JP2014102547A - Conductive pattern-formed substrate, capacitive sensor sheet and method for manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To achieve a lower resistance of a transparent electrode without increasing the whole thickness of a transparent electrode layer and without causing an optical problem.SOLUTION: A conductive pattern-formed substrate is provided, which includes: a substrate 11 having light-transmitting property and having a groove 12 formed by etching or the like on an electrode-forming surface 11a; and a transparent electrode 13 comprising a light-transmitting conductive film, which is deposited on the electrode-forming surface 11a of the substrate so as to fill the groove 12 and to give an upper surface 13a thereof as a parallel and flat surface to the electrode-forming surface 11a of the substrate 11.

Description

  The present invention relates to a conductive pattern forming substrate, a capacitive sensor sheet configured using the conductive pattern forming substrate, and a method of manufacturing the capacitive sensor sheet.

  2. Description of the Related Art Conventionally, touch panels have been used as means for inputting information displayed on a screen in electronic devices such as mobile phones and personal computers. For example, a touch panel using a capacitive sensor sheet that detects a change in capacitance due to contact with a human finger or the like and detects a position touched by the human finger is known.

  As a sensor sheet used for a touch panel, for example, a transparent electrode made of ITO (indium tin oxide) or conductive ink is patterned on a base sheet (for example, see Patent Document 1 and Patent Document 2). ). In this case, the entire transparent electrode is generally formed on the base sheet with a constant thickness.

JP 2012-069049 A JP 2012-089595 A

  The resistance value of the transparent electrode disclosed in Patent Documents 1 and 2 is desirably low. However, if the thickness of the entire transparent electrode layer is increased in order to reduce the resistance of the transparent electrode, optical defects such as a decrease in total light transmittance and an increase in haze when used as a sensor sheet for a touch panel are caused. May occur.

  The objective of this invention is providing the electroconductive pattern formation board | substrate which has the transparent electrode which is excellent in an optical characteristic, and low resistance value, an electrostatic capacitance type sensor sheet, and its manufacturing method.

In order to solve the above problems, the present invention proposes the following means.
One embodiment of the present invention includes an insulating layer having light permeability and having a recess provided on a surface thereof, and a light-transmitting conductive film provided in an edge of the recess and in the recess of the surface. The thickness of the light-transmitting conductive film in the layer thickness direction of the insulator layer is such that the thickness in the region overlapping the recess when viewed from the layer thickness direction is greater than the thickness in the edge. The conductive pattern forming substrate.

  Moreover, the said recessed part may be directly formed in the surface of the said insulator layer.

  Further, the insulator layer has a base material and a transparent insulator film provided on a part of the surface of the base material, and the concave portion has the base material in a gap between the transparent insulator films. It may be an exposed area.

  Further, the insulator layer has a base material and a transparent insulator film laminated on the surface of the base material, and the concave portion is formed on the surface of the transparent insulator film, and the light transmissive property The conductive film may be laminated on the surface of the transparent insulator film.

  Moreover, the said recessed part may have at least 1 groove part long in one direction, and the said transparent conductive film may cover the said groove part.

  In addition, a plurality of light-transmitting conductive films covering the groove portions may extend in parallel to one direction of the surface direction of the insulator layer and may be arranged at intervals in a direction intersecting the one direction. Good.

  The plurality of light transmissive conductive films may be formed in a band shape.

  Further, the plurality of light transmissive conductive films have a relatively large area pad portion and a relatively small area thin wire portion when viewed from the layer thickness direction, and the thin wire portion is the groove portion. The pad portion is integrally formed with the pad portion so as to overlap with the pad portion when viewed from the layer thickness direction, and the pad portion has the groove portion when viewed from the layer thickness direction. A plurality may be provided with a gap between them in the extending direction.

  Another aspect of the present invention includes a first layer composed of the conductive pattern formation substrate of the above aspect and a second layer composed of the conductive pattern formation substrate of the above aspect, wherein the second layer is the second layer in the second layer. The capacitance type, wherein the groove portion is provided so as to overlap the first layer so that the direction in which the groove portion extends is a direction intersecting the groove portion in the first layer when viewed from the layer thickness direction. It is a sensor sheet.

