JP2014101535A - Alignment mechanism of substrate processing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an alignment mechanism of a substrate processing device capable of aligning a substrate and a mask that are made upright at high accuracy.SOLUTION: An alignment mechanism of a substrate processing device for opposing a mask M to a principal plane of a substrate Sb comprises: a mask frame 13 for supporting the upright mask M; a chuck plate on which the substrate Sb is located; a substrate frame 15 for rotating the chuck plate between an initial position and an upright position at which the principal plane of the substrate Sb is opposed to a principal plane of the mask M; a detection part for detecting positional deviation of the substrate Sb and the mask M supported by the chuck plate at the upright position; and a parallel link mechanism for displacing the chuck plate at the upright position when the positional deviation of the substrate Sb and the mask M is detected.

Description

  The present invention relates to an alignment mechanism that is provided in a substrate processing apparatus that performs processing such as film formation and exposure on a substrate through a mask, and performs alignment between the substrate and the mask.

  Conventionally, when manufacturing a flat panel display such as an organic EL display or a liquid crystal display, a solar battery panel, or the like, a substrate on which a film forming material is attached to a substrate through a mask or exposed through the mask Many processing devices are used. For example, as one of the substrate processing apparatuses, there is a vapor deposition apparatus that sublimates a film forming material and adheres to the substrate. In a general vapor deposition apparatus, the main surface of the substrate is held horizontally and a mask is overlaid on the substrate. Film formation is performed.

  On the other hand, in recent years, with an increase in area of flat panel displays and the like, substrates and masks have also increased in area. When the area of the substrate and the mask is increased, the deflection at the center portion increases due to their own weight. When the substrate bends greatly, a positional deviation occurs between the opening of the mask and the film formation target area of the substrate, so that the film forming material adheres to an area other than the film formation target area or a part of the film formation target area. There arises a problem that the film forming material does not adhere to the substrate. A conventional alignment mechanism is difficult to align with a substrate that cancels the deflection of the substrate.

  In order to solve this problem, a film forming apparatus that performs vapor deposition in a state where the substrate is vertically set has been proposed (for example, Patent Document 1). In this apparatus, bending due to the weight of the substrate is suppressed.

JP 2010-62043 A

By the way, in the film-forming apparatus mentioned above, after aligning a board | substrate vertically, alignment is performed by moving a shadow mask with respect to a board | substrate by an alignment part.
However, when the substrate is set up vertically compared to the case where the substrate is placed horizontally, alignment is required in consideration of the gap between the substrate and the mask. That is, when the substrate is placed horizontally, the mask and the substrate are overlapped so that there is no gap between the substrate and the mask. However, when the substrate is set up vertically, there is no gap between the substrate and the mask. As a result, the main surface of the substrate may not be parallel to the main surface of the mask.

  On the other hand, many conventional alignment mechanisms have a stage in which a substrate or mask is leveled, rotated about the normal direction of its main surface, and translated in the vertical direction. When this alignment mechanism is adopted in a substrate processing apparatus that vertically stands the substrate or mask, the alignment operation may not be performed smoothly in order to displace the shadow mask or substrate against gravity, Accuracy may be reduced.

  The present invention has been made in view of the above problems, and an object thereof is to provide an alignment mechanism of a substrate processing apparatus capable of aligning an upright substrate and a mask with high accuracy.

  An alignment mechanism of a substrate processing apparatus that solves the above problem is the alignment mechanism of a substrate processing apparatus in which a mask is opposed to a main surface of a substrate, and a mask support portion that supports the upright mask and the substrate are placed thereon. A substrate mounting portion; a rotation mechanism that rotates the substrate mounting portion between an initial position and an upright position in which a main surface of the substrate is opposed to a main surface of the mask; A detection unit for detecting a positional deviation between the substrate and the mask supported by the substrate mounting unit, and a displacement of the substrate mounting unit at the upright position when a positional deviation between the substrate and the mask is detected. And a parallel link mechanism.

  According to this aspect, since the substrate mounting portion in the upright position is displaced by the parallel link mechanism, the conventional substrate mounting portion that rotates about the normal direction of the substrate and moves up and down along the normal direction is used. In comparison, the position of the substrate mounting portion can be finely adjusted. For this reason, even when processing is performed on an upright substrate, alignment between the substrate and the mask can be performed with high accuracy.

  With respect to the alignment mechanism of the substrate processing apparatus, the parallel link mechanism includes a pair of link devices provided at each of at least two corners of the substrate platform, and the pair of link devices connected to the corners. It is preferable that the central axes are orthogonal to each other, and the connection points with the substrate mounting portion are respectively arranged toward the corner portions.

