JP2014049192A - Strip-like substrate and led lighting device using the same - Google Patents

Strip-like substrate and led lighting device using the same Download PDF

Info

Publication number
JP2014049192A
JP2014049192A JP2012188826A JP2012188826A JP2014049192A JP 2014049192 A JP2014049192 A JP 2014049192A JP 2012188826 A JP2012188826 A JP 2012188826A JP 2012188826 A JP2012188826 A JP 2012188826A JP 2014049192 A JP2014049192 A JP 2014049192A
Authority
JP
Japan
Prior art keywords
substrate
belt
strip
shaped
led
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2012188826A
Other languages
Japanese (ja)
Inventor
Natsuhiko Mori
夏比古 森
Nobuyoshi Yamashita
信好 山下
Hiroyuki Noda
浩行 野田
Tomoyuki Seto
智行 瀬戸
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NTN Corp
Original Assignee
NTN Corp
NTN Toyo Bearing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NTN Corp, NTN Toyo Bearing Co Ltd filed Critical NTN Corp
Priority to JP2012188826A priority Critical patent/JP2014049192A/en
Publication of JP2014049192A publication Critical patent/JP2014049192A/en
Pending legal-status Critical Current

Links

Images

Landscapes

  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide an LED mounting substrate and an LED lighting device which has a low cost and high convenience based on the LED mounting substrate.SOLUTION: A strip-like substrate 2 includes: strip plates 21, 22 for cathode and anode made of conductive metal; and a resin part 24 which is formed according to injection molding while inserting both strip plates 21, 22 thereinto and integrally retains both strip plates 21, 22 in an insulating state. Therein, a plurality of window parts 26 are formed on the upper surface of the strip-like substrate 2 so as to be separated in such a direction that the strip-like substrate 2 is extended, respective LEDs 3 accommodated on the window parts 26 are electrically connected to the positive and negative strip plates 21, 22 and, when a bottom surface 29 of the strip-like substrate 2 is put on an attachment surface, the center line X of the bottom surface in such a direction that the strip-like substrate 2 is extended is formed so as to be curved in a substantially circular-arcuate shape on the attachment surface.

Description

本発明は、帯状基板およびこれを用いたLED照明装置に関する。   The present invention relates to a belt-like substrate and an LED lighting device using the same.

LEDを装着するための基板の一例が特許文献1に記載されている。この基板は、導電性金属からなる正極用および負極用の帯板、並びに両帯板をインサートして射出成形され、両帯板を絶縁状態で一体に保持する樹脂部を有する。この基板の一面には、その延びる方向に離間して複数の発光ダイオード(LED)が装着される。   An example of a substrate for mounting an LED is described in Patent Document 1. This substrate has a positive electrode and a negative electrode band plate made of a conductive metal, and a resin part that is injection-molded by inserting both band plates and holds both band plates in an insulated state. A plurality of light emitting diodes (LEDs) are mounted on one surface of the substrate apart from each other in the extending direction.

この基板は、金属製帯板に樹脂をインサート成形して絶縁部を形成し、プリント基板を用いないため製作工程が簡単で低コストで製造が可能であると共に、リール巻き状態での連続基板の保管や搬送が可能である、等の面で優れたものである。   This board is formed by insert molding resin on a metal strip to form an insulating part, and since the printed board is not used, the manufacturing process is simple and can be manufactured at low cost, and the continuous board in the reel winding state can be manufactured. It is excellent in terms of storage and transportation.

特開2011−146187号公報JP 2011-146187 A

しかしながら、特許文献1記載の基板は、既存の蛍光灯の代替品を提供するためのものにすぎない。すなわち、特許文献1記載の発明は、上記基板を、使用する蛍光管の長さ、形状により決定される定寸に切断してから蛍光管の内部に封入することで、既存蛍光灯と同サイズのLEDタイプ蛍光灯を製作することを企図したものである。しかし、近年の新たな市場需要に対応できる商品として、更なる付加価値を高めるための検討には至っていない。   However, the substrate described in Patent Document 1 is only for providing an alternative to the existing fluorescent lamp. That is, the invention described in Patent Document 1 is the same size as an existing fluorescent lamp by cutting the substrate into a fixed size determined by the length and shape of the fluorescent tube to be used and then enclosing it in the fluorescent tube. The LED type fluorescent lamp is intended to be manufactured. However, as a product that can meet new market demands in recent years, no studies have been made to further increase the added value.

上記問題に鑑み、本発明は、上記タイプのLED装着基板をベースに、低コストで利便性の高いLED装着基板およびLED照明装置を提供することを目的とする。   In view of the above problems, an object of the present invention is to provide a low-cost and highly convenient LED mounting board and LED lighting device based on the above-described type of LED mounting board.

本発明者らは、上記タイプの基板を発展させて、使い勝手の良い丸型LED照明装置に好適なLED装着基板の新たな商品コンセプトを着想し、本発明に至った。   The inventors of the present invention have developed the above-mentioned type of substrate and have conceived a new product concept of an LED mounting substrate suitable for an easy-to-use round LED lighting device, and have arrived at the present invention.

上記の目的を解決する技術的手段として、本発明に係る帯状基板は、導電性金属からなる正極用および負極用の帯板、並びに両帯板をインサートした射出成形で形成され、両帯板を絶縁状態で一体に保持する樹脂部を有する帯状基板であって、前記帯状基板の上面に、帯状基板の延びる方向に離間して複数の窓部が形成され、この窓部に収容されるLEDのそれぞれが前記正負双方の帯板に電気的に接続される構成を有し、前記帯状基板の底面を取付け面に置いたとき、帯状基板の延びる方向の底面の中心線が前記取付け面上で略円弧状に湾曲して形成されていることを特徴とする。   As a technical means for solving the above-described object, a strip-shaped substrate according to the present invention is formed by injection molding in which a strip for a positive electrode and a negative electrode made of a conductive metal, and both strips are inserted. A strip-shaped substrate having a resin portion that is integrally held in an insulated state, wherein a plurality of windows are formed on the upper surface of the strip-shaped substrate so as to be spaced apart from each other in the extending direction of the strip-shaped substrate. Each has a configuration that is electrically connected to both the positive and negative strips, and when the bottom surface of the strip substrate is placed on the mounting surface, the center line of the bottom surface in the direction in which the strip substrate extends extends substantially on the mounting surface. It is characterized by being curved in an arc shape.

本発明に係る帯状基板は、プリント基板を用いないため製作工程が簡単で低コストで製造が可能であると共に、リール巻き状態での連続基板の保管や搬送が可能であるという利点に、加えて、使い勝手の良い丸型LED照明装置に好適である。また、複雑な配線工事が不要となるため、帯状基板の取り付け作業を簡略化でき、エンドユーザによって照明装置に取り付けることも可能となり、さらには、LEDの発光色や光度などの選定を含めて個人の好みに応じたLED照明装置を実現することも可能である。   In addition to the advantage that the strip-shaped substrate according to the present invention does not use a printed circuit board, the manufacturing process is simple and can be manufactured at low cost, and the continuous substrate can be stored and transported in a reel winding state. It is suitable for a round LED lighting device that is easy to use. In addition, since complicated wiring work is not required, it is possible to simplify the work of attaching the belt-like substrate, and it is possible to attach it to the lighting device by the end user, and further, including the selection of the LED emission color, brightness, etc. It is also possible to realize an LED lighting device according to the user's preference.