  According to still another aspect of the present invention, there is provided a first insulator layer forming step of forming a first insulator layer having a first recess on a surface, and filling the first recess and having an upper surface on the first insulating layer. A first transparent electrode made of a light-transmitting conductive film is disposed on the first insulator layer so as to be a flat surface parallel to the surface of the body layer, out of the surface direction of the first insulator layer. A first electrode forming step of extending in parallel to each other and laminating, and a second recess on the surface of the first insulator layer so as to cover the upper surface of the first transparent electrode. A second insulator layer forming step of laminating two insulator layers, and the second insulation so as to fill the second recess and to have a flat surface parallel to the surface of the first insulator layer. A second transparent electrode made of a light transmissive conductive film is formed on the body layer along the surface direction of the second insulator layer and the first transparent electrode. A capacitive sensor sheet manufacturing method, characterized by comprising a second electrode forming step of laminating to extend in parallel with each other in a direction intersecting the transparent electrodes.

  Still another aspect of the present invention is an insulator layer forming step of creating an insulator layer having a recess on the surface, and filling the recess and making the upper surface a flat surface parallel to the surface of the insulator layer. On the insulator layer, an electrode forming step of laminating a transparent electrode made of a light transmissive conductive film so as to extend in parallel to one of the plane directions of the insulator layer, and the insulator layer forming step; With respect to the two conductive pattern forming substrates obtained in the electrode forming step, one of the two conductive pattern forming substrates is used as a lower layer and the other one of the two conductive pattern forming substrates. Is a superposition process in which the transparent electrode of the lower conductive pattern forming substrate and the transparent electrode of the upper conductive pattern forming substrate are combined so that they face each other in a crossing direction, and are laminated and integrated through the transparent adhesive layer And comprising A capacitive sensor sheet manufacturing method according to claim Rukoto.

  According to the conductive pattern forming substrate, the capacitive sensor sheet, and the method of manufacturing the same of the present invention, the concave portion on the surface of the insulator layer is filled with the light-transmitting conductive film, so that the other portion is filled in the concave portion. Since the thickness of the light-transmitting conductive film is increased, the resistance value of the transparent electrode can be made smaller than when there is no recess. Accordingly, the resistance of the transparent electrode can be reduced without increasing the thickness of the entire transparent electrode layer and without causing optical defects.

BRIEF DESCRIPTION OF THE DRAWINGS It is a block diagram of 1st Embodiment of the conductive pattern formation board | substrate of this invention, (a) is a top view, (b) And (c) is AA arrow sectional drawing of (a), It is sectional drawing at the time of changing the method of forming the recessed part of the surface. It is a figure for demonstrating the manufacturing process of the conductive pattern formation board | substrate when the method of forming the recessed part of the surface of an insulator layer is changed as a modification of the embodiment. It is a block diagram of 2nd Embodiment of the conductive pattern formation board | substrate of this invention, (a) is a top view, (b) And (c) is BB arrow sectional drawing of (a), It is sectional drawing at the time of changing the method of forming the recessed part of the surface. It is a block diagram of 3rd Embodiment of the conductive pattern formation board | substrate of this invention, (a) is a top view, (b)-(d) is CC sectional view taken on the line of (a), (b) And (c) is a cross-sectional view when the method of forming the recesses on the surface of the substrate is changed, and (d) is a cross-sectional view showing a modification. It is a figure which shows the structure of the modification of the embodiment, (a) is a top view, (b) is DD sectional view taken on the line of (a). It is a top view which shows the structure of the other modification of the embodiment. (A) thru | or (i) are process explanatory drawing of 1st Embodiment of the manufacturing method of the electrostatic capacitance type sensor sheet | seat of this invention. (A) thru | or (j) are process explanatory drawing of 2nd Embodiment of the manufacturing method of the electrostatic capacitance type sensor sheet | seat of this invention.

(First Embodiment of Conductive Pattern Forming Substrate)
Hereinafter, a first embodiment of a conductive pattern forming substrate of the present invention will be described with reference to the drawings. FIG. 1 is a configuration diagram of a first embodiment of a conductive pattern forming substrate according to the present invention, in which (a) is a plan view, and (b) and (c) are cross-sectional views taken along line AA in (a). . FIG. 1B and FIG. 1C are cross-sectional views when the method of forming the recesses is different.
The conductive pattern forming substrate of this embodiment can be suitably applied to a capacitive sensor sheet of a capacitive touch panel.

  As shown in FIGS. 1A, 1 </ b> B, and 1 </ b> C, the conductive pattern forming substrate 10 </ b> A includes a base material (insulator layer) 11 and a transparent electrode 13.

