JP2014090250A - Imaging element unit, lens unit, and imaging apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an imaging element unit configured by bonding an imaging element to an element attachment plate, a lens unit mounted with the imaging element unit, and an imaging apparatus mounted with the lens unit.SOLUTION: An imaging element unit 30 comprises: an imaging element 31 having an imaging surface 33 on its front face; and an element attachment plate 41 having an element attachment surface 48 which is fixed to the back face of the imaging element by an adhesive agent 71. The element attachment plate has, on the element attachment surface, an inlet 43 whose aperture size is smaller than the size of the back face of the imaging element. A protrusion 46 is formed on the back face of the element attachment surface so as to surround the inlet with an interval from the edge of the inlet. In a state where the back face of the imaging element and the element attachment surface of the element attachment plate face each other, the adhesive agent is injected from the inlet to fill an adhesive agent reservoir 49 surrounded by the protrusion till the adhesive agent reservoir 49 is substantially filled up, and then the adhesive agent is cured, thereby fixing the imaging element to the element attachment plate.

Description

  The present invention relates to an image sensor unit formed by bonding an image sensor to an element mounting plate, a lens unit on which the image sensor unit is mounted, and an image pickup apparatus on which the lens unit is mounted.

  A device having an imaging function such as a digital camera, a mobile phone, a smartphone, or a PDA (Personal Digital Assistant) (hereinafter, referred to as an “imaging device” as appropriate) receives a light beam that has passed through the lens in a lens barrel that houses the lens. A lens unit on which an image pickup device unit is mounted by attaching the image pickup device to be mounted to the device mounting plate. The imaging element unit is formed by screwing an element mounting plate to a lens barrel.

  The imaging element is attached to the element attachment plate using an adhesive. For example, in Patent Document 1, an opening in which an imaging element is fitted is formed in the element mounting plate, and an adhesive is injected between the side surface of the imaging element and the opening in a state where the imaging element is fitted in the opening and cured. Thus, the image sensor is attached.

  On the other hand, as the image pickup apparatus is reduced in size and thickness, there is a demand for the lens unit to be reduced in size and thickness. In particular, there is a strong demand for thin lens units mounted on mobile phones, smartphones, PDAs, and the like.

JP 2011-18954 A

  However, in order to form the opening in which the image pickup element fits in the element mounting plate as described above, it is necessary to enlarge the opening. Accordingly, the outer shape of the element mounting plate must be increased. In some cases, the lens unit cannot be reduced in size, and the lens unit cannot be sufficiently thinned.

  An object of the present invention is to provide an image sensor unit capable of firmly attaching an image sensor to an element mounting plate while reducing the size, a lens unit equipped with the image sensor unit, and an image pickup apparatus equipped with the lens unit. Is to provide.

The image sensor unit according to the present invention is
An imaging element unit comprising: an imaging element having an imaging surface on a surface; and an element mounting plate having an element mounting surface fixed by an adhesive and a back surface of the imaging element,
The element mounting plate has an injection port that opens smaller than the back surface of the imaging device on the element mounting surface, and the back surface of the element mounting surface is spaced from the edge of the injection port. A ridge is projected to surround it,
With the back surface of the image sensor and the element mounting surface of the element mounting plate facing each other, the adhesive is injected from the injection port to substantially fill the adhesive reservoir surrounded by the protrusions. The imaging element is fixed to the element mounting plate by filling the adhesive and curing the adhesive.

According to the image pickup device unit of the present invention, the image pickup device can be attached to the device attachment plate by injecting the adhesive from the injection port of the device attachment plate until the adhesive reservoir is substantially filled and curing.
The adhesive is bonded to the image sensor, and on the element mounting plate, on the element mounting surface at the periphery of the inlet, the edge of the inlet, the ridge, and the back side of the element mounting surface surrounded by the ridge. Glued. That is, since the adhesion area to the element mounting plate can be increased as much as possible, the adhesion force can be increased. In addition, since the adhesive reservoir is larger than the injection port, the adhesive filled in the adhesive reservoir protrudes from the injection port and spreads, and is prevented from being removed like a rivet head. Therefore, the element mounting plate can be more firmly bonded.
Moreover, the filling condition of the adhesive can be visually confirmed by filling the adhesive until the adhesive reservoir is substantially filled.