具体的には、上記の帯板を略L字状の横断面に形成し、帯板を帯状基板の底面に平行な第1の板部と底面に対して垂直な第2の板部とから構成することが好ましい。第2の板部を形成し、第1の板部を連続させないことにより、帯状基板の延びる方向の底面の中心線を無理なく略円弧状に湾曲させることができる。   Specifically, the band plate is formed in a substantially L-shaped cross section, and the band plate is composed of a first plate part parallel to the bottom surface of the belt-like substrate and a second plate part perpendicular to the bottom surface. It is preferable to configure. By forming the second plate portion and making the first plate portion not continuous, the center line of the bottom surface in the extending direction of the belt-like substrate can be easily curved in a substantially arc shape.

また、第2の板部にLEDの端子と接触する端子を形成することができる。これにより、簡単な構成で端子を形成することができ、帯状基板へのLEDの装着作業が極めて容易であると共に、装着するだけで電気的に接続され、各端子の半田付け作業が不要となる。   Moreover, the terminal which contacts the terminal of LED can be formed in a 2nd board part. As a result, the terminals can be formed with a simple configuration, and the mounting operation of the LED on the belt-like substrate is extremely easy, and it is electrically connected only by mounting, and the soldering operation of each terminal becomes unnecessary. .

上記の第1の板部には、帯状基板の延びる方向において隣り合う窓部との間に切欠き部を形成することにより、底面の中心線を容易に略円弧状に湾曲させることができる。   By forming a notch portion between the first plate portion and the adjacent window portion in the extending direction of the belt-like substrate, the center line of the bottom surface can be easily curved into a substantially arc shape.

上記の樹脂部を帯状基板の延びる方向に連続して形成することができる。この場合には、製作された帯状基板の湾曲状態を一定に維持することができ、帯状基盤の強度や取り扱い性に有利となる。   Said resin part can be continuously formed in the direction where a strip | belt-shaped board | substrate is extended. In this case, the curved state of the manufactured belt-like substrate can be kept constant, which is advantageous for the strength and handleability of the belt-like substrate.

上記とは逆に、樹脂部を帯状基板の延びる方向において隣り合う窓部との間で分断して形成することができる。この場合には、製作済の帯状基板の底面の中心線の曲率半径を適当な範囲で変更することが可能となるので、サイズの異なる丸型照明装置への帯状基板の適用自由度を高めることができる。   Contrary to the above, the resin portion can be divided and formed between adjacent window portions in the direction in which the belt-shaped substrate extends. In this case, the radius of curvature of the center line of the bottom surface of the manufactured belt-like substrate can be changed within an appropriate range, so that the degree of freedom of application of the belt-like substrate to round illuminators of different sizes can be increased. Can do.

上記のLEDを着脱可能にするために、係止凸部を窓部の側面に樹脂部と一体で形成したり、又は窓部に位置する帯板の第2の面に形成することができる。これにより、LEDを容易に装着あるいは取り外すことができる。   In order to make the above-described LED detachable, the locking convex portion can be formed integrally with the resin portion on the side surface of the window portion, or can be formed on the second surface of the band plate located on the window portion. As a result, the LED can be easily mounted or removed.

本発明によれば、LED装着基板が、プリント基板を用いないため製作工程が簡単で低コストで製造が可能であると共に、リール巻き状態での連続基板の保管や搬送が可能であるという利点に、加えて、使い勝手の良い丸型LED照明装置に好適である。また、複雑な配線工事が不要となるため、帯状基板の取り付け作業を簡略化でき、エンドユーザによって照明装置に取り付けることも可能となる。さらには、LEDの発光色や光度などの選定を含めて個人の好みに応じたLED照明装置を実現することも可能である。   According to the present invention, since the LED mounting board does not use a printed board, the manufacturing process is simple and can be manufactured at low cost, and the continuous board can be stored and transported in a reel winding state. In addition, it is suitable for a round LED lighting device that is easy to use. Further, since complicated wiring work is not required, the work of attaching the belt-like substrate can be simplified, and the end user can attach it to the lighting device. Furthermore, it is also possible to realize an LED lighting device according to personal preference including selection of the light emission color and luminous intensity of the LED.

本発明の第1の実施形態に係る帯状基板を示す平面図である。It is a top view which shows the strip | belt-shaped board | substrate which concerns on the 1st Embodiment of this invention. 図1中のX−X線における縦断面図である。It is a longitudinal cross-sectional view in the XX line in FIG. 図1中のY−Y線における横断面図である。It is a cross-sectional view in the YY line in FIG. LEDチップを示す斜視図である。It is a perspective view which shows a LED chip. 帯状基板の斜視図である。It is a perspective view of a strip | belt-shaped board | substrate. 帯状基板の斜視図である。It is a perspective view of a strip | belt-shaped board | substrate. 帯状基板の製作方法を説明する概要図である。It is a schematic diagram explaining the manufacturing method of a strip | belt-shaped board | substrate. 帯状基板を用いたLED照明装置を説明する平面図である。It is a top view explaining the LED illuminating device using a strip | belt-shaped board | substrate. 帯状基板を用いたLED照明装置を説明する概要図である。It is a schematic diagram explaining the LED illuminating device using a strip | belt-shaped board | substrate. 本発明の第2の実施形態に係る帯状基板を示す平面図である。It is a top view which shows the strip | belt-shaped board | substrate which concerns on the 2nd Embodiment of this invention. 図10中のY−Y線における横断面図である。It is a cross-sectional view in the YY line in FIG. 本発明の第3の実施形態に係る帯状基板を示す平面図である。It is a top view which shows the strip | belt-shaped board | substrate which concerns on the 3rd Embodiment of this invention. 上記の帯状基板の湾曲半径を修正した状態を示す平面図である。It is a top view which shows the state which corrected the curvature radius of said strip | belt-shaped board | substrate. 帯状基板の斜視図である。It is a perspective view of a strip | belt-shaped board | substrate. 帯状基板の斜視図である。It is a perspective view of a strip | belt-shaped board | substrate.

以下に本発明の実施の形態を図面に基づいて説明する。   Embodiments of the present invention will be described below with reference to the drawings.

本発明の第1の実施形態に係る帯状基板を図1〜7に基づいて説明する。図1に示すように、帯状基板2は、平行に配置した二枚の帯板21、22を樹脂部24で一体に保持した帯板状の形態を有する。帯状基板2の底面29(図2、図3参照)を取付け面に置いたとき、帯状基板2の延びる方向の底面29の中心線Xは、取付け面上で略円弧状に湾曲して形成されている。二枚の帯板21、22は、何れも厚さ0.01mm〜3mm程度(例えば0.1mm)の可撓性に富む導電性金属(例えば銅板、アルミ板、ステンレス鋼板)で形成される。二枚の帯板21、22の端部には、電源に接続するための端子23が形成されている。帯板21、22の表面には、必要に応じて錫メッキ等で導電性の金属被膜を形成することもできる。   A strip substrate according to a first embodiment of the present invention will be described with reference to FIGS. As shown in FIG. 1, the belt-like substrate 2 has a belt-like shape in which two belt plates 21 and 22 arranged in parallel are integrally held by a resin portion 24. When the bottom surface 29 of the belt-like substrate 2 (see FIGS. 2 and 3) is placed on the attachment surface, the center line X of the bottom surface 29 in the extending direction of the belt-like substrate 2 is formed to be curved in a substantially arc shape on the attachment surface. ing. The two strips 21 and 22 are each made of a conductive metal (eg, copper plate, aluminum plate, stainless steel plate) having a thickness of about 0.01 mm to 3 mm (for example, 0.1 mm) and having high flexibility. Terminals 23 for connection to a power source are formed at the ends of the two strips 21 and 22. A conductive metal film can be formed on the surfaces of the strips 21 and 22 by tin plating or the like, if necessary.

