JP2014036969A - Work plate thickness detecting device and method in machining tool - Google Patents

Abstract

PROBLEM TO BE SOLVED: To further precisely detect a pinching position of work according to the plate thickness of the work, and to carry out accurate bending machining.SOLUTION: A gauge of reference plate thickness which is close to the set plate thickness of work W is selected from a reference gauge on the basis of the set plate thickness information of the work and the plate thickness information of the reference gauge. A plate thickness detecting cameta is moved to the selected gauge to detect the plate thickness of the gauge. Next, the plate thickness detecting camera is moved to the work to detect the plate thickness of the work. A nominal value of the plate thickness of the selected gauge is added to a subtraction value obtained by subtracting the detected plate thickness of the gauge and the detected plate thickness of the work to set a plate thickness value of the work.

Description

  The present invention relates to a workpiece thickness detection apparatus and method in a processing machine that processes a plate-like workpiece such as a bending machine, and in particular, a workpiece plate capable of measuring an accurate workpiece thickness regardless of the workpiece thickness. The present invention relates to a thickness detection apparatus and method.

  Generally, in a processing machine that bends a plate-shaped workpiece such as a conventional bending machine, the nominal thickness is often input as the bending data instead of the exact thickness, and the difference in thickness is the bending angle. It had an effect on machining accuracy.

  Although a method of measuring and inputting the plate thickness in advance is conceivable, it takes time and effort, and a simple, inexpensive and accurate measuring device has been desired.

  Conventionally, there have been the following methods for detecting the workpiece plate thickness.

  FIG. 5 is an explanatory view of a conventional method for detecting a workpiece plate thickness.

  As shown in FIG. 5 (a), first, the conventional workpiece thickness detecting device includes a first measuring member 3a arranged so that its upper end is positioned at the same height as the upper end position of the die 1a, It has the 2nd measurement member 3b provided so that it might move up and down with respect to the 1st measurement member 3a, and the voltmeter 5 provided in the 2nd measurement member 3b.

  The tip of the second measuring member 3b is pointed in a conical shape, moves up and down with respect to the first measuring member 3a, and the tip contacts the first measuring member 3a. As shown in FIG. 5A, the tip of the second measurement member 3b is brought into contact with the first measurement member 3a, and in this state, the voltmeter 5 measures the current voltage flowing to the second measurement member 3b. Then, the measured current voltage is recognized as zero, and origin return zero reset processing is performed.

  Next, as shown in FIG.5 (b), the workpiece | work W is mounted on the die | dye 1a and the 1st measurement member 3a, the 2nd measurement member 3b is moved below, and the 1st measurement member 3a. The top end of the second measuring member 3b is brought into contact with the upper surface of the upper work W, and in this state, the current voltage flowing to the second measuring member 3b is measured by the voltmeter 5, and the measured current voltage is set to a predetermined value. The thickness was multiplied by the factor of.

  There was no prior art document.

  However, the conventional workpiece thickness detection method has a problem that a measurement error is small for a workpiece having a relatively small thickness, but a large measurement error is caused for a workpiece having a large thickness.

  That is, for example, when a workpiece having a thickness of 1 to 2 mm is measured after the zero reset process, if the measurement accuracy is + 1%, the measurement error is not so large as 0.01 to 0.02 mm. When measuring a 6 mm workpiece, if the measurement accuracy is + 1%, the measurement error is 0.06 mm, and if the measurement accuracy is 5%, the measurement error is as large as 0.3 mm.

  Therefore, the workpiece thickness can not be measured accurately especially for workpieces with a large thickness. Therefore, when bending is performed based on the workpiece thickness measured indefinitely, a desired bending angle is obtained. There was an unbelievable problem.

The present invention is for solving the above-mentioned problem, and the invention according to claim 1 is a workpiece plate thickness detection device for detecting a plate thickness of the workpiece in a processing machine for processing the workpiece,
A plate thickness detecting means for detecting the plate thickness of the object;
A reference gauge comprising a plurality of gauges that are detected by the plate thickness detection means and provide a plurality of reference plate thicknesses;
Moving means for moving the plate thickness detecting means between the workpiece and the reference gauge;
Storage means for storing the workpiece information and the reference gauge information;
And a control means for controlling the following process steps (A) to (D).

