JP2014116637A - Light-emitting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a light-emitting device that suppresses light absorption, is excellent in light extraction efficiency, and is highly reliable.SOLUTION: A conductor wiring formed in a mounting area is covered by a first light reflection resin layer (108), a conductor wiring formed around the mounting area is covered by a second light reflection resin layer (120), and at least a part of a wiring (112) is covered by the second light reflection resin layer (120).

Description

  The present invention relates to a light-emitting device that can be used as a light source for a lighting device and a display device, and more particularly to a light-emitting device that has excellent light extraction efficiency and high reliability.

  Conventionally, various lighting devices and display devices using a light-emitting element (also referred to as a semiconductor light-emitting element) as a light source have been developed, and means for improving light output have been studied. For example, Patent Literature 1 describes a light emitting device 950 shown in FIG. FIG. 11A is a top view illustrating a schematic configuration of a conventional light emitting device 950, and FIG. 11B is a schematic diagram illustrating a manufacturing process of the light emitting device 950. FIG.

  A conventional method for manufacturing a light emitting device 950 includes a step of placing a light emitting element 969 on a conductor wiring 965 formed on a substrate 974 and electrically connecting the light emitting element 969 and the conductor wiring 965 using a wire 976. A step of forming a light reflecting resin 960 that reflects light from the light emitting element 969 on the substrate 974 so as to cover a part of the conductor wiring 965 and surround the light emitting element 969, and the light reflecting resin 960. And a step of forming a sealing member (not shown) so as to cover the light emitting element 969 after curing. The light reflecting resin 960 is formed using a resin discharge device 972 as shown in FIG.

JP 2009-182307 A (released on August 13, 2009)

  However, the conventional light emitting device 950 has a problem that light extraction efficiency is poor due to light absorption due to the structure of the light emitting device 950.

  In general, since it is difficult to reduce the size of a light emitting device, the size of the light emitting device itself is limited. However, in order to improve the light output, it is necessary to mount a large number of light emitting elements on a substrate with a small area. . When a large number of light emitting elements 969 are mounted in the conventional light emitting device 950, the routing of the conductor wiring becomes complicated, and the conductor wiring is formed at the center of the light emitting portion, or a plurality of conductor wirings are formed. become. For this reason, in addition to light absorption by the conductor wiring 965, light absorption by the conductor wiring occurs, so that the light extraction efficiency deteriorates.

  Furthermore, the above light absorption causes a problem of low reliability because it causes chromaticity deviation, chromaticity variation, a decrease in light output, and non-uniform light emission.

  The present invention has been made in view of the above-described conventional problems, and an object thereof is to provide a light-emitting device that suppresses light absorption, has excellent light extraction efficiency, and has high reliability.

  In order to solve the above problems, a light-emitting device according to one embodiment of the present invention is configured to be electrically connected to a substrate having a single-layer structure in which a conductive member is partially formed on a surface and the conductive member. A plurality of light emitting elements mounted directly on the surface of the substrate, a first light reflecting resin layer made of a first resin having light reflection characteristics, and the substrate so as to surround a mounting region on which the plurality of light emitting elements are mounted. A second light-reflecting resin layer made of a second resin having a light-reflecting characteristic, and a sealing resin that covers the plurality of light-emitting elements, and the mounting region of the conductive member. The conductive member formed on the first light reflecting resin layer is covered with the first light reflecting resin layer, and the conductive member formed around the mounting region is covered with the second light reflecting resin layer and connected to the conductive member. The wire is at least by the second light reflecting resin layer. Is characterized in that part is covered.

  According to one embodiment of the present invention, light absorption is suppressed, light extraction efficiency is excellent, and reliability is high.

It is a top view which shows one Embodiment of the light-emitting device in this invention. FIG. 2 is a plan view showing a configuration when a conductor wiring and a printing resistor are formed, showing a manufacturing process of the light emitting device of FIG. 1. It is a top view which shows the manufacturing process of the light-emitting device of FIG. 1, and shows a structure when a 1st reflective resin layer is formed. It is a top view which shows the manufacturing process of the light-emitting device of FIG. 1, and shows a structure when a light emitting element is mounted. (A) is the sectional view on the AA line of FIG. 2, (b) is the sectional view on the BB line of FIG. 3, (c) is the sectional view on the CC line of FIG. It is a top view which shows the manufacturing process of the light-emitting device of FIG. 1, and shows a structure when the 2nd reflective resin layer is formed. 1A and 1B show a manufacturing process of the light-emitting device of FIG. 1, (a) is a cross-sectional view taken along line DD of FIG. 6, and (b) is a cross-sectional view showing a configuration when a sealing resin is formed. 1A and 1B show a manufacturing process of the light-emitting device of FIG. 1, (a) is a cross-sectional view taken along line EE of FIG. 6, and (b) is a cross-sectional view showing a configuration when a sealing resin is formed. It is a top view which shows the manufacturing process of the light-emitting device of FIG. 1, and shows a mode that the 2nd light reflection resin layer is formed in the manufacturing process before individualization. It is a perspective view which shows the example of 1 structure of the opening part of the nozzle in a resin discharge apparatus. (A) is a top view which shows schematic structure of the conventional light-emitting device, (b) is a schematic diagram which shows the manufacturing process of the said light-emitting device. 2 is a table showing relative light fluxes according to an arrangement interval between a printing resistor and a light emitting element in the light emitting device of FIG. 1. It is a graph which shows the relationship of arrangement | positioning between the printing resistance shown in FIG. 12, and a light emitting element.

