JP2014108480A - End surface polishing tool for sheet glass - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an end surface polishing tool for sheet glass for polishing-processing an end surface in sheet glass.SOLUTION: An end surface polishing tool for sheet glass comprises a grinding stone part 12 in which a grinding grain structure 20 in which plural grinding grains are combined with each other by synthetic resin bonding agent is formed longitudinally and linearly, and a body part 14 gripping and fixing the grinding stone part 12 as replaceable. In the side peripheral part of the grinding stone part 12, formed is a coloring layer 12a which is peeled by polishing processing and the peeling of which can be confirmed visibly. Thus, the grinding stone part 12 can be replaced as worn by usage, to be provided for polishing processing, while problems like end face drooping and consumption of loose grain are suppressed. Therefore, an end surface at a hole part 52 formed in a cover glass 50 can be polishing-processed beneficially, and breakage of the cover glass 50 can be suppressed beneficially.

Description

  The present invention relates to an end surface polishing tool for thin glass that performs polishing of an end surface in a thin glass.

  A touch panel that displays an image and receives an input in accordance with a contact operation is widely used for a mobile phone such as a so-called smartphone, a tablet terminal, or the like. The cover glass attached to the touch panel is a thin glass plate having a thickness of about 0.5 mm to 1.5 mm. For example, a cover glass provided with a hole penetrating in the thickness direction in a portion corresponding to a speaker is generally used. is there. A technique for improving the processing accuracy of the hole in the cover glass has been proposed. For example, it is a grinding apparatus described in Patent Document 1. According to this technology, when processing thin glass, it is possible to perform hole processing without providing marks on the surface of the thin glass while processing with high accuracy by using the camera's shooting data. It is said that grinding processing such as can be performed.

JP 2011-101942 A

  By the way, with recent technological development, the cover glass used for the touch panel or the like is steadily thinned, and its breakage is a problem. The cause of this breakage is often the origin of minute defects remaining after grinding of the hole, and the demand for polishing the end face of the hole is increasing. However, in the conventional technique, after the hole portion is formed, the end face of the hole portion cannot be polished. That is, many of the hole portions formed in the thin glass plate are extremely small, for example, 1 mmφ or less, and the end face cannot be suitably polished with the conventional tool. As a method of polishing the end face of such a hole, buffing using loose abrasive grains and buffs can be considered, but in addition to the consumption of loose abrasive grains becoming a new problem, the holes to be machined are processed. There was a possibility that sagging would occur on the end face. Such a subject was newly discovered in the process in which the present inventors continued intensive research with the intention of improving the performance of a thin glass processing tool.

  The present invention has been made against the background of the above circumstances, and an object of the present invention is to provide an end surface polishing tool for thin glass that performs polishing of the end surface of the thin glass.

  The gist of the first invention for achieving the above object is an end surface polishing tool for thin glass that performs polishing of an end surface in thin glass, wherein a plurality of abrasive grains are bonded to each other by a synthetic resin binder. The abrasive grain structure includes a grindstone portion formed in a longitudinal line shape, and a main body portion that grips and fixes the grindstone portion in a replaceable manner, and a side peripheral portion of the grindstone portion is peeled off by the polishing process. And the colored layer which the peeling can confirm visually is formed.

  As described above, according to the first invention, the abrasive grain structure in which a plurality of abrasive grains are bonded to each other by the synthetic resin binder, the grindstone part formed in a longitudinal line shape, and the grindstone part can be exchanged. A gripping and fixing main body portion, and a side layer of the grindstone portion is formed with a colored layer that is peeled off by the polishing process and the peeling can be visually confirmed. Each time the grindstone part is worn by use, the grindstone part can be exchanged and used for polishing while suppressing problems such as the consumption of loose abrasive grains. For this reason, the end surface in the hole part etc. which were formed in the said thin glass can be grind | polished suitably, and the failure | damage of the thin glass can be suppressed suitably. That is, it is possible to provide an end surface polishing tool for thin glass that performs polishing of the end surface of the thin glass.