The base material 11 is an insulating member having optical transparency and having a groove (concave portion) 12 provided on an electrode forming surface (front surface) 11a.
Examples of the material of the substrate 11 include resin materials such as polyethylene terephthalate, polycarbonate, polymethyl methacrylate, polyarylate, and polyetherimide, and glass.

The groove 12 is formed by continuously extending linearly along the direction in which the strip-shaped transparent electrode 13 extends, and the width of the groove 12 (the direction along the surface of the substrate 11 and perpendicular to the direction in which the groove 12 extends). The size measured in (1) is set to be constant in consideration of improvement in the visibility of the object viewed through the conductive pattern forming substrate 10A and ease of processing of the groove 12.
Considering the disassembly ability related to the visibility of the human eye, if the width of the groove 12 is set to 30 μm or less, preferably 20 μm or less, it becomes difficult to recognize the groove 12 with the human eye. Does not interfere with sex. In addition, the depth of the groove 12 is preferably 0.1 μm to 0.7 μm.

As shown in FIG. 1B, the groove 12 is formed directly on the electrode forming surface 11a of the substrate 11 by etching or the like. Moreover, as shown in FIG.1 (c), the groove part 12 may form the transparent insulator film | membrane 14 partially in the electrode formation surface 11a of the base material 11 by printing, such as an inkjet. When the transparent insulator film 14 is formed on the substrate 11 as shown in FIG. 1C, the lacking portion 14S of the transparent insulator film 14 can be used as the groove portion 12.
Examples of the material of the transparent insulator film 14 include acrylic resins, alkyd resins, polyurethane, acrylic urethane, urethane acrylate, polyamide, polycarbonate, polyester, polyvinyl acetate, polystyrene, polyacetal, polyamide, polyvinyl alcohol, and the like. And the like.

  The transparent electrode 13 is a light-transmitting conductive film laminated on the electrode forming surface 11a of the base material 11 so that the recess 12 is filled and the upper surface 13a is a flat surface parallel to the surface of the electrode forming surface 11a of the base material 11. It becomes more.

The transparent electrode 13 covers at least the groove 12 and a part of the electrode forming surface 11a of the substrate 11 and is formed in a strip shape having a width larger than the width of the groove 12 in this embodiment. That is, the transparent electrode 13 is disposed on the edge of the groove portion 12 and in the groove portion 12 on the surface of the substrate 11. In the present embodiment, the edge of the groove 12 refers to a region on the electrode forming surface 11a located at both ends in the width direction of the groove 12 when the substrate 11 is viewed from a direction orthogonal to the electrode forming surface 11a. Point to.
A plurality of transparent electrodes 13 covering the groove 12 are arranged in parallel to each other in one direction of the surface direction of the substrate 11 and at a predetermined interval in a direction intersecting the one direction. As the material for the transparent electrode 13, a transparent conductive material that can be wet-formed is suitable, and it is possible to employ a solution in which a conductor such as ITO ink, metal nanowires, conductive fine particles, or carbon material is dispersed in a solvent. it can.

The operation of the conductive pattern 10A having the above-described configuration will be described.
In the present embodiment, the transparent electrode 13 is laminated in the groove 12 formed on the electrode forming surface 11a. For this reason, the thickness of the transparent electrode in the layer thickness direction of the base material 11 is thicker in the groove portion 12 than in the groove portion 11. As a result, the thickness t2 of the transparent electrode 13 in the portion where the groove portion 12 is filled can be made thicker than the thickness t1 of the transparent electrode 13 in the other portion, so that compared to the case where the groove portion 12 is not provided, The resistance value of the transparent electrode 13 is smaller when the groove 12 is provided.

  By the way, even if the transparent electrode 13 is simply thickened without providing the groove 12, the resistance value of the transparent electrode 13 can be reduced. However, when the groove 12 is not provided, the entire thickness of the conductive pattern forming substrate 10A is increased.

  Further, when the transparent electrode 13 is simply thickened, the difference between the color tone of the transparent electrode 13 itself and the color tone of the base material 11 itself becomes large, and the boundary of the transparent electrode 13 disposed on the base material 11 becomes clear, An optical defect that the pattern of the transparent electrode 13 is visible to the user is likely to occur.

  On the other hand, in this embodiment, although the difference in color tone between the groove portion 12 and the base material 11 is large, the portion where the transparent electrode 13 is laminated outside the groove portion 12 is between the base material 1. The difference in color tone is not so large. That is, the color tone changes stepwise from the color of the base material 11 itself (or the base material 11 and the transparent insulator film 14) to the part where the influence of the color of the transparent electrode 13 is the largest. Therefore, the boundary line of the pattern of the transparent electrode 13 is difficult to see.