  An embodiment of the present invention will be described below with reference to the drawings. The light-emitting device according to the present invention can be used as a light source for lighting devices and display devices. In the following description, the horizontal direction in FIG. 1 is referred to as the x direction (first direction), and the vertical direction in FIG. 1 is referred to as the y direction (second direction). Further, the plan view of FIG. 1 is a top view.

(Configuration of light emitting device)
FIG. 1 is a top view illustrating a configuration example of the light emitting device 100 according to the present embodiment. 2 to 8 show a manufacturing process of the light emitting device 100. FIG. 2 shows a configuration when the conductor wiring 106 and the printing resistor 104 are formed. FIG. 3 shows a configuration when the first light reflecting resin layer 108 is formed. FIG. 4 shows a configuration when the light emitting element 110 is mounted. 5A is a cross-sectional view taken along line AA in FIG. 2, FIG. 5B is a cross-sectional view taken along line BB in FIG. 3, and FIG. 5C is a cross-sectional view taken along line CC in FIG. FIG. FIG. 6 shows a configuration when the second light reflecting resin layer 120 is formed. 7A is a cross-sectional view taken along the line DD of FIG. 6, and FIG. 7B shows a configuration when a sealing resin is formed. FIG. 8A is a cross-sectional view taken along the line EE of FIG. 6, and FIG. 8B shows a configuration when a sealing resin is formed.

  The light-emitting device 100 of this embodiment is a light-emitting device using a light-emitting element (also referred to as a semiconductor light-emitting element). As shown in FIGS. 1-8, the light-emitting device 100 of this Embodiment is the board | substrate 102, the printing resistance 104, the light emitting element 110, the 1st light reflection resin layer 108, the 2nd light reflection resin layer 120, and sealing. A resin 122 is provided.

  The substrate 102 is a ceramic substrate made of ceramic and has a single layer structure. The substrate 102 has a rectangular outer shape when viewed from above. A light emitting element 110, a first light reflecting resin layer 108, a second light reflecting resin layer 120, and a sealing resin 122 are provided on one surface (hereinafter referred to as a surface) of the substrate 102. Further, as clearly shown in FIG. 2, the printed resistor 104, the conductor wiring 106, the anode electrode 114, and the cathode electrode 116 are directly formed on the surface of the substrate 102.

  The conductor wiring 106 is an electrode that is electrically connected to the light emitting element 110 by wire bonding, and is a wiring that is routed for electrical connection. The conductor wiring 106 is made of gold (Au). Conductor wirings 106 a to 106 e are formed as the conductor wiring 106. The conductor wiring 106a is a non-wire bonding wiring. However, the conductor wirings 106 a to 106 e are not limited, and the conductor wiring 106 may be formed partially according to the circuit configuration of the light emitting element 110. Hereinafter, the conductor wirings 106 a to 106 e are collectively referred to as the conductor wiring 106.

  The anode electrode 114 and the cathode electrode 116 are electrodes for supplying power to the light emitting element 110 and can be connected to an external power source of the light emitting device 100. The anode electrode 114 and the cathode electrode 116 are made of, for example, silver (Ag) -platinum (Pt). The anode electrode 114 and the cathode electrode 116 are disposed in the vicinity of each corner on the diagonal line on the surface of the substrate 102 (upper right and lower left in FIG. 2).

  The printing resistor 104 is a resistance element in which a printed paste-like resistance component is fixed by baking. The printing resistor 104 is partially formed (the printing resistor 104a and the printing resistor 104b) so as to be connected in parallel with a circuit in which a plurality of light emitting elements 110 are connected in series. By adopting a circuit configuration in which the printing resistor 104 and a circuit in which a plurality of light emitting elements 110 are connected in series are connected in parallel, the light emitting element 110 can be protected from electrostatic withstand voltage. Hereinafter, the printing resistor 104a and the printing resistor 104b are collectively referred to as a printing resistor 104.

  The light emitting element 110 is a blue light emitting element having an emission peak wavelength of around 450 nm, but is not limited thereto. As the light emitting element 110, for example, an ultraviolet (near ultraviolet) light emitting element having a light emission peak wavelength of 390 nm to 420 nm may be used, thereby further improving the light emission efficiency. As clearly shown in FIG. 4, a plurality (60 in this embodiment) of light emitting elements 110 are mounted on the surface of the substrate 102 at predetermined positions that satisfy a predetermined light emission amount. Electrical connection of the light emitting element 110 is performed by wire bonding using the wire 112. The wire 112 is made of, for example, gold.

The first light reflecting resin layer 108 reflects light from the light emitting element 110 and prevents light absorption by the conductor wiring 106 and the printing resistor 104. The first light reflecting resin layer 108 is a white insulator and is also called a white resist. The main component of the first light reflecting resin layer 108 is made of resin and zirconium oxide (ZrO ₂ ) which is a light diffusing agent, but is not limited thereto, and if an insulating resin (first resin) having light reflecting properties is used. Good. The first light reflecting resin layer 108 is formed so as to cover the conductor wiring 106 a and the printing resistor 104.