  The gist of the second invention subordinate to the first invention is that the colored layer is provided by coating a thin film containing at least one of an inorganic pigment and an organic pigment on a side peripheral portion of the grindstone portion. It is. If it does in this way, the colored layer of the suitable and practical aspect which can peel by the said grinding | polishing process and can confirm the peeling visually can be given to the side peripheral part of the said grindstone part.

  The gist of the third invention according to the first invention or the second invention is that the main body portion stores the grindstone portion and extends the grindstone portion housed in the main body portion in the longitudinal direction. And a feeding mechanism for projecting to the outside of the main body. If it does in this way, it will become possible to take out the whetstone part gradually, and to use for grinding processing, whenever the whetstone part wears down by use.

  The gist of the fourth invention according to any one of the first to third inventions is that the grindstone portion is provided with the abrasive grain structure around a longitudinal core wire. If it does in this way, appropriate intensity | strength can be provided to the grindstone part, ensuring the grinding | polishing performance by the said grindstone part.

  The gist of the fifth invention according to any one of the first to fourth inventions is that the end polishing tool for thin glass is a hand-held device having a gripping part to be gripped by an operator during the polishing process. It is used by being attached to a type polishing machine. In this way, it is possible to provide a hand-held polishing machine that polishes the end face of a hole or the like that penetrates in the thickness direction formed in the thin glass.

It is the front view which looked at the end surface polishing tool for thin glass which is a suitable Example of this invention from the direction perpendicular | vertical to an axial center. FIG. 2 is a partial cross-sectional view showing the grindstone section cut along a plane including an axis, in order to explain in detail the configuration of the grindstone section in the end face polishing tool for thin glass of FIG. 1. FIG. 5 is a schematic view illustrating the configuration of a hand-held polishing machine to which the thin glass edge polishing tool shown in FIG. 1 or FIG. 4 is preferably attached. It is the front view which looked at the end surface polishing tool for sheet glass which is another suitable Example of this invention from the direction perpendicular | vertical to an axial center. It is a top view which illustrates the hole formed in the cover glass which is a process target of the hole processing using the end surface polishing tool for thin glass of FIG. 1 or FIG. 4, and the cover glass. It is a figure which illustrates the movement locus | trajectory of the tool at the time of the grinding | polishing process of the hole in the cover glass by the end surface polishing tool for thin glass of FIG. It is a figure explaining a mode that the colored layer formed in the side peripheral part of the grindstone part in the end surface polishing tool for thin glass of FIG. 1 or FIG. 4 peels by grinding | polishing process, and has illustrated the mode before use. It is a figure explaining a mode that the colored layer formed in the side peripheral part of the grindstone part in the end surface polishing tool for thin glass of FIG. 1 or FIG. 4 peels by grinding | polishing processing, and has illustrated the mode after use.

  Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings. In the drawings used for the following description, the dimensional ratios and the like of each part are not necessarily drawn accurately.

  FIG. 1 is a front view of a thin glass edge polishing tool 10 (hereinafter simply referred to as a tool 10), which is a preferred embodiment of the present invention, viewed from a direction perpendicular to an axis C. FIG. As shown in FIG. 1, the tool 10 of the present embodiment has a grindstone portion 12 having an abrasive grain structure (grindstone structure) formed in a longitudinal line shape and the grindstone portion 12, and the tool The main body 14 corresponding to a shank portion that is detachably attached to a rotary shaft end of a hand-held polishing machine 22 or the like, which will be described later, and the grindstone 12 accommodated in the main body 14 are extended in the longitudinal direction. And a feeding mechanism 16 that protrudes to the outside (front end side) of the main body portion 14.

  The main body 14 is preferably constructed in a substantially cylindrical shape from an iron-based material or a cemented carbide. Preferably, carbon steel, molybdenum steel, stainless steel or the like is used as the iron-based material. Preferably, the central portion including the axis C is a hollow 14a, and the grindstone portion 12 is accommodated in the hollow 14a and the feeding mechanism 16 is provided. Here, in the example shown in FIG. 1, a configuration in which the grindstone portion 12 is housed in the main body portion 14 in a straight state, that is, in a state of extending straight, is exemplified. When 12 has flexibility, it may be accommodated in the main body 14 while being wound in a reel shape.