According to this aspect, since the parallel link mechanism includes a pair of link devices at at least two corners of the substrate platform, the robustness of the substrate platform in the upright position can be improved.
With respect to the alignment mechanism of the substrate processing apparatus, the parallel link mechanism is a pair of link apparatuses whose central axes are orthogonal to each other, and at least one of the corners in the vertical direction of the substrate mounting portion in the upright position. It is preferable to be provided.

  According to this aspect, the parallel link mechanism includes a pair of link devices whose central axes are orthogonal to each other, at least one of the corner portions below the substrate mounting portion in the vertical direction. For this reason, since the link device presses against the load of the substrate mounting portion from below, it is possible to stabilize the posture of the substrate and perform highly accurate alignment.

Regarding the alignment mechanism of the substrate processing apparatus, it is preferable that the parallel link mechanism includes the link device asymmetrically with respect to a vertical axis on the substrate mounting portion in an upright position.
According to this aspect, since the parallel link mechanism is provided with the link device asymmetrically with respect to the vertical axis, it is possible to improve the robustness of the substrate mounting portion in the upright position.

  With respect to the alignment mechanism of the substrate processing apparatus, the parallel link mechanism includes a first link device that is connected to a lower side of the substrate mounting portion in an upright position and has a central axis horizontally connected to a corner on one side; A second link device connected to a lower corner of one side of the substrate mounting portion in the upright position with a central axis orthogonal to the central axis of the first link device; and the substrate in the upright position A third link device that is connected to one side of the placement unit at an upper corner with a central axis parallel to the central axis of the second link device; and an upper side of the substrate placement unit in an upright position A fourth link device connected to a corner on one side so that a central axis is orthogonal to a central axis of the third link device, and the other side of the substrate platform at the upright position, A fifth link device connected to the center with the central axis vertical, and in front of the upright position To a second side edge central portion of the substrate mounting portion, it is preferable and a sixth link device connected to the vertical and then to and facing the fifth linkage to the central axis.

According to this aspect, since the parallel link mechanism includes the six link devices as described above, it is possible to improve the robustness of the substrate mounting portion in the upright position.
As for the alignment mechanism of the substrate processing apparatus, the link device constituting the parallel link mechanism includes a base portion fixed to the rotation mechanism so as not to move, an end effector contacting the substrate mounting portion, and the end effector An expansion / contraction part that strokes, a joint part that connects a distal end of the expansion / contraction part and the end effector, a tilting part that tilts the expansion / contraction part, and a rotating shaft that rotates the expansion / contraction part, and the substrate mounting It is preferable to displace the part with three dimensions and six degrees of freedom.

  According to this aspect, each link device can be expanded, contracted, rotated, and rotated, and by combining these operations, the substrate platform can be displaced in three-dimensional six degrees of freedom. The substrate mounting portion can be aligned with high accuracy.

  With respect to the alignment mechanism of the substrate processing apparatus, the detection unit includes a hole for measuring a relative position between the substrate and the mask in the substrate mounting unit. It is preferable to provide a position detection sensor at a position corresponding to the hole on the back surface of the placement surface.

  According to this aspect, since the position detection sensor is provided on the back surface of the substrate platform, when the substrate is placed on the substrate platform at the initial position, the positional deviation between the substrate platform and the substrate is detected. Can be detected. For this reason, when a board | substrate is mounted in the state which shifted | deviated largely with respect to the board | substrate mounting part, board | substrate mounting can be performed again in the step before rotating a board | substrate mounting part.

The perspective view which shows the principal part of 1st Embodiment which actualized the substrate processing apparatus to the vapor deposition apparatus. The side view when the board | substrate stage of the alignment mechanism is arrange | positioned in an upright position. The front view when the board | substrate stage of the alignment mechanism is arrange | positioned in an upright position. The perspective view which shows the link apparatus of the alignment mechanism. The schematic diagram of the alignment mechanism. The schematic diagram explaining the position shift detection with the sensor of the alignment mechanism, a board | substrate, and a mask. The schematic diagram of the vapor deposition process through the mask. The block diagram of the control apparatus with which the vapor deposition apparatus is provided. The flowchart of vapor deposition by the vapor deposition apparatus.

(First embodiment)
Hereinafter, a first embodiment of an alignment mechanism of a substrate processing apparatus will be described with reference to FIGS. In this embodiment, the alignment mechanism of the substrate processing apparatus is embodied as an alignment mechanism of a vapor deposition apparatus for manufacturing an organic EL display. The vapor deposition apparatus is an apparatus that forms a thin film such as an electrode layer or a light emitting layer by attaching a film forming material to a film formation target region of a substrate through a mask.

  The film forming apparatus includes a chamber having a film forming chamber inside and an exhaust system for adjusting the pressure in the chamber. In addition, the film forming apparatus includes a support frame 12 in the chamber. The support frame 12 includes a mask frame 13 as a mask support portion, a substrate frame 15 constituting a rotation mechanism, and a base frame (not shown) to which the mask frame 13 and the substrate frame 15 are fixed.