  The second light reflecting resin layer 120 reflects light from the light emitting element 110 and prevents light absorption by the conductor wiring 106 and the printing resistor 104. The second light reflecting resin layer 120 is made of an alumina filler-containing silicone resin, but is not limited thereto, and an insulating resin (second resin) having light reflecting properties may be used. The second light reflecting resin layer 120 is provided in a rectangular ring shape with rounded corners when viewed from above so as to surround a mounting region in which all the light emitting elements 110 are mounted. However, the ring shape of the second light reflecting resin layer 120 is not limited to this.

  The sealing resin 122 is a sealing resin layer made of a translucent resin and contains a phosphor. The sealing resin 122 is formed by being filled in a region surrounded by the second light reflecting resin layer 120. That is, the sealing resin 122 is formed on the mounting region of the light emitting element 110 and covers the light emitting element 110, the wire 112, and the first light reflecting resin layer 108.

As the phosphor, a phosphor that is excited by the primary light emitted from the light emitting element 110 and emits light having a longer wavelength than the primary light is used, and is appropriately selected according to desired white chromaticity. be able to. For example, as a combination of daylight white color and light bulb color, there are a combination of YAG yellow phosphor and (Sr, Ca) AlSiN ₃ : Eu red phosphor, and a combination of YAG yellow phosphor and CaAlSiN ₃ : Eu red phosphor. As a combination of high color rendering, there is a combination of (Sr, Ca) AlSiN ₃ : Eu red phosphor and Ca ₃ (Sc, Mg) ₂ Si ₃ O ₁₂ : Ce green phosphor. However, the present invention is not limited thereto, and a combination of other phosphors may be used, and a configuration including only a YAG yellow phosphor as pseudo white may be used.

(Method for manufacturing light emitting device)
Next, a method for manufacturing the light emitting device 100 having the above configuration will be described. The light emitting device 100 is formed as an integrated unit composed of a plurality of light emitting device groups, and is formed as individual light emitting devices by dividing the periphery (four sides) of each light emitting device by dicing at the end of the manufacturing process. Is done. However, in the following, for the convenience of explanation, the explanation and illustration will be made by paying attention to one light emitting device as appropriate.

<Conductor wiring formation process>
First, as shown in FIG. 2, the conductor wiring 106, the anode electrode 114, and the cathode electrode 116 are formed on the substrate 102. These can be formed by, for example, a printing method.

  The conductor wiring 106a (fifth conductor wiring) is connected to the conductor wiring 106c and the conductor wiring 106d and is formed to extend in the y direction. The conductor wiring 106b (first conductor wiring) is formed extending in the x direction. The conductor wiring 106c (second conductor wiring) is formed so as to face the conductor wiring 106b along the y direction and extend in the x direction. The conductor wiring 106d (third conductor wiring) is formed to extend in the x direction on the extension line of the conductor wiring 106b. The conductor wiring 106d is not connected to the conductor wiring 106b. The conductor wiring 106e (fourth conductor wiring) is formed so as to face the conductor wiring 106d along the y direction and to extend in the x direction on the extension line of the conductor wiring 106c. The conductor wiring 106e is not connected to the conductor wiring 106c. The conductor wiring 106a is disposed so as to be substantially at the center of the light emitting portion. That is, the conductor wiring 106a is arranged at a position where the mounting area is divided into two in a top view in the mounting area of the light emitting element 110. The conductor wirings 106 b to 106 e are disposed outside the mounting region of the light emitting element 110 and below the second light reflecting resin layer 120. The conductor wiring 106b is connected to the anode electrode 114, and the conductor wiring 106e is connected to the cathode electrode 116.

  In addition, it is preferable to form an anode electrode mark 115 in the vicinity of the anode electrode 114 so that the anode electrode 114 can be visually recognized as an anode electrode. Similarly, it is preferable to form a cathode electrode mark 117 in the vicinity of the cathode electrode 116 so that it can be visually recognized that the cathode electrode 116 is a cathode electrode.

<Printing resistance formation process>
Subsequently, as shown in FIG. 2, a printing resistor 104 is formed on the substrate 102. Specifically, the printing resistor 104 is formed by a manufacturing process including (1) printing and (2) firing. In the printing process, the paste containing the resistance component is screen-printed at a predetermined position so as to overlap the end of the conductor wiring 106 (partly in contact with the conductor wiring 106). The paste is composed of ruthenium dioxide (RuO ₂ , ruthenium as a conductive powder), a cohesive agent, a resin, and a solvent. In the baking process, the printed resistor 104 is formed by baking the substrate 102 in an electric furnace and fixing the paste. The conductive powder is not limited to ruthenium and may be any metal or oxide that does not soften below the firing temperature.

  Accordingly, the printing resistor 104a (first printing resistor) extending in the y direction so as to contact the conductor wiring 106b and the conductor wiring 106c, and the y direction so as to contact the conductor wiring 106d and the conductor wiring 106e. The printing resistance 104b (second printing resistance) to be stretched is formed. The printing resistor 104a and the printing resistor 104b are formed substantially in parallel. The printing resistor 104a is laid over and electrically connected to the end of the conductor wiring 106b and the end of the conductor wiring 106c. The printing resistor 104b is installed and electrically connected to the end of the conductor wiring 106d and the end of the conductor wiring 106e. The printing resistor 104 a and the printing resistor 104 b are disposed outside the mounting region of the light emitting element 110 and below the second light reflecting resin layer 120.