樹脂部24は、端子23を除く帯板21、22をその軸方向全体にわたって連続して被覆し、かつ二枚の帯板21、22間の間隙を充足している。帯板21の端子23が正極用であり、帯板22の端子23が負極用であるが、これとは逆に、帯板21の端子23を負極用とし、帯板22の端子23を正極用とすることもできる。樹脂部24は、後述のように帯板21、22をインサートして射出成形することで形成される。樹脂材料は、帯状基板2が用いられるLED照明装置の使用条件に応じて任意に選択することができ、例えばLCPやPPS、POM、PEEK等が使用可能である。   The resin portion 24 continuously covers the strips 21 and 22 excluding the terminal 23 over the entire axial direction, and satisfies the gap between the two strips 21 and 22. The terminal 23 of the band plate 21 is for the positive electrode and the terminal 23 of the band plate 22 is for the negative electrode. Conversely, the terminal 23 of the band plate 21 is for the negative electrode and the terminal 23 of the band plate 22 is the positive electrode. It can also be used. The resin portion 24 is formed by inserting the band plates 21 and 22 and performing injection molding as will be described later. The resin material can be arbitrarily selected according to the use conditions of the LED lighting device in which the belt-like substrate 2 is used. For example, LCP, PPS, POM, PEEK, or the like can be used.

樹脂部24には、帯板21、22の延びる方向に沿って適宜(等ピッチあるいは不等ピッチ)複数の窓部26が形成される。この実施形態では窓部26が等ピッチで形成されたものを図示している。窓部26は、二枚の帯板21、22の間で帯状基板2の一方の面(LEDチップ3の装着側の面である。以下「上面」と称する。)および他方の面(以下、「底面」と称する)に開口している。   A plurality of window portions 26 are formed in the resin portion 24 as appropriate (equal pitch or unequal pitch) along the direction in which the strips 21 and 22 extend. In this embodiment, the windows 26 are formed at an equal pitch. The window portion 26 is between one of the two strips 21 and 22, one surface of the belt-like substrate 2 (the surface on the side where the LED chip 3 is mounted. (Referred to as “bottom surface”).

二枚の帯板21、22は、図3に示すように、略L字状の横断面を有する。図3は、図1のY−Y線における拡大した横断面図である。略L字状の横断面を有する帯板21、22は、帯状基板2の底面29に平行な第1の板部21a、22aと、底面29に対して垂直な第2の板部21b、22bとからなる。第2の板部21b、22bは、第1の板部21a、22aの幅方向の内縁から折れ曲がって底面29に向けて延びている。第2の板部21b、22bの底面29側の端部には複数(図示では3個)の端子21c、22cが形成されている。各端子21c、22cは、第2の板部21b、22bから折り曲げられて、窓部26内に突出し、LEDチップ3の各端子32と接触している。各端子21c、22cが、窓部26内に突出している状態は、図1のLEDチップ3を装着していない窓部26からも参照される。   The two strips 21 and 22 have a substantially L-shaped cross section as shown in FIG. FIG. 3 is an enlarged cross-sectional view taken along line YY in FIG. The strip plates 21 and 22 having a substantially L-shaped cross section include first plate portions 21 a and 22 a that are parallel to the bottom surface 29 of the strip substrate 2, and second plate portions 21 b and 22 b that are perpendicular to the bottom surface 29. It consists of. The second plate portions 21 b and 22 b are bent from the inner edges in the width direction of the first plate portions 21 a and 22 a and extend toward the bottom surface 29. A plurality (three in the figure) of terminals 21c and 22c are formed at the end of the second plate portions 21b and 22b on the bottom surface 29 side. The terminals 21c and 22c are bent from the second plate portions 21b and 22b, protrude into the window portion 26, and are in contact with the terminals 32 of the LED chip 3. The state in which each terminal 21c, 22c protrudes into the window part 26 is also referred to from the window part 26 not mounted with the LED chip 3 of FIG.

図1に示すように、各帯板21、22の底面29(図2、図3参照)に平行な第1の板部21a、22aには、隣り合う窓部26、26間の部位に切欠き部21d、22dが設けられている。この切欠き部21d、22dが形成された部位では、各帯板21、22には、底面29に対して垂直な第2の板部21b、22bのみが形成される。図示のように、半径方向外側の帯板21と半径方向内側の帯板22の窓部26を形成する長手方向の長さは、等しく形成されているので、切欠き部21dは、切欠き部22dより長手方向の幅が大きく形成される。このように切欠き部21d、22dを形成することにより、第2の板部21b、22bの断面方向(図1の紙面上)で無理なく容易に湾曲させることができる。   As shown in FIG. 1, the first plate portions 21a and 22a parallel to the bottom surfaces 29 (see FIGS. 2 and 3) of the band plates 21 and 22 are cut at portions between the adjacent window portions 26 and 26, respectively. Notch portions 21d and 22d are provided. In the portions where the notches 21d and 22d are formed, only the second plate portions 21b and 22b perpendicular to the bottom surface 29 are formed on the strip plates 21 and 22, respectively. As shown in the drawing, since the longitudinal lengths of the window portions 26 of the radially outer strip 21 and the radially inner strip 22 are formed to be equal, the notch 21d is notched. The width in the longitudinal direction is larger than 22d. By forming the notches 21d and 22d in this way, the second plates 21b and 22b can be easily and easily curved in the cross-sectional direction (on the paper surface of FIG. 1).

切欠き部21d、22dの部位で湾曲又は折り曲げることにより、帯状基板2を取付け面に置いたとき、帯状基板2の延びる方向の底面29の中心線Xを取付け面上で略円弧状に湾曲して形成することができる。詳しくは、帯板21の窓部26を形成する部分は直線状となり、切欠き部21d、22dの部分は湾曲又は折り曲げることにより、これら直線状部分と湾曲部分又は折り曲げ部分が交互に接続された形態となり、帯状基板2は全体として略円弧状(厳密には多角形状に近い)に湾曲している。上記のように、帯状基板の延びる方向の底面の中心線Xの形態は、直線状部分と湾曲部分又は折り曲げ部分が交互に接続された形態であるので、本明細書および特許請求の範囲において、底面の中心線の曲率半径とは中心線Xに内接する円の半径を意味する。   When the belt-like substrate 2 is placed on the mounting surface by bending or bending at the notch portions 21d and 22d, the center line X of the bottom surface 29 in the extending direction of the belt-like substrate 2 is curved in a substantially arc shape on the mounting surface. Can be formed. Specifically, the portion of the band plate 21 that forms the window portion 26 is linear, and the portions of the notches 21d and 22d are curved or bent so that the linear portions and the curved or bent portions are alternately connected. The belt-like substrate 2 is curved in a substantially arc shape (strictly close to a polygonal shape) as a whole. As described above, since the form of the center line X of the bottom surface in the extending direction of the belt-like substrate is a form in which straight portions and curved portions or bent portions are alternately connected, in the present specification and claims, The radius of curvature of the center line on the bottom surface means the radius of a circle inscribed in the center line X.

