JP2014104515A - Thermal deformation prevention device of static pressure pad in double-side grinding apparatus and double-side grinding apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a thermal deformation prevention device which in simultaneous working of surface-rear surface of a thin disk-like workpiece, restrains thermal deformation of a static pressure pad for hydrostatically supporting both surface and rear surface of the workpiece.SOLUTION: The thermal deformation prevention device 6 restrains the thermal deformation of a pair of static pressure pads 15 and 16 for supporting both surface and rear surface Wa and Wb of a workpiece W in a noncontact state by a hydrostatic fluid. The thermal deformation prevention device 6 is used in a double-end surface grinding machine in which a thin disk-like workpiece W is rotationally supported with a workpiece rotationally supporting device 5, and a pair of high speed-rotating grinding wheels 1 and 2 are cut in the grinding wheel axis direction thereof and both surface and rear surface Wa and Wb of the workpiece W are simultaneously ground.. A heat shield plate 30 as thermal deformation prevention means for restraining the thermal deformation of the static pressure pads 15 and 16, is provided in a boundary part with the grinding wheels 1 and 2 in the static pressure pads 15 and 16.

Description

  The present invention relates to a device for preventing thermal deformation of a static pressure pad and a double-side grinding device in a double-side grinding device, and more specifically, in the simultaneous machining of the front and back surfaces of a thin disk-like workpiece such as a semiconductor wafer. The present invention relates to a thermal deformation prevention technique for suppressing thermal deformation of a pair of static pressure pads that support both front and back surfaces with a hydrostatic fluid in a non-contact state.

  For example, a semiconductor wafer is obtained by thinly slicing a cylindrical semiconductor ingot made of single crystal silicon, and then the front and back surfaces are finished to a smooth surface by finishing with a grinding device or a polishing device. .

  In grinding or polishing a thin disk-shaped workpiece (hereinafter referred to as a workpiece) such as a semiconductor wafer, a method of processing the front surface and / or the back surface of the workpiece while supporting and rotating the workpiece is employed. In a double-sided grinding machine that simultaneously grinds the front and back surfaces of a wafer, the workpiece is rotated and supported by a workpiece rotation support device, and a pair of grinding wheels rotating at high speed are cut in the direction of the grinding wheel axis to grind both grinding wheel end faces. The front and back surfaces of the workpiece are ground simultaneously by the surface.

  By the way, the workpiece rotation support device includes axial support means for positioning and supporting the workpiece in the axial direction, and radial support means for positioning and rotating the workpiece in the radial direction. As the axial support means, there is a configuration including a pair of static pressure pads that support both sides of the workpiece in a non-contact state with a static pressure fluid. In this type of workpiece rotation support device, both sides of the workpiece are supported. Is supported in a non-contact state by a static pressure fluid, the distance between the surface of the static pressure pad and the front and back surfaces of the workpiece is set very narrow.

  For this reason, the thermal deformation of the hydrostatic pad immediately interferes with the workpiece and the radial support means for rotating and supporting the workpiece, and there is a risk that high-precision grinding becomes difficult or grinding itself becomes impossible. . In particular, when the workpiece to be ground has a large diameter, the static pressure pad that supports the workpiece also has a large diameter, and the amount of thermal deformation tends to increase. As described above, management control of grinding heat, which is a main factor of thermal deformation of the static pressure pad, is very complicated in structure and is one of the major problems to be solved at an early stage.

  In this regard, for example, as disclosed in Patent Document 1 or 2, a technique for preventing thermal deformation of the apparatus component by preventing thermal conduction due to scattering of the grinding fluid in the grinding apparatus has been developed and proposed. However, it is not a technology that can be effectively applied to the special structure of the static pressure pad, and further improvements have been demanded.

JP-A 63-207549 JP 2000-354964 A

  The present invention has been made in view of such conventional problems, and the object of the present invention is to provide a static surface on both the front and back surfaces of a thin disk-shaped workpiece such as a semiconductor wafer. An object of the present invention is to provide a thermal deformation prevention device capable of effectively suppressing thermal deformation of a hydrostatic pad supported in a non-contact state by a pressurized fluid.

  Another object of the present invention is to provide a double-sided grinding apparatus that comprises the thermal deformation prevention device as a component device and can simultaneously and efficiently grind the front and back surfaces of a thin disc-shaped workpiece such as a semiconductor wafer. Is to provide.

  In order to achieve the above object, the thermal deformation prevention device of the double-sided grinding apparatus of the present invention supports a thin disk-shaped workpiece by a workpiece rotation support portion and cuts a pair of grinding wheels rotating at high speed in the direction of the grinding wheel axis. In the double-side grinding apparatus that simultaneously grinds both the front and back surfaces of the workpiece by the grinding surfaces of the both ends of the grinding wheel, the pair of workpiece rotation support portions that support the front and back surfaces of the workpiece in a non-contact state with a hydrostatic fluid. A thermal deformation prevention device for suppressing thermal deformation of a static pressure pad, wherein thermal deformation prevention means for suppressing thermal deformation of the static pressure pad is provided at a boundary portion of the static pressure pad with the grinding wheel. It is characterized by.

The following configuration is adopted as a preferred embodiment.
(1) The thermal deformation prevention means is configured to prevent the coolant splashed from the grinding portion of the grinding wheel from flowing into the back side of the static pressure pad.

(2) The thermal deformation prevention means is in the form of a heat shield plate attached and fixed to the inner periphery of the grinding wheel insertion portion of the static pressure pad so as to cover the outer peripheral portion of the grinding wheel.

(3) In the heat shield plate, the mounting range in the front and back direction of the grinding wheel insertion portion of the hydrostatic pad is at least behind the back surface of the hydrostatic pad from a position slightly retracted from the surface of the hydrostatic pad. And extending to a position covering the rear end of the grinding wheel during grinding.

(4) The heat shield plate is made of a material having a lower thermal conductivity than metal.