  The feeding mechanism 16 is preferably configured in accordance with a centering mechanism in a well-known mechanical pencil. For example, a button (not shown) provided on the main body 14 is pressed ( Each time, the grindstone 12 having a predetermined length is protruded from the tip of the main body 14 to the outside of the main body 14. The protrusion length of the grindstone 12 corresponding to this one operation is preferably in the range of 0.5 mm or more and 5.0 mm or less. Each time a knob (not shown) provided on the main body 14 is turned, the grindstone 12 having a length corresponding to the turning amount protrudes from the front end of the main body 14 to the outside of the main body 14. An aspect such as being allowed to occur is also considered. The feeding operation of the grindstone unit 12 by the feeding mechanism 16 as described above may be performed by manually operating the buttons or knobs. For example, in the hand-held polishing machine 22 described later It may be mechanically performed according to a control command or the like from a control device provided.

  Preferably, the feeding mechanism 16 is configured so that the grinding wheel portion 12 cannot be relatively rotated with respect to the main body portion 14 and cannot be relatively moved in the axial direction while the grinding stone portion 12 is not being fed. Hold and fix. That is, at the time of polishing with the tool 10, the feeding mechanism 16 makes them coaxial with each other so that the grinding wheel portion 12 and the main body portion 14 are integrally rotated around the axis C by driving the polishing machine. It functions as a chuck part to be fixed.

  FIG. 2 is a partial cross-sectional view showing the grinding wheel 12 cut along a plane including the axis C in order to explain the configuration of the grinding wheel 12 in detail. As shown in FIG. 2, the grindstone 12 preferably has an abrasive grain structure (grindstone structure) in which a plurality of abrasive grains are bonded to each other by a synthetic resin binder around a longitudinal core wire 18. 20 is provided. The core wire 18 preferably has a circular cross section perpendicular to the axis C, that is, a cylindrical shape. Therefore, preferably, the grindstone portion 12 in which the abrasive grain structure 20 is formed around the core wire 18 is similarly configured to have a circular cross section perpendicular to the axis C, that is, a cylindrical shape. It is a thing. In other words, the abrasive grain structure 20 is formed in a cylindrical shape centered on the axis C. As the method for forming the abrasive grain structure 20 around the core wire 18, well-known extrusion molding, injection molding, wire coating, wire coating molding, ultraviolet curing, etc. are preferably used.

The core wire 18 is preferably a piano wire, a ceramic wire (ceramic fiber), or a synthetic resin wire (synthetic resin fiber). Preferably, the tensile strength of the core wire 18, for example in the range of 100 N / mm ² or more 4000 N / mm ² or less at a prescribed JIS G0202. Preferably, the elastic modulus of the core wire 18 is within a range of 1 GPa or more and 600 GPa or less, for example, according to JIS K7161.

The abrasive grains contained in the abrasive grain structure 20 are preferably CeO ₂ (ceria), WA (white alumina), GC (green silicon carbide), SiO ₂ (silica), ZrO ₂ (zirconia), Mn ₂ O. ₃ Including at least one of (alumina), diamond, and CBN (cubic boron nitride). The abrasive grains contained in the abrasive grain structure 20 preferably have an average particle diameter in the range of 0.1 μm to 10 μm. This average particle diameter is preferably measured by wet measurement using a well-known laser diffraction / scattering particle diameter / particle size distribution measuring apparatus (for example, “MT3000II” manufactured by Nikkiso Co., Ltd.) in an aqueous solvent. For example, the value of D (50) of the measurement result is used as the average particle diameter. The ratio of the abrasive grains in the abrasive grain structure 20 is preferably in the range of 5% by volume to 50% by volume. Examples of the synthetic resin binder in the abrasive grain structure 20 include thermoplastics such as polyethylene, polypropylene, polystyrene, ABS resin, acrylic resin, polyethylene terephthalate, polyamide, polycarbonate, polyphenylene sulfide, polyimide, polytetrafluoroethylene, and biodegradable plastic. Resin, phenol, melamine, urea, epoxy, unsaturated polyester, polyurethane, silicone and other thermosetting resins, rubber and the like are preferably used.