図2は、図1の底面の中心線Xにおける縦断面を示す。ただし、LEDチップ3については断面ではなく側面を示す。この図の左側の窓部26にはLEDチップ3が装着された状態を示し、右側の窓部26は、これからLEDチップ3を装着する状態を示す。LEDチップ3を窓部26に矢印の方向に挿入すると、LEDチップ3の端子32が窓部26の側面に形成された係止凸部26aを弾性変形させて乗り越え、LEDチップ3の端子32は、窓部26内に突出する端子21c、22cに接触し、続いて、LEDチップ3の端子32の上端32a(図4参照)が係止凸部26aに係合して抜け止めされる(図3参照)。このように、帯状基板2へのLEDチップ3の装着作業が極めて容易であると共に、装着するだけで電気的に接続される。したがって、各端子32、21c、22cの半田付け作業が不要となる。また、窓部26の係止凸部26aを弾性変形させることにより、LEDチップ3を帯状基板2から取り外すことも可能である。帯状基板2の上面28および底面29は平坦な面であり、帯状基板2の厚さは3〜5mm程度である。   FIG. 2 shows a longitudinal section along the center line X of the bottom surface of FIG. However, the LED chip 3 is not a cross section but a side surface. The left window portion 26 in this figure shows a state in which the LED chip 3 is attached, and the right window portion 26 shows a state in which the LED chip 3 will be attached. When the LED chip 3 is inserted into the window portion 26 in the direction of the arrow, the terminal 32 of the LED chip 3 is elastically deformed over the locking projection 26a formed on the side surface of the window portion 26, and the terminal 32 of the LED chip 3 Then, the terminals 21c and 22c projecting into the window portion 26 are contacted, and then the upper end 32a (see FIG. 4) of the terminal 32 of the LED chip 3 is engaged with the locking convex portion 26a to be prevented from coming off (see FIG. 3). As described above, the mounting operation of the LED chip 3 on the belt-like substrate 2 is extremely easy and is electrically connected only by mounting. Therefore, the soldering work of the terminals 32, 21c, and 22c is not necessary. Further, it is possible to remove the LED chip 3 from the belt-like substrate 2 by elastically deforming the locking convex portion 26 a of the window portion 26. The upper surface 28 and the bottom surface 29 of the belt-like substrate 2 are flat surfaces, and the thickness of the belt-like substrate 2 is about 3 to 5 mm.

LEDチップ3としては、図4に示すような表面実装型(あるいはチップ型)と呼ばれるものが使用される。LEDチップ3の構成・形態は任意であり、図4では、複数(図示例では3つ)の発光素子31を有するマルチチップであって、薄肉の直方体状にパッケージングされたLEDチップ3を例示している。マルチチップの他に、シングルチップも使用可能である。また、チップ型の他に砲弾型も使用可能である。LEDチップ3は、発光素子31の数に対応した一対もしくは複数対の端子32を有する。端子32は断面L字型をなし、LEDチップ3の中央部付近から外部に突出し、側面および底面に沿うように延びてチップ外周に端子32を有する。   As the LED chip 3, a so-called surface mount type (or chip type) as shown in FIG. 4 is used. The configuration and form of the LED chip 3 is arbitrary, and FIG. 4 illustrates the LED chip 3 that is a multichip having a plurality of (three in the illustrated example) light emitting elements 31 and packaged in a thin rectangular parallelepiped shape. doing. In addition to the multichip, a single chip can also be used. In addition to the chip type, a shell type can be used. The LED chip 3 has a pair or a plurality of pairs of terminals 32 corresponding to the number of light emitting elements 31. The terminal 32 has an L-shaped cross section, protrudes from the central portion of the LED chip 3 to the outside, extends along the side surface and the bottom surface, and has the terminal 32 on the outer periphery of the chip.

図1では、一部の窓部26にLEDチップ3をはめ込んでいないが、これは端子21c、22cおよび係止凸部26aを図面上に明示することで帯状基板2の構成を明確化するためであり、当然全ての窓部26にLEDチップ3をはめ込んで使用してもよいし、図1のように一部の窓には、はめ込まずに使用してもよい。本実施形態では、二枚の帯板21、22とLEDチップ3とを並列で接続されたものを示したが、帯板を形状変更することで回路変更し、LEDチップ3を直列に接続することもできる。このように、二枚の帯板21、22とLEDチップ3とが接続されるので、プリント基板は不要である。   In FIG. 1, the LED chips 3 are not fitted in some of the window portions 26, but this is to clarify the configuration of the belt-like substrate 2 by clearly showing the terminals 21 c and 22 c and the locking projections 26 a on the drawing. Of course, the LED chip 3 may be used by being fitted to all the window portions 26, or may be used without being fitted to some windows as shown in FIG. In the present embodiment, the two strips 21 and 22 and the LED chip 3 are connected in parallel. However, the circuit is changed by changing the shape of the strip and the LED chips 3 are connected in series. You can also. Thus, since the two strips 21 and 22 and the LED chip 3 are connected, a printed circuit board is unnecessary.

図5および図6に帯状基板2の斜視図を示す。図5は、帯状基板2を上面側から見た図であり、図6は、帯状基板2を底面側から見た図である。図5および図6より、LEDチップ3の端子32が、窓部26内に突出する端子21c、22cに接触し、LEDチップ3の端子32の上端32a(図4参照)が係止凸部26aに係合して窓部26内に装着されている様子がよく理解できる。また、図6より、帯状基板2の延びる方向の底面29の中心線Xが取付け面上で略円弧状に湾曲して形成されている様子がよく理解できる。   5 and 6 are perspective views of the belt-like substrate 2. FIG. 5 is a view of the belt-like substrate 2 as viewed from the top surface side, and FIG. 6 is a view of the belt-like substrate 2 as viewed from the bottom surface side. 5 and 6, the terminal 32 of the LED chip 3 contacts the terminals 21c and 22c protruding into the window portion 26, and the upper end 32a (see FIG. 4) of the terminal 32 of the LED chip 3 is the locking convex portion 26a. It can be understood well that the window is engaged in the window portion 26. From FIG. 6, it can be well understood that the center line X of the bottom surface 29 in the extending direction of the belt-like substrate 2 is formed to be curved in a substantially arc shape on the mounting surface.

以上に述べた帯状基板2は、以下の手順で製作することができる。先ず、幅広の二枚の帯板から切欠き部21d、22d、端子21c、22cとこれに続く第2の板部21b、22bの展開状態の端縁をプレス加工により打ち抜く。その後、又は同時に第1の板部21a、22aに対して第2の板部21b、22bを直角に折り曲げ、また、端子21c、22cを第2の板部21b、22bに対して折り曲げ加工する。その後、切欠き部21d、22dの部分を湾曲させる。切欠き部21d、22dが形成されているので、第2の板部21b、22bの断面方向で無理なく容易に湾曲させることができる。このような一連の工程を経て帯板21、22が製作される。このようにして製作された帯板21、22を図7に示す。この工程は、一例であって、適宜変更、追加することができる。   The belt-like substrate 2 described above can be manufactured by the following procedure. First, the unfolded end edges of the notches 21d and 22d, the terminals 21c and 22c, and the second plates 21b and 22b following this are punched out from two wide strips by press working. Thereafter, or simultaneously, the second plate portions 21b and 22b are bent at a right angle with respect to the first plate portions 21a and 22a, and the terminals 21c and 22c are bent with respect to the second plate portions 21b and 22b. Thereafter, the portions of the notches 21d and 22d are curved. Since the notches 21d and 22d are formed, the second plates 21b and 22b can be easily and easily curved in the cross-sectional direction. The strips 21 and 22 are manufactured through such a series of steps. The strips 21 and 22 manufactured in this way are shown in FIG. This process is an example, and can be changed or added as appropriate.