  FIG. 5A shows the state of the cross section after the printing resistor 104 is formed. As shown in FIG. 5A, it can be seen that the printed resistor 104 and the conductor wiring 106 a are formed on the surface of the substrate 102. The printing resistor 104 and the conductor wiring 106a are formed substantially in parallel. For example, the printing resistor 104 has a height of 8 μm.

<First light reflecting resin layer forming step>
Subsequently, as shown in FIG. 3, the first light reflecting resin layer 108 is formed so as to cover the conductor wiring 106 a and the printing resistor 104. The first light reflecting resin layer 108 can be formed by, for example, a printing method. In addition, after forming the 1st light reflection resin layer 108 by the printing method, it heat-processes on the conditions of temperature 800 degreeC and 10 minutes.

  The state of the cross section after forming the first light reflecting resin layer 108 is shown in FIG. As shown in FIG. 5B, it can be seen that the printing resistor 104 and the conductor wiring 106 a are covered with the first light reflecting resin layer 108. The first light reflecting resin layer 108 prevents a short circuit between the conductor wirings 106.

  Moreover, it is preferable that the 1st light reflection resin layer 108 which covers the conductor wiring 106a is formed in the height of 5 micrometers-50 micrometers. Thereby, even if the laminated body of the conductor wiring 106a and the first light reflecting resin layer 108 is formed at the center of the region surrounded by the second light reflecting resin layer 120, that is, the center of the mounting region of the light emitting element 110, It does not affect chromaticity, light output, and light emission uniformity.

<Light emitting element mounting process>
Subsequently, as shown in FIG. 4, the light emitting element 110 is mounted on the substrate 102. Specifically, first, the light emitting element 110 is die-bonded using an adhesive resin such as a silicone resin. There are 30 light emitting elements 110 in two regions, a region surrounded by the conductor wirings 106a, 106b, and 106c and the printing resistor 104a and a region surrounded by the conductor wirings 106a, 106d, and 106e and the printing resistor 104b, respectively. Place one by one. That is, a total of 60 light emitting elements 110 are arranged.

  The light emitting element 110 is a chip having a rectangular outer shape when viewed from above, and has a thickness of 100 to 180 μm, for example. Two chip electrodes for anode and cathode are provided on the rectangular upper surface of the light emitting element 110 so as to face each other in the longitudinal direction.

  The light emitting elements 110 are arranged in a row, and one light emitting element row is arranged such that the longitudinal direction of the light emitting elements 110 in the top view is along the y direction (column direction). In addition, the light emitting elements 110 of a certain light emitting element array are placed between the light emitting elements 110 of adjacent light emitting element arrays so that the longitudinal side surfaces of the light emitting elements 110 do not face each other between adjacent light emitting element arrays. It is arranged to be located. That is, the light emitting elements 110 are arranged in a so-called staggered arrangement. When viewed from the top surface of the substrate 102, the second light emitting elements 110 are adjacent so that the long sides of the light emitting elements 110 face each other in an oblique direction, rather than the first light emitting element spacing adjacent so that the short sides of the light emitting elements 110 face each other. It is preferable that the distance between the light emitting elements is larger.

  Subsequently, wire bonding is performed using the wire 112. At this time, wire bonding is performed between the conductor wiring 106 and the chip electrode for the light emitting element 110 disposed adjacent to the conductor wiring 106. Between the adjacent light emitting elements 110 not sandwiching the conductor wiring 106, both chip electrodes are directly connected by wire bonding. Thereby, between the anode electrode 114 and the cathode electrode 116, the three series circuit parts to which the 20 light emitting elements 110 were connected in series are connected in parallel.

  FIG. 5C shows a cross-sectional state after the light emitting element 110 is mounted. As shown in FIG. 5C, the printed resistor 104 and the conductor wiring 106a covered with the first light reflecting resin layer 108 are formed, and the light emitting element 110 connected by the wire 112 is mounted. I understand that. Since the light-emitting element 110 is directly mounted on the surface of the substrate 102, heat dissipation can be improved.

  Here, the arrangement interval m between the printing resistor 104 and the light emitting element 110 closest to the printing resistor 104 (the distance from the end of the printing resistor 104 to the end of the light emitting element 110) is preferably 0.55 mm.

  FIG. 12 shows the relative light flux according to the arrangement interval between the printing resistor 104 and the light emitting element 110, and FIG. 13 shows the arrangement relationship between the printing resistor 104 and the light emitting element 110 in a graph. As can be seen from FIGS. 12 and 13, when the arrangement interval between the printing resistor 104 and the light emitting element 110 is less than 0.55 mm, the relative luminous flux of the light emitting device 100, that is, the light output rapidly decreases. From this, it was found that the arrangement interval between the printing resistor 104 and the light emitting element 110 is 0.55 mm or more, preferably in the range of 0.55 mm to 0.92 mm, and 0.55 mm is optimal.