  The double-sided grinding apparatus for thin-walled disc-like workpieces of the present invention supports the thin-walled disc-like workpieces in rotation and cuts a pair of grinding wheels rotating at high speed in the direction of the grinding wheel axis. A device for simultaneously grinding the front and back surfaces of the workpiece, wherein a pair of grinding wheels arranged so that the grinding surfaces of the end faces face each other, and the workpiece between the grinding surfaces of the pair of grinding wheels. Work rotation support means for supporting and rotating in a state where the front and back surfaces face both the grinding surfaces. The work rotation support means includes: an axial support means for positioning and supporting the work in the axial direction; A radial support means for positioning and rotating in the radial direction, the axial support means comprising a pair of static pressure pads for supporting the front and back surfaces of the workpiece in a non-contact state with a static pressure fluid. With obtaining, and characterized by including the heat deformation prevention device.

  The technology for preventing thermal deformation of a static pressure pad according to the present invention was born as a result of various test studies on a specific technology called a static pressure pad of a double-side grinding apparatus by the present inventor. That is, the present inventor considers structural characteristics that affect the thermal deformation of the hydrostatic pad, such as supplying the hydrostatic fluid of the hydrostatic pad in the grinding apparatus so as to follow the machine temperature. On the other hand, as a result of repeating various studies and experiments to be described later on how the grinding heat generated when grinding a workpiece is involved in the thermal deformation of the hydrostatic pad, the present invention has been completed.

  In other words, when a thin disk-shaped workpiece is supported in rotation between a pair of static pressure pads arranged on the left and right sides and both sides of the workpiece are ground simultaneously with a pair of grinding wheels that rotate at high speed, The generated grinding heat is transmitted to the grinding water (coolant) and workpiece supplied to the grinding part via the center of the grinding wheel shaft of the grinding wheel. The grinding water heated by the grinding heat is rotated by the workpiece. Is carried between the pair of static pressure pads, and is scattered by the rotation of the grinding wheel and flows into the back surface side of the static pressure pads.

  As a result of various test studies by the present inventors, the grinding heat transferred between the hydrostatic pads by the grinding water, that is, from the front side to the back side, causes a temperature difference between the front side and the back side of the hydrostatic pad. As a result, it has been found that the static pressure pad warps to the workpiece side and interferes with the workpiece and the carrier supporting the workpiece in the radial direction. The present inventor further conducted a test study based on the knowledge obtained by these test studies, and completed the present invention as a result.

  Thus, according to the thermal deformation prevention device of the present invention, the thin disc-shaped workpiece is supported by the workpiece rotation support portion including the static pressure pad, and a pair of grinding wheels rotating at high speed are cut in the direction of the grinding wheel axis. In the double-side grinding apparatus that simultaneously grinds both the front and back surfaces of the workpiece with the grinding surfaces of the both end faces of the grinding wheel, heat that suppresses thermal deformation of the static pressure pad at the boundary portion of the hydrostatic pad with the grinding wheel. Since deformation prevention means is provided, thermal deformation of the static pressure pad in the work rotation support part that supports both the front and back surfaces of the work in a non-contact state with a hydrostatic fluid in the simultaneous processing of the front and back surfaces of the thin disk-shaped work Can be effectively suppressed.

  That is, in the present invention, the thermal deformation preventing means is provided at the boundary portion of the hydrostatic pad with the grinding wheel, specifically, the grinding wheel insertion portion of the hydrostatic pad, thereby The inflow of the hydrostatic pad from the ground portion where the temperature difference has occurred between the front surface side and the back surface side to the front and back surfaces, particularly the back surface side, is effectively suppressed or prevented.

  As a result, warpage to the workpiece side due to thermal deformation of the static pressure pad is reduced as much as possible, and interference between the static pressure pad and the workpiece and the carrier is effectively prevented, thereby making it impossible to grind the workpiece. Such problems can be effectively prevented.

It is a side view which shows the structure of the principal part of the horizontal-axis double-head surface grinding machine which is Embodiment 1 of this invention partially with an imaginary line. FIG. 2 is a front view showing a configuration of a main part of the same surface grinding machine in a partial cross section along the line II-II in FIG. 1. It is a schematic diagram which shows the conditions of the test apparatus for investigating the influence with respect to the static pressure pad by the grinding water when not equipped with the thermal deformation prevention apparatus of the same surface grinding machine. It is a schematic diagram which shows the influence by the grinding water of the static pressure pad in the test apparatus. It is a graph which similarly shows the influence by the grinding water of the same static pressure pad. FIG. 6A is a diagram for illustrating a test result for examining an influence on a static pressure pad by a clockwise rotation of a workpiece when the surface grinder is not provided with a thermal deformation prevention device, and FIG. FIG. 6B is a graph showing the influence of the work of the static pressure pad in the clockwise direction in the test apparatus. FIG. 7A is a view for showing test results for investigating the influence of the counterclockwise rotation of the workpiece on the static pressure pad when the surface grinder is not provided with the thermal deformation prevention device, and FIG. FIG. 7B is a graph showing the influence of the counter pressure rotation of the workpiece of the static pressure pad in the test apparatus. FIG. 8A is a schematic diagram for explaining the influence of both of these on the combined static pressure pad from the test results of examining the influence of the grinding water and the workpiece rotation direction of the static pressure pad. FIG. 8A is a grinding wheel. FIG. 8 (b) shows the state of the lower part of the apparatus rear side along the line BB of FIG. 3 of the static pressure pad while the grinding wheel is in contact with the workpiece. (C) shows the state of the apparatus front side lower part along CC line of FIG. 3 of the static pressure pad in which the grinding wheel is contacting the workpiece | work, respectively. FIG. 9A is a graph showing a change in inter-pad distance of a static pressure pad during actual grinding in the case where the apparatus for preventing thermal deformation of the same surface grinder is not provided, FIG. 9A is an overall graph, FIG. 9B These are the graphs which expand and show the inside of the dotted-line frame in Fig.9 (a). It is a graph which shows the change of the interpad distance of the static pressure pad at the time of actual grinding in the case of providing the thermal deformation prevention apparatus of the same surface grinding machine. It is a schematic diagram which shows the test conditions for investigating the curvature reduction state of the static pressure pad at the time of grinding in the case of providing the thermal deformation prevention apparatus of the same surface grinding machine. FIG. 12A is a schematic diagram for explaining a warped reduction state of the static pressure pad from a test result in the case where the thermal deformation prevention device is provided, and FIG. 12A is a state of the static pressure pad before the grinding wheel contacts the workpiece, FIG. 12B shows the state of the lower part of the rear side of the apparatus along the line BB in FIG. 11 of the static pressure pad while the grinding wheel is in contact with the workpiece, and FIG. 12C shows the state when the grinding wheel contacts the workpiece. The state of the static pressure pad apparatus front lower part along CC line in FIG. 11 is each shown. It is a side view which shows the structure of the principal part of the horizontal-axis double-head surface grinding machine which is Embodiment 2 of this invention partially with an imaginary line. It is a front view which shows the semiconductor wafer which is a workpiece for grinding of the same surface grinder.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Throughout the drawings, the same reference numeral indicates the same component or element.

