dw) connected in reverse parallel thereto (referred to as component pairs for convenience of explanation) are enclosed in one package. Specifically, two pairs of components are enclosed in each electronic component package (16). That is, the air conditioner (1) includes three electronic component packages (16) because the inverter (13) has six switching elements (Tr). One diode (Dr) is enclosed in one electronic component package (17). Therefore, in the present embodiment, there are six electronic component packages (17).

  In the power supply device (P), the three-phase AC voltage converted by the inverter (13) is supplied to the three-phase motor (2b) for driving the compression mechanism (2a). The controller (7) controls the six switching elements (Tr) built in the inverter (13) so as to control the current (iu, iv, iw) flowing in each phase of the three-phase motor (2b). A signal (CNT) is output to control the rotation speed of the three-phase motor (2b).

  Returning to FIG. 1, the refrigerant circuit (10) of the air conditioner (1) includes a cooler (30) for cooling the converter unit (11) and the inverter (13) of the power supply device (P). In parallel with the expansion valve (4). The switching element (Tr), the freewheeling diode (Dw), and the diode (Dr) generate heat and become high temperature during their energization operation. The cooler (30) cools these electronic components constituting the power supply device (P). In this example, the electronic components cooled by the cooler (30) are a switching element (Tr), a free wheel diode (Dw), and a diode (Dr). Note that the diode (Dr) for the converter unit (11) has a lower heat generation density than the switching element (Tr). Even when viewed in units of the electronic component package (16, 17), the electronic component package (17) used for the converter unit (11) has a lower heat generation density than the electronic component package (16) used for the inverter (13). .

  A refrigerant pipe (23) branched from a refrigerant pipe (6) connecting the condenser (3) and the expansion valve (4) is connected to the cooler (30). A refrigerant cooling expansion valve (22) is provided in the middle of the refrigerant pipe (23) in order to control the flow rate and pressure of the refrigerant flowing through the cooler (30). And a refrigerant | coolant piping (25) is connected to a cooler (30), and this refrigerant | coolant piping (25) merges with the refrigerant | coolant piping (6) which connects an expansion valve (4) and an evaporator (5). A solenoid valve (27) and a capillary (28) are provided in the middle of the refrigerant pipe (25).

<Cooler configuration>
FIG. 3 is a perspective view of the cooler (30). 4 is a transverse sectional view of the cooler (30), and FIG. 5 is a longitudinal sectional view of the cooler (30). As shown in FIGS. 3 to 5, the cooler (30) includes an upper outer plate (32), a lower outer plate (33), a plurality of fins (34), and two pipe mounting members (36). Yes.

  The upper outer plate (32) is formed by bending a plate material (for example, a copper plate), and its cross-sectional shape is U-shaped with a flat bottom portion (32a). As will be described in detail later, an electronic component package (17) enclosing a diode (Dr) (electronic component) is attached to the upper outer plate (32), and the diode (Dr) heat is transferred to the refrigerant.

  The lower outer plate (33) is made of a flat plate material (for example, a copper plate). As will be described in detail later, an electronic component package (16) enclosing a switching element (Tr) and a freewheeling diode (Dw) is attached to the lower outer plate (33), and these electronic components (Tr, Dw) Transfer heat to the refrigerant.

  The pipe mounting member (36, 36) is a member for mounting the refrigerant pipe (23, 25). In this example, the pipe mounting members (36, 36) are formed in a block shape with the same material as the upper outer plate (32) and the like, and are provided with holes for inserting the refrigerant pipes (23, 25).

  The fin (34) transfers heat from the upper outer plate (32) and the lower outer plate (33) to the refrigerant, thereby exchanging heat between the refrigerant and the electronic components (for example, the switching element (Tr) and the reflux diode (Dw)). Has the function of promoting The fins (34) are arranged in parallel with each other at a predetermined interval between the bottom (32a) of the upper skin (32) and the lower skin (33), and the upper skin (32) ( Specifically, it is connected to the bottom (32a)) and the lower outer plate (33). With this configuration, the space between the fins (34) facing each other serves as a flow path (37) through which the refrigerant flows. Further, the fin (34) can transfer heat with the upper outer plate (32) and the lower outer plate (33). In the present embodiment, the material of the fin (34) is the same as that of the upper outer plate (32). Of course, the material of the fin (34) is not limited to this.

<Mounting of electronic components to the cooler and placement of the cooler>
FIG. 6 shows an electronic component mounting state in the present embodiment. FIG. 6 is a view of the cooler (30) from the arrow A in FIG.

