JP2014112789A - High frequency power amplifier - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a high frequency power amplifier that enables a resonance frequency to be substantially shifted by a substantial change in the length of stubs while ensuring an equivalent capacitance formed by the stubs.SOLUTION: In a matching circuit 2, a plurality of large adjusting stubs 3 connected by wires 5 are connected in a closed loop in part or in whole. The plurality of large adjusting stubs 3 in the closed loop connection provide the same equivalent capacitance as in a series connection, and at the same time, the stubs have a shorter electrical length and thus provide a higher resonance frequency than in the series connection. The resonance frequency can thus be substantially shifted by a substantial change in the length of the stubs while the equivalent capacitance formed by the stubs is ensured.

Description

  The present invention relates to a high frequency power amplifier having an improved matching circuit.

Generally, in order to obtain the maximum output, the high-frequency power amplifier needs to match the impedance of the transistor to 50Ω for both input and output using a matching circuit.
Therefore, the circuit design is performed so that the matching circuit pattern can be matched to the optimum input and output impedance of the transistor.
However, in practice, the matching may be out of design due to variations in characteristics of the transistors themselves or variations in assembly.
For this reason, adjustment is performed so that the impedance whose matching is deviated from the design is moved to the optimum point and matching is achieved.

FIG. 8 is a block diagram showing a high frequency power amplifier according to Conventional Example 1. In FIG.
In FIG. 8, 1a, 1b, and 1d are lines, 1c is a coupling portion, 102 is a matching circuit including an impedance adjusting stub, 103 is a stub, and 104 is a wire.
In Conventional Example 1, a plurality of stubs 103 are connected in series by wires 104, and one of the stubs 103 and the line 1 d of the coupling portion 1 c are connected by wires 104.
By adjusting the number of the plurality of stubs 103 connected in series, the impedance is adjusted by the equivalent capacitance of the plurality of stubs 103 connected.

FIG. 9 is a block diagram showing a high-frequency power amplifier according to Conventional Example 2.
In FIG. 9, 1 is a line, 112 is a matching circuit composed of an impedance adjustment stub, 113 is an open stub, 114 is an adjustment land (stub), and 115 is a wire.
In Conventional Example 2, an open stub 113 is disposed in the vicinity of the line 1, a small adjustment land 114 is disposed around the open stub 113, and an arbitrary adjustment land 114 is opened by a wire 115. The open stub 113 and the line 1 are connected by a wire 115.
By adjusting the number of adjustment lands 114 connected to these open stubs 113, the impedance is finely adjusted.
Conventional example 2 is proposed in Patent Document 1 below.

JP 62-269402 A

Since the high frequency power amplifiers of the conventional example 1 and the conventional example 2 are configured as described above, when a stub is connected to adjust the impedance, the length of the connected stub becomes λ / 4 with respect to a certain frequency. It becomes the electric length of.
That is, since the position where the stub is connected to a certain frequency appears as a short point, a certain frequency signal is hardly transmitted to the output side.
That is, there is a frequency at which the gain is greatly degraded as a resonance point.
If the resonance point where the gain is deteriorated is in the vicinity of the band to be used, it becomes a big problem in characteristics.

Thus, the resonance frequency is determined by the length of the connected stub.
For example, in the configuration of Conventional Example 1 shown in FIG. 8, when impedance adjustment is performed by connecting the stub 103 in series, a resonance point corresponding to the length of the stub 103 is generated.
When this resonance point occurs in the vicinity of the use band, it is necessary to shift the resonance point position by changing the length of the stub 103. However, impedance adjustment is performed by an equivalent capacitance formed according to the length of the stub 103. Therefore, there arises a problem that the length of the stub 103 cannot be changed and the resonance frequency cannot be shifted.

  In the configuration of Conventional Example 2 shown in FIG. 9, the impedance can be finely adjusted by adjusting the number of adjustment lands 114 connected to the open stub 113. However, the length of the stub is not limited. Is largely determined by a single large-sized open stub 113, and the length of the stub cannot be greatly changed by the small-sized adjustment land 114, and therefore, the resonance frequency cannot be greatly shifted. Arise.

  The present invention has been made to solve the above-described problems, and provides a high-frequency power amplifier that greatly changes the resonance frequency by largely changing the length of the stub while ensuring the equivalent capacitance formed by the stub. With the goal.

