JP2014068511A - Electric power conversion apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electric power conversion apparatus capable of preventing a wiring distance of a wire connecting a power module with a control board from being elongated.SOLUTION: An electric power conversion apparatus includes: a control board 11 in which a power module arrangement part 11c having an opening on at least its surface is formed; and a power module 12 which is formed by a semiconductor element, is disposed in the power module arrangement part 11c, and is subject to operation control by the control board 11.

Description

  The present invention relates to a power conversion device.

  In the power conversion device of Patent Document 1, a power module (semiconductor module) composed of semiconductor elements is disposed on a cooler, and a control board is disposed above the power module. The power module and the control board are connected by an L-shaped wiring conductor.

JP 2007-116840 A (FIGS. 4 and 9)

  In the above-described prior art configuration, the distance between the power module and the control board is increased. For this reason, the wiring distance of the wiring which connects a power module and a control board becomes long. If the wiring distance is increased, the inductance is increased, which may cause a malfunction during switching.

  The present invention has been made paying attention to such conventional problems. The objective of this invention is providing the power converter device which can prevent that the wiring distance of the wiring which connects a power module and a control board becomes long.

  The present invention solves the above problems by the following means.

  One aspect of the power conversion device according to the present invention includes a control board on which a power module arrangement portion that opens at least on the surface is formed. In addition, the power module includes a power module that is configured by a semiconductor element and that is disposed in the power module placement section and whose operation is controlled by the control board.

  According to this aspect, since the power module is disposed in the power module disposition portion formed on the control board, the distance between the power module and the control board is reduced, and the wire connecting the power module and the control board is provided. Can be shortened. This can reduce the possibility of malfunction during switching.

  Embodiments of the present invention and advantages of the present invention will be described in detail below with reference to the accompanying drawings.

FIG. 1 is a plan view showing a main part of a first embodiment of a power conversion device according to the present invention. FIG. 2 is a cross-sectional view of the first embodiment of the power converter according to the present invention. FIG. 3 is a cross-sectional view of a second embodiment of the power converter according to the present invention. FIG. 4 is a cross-sectional view of a third embodiment of the power converter according to the present invention. FIG. 5 is a cross-sectional view of a fourth embodiment of the power converter according to the present invention. FIG. 6 is a cross-sectional view of a fifth embodiment of the power converter according to the present invention. FIG. 7: is a top view which shows the principal part of 6th Embodiment of the power converter device by this invention. FIG. 8 is a cross-sectional view of a sixth embodiment of the power converter according to the present invention. FIG. 9: is a top view which shows the principal part of 7th Embodiment of the power converter device by this invention. FIG. 10 is a sectional view of a seventh embodiment of the power converter according to the present invention.

(First embodiment)
FIG. 1 is a plan view showing a main part of a first embodiment of a power conversion device according to the present invention.

  The power conversion device 1 is a device that is used, for example, for operation control of a drive motor that drives an electric vehicle. The power conversion device 1 is disposed on, for example, an end surface of a motor and is configured integrally with the motor. The power conversion device 1 includes a control board 11 and a power module 12.

  The control board 11 is a board that controls the operation of the power module 12. In FIG. 1, the control board 11 is exemplified as a circle having a hole in the center, that is, a donut shape. The control board 11 is disposed on the cooler 13. A P-side pad 11p and an N-side pad 11n connected to the power module 12 are formed on the control board 11. The P-side pad 11p and the N-side pad 11n are arranged at positions that take into consideration low wiring inductance and noise interference in accordance with the layout of the semiconductor elements constituting the power module 12. That is, the position of FIG. 1 is only an example, and the wire connection direction is not limited to the direction of FIG.

  The power module 12 controls the operation of the drive motor. The power module 12 is composed of a semiconductor element. FIG. 1 illustrates the case where nine power modules 12 are used. The power module 12 is connected (wire bonded) to the P-side pad 11p and the N-side pad 11n of the control board 11.

  2 is a cross-sectional view of the first embodiment of the power conversion device according to the present invention, FIG. 2 (A) shows a cross section taken along the line AA in FIG. 1, and FIG. 2 (B) shows a cross section taken along the line BB in FIG. Show. In order to avoid the complexity of the drawing, the bus bar and the like above the power module 12 are omitted in FIG.

