JP2014096237A - Method of manufacturing led line lamp, led protection tube for led line lamp, and led line lamp - Google Patents

Method of manufacturing led line lamp, led protection tube for led line lamp, and led line lamp Download PDF

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JP2014096237A
JP2014096237A JP2012246006A JP2012246006A JP2014096237A JP 2014096237 A JP2014096237 A JP 2014096237A JP 2012246006 A JP2012246006 A JP 2012246006A JP 2012246006 A JP2012246006 A JP 2012246006A JP 2014096237 A JP2014096237 A JP 2014096237A
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led
line lamp
heat
substrate
conductive resin
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Kyoichi Sato
恭一 佐藤
Hitoshi Ando
仁己 安藤
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KANKYO GIJUTSU SERVICE KK
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Abstract

PROBLEM TO BE SOLVED: To make an LED line lamp lightweight and long in lifetime while providing sufficient heat radiation characteristics, and to improve the productivity.SOLUTION: A heat radiation part 2a is made of a first heat-conductive resin, and a diffusion part 2b is made of a resin which transmits and diffuses irradiation light of an LED element 4b. An outer cylinder part 2 comprising the heat radiation part 2a and diffusion part 2b is molded in one body. Mutually facing guide parts 2b-1, 2b-1' provided at both front and rear ends of the diffusion part 2b are formed in a length direction respectively to be sectioned in a channel shape including the heat radiation part 2a as one side, and an LED substrate 4 is slid and inserted so as to have both front and rear ends held at the channel-sectioned part. A grooved part 2a-2 is formed in the length direction at a substantially center part of the heat radiation part 2a. A second heat-conductive resin 5 is charged between the opposite surface 2a-1 of the heat radiation part 2a including the grooved part 2a-2, and the side of a substrate part 4a where the LED element 4b is not mounted.

Description

本発明は、LEDに対する放熱部および拡散部が一体成形されたLEDラインランプの製造方法および当該製造方法に係るLED保護管、LEDラインランプに関する。   The present invention relates to a manufacturing method of an LED line lamp in which a heat radiating portion and a diffusion portion for an LED are integrally formed, an LED protective tube and an LED line lamp according to the manufacturing method.

特に、十分な放熱特性を担保しながら、軽量化を図り、さらに、生産性を向上させることができるようにしたLED保護管およびLEDラインランプなどに関する。   In particular, the present invention relates to an LED protective tube, an LED line lamp, and the like that can achieve weight reduction while ensuring sufficient heat dissipation characteristics and further improve productivity.

なお、本明細書では必要に応じて、LEDラインランプの長手方向を「左右」方向とし、後述する封止蓋部1側を「左」、封止蓋部1´側を「右」と、それぞれ記載する。前後はそれぞれ、この「左」、「右」に対しLED出力光の照射側を「下」、その反対側を「上」としたときの正面側(前)、背面側(後)を示している。   In this specification, if necessary, the longitudinal direction of the LED line lamp is the “left and right” direction, the sealing lid portion 1 side described later is “left”, the sealing lid portion 1 ′ side is “right”, Describe each. The front and back indicate the front side (front) and back side (rear) when the LED output light irradiation side is “down” and the opposite side is “up” with respect to the “left” and “right”, respectively. Yes.

従来、電源側に設定される固定基部にLED照明部が回動可能な形で取り付けられたLEDラインランプが提案されている(例えば、特許文献1)。このLEDラインランプにおいては、LED素子を搭載した照明基板(LED基板)の回動軸が固定基部に摩擦係合可能な形で取り付けられ、固定基部に対して任意に設定される照明基板の回動位置は、照明基板の回動軸とその受け側(固定基部)との摩擦係合により保持されるようになされている。   2. Description of the Related Art Conventionally, an LED line lamp has been proposed in which an LED illumination unit is rotatably attached to a fixed base set on the power supply side (for example, Patent Document 1). In this LED line lamp, the rotation axis of the illumination board (LED board) on which the LED element is mounted is attached in a form that can be frictionally engaged with the fixed base, and the rotation of the illumination board that is arbitrarily set with respect to the fixed base. The moving position is held by frictional engagement between the rotating shaft of the illumination board and its receiving side (fixed base).

従来の、電源側固定基部にLED照明部が回動可能な形で取り付けられたLEDラインランプでは、LED照明部の任意の回動状態を、照明部側とその受け側との摩擦作用で保持するようになされているため、LED照明部の回動位置、すなわちLED出力光の照射位置を所望位置に継続的に安定保持することがむずかしいという問題点があった。   In the conventional LED line lamp in which the LED illumination unit is mounted on the power supply side fixed base, the arbitrary rotation state of the LED illumination unit is maintained by the frictional action between the illumination unit side and the receiving side. Therefore, there is a problem that it is difficult to continuously hold the rotation position of the LED illumination unit, that is, the irradiation position of the LED output light, at a desired position continuously.

そこで、固定基部と、回動可能なLED照明部とを節度係合させ、これによりLED照明部が任意の位置へ回動設定された状態の継続的な安定化を図ることができる、LEDラインランプが考案されている(例えば、特許文献2)。   Therefore, an LED line in which the fixed base and the rotatable LED illumination unit are moderately engaged, and thereby the LED illumination unit can be continuously stabilized in a state where the LED illumination unit is rotated to an arbitrary position. A lamp has been devised (for example, Patent Document 2).

特開2007−122933号公報JP 2007-122933 A

実用新案登録3176594号公報Utility Model Registration No. 3176594

上述した特許文献2に記載の技術を適用したLEDラインランプは、
左右一対の形で配設された固定基部、
固定基部のそれぞれに回動可能な形で取り付けられた左右一対の鞘状キャップ、
固定基部内部の環状空間域に組み込まれて鞘状キャップをその任意の回動位置に保持するための環状保持部材、
LED出力光の拡散作用および白色化作用を呈する断面C形直線状の拡散板、
拡散板と一体化した状態でその左右両端部分が鞘状キャップに取り付けられる放熱板、
放熱板に固定され、インライン搭載された複数のLED素子を有するLED基板
などを含んで構成されている。
The LED line lamp to which the technology described in Patent Document 2 is applied is as follows.
A fixed base arranged in a pair of left and right,
A pair of left and right sheath caps attached to each of the fixed bases in a rotatable manner;
An annular holding member incorporated in the annular space inside the fixed base to hold the sheath-like cap in its arbitrary rotational position;
A diffuser plate with a C-shaped cross section that exhibits a diffusion action and a whitening action of LED output light;
A heat sink whose left and right ends are attached to a sheath cap in a state integrated with the diffuser,
It is configured to include an LED substrate having a plurality of LED elements fixed to the heat sink and mounted in-line.

固定基部、環状保持部材、鞘状キャップ、拡散板、および、LED基板は、例えば、ポリカーボネートなどの合成樹脂製のものが用いられている。そして、放熱板は、例えば、アルミなどの金属製のものが用いられている。   As the fixed base, the annular holding member, the sheath cap, the diffusion plate, and the LED substrate, for example, those made of synthetic resin such as polycarbonate are used. And the thing made from metals, such as aluminum, is used for the heat sink, for example.

拡散板および放熱板を一体化した部材は、直線状の筒状部を構成している。すなわち、合成樹脂製であり断面C形の拡散板のC字切欠部に、金属製(アルミ製)の放熱板が取り付けられ、筒状部が構成されている。放熱板は、その筒内部に、LED基板を取り付けるための対向案内部を有し、LED基板をカシメ加工により固定保持している。   A member in which the diffusion plate and the heat radiating plate are integrated constitutes a linear cylindrical portion. That is, a metal (aluminum) heat radiating plate is attached to a C-shaped notch portion of a diffusion plate made of synthetic resin and having a C-shaped cross section, thereby forming a cylindrical portion. The heat radiating plate has an opposing guide portion for attaching the LED board inside the cylinder, and holds the LED board by caulking.

上述した特許文献2に記載の技術を適用したLEDラインランプにおいて、筒状部の放熱板にLED基板を取り付ける作業は、
(11)放熱板の対向案内部に、長手方向からLED基板を差し込む
(12)対向案内部の被せ部を必要箇所(すなわち、カシメ加工部分を)潰して、LED基板の背面が放熱板に密着するように固定保持する。
(13)拡散板のC字切欠部に長手方向から放熱板を差し込み、筒状部とする
という手順で行われる。
In the LED line lamp to which the technology described in Patent Document 2 described above is applied, the work of attaching the LED substrate to the heat sink of the cylindrical portion is as follows.
(11) Insert the LED board into the opposite guide part of the heat sink from the longitudinal direction.
(12) Crush the required portion (that is, the crimped portion) of the facing guide portion, and fix and hold it so that the back surface of the LED substrate is in close contact with the heat sink.
(13) The heat sink is inserted into the C-shaped notch of the diffusion plate from the longitudinal direction to form a cylindrical portion.