  Thus, in the present embodiment, it is possible to reduce the resistance of the transparent electrode 13 while reducing the thickness of the conductive pattern forming substrate 10A without impairing the visibility (no optical failure). .

  In addition, the position and number of grooves 12 can be set arbitrarily. For example, in the present embodiment, the groove portion 12 is provided at the center of the width of the transparent electrode 13, but the groove portion 12 may be provided at a position near the end of the transparent electrode 13 in the width direction. Further, the number of the groove portions 12 may be plural per one row of the transparent electrodes 13.

  Further, the upper surface of the transparent electrode 13 may not be flat. For example, the transparent electrode 13 extends along the surface of the base material 11 and extends outward in the width direction of the transparent electrode 13 in a direction orthogonal to the direction in which the groove 12 extends (hereinafter referred to as “the width direction of the transparent electrode 13”). You may curve so that layer thickness may become thin. In this case, the color tone of the transparent electrode 13 becomes a gradation that gradually becomes thinner toward the outer side in the width direction, and the boundary between the transparent electrode 13 and the base material 11 becomes unclear when viewed from the layer thickness direction of the base material 11. The pattern of the transparent electrode 13 is difficult to see.

2A to 2D, a transparent insulator film 14 is laminated over the entire surface of the substrate 11 (see FIGS. 2A and 2B). Next, a groove 12 is formed on the surface of the transparent insulator film 14 (see FIG. 2C), and then a transparent electrode 13 is laminated on the groove 12 (see FIG. 2D). Also good.
Examples of the method for forming the groove 12 include a chemical method such as press molding, other machining, or etching.

  In this case, although the transparent insulator film 14 is interposed between the transparent electrode 13 and the base material 11 and the transparent electrode 13 and the base material 11 may not be in direct contact with each other, the same effects as those of the above-described embodiment are achieved.

(Second Embodiment of Conductive Pattern Forming Substrate)
Next, a second embodiment of the conductive pattern forming substrate of the present invention will be described. FIG. 3 is a configuration diagram of a second embodiment of the conductive pattern forming substrate of the present invention, where (a) is a plan view, and (b) and (c) are cross-sectional views taken along line BB in (a). It is sectional drawing at the time of changing the way of forming the recessed part of the surface of a base material.
As shown in FIGS. 3A and 3B, in the conductive pattern forming substrate 10 </ b> B of this embodiment, three grooves 12 are provided for each row of transparent electrodes 13. As shown in FIG. 3B, the groove 12 may be formed directly on the electrode forming surface 11a of the substrate 11 by etching or the like. Further, as shown in FIG. 3C, the groove 12 may partially form the transparent insulator film 14 on the electrode forming surface 11 a of the substrate 11 by printing such as inkjet.
The transparent insulator film 14 may be formed by first uniformly coating on the base material 11 and then applying a pattern other than the groove 12 by ink jet printing or the like.

  Further, the width, depth, and number of the grooves 12 may be changed depending on the position on the array of the transparent electrodes 13 or the position in the extending direction. By doing so, a gradation effect can be given to the visual influence due to the presence of the groove 12, and the pattern appearance can be reduced.

The conductive pattern forming substrates 10A and 10B described in the first and second embodiments detect the position on the two-dimensional plane by overlapping two transparent electrodes 13 so as to extend in directions intersecting each other. It becomes a sensor sheet.
In this case, at the intersection of the transparent electrodes 13 of both layers (the position overlapping when viewed from the thickness direction of the sheet), the transparent electrode 13 is locally thickened by overlapping the groove 12, and the transparent electrode 13 is overlapped. There is a possibility that a difference in color tone may occur in the non-overlapping part. In such a case, the difference in color tone becomes inconspicuous by omitting the groove 12 at a portion where the transparent electrodes 13 intersect or by reducing the size of the groove 12.

(Third embodiment of conductive pattern forming substrate)
Next, a third embodiment of the conductive pattern forming substrate of the present invention will be described. 4A and 4B are configuration diagrams of a conductive pattern forming substrate 10C according to a third embodiment of the conductive pattern forming substrate of the present invention. FIG. 4A is a plan view, and FIGS. 4B to 4D are CC views of FIG. It is arrow sectional drawing, (b) And (c) is sectional drawing at the time of changing how to form the recessed part of the surface of a base material, (d) is sectional drawing which shows a modification.
In the conductive pattern forming substrate 10C of the present embodiment, as shown in FIG. 4A, the conductive pattern forming substrate 10C extends in parallel with one direction of the surface direction of the base material 11 and is spaced at a certain interval in the direction intersecting the one direction. When the plurality of transparent electrodes 23 arranged are viewed from a direction orthogonal to the surface direction of the base material 11 (the layer thickness direction of the base material 11), the transparent electrodes 23 are relatively large relative to the square-shaped pad portion 23A. And a thin wire portion 23B having a small area.