  As is clear from FIGS. 2A and 2B, the control board 11 is disposed on the cooler 13. A power module placement portion 11c is formed in the control board 11 so as to penetrate from the front surface 11a to the back surface 11b. The power module 12 is arrange | positioned in the power module arrangement | positioning part 11c. The power module 12 contacts the cooler 13. The power module placement portion 11 c of the control board 11 is in contact with the power module 12 in the vicinity of the opening on the surface. The inner peripheral surface in the vicinity of the bottom is recessed so as not to contact the power module 12. In other words, the power module placement portion 11c has a predetermined portion near the opening (a portion on the upper surface near the opening) in contact with the power module 12 in a state where the power module 12 is placed, and the inner peripheral surface near the bottom via the step. Are recessed so as to be separated without contacting the power module. Adhesives (solder, adhesive, etc.) left over by adhering the power module 12 remain in the recess 11d. With such a structure, it is possible to prevent excess adhesive (such as solder or adhesive) from overflowing. Further, the power module 12 can be held without tilting.

  A bus bar 21 and a capacitor 22 are disposed above the power module 12. The bus bar 21 includes a base plate 21b, a P-side bus bar 21p, and an N-side bus bar 21n. N-side bus bar 21n is arranged on base plate 21b. A cutout portion is formed on the upper surface of the N-side bus bar 21n, and the P-side bus bar 21p is disposed in the cutout portion. The capacitor 22 is mounted across the N-side bus bar 21n and the P-side bus bar 21p. The bus bar N terminal 211n of the N-side bus bar 21n is connected to the N terminal 12n of the power module 12. The bus bar P terminal 211p of the P-side bus bar 21p is connected to the P terminal 12p of the power module 12. In FIG. 2A, the N terminal 12n and the P terminal 12p overlap each other and appear as one. Further, the N-side bus bar 21n and the P-side bus bar 21p may be replaced and arranged in reverse. It can be changed as appropriate.

  The power module 12 is connected to a drive motor through an AC terminal 12ac.

  According to the present embodiment, the power module 12 is arranged in the power module arrangement unit 11 c formed on the control board 11. With this configuration, the distance between the power module 12 and the control board 11 is reduced, and the wires connecting the power module 12 and the control board 11 (P-side pad 11p and N-side pad 11n) can be shortened.

  On the other hand, when the distance between the power module and the control board is large as in Patent Document 1, the wiring distance of the wiring becomes long. As the wiring distance increases, the inductance increases. When the inductance increases, a current is generated due to a voltage change (dv / dt) and stray capacitance C during switching (C · dv / dt). This current and inductance (L) increase the gate voltage (L · di / dt), and the increased gate voltage may exceed the threshold voltage. In such a case, malfunction may occur. In this way, malfunction may occur during switching.

  On the other hand, according to the configuration of this embodiment, since the wire is short, the inductance is small, and malfunction during switching is reduced.

  Moreover, since the L-shaped wiring conductor used in Patent Document 1 is unnecessary, when the power conversion device 1 is arranged on the end surface of the motor, the motor output axial direction length can be shortened and the size can be reduced. it can.

  Further, according to the present embodiment, the vicinity of the opening on the surface of the power module placement portion 11 c of the control board 11 contacts the power module 12. If there is a gap between the power module placement portion 11c of the control board 11 and the power module 12 and they are separated without contact, the P-side pad 11p and the N-side pad 11n are also the power module by that gap. I will be away from 12.

  On the other hand, if the vicinity of the opening on the surface of the power module placement portion 11c of the control board 11 is in contact with the power module 12 as in the present embodiment, the P-side pad 11p and the N-side pad 11n are further connected to the power module. 12 can be approached. Therefore, the wire can be further shortened, the inductance is further reduced, and the malfunction at the time of switching is further reduced.

  Furthermore, according to this embodiment, the inner peripheral surface near the bottom of the power module placement portion 11 c of the control board 11 is recessed so as to be separated without contacting the power module 12. With such a configuration, it is possible to fasten the adhesive material (solder, adhesive, or the like) that has become excessive by bonding the power module 12 to the recess 11d. If there is no recess, excess adhesive (solder, adhesive, etc.) may leak to the lower surface of the control board 11 and the control board 11 may be lifted. In such a state, if the power module 12 and the control board 11 (P-side pad 11p and N-side pad 11n) are wire-bonded, the wire becomes long and the inductance becomes large. On the other hand, with the configuration of the present embodiment, surplus adhesive (solder, adhesive, etc.) can escape to the recess 11d, so that surplus adhesive (solder, adhesive, etc.) overflows. It is possible to prevent the control board 11 from floating. Therefore, it can prevent that a wire becomes long.

  Furthermore, according to the present embodiment, the power module placement portion 11 c is formed so as to penetrate from the front surface 11 a to the back surface 11 b of the control board 11. The power module 12 is arranged in the power module arrangement unit 11 c and contacts the cooler 13. With such a configuration, the power module 12 is directly cooled by the cooler 13, and the possibility of a thermal failure of the power module 12 is further reduced.