このように従来のLEDラインランプにおいては、LED保護管の放熱部が金属製(アルミ製)であるため重く、取り付け対象の器具負担の軽減、落下時の安全性向上、運搬の容易化などのために、放熱部の重量の軽量化が求められていた。   Thus, in the conventional LED line lamp, the heat radiation part of the LED protective tube is made of metal (aluminum), so it is heavy, such as reducing the burden on the equipment to be attached, improving safety when falling, and facilitating transportation. Therefore, the weight reduction of the heat radiating part has been demanded.

また、上述した特許文献2に記載の技術を適用したLEDラインランプにおいては、LED基板の放熱板への取り付け後に拡散板と放熱板との組み付けを行うようになされており、生産性が悪く、材質の大きく異なる拡散板と放熱板との間に十分な気密性を設けることも困難で、LEDが発生する熱と空気中の酸素の影響によるハンダ部分の酸化が長寿命化を妨げていた。   Further, in the LED line lamp to which the technology described in Patent Document 2 described above is applied, the diffusion plate and the heat radiating plate are assembled after the LED substrate is attached to the heat radiating plate, and the productivity is poor. It is also difficult to provide a sufficient airtightness between the diffuser plate and the heat radiating plate, which are greatly different in material, and the oxidation of the solder portion due to the influence of the heat generated by the LED and oxygen in the air hinders the extension of the life.

そこで、本発明は、
(21)筒状のLED保護管を合成樹脂製の放熱部と拡散部との一体成形物とし、かつ当該LED保護管にはLED基板を取り付ける際の左右方向(長手方向)案内部、さらにはLED基板とLED保護管放熱部との間に充填される熱伝導性樹脂の供給対象部となる左右方向(長手方向)溝状部をそれぞれ設けて、LED保護管の十分な放熱特性を担保しながら、LEDラインランプの軽量化、長寿命化を図る、
(22)LED保護管の構造の簡素化により、LEDラインランプの製造コストの低減化や生産性の向上化を図る、
ことなどを目的とする。
Therefore, the present invention provides
(21) A cylindrical LED protective tube is an integrally molded product made of a synthetic resin heat radiating portion and a diffusion portion, and the LED protective tube is mounted in the left-right direction (longitudinal direction) when the LED substrate is attached. Left and right direction (longitudinal direction) groove-like parts that are the supply target parts of the thermally conductive resin filled between the LED substrate and the LED protective tube heat radiation part are provided to ensure sufficient heat dissipation characteristics of the LED protective tube. However, to reduce the weight and extend the life of LED line lamps,
(22) By simplifying the structure of the LED protective tube, the manufacturing cost of the LED line lamp is reduced and the productivity is improved.
For purposes.

本発明は、以上の課題を次のようにして解決する。   The present invention solves the above problems as follows.

(1)LED素子(例えば、後述のLED素子4b)を搭載したLED基板(例えば、後述のLED基板4)が直管状のLED保護管(例えば、後述の外筒部2)の内部に配設された形のLEDラインランプの製造方法において、
前記LED基板との当接面(例えば、後述の対向面2a−1)を有する第一の熱伝導性樹脂からなる放熱部(例えば、後述の放熱部2a)、前記LED素子の照射光を透過・拡散する樹脂製の拡散部(例えば、後述の拡散部2b)、および当該当接面との間に当該LED基板を案内して保持するための対向案内部(例えば、後述の対向案内部2b−1,2b−1´)を備えた、前記LED保護管を一体成形し、
この一体成形された前記LED保護管に、その開口端部から前記LED基板を前記対向案内部に沿ってスライド挿入する。
(2)上記(1)において、
前記LED基板を前記対向案内部に沿ってスライド挿入する際に、
第二の熱伝導性樹脂(例えば、後述の熱伝導性樹脂5)を前記当接面に供給し、
この供給により、前記第二の熱伝導性樹脂が、前記スライド挿入にともない形成される前記LED基板と前記当接面との間の空間域に充填されるようにする。
(3)上記(2)において、
前記第二の熱伝導性樹脂は、
前記当接面のスライド挿入方向に形成された溝状部(例えば、後述の溝状部2a−2)に供給されるようにする。
(4)上記(1),(2)において、
前記LED基板をスライド挿入するための駆動部および前記第二の熱伝導性樹脂を前記当接面に供給するための注入部(例えば、後述の滴下口6a)を一体化した連動部材(例えば、後述のフック8)の作用により、
前記LED基板の先端位置よりもスライド挿入方向の前方部分に、前記第二の熱伝導性樹脂が供給されるようにする。
(5)LED素子(例えば、後述のLED素子4b)を搭載したLED基板(例えば、後述のLED基板4)を収容する直管状のLED保護管(例えば、後述の外筒部2)において、
前記LED基板との当接面(例えば、後述の対向面2a−1)を有する第一の熱伝導性樹脂からなる放熱部(例えば、後述の放熱部2a)と、
前記LED素子の照射光を透過・拡散する樹脂製の拡散部(例えば、後述の拡散部2b)と、
前記当接面との間に前記LED基板を案内して保持するための対向案内部(例えば、後述の対向案内部2b−1,2b−1´)と、を備え、
前記放熱部,前記拡散部および前記対向案内部の全体が一体成形されるようにする。
(6)上記(5)において、
前記当接面は、
前記対向案内部に沿ってスライド挿入される前記LED基板の挿入方向の溝状部(例えば、後述の溝状部2a−2)を備えるようにする。
(7)LEDラインランプにおいて、
上記(5),(6)のLEDラインランプ用のLED保護管の前記対向案内部に前記LED基板が保持されるようにする。
(8)上記(7)において、
前記放熱部と前記LED基板の当接面との間の空間域に第二の熱伝導性樹脂(例えば、後述の熱伝導性樹脂5)が充填されるようにする。
(9)上記(7),(8)において、
前記LED保護管の端部を封止する蓋部(例えば、後述の封止蓋部1,1´)を備え、
前記LED保護管と前記蓋部との間の内部空間域には不活性ガスが充填されるようにする。
(1) An LED substrate (for example, a later-described LED substrate 4) on which an LED element (for example, a later-described LED element 4b) is mounted is disposed inside a straight tubular LED protective tube (for example, a later-described outer cylinder portion 2). In the manufacturing method of the shaped LED line lamp,
A heat dissipating part (for example, a heat dissipating part 2a described later) made of a first heat conductive resin having a contact surface (for example, a facing surface 2a-1 described later) with the LED substrate, and transmitting the irradiation light of the LED element. A resin-made diffusing portion (for example, a diffusing portion 2b described later) and an opposing guide portion (for example, an opposing guiding portion 2b described later) for guiding and holding the LED substrate between the contact surface. -1, 2b-1 '), the LED protective tube is integrally molded,
The LED board is slid and inserted into the integrally formed LED protective tube from the opening end portion along the opposing guide portion.
(2) In (1) above,
When the LED board is slid and inserted along the opposing guide portion,
Supplying a second thermal conductive resin (for example, thermal conductive resin 5 described later) to the contact surface;
By this supply, the second thermally conductive resin is filled in a space region between the LED substrate and the contact surface that is formed as the slide is inserted.
(3) In (2) above,
The second thermally conductive resin is
It is made to supply to the groove-shaped part (for example, groove-shaped part 2a-2 mentioned later) formed in the slide insertion direction of the said contact surface.
(4) In (1) and (2) above,
An interlocking member (for example, a driving unit for slidingly inserting the LED substrate and an injection unit (for example, a later-described dropping port 6a) for supplying the second thermal conductive resin to the contact surface (for example, By the action of the hook 8) described later,
The second thermally conductive resin is supplied to the front portion in the slide insertion direction from the tip position of the LED substrate.
(5) In a straight tubular LED protective tube (for example, an outer cylinder portion 2 to be described later) that accommodates an LED board (for example, an LED substrate 4 to be described later) on which an LED element (for example, an LED element 4b described later) is mounted,
A heat dissipating part (for example, a heat dissipating part 2a described later) made of a first heat conductive resin having a contact surface (for example, a facing surface 2a-1 described later) with the LED substrate;
A resin-made diffusion part that transmits and diffuses the light emitted from the LED element (for example, a diffusion part 2b described later);
An opposing guide portion (for example, an opposing guide portion 2b-1, 2b-1 ′ described later) for guiding and holding the LED substrate between the contact surface,
The heat radiating part, the diffusing part, and the entire opposing guide part are integrally formed.
(6) In (5) above,
The contact surface is
A groove-shaped portion (for example, a groove-shaped portion 2a-2 described later) in the insertion direction of the LED substrate that is slidably inserted along the opposing guide portion is provided.
(7) In the LED line lamp,
The LED substrate is held by the opposing guide portion of the LED protective tube for the LED line lamp of (5) and (6).
(8) In (7) above,
A space region between the heat radiation part and the contact surface of the LED substrate is filled with a second heat conductive resin (for example, heat conductive resin 5 described later).
(9) In the above (7) and (8),
A lid portion (for example, a sealing lid portion 1, 1 ′ described later) for sealing an end portion of the LED protective tube is provided,
An internal space between the LED protective tube and the lid is filled with an inert gas.