  In the high frequency power amplifier according to the present invention, a plurality of stubs are arranged in the impedance adjustment stub, and a part or all of the plurality of stubs are connected by the first wire, and are connected by the first wire. In addition, at least one stub of the plurality of stubs and the line are connected by the second wire, and part or all of the plurality of stubs connected by the first wire are closed-loop connected It is.

According to the present invention, the impedance adjusting stub is configured such that a part or all of the plurality of stubs connected by the first wire are closed-loop connected.
A plurality of stubs connected in a closed loop have the same equivalent capacitance as when connected in series, and at the same time, the length of the stub is shorter than when connected in series, so that the resonance frequency is increased.
Therefore, there is an effect that the resonance frequency can be greatly shifted by largely changing the length of the stub while securing the equivalent capacitance formed by the stub.

It is a block diagram which shows the high frequency power amplifier (state which is not wire-connected) by Embodiment 1 of this invention. 1 is a configuration diagram showing a high frequency power amplifier (wired state) according to Embodiment 1 of the present invention. FIG. It is a block diagram which shows the high frequency power amplifier used as the object of simulation. It is a characteristic view which shows a simulation result. It is a block diagram which shows the high frequency power amplifier by Embodiment 2 of this invention. It is a block diagram which shows the high frequency power amplifier by Embodiment 3 of this invention. It is a block diagram which shows the high frequency power amplifier by Embodiment 4 of this invention. It is a block diagram which shows the high frequency power amplifier by the prior art example 1. It is a block diagram which shows the high frequency power amplifier by the prior art example 2.

Embodiment 1 FIG.
1 is a block diagram showing a high-frequency power amplifier (not connected by wire) according to Embodiment 1 of the present invention.
In FIG. 1, 1a, 1b, and 1d are lines, 1c is a coupling portion, 2 is a matching circuit including an impedance adjustment stub, 3 is an adjustment large stub, and 4 is an adjustment small stub.
A plurality of large adjustment large stubs 3 are arranged near the line 1d of the coupling portion 1c, and a plurality of small adjustment small stubs 4 are arranged around the plurality of adjustment large stubs 3. .
FIG. 1 shows a state where wires are not yet connected.

FIG. 2 is a block diagram showing a high-frequency power amplifier (wired state) according to Embodiment 1 of the present invention.
When adjusting the impedance of the line 1d, one adjustment large stub 3 and the line 1d are connected by the wire 5, and the plurality of adjustment large stubs 3 are connected to each other by the wire 5 so as to form a closed loop.
Note that the number of large adjustment stubs 3 connected to form a closed loop may be arbitrary according to the expected equivalent capacity.
Further, the adjustment large stub 3 and an arbitrary number of adjustment small stubs 4 are connected by wires 5.
By connecting the adjustment small stub 4, the equivalent capacitance is finely adjusted.
The adjustment large stub 3 has such a size that a plurality of wires 5 can be hit each other and a closed loop can be formed by the wires 5.
By configuring in this way, the size of the stub can be adjusted not only in the length direction but also in the width direction.

Next, the operation will be described.
When impedance adjustment is performed using a stub, a resonance point corresponding to the electrical length of the stub is generated.
At this time, when the plurality of large adjustment stubs 3 are connected in parallel by the wire 5 using the large adjustment stub 3, the equivalent capacitance formed by the plurality of large adjustment stubs 3 is connected in series. At the same time, the length of the plurality of large stubs 3 for adjustment is shorter than that when connecting in series, so that the resonance frequency increases.
The resonance point generated in the vicinity of the use band can be shifted by the principle as described above.

FIG. 3 is a block diagram showing a high frequency power amplifier to be simulated.
In FIG. 3, 6 is a transistor (FET: Field Effect Transistor) that amplifies a high frequency input from the input line 1 and outputs it to the output line 1, and 7 is the transistor 6, the input line 1 and the output side. Wires connected to the line 1, 8 is an input terminal, and 9 is an output terminal.
The matching circuit 2 is provided on the input-side line 1 and the output-side line 1 of the transistor 6.

Considering the internal matching FET as shown in FIG. 3, FIG. 4 shows the simulation results when the stub is adjusted to the optimum impedance of the transistor 6 and when the stub is connected in series and in parallel.
When stubs are connected in series as in Conventional Example 1 shown in FIG. 8, a resonance point is generated at 6.5 GHz in the vicinity of the 5 GHz use band.
However, it can be seen that the resonance point is greatly shifted to 8.6 GHz on the high frequency side by connecting the stubs in parallel as in the first embodiment and shortening the length of the stubs.
At this time, it can be seen that the gain characteristic does not change except that the resonance point is shifted.
As shown in the configuration of the first embodiment, by changing the stub connection method from the serial type to the parallel type, it is possible to make an adjustment for greatly changing the resonance point position without affecting the characteristics of the tunnels 6.