(A) selecting a gauge having a reference plate thickness close to a set plate thickness of the workpiece W from the reference gauge from the workpiece information and the reference gauge information from the storage means;
(B) moving the plate thickness detecting means to the gauge selected in the step (A) by the moving means;
(C) detecting the thickness of the selected gauge by the thickness detecting means;
(D) moving the plate thickness detecting means to the workpiece by the moving means;
(E) detecting the plate thickness of the workpiece by the plate thickness detecting means;
(F) subtracting the plate thickness of the selected gauge detected in the step (C) and the plate thickness of the workpiece detected in the step (E);
(G) A step of adding the plate thickness information of the selected gauge from the storage means to the subtraction value obtained in the step (F) to obtain the plate thickness of the workpiece.

  The invention according to claim 2 is characterized in that the plate thickness detection means comprises a plate thickness detection camera provided on the abutting workpiece contact surface for positioning the workpiece. This is a plate thickness detection device.

  The invention according to claim 3 is characterized in that the plate thickness information of the selected gauge from the storage means is a nominal value of the selected gauge. It is a detection device.

  The invention according to claim 4 is the workpiece plate thickness detection device according to any one of claims 1 to 3, wherein the processing machine is a bending machine.

According to a fifth aspect of the present invention, there is provided a plate thickness detection unit that detects a plate thickness of an object, a reference gauge that includes a plurality of gauges that are detected by the plate thickness detection unit and provide a plurality of reference plate thicknesses, and a workpiece And a reference means for moving the plate thickness detection means, and a storage means for storing the workpiece information and the reference gauge information. In a processing machine that performs the processing of, workpiece thickness detection method for detecting the thickness of the workpiece,
(A) The step of selecting, from the reference gauge, a gauge having a reference plate thickness close to a set plate thickness of the workpiece W from the workpiece information and the reference gauge information from the storage unit by the control unit;
(B) The step of moving the plate thickness detecting means using the moving means to the gauge selected in the step (A) by the control means;
(C) The step of detecting the thickness of the selected gauge by the thickness detecting means by the control means;
(D) The step of moving the plate thickness detecting means to the work by the control means using the moving means;
(E) The step of detecting the plate thickness of the workpiece by the plate thickness detection unit by the control unit;
(F) subtracting the selected gauge thickness detected in the step (C) and the workpiece thickness detected in the step (E) by the control means;
(G) The step of adding the plate thickness information of the selected gauge from the storage unit to the subtraction value obtained in the step (F) by the control unit to obtain the plate thickness of the workpiece; Is a workpiece plate thickness detection method.

  The invention according to claim 6 is the workpiece thickness detection method according to claim 5, wherein the thickness information of the selected gauge from the storage means is a nominal value of the selected gauge. It is.

  According to the present invention, the pinching position of the workpiece can be detected more accurately according to the plate thickness of the workpiece, and accurate bending can be performed.

It is a whole front view showing the outline of the processing machine which carried out the present invention. FIG. 2 is a schematic view of a die and a punch around the processing machine shown in FIG. 1, (a) is a side view seen from the side, and (b) and (c) are rear views seen from the back. is there. It is a block diagram which shows schematic structure regarding the control apparatus 9 of the processing machine shown in FIG. It is a flowchart of the workpiece | work board thickness detection operation | movement by the control apparatus 9 shown in FIG. It is explanatory drawing of the detection method of the conventional workpiece | work board thickness.

  FIG. 1 is an overall front view showing an outline of a processing machine embodying the present invention, FIG. 2 is a schematic view around a die and a punch shown in FIG. 1, and (a) is a side view. It is a side view, (b), (c) is a rear view seen from the back side.

  As shown in FIG. 1, this processing machine (bending machine) 7 is provided with a die 7a as a first bending tool provided at the lower portion and a punch 7b as a second bending tool provided at the upper portion. The workpiece carried between the die 7a and the punch 7b is bent by the die 7a and the punch 7b by being slid along the D axis (see FIG. 2A). .

  As shown in FIGS. 2 and 3, the bending machine 7 is provided with a workpiece thickness detecting device for measuring the thickness of the workpiece W. The workpiece thickness detecting device is used for positioning the workpiece W. A reference gauge 17 comprising a plate thickness detection camera 15 provided on the workpiece contact surface 13a of the abutment 13 and a plurality of gauges that are detected by the plate thickness detection camera 15 of the abutment 13 and provide a plurality of reference plate thicknesses. A moving means 19 (see FIG. 3) for moving the plate thickness detection camera 15 between the workpiece W and the reference gauge 17, information on the plate thickness of the reference gauge 17 detected by the plate thickness detection camera 15, and a plate A controller 9 that obtains a difference from the thickness information of the workpiece W detected by the thickness detection camera 15 and calculates the thickness of the workpiece W from the difference and the nominal value of the reference gauge 17 is provided. . As will be described later, the control device 9 controls the entire processing machine.