Embodiment 1
FIGS. 1 and 2 show a double-side grinding apparatus according to the present invention. Specifically, this grinding apparatus simultaneously covers the front and back surfaces of a semiconductor wafer as shown in FIG. 14 which is a thin disk-shaped workpiece W. This is a horizontal double-sided surface grinder that grinds and is supported by the grindstone shafts 3 and 4 of the pair of grinding wheels 1 and 2 in a horizontally opposed manner.

  The semiconductor wafer W to be processed in the present embodiment is a thin disk having a thickness of about 0.5 to 2.0 mm, and in order to match the crystal orientation of the wafer during the manufacturing process, the circular outer peripheral edge A notch Wn is provided as a notch. In this embodiment, it is set as the structure which grinds using this notch Wn effectively.

  As shown in FIGS. 1 and 2, the grinding machine includes basic configurations such as a pair of left and right grinding wheels 1 and 2 and a workpiece rotation support device (work rotation support portion) 5 which are main components of the grinding portion. Thus, the main component of the workpiece rotation support device 5 includes a thermal deformation prevention device 6 that is a characteristic configuration of the present invention.

  The grinding wheels 1 and 2 are specifically cup-type grinding wheels, and their peripheral edge front surfaces 1a and 2a are annular grinding surfaces. These grinding wheels 1 and 2 are arranged so that the grinding surfaces 1a and 2a face each other in a substantially parallel state, and at a grinding position between the two grinding surfaces 1a and 2a, as will be described later, The workpiece rotation support device 5 is configured to be rotated and supported.

  Specifically, the grinding wheels 1 and 2 are detachably attached and fixed to the tip portions of the grinding wheel shafts 3 and 4. These grindstone shafts 3 and 4 are drivingly connected to drive motors 7 and 8 installed inside a grindstone base (not shown), and also by a grindstone cutting device (not shown) installed inside the grindstone stand. The structure is such that the cutting operation is performed in the axial direction, that is, in the cutting directions X and Y. In addition, coolant supply paths 9 for supplying coolant (grinding water) to the grinding portions of the grinding wheels 1 and 2, that is, the grinding surfaces 1 a and 2 a, penetrate through the entire length of the center of the grinding wheel shafts 3 and 4. The front end 9a of the grinding wheel 1 and 2 is opened to face the front end of the grinding wheels 1 and 2, and the rear end thereof can communicate with the coolant supply source, although not specifically shown.

  The workpiece rotation support device 5 functions as a workpiece rotation support means for supporting and rotating the workpiece W. The workpiece W is disposed between the grinding surfaces 1a and 2a of the pair of grinding wheels 1 and 2, and the front and back surfaces Wa and Wb thereof are arranged. It is configured to support and rotate in a vertical state facing both the grinding surfaces 1a and 2a.

  The work rotation support device 5 includes an axial support means 10 for positioning and supporting the work W in the axial direction, and a radial support means 11 for positioning and supporting the work W in the radial direction. The support means 10 includes the thermal deformation prevention device 6 as its main component.

  The axial direction support means 10 is in the form of a static pressure support device that positions and supports the front and back surfaces Wa and Wb of the workpiece W in a non-contact state with a static pressure fluid, and is provided in an opposing manner as its main component. A pair of left and right static pressure pads 15 and 16 and the thermal deformation prevention device 6 are provided.

  As shown in FIGS. 1 and 2, the pair of static pressure pads 15 and 16 are in the form of thick discs arranged in parallel and facing each other at a predetermined interval in the vertical state, and the constituent materials are aluminum and stainless steel. Ceramics are used, and ceramics are used in this embodiment. The pair of static pressure pads 15 and 16 are each provided with a notch 17 for avoiding interference with the grinding wheels 1 and 2 as a grinding wheel insertion portion at a lower portion thereof, and a surface serving as an opposing support surface, that is, a pad surface 15a. 16a, although not specifically shown, static pressure grooves are respectively formed with a predetermined pattern shape. These static pressure grooves are connected to a static pressure fluid supply source (not shown) through a plurality of fluid supply holes provided at the bottom.

  Further, as shown in FIG. 1, the grinding wheel insertion portion 17 has an arc-shaped inner diameter contour having a slightly larger diameter than the outer diameter of the grinding wheels 1 and 2. A thermal deformation prevention device 6 is provided.

  The pressure fluid such as water supplied from the static pressure fluid supply source is a plurality of fluid supply holes (in a static pressure groove provided on the pad surfaces 15a and 16a of the static pressure pads 15 and 16) during grinding. The front and back surfaces Wa and Wb of the workpiece W are statically held in a non-contact state at substantially the center position in the axial direction between the grinding surfaces 1a and 2a of the grinding wheels 1 and 2. As the pressure fluid to be ejected, pressure water (so-called pad water) is used in the illustrated embodiment.

  The pad water constantly ejected and supplied from the pad surfaces 15a and 16a of the static pressure pads 15 and 16 is temperature-adjusted so as to follow the machine temperature, and the front and back surfaces Wa and Wb of the workpiece W statically supported and the pads. The minute gap between the surfaces 15a and 16a flows downward by its own weight and is discharged.