  The colored layer 12a (see FIG. 7 and FIG. 7) can be peeled off from the side circumferential portion (outer peripheral surface) of the grindstone 12 by being brought into sliding contact with the work material in the polishing process and the peeling can be visually confirmed (visually recognized). FIG. 8) is provided. The colored layer 12a is preferably formed by covering a side peripheral portion of the grindstone portion 12 with a thin film containing at least one of an inorganic pigment and an organic pigment. As the inorganic pigment, zinc white, yellow lead, red bean (iron oxide red), titanium dioxide, ultramarine (ultraviolet) and the like are preferably used. As the organic pigment, an azo pigment or a phthalocyanine pigment is preferably used. As the thin film, colored glass (low melting point glass having a melting point of about 450 to 500 ° C.), colored coating, colored powder (colored inorganic powder or organic powder), etc. are affected by the polishing process by the grinding wheel portion 12. Those that do not give and are easy to drop off are preferably used. As the method for forming the colored layer 12a, vacuum deposition is most suitable, but electrostatic coating, ion plating, molecular beam epitaxy, chemical plating, or the like may be used. Alternatively, it may be as simple as a paint such as a varnish containing a pigment is applied to the side periphery of the grindstone 12. The grindstone portion 12 is preferably formed with the colored layer 12a so as to cover the entire side peripheral portion thereof, but may not necessarily be provided on the whole, and will be described later, for example. In the grindstone portion 12 attached to the tool 40 shown in FIG. 4, the colored layer 12 a does not have to be provided in the portion related to gripping by the chuck portion 42.

  As specific dimensions of each part in the tool 10, the diameter dimension φ1 of the grindstone 12 shown in FIG. 2 is preferably in the range of 0.3 mmφ to 2.0 mmφ, for example, about 0.7 mmφ. The diameter 18 of the core wire 18 is preferably in the range of 0.2 mmφ to 1.5 mmφ, for example, about 0.5 mmφ. The thickness t of the grindstone structure 20 is preferably in the range of 0.05 mm to 1.0 mm, for example, about 0.1 mm. The length of protrusion of the grindstone 12 from the main body 14 at the time of polishing with the tool 10 is preferably in the range of 0.5 mm to 5.0 mm.

  FIG. 3 is a schematic view illustrating the configuration of a hand-held polishing machine 22 (hereinafter simply referred to as the polishing machine 22) in which the tool 10 is preferably used. As shown in FIG. 3, the polishing machine 22 is a pen holder grip-type polishing machine that is used by being held like a pen or pencil by an operator during polishing, and the tool 10 is axially centered during the polishing. An electric motor 24 that generates a rotational force (torque) for rotating around C, a flexible power transmission cable 26 that transmits the rotational force generated by the electric motor 24 to the rotary shaft 28, and an axial center A shaft-shaped (cylindrical) main body 30 that accommodates the rotating shaft 28 so as to be relatively rotatable (rotatable about a common axis), and an end portion of the rotating shaft 28 that is opposite to the power transmission cable 26. And a chuck portion 32 that is integrally provided to grip and fix the tool 10 in a replaceable manner.

  In the polishing process by the polishing apparatus 22, the tool 10 is attached to the chuck portion 32, and the chuck portion 32 extends and is held and fixed so as to be integrally rotated coaxially with the rotary shaft 28. During the polishing process, the rotational force generated by the electric motor 24 is transmitted via the power transmission cable 26 to the rotating shaft 28 and to the chuck portion 32 provided at the tip thereof, and the chuck portion. The tool 10 attached to 32 is rotated around the axis C. Then, as will be described later with reference to FIGS. 5 and 6, the tool 10 that rotates with respect to the thin glass to be processed is brought into contact (sliding contact), so that in the hole formed in the thin glass. The end surface is polished. Here, in the polishing machine 22, an operator can perform the polishing process by holding the shaft-shaped main body 30 like a pen or a pencil. That is, in the polishing machine 22, the shaft-shaped main body 30 corresponds to a gripping part that is gripped by an operator during the polishing process.