  Similarly, the arrangement interval k between the conductor wiring 106a and the light emitting element 110 closest to the conductor wiring 106a (the distance from the end of the conductor wiring 106 to the end of the light emitting element 110, there are two left and right) is 0. .55 mm is preferable. Furthermore, it is preferable that the arrangement interval n between the side surfaces in the longitudinal direction of the adjacent light emitting elements 110 between adjacent light emitting element arrays is 0.55 mm. However, when 60 or more light emitting elements 110 are mounted as in the present embodiment, 0.55 mm is optimal, but the number is not limited thereto. Considering this point, the arrangement interval k and the arrangement interval n are preferably 0.65 mm or more.

<Second light reflecting resin layer forming step>
Subsequently, as shown in FIG. 6, the second light reflecting resin layer 120 is formed so as to cover the conductor wirings 106 b to 106 e and the first light reflecting resin layer 108 covering the printing resistor 104. Specifically, for example, using a resin discharge device (not shown), the liquid alumina filler-containing silicone resin is drawn at a predetermined position while being discharged from a nozzle having a round opening. And the 2nd light reflection resin layer 120 is formed by performing a heat-hardening process on the conditions of hardening temperature: 120 degreeC and hardening time: 1 hour. The curing temperature and the curing time are examples, and are not limited thereto.

  FIGS. 7A and 8A show the state of the cross section after forming the second light reflecting resin layer 120. FIG. The second light reflecting resin layer 120 has, for example, a width of 0.9 mm. The height of the uppermost portion of the second light reflecting resin layer 120 is set to be higher than the height of the upper surface of the light emitting elements 110 and higher than the wires 112 (wire loops) connecting the light emitting elements 110. Yes. Further, the height of the uppermost portion of the second light reflecting resin layer 120 is set to be higher than the height of the first light reflecting resin layer 108 covering the conductor wiring 106a. As a result, the sealing resin 122 can be formed so as not to expose the light emitting element 110, the wire 112, and the first light reflecting resin layer 108 covering the conductor wiring 106a, and these can be protected. It becomes.

  Further, at least a part of the wire 112 connected to the conductor wirings 106 b to 106 e is covered with the second light reflecting resin layer 120. Thereby, it is possible to reduce the peeling of the wire or prevent the peeling of the wire.

  As shown in FIG. 7A, the printing resistor 104 formed below the second light reflecting resin layer 120 is covered with the second light reflecting resin layer 120 via the first light reflecting resin layer 108. I understand that. That is, the printing resistor 104, the first light reflecting resin layer 108, and the second light reflecting resin layer 120 are laminated. The second light reflecting resin layer 120 does not interfere with the light emitting element 110.

  Further, in the second light reflecting resin layer 120, the printing resistor 104 is disposed on the side farther from the light emitting element 110 than the center of the cross section of the second light reflecting resin layer 120. That is, the printing resistor 104 is disposed in a direction away from the light emitting element 110 with respect to an intermediate position between the inner end and the outer end of the second light reflecting resin layer 120.

  Thus, the position of the printing resistor 104 is preferably formed on the side far from the light emitting element 110 while satisfying the above-described arrangement interval. That is, by providing the second light reflecting resin layer 120 closer to the inside, it is possible to reduce the area of the substrate 102 and make the light emitting portion uniform.

  As shown in FIG. 8A, it can be seen that the conductor wirings 106 b to 106 e formed below the second light reflecting resin layer 120 are directly covered by the second light reflecting resin layer 120. That is, each of the conductor wirings 106b to 106e and the second light reflecting resin layer 120 are laminated. The second light reflecting resin layer 120 does not interfere with the light emitting element 110.

  In the second light reflecting resin layer 120, the conductor wirings 106 b to 106 e are disposed on the side farther from the light emitting element 110 than the center of the cross section of the second light reflecting resin layer 120. That is, the conductor wirings 106 b to 106 e are arranged in a direction away from the light emitting element 110 with respect to the intermediate position between the inner end and the outer end of the second light reflecting resin layer 120.

  Thus, the positions of the conductor wirings 106 b to 106 e formed below the second light reflecting resin layer 120 are preferably formed on the side far from the light emitting element 110. That is, by providing the second light reflecting resin layer 120 closer to the inside, it is possible to reduce the area of the substrate 102 and make the light emitting portion uniform.

  Here, FIG. 9 shows a state in which the second light reflecting resin layer 120 is formed in the manufacturing process before separation. As shown in FIG. 9, the light emitting device is continuously formed on one large substrate 102a, and finally divided along a dividing line 160 set around (four sides) of the light emitting device, Each light emitting device 100 is formed.

  In FIG. 9, in the formation process of the 2nd light reflection resin layer 120 after the mounting process of the light emitting element 110, the mode in the middle of manufacture when the 2nd light reflection resin layer 120 is formed in the upper right in the figure is shown. . The second light reflecting resin layer 120 is sequentially formed. It can be seen that the second light reflecting resin layer 120 is formed on the stacked body of the first light reflecting resin layer 108 and the printed resistor 104 and the conductor wirings 106b to 106e. The laminated body of the first light reflecting resin layer 108 and the conductor wiring 106a is formed by extending substantially the center of the annular second light reflecting resin layer 120 in the y direction (from top to bottom).

  In addition, although the nozzle with a round-shaped opening part was used for the resin discharge apparatus, it is not restricted to this, For example, you may use the nozzle 700 which has a rectangular cyclic | annular opening part 710 as shown in FIG. . In the nozzle 700, since the resin is discharged from the opening 710 at a time, the annular second light-reflecting resin layer 120 without a joint can be produced in a short time. That is, it is possible to form the second light-reflecting resin layer 120 in which the bulge of the joint portion is suppressed and the leakage of the sealing resin 122 can be reduced.