なお、上述の第一の熱伝導性樹脂および第二の熱伝導性樹脂の記載における「第一」,「第二」は、それぞれの熱伝導性樹脂が異なる部分(第一は放熱部自体,第二はLED基板と放熱部との間の空間域)で用いられることを示している。双方の熱伝導性樹脂が異なる材質からなるか、同じ材質からなるかは任意である。   In the description of the first thermal conductive resin and the second thermal conductive resin described above, “first” and “second” are different portions of the respective thermal conductive resins (the first is the heat radiating part itself, The second indicates that it is used in a space area between the LED substrate and the heat dissipation portion. It is arbitrary whether the two heat conductive resins are made of different materials or the same material.

このような上記(1)〜(9)それぞれの構成からなるLED保護管、LEDラインランプ、および、LEDラインランプの製造方法を本発明の対象としている。   The LED protective tube, the LED line lamp, and the method for manufacturing the LED line lamp having the configurations (1) to (9) are the objects of the present invention.

本発明は、以上の課題解決手段により、
(31)LED保護管を軽量化するので、LEDラインランプの取り付け対象の器具負担の軽減、落下時の安全性向上、運搬の容易化などを図り、
(32)LED保護管(放熱部+透過・拡散部)を一体成形するので、LEDラインランプに不活性ガスを充填したときの気密性を得ることが容易となり、長寿命化を図り、
(33) LED保護管の構造の簡素化するので、LEDラインランプの製造コストの低減化や生産性の向上化を図る、
ことなどができる。
The present invention provides the above problem solving means.
(31) Since the LED protective tube will be lighter, we will reduce the burden on the equipment to which the LED line lamp is attached, improve safety when dropped, and facilitate transportation.
(32) Since the LED protective tube (heat radiation part + transmission / diffusion part) is integrally molded, it becomes easy to obtain airtightness when the LED line lamp is filled with an inert gas, and the service life is extended.
(33) Since the structure of the LED protection tube is simplified, the production cost of the LED line lamp is reduced and the productivity is improved.
You can do that.

LEDラインランプの全体外観を示す説明図である。It is explanatory drawing which shows the whole external appearance of a LED line lamp. 図1のA−A´方向の断面形状を示す説明図である。It is explanatory drawing which shows the cross-sectional shape of the AA 'direction of FIG. 放熱部を構成する放熱樹脂およびポリカーボネートそれぞれの配合割合と、そのときの放熱部性能との関係を示す実験結果である。It is an experimental result which shows the relationship between the mixing | blending ratio of each of the thermal radiation resin and polycarbonate which comprises a thermal radiation part, and the thermal radiation part performance at that time. LEDラインランプの組み立て方法についての説明図である。It is explanatory drawing about the assembly method of a LED line lamp. LEDラインランプの組み立て方法についての説明図である。It is explanatory drawing about the assembly method of a LED line lamp.

図1〜図5を参照して、本発明を実施するための形態について説明する。   With reference to FIGS. 1-5, the form for implementing this invention is demonstrated.

各図で用いるアルファベット付き参照番号の構成要素(例えば、放熱部2a)は原則として、当該参照番号の数字部分の構成要素(例えば、外筒部2)の一部であることを示している。また、アルファベット付き参照番号の後にさらにハイフォン(−)と数字が記載された構成要素(例えば、溝状部2a−2)は、当該アルファベット付き参照番号(例えば、放熱部2a)の構成要素の一部であることを示している。   The components with reference numbers with alphabets (for example, the heat radiating portion 2a) used in each figure are shown to be part of the components (for example, the outer cylinder portion 2) with the numeral portions of the reference numbers in principle. In addition, a constituent element (for example, the groove-like part 2a-2) in which a hyphen (-) and a number are further described after the reference number with alphabet is one of the constituent elements of the reference number with alphabet (for example, the heat radiating part 2a). It shows that it is a part.

図1、図2、図4、および、図5において、
1,1´は、左右一対の形で配設され、後述する放熱部2aおよび拡散部2bで構成された外筒部2の左右両端を封止する封止蓋部、
1a,1a´は、当該封止蓋部のそれぞれの外端面部分に形成された一対の接続端子、
2は、一体成形されて後述する放熱部2aおよび拡散部2bからなる直管状の外筒部(LED保護管)、
2aは、後述の放熱樹脂とポリカーボネートなどの合成樹脂との混合物で形成され、後述するLED基板4が発生する熱を外部に放熱する放熱部、
2a−1は、当該外筒部の内側となるように、当該放熱部のほぼ中央部に長手方向に形成され、後述のLED基板4のLED素子4a搭載面の裏面(上側)が対向する吸熱用の対向面(当接面)、
2a−2は、当該対向面の長手方向中央部に形成される溝状部、
2bは、ポリカーボネートなどの合成樹脂で生成され、LED出力光の拡散作用および白色化作用を呈する断面C形直線状の拡散部、
2b−1,2b−1´は、当該拡散部の長方形状底面側の前後両端部分(長手方向)に、放熱部2aをその一辺として断面コの字状になるようにそれぞれ形成され、後述のLED基板4をそこにスライド挿入させて保持するための一対の対向案内部
を、それぞれ示している。
In FIG. 1, FIG. 2, FIG. 4, and FIG.
1 and 1 'are arranged in a pair of left and right shapes, and sealing lid portions that seal both left and right ends of the outer cylinder portion 2 configured by a heat radiating portion 2a and a diffusion portion 2b, which will be described later,
1a and 1a ′ are a pair of connection terminals formed on the respective outer end surface portions of the sealing lid portion,
2 is a straight tubular outer tube portion (LED protective tube) that is integrally molded and includes a heat radiating portion 2a and a diffusion portion 2b, which will be described later.
2a is formed of a mixture of a heat-dissipating resin described later and a synthetic resin such as polycarbonate, and a heat-dissipating part that dissipates heat generated by the LED substrate 4 described later to the outside,
2a-1 is formed in the longitudinal direction at the substantially central portion of the heat radiating portion so as to be inside the outer cylinder portion, and the heat absorption opposite to the back surface (upper side) of the LED element 4a mounting surface of the LED substrate 4 described later. Facing surface (contact surface),
2a-2 is a groove-shaped portion formed in the center in the longitudinal direction of the facing surface,
2b is a C-shaped linear diffusion section having a cross-sectional shape that is produced from a synthetic resin such as polycarbonate and exhibits LED light diffusing action and whitening action;
2b-1 and 2b-1 ′ are respectively formed in the front and rear end portions (longitudinal direction) on the rectangular bottom surface side of the diffusion portion so as to have a U-shaped cross section with the heat radiation portion 2a as one side thereof. A pair of opposing guide portions for slidingly holding the LED substrate 4 therein is shown.

そして、
3は、後述するLED基板4のLED素子4bを駆動するための駆動素子や、電源回路ユニットなどを搭載したLED駆動回路部、
4は、拡散部2bの対向案内部2b−1,2b−1´に保持される状態で、対向面(当接面)2a−1との間に配設されたLED基板、
4aは、後述するLED素子4bを搭載するとともに、LED駆動回路部3からの電流をそれぞれのLED素子4bに供給するための導体パターンが設定された基板部、
4bは、基板部4aにそれぞれ下向きでインライン搭載された複数のLED素子、
4cは、当該LED基板において、基板部4aの導体パターンとLED素子4bのそれぞれを接続するハンダ接続部、
4dは、当該LED基板の長手方向端部に形成されたスライド挿入作動用の孔部
を、それぞれ示している。
And
3 is a driving element for driving the LED element 4b of the LED substrate 4 to be described later, an LED driving circuit unit equipped with a power supply circuit unit, etc.
4 is an LED substrate disposed between the opposing surface (contact surface) 2a-1 in a state of being held by the opposing guide portions 2b-1, 2b-1 ′ of the diffusing portion 2b.
4a is mounted with a later-described LED element 4b, and a board portion on which a conductor pattern for supplying current from the LED drive circuit unit 3 to each LED element 4b is set,
4b is a plurality of LED elements mounted in-line downward on the substrate part 4a,
4c, in the LED substrate, a solder connection portion for connecting the conductor pattern of the substrate portion 4a and each of the LED elements 4b,
4d shows holes for slide insertion operation formed at the ends in the longitudinal direction of the LED substrate.

そして、
5は、放熱部2aとLED基板4の間に充填された熱伝導性樹脂(図2参照)、
6は、充填対象の熱伝導性樹脂5を溝状部2a−2上に滴下するためのパイプ(図4,図5参照)、
6aは、当該パイプの一端であって、後述する給液管7の接続端とは異なる側に設けられ、溝状部2a−2上に熱伝導性樹脂5を滴下するための滴下口、
7は、熱伝導性樹脂5をパイプ内に供給するためにパイプ6と接続された給液管、
8は、その端部が、例えば90度前後のカギ状になっており、対向案内部2b−1,2b−1´に沿って、LED基板4をスライド挿入させるために、孔部4dにその端部を差し込むことができる形状を有するフック
を、それぞれ示している。
And
5 is a heat conductive resin (see FIG. 2) filled between the heat radiation part 2a and the LED substrate 4.
6 is a pipe for dripping the heat conductive resin 5 to be filled onto the groove-like portion 2a-2 (see FIGS. 4 and 5),
6a is one end of the pipe, provided on the side different from the connection end of the liquid supply pipe 7 to be described later, a dropping port for dropping the heat conductive resin 5 on the groove-like portion 2a-2,
7 is a liquid supply pipe connected to the pipe 6 for supplying the heat conductive resin 5 into the pipe,
8, the end of which is in the shape of a key around 90 degrees, for example, so that the LED board 4 can be slid along the opposing guide portions 2b-1, 2b-1 '. Each of the hooks has a shape into which the end can be inserted.