  The mask frame 13 is formed in a substantially square frame shape, and is fixed perpendicular to the pedestal frame. At the center of the mask frame 13, a mask M is fixed in an upright state. A vapor deposition apparatus 30 having a vapor deposition source is provided on the back surface of the mask frame 13.

  Next, the substrate frame 15 will be described in detail. As shown in FIG. 2, the substrate frame 15 includes a frame body 18 formed in a square frame shape for supporting the substrate Sb. Rotating shafts 17 are respectively provided on both sides of the base end portion disposed on the mask frame 13 side in the frame body 18. The rotating shaft 17 is rotatably supported by a bearing portion 14 fixed to the pedestal frame. In addition, the rotating shaft 17 is connected to a driving device (not shown) that constitutes a rotating mechanism while being supported by the bearing portion, and rotates by the rotational force of a motor built in the driving device. With this configuration, the frame body 18 is configured to be rotatable between a rotation start end position where the upper surface is substantially horizontal and a rotation end position where the upper surface is vertical. As shown in FIG. 2, when the frame main body 18 is disposed at the rotation end position, the frame main body 18 faces the mask frame 13.

  As shown in FIG. 3, a chuck plate 20 as a substrate mounting portion is provided on the upper surface of the frame main body 18 via a parallel link mechanism P constituting an alignment mechanism. The parallel link mechanism P has six link devices L1 to L6. In addition, when it demonstrates without distinguishing link apparatus L1-L6, it demonstrates as the link apparatus L only.

  The link device L will be described with reference to FIG. The link device L includes a fixed side bracket La as a base portion that is fixed to the frame body 18. The stationary bracket La is fixed to the upper surface of the frame body 18 so as not to move. Further, the upper surface of the fixed bracket La is inclined in a direction corresponding to the outside of the substrate Sb, and a rotation axis Lb is provided on the upper surface. The rotation axis Lb is rotatable in both directions around the normal direction on the upper surface of the fixed bracket La.

  A tilting portion Ld is provided on the rotation axis Lb. The tilting portion Ld includes a bearing portion Le standing in a direction perpendicular to the upper surface of the fixed bracket La, and a tilting shaft Lf inserted through the bearing portion Le. The tilting portion Ld follows the rotating direction when the rotating shaft Lb rotates.

  In the middle of the tilt axis Lf, the telescopic device Lg is mounted so as to be tiltable. The telescopic device Lg includes a box-shaped case Lh, and a shaft penetration portion Li is formed on the lower surface of the case Lh. A tilting axis Lf is pivotally supported by the shaft insertion portion Li. With this configuration, the telescopic device Lg can be tilted with respect to the upper surface of the fixed bracket La about the tilting axis Lf.

  The expansion device Lg is an electric cylinder made of a ball screw or the like, and includes a shaft Lj as an expansion / contraction portion and a joint portion Lk provided at the tip of the shaft Lj. The shaft Lj is provided to be extendable and contractable with respect to the case Lh. The joint portion Lk is composed of a ball joint or the like. A movable side bracket Lm, which is an end effector, is connected to the joint portion Lk. The movable bracket Lm supports the chuck plate 20 from the back surface side by its upper surface.

  Further, the expansion device Lg is connected to a link driving unit Ln including a motor and a transmission mechanism such as a belt or a gear for transmitting the driving force of the motor to the shaft Lj, the tilting shaft Lf, and the rotating shaft Lb. Yes.

By transmitting the driving force of the link driving unit Ln, the rotation shaft Lb rotates, and the tilting unit Ld and the expansion device Lg follow the rotation of the rotation shaft Lb.
Further, due to the driving force of the link drive unit Ln, the expansion / contraction device Lg tilts with respect to the upper surface of the fixed bracket La about the tilt axis Lf and expands / contracts the shaft Lj with respect to the case Lh. When the axial direction of the shaft Lj is parallel to the inclination direction of the upper surface of the fixed bracket La, the tilt angle of the tilt portion Ld is 0 ° and the rotation angle of the rotation shaft Lb is 0 °. A position where the shaft Lj is not extended and the extension is the minimum length is defined as a stroke length “0”. The position of the link device L when the rotation angle is 0 °, the tilt angle is 0 °, and the stroke length is zero is hereinafter referred to as an initial position of the link device L.

  Next, the chuck plate 20 will be described. Each of the link devices L1 to L6 shown in FIG. 3 is arranged at the initial position, and the chuck plate 20 is fixed to the substrate frame 15 at the rotation end position, that is, the main surface of the chuck plate 20 faces the mask M. Located in an upright position.