FIG. 1 is an exploded perspective view of a lens unit according to an embodiment of the present invention. 2A is a plan view of an embodiment of the image sensor unit, and FIG. 2B is a cross-sectional view taken along line IIB-IIB in FIG. 2A. 3A is a plan view of another embodiment of the image sensor unit, and FIG. 3B is a cross-sectional view taken along line IIIB-IIIB in FIG. 3A.

  DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention implemented in a lens unit (10) that can be mounted on an imaging device such as a digital camera, a mobile phone, a smartphone, or a PDA that captures an image or a moving image will be specifically described below with reference to the drawings.

  As shown in FIG. 1, a lens unit (10) according to an embodiment of the present invention includes a lens barrel (20) that houses a lens (23), and an image to which light rays that have passed through the lens (23) are to enter. The image sensor unit (30) includes an element (31) and an element mounting plate (41) in which the image sensor (31) is fixed on one surface with an adhesive. The lens barrel (20) shown in the drawing is a bending optical system, and includes a reflecting mirror and a prism in addition to the lens. The lens barrel (20) is bent by about 90 ° to pass through the lens (23). 20) to the image pickup device (31) located on the bottom side.

  For example, a CCD (Charge Coupled Device) image sensor or a CMOS (Complementary Metal Oxide Semiconductor) image sensor can be used as the imaging device (31), and the sensor substrate (35) is attached to the back side of the imaging surface. . In this specification, the imaging device (31) includes a sensor substrate (35), and the sensor substrate (35) is bonded to the element mounting plate (41) as described later. ) Is omitted, or when the sensor substrate (35) is not directly mounted on the image sensor (31), the image sensor (31) is directly bonded to the element mounting plate (41).

  The image pickup device (31) is electrically connected to the sensor substrate (35), and is further electrically connected to the control system of the image pickup apparatus by a flexible substrate (37) or the like. In the illustrated embodiment, the flexible substrate (37) is disposed between the sensor substrate (35) and the element mounting plate (41), and is opposed to an injection port (43) of the element mounting plate (41) described later. Further, as shown in FIG. 2, an opening (39) having an opening area larger than that of the injection port (43) is formed.

  The flexible substrate (37) can be joined to the sensor substrate (35) by soldering or bonding so that the opening (39) is located at the approximate center of the sensor substrate (35) of the image sensor (31). .

  The element mounting plate (41) for fixing the imaging element (31) can be made of a metal plate. One surface of the element mounting plate (41) is an element mounting surface (48) that faces the image sensor (31).

  As shown in FIG. 2, the element mounting plate (41) has an inlet (43) at a position facing the imaging element (31). The injection port (43) is an opening smaller than the back surface of the image sensor (31). Although the injection port (43) is rectangular in the drawing, it is not limited to this. The injection port (43) can be formed by punching.

Further, as shown in FIG. 2, the element mounting plate (41) is formed on the back surface side of the element mounting surface (48) with a protrusion that surrounds the injection port (43) at a distance from the injection port (43). (46) is formed. A space between the ridge (46) and the peripheral edge of the inlet (43) is referred to as a flat surface (49).
The protrusion (46) can be formed, for example, by pressing the element mounting plate (41). In this case, as shown in FIG. 2, the protrusion (46) has a substantially U-shaped cross section. On the element mounting surface (48) side, a recess (47) having a substantially U-shaped cross section is formed on the back surface of the protrusion (46).

  As shown in FIG. 2, the height of the protrusion (46) is substantially the same as or higher than the height of the head of the screw (61) for attaching the image sensor unit (30) to the lens barrel (20). Configure low. Thereby, the increase in the installation space by providing the protrusion (46) can be prevented.