  FIG. 4 is a front view of a thin glass edge polishing tool 40 (hereinafter simply referred to as a tool 40), which is another preferred embodiment of the present invention, as viewed from a direction perpendicular to the axis C. In FIG. 4, the same reference numerals are assigned to components common to the tool 10 shown in FIG. 1, and description thereof is omitted. In the polishing process by the polishing apparatus 22, a tool 40 as shown in FIG. 4 may be attached to the chuck portion 32 and used. In the tool 40 shown in FIG. 4, the main body portion 14 is not provided with the hollow 14 a and the feeding mechanism 16, and a chuck portion 42 is provided on the distal end side of the main body portion 14. The chuck portion 42 grips and fixes the grindstone portion 12 in a replaceable manner. The grindstone portion 12 used in the tool 40 has a configuration as shown in FIG. 2 described above, and the length (axial dimension) is preferably in the range of 5 mm to 200 mm. Is. Furthermore, a mode in which the grindstone 12 is directly attached to the polishing machine 22 is also conceivable. For example, a chuck portion for gripping and fixing the grindstone portion 12 in a replaceable manner is provided at the end of the rotary shaft 28, and the grindstone portion 12 is directly attached to the chuck portion and used for the polishing process. Also good. In such an aspect, the chuck portion provided at the end of the rotating shaft 28 corresponds to a main body portion that grips and fixes the grindstone portion 12 in a replaceable manner.

  FIG. 5 is a plan view illustrating a cover glass 50 that is a processing target of drilling using the tools 10 and 40 and a hole 52 formed in the cover glass 50. The tools 10 and 40 of the present embodiment configured as described above are used for finish polishing of the hole 52 in the cover glass 50 as a thin glass to be mounted on the touch panel as shown in FIG. That is, after the hole portion 52 penetrating in the thickness direction of the cover glass 10 is formed, the end surface (inner peripheral surface) of the hole portion 52 is used for polishing. The cover glass 50 is, for example, tempered glass having a longitudinal dimension L1 of approximately 100 mm, a width dimension L2 of approximately 50 mm, and a thickness dimension of approximately 0.5 to 1.5 mm. The polishing of the hole 52 is performed before tempering. The cover glass 50 and the reinforced cover glass 50 may be used. The hole 52 is, for example, a longitudinal hole (long hole) having a longitudinal dimension L3 of about 11 mm and a width dimension L4 of about 1.2 mm, and corresponds to a speaker of a mobile phone to which the cover glass 50 is attached. It is provided in the part. Hereinafter, the specific example of the process of the hole 52 in the said cover glass 50 by the tools 10 and 40 of a present Example is demonstrated.

  FIG. 6 is a diagram illustrating the movement trajectory of the tool 10, 40 during the polishing of the hole 52 in the cover glass 50 by the tool 10, 40, and the movement trajectory of the axis C is indicated by a broken line. ing. The polishing of the hole 52 in the cover glass 50 by the tools 10 and 40 is preferably performed in a state where the axis C of the tools 10 and 40 is maintained perpendicular to the flat portion of the cover glass 50. The tools 10 and 40 are moved relative to the cover glass 50 in a plane direction (a direction perpendicular to the axis C). That is, at the position where the grindstone 12 in the tools 10 and 40 is brought into contact with the peripheral edge (inner peripheral surface) of the hole 52, the axis C of the rotating tools 10 and 40 is, for example, the position S in the plane direction. The grinding wheel portion 12 performs polishing on the periphery of the hole portion 52 by being relatively moved along the locus of the axis C as indicated by the broken line. The broken line in FIG. 6 shows an example in which the axial center C of the tools 10 and 40 is rotated once in the circumferential direction of the hole 52. In actual polishing processing, polishing processing is performed for several rounds. It is desirable. When the end surface of the hole 52 has a portion that is not perpendicular to the flat surface portion of the cover glass 50, for example, when the hole 52 is chamfered, the axial center of the tool 10, 40 is used. In the state where C is inclined at a predetermined angle with respect to the cover glass 50 in accordance with the inclination of the end face, the tools 10 and 40 are rotated relative to each other along the periphery of the hole 52 as described above. As a result, the same polishing process as described above is performed on the end surface of the hole 52. According to the polishing machine 22, an operator can hold the shaft-shaped main body 30 like a pen or a pencil and perform such polishing processing, so that precise work can be performed manually.