  Here, as shown in FIGS. 2B and 2C, the reference gauge 17 has a plurality of thickness gauges 17a to 17e that provide a plurality of reference thicknesses, and detects workpiece thickness. The camera 15 moves between the reference gauge 17 and the workpiece W and obtains image information of the reference gauge 17 and the workpiece W. Here, the gauge 17a is a gauge having a nominal value of 1 mm, the gauge 17b is a gauge having a nominal value of 1.5 mm, and the gauge 17c is a gauge having a nominal value of 3 mm. The gauge 17d is a gauge having a nominal value of 6 mm, and the gauge 17e is a gauge having a nominal value of 9 mm.

  As shown in FIGS. 2B and 2C, the camera moving means 19 moves the plate thickness detection camera 15 between the workpiece W and the reference gauge 17, for example, a back gauge. A motor or an accumulator may be provided as power using a shaft, and the power may be controlled by a driver under the control of the CPU 25 or may be moved by another mechanism.

  Here, as shown in FIGS. 2B and 2C, the workpiece thickness detection camera 15 is configured to move between the reference gauge 17 and the workpiece W in the horizontal direction. The gauge 17 may be provided in a direction perpendicular to the workpiece W, and the workpiece plate thickness detection camera 15 may be configured to move between the reference gauge 17 and the workpiece W in the vertical direction. Here, the reference gauge 17 is configured to be attached to, for example, a support member in the horizontal direction of the workpiece W.

  Further, although the plate thickness detection camera 15 is configured to be provided on the work contact surface 13a of the abutment 13, it may be provided separately from the abutment 13.

  As shown in FIG. 1, the control device 9 is provided with an input display unit 11 for displaying a predetermined image and inputting an instruction from the operator.

  Then, based on the control of the control device 9, the above-described bending process is performed according to the bending process input and set by the input display unit 11.

  FIG. 3 is a block diagram showing a schematic configuration of the control device 9 of the bending machine 7 shown in FIG.

  The control device 9 also functions as a workpiece thickness detection device that detects the thickness of the workpiece W based on the detection result from the plate thickness detection camera 15 described above.

  As shown in FIG. 3, the control device 9 of the bending machine 7 has a CPU 25 to which a ROM 21 and a RAM 23 are connected via a bus. The CPU 25 further detects the above-described plate thickness detection via the bus. The camera 15, the moving means 19 of the plate thickness detection camera 15, the input display unit 11 serving as an input unit and a display unit, and a database 27 storing information on the workpiece W and the reference gauge 17 are connected.

  The CPU 25 is also connected to a driver 31 for driving a cylinder 29 for vertically driving the upper table on which the punch 7b is mounted via the bus.

  Here, the CPU 25 receives the punch and die data, product shape data, workpiece material (work W) data, and reference gauge 17 data in the database 27 in accordance with settings and instructions from the input display unit 11 from the operator. In addition to using the RAM 23 in accordance with a computer program from the ROM 21, the thickness of the workpiece W is detected as will be described later, and the bending operation set as input is performed.

  Next, a workpiece thickness detection method using the workpiece thickness detection device will be described with reference to FIGS. 4 and 2.

  FIG. 4 is a flowchart of the workpiece W thickness detection operation by the workpiece W thickness detector shown in FIG.

  First, when the operation mode is the workpiece thickness detection mode, in step 101 of FIG. 4, a gauge having a thickness closest to the set thickness of the workpiece W to be measured is selected from the reference gauge 17.

  That is, the CPU 25 obtains the set plate thickness information of the workpiece W to be processed and the nominal value of the reference gauge 17 from the database 27 and the like, and the set plate thickness information of the workpiece W is information on the nominal value of the reference gauge 17. And a gauge having a thickness closest to the thickness of the workpiece W is selected.

  In this embodiment, the set plate thickness of the workpiece W is 7 mm, and the selected gauge is a gauge 17d having a plate thickness of 6 mm.