  The radial support means 11 is in the form of a rotational drive device that rotationally drives the workpiece W while positioning the workpiece W in the radial direction. As a main component, the carrier device 20 that fits and supports the workpiece W, and this carrier And a rotating device 21 that supports and rotates the device 20.

  As shown in FIG. 1, the rotating device 21 includes a plurality of (four in the illustrated embodiment) support rollers 23, 23,... Rotatably supporting the outer peripheral surface 25 a of the carrier ring 25 of the carrier device 20. The ring drive gear 24 is configured to mesh with the inner teeth 27a of the carrier presser 27 that is integrally fitted and fixed to the carrier ring 25, and the ring drive gear 24 is drivingly connected to a rotational drive source (not shown). Yes.

  Then, due to the driving rotation of the ring drive gear 24 by the rotation driving source, the carrier device 20 that fits and supports the workpiece W is rotated around the rotation center defined by the support rollers 23, 23,. Is rotated while being positioned in the radial direction.

  The carrier device 20 fits and supports the work W, and as shown in FIGS. 1 and 2, the carrier ring 25, the carrier body 26, and the carrier presser 27 are configured as main parts.

  The carrier ring 25 is a part that functions as a main body ring of the carrier device 20 and is in the form of an annular ring member as shown in FIG. 1, and an outer peripheral surface 25a is formed in a cylindrical surface. And as above-mentioned, as for the carrier ring 25, the outer peripheral surface 25a is positioned and supported by the four support rollers 23,23, ... of the rotating device 21 which is a rotation drive part.

  An annular mounting groove 25b is continuously provided over the entire circumference on the inner diameter side of the carrier ring 25, and the outer peripheral edge portion of the carrier body 26 is fitted into the mounting groove 25b. An annular carrier retainer 27 is attached and fixed so as to be detachable and replaceable.

  The carrier retainer 27 is in the form of an internal gear made of an annular ring member as shown in FIG. 1, and the inner teeth 27a are formed on the inner periphery. In the state where the carrier presser 27 is integrally fitted and fixed in the mounting groove 25b of the carrier ring 25, as described above, the four support rollers 23, 23,... The outer peripheral surface 25a of the carrier ring 25 is rotatably supported, and the ring drive gear 24 of the rotating device 21 is engaged with the inner teeth 27a of the carrier retainer 27.

  The carrier body 26 is a part that fits and supports the workpiece W, and is specifically in the form of a thin annular plate as shown in FIG. 1, and its circular inner peripheral edge 26 a is the entire circular outer periphery of the workpiece W (all It is structured so that the surroundings are closely surrounded. That is, the circular inner peripheral edge 26a has an inner diameter dimension slightly larger than the outer diameter dimension of the workpiece W to be ground, and a predetermined gap is formed between the outer peripheral edge of the workpiece W. Thus, the workpiece W is fitted and supported on the carrier body 26 in a loose fit.

  Further, as shown in FIG. 1, a notch trigger 28 that engages with a notch Wn that is a notch provided in the circular outer peripheral edge of the workpiece W is provided at a predetermined portion of the circular inner peripheral edge 26 a of the carrier body 26. ing. The point engaging portion 28a of the notch trigger 28 is provided in the rotation direction of the carrier device 20 on the notch Wn of the work W in a state where the work W is loosely fitted and supported within the circular inner peripheral edge 26a of the carrier body 26. As a result, the workpiece W is loosely fitted and supported by the carrier body 26 and is rotated integrally with the carrier body 26 via the notch trigger 28.

  In the work rotation support device 5, the front and back surfaces Wa and Wb of the work W fitted and supported by the carrier device 20 of the radial support means 11 are not contacted by the static pressure pads 15 and 16 of the axial support means 10. The carrier device 20 rotates around the rotation center defined by the support rollers 23, 23, while being held in a static pressure state and positioned and supported at the center position (processing position) between the both static pressure pads 15, 16. It is operated and rotated while the workpiece W is positioned in the radial direction.

Next, the configuration of the thermal deformation prevention device 6 that is a characteristic configuration of the present invention will be described in detail.
The thermal deformation prevention device 6 suppresses thermal deformation of the pair of static pressure pads 15 and 16 of the workpiece rotation support device 5, and is a boundary between the static pressure pads 15 and 16 and the grinding wheels 1 and 2. The part is provided with a heat shield plate 30 as thermal deformation preventing means for suppressing thermal deformation of the static pressure pads 15 and 16.

  In the thermal deformation prevention device 6 of the illustrated embodiment, the heat shield plate 30 is provided at a portion of the grinding wheel insertion portion 17 in the static pressure pads 15 and 16.

  Specifically, the heat shield plate 30 is in the form of a heat shield plate provided along the cylindrical inner periphery of the grinding wheel insertion portion 17, and according to the results of various test studies described below, The coolant that splashes from the grinding part of the cars 1 and 2 is structured to prevent the coolant from flowing into the back side of the static pressure pads 15 and 16.

  That is, in the horizontal-axis double-sided surface grinding machine configured to rotate and support the workpiece W by the workpiece rotation support device 5 including the static pressure pads 15 and 16 as in this embodiment, a pair of grinding wheels rotating at high speed. When the front and back surfaces Wa and Wb of the workpiece W are ground simultaneously in 1 and 2, the grinding heat generated in the grinding part during grinding is applied to the grinding wheel shafts 3 of the grinding wheels 1 and 4 and the coolant supply paths 9 and 9 in the center inside. The grinding water supplied to the grinding surfaces 1a and 2a, which are grinding parts, is transmitted to the workpiece W or the like, and the grinding water heated by the grinding heat is rotated by the rotation of the workpiece W. In addition to being carried between 15 and 16, it is scattered by the rotation of the grinding wheels 1 and 2 and flows into the back surfaces of the static pressure pads 15 and 16, that is, the pad back surfaces 15b and 16b.