<Sealing resin formation process>
Subsequently, a sealing resin 122 is formed on the substrate 102. Specifically, a phosphor-containing resin obtained by dispersing a phosphor in a liquid translucent resin is injected so as to fill a region surrounded by the second light reflecting resin layer 120. After injecting the phosphor-containing resin, it is cured at a predetermined temperature and time. Thereby, the sealing resin 122 is formed.

  The state of the stage after forming the sealing resin 122 is shown in FIGS. 7B and 8B. As shown in FIGS. 7B and 8B, the first light reflecting resin layer 108, the light emitting element 110, and the wire 112 on the conductor wiring 106a are covered with the sealing resin 122. I understand.

<Substrate division process>
Finally, it divides | segments into the separate light-emitting device 100 along the division line 160 shown in FIG. As a dividing method, there is a method in which the upper part of a dividing groove (not shown) provided on the back surface of the substrate 102a along the dividing line 160 is sheared from the front surface side by a dividing blade. According to this method, since the substrate 102a is cracked along the dividing groove, it can be easily divided. By dividing, as shown in FIG. 1, the light-emitting device 100 singulated can be manufactured.

  As described above, in the light emitting device 100, the conductor wiring 106a formed in the mounting region of the light emitting element 110 is covered with the first light reflecting resin layer 108 and formed below the second light reflecting resin layer 120. The conductor wirings 106 b to 106 e are directly covered with the second light reflecting resin layer 120, and the printing resistor 104 formed below the second light reflecting resin layer 120 passes through the first light reflecting resin layer 108. It has the structure covered with the 2nd light reflection resin layer 120. FIG.

  In general, in a light-emitting device, when a large number of light-emitting elements are mounted on a substrate having a single-layer structure, the routing of the conductor wiring becomes complicated, and the conductor wiring is formed at the center of the light-emitting portion. Conductor wiring is formed. In addition, a printing resistor may be formed to protect the light emitting element. Conductive members such as the above-described conductor wiring and printing resistance absorb light, and thus cause chromaticity deviation, chromaticity variation, reduction in light output, and non-uniform light emission.

  On the other hand, according to the configuration of the light emitting device 100, the conductor wiring 106 and the printing resistor 104 are the first light reflecting resin layer 108 and the second light reflecting resin layer 120 that efficiently reflect the light from the light emitting element 110. Since it is covered, light absorption by the conductor wiring 106 and the printing resistor 104 can be sufficiently reduced. Thereby, it is possible to suppress chromaticity deviation, chromaticity variation, reduction in light output, and non-uniform light emission. Therefore, light absorption can be suppressed, light extraction efficiency can be improved, and a highly reliable light-emitting device 100 can be provided.

  In particular, since the appearance of the printing resistor 104 is black, the printing resistor 104 is formed below the second light-reflecting resin layer 120, covers the entire area with the first light-reflecting resin layer 108, and further reflects the second light as much as possible. By covering with the resin layer 120, light absorption by the printing resistor 104 can be minimized. Therefore, it is possible to prevent a decrease in light output of the light emitting device 100. Further, the gap is reduced by covering the printing resistor 104 with the two layers of the first light reflection resin layer 108 and the second light reflection resin layer 120. Therefore, leakage of the sealing resin 122 to the outside is suppressed, and the sealing resin 122 can be formed stably.

  In the light emitting device 100 described above, the number of the light emitting elements 110 is not limited to 60, and a plurality of light emitting elements 110 can be mounted, and a high output light emitting device with excellent light extraction efficiency can be realized. It is. Further, the electrical connection (circuit configuration) of the light emitting element 110 is not limited to the above. A configuration in which two or more series circuit portions in which two or more light-emitting elements 110 are connected in series may be connected in parallel between the anode electrode 114 and the cathode electrode 116.

  In the above-described embodiment, the light emitting elements 110 are arranged in the left and right regions with the conductor wiring 106a as a boundary. However, by adding the conductor wiring 106, the light emitting elements 110 are arranged in three or more regions arranged in the x direction. Can be placed in series-parallel connection. In this case, the conductor wiring formed in the mounting region of the light emitting element 110, such as the conductor wiring 106a, may be covered with the first light reflecting resin layer 108.

  Therefore, it is desirable that the first light reflecting resin layer 108 is formed in at least three places. That is, the first light reflecting resin layer 108 only needs to be formed on at least the two printed resistors 104a and 104b and the one conductor wiring 106a, and absorbs light provided according to the configuration. It can also be formed on other conductive members.

  Further, in the light emitting device 100, all the light emitting elements 110 having the same shape are mounted. However, the light emitting device 110 is not limited to this and may be mounted with different shapes. For example, as the light emitting element 110, a light emitting element having a square outer shape in a top view can be used as appropriate.

  Note that the printing resistor 104 is formed to protect the light emitting element 110, but the light emitting device 100 does not necessarily include the printing resistor 104. The size of the printing resistor 104 and circuit installation are determined according to the number of light emitting elements 110 to be mounted and the usage environment (the magnitude of the electrostatic withstand voltage value that may be applied to the light emitting elements 110).