  The pad portions 23A are aligned and arranged with a gap therebetween in the direction in which each transparent electrode 23 extends. The thin wire portion 23B is provided between the pad portions 23A so as to connect the pad portions 23A when viewed from the layer thickness direction of the substrate 11. Further, between the transparent electrodes 23 adjacent to each other in the direction orthogonal to the extending direction of each transparent electrode 23, the vertices of the pad portion 23A are close to each other, but are kept in a non-conductive state. The transparent electrode 23 is not formed between the pad portions 23A arranged in a lattice pattern in the surface of the base material 11, and a substantially square space 24 in which the surface of the base material 11 is exposed is secured. .

In this embodiment, the groove part 22 is provided in the position which overlaps with the thin wire | line part 23B, when it sees from the layer thickness direction of the base material 11. FIG. Further, in the present embodiment, the groove portion 22 is not provided at a position overlapping the pad portion 23 </ b> A when viewed from the layer thickness direction of the base material 11.
As shown in FIG. 4B, the groove 22 may be formed directly on the electrode forming surface 11 a of the base material 11 by etching or the like. Moreover, as shown in FIG.4 (c), the groove part 22 may comprise the transparent insulator film | membrane 14 partially formed in the electrode formation surface 11a of the base material 11 by printing, such as an inkjet. The width of the groove portion 22 (the size measured along the surface of the base material 11 and perpendicular to the direction in which the groove portion 22 extends) is set to a dimension hidden under the thin wire portion 23B of the transparent electrode 23. The thin wire portion 23 </ b> B 23 covers at least the groove portion 22 and a part of the electrode forming surface 11 a of the substrate 11.

  In the present embodiment, the thin wire portion 23 </ b> B is formed in a strip shape having a width larger than the width of the groove portion 22. That is, the thin wire portion 23 </ b> B of the transparent electrode 23 is disposed on the edge of the groove portion 22 and in the groove portion 22 on the surface of the base material 11. In addition, the edge of the groove part 22 refers to the area | region on the electrode formation surface 11a located in the both ends of the width direction of the groove part 22 when the base material 11 is seen from the direction orthogonal to the electrode formation surface 11a. Also in this embodiment, the width of the groove portion 22 is set to be constant in consideration of the improvement in the visibility of the object viewed through the conductive pattern forming substrate 10C and the processability of the groove portion 22, For example, it is set to 30 μm or less, preferably 20 μm or less. In addition, the depth of the groove 22 is preferably 0.1 μm to 0.7 μm.

  As a modification of the relationship between the width of the groove portion 22 and the width of the thin wire portion 23B of the transparent electrode 23, the width of the groove portion 22 is set equal to the width of the thin wire portion 23B of the transparent electrode 23 as shown in FIG. May be.

  In the present embodiment, the thin wire portion 23B of the transparent electrode 23 is laminated in the groove portion 22 formed on the electrode forming surface 11a. For this reason, the thickness of the thin wire portion 23 </ b> B of the transparent electrode 23 in the layer thickness direction of the substrate 11 is thicker inside the groove portion 22 than outside the groove portion 21. As a result, the thickness of the transparent electrode 23 in the portion where the groove portion 22 is filled can be made thicker than the thickness of the transparent electrode 23 in the other portion, and the resistance value of the thin wire portion 23B of the transparent electrode 23 can be reduced. . In particular, in the thin wire portion 23B where the possibility of an increase in resistance value is high, the groove portion 22 is formed, so that the resistance value can be lowered as compared with the case where the groove portion 22 is not formed.