LEDラインランプは、封止蓋部1,1´、放熱部2aおよび拡散部2bで構成される外筒部2(LED保護管)、LED駆動回路部3、LED基板4並びに熱伝導性樹脂5などの構成要素からなっている。   The LED line lamp includes an outer cylinder portion 2 (LED protective tube) composed of a sealing lid portion 1, 1 ′, a heat radiating portion 2 a and a diffusion portion 2 b, an LED drive circuit portion 3, an LED substrate 4, and a heat conductive resin 5. It consists of components such as.

封止蓋部1,1´、および、拡散部2bには、例えば、ポリカーボネートなどの合成樹脂製のものが用いられている。放熱部2aには、高熱伝導性充填材などを含有し高熱伝導性を有する合成樹脂である放熱樹脂と、ポリカーボネートなどの合成樹脂との混合物のものが用いられている。基板部4aには、アルミ基板やガラスエポキシ基板などが用いられている。熱伝導性樹脂5には、熱伝導性の高い樹脂製のものが用いられている。また、熱伝導性樹脂5に用いられる樹脂は、熱伝導性が高いのみならず、さらに、接着性を有していると好適である。   For the sealing lid portions 1 and 1 ′ and the diffusion portion 2 b, for example, those made of synthetic resin such as polycarbonate are used. For the heat radiating part 2a, a mixture of a heat radiating resin, which is a synthetic resin containing a high thermal conductivity filler and having high thermal conductivity, and a synthetic resin such as polycarbonate is used. For the substrate portion 4a, an aluminum substrate, a glass epoxy substrate, or the like is used. The heat conductive resin 5 is made of a resin having high heat conductivity. In addition, the resin used for the heat conductive resin 5 preferably has not only high heat conductivity but also adhesiveness.

封止蓋部1,1´、放熱部2a、および、拡散部2bに用いられるポリカーボネートには、例えば、三菱エンジニアリングプラスチック株式会社製のグレード名:EKD2108Uなどがある。放熱部2aにおいて、上述したポリカーポネートと混合されて用いられる放熱樹脂には、例えば、三菱エンジニアリングプラスチックス株式会社のグレード名:TPN1121などがある。このTPN1121は、一般的なポリカーボネートの熱伝導率が0.2W/m/K程度であるのに対して、7〜8W/m/Kの熱伝導率を有する。また、熱伝導性樹脂5には、例えば、東レ・ダウコーニング株式会社製のシリコーン高熱伝導性放熱接着剤TC−2030などを用いることができる。このTC−2030は二液混合硬化型の接着剤で、混合して時間が経過すると液状からゴム状に硬化するので、硬化する前に滴下・充填する必要がある。   Examples of the polycarbonate used for the sealing lid portions 1 and 1 ', the heat radiating portion 2a, and the diffusing portion 2b include grade name: EKD2108U manufactured by Mitsubishi Engineering Plastics. In the heat radiating part 2a, examples of the heat radiating resin mixed with the above-described polycarbonate and the like include grade name: TPN1121 of Mitsubishi Engineering Plastics Co., Ltd. The TPN 1121 has a thermal conductivity of 7 to 8 W / m / K, whereas a general polycarbonate has a thermal conductivity of about 0.2 W / m / K. In addition, as the heat conductive resin 5, for example, silicone high heat conductive heat radiation adhesive TC-2030 manufactured by Toray Dow Corning Co., Ltd. can be used. This TC-2030 is a two-component mixed-curing type adhesive, which, after mixing, cures from a liquid state to a rubber-like shape, and therefore needs to be dropped and filled before curing.

図1は、LEDラインランプの全体外観を示す図である。   FIG. 1 is a diagram showing an overall appearance of an LED line lamp.

放熱部2aおよび拡散部2bで構成される外筒部2は、直管状であって、いずれか一端(図1においては、左側)の内部に、LED駆動回路部3を装着可能なようになされている。LED駆動回路部3は、接続端子1a,1a´と電気的に接続されており、点灯や消灯などの制御信号や、電源の供給を受けることができるようになされている。放熱部2aおよび拡散部2bで構成される外筒部2は、LED駆動回路部3およびLED基板4(図2参照)をその内部に備え、窒素ガスなどの不活性ガスが充填された状態で、封止蓋部1,1´のそれぞれにより、その両端が気密に封止される。   The outer cylinder part 2 composed of the heat radiating part 2a and the diffusing part 2b is a straight tube, and the LED drive circuit part 3 can be mounted inside one end (left side in FIG. 1). ing. The LED drive circuit unit 3 is electrically connected to the connection terminals 1a and 1a ′, and can receive control signals such as lighting and extinguishing and power supply. The outer cylinder part 2 composed of the heat radiating part 2a and the diffusing part 2b is provided with an LED drive circuit part 3 and an LED substrate 4 (see FIG. 2) inside and filled with an inert gas such as nitrogen gas. The both ends of the sealing lid portions 1 and 1 'are hermetically sealed.

ここで、封止蓋部1,1´は、例えば、実用新案登録3176594号公報に記載の技術を適用することなどにより、放熱部2aおよび拡散部2bで構成される外筒部2を回動可能なように把持することができると好適である。   Here, the sealing lid portion 1, 1 ′ rotates the outer cylinder portion 2 composed of the heat radiating portion 2 a and the diffusing portion 2 b, for example, by applying the technology described in Utility Model Registration No. 3176594. It is preferred that it can be gripped as possible.

また、図示のLEDラインランプは、LED素子4bとしては青色発光素子に黄色の蛍光体を被せたものを用いている。この青色および黄色の混色作用によって得られる白色光を、拡散剤を含む拡散部2bからの白色照射光として出力することができる。   In the illustrated LED line lamp, a blue light emitting element covered with a yellow phosphor is used as the LED element 4b. The white light obtained by the blue and yellow color mixing action can be output as white irradiation light from the diffusion portion 2b containing the diffusing agent.

図2は、図1のA−A´方向の断面形状を示す図である。   FIG. 2 is a diagram showing a cross-sectional shape in the AA ′ direction of FIG. 1.

拡散部2bの上側両端、すなわち、放熱部2aと接する長手方向部分には、対向案内部2b−1,2b−1´が設けられる。対向案内部2b−1,2b−1´は、放熱部2aをその一辺として断面コの字状になるようにそれぞれ形成される。LED基板4は、放熱部2aと対向案内部2b−1,2b−1´とで形成される断面コの字型の部分に、その前後両端部分が保持されるようにスライド挿入される。   Opposing guide portions 2b-1 and 2b-1 'are provided at both upper ends of the diffusing portion 2b, that is, in a longitudinal direction portion in contact with the heat radiating portion 2a. The opposing guide portions 2b-1, 2b-1 'are each formed to have a U-shaped cross section with the heat radiating portion 2a as one side. The LED substrate 4 is slid and inserted into a U-shaped portion formed by the heat radiating portion 2a and the opposing guide portions 2b-1, 2b-1 'so that both front and rear end portions thereof are held.

すなわちこの断面コの字型部分の高さは、LED基板4を対向案内部2b−1,2b−1´にスライド挿入させて安定的にLED基板4を保持することができる大きさに決められる。   That is, the height of the U-shaped portion of the cross section is determined to be a size that allows the LED substrate 4 to be stably held by sliding the LED substrate 4 into the opposing guide portions 2b-1, 2b-1 ′. .

LED基板4は、LED素子4bを搭載するとともにLED駆動回路部3からの電流をそれぞれのLED素子4bに供給するための導体パターンが描かれた基板部4a、基板部4aにそれぞれ下向きでインライン搭載された複数のLED素子4b、基板部4aの導体パターンとLED素子4bのそれぞれを接続するハンダ接続部4cを含むかたちで構成され、LED駆動回路部3の駆動制御に基づいて複数のLED素子4bが、点灯および消灯される。   The LED board 4 is mounted inline with the LED element 4b mounted on the board part 4a and the board part 4a on which the conductor pattern for supplying the current from the LED drive circuit unit 3 to each LED element 4b is drawn. The plurality of LED elements 4b, the conductor pattern of the board part 4a and the solder connection part 4c for connecting each of the LED elements 4b, and the plurality of LED elements 4b based on the drive control of the LED drive circuit part 3 Is turned on and off.