  FIG. 7 is a perspective view illustrating an attachment state of the electronic component package (16) (switching element (Tr)) to the cooler (30). As shown in the figure, three electronic component packages (16) are attached to the lower outer plate (33). Thereby, in the cooler (30), the lower outer plate (33) transfers the heat of the six switching elements (Tr) and the six freewheeling diodes (Dw) to the refrigerant in the cooler (30). Note that thermal grease may be applied between the electronic component package (16) and the lower outer plate (33). FIG. 8 illustrates an attachment state of the electronic component package (17) (diode (Dr)) to the cooler (30). As shown in FIG. 8, in this embodiment, six electronic component packages (17) are attached to the upper outer plate (32). Thermal grease may be applied between the electronic component package (17) and the upper outer plate (32).

  The cooler (30) is disposed in the air conditioner (1) so that the lower outer plate (33) is horizontal and the lower outer plate (33) is downward. That is, in this example, the flow path (37) is in the horizontal direction.

<Cooling electronic components>
When the compressor (2) is operated, a part of the refrigerant after passing through the condenser (3) bypasses the expansion valve (4), and the refrigerant cooling expansion valve (22) and cooler (30) And then flows into the evaporator (5) via the capillary (28).

  In the cooler (30), the refrigerant from the condenser (3) cools the six switching elements (Tr) and the six diodes (Dw) of the converter section (11) in the lower outer plate (33). To do. The upper outer plate (32) cools the diode (Dr) of the converter unit (11). The refrigerant flowing into the cooler (30) may be in a two-phase state of a gas refrigerant and a liquid refrigerant depending on the operating state of the air conditioner (1). FIG. 9 shows the state of the refrigerant in the cooler (30) when the refrigerant is in a two-phase state. As shown in FIG. 9, when the refrigerant is in a two-phase state, the liquid refrigerant is in contact with the lower outer plate (33), and the gas refrigerant is in contact with the upper outer plate (32). That is, the switching element (Tr) exchanges heat with the liquid refrigerant via the lower outer plate (33), and the diode (Dr) of the converter unit (11) exchanges heat with the gas refrigerant via the upper outer plate (32). Exchange. That is, in this embodiment, the switching element (Tr) is cooled with the liquid refrigerant, and the diode (Dr) having a heat generation density smaller than that of the switching element (Tr) is cooled with the gas refrigerant.

<Effect in this embodiment>
Since the liquid refrigerant has a density higher than that of the gas refrigerant and can evaporate and absorb heat, the liquid refrigerant can cool the electronic component more effectively than the gas refrigerant. In the present embodiment, even when the refrigerant is in a two-phase state, the switching element (Tr) reliably exchanges heat with the liquid refrigerant. Therefore, according to the present embodiment, the electronic components (switching element (Tr), freewheeling diode (Dw)) can be cooled more effectively.

  The diode (Dr) exchanges heat with the gas refrigerant when the refrigerant is in a two-phase state. Since the diode (Dr) has a lower heat generation density than the switching element (Tr) attached to the lower outer plate (33), it is possible to perform desired cooling with a gas refrigerant.

<< Other Embodiments >>
The internal structure of the cooler (30) is an example. For example, the number and shape of the fins (34) are examples, and the fins (34) are not necessarily provided.

  The number of electronic component packages (16, 17) attached to the cooler (30) is also an example.

  Moreover, the electronic component cooled with the cooler (30) shown by the said embodiment is an illustration. In addition, for example, a reactor, a capacitor, a discharge resistor, or the like may be used.

  The arrangement of the cooler (30) in the refrigerant circuit is also an example. The arrangement of the cooler (30) in the refrigerant circuit may be, for example, between the condenser (3) and the expansion valve (4), or between the expansion valve (4) and the evaporator (5). .

  The present invention is useful as a refrigeration apparatus including a cooler that cools electronic components of a power supply apparatus that supplies power to a motor for driving a compressor.

DESCRIPTION OF SYMBOLS 1 Air conditioning apparatus 2 Compressor 2b Motor 3 Condenser 4 Expansion valve 5 Evaporator 30 Cooler 37 Flow path

Claims (3)

A power supply device (P) that includes a compressor (2), a condenser (3), an expansion valve (4), and an evaporator (5), and supplies power to the drive motor (2b) of the compressor (2) ), And a flow path (37) for circulating the refrigerant, the refrigerant containing the liquid is introduced into the flow path (37), and the refrigerant containing the gas flows out to constitute the power supply device (P). In a refrigeration system equipped with a cooler (30) for cooling electronic components (Tr, Dw, Dr),
The electronic component (Tr, Dw, Dr) is mounted on the lower side of the cooler (30) so as to face the flow path (37). The refrigeration apparatus of claim 1,
In the cooler (30), an electronic component (Dr) having a heat generation density smaller than that of the electronic component (Tr) attached to the lower side is attached so as to face the upper side of the flow path (37). Refrigeration equipment characterized. In the refrigeration apparatus according to claim 1 or 2,
The refrigerator (30) has a plurality of the flow paths (37) formed therein, and a refrigeration apparatus characterized in that

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