  Further, according to the present embodiment, since the power module 12 and the control board 11 (P-side pad 11p and N-side pad 11n) are connected by wire bonding, electrical connection is possible even if there is a variation in the position of components. Is possible.

(Second Embodiment)
FIG. 3 is a cross-sectional view of a second embodiment of the power conversion device according to the present invention, FIG. 3 (A) corresponds to FIG. 2 (A) of the first embodiment, and FIG. 3 (B) is the first embodiment. This corresponds to FIG.

  In the following description, parts having the same functions as those described above are denoted by the same reference numerals, and redundant description is omitted as appropriate.

  The cooler 13 of this embodiment has a recess 13a. The bottom of the power module placement portion 11c is constituted by the recess 13a. The recess 13a is formed larger than the power module 12 in the left-right direction in FIGS. 2 (A) and 2 (B). That is, the inner peripheral surface 13 b near the bottom of the power module placement portion 11 c is formed so as to be separated without contacting the power module 12.

  Even with such a configuration, surplus adhesive (solder, adhesive, etc.) can escape into the gap between the power module 12 and the inner peripheral surface 13b, so surplus adhesive (solder, adhesive, etc.) Can be prevented from overflowing, and the control board 11 is prevented from floating. Therefore, it can prevent that a wire becomes long.

  Moreover, it becomes easy to cool also from the surrounding surface near the bottom of the power module 12, that is, the heat radiation path from the power module 12 to the cooler 13 is increased, and the heat radiation performance can be improved.

(Third embodiment)
FIG. 4 is a cross-sectional view of a third embodiment of the power conversion device according to the present invention. FIG. 4 (A) corresponds to FIG. 2 (A) of the first embodiment, and FIG. 4 (B) is the first embodiment. This corresponds to FIG.

  In the present embodiment, a groove 13c is formed along the periphery of the power module 12 at the bottom of the power module placement portion 11c (the upper surface of the cooler 13 in FIG. 4).

  Even with such a configuration, surplus adhesive (solder, adhesive, etc.) can escape to the groove 13c, so that it is possible to prevent the surplus adhesive (solder, adhesive, etc.) from overflowing, and the parts The floating state is prevented. Therefore, it can prevent that a wire becomes long.

(Fourth embodiment)
FIG. 5 is a cross-sectional view of a fourth embodiment of the power converter according to the present invention. FIG. 5 (A) corresponds to FIG. 2 (A) of the first embodiment, and FIG. 5 (B) is the first embodiment. This corresponds to FIG.

  In the present embodiment, the inner peripheral surface of the power module placement portion 11c has a diagonal shape that spreads downward when viewed in a longitudinal section.

  Even with such a configuration, surplus adhesive (solder, adhesive, etc.) can be released into the gap between the power module 12 and the inner peripheral surface of the power module placement portion 11c, so surplus adhesive (solder) And the overflow of the control board 11 can be prevented. Therefore, it can prevent that a wire becomes long.

  Moreover, formation of the inner peripheral surface of the power module placement portion 11c is easy.

(Fifth embodiment)
FIG. 6 is a cross-sectional view of a fifth embodiment of the power converter according to the present invention. FIG. 6 (A) corresponds to FIG. 2 (A) of the first embodiment, and FIG. 6 (B) is the first embodiment. This corresponds to FIG.

  In the present embodiment, the inner peripheral surface of the power module placement portion 11c has a curved shape that spreads downward when viewed in a longitudinal section.

  Even with such a configuration, surplus adhesive (solder, adhesive, etc.) can be released into the gap between the power module 12 and the inner peripheral surface of the power module placement portion 11c, so surplus adhesive (solder) And the overflow of the control board 11 can be prevented. Therefore, it can prevent that a wire becomes long.

  Moreover, formation of the inner peripheral surface of the power module placement portion 11c is easy.

(Sixth embodiment)
FIG. 7: is a top view which shows the principal part of 6th Embodiment of the power converter device by this invention.

  In the first embodiment, the power module placement portion 11c is in contact with the power module 12 in the entire periphery near the opening on the surface. On the other hand, as shown in FIG. 7, the power module placement portion 11 c according to the present embodiment has four locations in the vicinity of the opening on the surface so as to contact the power module 12.

  FIG. 8 is a cross-sectional view of a sixth embodiment of the power conversion device according to the present invention. FIG. 8 (A) corresponds to FIG. 2 (A) of the first embodiment, and FIG. 8 (B) is the first embodiment. This corresponds to FIG.