図7に示すように、間隔をあけて平行にガイドした二枚の帯板21、22を射出成形機7に所定ピッチで間欠的に送り込み、型内に樹脂を射出することで樹脂部24を形成する。これにより、二枚の帯板21、22を樹脂部24で一体に保持し、かつ二枚の帯板21、22間を樹脂部24で絶縁した帯状基板2が得られる。帯板21、22のプレス加工により打ち抜き、あるいは塑性変形させる加工は、射出成型機7への送り込み前でも、射出成型機内でもこれらの加工を行うことができる。   As shown in FIG. 7, the two strips 21 and 22 guided in parallel with a gap are intermittently fed into the injection molding machine 7 at a predetermined pitch, and the resin portion 24 is injected by injecting the resin into the mold. Form. Thereby, the belt-like substrate 2 in which the two belt plates 21 and 22 are integrally held by the resin portion 24 and the two belt plates 21 and 22 are insulated by the resin portion 24 is obtained. The punching or plastic deformation of the strips 21 and 22 can be performed before feeding into the injection molding machine 7 or in the injection molding machine.

射出成形機7から搬出された帯状基板2の窓部26にLEDチップ3を装着する。LEDチップ3を装着した基板2は順次巻き取ってロール状にし、後加工工程に移送する。LEDチップはこの段階ではめ込まずにエンドユーザが自由にはめ込むことができるよう、基板のみを後加工工程へ移送してもよい。後加工工程では、基板2をロールから引き出して所定寸法に切断し、さらに樹脂部24の一端を除去して端子23を露出させ、端子23を最終形状に打ち抜き加工する(図1参照)。予め使用長さが分かっている場合には端子23の部分の樹脂成形を行わず、露出したままで端子23とすることもできるし、成形後のロール状の巻き取りを行わず、直ちに切断することも可能である。LEDチップ3の取外しあるいは装着をエンドユーザ等が行うことも可能である。   The LED chip 3 is mounted on the window portion 26 of the belt-like substrate 2 carried out from the injection molding machine 7. The substrate 2 on which the LED chip 3 is mounted is sequentially wound up into a roll shape and transferred to a post-processing step. Only the substrate may be transferred to a post-processing step so that the LED chip can be freely inserted by the end user without being inserted at this stage. In the post-processing step, the substrate 2 is pulled out of the roll and cut into a predetermined size, and one end of the resin portion 24 is removed to expose the terminal 23, and the terminal 23 is punched into a final shape (see FIG. 1). If the length of use is known in advance, the resin molding of the terminal 23 portion is not performed, and the terminal 23 can be left exposed, or can be cut immediately without being rolled up after molding. It is also possible. The end user or the like can also remove or attach the LED chip 3.

図7では、分離された状態の二枚の帯板21、22を射出成形機7に供給する構成を例示したが、一枚の帯板を順送りして射出成形機7の直前で切断、折り曲げ等の加工を行い、これらを射出成形機7に供給することもできる。   In FIG. 7, the configuration in which the two strips 21 and 22 in a separated state are supplied to the injection molding machine 7 is illustrated, but one strip is fed forward and cut and bent immediately before the injection molding machine 7. These can be processed and supplied to the injection molding machine 7.

次に本実施形態の帯状基板2を用いたLED照明装置1を図8および図9に基づいて説明する。前述した帯状基板2の両端が円形に繋がるように所定寸法で切断し、樹脂部24の一端を除去して端子23を露出させ、端子23を最終形状に打ち抜き加工する(図1参照)。その状態の帯状基板2の端子23を、図8に示すように、照明装置のコネクタ11の端子に接続する。図示のように、帯状基板2には多数のLEDチップ3が装着されている。   Next, the LED lighting apparatus 1 using the strip | belt-shaped board | substrate 2 of this embodiment is demonstrated based on FIG. 8 and FIG. The above-described belt-like substrate 2 is cut with a predetermined dimension so that both ends thereof are connected in a circle, one end of the resin portion 24 is removed to expose the terminal 23, and the terminal 23 is punched into a final shape (see FIG. 1). The terminal 23 of the strip | belt-shaped board | substrate 2 of the state is connected to the terminal of the connector 11 of an illuminating device, as shown in FIG. As illustrated, a number of LED chips 3 are mounted on the belt-like substrate 2.

図9にLED照明装置の一例を示す。このLED照明装置1は、家庭用の一般的なもので、天井40に設置されたコネクタ41に接続される。照明装置1のコネクタ42から下方にケーブル43を介して照明部本体44が吊り下げられる。照明部本体44は、接続基部47、LED点灯回路部45、帯状基板2の取付け板46、カバー48等から構成される。LED点灯回路部45は、図示は省略するが、抵抗、電解コンデンサ、トランス等からなり、外部電源である交流電流を整流平滑し、所定の直流電流に変換して、コネクタ11を介して帯状基板2に装着されたLEDチップ3に低電流を供給する。この実施形態では、LED点灯回路部45と帯状基板2の取付け板46のセットを接続基部47に係止する構造としている。   FIG. 9 shows an example of the LED lighting device. The LED lighting device 1 is a general household one and is connected to a connector 41 installed on the ceiling 40. The lighting unit main body 44 is suspended from the connector 42 of the lighting device 1 via the cable 43. The illumination unit main body 44 includes a connection base 47, an LED lighting circuit unit 45, a mounting plate 46 for the belt-like substrate 2, a cover 48, and the like. Although not shown, the LED lighting circuit unit 45 includes a resistor, an electrolytic capacitor, a transformer, and the like, rectifies and smoothes an alternating current that is an external power supply, converts the alternating current into a predetermined direct current, and passes through the connector 11 to form a belt-like substrate. A low current is supplied to the LED chip 3 attached to 2. In this embodiment, a set of the LED lighting circuit portion 45 and the mounting plate 46 of the belt-like substrate 2 is configured to be locked to the connection base portion 47.

図9に示すLED照明装置1では、帯状基板2は取付け板46に適宜数(例えば3箇所)のフック49により取り付けられている。ここで、取付け板46の下面が本明細書および特許請求の範囲における取付け面を意味する。本実施形態では、取付け面が平面の例を示すが、これに限られるものではなく、円錐凸状に傾斜した取付け面や円錐凹状に傾斜した取付け面、あるいは湾曲した取付け面であってもよい。また、上記のLED照明装置1では、フック49による取付例を示したが、これに限られず、帯状基板2の樹脂部24に貫通穴等を設けてネジ止めしたり、あるいは接着剤などにより取り付けることもできる。帯状基板2は、その延びる方向の底面29の中心線Xが取付け面上で略円弧状に湾曲して形成されているので、使い勝手の良い丸型LED照明装置に好適である。また、複雑な配線工事が不要となるため、帯状基板2の取り付け作業を簡略化でき、エンドユーザによって照明装置1に取り付けることも可能となる。なお、数V程度で点灯するLEDチップ3用の電極が低電圧であるため、安全性の面でも特段の問題は生じない。   In the LED lighting device 1 shown in FIG. 9, the belt-like substrate 2 is attached to the attachment plate 46 by an appropriate number (for example, three places) of hooks 49. Here, the lower surface of the mounting plate 46 means the mounting surface in the present specification and claims. In the present embodiment, an example in which the mounting surface is a plane is shown, but the present invention is not limited to this, and the mounting surface may be a conical convex inclined mounting surface, a conical concave inclined mounting surface, or a curved mounting surface. . Further, in the LED lighting device 1 described above, the attachment example using the hook 49 has been shown. However, the present invention is not limited to this. You can also. The band-shaped substrate 2 is suitable for a round LED lighting device that is easy to use because the center line X of the bottom surface 29 in the extending direction is formed in a substantially arc shape on the mounting surface. In addition, since complicated wiring work is not required, the work of attaching the strip-like substrate 2 can be simplified, and the end user can attach it to the lighting device 1. In addition, since the electrode for the LED chip 3 that is lit at about several volts has a low voltage, there is no particular problem in terms of safety.