(Modification 1)
Next, a modification of the third embodiment will be described. 5A and 5B are configuration diagrams of the present modification, in which FIG. 5A is a plan view and FIG. 5B is a cross-sectional view taken along the line DD in FIG.
As shown in FIG. 5, in the conductive pattern forming substrate 10D of the present embodiment, the groove portion 22 extends linearly and continuously below the pad portion 23A and the fine wire portion 23B.
Even with such a configuration, the same effects as those of the third embodiment can be obtained. Further, in this modification, the transparent electrode 13 disposed in the groove 22 reduces the resistance value of the thin wire portion 23B as shown in the third embodiment, and in addition, reduces the resistance value of the pad portion 23A. It is intended to reduce.
Further, in comparison with the case where the groove portion 22 is formed only in the region corresponding to the thin wire portion 23B, in this modification, the groove portion 22 is configured by forming a linearly continuous groove, and therefore, manufacturing is easy. is there.

(Modification 2)
Next, another modification of the third embodiment will be described. FIG. 6 is a plan view showing the configuration of this modification.
As shown in FIG. 6, in the conductive pattern forming substrate 10E of the present modification example, another groove portion 22B intersecting with the groove portion 22 extending linearly and continuously is provided below the pad portion 23A. It differs from 4th Embodiment and its modification 1.
In this modification, the another groove portion 22B can further reduce the resistance value of the pad portion 23A by disposing the transparent electrode 13 inside the other groove portion 22B.

  The conductive pattern forming substrates 10C to 10E shown in FIGS. 4 to 6 are also laminated in two layers, and the extending directions of the transparent electrodes 23 of the conductive pattern forming substrates of the respective layers are set to intersect each other. A sensor sheet for detecting a position on a two-dimensional plane can be configured. At this time, the pad portions 23A of the transparent electrodes 23 of both layers are alternately arranged, and the pad portions 23A of one layer are overlapped so as to be positioned in a substantially square space 24 between the pad portions 23A of the other layer. Is preferred.

(1st Embodiment of the manufacturing method of an electrostatic capacitance type sensor sheet)
Next, 1st Embodiment of the manufacturing method of the electrostatic capacitance type sensor sheet | seat of this invention is described.
In the present embodiment, a sensor sheet manufacturing method for detecting a position on a two-dimensional plane (XY plane) defined by two directions (X direction and Y direction) orthogonal to each other will be exemplified.
FIG. 7A to FIG. 7I are process explanatory views of the first embodiment of the method of manufacturing the capacitive sensor sheet.

  When two directions orthogonal to each other along the surface direction of the sheet are defined as an X direction and a Y direction, in this embodiment, first, the layer thickness of the substrate 11 (first insulator layer, see FIG. 7A). As shown in FIG. 7B, a first groove portion 12X along one direction (X direction, the depth direction in the drawing in FIG. 7B) is formed on one surface of the direction. As shown in an enlarged view in FIG. 7C, a plurality of groove portions 12X are formed in parallel with each other with a gap.

The first groove portion 12X can be formed by etching the electrode forming surface 11a of the substrate 11. The method of forming the groove 12X by etching may be wet etching or dry etching. Moreover, you may form the groove part 12X in the base material 11 by machining.
When the groove 12X is formed by etching, it is easier to form the groove 12X than by fine machining, and when the groove 12X is formed by machining, the etching conditions of the groove 12X are not varied. Accuracy can be increased.

Next, as shown in FIGS. 7D and 7E, the groove portion 12 of the electrode forming surface 11 a of the base material 11 is filled, and the upper surface 13 a becomes a flat surface parallel to the electrode forming surface 11 a of the base material 11. Thus, on the base material 11, the 1st transparent electrode 13X which consists of a transparent conductive film 13P is extended and laminated | stacked mutually parallel to a X direction.
As a method for forming the first transparent electrode 13X, for example, first, as shown in FIG. 7D, a solution of the light-transmitting conductive film 13P is formed to a certain thickness so as to cover the groove 12X and other surfaces in the base material 11. Then, as shown in FIG. 7E, patterning can be performed after the solution of the light transmissive conductive film 13P is cured.
As another method for forming the first transparent electrode 13X, for example, a method of printing the solution of the light transmissive conductive film 13P on the electrode forming surface 11a of the substrate 11 by screen printing can be employed.
Further, as another method for forming the first transparent electrode 13X, for example, a solution of the light transmissive conductive film 13P may be printed in a pattern shape by ink jet printing.

  FIGS. 7 (f) to 7 (i) are views of the substrate 11 as viewed by rotating the orientation of the substrate 11 by 90 ° in the plane with respect to FIG. 7 (e). FIG. 7F is a view showing the structure shown in FIG. 7E by rotating the substrate 11 and the first transparent electrode 13X by 90 °, and the X direction in which the groove 12X extends is shown in FIG. Is the left-right direction on the page.