  In the present embodiment, as shown in FIG. 8B, there is a gap between the power module placement portion 11c and the power module 12 except for the four protruding portions near the opening on the surface. Therefore, even if there is a large amount of excess adhesive (solder, adhesive, etc.), excess adhesive (solder, adhesive, etc.) can escape into this gap, so excess adhesive (solder, adhesive, etc.) Etc.) and the control board 11 is prevented from floating. Therefore, it can prevent that a wire becomes long.

(Seventh embodiment)
FIG. 9: is a top view which shows the principal part of 7th Embodiment of the power converter device by this invention.

  In the first embodiment, the power module placement portion 11c is formed by penetrating a trapezoidal square hole from the front surface 11a to the back surface 11b of a circular hole having a hole formed at the center, that is, a donut-shaped control board 11. In contrast, the control board 11 of the present embodiment has a gear shape with a cutout outer shape. And the power module arrangement | positioning part 11c is formed so that this notch may be followed.

  FIG. 10 is a cross-sectional view of a seventh embodiment of the power converter according to the present invention. FIG. 10 (A) corresponds to FIG. 2 (A) of the first embodiment, and FIG. 10 (B) is the first embodiment. This corresponds to FIG.

  In this embodiment, as shown in FIG. 10A, the control board 11 is notched on the outer side of the power module 12 (the right side in FIG. 10A), and there is no control board 11. Therefore, even if there is a large amount of excess adhesive (solder, adhesive, etc.), excess adhesive (solder, adhesive, etc.) can escape to the notch, so excess adhesive (solder, adhesive, etc.) It is possible to prevent the adhesive or the like from overflowing, and to prevent the control board 11 from floating. Therefore, it can prevent that a wire becomes long.

  The embodiment of the present invention has been described above. However, the above embodiment only shows a part of application examples of the present invention, and the technical scope of the present invention is limited to the specific configuration of the above embodiment. Absent.

  For example, in each of the above embodiments, the power module placement unit is formed so as to penetrate from the front surface to the back surface of the control board, but is not limited thereto. The control board may have a concave shape that opens on the front surface but does not penetrate to the back surface and has a bottom. With such a configuration, the control board and the power module can be sub-assembled in advance.

  Moreover, the shape of each component is only an example, and the shape can be appropriately changed according to the specification of the component.

  Moreover, the said embodiment can be combined suitably.

DESCRIPTION OF SYMBOLS 1 Power converter 11 Control board 11a Front surface of control board 11b Back surface of control board 11c Power module arrangement | positioning part 11d Recessed part 11p P side pad 11n N side pad 12 Power module 13 Cooler

Claims (10)

A control board on which a power module arrangement portion that is open at least on the surface is formed;
A power module composed of a semiconductor element, arranged in the power module placement unit and controlled in operation by the control board;
A power conversion device including: The power conversion device according to claim 1,
The power module placement portion is formed so that at least a predetermined portion near the opening is in contact with the power module.
Power conversion device. In the power converter device according to claim 1 or 2,
The control board is formed so that the power module arrangement portion penetrates from the front surface to the back surface,
A cooler disposed on the back surface of the control board;
The power module is in contact with the cooler;
Power conversion device. The power conversion device according to claim 3,
The power module placement portion is formed such that at least the inner peripheral surface near the bottom is separated without contacting the power module in a state where the power module is placed.
Power conversion device. In the power converter device according to claim 3 or 4,
The power module placement portion is formed so that at least a predetermined portion near the opening is in contact with the power module in a state where the power module is placed, and an inner peripheral surface is separated from the power module as it is closer to the bottom.
Power conversion device. The power conversion device according to claim 5,
The inner peripheral surface of the power module placement portion is a diagonal line or a curve when viewed in a longitudinal section,
Power conversion device. In the power converter device according to claim 3 or 4,
In the power module placement portion, in a state where the power module is placed, a predetermined portion near the opening is in contact with the power module, and an inner peripheral surface near the bottom is separated through a step without contacting the power module. Formed as
Power conversion device. In the power converter device according to any one of claims 3 to 7,
The cooler is formed with a recess,
The power module placement section is formed such that at least the inner peripheral surface in the vicinity of the bottom is separated without contacting the power module in a state where the bottom is configured by the concave portion of the cooler and the power module is disposed. ,
Power conversion device. In the power converter device according to any one of claims 1 to 8,
In the bottom of the power module placement portion, a groove is formed along the periphery of the power module to be placed.
Power conversion device. In the power converter device according to any one of claims 1 to 9,
The power module is connected to a control terminal of the control board by wire bonding,
Power conversion device.

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