  The chuck plate 20 has a substantially rectangular shape, and includes a substrate housing portion 20a on which the substrate Sb is placed. A plurality of clips 20b for fixing the accommodated substrate is provided on the outer side of the substrate accommodating portion 20a over the circumferential direction of the substrate accommodating portion 20a. The clip 20b biases the substrate Sb in the direction in which the substrate Sb is pressed against the chuck plate 20.

  Plate-like supported portions 20 h and 20 i are fixed to the chuck plate 20 on the left side of the lower side and the lower side of the left side as viewed from the substrate housing portion 20 a side. The supported portion 20h is supported by the first link device L1. The first link device L <b> 1 is arranged with a movable bracket Lm, which is a connection point with the chuck plate 20, facing the lower left corner of the chuck plate 20.

  The supported portion 20i is supported by the second link device L2. The second link device L <b> 2 is arranged with the movable bracket Lm, which is a connection point with the chuck plate 20, facing the lower left corner of the chuck plate 20. The center axis Ax1 of the shaft Lj of the first link device L1 is orthogonal to the center axis Ax2 of the shaft Lj of the second link device L2.

  Furthermore, plate-like supported portions 20j and 20k are fixed to the chuck plate 20 on the upper side of the left side and the left side of the upper side when viewed from the substrate housing portion 20a side. The supported portion 20j is supported by the third link device L3. The third link device L <b> 3 is arranged with the movable bracket Lm, which is a connection point with the chuck plate 20, facing the upper left corner of the chuck plate 20.

  The back surface of the supported portion 20k is supported by the fourth link device L4. The fourth link device L <b> 4 is arranged with the movable bracket Lm, which is a connection point with the chuck plate 20, facing the upper left corner of the chuck plate 20. That is, the central axis Ax3 of the shaft Lj of the third link device L3 is orthogonal to the central axis Ax4 of the shaft Lj of the fourth link device L4.

  That is, the first link device L1 and the second link device L2 surround and support the lower left corner of the chuck plate 20, and the third link device L3 and the fourth link device L4 surround the upper left corner of the chuck plate 20. Support with.

  The third link device L3 is provided at a position and a direction symmetrical to the second link device L2 with respect to a horizontal axis X that passes through the center of the chuck plate 20 and extends in the short direction of the chuck plate 20. . Further, the fourth link device L4 is provided at a position symmetrical to the first link device L1 with respect to the horizontal axis X.

  On the other hand, a long supported portion 20m is fixed to the chuck plate 20 at the center of the right side when viewed from the substrate housing portion 20a side. The back surface of the supported portion 20m is supported by the fifth link device L5 and the sixth link device L6. The fifth link device L5 is connected to the upper end portion of the supported portion 20m, and the movable bracket Lm, which is a connection point with the chuck plate 20, is disposed downward. The sixth link device L6 supports the lower end portion of the supported portion 20m, and is arranged with the movable bracket Lm, which is a connection point with the chuck plate 20, facing upward. Further, the center axis Ax5 of the fifth link device L5 and the center axis Ax6 of the sixth link device L6 are on the same line. Further, the position and direction of the fifth link device L5 are symmetric with respect to the horizontal axis X with respect to the position and direction of the sixth link device L6.

  Thus, the parallel link mechanism P includes six link devices L asymmetrically with respect to the vertical axis Y. Further, the chuck plate 20 has six degrees of freedom by the first to sixth link devices L1 to L6. As shown in FIG. 5, the chuck plate 20 is driven in the vertical axis (Y-axis) direction, the horizontal axis (X-axis) direction in the substrate width direction, and the substrate thickness direction by driving the first to sixth link devices L1 to L6. Translation in the vertical axis (Z-axis) direction and rotation in the yaw (Yθ), pitch (Xθ), and roll (Zθ) directions around these three axes are possible.

  Further, the lower left corner and the upper left corner of the chuck plate 20 are surrounded and supported by the first to fourth link devices L1 to L4, and the center of the right side is supported by the fifth and sixth link devices L6. Even if the chuck plate 20 is placed in the upright position, the posture of the chuck plate 20 can be stabilized.

  In addition, by arranging the link devices L1 to L6 as described above, the robustness of the chuck plate 20 arranged in the upright position can be enhanced. For example, even if an unintended external force is applied to the chuck plate 20, the substrate frame 15 connected to the chuck plate 20, or the substrate Sb, the chuck plate 20 disposed in the upright position is not easily tilted or displaced from the fixed position. . The robustness of the chuck plate 20 according to the arrangement pattern of the link devices L1 to L6 has been clarified by the inventors' experiments and simulations, but the reason is being clarified.