本実施形態のように各LEDチップ3を並列接続すれば、帯状基板2の製作後にこれを長さ方向の適所で切断しても断線は生じず、各LEDを点灯させることができる。従って、小売店において帯状基板2を切り売りするような販売態様を採用することも可能となる。   If the LED chips 3 are connected in parallel as in the present embodiment, even if the strip-shaped substrate 2 is cut at an appropriate position in the length direction after the strip-shaped substrate 2 is cut, no disconnection occurs and each LED can be turned on. Therefore, it is also possible to adopt a sales mode in which the strip-like substrate 2 is sold and sold at a retail store.

上記のLED照明装置1では、1列の帯状基板2を取り付けた例を示したが、明るさを増すために、2列あるいはそれ以上の帯状基板2を取り付けることも可能である。また、図9では、開放型の蛍光灯タイプの例を示したが、丸型シーリングランプなどにも適用できることは言うまでもない。さらに、LEDの発光色や光度などの選定を含めて個人の好みに応じたLED照明装置を実現することも可能である。   In the LED lighting device 1 described above, an example in which one row of strip-like substrates 2 is attached is shown. However, in order to increase the brightness, two or more rows of strip-like substrates 2 can be attached. Further, although an example of an open type fluorescent lamp type is shown in FIG. 9, it goes without saying that it can also be applied to a round ceiling lamp or the like. Furthermore, it is also possible to realize an LED lighting device according to personal preference including selection of the light emission color and luminous intensity of the LED.

次に、本発明の第2の実施形態に係る帯状基板を図10および図11に示す。図10は帯状基板の上面側から見た平面図であり、図11は、図10のY−Y線における横断面図である。この実施形態では、帯状基板2の樹脂部24の窓部26に装着したLEDチップ3の抜け止めを行う係止凸部の構成が、第1の実施形態に比べて異なる。その他の構成については、第1の実施形態と同じであるので、同様の機能を有する部位には同じ符号を付して、重複説明を省略する。   Next, a belt-like substrate according to a second embodiment of the present invention is shown in FIGS. 10 is a plan view seen from the upper surface side of the belt-like substrate, and FIG. 11 is a cross-sectional view taken along the line YY of FIG. In this embodiment, the structure of the latching convex part which prevents the LED chip 3 attached to the window part 26 of the resin part 24 of the belt-like substrate 2 from being different is different from that of the first embodiment. Since other configurations are the same as those of the first embodiment, portions having the same functions are denoted by the same reference numerals, and redundant description is omitted.

帯板21、22は、第1の実施形態と同様、略L字状の横断面を有し、帯板21、22は、帯状基板2の底面29に平行な第1の板部21a、22aと、底面29に対して垂直な第2の板部21b、22bとからなる。第2の板部21b、22bは、第1の板部21a、22aの幅方向の内縁から折れ曲がって底面29に向けて延びている。第2の板部21b、22bの底面29側の端部には複数(図示では3個)の端子21c、22cが形成されている。各端子21c、22cは、第2の板部21b、22bから折り曲げられて、LEDチップ3の各端子32と接触している。   Similar to the first embodiment, the strip plates 21 and 22 have a substantially L-shaped cross section, and the strip plates 21 and 22 are first plate portions 21 a and 22 a that are parallel to the bottom surface 29 of the strip substrate 2. And second plate portions 21 b and 22 b perpendicular to the bottom surface 29. The second plate portions 21 b and 22 b are bent from the inner edges in the width direction of the first plate portions 21 a and 22 a and extend toward the bottom surface 29. A plurality (three in the figure) of terminals 21c and 22c are formed at the end of the second plate portions 21b and 22b on the bottom surface 29 side. The terminals 21c and 22c are bent from the second plate portions 21b and 22b and are in contact with the terminals 32 of the LED chip 3.

第1の実施形態では、窓部26に装着されたLEDチップ3の抜け止めのための係止凸部26aは、窓部26の側面に射出成形で形成されていたが、本実施形態では、係止凸部
21e、22eは、帯板21、22の第2の板部21b、22bにプレス加工により形成されている。第1の実施形態において前述したLEDチップ3の帯状基板2へ着脱方法や
帯状基板2の延びる方向の底面29の中心線Xが取付け面上で略円弧状に湾曲して形成されている構成、帯状基板2の製作方法、樹脂部24の一端を除去する端子23の加工および帯状基板2を用いたLED照明装置の構成、等については、第1の実施形態と同様であるので重複説明を省略する。
In the first embodiment, the locking convex portion 26a for preventing the LED chip 3 attached to the window portion 26 from being detached is formed on the side surface of the window portion 26 by injection molding, but in this embodiment, The locking projections 21e and 22e are formed on the second plate portions 21b and 22b of the band plates 21 and 22 by pressing. A configuration in which the LED chip 3 is attached to and detached from the band-like substrate 2 in the first embodiment, and the center line X of the bottom surface 29 in the extending direction of the band-like substrate 2 is formed to be curved in a substantially arc shape on the mounting surface. The manufacturing method of the strip-shaped substrate 2, the processing of the terminal 23 for removing one end of the resin portion 24, the configuration of the LED lighting device using the strip-shaped substrate 2, and the like are the same as those in the first embodiment, and thus redundant description is omitted. To do.

本発明の第3の実施形態を図12〜15に示す。この実施形態の帯状基板2は、帯板21、22については第2の実施形態とほぼ同様のものであるが、樹脂部24の構成が、第2の実施形態に比べて異なる。第2の実施形態と同様の機能を有する部位には同じ符号を付して重複説明を省略する。   A third embodiment of the present invention is shown in FIGS. The belt-like substrate 2 of this embodiment is substantially the same as that of the second embodiment with respect to the belt plates 21 and 22, but the configuration of the resin portion 24 is different from that of the second embodiment. Parts having the same functions as those of the second embodiment are denoted by the same reference numerals, and redundant description is omitted.

本実施形態の帯状基板2は、二枚の帯板21、22をインサートして射出成形した後に、帯状基板2の延びる方向の底面29の中心線Xの曲率半径を修正可能にしたものである。具体的には、図12に示すように、帯状基板2の窓部26を形成する樹脂部24が、矩形状のブロックであり、帯状基板2の延びる方向において隣り合う窓部26との間で分断して形成されている。そのため隣り合う窓部26を形成する樹脂部24間に帯板21、22の第2の板部21b、22bが露出している。また、板部21b、22bの露出長さを増加させるために、帯板21、22の第1の板部21a、22aに設けた切欠き部21d、22dの長手方向の幅を第2の実施形態のものよりも若干大きくしている。これにより、底面29の中心線Xの曲率半径の修正量を確保している。   The belt-like substrate 2 of the present embodiment is one in which the curvature radius of the center line X of the bottom surface 29 in the extending direction of the belt-like substrate 2 can be corrected after the two belt plates 21 and 22 are inserted and injection-molded. . Specifically, as shown in FIG. 12, the resin portion 24 that forms the window portion 26 of the belt-like substrate 2 is a rectangular block, and between the adjacent window portions 26 in the extending direction of the belt-like substrate 2. It is divided and formed. Therefore, the second plate portions 21 b and 22 b of the strip plates 21 and 22 are exposed between the resin portions 24 that form the adjacent window portions 26. Further, in order to increase the exposed length of the plate portions 21b and 22b, the width in the longitudinal direction of the notches 21d and 22d provided in the first plate portions 21a and 22a of the strip plates 21 and 22 is set in the second embodiment. It is slightly larger than that of the form. Thereby, the correction amount of the curvature radius of the center line X of the bottom surface 29 is ensured.