  On the other hand, the workpiece W is held in a non-contact manner from the surfaces of the left and right static pressure pads 15 and 16, that is, the pad surfaces 15 a and 16 a, by pad water (static pressure fluid) supplied between the pair of left and right static pressure pads 15 and 16. However, the pad water is temperature-adjusted so as to follow the machine temperature and is constantly ejected from the pad surfaces 15a, 16a, and is always discharged from the minute gap between the workpiece W and the static pressure pads 15, 16. Yes. The discharged pad water is falling downward by gravity.

  Accordingly, the grinding heat generated when grinding the workpiece W is transmitted to the grinding water supplied from the coolant supply passages 9 and 9 in the center of the grinding wheel shafts 3 and 4, and the grinding wheel rotating at high speed. From 1 and 2 to the grinding wheel insertion parts 17 and 17 of the static pressure pads 15 and 16 and falling, and a part is discharged to the back surfaces 15b and 16b of the static pressure pads 15 and 16 And (ii) what is transmitted to the workpiece W and (iii) what is transmitted to the grinding wheels 1 and 2.

  Among these three heat transfer paths of grinding (i) to (iii), those that affect the thermal deformation of the static pressure pads 15 and 16 include those of (i) and (ii). The test was conducted.

  When performing the following test, as shown in FIG. 3A, the distance between the pad surfaces 15a and 16a of both the static pressure pads 15 and 16 (pad Three distance sensors 40 for measuring the distance), that is, a distance sensor 40F in the vicinity of the lower end on the front side of the apparatus, a distance measuring sensor 40C in the upper position in the center of the apparatus, and a position in the vicinity of the lower end on the rear side of the apparatus. A distance measuring sensor 40R was installed.

  Further, two temperature sensors 45 for measuring the temperature of the pad surfaces 15a and 16a of the static pressure pads 15 and 16 are provided, that is, a temperature sensor 45F at a position below the static pressure pad on the front side of the apparatus and a static pressure on the rear side of the apparatus. A temperature sensor 45R below the pad was installed. These temperature sensors 45F and R indirectly measured the temperature of the pad surfaces 15a and 16a of the static pressure pads 15 and 16 from the water temperature of the pad water falling between the static pressure pads 15 and 16.

  FIG. 3B shows a warping mechanism due to thermal deformation of the static pressure pads 15 and 16 due to the grinding heat. As shown in the figure, the temperature of the pad surfaces 15a and 16a of the static pressure pads 15 and 16 is shown. Is lower than the pad back surfaces 15b and 16b, the pad back surfaces 15b and 16b are thermally expanded, while the pad surfaces 15a and 16a are thermally contracted, and the static pressure pads 15 and 16 are placed on the pad surfaces 15a and 16a. It will warp. When the temperature of the pad front surfaces 15a and 16a and the temperature of the pad back surfaces 15b and 16b are opposite to the above, the warping of the static pressure pads 15 and 16 is opposite to that shown in the figure.

(1) Test 1-Regarding the influence of the grinding water of (i) above:
In this test, in a horizontal double-sided surface grinder without the thermal deformation prevention device 6, as a substitute for grinding heat, hot water of about 50 ° C. is supplied from the coolant supply passage 9 at the center of the grindstone shafts 3 and 4. As the pad water ejected from the static pressure pads 15 and l6, the water adjusted to the machine temperature is used as the pad water, and the work W is supported by the work rotation support device 5 in the rotation stopped state and is rotated at a high speed. When the pair of grinding wheels 1 and 2 was brought close to the front and back surfaces Wa and Wb of the workpiece W, the influence of the static pressure pads 15 and 16 due to the grinding water scattered by the rotation of the grinding wheels 1 and 2 was examined.

  The results of Test 1 are shown in FIGS. 4 and 5, and from this test result, the gap between the lower portions of the static pressure pads 15 and 16 becomes narrow at both the front and rear positions of the apparatus simultaneously with the rotation of the grinding wheels 1 and 2. (See FIG. 4B), and the rotation of the grinding wheels 1 and 2 is stopped and the gap is returned to the base state before the rotation contact (the state shown in FIG. 4A) (FIG. 4B). It was found that the hot water (grinding water) scattered by the rotation of the grinding wheels 1 and 2 was warping the lower portions of the static pressure pads 15 and 16 toward the workpiece W side.

(2) Test 2-Influence of the rotation of the workpiece W in (ii) above:
In this test, as in Test 1, in the actual machining of the workpiece W using a horizontal-axis double-sided surface grinder without the thermal deformation prevention device 6, the rotation direction of the workpiece W is clockwise (CW) (FIG. 6 (a )) And counterclockwise (CCW) (FIG. 7A), the influence of the static pressure pads 15 and 16 due to the rotation of the workpiece W was examined.

  The results of Test 2 are shown in FIG. 6B and FIG. 7B. From the test results, the direction of rotation of the workpiece W is clockwise (CW) (FIG. 6A) and counterclockwise ( CCW) (FIG. 7A), the measurement results (temperature change) by the temperature sensors 45F and 45R at the lower positions of the front and rear sides of the static pressure pads 15 and 16 are switched, and the static pressure is correspondingly changed. It can be seen that the change tendency of the distance between the lower portions of the pads 15 and 16 is also switched between the front and rear sides of the apparatus (FIGS. 6B and 7B), and the heated grinding water is carried in the direction in which the workpiece W rotates. Turned out to be. From the above, the grinding heat is brought between the left and right static pressure pads 15 and 16 along with the rotation of the workpiece W by the water adhering to the workpiece W and the workpiece surfaces Wa and Wb, and the pad surface 15a of the static pressure pads 15 and 16 is transferred. , 16a was found to cause thermal expansion.