そして、放熱部2aのほぼ中央部に長手方向に溝状部2a−2が形成される。溝状部2a−2を含む放熱部2aと、基板部4aのLED素子4bが搭載されていない側との間には、熱伝導性樹脂5が充填される。溝状部2a−2が形成されていることにより、熱伝導性樹脂5は、LED基板と放熱部との間に十分行き渡る。これにより、LED基板4の点灯により発生する熱を、効率よく放熱部2aから放熱することができる。また、基板部4aの熱伝導性樹脂5との接触面には、さらに熱伝導性を向上させるために、例えば、銅版などを張り付けるようにすると好適である。   And groove-like part 2a-2 is formed in the longitudinal direction in the approximate center part of the thermal radiation part 2a. The heat conductive resin 5 is filled between the heat radiating part 2a including the groove part 2a-2 and the side on which the LED element 4b of the substrate part 4a is not mounted. By forming the groove-shaped part 2a-2, the heat conductive resin 5 is sufficiently distributed between the LED substrate and the heat dissipation part. Thereby, the heat | fever generate | occur | produced by lighting of the LED board 4 can be thermally radiated from the thermal radiation part 2a efficiently. Further, for example, a copper plate is preferably attached to the contact surface of the substrate portion 4a with the heat conductive resin 5 in order to further improve the heat conductivity.

なお、ここでは、対向案内部2b−1,2b−1´が、拡散部2bの前後両端、すなわち、放熱部2aと接する部分に、放熱部2aをその一辺として断面コの字状になるようにそれぞれ形成されているものとして説明したが、対向案内部2b−1,2b−1´は、外筒部2内部に、長手方向に断面コの字状になるように少なくとも2か所形成されていればよく、例えば、拡散部2bの前後両端付近の部分に長手方向に断面コの字状になるようにそれぞれ形成されていてもよいし、2つ以上の対向案内部2bが形成され、異なる大きさのLED基板を搭載可能なようにしてもよい。   Here, the opposing guide portions 2b-1 and 2b-1 'are formed in a U-shaped cross section with the heat radiating portion 2a as one side at the front and rear ends of the diffusing portion 2b, that is, at the portion in contact with the heat radiating portion 2a. However, the opposing guide portions 2b-1 and 2b-1 'are formed in the outer cylinder portion 2 at least at two locations so as to have a U-shaped cross section in the longitudinal direction. For example, it may be formed so as to have a U-shaped cross section in the longitudinal direction in the vicinity of the front and rear ends of the diffusion portion 2b, or two or more opposing guide portions 2b are formed, You may enable it to mount the LED board of a different magnitude | size.

図3は、放熱部2aに関する放熱樹脂とポリカーボネートの配合実験結果を示す説明図である。   FIG. 3 is an explanatory view showing the blending experiment result of the heat radiation resin and the polycarbonate regarding the heat radiation portion 2a.

放熱部2aを放熱樹脂とポリカーボネートなどの樹脂との混合物としているのは、放熱樹脂だけでは満足しない、成型性、密着性、表面仕上がりなどを向上させるためである。図3には、ポリカーボネート(例えば、三菱エンジニアリングプラスチック株式会社製のグレード名:EKD2108Uなど)と放熱樹脂(例えば、三菱エンジニアリングプラスチックス株式会社のグレード名:TPN1121など)との混合比と、弾性、放熱性、成形性、密着性、および、表面仕上がりとの関係を示している。   The reason why the heat dissipating part 2a is a mixture of a heat dissipating resin and a resin such as polycarbonate is to improve moldability, adhesion, surface finish, etc., which are not satisfied with the heat dissipating resin alone. FIG. 3 shows the mixing ratio of polycarbonate (for example, grade name: EKD2108U manufactured by Mitsubishi Engineering Plastics Co., Ltd.) and a heat radiation resin (for example, grade name: TPN1121 etc. of Mitsubishi Engineering Plastics Co., Ltd.), elasticity, and heat dissipation. It shows the relationship between the properties, formability, adhesion, and surface finish.

この関係によれば、放熱樹脂とポリカーボネートなどの合成樹脂との混合物の混合比が30%〜70%の範囲の放熱部2aを用いると、当該放熱部の弾性、放熱性、成形性、密着性、および表面仕上がりのそれぞれに一定以上の品質を得ることができる。   According to this relationship, when the heat dissipation part 2a in which the mixing ratio of the heat dissipation resin and the synthetic resin such as polycarbonate is in the range of 30% to 70% is used, the elasticity, heat dissipation, moldability, and adhesion of the heat dissipation part are concerned. A certain level of quality can be obtained for each of the surface finish.

このような混合比の樹脂の混合物で生成された放熱部2aには、十分な密着性が備わるため、放熱部2aと拡散部2bを押出材としてこれらを一体成形(二色成形)し、必要な長さに切り出して外筒部2を形成することが可能となる。これにより、別途金属製放熱部材の生産を不要とすることができ、工数を少なくし、かつ、外筒部2の軽量化を図ることができる。また、一体成形された外筒部2を封止蓋部1,1´により封止したものは、気密性に優れるので、例えば、窒素ガスなどの不活性ガスを注入することができる。これによって、温度上昇によるLED素子4bやハンダ接続部4cなどの酸化による劣化を防止することが可能となり、LEDラインランプの長寿命化を図ることができる。   Since the heat radiating part 2a generated with the resin mixture having such a mixing ratio has sufficient adhesion, the heat radiating part 2a and the diffusing part 2b are integrally formed (two-color molding) using the extruded material as a necessary material. It is possible to form the outer cylinder portion 2 by cutting it into a long length. Thereby, it is possible to eliminate the need to separately produce a metal heat radiating member, to reduce the man-hours, and to reduce the weight of the outer cylinder portion 2. Moreover, what sealed the outer cylinder part 2 integrally molded by the sealing lid parts 1 and 1 'is excellent in airtightness, For example, inert gas, such as nitrogen gas, can be inject | poured. Accordingly, it is possible to prevent deterioration of the LED element 4b, the solder connection portion 4c, and the like due to temperature rise due to oxidation, and it is possible to extend the life of the LED line lamp.

すなわち、図1、図2、および、図3を用いて説明したLEDラインランプの基本的特徴は、
(41)放熱部2aが、高熱伝導性を有する合成樹脂で生成されていること、
(42)放熱部2aと拡散部2bが一体成形されること、
(43)拡散部2bの上端側には、放熱部2aとあわせて断面コの字状になるように拡散部長手方向の対向案内部2b−1,2b−1´が形成され、LED基板4は、放熱部2aと対向案内部2b−1,2b−1´によって形成される断面コの字状の部分に、その前後方向端部が挟まれて保持されること、
である。
That is, the basic features of the LED line lamp described with reference to FIGS. 1, 2 and 3 are as follows:
(41) The heat dissipating part 2a is made of a synthetic resin having high thermal conductivity,
(42) The heat radiating portion 2a and the diffusing portion 2b are integrally formed,
(43) On the upper end side of the diffusing portion 2b, opposed guide portions 2b-1, 2b-1 'in the longitudinal direction of the diffusing portion are formed so as to have a U-shaped cross section together with the heat radiating portion 2a. Is that the end portion in the front-rear direction is sandwiched and held by the U-shaped section formed by the heat radiation portion 2a and the opposing guide portions 2b-1, 2b-1 ′,
It is.

さらなる基本的特徴は、
(44)放熱部2aの下面ほぼ中央部に放熱部長手方向の溝状部2a−2が形成されていること、
(45)溝状部2a−2を含む放熱部2aの対向面2a−1と、基板部4aのLED素子4bが搭載されていない側の面との隙間に熱伝導性樹脂5が充填されていること、
(46)放熱部2aおよび拡散部2bで構成される外筒部2を封止蓋部1,1´により封止した内部には、不活性ガス(例えば窒素ガス)が注入されていること
などである。
Further basic features are
(44) A groove-like portion 2a-2 in the longitudinal direction of the heat radiating portion is formed at a substantially central portion of the lower surface of the heat radiating portion 2a.
(45) The heat conductive resin 5 is filled in the gap between the facing surface 2a-1 of the heat radiating portion 2a including the groove-shaped portion 2a-2 and the surface of the substrate portion 4a where the LED element 4b is not mounted. Being
(46) An inert gas (for example, nitrogen gas) is injected into the inside of the outer cylinder portion 2 composed of the heat radiating portion 2a and the diffusing portion 2b sealed with the sealing lid portions 1 and 1 '. It is.

従来、LEDラインランプの放熱部にはアルミなどの金属製のものが用いられてきたのに対して、図1および図2に示された放熱部2aは、上記基本的特徴(41)に示したように、高熱伝導性を有する合成樹脂で生成されている。これにより、従来ものに対して軽量化することができ、取り付け対象の器具負担の軽減、落下時の安全性向上、運搬の容易化などを達成することができる。   Conventionally, the heat radiating part of the LED line lamp has been made of metal such as aluminum, whereas the heat radiating part 2a shown in FIGS. 1 and 2 is shown in the basic feature (41). As described above, it is made of a synthetic resin having high thermal conductivity. Thereby, it can reduce in weight with respect to the conventional one, and reduction of the instrument burden of attachment object, safety improvement at the time of dropping, easy transportation, etc. can be achieved.