  As shown in FIG. 7 (g), a transparent insulator layer having a second concave portion 24Y along the Y direction on the surface so as to cover the upper surface of the first transparent electrode 13X (second insulating layer) Insulator layer) 24 is laminated. The second groove 24Y on the surface of the transparent insulator layer 24 is formed by, for example, applying the entire surface of the first layer of transparent insulating material and partially applying the second layer of transparent insulating material by screen printing or inkjet printing, for example. can do. In addition, the second groove 24Y may be formed by etching or machining the transparent insulator layer stacked on the first transparent electrode 13X.

Next, as shown in FIG. 7 (h), the second groove 24Y is filled and the light is applied on the transparent insulator layer 24 so that the upper surface 13a is a flat surface parallel to the electrode forming surface 11a of the substrate 11. A transparent conductive film 13P is stacked.
Further, as shown in FIG. 7 (i), after the light transmissive conductive film 13P is cured, the cured product of the light transmissive conductive film 13P is patterned to cover the second groove 24Y and extend in the Y direction. The transparent electrode 13Y is formed.
Thus, the capacitive sensor sheet 30A is completed.

(Second Embodiment of Manufacturing Method of Capacitive Sensor Sheet)
Next, 2nd Embodiment of the manufacturing method of the electrostatic capacitance type sensor sheet | seat of this invention is described.
FIG. 8A to FIG. 8J are process explanatory views of a second embodiment of the method of manufacturing a capacitive sensor sheet.
In the method of the present embodiment, the transparent electrode 13X along the X direction is covered so as to cover the groove 12X along the X direction of the electrode forming surface 11a of the substrate 11 in the steps shown in FIGS. Then, the first conductive pattern forming substrate 10X is formed.
8G to 8I, the transparent electrode 13Y along the Y direction is formed so as to cover the groove 12Y along the Y direction of the electrode forming surface 21a of the insulator layer 21. Then, the second conductive pattern forming substrate 10Y is formed.

For example, as shown in FIGS. 8A to 8F, the first conductive pattern formation substrate 10X is formed on one of both surfaces in the layer thickness direction of the base material 11 (see FIG. 8A). As shown in FIG. 8C, a plurality of groove portions 12X are formed. The groove 12X is formed by etching, for example.
Subsequently, as shown in FIGS. 8C and 8D, a light-transmissive conductive film 13P is uniformly applied so as to cover the groove 12X, and etching is performed as shown in FIG. 8E. For example, the first transparent electrode 13X is patterned.
Further, as shown in FIGS. 8G to 8I, the second conductive pattern forming substrate 10Y has the transparent insulating film 14 partially formed on the electrode forming surface 21a of the insulating layer 21 by printing such as inkjet. The groove portion 12Y is formed by the lack portion 14S of the transparent insulator film 14 formed.
In addition, the formation method of the groove parts 12X and 12Y is not limited to the above combination.

  Conductive pattern formation substrate 10Y created through the steps (g) to (i) on the conductive pattern formation substrate 10X created through the steps shown in FIGS. The transparent electrodes 13X of the substrate 10X are combined so that the extending direction of the transparent electrodes 13Y of the upper conductive pattern forming substrate 10Y and the extending direction of the transparent electrodes 13Y face each other. Thus, the capacitive sensor sheet 30B is completed.

  In this case, as shown in FIG. 8 (j), the transparent adhesive layer 20 is combined so that the insulating layer 14 of the upper conductive pattern forming substrate 10Y is in contact with the transparent electrode 13X of the lower conductive pattern forming substrate 10X. The lower conductive pattern forming substrate 10X may be overlapped with the upper conductive pattern forming substrate 10Y, but the upper conductive pattern forming substrate 10Y is turned upside down so that the transparent electrode of the lower conductive pattern forming substrate 10X The transparent electrode 13Y of the lower conductive pattern forming substrate 10Y and the transparent electrode 13Y of the lower conductive pattern forming substrate 10Y, which are opposed to each other, are combined so that the transparent electrode 13Y of the upper conductive pattern forming substrate 10Y is opposed to the transparent electrode 13Y of the lower conductive pattern forming substrate 10Y. An insulating transparent adhesive layer may be interposed between the two layers.

  In the above-described embodiment, the case where the concave portions are the groove portions 12, 12X, 12Y, and 24Y has been described. However, a concave portion that exists in a dot shape may be provided instead of the groove portions.