図12は、底面29の中心線Aの曲率半径を修正する前の状態を示す。板部21b、22bを切欠き部21d、22dの部位で湾曲させることにより、帯状基板2を取付け面に置いたとき、帯状基板2の延びる方向の底面29の中心線Aが取付け面上で所定の略円弧状に湾曲して形成されている。すなわち、帯板21の窓部26を形成する部分は直線状となり、切欠き部21d、22dの部分は湾曲することにより、これら直線状部分と湾曲部分が交互に接続された形態となり、帯状基板2は全体として略円弧状に湾曲している。   FIG. 12 shows a state before the curvature radius of the center line A of the bottom surface 29 is corrected. When the strip substrate 2 is placed on the mounting surface by curving the plate portions 21b and 22b at the notch portions 21d and 22d, the center line A of the bottom surface 29 in the extending direction of the strip substrate 2 is predetermined on the mounting surface. It is formed to be curved in a substantially arc shape. That is, the portion of the band plate 21 that forms the window portion 26 is linear, and the portions of the notches 21d and 22d are curved, so that the linear portion and the curved portion are alternately connected to each other. 2 is curved in a substantially arc shape as a whole.

図12の状態から、帯状基板2の曲率半径を修正したものを図13に示す。図示のものは、底面29の中心線Xの曲率半径が大きくなる側に修正したものである。図示のように半径方向外側の帯板21の第2の板部21bを収縮する方に変形させて、この変形量に応じて底面29の中心線Xの曲率半径が所定寸法だけ大きくなる。このように、製作済の帯状基板の底面の中心線の曲率半径を適当な範囲で変更することが可能となるので、サイズの異なる丸型照明装置への帯状基板の適用自由度を高めることができる。   FIG. 13 shows a state in which the radius of curvature of the belt-like substrate 2 is corrected from the state shown in FIG. The illustrated one is corrected to the side where the radius of curvature of the center line X of the bottom surface 29 is increased. As shown in the drawing, the second plate portion 21b of the strip plate 21 on the radially outer side is deformed so as to contract, and the radius of curvature of the center line X of the bottom surface 29 is increased by a predetermined dimension according to the amount of deformation. As described above, the radius of curvature of the center line of the bottom surface of the manufactured belt-like substrate can be changed within an appropriate range, so that the degree of freedom of application of the belt-like substrate to round illuminators of different sizes can be increased. it can.

図14および図15に帯状基板2の斜視図を示す。図14は、帯状基板2を上面側から見た図であり、図15は、帯状基板2を底面側から見た図である。前述した第1の実施形態と同様、図14および図15より、LEDチップ3の端子32が、窓部26内に突出する端子21c、22cに接触し、LEDチップ3の端子32の上端32a(図4参照)が係止凸部21e、22eに係合して窓部26内に装着されている様子がよく理解できる。また、図15より、帯状基板2の延びる方向の底面29の中心線Xが取付け面上で略円弧状に湾曲して形成されている様子がよく理解できる。   14 and 15 are perspective views of the belt-like substrate 2. FIG. 14 is a view of the belt-like substrate 2 as viewed from the top surface side, and FIG. 15 is a view of the belt-like substrate 2 as viewed from the bottom surface side. 14 and 15, the terminal 32 of the LED chip 3 contacts the terminals 21 c and 22 c protruding into the window portion 26, and the upper end 32 a ( It can be understood well that the state shown in FIG. 4 is engaged with the locking projections 21e and 22e and is mounted in the window portion 26. Further, from FIG. 15, it can be well understood that the center line X of the bottom surface 29 in the extending direction of the belt-like substrate 2 is formed to be curved in a substantially arc shape on the mounting surface.

本実施形態では、窓部26に装着されたLEDチップ3の抜け止めのための係止凸部21e、22eを、帯板21、22の第2の板部21b、22bにプレス加工により形成した例を示したが、第1の実施形態と同様に、係止凸部を窓部26の側面に射出成形することも可能である。   In the present embodiment, the locking projections 21e and 22e for preventing the LED chip 3 attached to the window 26 from being detached are formed on the second plate portions 21b and 22b of the band plates 21 and 22 by press working. Although an example is shown, it is also possible to injection-mold the locking convex part on the side surface of the window part 26 as in the first embodiment.

本実施形態の帯状基板も、第1の実施形態において前述したLEDチップ3の帯状基板2へ着脱方法や帯状基板2の延びる方向の底面29の中心線Xが取付け面上で略円弧状に湾曲して形成されている構成、帯状基板2の製作方法、樹脂部24の一端を除去する端子23の加工および帯状基板2を用いたLED照明装置の構成、等については、第1の実施形態と同様であるので重複説明を省略する。   The belt-like substrate of this embodiment is also attached to the belt-like substrate 2 of the LED chip 3 described in the first embodiment, and the center line X of the bottom surface 29 in the extending direction of the belt-like substrate 2 is curved in a substantially arc shape on the attachment surface. The structure formed in this way, the manufacturing method of the strip-shaped substrate 2, the processing of the terminal 23 for removing one end of the resin portion 24, the configuration of the LED lighting device using the strip-shaped substrate 2, and the like are the same as those in the first embodiment. Since it is the same, redundant description is omitted.

本発明は前述した実施形態に何ら限定されるものではなく、本発明の要旨を逸脱しない範囲内において、さらに種々の形態で実施し得ることは勿論のことであり、本発明の範囲は、特許請求の範囲によって示され、さらに特許請求の範囲に記載の均等の意味、および範囲内のすべての変更を含む。   The present invention is not limited to the above-described embodiments, and can of course be implemented in various forms without departing from the scope of the present invention. The scope of the present invention is not limited to patents. It includes the equivalent meanings recited in the claims and the equivalents recited in the claims, and all modifications within the scope.

1 LED照明装置
2 帯状基板
3 LEDチップ
7 射出成形機
11 コネクタ
21 正極側帯板
21a 第1の板部
21b 第2の板部
21c 端子
21d 切欠き部
21e 係止凸部
22 負極側帯板
22a 第1の板部
22b 第2の板部
22c 端子
22d 切欠き部
22e 係止凸部
23 端子
24 樹脂部
26 窓部
27 端子
28 上面
29 底面
32 端子
46 取付け板
X 底面の中心線
DESCRIPTION OF SYMBOLS 1 LED illuminating device 2 Strip | belt-shaped board | substrate 3 LED chip 7 Injection molding machine 11 Connector 21 Positive side strip 21a 1st board part 21b 2nd board part 21c Terminal 21d Notch part 21e Locking convex part 22 Negative side strip 22a 1st Plate portion 22b Second plate portion 22c Terminal 22d Notch portion 22e Locking convex portion 23 Terminal 24 Resin portion 26 Window portion 27 Terminal 28 Top surface 29 Bottom surface 32 Terminal 46 Mounting plate X Bottom center line

LEDを装着するための基板の一例が特許文献1に記載されている。この基板は、導電性金属からなる正極用および負極用の帯板、並びに射出成形され、両帯板を絶縁状態で一体に保持する樹脂部を有する。この基板の一面には、その延びる方向に離間して複数の発光ダイオード(LED)が装着される。
An example of a substrate for mounting an LED is described in Patent Document 1. The substrate strip for the positive electrode and the negative electrode made of a conductive metal, is molded out morphism as well, it has a resin portion for holding together the two strips in an isolated state. A plurality of light emitting diodes (LEDs) are mounted on one surface of the substrate apart from each other in the extending direction.