また、従来、LEDラインランプの放熱部にはアルミなどの金属製のものが用いられてきたため、放熱部と拡散部とは、それぞれ別個に形成されていたが、上記基本的特徴(42)に示したように、放熱部2aと拡散部2bからなる外筒部2を一体成形することができる。これにより、外筒部2形成のための工数を削減することができる。   In addition, conventionally, since the heat radiation part of the LED line lamp has been made of metal such as aluminum, the heat radiation part and the diffusion part have been formed separately, but the basic feature (42) As shown, the outer tube portion 2 including the heat radiating portion 2a and the diffusing portion 2b can be integrally formed. Thereby, the man-hour for outer cylinder part 2 formation can be reduced.

また、従来、LED基板は、金属部分のカシメ加工により固定されていたが、放熱部2aおよび拡散部2bで構成される外筒部2が樹脂製であることから、同様の固定方法を用いることができない。これに対して、上記基本的特徴(43)に示したように、対向案内部2b−1,2b−1´が形成されているので、LED基板4は、放熱部2aと対向案内部2b−1,2b−1´によって形成される断面コの字状の部分にその前後方向端部が挟まれて保持されるように、スライド挿入される(その工程の詳細は、図4および図5を用いて後述する)。これにより、金属部材を用いることなく、LED基板4を外筒部2内部の所定位置に配置することが可能となる。   Conventionally, the LED board has been fixed by caulking of the metal part. However, since the outer cylinder part 2 composed of the heat radiating part 2a and the diffusing part 2b is made of resin, a similar fixing method is used. I can't. On the other hand, as shown in the basic feature (43), since the opposing guide portions 2b-1, 2b-1 'are formed, the LED substrate 4 includes the heat radiating portion 2a and the opposing guide portion 2b-. It is slid and inserted so that the front and rear end portions are sandwiched and held by the U-shaped section formed by 1 and 2b-1 ′ (see FIGS. 4 and 5 for details of the process). Will be described later). Thereby, it becomes possible to arrange | position the LED board 4 in the predetermined position inside the outer cylinder part 2, without using a metal member.

また、上記基本的特徴(44)および(45)で示したように、放熱部長手方向に形成された溝状部2a−2を含む対向面2a−1と、基板部4aのLED素子4bが搭載されていない側の面との隙間に熱伝導性樹脂5が充填されていることにより、LED基板4の点灯により発生する熱を、効率よく放熱部2aから放熱することができる。また、熱伝導性樹脂5が接着性を有していた場合、LED基板4はさらに安定して固定されるので、好適である。   Further, as shown in the basic features (44) and (45), the opposing surface 2a-1 including the groove-like portion 2a-2 formed in the longitudinal direction of the heat radiating portion and the LED element 4b of the substrate portion 4a are provided. Since the heat conductive resin 5 is filled in the gap between the surface on which the LED board 4 is not mounted, the heat generated by the lighting of the LED substrate 4 can be efficiently radiated from the heat radiation portion 2a. Moreover, when the heat conductive resin 5 has adhesiveness, since the LED board 4 is fixed more stably, it is suitable.

また、放熱部2aおよび拡散部2bで構成される外筒部2の気密性が高いことから、上記基本的特徴(43)に示したように、外筒部2を封止蓋部1,1´により封止した内部に不活性ガスを充填することが可能となる。これにより、温度上昇によるLED素子4bやハンダ接続部4cなどの酸化による劣化を防止することが可能となり、LEDラインランプの長寿命化を図れる。   Moreover, since the airtightness of the outer cylinder part 2 comprised by the thermal radiation part 2a and the spreading | diffusion part 2b is high, as shown in the said basic characteristic (43), the outer cylinder part 2 is made into sealing lid part 1,1. It becomes possible to fill the inside sealed with ′ with an inert gas. Accordingly, it is possible to prevent deterioration of the LED element 4b, the solder connection portion 4c, and the like due to temperature rise due to oxidation, and it is possible to extend the life of the LED line lamp.

次に、図4及び図5を用いて、放熱部2aおよび拡散部2bで構成される外筒部2に、LED基板4を取り付け、熱伝導性樹脂5を充填する工程について説明する。   Next, with reference to FIG. 4 and FIG. 5, a process of attaching the LED substrate 4 to the outer cylinder portion 2 composed of the heat radiating portion 2 a and the diffusing portion 2 b and filling the thermally conductive resin 5 will be described.

上述したように、LED基板4の取り付け部分がすべて樹脂製になったため、金属用のカシメ加工ではLED基板4を外筒部2内部に固定することができない。また、一体成形された外筒部2は細い筒状長尺部材となるので、その内側に、同様に長尺部材であるLED基板4を取り付ける作業は、従来の取り付け作業と同等の方法では非常に困難となる。そのため、LED基板4の取り付けは、長手方向からの差込みとし、その差し込みと同時に、LED基板4が差し込まれる直前の箇所に熱伝導性樹脂5を流し込む。   As described above, since all the mounting portions of the LED substrate 4 are made of resin, the LED substrate 4 cannot be fixed inside the outer cylinder portion 2 by caulking for metal. Further, since the integrally formed outer cylinder portion 2 becomes a thin cylindrical long member, the work for attaching the LED board 4 which is also a long member inside is very difficult in the same manner as the conventional attachment work. It becomes difficult. For this reason, the LED substrate 4 is attached from the longitudinal direction, and simultaneously with the insertion, the heat conductive resin 5 is poured into a place immediately before the LED substrate 4 is inserted.

熱伝導性樹脂5の充填工程は図4に示されるように、先ず外筒部2の長手方向の長さより長いパイプ6およびフック8を一本の棒状部材となるように相互固定する。パイプ6は、パイプ6およびフック8が図中右側から左方向に引き抜かれるときに、滴下口6aがフック8の先端カギ状部分より引き抜かれる方向側(図中左側:図4を横長にしたときの左側)に位置するとともに、滴下口6aが溝状部2a−2の上部に位置するように、その位置が決められる。そして、フック8は、パイプ6およびフック8が図中右側から左方向に引き抜かれるときに、LED基板4が、対向案内部2b−1,2b−1´と放熱部2aとで構成される断面コの字形状の部分に差し込まれてスライド挿入されるように、その先端の位置が決められる。   As shown in FIG. 4, the filling process of the heat conductive resin 5 first fixes the pipe 6 and the hook 8 longer than the length in the longitudinal direction of the outer cylinder part 2 so as to form one bar-like member. When the pipe 6 and the hook 8 are pulled out from the right side in the drawing in the left direction, the pipe 6 is pulled out from the hooked portion of the tip of the hook 8 (left side in the drawing: when FIG. 4 is horizontally long). And the position is determined so that the dripping port 6a is located above the groove-like portion 2a-2. The hook 8 has a cross section in which the LED substrate 4 is composed of the opposing guide portions 2b-1, 2b-1 'and the heat radiating portion 2a when the pipe 6 and the hook 8 are pulled out from the right side in the drawing in the left direction. The position of the tip is determined so as to be inserted into the U-shaped portion and slid.

LED基板4は、基板部4aのLED素子4b、ハンダ接続部4c、および、導線パターンのない長手方向端部に孔部4dを有する。孔部4dは、LED基板4の長手方向の少なくともいずれか一端に設けられると好適である。LED基板4は、フック8の先端側に用意される。   The LED board 4 has the LED element 4b of the board | substrate part 4a, the solder connection part 4c, and the hole part 4d in the longitudinal direction edge part which does not have a conducting wire pattern. The hole 4d is preferably provided at at least one end in the longitudinal direction of the LED substrate 4. The LED substrate 4 is prepared on the tip side of the hook 8.

そして、相互固定されたパイプ6およびフック8は、外筒部2の一端(図中左側)から外筒部2内部に差し込まれ、フック8の先端カギ状の部分が、外筒部2の他端より外側(図中右側)に出るように配置される。パイプ6の他端(図中左側)には給液管7が取り付けられ、熱伝導性樹脂5をパイプ6に送出する。なお、LED基板4の孔部4dが、LED基板4の長手方向のいずれか一端に設けられていた場合、孔部4dが、外筒部2側(図中左側)となるように、LED基板4が配置されると好適である。   The pipe 6 and the hook 8 fixed to each other are inserted into the outer cylinder part 2 from one end (left side in the figure) of the outer cylinder part 2, and the hook-shaped portion of the hook 8 is connected to the other part of the outer cylinder part 2. It is arranged so as to come out from the end (right side in the figure). A liquid supply pipe 7 is attached to the other end (left side in the figure) of the pipe 6, and the thermally conductive resin 5 is sent to the pipe 6. When the hole 4d of the LED substrate 4 is provided at one end in the longitudinal direction of the LED substrate 4, the LED substrate is arranged so that the hole 4d is on the outer cylinder 2 side (left side in the figure). 4 is preferably arranged.