  As shown in FIG. 3, two pairs of distance sensor fixing portions 23 and a pair of imaging device fixing portions 24 are formed on the chuck plate 20. A distance measuring sensor 25 is fixed to the back surface of the distance measuring sensor fixing unit 23. The distance measuring sensor 25 that constitutes the detection unit and the position detection sensor includes a light source that emits a light beam such as a laser or infrared light, and a light receiving element that receives reflected light reflected by the light beam. In addition, the imaging device 26 is fixed to the back surface of the imaging device fixing unit 24. The imaging device 26 constituting the detection unit and the position detection sensor includes an optical system including a lens and a mirror, and a light receiving element such as a CCD.

  As shown in FIG. 3, the distance measurement sensor fixing portion 23 is provided with through holes 23 h through which light rays output from the distance measurement sensor 25 pass. The through hole 23 h is formed through the chuck plate 20. The substrate Sb fixed to the substrate frame 15 is a light-transmitting substrate and transmits light emitted from the distance measuring sensor 25.

  The imaging device fixing portion 24 is provided with a through hole 24h through which the light receiving element of the imaging device 26 receives light from the mask side. The through hole 24h is also formed through the chuck plate 20.

  In addition, a pair of the distance measurement sensor fixing portions 23 are respectively disposed at corners that are opposite to the substrate housing portion 20a, and the pair of imaging device fixing portions 24 are the distance sensor fixing portions of the substrate housing portion 20a. It is provided so as to be diagonal at each corner where 23 is not provided. Further, the remaining pair of distance measuring sensor fixing portions 23 is formed in the vicinity of the imaging device fixing portion 24 and at positions symmetrical with respect to the center of the substrate.

  The distance measuring sensor 25 emits a light beam from the light source to the mask M through the through-hole 23h and receives the light reflected by the mask M when the chuck plate 20 is disposed in the upright position. Then, the detection results of the distance measuring sensors 25 are compared, and a position shift around the vertical axis (Yθ direction) and a position shift around the horizontal axis (Xθ direction) are detected. For example, when the relative distance between the lower end portion of the substrate Sb and the mask M is larger than the relative distance between the upper end portion of the substrate Sb and the mask M, that is, the posture is such that the upper end portion of the substrate is inclined toward the mask side. When there is a deviation around the axis (Xθ direction), the relative distance detected by the distance measuring sensor 25 arranged at the lower end portion of the substrate is larger than the relative distance detected by the distance measuring sensor 25 arranged at the upper end portion of the substrate. large. In this case, it is determined that there is a positional shift around the horizontal axis.

  As illustrated in FIG. 6, when the chuck plate 20 is set to the upright position, the imaging device 26 is diagonally connected to each other among the translucent substrates Sb through the through holes 24 h of the imaging device fixing portion 24. An alignment mark (hereinafter referred to as a substrate-side mark M1) formed at each corner and an alignment mark (hereinafter referred to as a mask-side mark M2) formed at each corner of the mask M that are diagonal to each other are imaged. To do. Each of the marks M1 and M2 is disposed on or near the optical axis 26x of the imaging device 26, and has a shape such as a cross, a triangle, a rectangle, or the like that can detect a two-dimensional positional deviation of the substrate Sb and the mask M. Yes.

  When there is no two-dimensional displacement between the substrate Sb and the mask M, the marks M1 and M2 are completely overlapped from the viewpoint of the imaging device 26. When there is a positional deviation between the substrate Sb and the mask M, the marks M1 and M2 overlap each other in a shifted state. Therefore, by analyzing the captured data, the positional deviation amount in the vertical axis (Y-axis) direction, the substrate width It is possible to detect a positional deviation amount in the horizontal axis (X-axis direction) direction and a positional deviation amount in the rotation (roll Zθ) direction around the vertical axis.

  When a positional deviation is detected between the substrate Sb and the mask M by the distance measuring sensor 25 and the imaging device 26, the link devices L1 to L6 are driven so as to cancel the positional deviation amount. For example, when it is detected that the board Sb is positioned vertically downward from the position (target position) where it should be originally placed, the link devices L1 to L6 move the board Sb vertically upward. To drive.

  Next, the vapor deposition apparatus 30 will be described. As shown in FIG. 7, the vapor deposition apparatus 30 includes a vapor deposition source 30 a that supplies a film forming material, and a scanning mechanism (not shown) that scans the vapor deposition source 30 a with respect to the mask M. The scanning mechanism includes a holder for fixing the vapor deposition source, a rail for transporting the holder, a motor, a belt for transmitting the driving force of the motor to the holder, and the like. Then, the deposition material is attached to the substrate Sb through the hole H of the mask M by scanning the vapor deposition source 30a over the entire mask. In FIG. 7, the gap (gap) between the vapor deposition source 30a, the mask M, and the substrate Sb is shown larger than the actual length.