10A, 10B, 10C, 10D, 10E, 10X, 10Y Conductive pattern forming substrate 11 Base material (insulator layer, first insulator layer)
11a, 21a Electrode forming surface (surface)
12, 12X, 12Y, 22, 22B, 24Y Groove (recess)
13, 13X, 13Y, 23 Transparent electrode 13a Upper surface 14 Transparent insulator film 14S Lack portion 20 Transparent adhesive layer 21 Second insulator layer 23A Pad portion 23B Fine wire portion 30A, 30B Capacitive sensor sheet

Claims (11)

An insulator layer having light transmission and a recess provided on the surface;
A light transmissive conductive film provided in an edge of the recess and in the recess of the surface;
With
The thickness of the light-transmitting conductive film in the layer thickness direction of the insulator layer is such that the thickness in the region overlapping with the concave portion when viewed from the layer thickness direction is greater than the thickness in the edge. Conductive pattern forming substrate.   The conductive pattern forming substrate according to claim 1, wherein the concave portion is formed directly on a surface of the insulator layer. The insulator layer is
A substrate;
A transparent insulator film provided on a part of the surface of the substrate;
Have
The conductive pattern forming substrate according to claim 1, wherein the concave portion is a region where the base material is exposed in a gap between the transparent insulator films. The insulator layer is
A substrate;
A transparent insulator film laminated on the surface of the substrate;
Have
The recess is formed on the surface of the transparent insulator film,
The conductive pattern forming substrate according to claim 1, wherein the light transmissive conductive film is laminated on a surface of the transparent insulator film. The recess has at least one groove that is long in one direction,
The conductive pattern forming substrate according to claim 1, wherein the light transmissive conductive film covers the groove.   A plurality of light-transmitting conductive films covering the groove portions are arranged in parallel to each other in one of the surface directions of the insulator layer and spaced apart in a direction intersecting the one direction. The conductive pattern forming substrate according to claim 5.   The conductive pattern forming substrate according to claim 5, wherein the plurality of light transmissive conductive films are formed in a band shape. The plurality of light-transmitting conductive films have a relatively large area pad portion and a relatively small area thin line portion when viewed from the layer thickness direction,
The thin line portion is formed integrally with the pad portion so as to extend along the groove portion and overlap the pad portion when viewed from the layer thickness direction,
The conductive pattern forming substrate according to claim 5, wherein a plurality of the pad portions are provided with a gap therebetween in a direction in which the groove portion extends when viewed from the layer thickness direction. A first layer comprising the conductive pattern formation substrate according to any one of claims 5 to 8,
A second layer comprising the conductive pattern forming substrate according to any one of claims 5 to 8,
Have
The second layer is provided so as to overlap the first layer so that a direction in which the groove portion in the second layer extends is a direction intersecting with the groove portion in the first layer when viewed from the layer thickness direction. A second layer,
A capacitance type sensor sheet comprising: A first insulator layer forming step of creating a first insulator layer having a first recess on the surface;
A first transparent layer made of a light-transmitting conductive film is formed on the first insulator layer so as to fill the first recess and to have a flat surface parallel to the surface of the first insulator layer. A first electrode forming step of laminating electrodes in parallel with each other in one of the surface directions of the first insulator layer; and
A second insulator layer forming step of laminating a second insulator layer having a second recess on the surface on the first insulator layer so as to cover the upper surface of the first transparent electrode;
A second transparent layer made of a light-transmitting conductive film is formed on the second insulator layer so as to fill the second recess and to have a flat surface parallel to the surface of the first insulator layer. A second electrode forming step of laminating the electrodes along the surface direction of the second insulator layer and extending in parallel with each other in a direction intersecting the first transparent electrode;
A method for producing a capacitive sensor sheet, comprising: An insulator layer forming step of creating an insulator layer having a recess on the surface;
A transparent electrode made of a light-transmitting conductive film is formed on the insulator layer so that the concave portion is filled and the upper surface is a flat surface parallel to the surface of the insulator layer. An electrode forming step of extending in parallel to each other and laminating;
With respect to the two conductive pattern forming substrates obtained in the insulator layer forming step and the electrode forming step, one of the two conductive pattern forming substrates is used as a lower layer and two conductive patterns are formed. The other one of the substrates is the upper layer, and the transparent electrode of the lower conductive pattern forming substrate and the transparent electrode of the upper conductive pattern forming substrate are combined so as to face each other and laminated through the transparent adhesive layer And the superposition process to integrate,
A method for producing a capacitive sensor sheet, comprising:

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