  In the light emitting device 100, when a conductive member that absorbs light, such as the conductor wiring 106 and the printing resistor 104, is partially formed on the substrate 102, a mounting region of the light emitting element 110 is included in the conductive member. The conductive member formed on the first light-reflecting resin layer 108 is covered with the first light-reflecting resin layer 108, and the conductive member formed below the second light-reflecting resin layer 120 is covered with the second light-reflecting resin layer 108. What is necessary is just to make it the structure covered with the resin layer 120, or directly covered with the said 2nd light reflection resin layer 120.

  In order to solve the above problems, a light-emitting device of the present invention has a single-layer structure substrate in which a conductive member is partially formed on the surface, and a surface of the substrate so as to be electrically connected to the conductive member. A plurality of light-emitting elements mounted directly, a first light-reflecting resin layer made of a first resin having light reflection characteristics, and an annular shape on the surface of the substrate so as to surround a mounting region where the plurality of light-emitting elements are mounted A second light-reflecting resin layer made of a second resin having a light-reflecting property and a sealing resin that covers the plurality of light-emitting elements; The member is covered with the first light reflecting resin layer, and the conductive member formed below the second light reflecting resin layer is covered with the second light reflecting resin layer via the first light reflecting resin layer. Directly covered by the second light-reflecting resin layer. It is characterized in that there is either.

  According to said structure, it becomes possible to improve heat dissipation by mounting the light emitting element directly on the surface of a board | substrate. Further, since the conductive member formed in the mounting region is covered with the first light reflecting resin layer, the first light reflecting resin layer can also be used for preventing a short circuit between the conductive members.

  Note that when a large number of light emitting elements are mounted on a single-layer structure substrate, the routing of the conductor wiring becomes complicated, and the conductor wiring is formed at the center of the light emitting portion, or a plurality of conductor wirings are formed. It will be. In addition, a printing resistor may be formed to protect the light emitting element. Conductive members such as the above-described conductor wiring and printing resistance absorb light, and thus cause chromaticity deviation, chromaticity variation, reduction in light output, and non-uniform light emission.

  On the other hand, according to said structure, the electrically-conductive member formed in the mounting area among the electrically-conductive members is covered with the 1st light reflection resin layer. The conductive member formed below the second light reflecting resin layer is covered with the second light reflecting resin layer via the first light reflecting resin layer, or directly covered with the second light reflecting resin layer. ing.

  Therefore, light absorption by the conductive member can be sufficiently reduced. Thereby, it is possible to suppress chromaticity deviation, chromaticity variation, reduction in light output, and non-uniform light emission. Therefore, it is possible to provide a light-emitting device that suppresses light absorption and has high light extraction efficiency and high reliability.

  In particular, since the appearance of the printing resistor is black, when the printing resistor is formed as the conductive member, the printing resistor is formed below the second light reflecting resin layer, and the first light reflecting resin layer and the second light reflecting resin are formed. By covering with two layers, light absorption due to printing resistance can be minimized. Further, the gap is reduced by covering the printing resistance with two layers of the first light reflecting resin layer and the second light reflecting resin layer. Therefore, leakage of the sealing resin to the outside is suppressed, and the sealing resin can be formed stably.

  In the light emitting device of the present invention, the conductive member formed below the second light reflecting resin layer is further away from the light emitting element than an intermediate position between the inner end and the outer end of the second light reflecting resin layer. It is preferable to arrange in the direction.

  In the light-emitting device of the present invention, the conductive member extends along at least a first conductor wiring formed by extending in the first direction in the surface of the substrate, and a second direction orthogonal to the first direction. The second conductor wiring formed opposite to the first conductor wiring and extending in the first direction, and the first conductor wiring extended on the extension line of the first conductor wiring. A third conductor wiring and a fourth conductor formed to extend in the first direction on the extension line of the second conductor wiring, facing the third conductor wiring along the second direction. A wiring, a fifth conductor wiring connected to the second conductor wiring and the third conductor wiring and extending in the second direction; the first conductor wiring and the second conductor; A first printing resistor formed by extending in the second direction so as to contact the wiring; A second printed resistor formed by extending in the second direction so as to be in contact with the third conductor wiring and the fourth conductor wiring, and the fifth conductor wiring is disposed on the mounting region. The first conductor wiring, the second conductor wiring, the third conductor wiring, the fourth conductor wiring, the first printing resistance, and the second printing resistance are arranged in the second light reflection. It is preferable to arrange | position below the resin layer.

  In the light emitting device of the present invention, it is preferable that the fifth conductor wiring is arranged at a position that divides the mounting region into at least two in a plan view.

  When a large number of light emitting elements are mounted on a substrate having a single layer structure, an arrangement like the fifth conductor wiring is preferable in routing the conductor wiring. Thereby, it becomes possible to suppress non-uniformity of light emission.

  In the light emitting device of the present invention, it is preferable that the first light reflecting resin layer is formed in at least three places.

  In the light emitting device of the present invention, it is preferable that the first light reflecting resin layer is formed so as to cover the first printing resistor and the second printing resistor.

  In the light emitting device of the present invention, it is preferable that the first light reflecting resin layer covering the fifth conductor wiring is formed with a height of 5 μm to 50 μm.