From the results of the above two tests 1 and 2, the temperature distribution of the pad front surfaces 15a and 16a and the pad back surfaces 15b and 16b at the lower part of the static pressure pads 15 and 16 is different between the front and rear sides of the device. It was found that the warping directions on the front and rear sides are different.
That is, taking the case where the rotation direction of the workpiece W is clockwise (CW) in normal operation (see FIG. 6A) as an example, the grinding wheels 1 and 2 and the workpiece W are in contact with each other with reference to FIG. When the grinding heat is generated, the warped state of the lower parts of the static pressure pads 15 and 16 is a basic state where the grinding wheels 1 and 2 are not in contact with the workpiece W (initial state before processing), that is, FIG. As shown in FIG. 8B, the direction in which the static pressure pads 15 and 16 warp on the rear side of the apparatus and the front side of the apparatus have no warpage is shown in FIG. As shown in FIG. 8C, the warp direction is opposite to the workpiece W, and the warping direction of the static pressure pads 15 and 16 on the front side of the device is warped toward the workpiece W as shown in FIG.

  Such a phenomenon is caused by the grinding heat brought in by the rotation of the workpiece W on the rear side of the static pressure pads 15 and 16 so that the temperature of the pad surfaces 15a and 16a of the static pressure pads 15 and 16 is lower than that of the pad back surfaces 15b and 16b. The pad surface 15a, 16a side is thermally expanded and the pad back surface 15b, 16b side is thermally contracted. Therefore, the distance between the static pressure pads 15, 16 increases (FIG. 8B), and the workpiece W Although the static pressure holding becomes unstable, the grinding on the workpiece W can be completed to the end without sandwiching the carrier device 20, and therefore it is acceptable. On the other hand, the pad surfaces 15a and 16a on the front side of the static pressure pads 15 and 16 have a temperature lower than that of the pad back surfaces 15b and 16b due to the influence of temperature-controlled pad water, so that the pad back surfaces 15b and 16b are thermally expanded. Then, the pad surfaces 15a and 16a side are thermally contracted (in the state shown in FIG. 3B) and warped toward the work W side, and the distance between the static pressure pads 15 and 16 is reduced (FIG. 8C). It has been found that the carrier ring 25 and the workpiece W of the carrier device 20 are caught, and in the worst case, the rotation of the workpiece W is stopped and damage to the workpiece W and the machine becomes a serious problem.

  Based on the knowledge obtained from the above test results, further test studies are performed, and a specific arrangement configuration of the heat shield plate (thermal deformation preventing means) 30 obtained based on the results will be described below.

  The heat shield plate 30 has a structure that prevents and prevents the grinding water (coolant) scattered from the grinding portion of the grinding wheels 1 and 2 from flowing into the pad back surfaces 15b and 16b of the pair of static pressure pads 15 and 16. Has been.

  Specifically, the heat shield plate 30 cuts down the temperature change of the pad back surfaces 15b and 16b as much as possible by blocking the grinding water that wraps around the pad back surfaces 15b and 16b of the static pressure pads 15 and 16 during grinding. In order to prevent the static pressure pads 15 and 16 from warping, in other words, to cover the inner periphery of the grinding wheel insertion portion 17 provided in the static pressure pads 15 and 16, as shown in FIG. The grinding wheels 1 and 2 are fixedly attached to the inner periphery of the grinding wheel insertion portion 17 of the static pressure pads 15 and 16 by fixing means (not shown) such as mounting bolts so as to cover the outer peripheral portions of the grinding wheels 1 and 2.

  Further, the heat shield plate 30 is slightly retracted from the surface of the static pressure pads 15 and 16 as shown in FIG. 2 in the attachment range in the front and back direction of the static pressure pads 15 and 16 in the grinding wheel insertion portion 17. From the position, it protrudes backward from at least the back surfaces of the static pressure pads 15 and 16 and extends to a position covering the rear ends of the grinding wheels 1 and 2 during grinding.

  That is, the heat shield plate 30 has a workpiece W on the pad surface 15a, 16a side of the static pressure pads 15, 16 at the time of grinding, so the pad back surface 15b from a position slightly lower than the pad surfaces 15a, 16a, The arrangement is such that it extends toward 16b and protrudes rearward from the pad back surfaces 15b and 16b.

  Here, it is ideal that the front edge of the heat shield plate 30 is set at a position slightly lower than the pad surfaces 15a and 16a so as to be flush with the pad surfaces 15a and 16a. Actually, since the gap between the static pressure pads 15 and 16 and the workpiece W is narrow, the front edge of the heat shield plate 30 is erroneously moved forward from the pad surfaces 15a and 16a by mistake when mounting the heat shield plate 30. This is to prevent the risk of popping out. Further, the reason why the rear edge of the heat shield plate 30 is set to protrude rearward from the pad back surfaces 15b and 16b is to prevent the grinding water heated by the grinding heat from flowing into the pad back surfaces 15b and 16b. It is.

  The heat shield plate 30 is made of a material having a lower thermal conductivity than metal. Specifically, the material of the heat shield plate 30 may be any material as long as it has flexibility capable of being along the inner periphery of the grinding wheel insertion portion 17, but has a thermal conductivity higher than that of metal. A resin material or a rubber material such as FRP (Fiber Reinforced Plastics), which has a low heat resistance and is expected to have a heat insulating effect, is inexpensive and has both flexibility and strength, and is preferably used. Also, any metal having a relatively low thermal conductivity can be used. In this case, a plate material having a low thermal conductivity is sandwiched between the static pressure pads 15 and 16 of the metal heat shield plate material. Thus, the heat shield plate 30 is configured. The constituent material of the heat shield plate 30 of this embodiment employs FRP as an ideal material.

  Then, the test result performed in order to investigate the thermal deformation suppression effect of the static pressure pads 15 and 16 by the thermal deformation prevention apparatus 6 provided with the heat shield plate 30 configured as described above will be described.

  In this test, the workpiece W was ground before and after mounting of the thermal deformation prevention device 6 in the horizontal-axis double-sided surface grinding machine of the present embodiment. The test results are shown in FIGS. 9 and 10, respectively.