  Next, the electrical configuration of the film forming apparatus will be described. As shown in FIG. 8, the control device 50 of the film forming apparatus includes a main control unit 51 including a CPU, a RAM, a ROM storing a film forming program, and the like. The main control unit 51 drives the exhaust system via the pump drive circuit 52 to adjust the pressure in the chamber. The control device 50 includes a motor drive circuit 53 that drives the drive device. The motor drive circuit 53 drives the drive device to rotate the substrate frame 15.

  The control device 50 includes a link drive circuit 54. The link drive circuit 54 is electrically connected to cables (not shown) connected to the link devices L1 to L6, respectively, and can adjust the rotation amount, tilt amount, and stroke amount of each link device L1 to L6.

  The control device 50 further includes a sensor control circuit 55. The sensor control circuit 55 can transmit a drive signal to the distance measuring sensor 25 and the imaging device 26 and can receive a detection signal. The main control unit 51 drives the distance measuring sensor 25 and the imaging device 26 via the sensor control circuit 55 and calculates the amount of positional deviation between the substrate Sb and the mask M based on the detection signal. Then, the link devices L1 to L6 are driven via the link drive circuit 54 based on the positional deviation amount.

The control device 50 includes a vapor deposition device drive circuit 56. The main control unit 51 drives a motor connected to the holder via the vapor deposition apparatus drive circuit 56.
Next, the operation of the film forming apparatus will be described with reference to the flowchart shown in FIG. First, initialization of the vapor deposition apparatus 30, each link apparatus L1-L6, and the control apparatus 50 is performed (step S1). At the time when the film forming process is started, the substrate frame 15 is disposed at the rotation start end position, so the main control unit 51 controls the link drive circuit 54 to return the link devices L1 to L6 to the initial position. Further, the main control unit 51 initializes the previous alignment data stored in the RAM or the like.

  Next, the substrate Sb is carried into the film forming apparatus from the transfer device (both not shown) via the gate valve, and is placed on the substrate accommodating portion 20a of the substrate frame 15 (step S2). When the substrate Sb is placed on the substrate housing portion 20a, the periphery of the substrate Sb is fixed by the clip 20b.

  At this time, the imaging device 26 is driven to image the substrate side mark M1 through the through hole 24h, and the deviation between the substrate Sb and the target position can be detected. When the difference between the substrate Sb and the target position is large, the substrate Sb can be remounted before the substrate frame 15 is rotated to the rotation end position.

  When the substrate Sb is fixed to the chuck plate 20, the main control unit 51 drives the drive device via the motor drive circuit 53, and rotates the substrate frame 15 around the rotation shaft 17 from the rotation start end position to the rotation end. The chuck plate 20 is turned to the upright position by rotating to the position (step S3). Further, the main control unit 51 drives the exhaust system via the pump drive circuit 52 to depressurize the chamber (step S4).

  When the substrate frame 15 is placed at the rotation end position, the main control unit 51 calculates the amount of positional deviation between the substrate Sb and the mask M (step S5). Specifically, the main control unit 51 drives the distance measuring sensor 25 via the sensor control circuit 55 and detects the relative distance from the distance measuring sensor 25 to the mask M. In addition, the imaging device 26 is driven, and imaging data obtained by imaging the substrate side mark M1 and the mask side mark M2 is analyzed to calculate a positional deviation amount in the horizontal direction, the vertical direction, and the roll direction.

  Then, the main control unit 51 determines whether or not there is a positional deviation based on the calculation result in step S5 (step S6). If it is determined that there is no positional deviation between substrate Sb and mask M (NO in step S6), the process proceeds to the vapor deposition step in step S9.

  On the other hand, when main controller 51 determines that there is a positional deviation (YES in step S6), link devices L1 to L6 are driven to cancel the positional deviation amount via link drive circuit 54 (step S7). .

  When the link devices L1 to L6 are driven, the main control unit 51 determines whether or not the position adjustment between the substrate Sb and the mask M has been completed (step S8). Here, detection data is acquired from the distance measuring sensor 25 and the imaging device 26, and it is determined whether or not the amount of positional deviation is equal to or less than a predetermined value.

  If the position adjustment has not been completed (NO in step S8), the process returns to step S7 to drive the link devices L1 to L6. When it is determined that the position adjustment has been completed (YES in step S8), vapor deposition is performed (step S9).

  In step S <b> 9, the main control unit 51 causes the vapor deposition source 30 a to scan the mask M via the vapor deposition apparatus drive circuit 56. Further, the vapor deposition source 30a is heated to deposit the film forming material on the substrate Sb through the mask M.

  When the vapor deposition source 30a is scanned over the entire mask, the substrate Sb is taken out (step S10). At this time, the main control unit 51 rotates the substrate frame 15 from the rotation end position to the rotation start end position via the motor drive circuit 53. When the substrate frame 15 is arranged at the rotation start end position, the clip 20b is removed, and the substrate Sb is taken out by the transfer device.