  According to the above configuration, even if the laminated body of the fifth conductor wiring and the first light reflecting resin layer is formed in the mounting region of the light emitting element, the chromaticity, light output, and light emission uniformity are affected. It becomes possible to prevent giving.

  In the light-emitting device of the present invention, the plurality of light-emitting elements include a region surrounded by the first conductor wiring, the second conductor wiring, the fifth conductor wiring, and the first printing resistor; A plurality of conductor wires, a fourth conductor wire, a fifth conductor wire, and a region surrounded by the second printing resistor are arranged, respectively, and the first conductor wire and the second conductor wire are arranged. Two or more series circuit units in which two or more light emitting elements are connected in series are connected in parallel with the body wiring, and two or more series circuits are connected between the third conductor wiring and the fourth conductor wiring. It is preferable that two or more series circuit units formed by connecting light emitting elements in series are connected in parallel.

  The light emitting device of the present invention includes an arrangement interval between the first printing resistor and the light emitting element closest to the first printing resistor, an arrangement interval between the second printing resistor and the light emitting element closest to the second printing resistor, and The arrangement interval between the fifth conductor wiring and the light emitting element closest to the fifth conductor wiring is preferably 0.55 mm or more.

  The light emitting device of the present invention includes the first direction between the first conductor wiring and the second conductor wiring and between the third conductor wiring and the fourth conductor wiring. It is preferable that the arrangement interval between the light emitting elements adjacent to each other is 0.65 mm or more.

  In the light-emitting device of the present invention, each of the plurality of light-emitting elements has a rectangular outer shape in plan view, and is preferably arranged so that the longitudinal direction of the light-emitting element is along the second direction. .

  In the light emitting device of the present invention, the substrate is preferably a ceramic substrate made of ceramic.

  In the light emitting device of the present invention, the sealing resin is preferably formed in contact with the surface of the substrate. Thereby, it becomes possible to improve the adhesiveness of a board | substrate and sealing resin.

  In the light emitting device of the present invention, it is preferable that the first light reflecting resin layer covering the conductive member formed in the mounting region is covered with the sealing resin.

  In the light emitting device of the present invention, it is preferable that the sealing resin is made of a translucent resin containing a phosphor.

  As described above, the light-emitting device of the present invention is directly mounted on the surface of the substrate so that the conductive member is partially formed on the surface and the substrate is electrically connected to the conductive member. A plurality of light emitting elements, a first light reflecting resin layer made of a first resin having light reflection characteristics, and an annular surface provided on the surface of the substrate so as to surround a mounting region on which the plurality of light emitting elements are mounted. A second light-reflecting resin layer made of a second resin having light-reflecting characteristics, and a sealing resin that covers the plurality of light-emitting elements, and among the conductive members, the conductive member formed in the mounting region is: The conductive member covered with the first light reflecting resin layer and formed below the second light reflecting resin layer is covered with the second light reflecting resin layer via the first light reflecting resin layer. And directly covered by the second light reflecting resin layer. A configuration is whether Re.

  Therefore, by covering the conductive member that absorbs light with the first light-reflecting resin layer and the second light-reflecting resin layer that efficiently reflects the light from the light emitting element, the light absorption by the conductive member is sufficiently reduced. be able to. Thereby, it is possible to suppress chromaticity deviation, chromaticity variation, reduction in light output, and non-uniform light emission. Therefore, the light absorption can be suppressed, the light extraction efficiency is excellent, and a highly reliable light emitting device can be provided.

  The present invention is not limited to the above-described embodiments, and various modifications can be made within the scope shown in the claims. That is, embodiments obtained by combining technical means appropriately modified within the scope of the claims are also included in the technical scope of the present invention.

  The present invention can be suitably used not only in the field related to a light-emitting device using a light-emitting element but also suitably in the field related to a method for manufacturing the light-emitting device. It can be widely used in the fields of devices and display devices.

100 Light Emitting Device 102 Substrate 104 Printing Resistance (Conductive Member)
104a Printing resistance (first printing resistance)
104b Printing resistance (second printing resistance)
106 Conductor wiring (conductive member)
106a Conductor wiring (fifth conductor wiring)
106b Conductor wiring (first conductor wiring)
106c Conductor wiring (second conductor wiring)
106d Conductor wiring (third conductor wiring)
106e Conductor wiring (fourth conductor wiring)
108 1st light reflection resin layer 110 Light emitting element 112 Wire 120 2nd light reflection resin layer 122 Sealing resin 700 Nozzle 710 Opening part

Claims (1)

A substrate having a single layer structure in which a conductive member is partially formed on the surface;
A plurality of light emitting elements mounted directly on the surface of the substrate so as to be electrically connected to the conductive member;
A first light-reflecting resin layer made of a first resin having light-reflecting characteristics;
A second light-reflecting resin layer made of a second resin having a light-reflecting property, which is annularly provided on the surface of the substrate so as to surround a mounting region on which the plurality of light-emitting elements are mounted;
A sealing resin covering the plurality of light emitting elements,
Of the conductive members,
The conductive member formed in the mounting region is covered with the first light reflecting resin layer,
The conductive member formed around the mounting region is covered with the second light reflecting resin layer,
The light-emitting device, wherein the wire connected to the conductive member is at least partially covered with the second light-reflecting resin layer.

Images