Claims (9)

導電性金属からなる正極用および負極用の帯板、並びに両帯板をインサートした射出成形で形成され、両帯板を絶縁状態で一体に保持する樹脂部を有する帯状基板であって、
前記帯状基板の上面に、帯状基板の延びる方向に離間して複数の窓部が形成され、この窓部に収容されるLEDのそれぞれが前記正負双方の帯板に電気的に接続される構成を有し、
前記帯状基板の底面を取付け面に置いたとき、帯状基板の延びる方向の底面の中心線が前記取付け面上で略円弧状に湾曲して形成されていることを特徴とする帯状基板。
A belt-like substrate made of conductive metal for positive and negative electrodes, and formed by injection molding in which both belt plates are inserted, and having a resin portion that integrally holds both belt plates in an insulating state,
A plurality of window portions are formed on the upper surface of the belt-like substrate so as to be spaced apart from each other in the extending direction of the belt-like substrate, and each of the LEDs accommodated in the window portion is electrically connected to both the positive and negative belt plates. Have
A band-shaped substrate, wherein when the bottom surface of the band-shaped substrate is placed on the mounting surface, a center line of the bottom surface in the extending direction of the band-shaped substrate is curved in a substantially arc shape on the mounting surface.
前記帯板が、略L字状の横断面を有し、前記帯状基板の底面に平行な第1の板部と底面に対して垂直な第2の板部とからなることを特徴とする請求項1に記載の帯状基板。   The band plate has a substantially L-shaped cross section, and includes a first plate portion parallel to the bottom surface of the band-shaped substrate and a second plate portion perpendicular to the bottom surface. Item 2. A belt-like substrate according to Item 1. 前記第1の板部には、帯状基板の延びる方向において隣り合う窓部との間に切欠き部が形成されていることを特徴とする請求項1又は請求項2に記載の帯状基板。   The strip-shaped substrate according to claim 1, wherein the first plate portion has a notch formed between adjacent window portions in the extending direction of the strip-shaped substrate. 前記樹脂部が、帯状基板の延びる方向に連続して形成されていることを特徴とする請求項1〜3のいずれか一項に記載の帯状基板。   The said resin part is continuously formed in the direction where a strip | belt-shaped board | substrate is extended, The strip | belt-shaped board | substrate as described in any one of Claims 1-3 characterized by the above-mentioned. 前記樹脂部が、帯状基板の延びる方向において隣り合う窓部との間で分断して形成され、前記帯状基板の底面の中心線の曲率半径を修正可能にしたことを特徴とする請求項1〜3のいずれか一項に記載の帯状基板。   The resin portion is formed by being divided between adjacent window portions in a direction in which the belt-shaped substrate extends, and the radius of curvature of the center line of the bottom surface of the belt-shaped substrate can be corrected. The strip-shaped substrate according to any one of 3. 前記帯板の第1の板部にLEDの端子と接触する端子を形成したことを特徴とする請求項1〜5のいずれか一項に記載の帯状基板。   The band-shaped substrate according to claim 1, wherein a terminal that contacts an LED terminal is formed on the first plate portion of the band plate. 前記LEDを脱着可能にする係止凸部を前記窓部の側面に樹脂部と一体で形成したことを特徴とする請求項1〜6のいずれか一項に記載の帯状基板。   The belt-like substrate according to any one of claims 1 to 6, wherein a locking convex portion that allows the LED to be attached and detached is formed integrally with a resin portion on a side surface of the window portion. 前記LEDを脱着可能にする係止凸部を前記窓部に位置する前記帯板の第1の面に形成したことを特徴とする請求項1〜6のいずれか一項に記載の帯状基板。   The belt-like substrate according to any one of claims 1 to 6, wherein a locking convex portion that allows the LED to be attached and detached is formed on a first surface of the belt plate that is located in the window portion. 請求項1〜8に記載の帯状基板を用いたLED照明装置。   The LED illuminating device using the strip | belt-shaped board | substrate of Claims 1-8.
JP2012188826A 2012-08-29 2012-08-29 Strip-like substrate and led lighting device using the same Pending JP2014049192A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2012188826A JP2014049192A (en) 2012-08-29 2012-08-29 Strip-like substrate and led lighting device using the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012188826A JP2014049192A (en) 2012-08-29 2012-08-29 Strip-like substrate and led lighting device using the same

Publications (1)

Publication Number Publication Date
JP2014049192A true JP2014049192A (en) 2014-03-17

Family

ID=50608690

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012188826A Pending JP2014049192A (en) 2012-08-29 2012-08-29 Strip-like substrate and led lighting device using the same

Country Status (1)

Country Link
JP (1) JP2014049192A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160027779A (en) * 2014-09-02 2016-03-10 한국단자공업 주식회사 Led module, led module assembly and method for assembling the sames
DE102016103047A1 (en) * 2016-02-22 2017-08-24 Itz Innovations- Und Technologiezentrum Gmbh A method of manufacturing a luminaire component and luminaire component produced by the method
KR101778922B1 (en) 2017-05-16 2017-09-14 (주)쓰리씨라이팅인더스 Hanging lamp using L.E.D
JP2019192473A (en) * 2018-04-24 2019-10-31 アイリスオーヤマ株式会社 Conductor, light emitting module and luminaire
JP2021125350A (en) * 2020-02-04 2021-08-30 バンドー化学株式会社 Band-shaped light emitter, light emitting device, and manufacturing method of band-shaped light emitter

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160027779A (en) * 2014-09-02 2016-03-10 한국단자공업 주식회사 Led module, led module assembly and method for assembling the sames
KR101647952B1 (en) * 2014-09-02 2016-08-12 한국단자공업 주식회사 Led module, led module assembly and method for assembling the sames
DE102016103047A1 (en) * 2016-02-22 2017-08-24 Itz Innovations- Und Technologiezentrum Gmbh A method of manufacturing a luminaire component and luminaire component produced by the method
KR101778922B1 (en) 2017-05-16 2017-09-14 (주)쓰리씨라이팅인더스 Hanging lamp using L.E.D
JP2019192473A (en) * 2018-04-24 2019-10-31 アイリスオーヤマ株式会社 Conductor, light emitting module and luminaire
JP2021125350A (en) * 2020-02-04 2021-08-30 バンドー化学株式会社 Band-shaped light emitter, light emitting device, and manufacturing method of band-shaped light emitter

Similar Documents

Publication Publication Date Title
JP2014049192A (en) Strip-like substrate and led lighting device using the same
JP6014800B2 (en) Lighting device
US10161604B2 (en) LED lighting system with centrally held longitudinally extending LED lamps and method thereof
US7270555B2 (en) Car interior LED lamp adapter electrical connector structure
US6880951B2 (en) Flashlight using a light emitting diode as a lamp
US20060180827A1 (en) LED light set
US8419211B2 (en) Lamp tube
US20130279165A1 (en) Stringed LED Capsule Lighting Apparatus
US20080200061A1 (en) Light-emitting cell module
US9423111B2 (en) Illumination device
USRE49779E1 (en) Flexible lighting apparatus
JP3142652U (en) Both-ends terminal structure of straight tube LED fluorescent lamp
JP2012084392A (en) Light emitting device and lighting system
CN103133923A (en) Assembled lamp strip structure
KR20110012044U (en) Elongate lamp with light emitting diodes
CN104169646A (en) Illuminating unit
US20160245477A1 (en) Lamp having a glass bulb and semiconductor light source
JP2013140683A (en) Fluorescent lamp type led lighting device
EP3619462B1 (en) Elongated flexible lighting device based on solid-state lighting technology
CN105408683A (en) Led assembly
CN101956915B (en) LED lamp tube
JP4252914B2 (en) LED connection circuit structure
CN111059482A (en) Lighting device with lead frame
KR20120068485A (en) Connector for socket and using this led bulb
JP4525518B2 (en) Light source device and lighting apparatus using the same