In the first embodiment, the plurality of large adjustment stubs 3 and the plurality of small adjustment stubs 4 are disposed. However, only the plurality of large adjustment stubs 3 are disposed, or only the plurality of small adjustment stubs 4 are disposed. If an arbitrary number of stubs are connected to the closed loop by the wire 5, the resonance point position can be greatly changed without affecting the characteristics of the tunnel 6.
Further, the adjustment large stub 3 is connected in the vicinity of the line 1d of the coupling portion 1c, but may be connected to an arbitrary position on the line 1.

As described above, according to the first embodiment, in the matching circuit 2, some or all of the plurality of large adjustment stubs 3 and the plurality of small adjustment stubs 4 connected by the wire 5 are closed-loop connected. It was to so.
A plurality of stubs connected in a closed loop have the same equivalent capacitance as when connected in series, and at the same time, the length of the stub is shorter than when connected in series, so that the resonance frequency is increased.
Therefore, it is possible to greatly change the resonance frequency by largely changing the length of the stub while securing the equivalent capacitance formed by the stub.

Also, a plurality of large adjustment large stubs 3 are arranged near the line 1d of the coupling portion 1c, and a plurality of small adjustment small stubs 4 are disposed around the plurality of adjustment large stubs 3. And a part or all of the plurality of large adjustment stubs 3 are connected in a closed loop.
Therefore, since it is possible to make a closed loop connection without greatly increasing the number of wires 5, it is possible to facilitate manufacture of the wires 5.

Embodiment 2. FIG.
5 is a block diagram showing a high frequency power amplifier according to Embodiment 2 of the present invention.
In FIG. 5, 12 is a matching circuit made up of impedance adjustment stubs, 13 is an adjustment large stub, and 14 is an adjustment small stub.
A plurality of small adjustment small stubs 14 are arranged near the line 1d of the coupling portion 1c, and a plurality of large adjustment large stubs 13 are arranged around the plurality of adjustment small stubs 14. .

When adjusting the impedance of the line 1 d, one adjustment small stub 14 and the line 1 d are connected by the wire 5, and the adjustment small stub 14 and an arbitrary number of adjustment small stubs 14 are connected by the wire 5.
The equivalent capacitance is finely adjusted by the connection of the adjustment small stub 14.
Further, the plurality of large adjustment stubs 13 are connected to each other by the wire 5 so as to form a closed loop, and the large adjustment stub 13 and the small adjustment stub 14 are connected by the wire 5.
Note that the number of large adjustment stubs 13 connected to form a closed loop may be arbitrary according to the expected equivalent capacity.
The adjustment large stub 13 has such a size that a plurality of wires 5 can be hit each other and a closed loop can be formed by the wires 5.
By configuring in this way, the size of the stub can be adjusted not only in the length direction but also in the width direction.

In the second embodiment, the plurality of large adjustment stubs 13 and the plurality of small adjustment stubs 14 are disposed. However, only the plurality of large adjustment stubs 13 are disposed or only the plurality of small adjustment stubs 14 are disposed. If an arbitrary number of stubs are connected to the closed loop by the wire 5, the resonance point position can be greatly changed without affecting the characteristics of the tunnel 6.
Further, the adjustment large stub 13 is connected in the vicinity of the line 1d of the coupling portion 1c, but may be connected to an arbitrary position on the line 1.

As described above, according to the second embodiment, in the matching circuit 12, some or all of the plurality of large adjustment stubs 13 and the plurality of small adjustment stubs 14 connected by the wire 5 are closed-loop connected. It was to so.
A plurality of stubs connected in a closed loop have the same equivalent capacitance as when connected in series, and at the same time, the length of the stub is shorter than when connected in series, so that the resonance frequency is increased.
Therefore, it is possible to greatly change the resonance frequency by largely changing the length of the stub while securing the equivalent capacitance formed by the stub.

Further, a plurality of small adjustment small stubs 14 are arranged near the line 1d of the coupling portion 1c, and a plurality of large adjustment large stubs 13 are arranged around the plurality of adjustment small stubs 14. And a part or all of the plurality of large adjustment stubs 13 are connected in a closed loop.
Therefore, since it is possible to make a closed loop connection without greatly increasing the number of wires 5, it is possible to facilitate manufacture of the wires 5.