パイプ6の先端カギ状の部分に、LED基板4の孔部4dが差し込まれて、図中右から左方向にフック8が引き抜かれると、図5に示されるように、LED基板4は、対向案内部2b−1,2b−1´と放熱部2aとで構成される断面コの字形状の部分に差し込まれてスライド挿入される。その時、LED基板4のスライド挿入位置より進行方向側(図中左側)において、滴下口6aから熱伝導性樹脂5が溝状部2a−2上部に滴下される。熱伝導性樹脂5の滴下量は、溝状部2a−2の容積より多く、LED基板4と溝状部2a−2を含む放熱部2との隙間を充填するのに十分な量となるように調整される。   When the hole 4d of the LED substrate 4 is inserted into the key-shaped portion of the pipe 6 and the hook 8 is pulled out from the right to the left in the drawing, the LED substrate 4 is opposed to each other as shown in FIG. It is inserted into the U-shaped section formed by the guide portions 2b-1, 2b-1 'and the heat radiating portion 2a and is slid. At that time, the heat conductive resin 5 is dripped onto the upper part of the groove-shaped portion 2a-2 from the dropping port 6a on the traveling direction side (left side in the figure) from the slide insertion position of the LED substrate 4. The dripping amount of the heat conductive resin 5 is larger than the volume of the groove-shaped portion 2a-2, and is sufficient to fill the gap between the LED substrate 4 and the heat radiation portion 2 including the groove-shaped portion 2a-2. Adjusted to

このようにして、細い筒状長尺部材である外筒部2に対して、同様に長尺部材であるLED基板4を容易に取り付けることができ、さらに、同一の工程で、LED基板4と溝状部2a−2を含む放熱部2との隙間に、熱伝導性樹脂5を充填することができる。熱伝導性樹脂5が、高い熱伝導性を有するのみならず、接着性も有していた場合、LED基板4がさらに安定して固定されるので、好適である。   In this way, the LED board 4 which is also a long member can be easily attached to the outer cylinder part 2 which is a thin cylindrical long member. Further, in the same process, The heat conductive resin 5 can be filled in a gap between the heat radiation part 2 including the groove part 2a-2. When the heat conductive resin 5 not only has high heat conductivity but also adhesiveness, the LED substrate 4 is more stably fixed, which is preferable.

なお、接着性を有しない熱伝導性樹脂を用いる場合にも、外筒部2にスライド挿入されたLED基板4の長手方向の位置決めは、LEDラインランプ両端の封止蓋部1,1´によって担保される。   Even when a heat conductive resin having no adhesiveness is used, the LED substrate 4 slidably inserted into the outer cylinder portion 2 is positioned in the longitudinal direction by the sealing lid portions 1 and 1 ′ at both ends of the LED line lamp. Secured.

また、LED基板4の上下方向および前後方向に関しては、対向案内部2b−1,2b−1´と放熱部2aとの間の保持作用によって位置決めされる。   Further, the vertical direction and the front-rear direction of the LED substrate 4 are positioned by the holding action between the opposing guide portions 2b-1, 2b-1 'and the heat radiating portion 2a.

LEDラインランプの製造工程は例えば以下のようになる。
(51)放熱部2aを構成する放熱樹脂とポリカーボネートなどの合成樹脂との混合物と、拡散部2bを構成するポリカーボネートなどの合成樹脂とを、押し出し材として一体成形(二色成形)し、必要な長さに切りだして外筒部2を形成する。
(52)パイプ6およびフック8からなる棒状部を、外筒部2の内側に挿入する。
(53)フック8の先端カギ状の部分にLED基板4の孔部4dを引っ掛ける。
(54)溝状部2a−2に熱伝導性樹脂5を適量滴下しながら、パイプ6およびフック8からなる棒状部を外筒部2から引き抜くように駆動して、LED基板4を、放熱部2aと対向案内部2b−1,2b−1´によって形成される断面コの字状の部分にその前後方向端部が挟まれるようにしてスライド挿入し、所定位置まで引き込む。
(55)LED基板4などにLED駆動回路部3を取り付ける。
(56)外筒部2に不活性ガスを注入、充填して、封止蓋部1,1´を取り付ける。
The manufacturing process of the LED line lamp is as follows, for example.
(51) A mixture of a heat radiating resin constituting the heat radiating portion 2a and a synthetic resin such as polycarbonate and a synthetic resin such as polycarbonate constituting the diffusing portion 2b are integrally molded (two-color molding) as an extrusion material, and necessary. The outer cylinder part 2 is formed by cutting into lengths.
(52) Insert the rod-shaped part composed of the pipe 6 and the hook 8 into the outer cylinder part 2.
(53) The hole 4d of the LED substrate 4 is hooked on the hook-like portion of the hook 8.
(54) While dripping an appropriate amount of the heat conductive resin 5 into the groove-like part 2a-2, the rod-like part composed of the pipe 6 and the hook 8 is driven to be pulled out from the outer cylinder part 2, and the LED substrate 4 is moved to the heat radiating part. 2a and the opposing guide portions 2b-1, 2b-1 ′ are slid and inserted so that the end portions in the front-rear direction are sandwiched between the U-shaped portions formed by the cross-section and pulled to a predetermined position.
(55) The LED drive circuit unit 3 is attached to the LED substrate 4 or the like.
(56) An inert gas is injected into the outer cylinder portion 2 and filled, and the sealing lid portions 1 and 1 'are attached.

このLEDラインランプ製造工程の場合、
(61)放熱樹脂とポリカーボネートなどの合成樹脂との混合比を調整することにより、放熱部2aの密着性が向上し、放熱部2aと拡散部2bからなる外筒部2を一体成形することができため、別途金属製放熱部材の生産を不要とし、外筒部2形成のための工数を削減する、
(62)LED基板4を、放熱部2aおよび対向案内部2b−1,2b−1´によって形成される断面コの字状の部分にその前後方向端部が挟まれるようにしてスライド挿入するものとしたので、細い筒状長尺部材である外筒部2に対して、同様に長尺部材であるLED基板4を容易に取り付ける、
(63)LED基板4のスライド挿入と同工程で熱伝導性樹脂5の充填を行うことができるため、別途工程を必要とせず、生産性を向上させる、
などの利点を有している。
In the case of this LED line lamp manufacturing process,
(61) By adjusting the mixing ratio of the heat-dissipating resin and the synthetic resin such as polycarbonate, the adhesion of the heat-dissipating part 2a is improved, and the outer cylinder part 2 composed of the heat-dissipating part 2a and the diffusing part 2b can be integrally formed. Therefore, it is not necessary to separately produce a metal heat radiating member, and the man-hour for forming the outer cylinder part 2 is reduced.
(62) The LED board 4 is slid and inserted so that the front and rear end portions are sandwiched between U-shaped sections formed by the heat radiating portion 2a and the opposing guide portions 2b-1, 2b-1 '. So, easily attach the LED board 4 which is a long member to the outer cylinder part 2 which is a thin cylindrical long member,
(63) Since the thermal conductive resin 5 can be filled in the same process as the slide insertion of the LED substrate 4, no additional process is required and the productivity is improved.
It has the advantages such as.

また、本発明の実施の形態は、上述した実施の形態に限定されるものではなく、本発明の要旨を逸脱しない範囲において種々の変更が可能であって例えば、
(71)滴下口6aを複数設ける、
(72)溝状部2a−2を複数設ける、
(73)LED基板4の孔部4dを複数設ける、
(74)フック8の先端カギ状部分を複数設ける、
(75)パイプ6およびフック8を兼用のものとし、フック8の先端に滴下口6aを設けて、LED基板4の孔部4dから、当接面に熱伝導性樹脂5を滴下する、
(76)対向案内部2b−1,2b−1´の対向端部を当接面の側へ狭めて、スライド挿入されたLED基板4が当該当接面に付勢されるようにする、
(77)LED基板4の挿入方向端部(前後方向縁部分)を図4および図5上方から見て凹または凸の円弧状とする、
(78)LED基板4の挿入方向端部(前後方向縁部分)をその先端ほど薄くなる形のテーパ面で形成する、
(79)放熱部2aと拡散部2bとを、透光性および熱伝導性を備えた同じ樹脂で一体成形する、
(80)放熱部2aを形成する樹脂として、熱伝導性充填材を混合したアクリロニトリル・ブタジエン・スチレン系樹脂(ABS系樹脂),ポリエステル樹脂などを用いる、
(81)拡散部2bは形成する樹脂として、アクリル樹脂,ポリスチレン樹脂などを用いる、
(82)熱伝導性樹脂5として、熱伝導性充填材を混合したエポキシ樹脂,ポリエステル樹脂などを用いる、
(83)熱伝導性樹脂5として、熱硬化性,嫌気硬化性,熱可塑性などの硬化性状を備えた樹脂を用いる、
(84)上記(80)の樹脂および熱伝導性樹脂5それぞれの熱伝導性充填材として、カーボン,アルミナ,窒化アルミニウム,炭化珪素,窒化ホウ素などを用いる、
(85)不活性ガスとして、二酸化炭素,アルゴンガス,ヘリウムガスなどを用いる、
ようにしてもよい。
The embodiments of the present invention are not limited to the above-described embodiments, and various modifications are possible without departing from the spirit of the present invention.
(71) providing a plurality of dropping ports 6a;
(72) providing a plurality of groove-like portions 2a-2,
(73) A plurality of hole portions 4d of the LED substrate 4 are provided.
(74) Provide a plurality of hook-like portions of the hook 8;
(75) The pipe 6 and the hook 8 are also used, the dropping port 6a is provided at the tip of the hook 8, and the heat conductive resin 5 is dropped from the hole 4d of the LED substrate 4 onto the contact surface.
(76) The opposing end portions of the opposing guide portions 2b-1, 2b-1 ′ are narrowed toward the contact surface so that the LED board 4 inserted by sliding is biased to the contact surface.
(77) The insertion direction end portion (front-rear direction edge portion) of the LED substrate 4 has a concave or convex arc shape when viewed from above in FIGS.
(78) The LED board 4 is formed with an end portion (edge portion in the front-rear direction) in the insertion direction with a tapered surface that becomes thinner toward the tip end.
(79) The heat dissipating part 2a and the diffusing part 2b are integrally molded with the same resin having translucency and heat conductivity.
(80) As a resin forming the heat radiation part 2a, an acrylonitrile / butadiene / styrene resin (ABS resin) mixed with a heat conductive filler, a polyester resin, or the like is used.
(81) The diffusion part 2b uses an acrylic resin, a polystyrene resin, or the like as a resin to be formed.
(82) As the heat conductive resin 5, an epoxy resin, a polyester resin, or the like mixed with a heat conductive filler is used.
(83) As the heat conductive resin 5, a resin having curable properties such as thermosetting, anaerobic curable, and thermoplasticity is used.
(84) Carbon, alumina, aluminum nitride, silicon carbide, boron nitride, or the like is used as the heat conductive filler for each of the resin (80) and the heat conductive resin 5;
(85) As an inert gas, carbon dioxide, argon gas, helium gas, etc. are used.
You may do it.