  In the tool 10, when the abrasive grain structure 20 in the grindstone part 12 is consumed by the polishing process as described above, the consumed part of the abrasive grain structure 20 is removed by, for example, cutting and stored in the main body part 14. The grindstone portion 12 is fed out to the outside of the main body portion 14 by the feeding mechanism 16. That is, the grindstone portion 12 having a new abrasive grain structure 20 that is not yet used for polishing is fed out from the main body 14 to the outside by the feeding mechanism 16 and used for subsequent polishing. In the tool 40, when the abrasive grain structure 20 in the grindstone part 12 is consumed by the polishing process as described above, the grindstone part 12 that has consumed the abrasive grain structure 20 is replaced with a new grindstone part 12. That is, the grindstone portion 12 having a new abrasive grain structure 20 that is not yet used for polishing processing is attached to the chuck portion 42 and used for subsequent polishing processing. Thereby, the grinding | polishing process of the said hole 52 etc. in the said cover glass 50 is performed by the said grindstone part 12 which always has the outstanding grinding | polishing performance.

  7 and 8 are views for explaining how the colored layer 12a formed on the side peripheral portion of the grindstone 12 is peeled off by the grinding process by the grindstone 12. FIG. As described above, the side peripheral portion of the grindstone 12 provided in the tools 10 and 40 is peeled off by being brought into sliding contact with the work material in the polishing process, and the peeling is visually confirmed (visually recognized). A colored layer 12a is formed. FIG. 7 shows a state in which the grindstone portion 12 is in a state before being used for polishing, and the colored layer 12a is provided (remains) on the entire side peripheral portion thereof. When polishing is performed from the state shown in FIG. 7, the colored layer 12a in the portion of the grindstone 12 that is in sliding contact with the work material in the polishing process is peeled off, as shown in FIG. The abrasive grain structure 20 in the portion is exposed. In other words, in the grindstone 12, the portion used for the polishing process can be visually confirmed by the change in the color of the side periphery. Therefore, in the tool 10 described above with reference to FIG. 1 and the like, the portion where the colored layer 12a is peeled off by use is removed by, for example, cutting or the like, and the grindstone portion 12 accommodated in the main body portion 14 is replaced with the feeding mechanism 16. Is fed out of the main body 14. In the tool 40 described above with reference to FIG. 4, it can be visually confirmed whether or not the grindstone 12 has been used for polishing, and can be used as a guide for replacement. In an embodiment in which an operator performs the polishing process by hand as in the polishing machine 22 described above with reference to FIG. 3 and the like, the operator confirms the consumption of the abrasive grain structure 20 in the grindstone 12. However, as described above, according to the tools 10 and 40 of the present embodiment, the use of the grindstone 12 and the consumption of the abrasive grain structure 20 can be suitably and practically used. And can be exchanged as appropriate.

  Thus, according to the present embodiment, the abrasive grain structure 20 in which a plurality of abrasive grains are bonded to each other by the synthetic resin binder is replaced with the grindstone part 12 formed in a longitudinal line shape and the grindstone part 12 is replaced. A main body portion 14 that can be gripped and fixed, and a colored layer 12a that is peeled off by the polishing process and that can be visually confirmed is formed on a side peripheral portion of the grindstone portion 12. Thus, each time the grindstone portion 12 is worn by use, the grindstone portion 12 can be replaced and used for polishing while suppressing problems such as end face sag and consumption of loose abrasive grains. For this reason, the end surface in the hole part 52 formed in the said cover glass 50 which is thin plate glass can be grind | polished suitably, and the failure | damage of the cover glass 50 can be suppressed suitably. That is, it is possible to provide the tools 10 and 40 for polishing the end face of the hole 52 formed in the cover glass 50 that penetrates in the thickness direction.

  The colored layer 12a is formed by covering a side peripheral portion of the grindstone 12 with a thin film containing at least one of an inorganic pigment and an organic pigment. The colored layer 12a of the suitable and practical aspect which can be confirmed can be given to the side peripheral part of the said grindstone part 12. FIG.