According to the above embodiment, the following effects can be obtained.
(1) In the above-described embodiment, the chuck plate 20 in the upright position is displaced by the parallel link mechanism P. Therefore, the chuck plate 20 rotates around the normal direction of the substrate Sb and moves up and down along the normal direction. In addition, the position of the chuck plate 20 can be finely adjusted. For this reason, even when the film is formed on the upright substrate Sb, the alignment between the substrate Sb and the mask M can be performed with high accuracy.

  (2) In the above embodiment, the parallel link mechanism P includes a pair of link devices L at the lower left corner and the upper left corner of the chuck plate 20, respectively. In addition, the pair of link devices L connected to each corner are arranged such that the central axes thereof are orthogonal to each other and the movable side bracket Lm, which is a connection point with the chuck plate 20, is directed to each corner. For this reason, the robustness when the chuck plate 20 is disposed in the upright position can be enhanced. Therefore, since the chuck plate 20 is not tilted or displaced during the position adjustment, the position adjustment between the substrate Sb and the mask M can be performed with high accuracy.

  (3) According to the above-described embodiment, the parallel link mechanism P includes the pair of first and second link devices L1 and L2 whose center axes are orthogonal to each other at the lower left corner of the chuck plate 20 in the vertical direction. . For this reason, since the first and second link devices L1 and L2 press against the load of the chuck plate 20 from below, the posture of the substrate Sb can be stabilized and highly accurate alignment can be performed. .

  (4) According to the above embodiment, the parallel link mechanism P includes the link devices L1 to L6 asymmetrically with respect to the vertical axis Y on the chuck plate 20 in the upright position. For this reason, even if an external force is applied, inclination or the like hardly occurs and the robustness of the chuck plate 20 in the upright position can be improved.

  (5) According to the above embodiment, the parallel link mechanism P includes the first link device L1 that is connected to the left side corner portion of the chuck plate 20 in the upright position with the central axis Ax1 being horizontal. . Furthermore, a second link device L2 is provided which is connected to the left side of the chuck plate 20 in the upright position at the lower corner so that the central axis Ax2 is orthogonal to the central axis Ax1 of the first link device L1. Furthermore, a third link device L3 is provided which is connected to the left side of the chuck plate 20 in the upright position at the upper corner so that the central axis Ax3 is parallel to the central axis Ax2 of the second link device L2. Further, a fourth link device L4 is provided, which is connected to the upper side of the chuck plate 20 in the upright position at the left corner so that the central axis Ax4 is orthogonal to the central axis Ax3 of the third link device L3. Further, a fifth link device L5 connected to the right side of the chuck plate 20 in the upright position with the central axis Ax5 vertically connected to the central portion, and the central axis Ax6 in the central portion of the right side of the chuck plate 20 in the upright position. And a sixth link device L6 connected to face the fifth link device L5. For this reason, the robustness of the chuck plate 20 in the upright position can be enhanced.

  (6) In the said embodiment, the link apparatus L is provided with the fixed side bracket La part fixed to the board | substrate frame 15 so that a movement was impossible, and the movable side bracket Lm which is an end effector. Further, the shaft Lj that strokes the movable bracket Lm, the joint portion Lk that connects the tip of the shaft Lj and the movable bracket Lm, the tilting portion Ld that tilts the shaft Lj, and the rotation axis Lb that rotates the shaft Lj Is provided. Then, the chuck plate 20 is displaced with three-dimensional six degrees of freedom. For this reason, even when the chuck plate 20 is disposed in the upright position, the alignment can be performed with high accuracy.

  (7) In the above embodiment, the chuck plate 20 is provided with the through holes 23h and 24h for measuring the relative positions of the substrate Sb and the mask M, and the back surface of the chuck plate 20 is the through hole. The distance measuring sensor 25 and the imaging device 26 are provided at positions corresponding to the holes 23h and 24h. For this reason, when the substrate Sb is placed on the chuck plate 20 at the initial position, it is possible to detect a positional deviation between the chuck plate 20 and the substrate Sb. For this reason, when the substrate Sb is placed in a state of being largely deviated with respect to the chuck plate 20, the placement of the substrate Sb can be performed again before the substrate frame 15 is rotated.

In addition, you may change the said embodiment as follows.
In the above embodiment, the chuck plate 20 has a substantially rectangular shape, but may have a polygonal shape such as a hexagonal shape.

  In the above embodiment, the chuck plate 20 as the substrate mounting portion is configured to fix the substrate Sb by the clip 20b, but may be configured to fix the substrate Sb by electrostatic force or suction force.