1,1´:封止蓋部
1a,1a´:電源端子、
2:外筒部(LED保護管)
2a:放熱部
2a−1:対向面
2a−2:溝状部
2b:拡散部
2b−1,2b−1´:対向案内部
3:LED駆動回路部
4:LED基板
4a:基板部
4b:LED素子
4c:ハンダ接続部
4d:孔部
5:熱伝導性樹脂
6:パイプ
6a:滴下口
7:給液管
8:フック
1, 1 ′: Sealing lid 1a, 1a ′: Power supply terminal,
2: Outer cylinder (LED protective tube)
2a: Heat radiation part 2a-1: Opposing surface 2a-2: Grooved part 2b: Diffusion parts 2b-1, 2b-1 ′: Opposing guide part 3: LED drive circuit part 4: LED substrate 4a: Substrate part 4b: LED Element 4c: Solder connection part 4d: Hole part 5: Thermally conductive resin 6: Pipe 6a: Drip port 7: Liquid supply pipe 8: Hook

Claims (9)

LED素子を搭載したLED基板が直管状のLED保護管の内部に配設された形のLEDラインランプの製造方法において、
前記LED基板との当接面を有する第一の熱伝導性樹脂からなる放熱部、前記LED素子の照射光を透過・拡散する樹脂製の拡散部、および当該当接面との間に当該LED基板を案内して保持するための対向案内部を備えた、前記LED保護管を一体成形し、
この一体成形された前記LED保護管に、その開口端部から前記LED基板を前記対向案内部に沿ってスライド挿入する、
ことを特徴とするLEDラインランプの製造方法。
In the manufacturing method of the LED line lamp of the form in which the LED substrate on which the LED element is mounted is disposed inside the straight tubular LED protective tube,
The LED is disposed between the heat radiating portion made of the first heat conductive resin having a contact surface with the LED substrate, the resin diffusion portion that transmits and diffuses the irradiation light of the LED element, and the contact surface. The LED protective tube having an opposing guide portion for guiding and holding the substrate is integrally formed,
Into the integrally formed LED protective tube, the LED substrate is slid and inserted along the opposing guide portion from the opening end portion thereof.
A method for manufacturing an LED line lamp.
前記LED基板を前記対向案内部に沿ってスライド挿入する際に、
第二の熱伝導性樹脂を前記当接面に供給し、
この供給により、前記第二の熱伝導性樹脂が、前記スライド挿入にともない形成される前記LED基板と前記当接面との間の空間域に充填される、
ことを特徴とする請求項1記載のLEDラインランプの製造方法。
When the LED board is slid and inserted along the opposing guide portion,
Supplying a second thermally conductive resin to the contact surface;
By this supply, the second thermally conductive resin is filled in a space area between the LED substrate and the contact surface formed with the slide insertion.
The method of manufacturing an LED line lamp according to claim 1.
前記第二の熱伝導性樹脂は、
前記当接面のスライド挿入方向に形成された溝状部に供給される、
ことを特徴とする請求項2記載のLEDラインランプの製造方法。
The second thermally conductive resin is
Supplied to the groove-shaped part formed in the slide insertion direction of the contact surface,
The method of manufacturing an LED line lamp according to claim 2.
前記LED基板をスライド挿入するための駆動部および前記第二の熱伝導性樹脂を前記当接面に供給するための注入部を一体化した連動部材の作用により、
前記LED基板の先端位置よりもスライド挿入方向の前方部分に、前記第二の熱伝導性樹脂が供給される、
ことを特徴とする請求項1または2記載のLEDラインランプの製造方法。
By the action of the interlocking member that integrates the driving part for slidingly inserting the LED substrate and the injection part for supplying the second thermal conductive resin to the contact surface,
The second thermally conductive resin is supplied to the front portion in the slide insertion direction from the tip position of the LED substrate,
The method of manufacturing an LED line lamp according to claim 1 or 2,
LED素子を搭載したLED基板を収容する直管状のLED保護管において、
前記LED基板との当接面を有する第一の熱伝導性樹脂からなる放熱部と、
前記LED素子の照射光を透過・拡散する樹脂製の拡散部と、
前記当接面との間に前記LED基板を案内して保持するための対向案内部と、を備え、
前記放熱部,前記拡散部および前記対向案内部の全体が一体成形されている、
ことを特徴とするLEDラインランプ用のLED保護管。
In the straight tubular LED protective tube that houses the LED substrate on which the LED element is mounted,
A heat radiating portion made of a first heat conductive resin having a contact surface with the LED substrate;
A resin-made diffusion part that transmits and diffuses the light emitted from the LED element;
An opposing guide portion for guiding and holding the LED substrate between the contact surface,
The entirety of the heat dissipating part, the diffusing part and the opposing guide part are integrally formed,
An LED protective tube for an LED line lamp.
前記当接面は、
前記対向案内部に沿ってスライド挿入される前記LED基板の挿入方向の溝状部を備えている、
ことを特徴とする請求項5記載のLEDラインランプ用のLED保護管。
The contact surface is
A groove-like portion in the insertion direction of the LED substrate that is slidably inserted along the opposing guide portion;
The LED protective tube for an LED line lamp according to claim 5.
請求項5または6に記載のLEDラインランプ用のLED保護管の前記対向案内部に前記LED基板が保持されている、
ことを特徴とするLEDラインランプ。
The LED substrate is held in the opposing guide portion of the LED protective tube for the LED line lamp according to claim 5 or 6,
LED line lamp characterized by that.
前記放熱部と前記LED基板の当接面との間の空間域に第二の熱伝導性樹脂が充填されている、
ことを特徴とする請求項7記載のLEDラインランプ。
The space region between the heat dissipation part and the contact surface of the LED substrate is filled with a second thermally conductive resin,
The LED line lamp according to claim 7.
前記LED保護管の端部を封止する蓋部を備え、
前記LED保護管と前記蓋部との間の内部空間域には不活性ガスが充填されている
ことを特徴とする請求項7または8記載のLEDラインランプ。
A lid for sealing the end of the LED protective tube;
The LED line lamp according to claim 7 or 8, wherein an inner space between the LED protective tube and the lid is filled with an inert gas.
JP2012246006A 2012-11-08 2012-11-08 Method of manufacturing led line lamp, led protection tube for led line lamp, and led line lamp Pending JP2014096237A (en)

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014130820A (en) * 2012-12-31 2014-07-10 Cheil Industries Inc Led lamp housing having heat radiation part and translucent part, and method of manufacturing the same
JP2015088452A (en) * 2013-11-01 2015-05-07 財團法人工業技術研究院Industrial Technology Research Institute Lamp structure
CN110032025A (en) * 2018-01-11 2019-07-19 舜宇光学(浙江)研究院有限公司 Structured light projector and its methods and applications
KR102056679B1 (en) 2017-12-28 2019-12-17 지엔에스티 주식회사 USB electronic device for vehicle with heat dissipation structure
WO2021008274A1 (en) * 2019-07-13 2021-01-21 深圳市虫虫科技有限公司 Splicing-type line lamp

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014130820A (en) * 2012-12-31 2014-07-10 Cheil Industries Inc Led lamp housing having heat radiation part and translucent part, and method of manufacturing the same
JP2015088452A (en) * 2013-11-01 2015-05-07 財團法人工業技術研究院Industrial Technology Research Institute Lamp structure
KR102056679B1 (en) 2017-12-28 2019-12-17 지엔에스티 주식회사 USB electronic device for vehicle with heat dissipation structure
CN110032025A (en) * 2018-01-11 2019-07-19 舜宇光学(浙江)研究院有限公司 Structured light projector and its methods and applications
WO2021008274A1 (en) * 2019-07-13 2021-01-21 深圳市虫虫科技有限公司 Splicing-type line lamp

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