  A region surrounded by the ridge (46) is referred to as an adhesive reservoir (51). That is, the adhesive reservoir (51) is surrounded by the ridge (46) on the side surface, one surface faces the flat surface (49) and the injection port (43) of the element mounting surface (48), and the other surface. Is an open area.

  In addition, a plurality of attachment holes (42) for screwing the lens barrel (20) and a positioning hole (45) are formed through the element attachment plate (41).

  The image sensor unit (30) is manufactured by bonding the image sensor (31) and the element mounting plate (41) having the above-described configuration.

  The imaging element (31) is aligned so that the opening (39) of the flexible substrate (37) faces the injection port (43) of the element mounting plate (41) as shown in FIG. ) Is positioned by a jig or the like so that the imaging surface (33) of the lens is parallel to the element mounting plate (41). In this case, the flexible substrate (37) and the element mounting plate (41) are not in close contact with each other and may be positioned with a gap as shown in FIG. 2 (b).

  In this state, the element mounting plate (41) side of the image sensor unit (30) is turned upward, and the adhesive (71) is injected from the injection port (43). As the adhesive (71), an ultraviolet curable type can be used. Further, as the adhesive (71), a thermosetting type or a moisture curing type may be used.

  As shown in FIGS. 2 (a) and 2 (b), the adhesive (71) injected from the inlet (43) is applied to the sensor substrate (35) and the flexible substrate (37) of the image sensor (31). It flows into the space formed by the opening (39). Since the adhesive (71) that has flowed in is blocked by the opening (39) of the flexible substrate (37), it does not spread further. When the adhesive (71) is further injected, the adhesive (71) overflows from the injection port (43) and is blocked by the ridge (46) to fill the adhesive reservoir (51). When the adhesive (71) is filled until the adhesive reservoir (51) is substantially filled, the injection of the adhesive (71) is stopped.

  As described above, since the adhesive (71) is injected until the adhesive reservoir (51) is substantially filled, the operator visually confirms the injection amount of the adhesive (71) and its filling condition. Therefore, poor adhesion due to insufficient injection of the adhesive (71) can be prevented.

  When the adhesive (71) is of an ultraviolet curable type, the adhesive (71) is cured by irradiating with ultraviolet rays in the above state. If the adhesive (71) is a thermosetting adhesive, it is cured by applying heat of a predetermined temperature or more. If the adhesive (71) is a moisture curable adhesive, moisture may be applied and cured. . In addition, a curing method according to the type of adhesive, such as natural standing, is employed.

  As described above, the imaging element (31) can be fixed to the element mounting plate (41) with the adhesive (71).

  As shown in FIG. 2 (b), the adhesive (71) is bonded to the sensor substrate (35) of the imaging device (31) in an area larger than the opening area of the injection port (43), and a flexible substrate ( 37) the opening (39), the edge of the injection port (43) of the element mounting plate (41), the flat surface (49) of the peripheral edge of the injection port (43), and the protrusion (46) surrounding this. Therefore, the adhesion area to the image sensor (31) and the element mounting plate (41) can be increased as much as possible, and the adhesion force can be increased.

  Further, since the adhesive reservoir (51) is larger than the injection port (43), the adhesive (71) filled in the adhesive reservoir (51) is prevented from being removed like the head of the rivet. . For this reason, an image pick-up element (31) can be adhere | attached more firmly with respect to an element attachment plate (41).

  More specifically, the expanded adhesive (71) such as the head of the rivet provides resistance to the direction in which the element mounting plate (41) drops off from the image sensor (31). This resistance can be increased as the height of the ridge (46) and the area of the flat surface (49) are increased.

  In the image pickup device unit (30) manufactured by the above configuration, the image pickup device (31) and the device mounting plate (41) are firmly bonded with an adhesive (71), and the device mounting plate (41) Since it can be formed to have substantially the same size or width as the imaging element (31), the element mounting plate (41) can be reduced in size and is suitable for mounting on a thin lens barrel (20).