  From this test result, since the distance between the pads on the front side of the static pressure pads 15 and 16 is too narrow in the grinding before mounting the thermal deformation prevention device 6, it fits into the notch portion Wn of the workpiece W and rotates integrally. The driven carrier device 20 was sandwiched between the left and right static pressure pads 15 and 16, and the carrier device 20 was locked, resulting in damage to all the teeth of the ring drive gear 24. The state in which the carrier device 20 is sandwiched between the static pressure pads 15 and 16 is shown in FIGS. 9A and 9B from the measurement result of the distance between the pad surfaces 15a and 16a of the static pressure pads 15 and 16 by the distance sensor 40F. It can be inferred from the fact that the change in the distance between the pad surfaces 15a and 16a is suddenly constant in the middle. At this point, it is considered that the static pressure pads 15 and 16 and the carrier device 20 are in contact with each other and no change in position occurs.

  On the other hand, after the thermal deformation prevention device 6 is attached, the workpiece W can be ground to the end, and as shown in FIG. 10, the pad surfaces 15a and 16a of the static pressure pads 15 and 16 by the distance sensors 40F and C are obtained. It can be seen from the measurement result of the distance between the pads that the amount of change in the distance between the pad surfaces 15a and 16a is about half that before the thermal deformation prevention device 6 is attached.

  Further, considering the estimated value shown in FIG. 9B (estimated value when the static pressure pads 15 and 16 continue to bend freely without interference with the carrier device 20), the static value after the thermal deformation preventing device 6 is attached is considered. It is predicted that the amount of change in the distance between the pad surfaces 15a and 16a of the pressure pads 15 and 16 can be suppressed to ¼ before the thermal deformation preventing device 6 is attached. That is, the amount of change in the distance between the pad surfaces 15a and 16a measured by the distance sensor 40F has not been measured due to the pinching phenomenon described above. However, if the graph is extended and connected as shown in FIG. It is expected to have changed to 160 μm. On the other hand, in the measurement result of the distance sensor 40R in which the distance between the pad surfaces 15a and 16a is increased, it can be seen that the amount of change in the distance between the pad surfaces 15a and 16a can be suppressed to about 2/3.

  Thus, in the double-head surface grinder configured as described above, the workpiece rotation support device 5 (the axial direction support means 10 and the radial direction support means 11) rotates and supports the workpiece W at the grinding position and rotates at high speed. A pair of grinding wheels 1 and 2 are cut into the grinding wheel shafts 3 and 4 in a predetermined amount of cutting, and the grinding surfaces 1a and 2a of the grinding wheels 1 and 2 make the front and back surfaces of the workpiece W. Wa and Wb are ground simultaneously.

  In this case, the grinding heat generated in the grinding part at the time of grinding is the grinding water (coolant) supplied to the grinding part via the grinding wheel shafts 3 of the grinding wheels 1 and 2, the coolant supply passages 9 and 9 in the center inside. When transmitted to the workpiece W or the like, the grinding water heated by the grinding heat is carried between the pair of static pressure pads 15 and 16 of the workpiece rotation support device 5 by the rotation of the workpiece W, and the grinding wheel 1 and There is a tendency to scatter by the rotation of 2 and flow into the pad back surfaces 15b, 16b side of the static pressure pads 15, 16.

  The grinding heat transmitted by the grinding water between the static pressure pads 15 and 16, that is, the pad surfaces 15 a and 16 a side and the pad back surfaces 15 b and 16 b side is heated at the pad surfaces 15 a and 16 a side and the pad back surfaces 15 b and 16 b side. Due to this, the static pressure pads 15 and 16 warp toward the workpiece W and interfere with the workpiece W and the carrier device 20 of the axial support means for supporting the workpiece W in the radial direction.

  However, according to the thermal deformation prevention device 6 of the present embodiment, the thermal deformation prevention device that suppresses thermal deformation of the static pressure pads 15 and 16 at the boundary portion between the static pressure pads 15 and 16 and the grinding wheels 1 and 2. 6 is provided, it is possible to effectively suppress thermal deformation of the static pressure pads 15 and 16 in the simultaneous processing of the front and back surfaces Wa and Wb of the workpiece W.

  That is, in the present embodiment, thermal deformation preventing means is provided at the boundary portion of the static pressure pads 15 and 16 with the grinding wheels 1 and 2, specifically, the grinding wheel insertion portion 17 of the static pressure pads 15 and 16. As a heat shield plate 30 is provided, the front and back surfaces of the static pressure pads 15 and 16, particularly the back surface side, from the ground portion of the grinding water that has caused a temperature difference between the front and back surfaces of the static pressure pads 15 and 16. As a result, the warpage to the workpiece W due to the thermal deformation of the static pressure pads 15 and 16 can be minimized.

  In order to confirm this effect, the thermal deformation of the static pressure pads 15 and 16 when the workpiece W is actually machined using the horizontal-axis double-sided surface grinding machine provided with the thermal deformation prevention device 6 of the present embodiment. A test was conducted to confirm.

  When performing this test, as in the above-described tests 1 and 2, as shown in FIG. 11, the pad surfaces 15a of both the static pressure pads 15 and 16 are formed on the pad surfaces 15a and 16a of the static pressure pads 15 and 16, respectively. , 16a for measuring the distance between the pads 16a, 16C, and 40R, and 2 for measuring the temperature of the pad surfaces 15a and 16a of the static pressure pads 15 and 16 Two temperature sensors 45F and 45R were installed below the static pressure pad.

  As a result of the test, as shown in FIG. 12, warpage of the static pressure pads 15 and 16 toward the workpiece W due to thermal deformation is reduced as much as possible (FIGS. 12B and 12C). It has been found that the interference between the workpieces 15 and 16 and the work device W or the carrier device 20 of the work rotation support device 5 can be effectively prevented, thereby preventing problems such as the inability to grind the work W.

Embodiment 2
This embodiment is shown in FIG. 13, and the configuration of the heat shield plate 30 is modified according to the shape of the static pressure pads 15 and 16.

  That is, as shown in FIG. 13, the grinding wheel insertion portion 17 provided on the static pressure pads 15 and 16 of the present embodiment has a portion corresponding to the upper half of the grinding wheels 1 and 2 of the grinding wheels 1 and 2. A linear contour having an arc-shaped inner diameter contour having a diameter slightly larger than the outer diameter, and a portion corresponding to the lower half portion of the grinding wheels 1 and 2 extending downward in the outer circumferential tangential direction of the grinding wheels 1 and 2 It is configured to do.