The expansion device Lg is an electric cylinder made of a ball screw or the like, but may be an air cylinder or a hydraulic cylinder.
In the above embodiment, the link device L is configured to be capable of displacing the chuck plate 20 with 6 degrees of freedom, but may be configured to have 6 degrees of freedom or less.

  In the above embodiment, the substrate processing apparatus is embodied as a vapor deposition apparatus that manufactures an organic EL display panel, but may be applied to a vapor deposition apparatus that manufactures a liquid crystal display panel, a solar battery cell, or the like. In addition to the vapor deposition apparatus, the substrate processing apparatus may be embodied in a film forming apparatus such as a sputtering apparatus, a CVD apparatus, or an apparatus that discharges a film forming material from a nozzle. Alternatively, in addition to the vapor deposition apparatus, the present invention may be embodied in an exposure apparatus that exposes a photoresist through a mask. In short, as long as the apparatus aligns the mask and the substrate, the alignment mechanism having the above configuration can be applied regardless of the installation atmosphere (atmosphere or vacuum).

  DESCRIPTION OF SYMBOLS 11 ... Chamber, 12 ... Support frame, 13 ... Mask frame as mask support part, 15 ... Substrate frame as rotation mechanism, 17 ... Rotating shaft, 20 ... Chuck plate as substrate mounting part, 23h, 24h ... Through Hole: 25 ... Distance measuring sensor constituting detection unit and position detection sensor, 26 ... Imaging sensor constituting detection unit and position detection sensor, Ax1 to Ax6 ... central axis, L, L1-L6 ... link device, La ... base Fixed side bracket as part, Lb ... rotating shaft, Ld ... tilting part, Lj ... shaft as expansion / contraction part, Lk ... joint part, Lm ... movable side bracket as end effector, M ... mask, P ... constituting alignment mechanism Parallel link mechanism, Sb ... substrate, Y ... vertical axis.

Claims (7)

In the alignment mechanism of the substrate processing apparatus in which the mask faces the main surface of the substrate,
A mask support for supporting the upright mask;
A substrate mounting portion on which the substrate is mounted;
A rotation mechanism that rotates the substrate platform between an initial position and an upright position in which the main surface of the substrate faces the main surface of the mask;
A detection unit for detecting a positional deviation between the substrate and the mask supported by the substrate mounting unit in the upright position;
An alignment mechanism for a substrate processing apparatus, comprising: a parallel link mechanism for displacing the substrate mounting portion at the upright position when a positional deviation between the substrate and the mask is detected.   The parallel link mechanism includes a pair of link devices at at least two corners of the substrate platform, respectively, and the pair of link devices connected to the corners have their central axes orthogonal to each other, The alignment mechanism of the substrate processing apparatus according to claim 1, wherein the connection point with the substrate mounting portion is disposed so as to face each corner.   3. The parallel link mechanism according to claim 2, wherein the pair of link devices in which the central axes are orthogonal to each other are provided at at least one of the vertical lower corners of the substrate platform in the upright position. Alignment mechanism for substrate processing equipment.   The alignment mechanism of the substrate processing apparatus according to claim 2, wherein the parallel link mechanism is provided with the link device asymmetrically with respect to a vertical axis at the substrate mounting portion in an upright position. The parallel link mechanism is
A first link device connected to the lower side of the substrate mounting portion in an upright position and connected to a corner on one side with the central axis being horizontal;
A second link device that is connected to a lower corner of one side of the substrate mounting portion in an upright position with a central axis orthogonal to the central axis of the first link device;
A third link device connected to the upper corner of one side of the substrate mounting portion in the upright position with a central axis parallel to the central axis of the second link device;
A fourth link device that is connected to the upper side of the substrate mounting portion in an upright position at a corner on one side so that the central axis is orthogonal to the central axis of the third link device;
A fifth link device connected to the central portion of the other side of the substrate mounting portion in the upright position with the central axis being vertical;
5. A sixth link device connected to the other side of the substrate mounting portion in the upright position and to a central portion with a central axis being vertical and facing the fifth link device. The alignment mechanism of the substrate processing apparatus as described in any one of these. The link device constituting the parallel link mechanism is
A base part fixed to the rotation mechanism so as not to move;
An end effector in contact with the substrate mounting portion;
A telescopic part that strokes the end effector;
A joint for connecting the tip of the stretchable part and the end effector;
A tilting part for tilting the telescopic part;
A rotation shaft for rotating the telescopic part,
The alignment mechanism of the substrate processing apparatus according to claim 1, wherein the substrate mounting portion is displaced with three-dimensional six degrees of freedom. The detector is
While providing a hole for measuring the relative position of the substrate and the mask in the substrate mounting portion,
The substrate processing apparatus according to claim 1, further comprising a position detection sensor at a position corresponding to the hole on the back surface of the substrate placement portion. Alignment mechanism.

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