Embodiment 3 FIG.
FIG. 6 is a block diagram showing a high frequency power amplifier according to Embodiment 3 of the present invention.
In FIG. 6, 22 is a matching circuit made up of impedance adjustment stubs, 23 and 25 are adjustment large stubs, and 24 is an adjustment small stub.
A plurality of large adjustment large stubs 23 are arranged in the vicinity of the line 1d of the coupling portion 1c, and a plurality of small adjustment small stubs 24 are arranged around the plurality of adjustment large stubs 23. Around the plurality of small adjustment stubs 24, a plurality of large adjustment large stubs 25 are arranged.

When adjusting the impedance of the line 1d, one adjustment large stub 23 and the line 1d are connected by the wire 5, and the plurality of adjustment large stubs 23 are connected to each other by the wire 5 so as to form a closed loop.
Further, the plurality of large adjustment stubs 25 are connected to each other by the wire 5 so as to form a closed loop.
The number of large adjustment stubs 23 and 25 to be connected in a closed loop may be arbitrary depending on the expected equivalent capacity.
Further, the adjustment small stubs 24 are connected to each other by the wire 5, and the adjustment large stub 23 and the adjustment small stub 24 are connected to each other, and the adjustment small stub 24 and the adjustment large stub 25 are connected to each other by the wire 5.
By connecting the adjustment small stub 24, the equivalent capacitance is finely adjusted.
The adjustment large stubs 23 and 25 have such a size that a plurality of wires 5 can be hit each other and a closed loop can be formed by the wires 5.
By configuring in this way, the size of the stub can be adjusted not only in the length direction but also in the width direction.

In the third embodiment, the plurality of large adjustment stubs 23 and 25 and the plurality of small adjustment stubs 24 are arranged. However, only the plurality of large adjustment stubs 23 are arranged, or the plurality of small adjustment stubs 24 are arranged. If an arbitrary number of stubs are connected to the closed loop by the wire 5, the resonance point position can be adjusted greatly without affecting the characteristics of the tunnels 6.
Further, stubs of different sizes are arranged in the order of the adjustment large stub 23, the adjustment small stub 24, and the adjustment large stub 25 from the side near the line 1d. There may be.
Further, the adjustment large stub 23 is connected in the vicinity of the line 1d of the coupling portion 1c, but may be connected to an arbitrary position on the line 1.

As described above, according to the third embodiment, in the matching circuit 22, some or all of the plurality of large adjustment stubs 23 and 25 and the plurality of small adjustment stubs 24 connected by the wire 5 are closed loop. Connected.
A plurality of stubs connected in a closed loop have the same equivalent capacitance as when connected in series, and at the same time, the length of the stub is shorter than when connected in series, so that the resonance frequency is increased.
Therefore, it is possible to greatly change the resonance frequency by largely changing the length of the stub while securing the equivalent capacitance formed by the stub.

Also, a plurality of large adjustment large stubs 23 are disposed in the vicinity of the line 1d of the coupling portion 1c, and a plurality of small adjustment small stubs 24 are disposed around the plurality of adjustment large stubs 23. Around the plurality of adjustment small stubs 24, a plurality of large adjustment large stubs 25 are arranged, and some or all of the plurality of adjustment large stubs 23, 25 are closed-loop connected. I did it.
Therefore, since it is possible to make a closed loop connection without greatly increasing the number of wires 5, it is possible to facilitate manufacture of the wires 5.
Furthermore, the degree of freedom in adjusting the impedance and the degree of freedom in adjusting the length and width of the stub can be increased.

Embodiment 4 FIG.
FIG. 7 is a block diagram showing a high frequency power amplifier according to Embodiment 4 of the present invention.
In FIG. 7, 32 is a matching circuit comprising impedance adjustment stubs, 33 is an adjustment large stub, 34 is an adjustment small stub, and 35 is an adjustment extra large stub.
A plurality of large adjustment large stubs 33 are disposed near the line 1d of the coupling portion 1c, and a plurality of small adjustment small stubs 34 are disposed around the plurality of large adjustment stubs 33. Around the plurality of small adjustment stubs 34, a plurality of extra-large adjustment stubs 35 having an extra large size are arranged.