  Correspondingly, the heat shield plate 30 of the thermal deformation prevention device 6 provided in this part is along the entire inner peripheral length of the grinding wheel insertion portion 17, and both end portions 30 a and 30 a thereof are the grinding wheel insertion portion 17. The two ends 17a and 17a are further extended linearly downward in the vertical direction so as to cover the grinding wheels 1 and 2 below.

Therefore, in the thermal deformation prevention device 6 configured as described above, the outer peripheral portions of the grinding wheels 1 and 2 on the front and rear sides of the grinding wheel are completely shielded from the static pressure pads 15 and 16 by the heat shield plate 30. Thus, scattering of the grinding water to the lower end portions of the static pressure pads 15 and 16 can be completely prevented.
Other configurations and operations are the same as those of the first embodiment.

  The above-described embodiment is merely a preferred embodiment of the present invention, and the present invention is not limited to this, and various design changes can be made within the scope.

  For example, in the illustrated embodiment, the present invention is applied to a double-headed surface grinder that simultaneously grinds the front and back surfaces of a semiconductor wafer as shown in FIG. 14, but the workpiece W to be ground is other than this. Thin-walled disk-shaped workpieces are also included.

  Furthermore, as the specific configuration of the thermal deformation prevention device 6, other configurations than those shown in the drawings can be adopted as long as the same operational effects can be exhibited.

  For example, in the illustrated embodiment, as the thermal deformation preventing means, the heat insulating plate 30 provided along the inner periphery of the grinding wheel insertion portion of the static pressure pads 15 and 16 is used. Other components that can be used may also be employed.

  In addition, although the heat shield plate 30 of the illustrated embodiment is basically formed of a material other than metal, the inflow of the grinding water from the grinding portion to the back side of the static pressure pads 15 and 16 is effectively suppressed or prevented. It has been experimentally found that the heat shield plate 30 made of an iron plate can obtain the effect of suppressing the temperature difference between the front and back surfaces of the static pressure pads 15 and 16 with the structure.

  Furthermore, the heat shield plate 30 of the first embodiment is configured to cover only the entire inner peripheral length of the grinding wheel insertion portion 17 of the static pressure pads 15 and 16 as shown in FIG. Ears 30a and 30a extending vertically downward may be provided as shown by the above, and by adopting such a configuration, as in the case of the second embodiment, the outer peripheral portions of the grinding wheels 1 and 2 on the front and rear sides of the apparatus are provided. Since the static pressure pads 15 and 16 are completely shielded and coated, there is an effect that the scattering of the grinding water to the lower end portions of the static pressure pads 15 and 16 is completely prevented.

W Workpiece (semiconductor wafer)
Wn Workpiece notch
Wa Work surface Wb Work surface back 1, 2 Grinding wheel 1a, 2a Grinding surface 3, 4 Grinding wheel shaft 5 Workpiece rotation support device (work rotation support means)
6 Thermal deformation prevention device 7 Coolant supply path 10 Axial support means 11 Radial support means 15, 16 Static pressure pads 15 a, 16 a Pad surface 15 b, 16 b Pad back surface 17 Grinding wheel insertion part 20 of static pressure pad Carrier device 30 Thermal insulation Plate (heat deformation prevention means)
30a Ear of heat shield

Claims (6)

While rotating and supporting a thin disk-shaped workpiece by the workpiece rotation support part, a pair of grinding wheels rotating at high speed are cut in the direction of the grinding wheel axis, and both the front and back surfaces of the workpiece are simultaneously made by the grinding surfaces of these grinding wheel end faces. In a double-side grinding apparatus for grinding, a thermal deformation preventing apparatus for suppressing thermal deformation of a pair of static pressure pads of the work rotation support portion that supports both front and back surfaces of the workpiece in a non-contact state with a static pressure fluid,
A thermal deformation prevention device for a double-side grinding apparatus, wherein thermal deformation prevention means for suppressing thermal deformation of the static pressure pad is provided at a boundary portion of the static pressure pad with the grinding wheel. 2. The double-sided surface according to claim 1, wherein the thermal deformation preventing means is configured to prevent the coolant splashed from the grinding portion of the grinding wheel from flowing into the back side of the static pressure pad. Thermal deformation prevention device for grinding equipment. The heat deformation prevention means is in the form of a heat shield plate that is attached and fixed to the inner periphery of the grinding wheel insertion portion of the static pressure pad so as to cover the outer peripheral portion of the grinding wheel. The thermal deformation prevention apparatus of the double-sided grinding apparatus as described in 2. The heat shield plate protrudes rearward at least from the back surface of the static pressure pad from a position where the attachment range in the front and back direction of the grinding wheel insertion portion of the static pressure pad is slightly retracted from the surface of the static pressure pad. The thermal deformation preventing device for a double-side grinding device according to claim 2 , wherein the thermal deformation preventing device is provided so as to extend to a position covering a rear end of the grinding wheel during grinding. The thermal deformation prevention device for a double-sided grinding device according to claim 2 , wherein the heat shield plate is made of a material having a lower thermal conductivity than metal. A device for rotating and supporting a thin disk-shaped workpiece and cutting a pair of grinding wheels rotating at high speed in the direction of the grinding wheel axis, and simultaneously grinding the front and back surfaces of the workpiece by the grinding surfaces of both grinding wheel end faces. There,
A pair of grinding wheels arranged so that the grinding surfaces of the end faces face each other;
A workpiece rotation support means for supporting and rotating the workpiece in a state where the front and back surfaces of the workpiece are opposed to both grinding surfaces between the grinding surfaces of the pair of grinding wheels;
This work rotation support means comprises axial support means for positioning and supporting the workpiece in the axial direction, and radial support means for positioning and rotating the workpiece in the radial direction,
The thermal deformation prevention device according to any one of claims 1 to 5, wherein the axial support means includes a pair of static pressure pads that support both surfaces of the workpiece in a non-contact state with a static pressure fluid. A double-side grinding apparatus for thin-walled disk-shaped workpieces.

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