  Also, when stress is applied to the image sensor unit (30), the orientation of the image sensor (31) and the element mounting plate (41) is unlikely to change. In this case, the parallelism between the image sensor (31) and the element mounting plate (41) does not change.

  The obtained image pickup device unit (30) is attached to the attachment portion of the image pickup device unit (30) provided in the lens barrel (20) by fixing with a screw (61) to produce the lens unit (10). Can do. When installing the image sensor unit (30), tilt adjustment is performed as necessary so that the optical axis of the lens barrel (20) is perpendicularly incident on the image pickup surface (33) of the image sensor (31). It is desirable.

  Since the lens unit (10) of the present invention can be mounted with the downsized image sensor unit (30) as described above, when the lens barrel (20) is thin, the lens unit (10) is thinned. It is effective for.

  Further, the lens unit (10) is incorporated in an imaging device. Since the lens unit (10) of the present invention can be reduced in thickness, an imaging apparatus equipped with the lens unit (10) of the present invention can also be reduced in thickness.

  In addition, each part structure of this invention is not restricted to the said embodiment, A various deformation | transformation is possible within the technical scope as described in a claim.

For example, as another embodiment of the element mounting plate (41), as shown in FIG. 3, a bridge portion (44) for connecting the opposing edges of the inlet (43) of the element mounting plate (41) is provided. Can do.
By injecting the adhesive (71), the bridge portion (44) is surrounded by the adhesive (71), so that the adhesive strength to the element mounting plate (41) can be further increased.

  For example, the protrusion (46) can be formed by attaching a frame member different from the element attachment plate (41) to the element attachment plate (41).

  Further, a metal plate for heat dissipation of the image sensor (31) may be interposed between the image sensor (31) and the element mounting plate (41). In this case, the metal plate may be provided with an opening that is substantially the same as the injection port (43) or wider than the injection port (43) so that the adhesive (71) can be injected.

  INDUSTRIAL APPLICABILITY The present invention is useful as an imaging element unit that can firmly attach an imaging element to an element mounting plate while achieving downsizing, a lens unit that includes the imaging element unit, and an imaging apparatus that includes the lens unit. is there.

(10) Lens unit
(20) Lens barrel
(30) Image sensor unit
(31) Image sensor
(33) Imaging surface
(35) Sensor board
(41) Element mounting plate
(43) Inlet
(46) Projections
(48) Element mounting surface
(51) Adhesive pool
(71) Adhesive

Claims (6)

An imaging element unit comprising: an imaging element having an imaging surface on a surface; and an element mounting plate having an element mounting surface fixed by an adhesive and a back surface of the imaging element,
The element mounting plate has an injection port that opens smaller than the back surface of the imaging device on the element mounting surface, and the back surface of the element mounting surface is spaced from the edge of the injection port. A ridge is projected to surround it,
With the back surface of the image sensor and the element mounting surface of the element mounting plate facing each other, the adhesive is injected from the injection port to substantially fill the adhesive reservoir surrounded by the protrusions. The image pickup device unit is formed by fixing the image pickup device to the device mounting plate by filling the adhesive and curing the adhesive.   The imaging element unit according to claim 1, wherein the adhesive is an ultraviolet curable adhesive, and is filled with the adhesive until the adhesive reservoir is substantially filled and then cured by irradiation with ultraviolet rays.   A flexible substrate is interposed between the imaging element and the element mounting plate. The flexible substrate has an opening having a larger opening area than the injection port, and the injection port and the opening are opposed to each other. The image sensor unit according to claim 1 or 2.   The image sensor unit according to any one of claims 1 to 3, wherein the element mounting plate includes a bridge portion that connects opposite edges of the injection port.   A lens unit comprising the imaging element unit according to any one of claims 1 to 4 attached to a lens barrel containing a lens.   An imaging device equipped with the lens unit according to claim 5.

Images