When adjusting the impedance of the line 1d, one adjustment large stub 33 and the line 1d are connected by the wire 5, and the plurality of adjustment large stubs 33 are connected to each other by the wire 5 so as to form a closed loop.
Further, the adjustment small stubs 34 are connected to each other by the wire 5, and the adjustment large stub 33 and the adjustment small stub 34 are connected to each other by the wire 5. The stub 35 is connected so as to be a closed loop.
By connecting the adjustment small stub 34, the equivalent capacitance is finely adjusted.
The number of large adjustment stubs 33 and extra large adjustment stubs 35 connected to form a closed loop may be arbitrary depending on the expected equivalent capacity.
In addition, the adjustment large stub 33 and the adjustment extra large stub 35 have a size capable of forming a plurality of wires 5 with each other and forming a closed loop with the wires 5.
By configuring in this way, the size of the stub can be adjusted not only in the length direction but also in the width direction.

In the fourth embodiment, the plurality of large adjustment stubs 33, the plurality of small adjustment stubs 34, and the plurality of large adjustment stubs 35 are arranged. The arrangement may be the arrangement of only the small adjustment stubs 34 or the arrangement of only the plurality of oversized adjustment stubs 35. If an arbitrary number of stubs are connected to the closed loop by the wires 5, the characteristics of the tonlangis 6 are affected. Therefore, it is possible to make an adjustment that greatly changes the resonance point position.
Further, stubs having different sizes are arranged in the order of the adjustment large stub 33, the adjustment small stub 34, and the adjustment extra large stub 35 from the side closer to the line 1d. There may be.
Further, the adjustment large stub 33 is connected to the vicinity of the line 1d of the coupling portion 1c, but may be connected to an arbitrary position on the line 1.
Furthermore, although three types of stubs of the large adjustment stub 33, the small adjustment stub 34, and the extra large adjustment stub 35 are arranged, there may be a plurality of sizes.

As described above, according to the fourth embodiment, in the matching circuit 32, among the plurality of large adjustment stubs 33, the plurality of small adjustment stubs 34, and the plurality of large adjustment stubs 35 connected by the wire 5 A part or all of the system is connected in a closed loop.
A plurality of stubs connected in a closed loop have the same equivalent capacitance as when connected in series, and at the same time, the length of the stub is shorter than when connected in series, so that the resonance frequency is increased.
Therefore, it is possible to greatly change the resonance frequency by largely changing the length of the stub while securing the equivalent capacitance formed by the stub.

A plurality of large adjustment stubs 33 having a large size are disposed in the vicinity of the line 1d of the coupling portion 1c, and a plurality of small adjustment stubs 34 having a small size are disposed around the plurality of adjustment large stubs 33. Around the plurality of small adjustment stubs 34, a plurality of extra large adjustment stubs 35 are arranged, and a part of the plural adjustment large stubs 33 and the plurality of adjustment extra large stubs 35 are arranged. Or all were closed loop connected.
Therefore, since it is possible to make a closed loop connection without greatly increasing the number of wires 5, it is possible to facilitate manufacture of the wires 5.
Furthermore, the degree of freedom in adjusting the impedance and the degree of freedom in adjusting the length and width of the stub can be increased.

  In the present invention, within the scope of the invention, any combination of the embodiments, or any modification of any component in each embodiment, or omission of any component in each embodiment is possible. .

  1a, 1b, 1d line, 1c coupling portion, 2, 12, 22, 32 matching circuit, 3, 13, 23, 25, 33 adjustment large stub, 4, 14, 24, 34 adjustment small stub, 5, 7 Wire, 6 transistors, 8 input terminals, 9 output terminals, 35 Extra large stub for adjustment.

Claims (4)

A transistor that amplifies the high frequency input from the input line and outputs it to the output line;
Including a matching circuit provided on at least one of the input-side line and the output-side line, including an impedance adjustment stub,
The impedance adjustment stub is
Multiple stubs are placed,
A part or all of the plurality of stubs are connected by a first wire,
At least one stub of the plurality of stubs connected by the first wire and the line are connected by the second wire,
A high-frequency power amplifier, wherein a part or all of the plurality of stubs connected by the first wire are connected in a closed loop. The impedance adjustment stub is
A plurality of stubs having at least two different sizes are arranged,
2. The high frequency power amplifier according to claim 1, wherein a part or all of a plurality of stubs having a large size are connected in a closed loop. The impedance adjustment stub is
3. The high frequency power amplifier according to claim 2, wherein a plurality of large stubs are disposed in the vicinity of the line. The impedance adjustment stub is
3. The high frequency power amplifier according to claim 2, wherein a plurality of small stubs are arranged in the vicinity of the line.

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