  The main body portion 14 is provided with a feeding mechanism 16 that houses the grindstone portion 12 and feeds the grindstone portion 12 accommodated in the main body portion 14 in the longitudinal direction so as to protrude to the outside of the main body portion 14. Therefore, every time the grindstone 12 is worn by use, the grindstone 12 can be gradually drawn out and used for polishing.

  The grindstone portion 12 is provided with the abrasive grain structure 20 around the longitudinal linear core wire 18, so that the grindstone portion 12 has an appropriate strength while ensuring the polishing performance by the grindstone portion 12. Can be granted.

  The tools 10, 40 are used by being attached to a polishing machine 22 having a shaft-shaped main body 30 as a gripping part to be gripped by an operator during the polishing process, and thus are formed on the cover glass 50. It is possible to provide a polishing machine 22 that polishes the end face of the hole 52 penetrating in the thickness direction.

  The preferred embodiments of the present invention have been described in detail with reference to the drawings. However, the present invention is not limited to these embodiments, and may be implemented in other modes.

  For example, in the above-described embodiment, the shape and size of each part in the tool 10 and the like are illustrated, but this is a preferred embodiment to the last, and the present invention is not limited to such embodiment. For example, the configuration and formation method of the colored layer 12a are not limited to the above-described embodiments, and may be a metal coating such as an Au vapor deposition film. The tools 10 and 40 may be used by being attached to a stationary polishing machine instead of a handheld type. When the abrasive grain structure 20 has a necessary and sufficient tensile strength and elastic modulus as a single body, the grindstone portion 12 does not necessarily have to have the abrasive grain structure 20 formed around the core wire 18, and the whole thereof. May be constituted by the abrasive grain structure 20. The diameter dimension φ1 of the grindstone 12 shown in FIG. 2, the diameter dimension φ2 of the core wire 18, the thickness dimension t of the abrasive grain structure 20 and the like are appropriately determined according to the shape and size of the hole 52 to be processed. Be changed. The tool 10 is also suitably used for polishing the end face of the cover ballus 50 other than the hole 52. In addition, the material of the core wire 18, the tensile strength, the type of abrasive grains, the average grain size, the ratio of the abrasive grains in the abrasive grain structure 20, and the like are also the shape and size of the hole 52 to be processed. It will be changed accordingly.

  In addition, although not illustrated one by one, the present invention is implemented with various modifications within a range not departing from the gist thereof.

  10, 40: End polishing tool for thin glass, 12: Grinding stone part, 12a: Colored layer, 14: Main body part, 16: Feeding mechanism, 18: Core wire, 20: Abrasive structure, 22: Hand-held polishing machine, 30: Shaft-shaped body (gripping part), 50: cover glass (thin glass), 52: hole

Claims (5)

An end surface polishing tool for thin glass that performs polishing of the end surface in the thin glass,
Abrasive grain structure in which a plurality of abrasive grains are bonded to each other by a synthetic resin binder, and a grindstone portion formed in a longitudinal line shape,
A main body for gripping and fixing the grindstone in a replaceable manner,
An end surface polishing tool for thin glass, wherein a colored layer that is peeled off by the polishing process and that can be visually confirmed is formed on a side peripheral portion of the grindstone.   2. The edge polishing tool for thin glass according to claim 1, wherein the colored layer is provided by coating a thin film containing at least one of an inorganic pigment and an organic pigment on a side peripheral portion of the grindstone portion.   The said main-body part is equipped with the drawing | feeding-out mechanism which draws out the said whetstone part accommodated in this main-body part in a longitudinal direction, and protrudes the outer side of the said main-body part while accommodating the said grindstone part. An end surface polishing tool for thin glass as described in 1.   The end face polishing tool for thin glass according to any one of claims 1 to 3, wherein the grindstone portion is provided with the abrasive grain structure around a longitudinal linear core wire.   The end face polishing tool for thin glass is used by being attached to a hand-held polishing machine provided with a gripping part that is gripped by an operator during the polishing process. End polishing tool for thin glass.