  Next, in step 103, the plate thickness detection camera 15 is moved to the imaging position of the selected gauge by the camera moving means. In this embodiment, as shown in FIG. 2B, the plate thickness detection camera 15 is moved to the imaging position of the gauge 17d having a plate thickness of 6 mm.

  In step 105, the selected gauge is imaged by the plate thickness detection camera 15. In this embodiment, the plate thickness detection camera 15 images the gauge 17d.

  In step 107, the thickness measurement value of the gauge 17d is obtained from the image information of the gauge 17d captured by the thickness detection camera 15. Here, the CPU 25 analyzes the image information of the gauge 17d and obtains the measured thickness value of the gauge 17d. In this embodiment, the thickness measurement value of the gauge 17d is 6.18 mm when the measurement accuracy is 3%.

  Next, in step 109, as shown in FIG. 2C, the plate thickness detection camera 15 is moved to the imaging position of the workpiece W having a plate thickness of 7 mm by the camera moving means.

  In step 111, the workpiece W having a thickness of 7 mm is imaged by the thickness detection camera 15.

  In step 113, the thickness measurement value of the workpiece W is obtained from the image information of the workpiece W captured by the plate thickness detection camera 15. Here, the CPU 25 analyzes the image information of the workpiece W and obtains the measured thickness value of the workpiece W. In this embodiment, the plate thickness measurement value of the workpiece W is 7.21 mm when the measurement accuracy is + 3%. In other words, a measurement error of 0.21 mm is generated as it is.

  Next, in step 115, the CPU 25 subtracts the selected gauge thickness value from the workpiece W thickness value to obtain a subtracted value.

  In this embodiment, 6.18 mm which is the thickness measurement value of the gauge 17d is subtracted from 7.21 mm which is the thickness measurement value of the workpiece W to obtain a subtraction value of 1.03 mm.

  Next, in step 117, the CPU 25 adds the subtracted value obtained in step 115 to the nominal value of the reference gauge 17d to obtain a measured value of the official plate thickness of the workpiece W.

  In this embodiment, the subtracted value of 1.03 mm is added to the nominal value of 6 mm of the reference gauge 17d to obtain the official thickness measurement value of the workpiece W of 7.03 mm.

  In other words, when the official plate thickness measurement value of the 7.03 mm workpiece W is compared with 7.21 mm which is the plate thickness measurement value of the workpiece W obtained in step 113, the measurement with less error is achieved. Recognize.

  Thus, according to this workpiece W plate thickness detection method, it can be seen that more accurate measurement values can be obtained by the plate thickness detection camera 15 as compared with the case where the workpiece W is directly measured.

  The present invention is not limited to the embodiment of the invention described above, and can be implemented in other modes by making appropriate modifications as follows.

  In the above-described embodiment, the workpiece and the reference gauge are measured by the plate thickness detection camera 15, but the workpiece and the reference gauge are measured using a measuring device using a voltmeter as shown in FIG. You may do it.

1a Die 3a First measuring member 3b Second measuring member 5 Voltmeter 7 Processing machine (bending machine)
7a Die 7b Punch 9 Control device 11 Input display unit 13a Workpiece contact surface 15 Thickness detection camera 17 Reference gauge 19 Camera moving means 27 Database 29 Cylinder 31 Driver

Claims (6)

In a processing machine for processing a workpiece, a workpiece thickness detecting device for detecting the thickness of the workpiece,
A plate thickness detecting means for detecting the plate thickness of the object;
A reference gauge comprising a plurality of gauges that are detected by the plate thickness detection means and provide a plurality of reference plate thicknesses;
Moving means for moving the plate thickness detecting means between the workpiece and the reference gauge;
Storage means for storing the workpiece information and the reference gauge information;
And a control means for controlling the following process processes (A) to (D).
(A) selecting a gauge having a reference plate thickness close to a set plate thickness of the workpiece W from the reference gauge from the workpiece information and the reference gauge information from the storage means;
(B) moving the plate thickness detecting means to the gauge selected in the step (A) by the moving means;
(C) detecting the thickness of the selected gauge by the thickness detecting means;
(D) moving the plate thickness detecting means to the workpiece by the moving means;
(E) detecting the plate thickness of the workpiece by the plate thickness detecting means;
(F) subtracting the plate thickness of the selected gauge detected in the step (C) and the plate thickness of the workpiece detected in the step (E);
(G) A step of adding the plate thickness information of the selected gauge from the storage means to the subtraction value obtained in the step (F) to obtain the plate thickness of the workpiece.   2. The workpiece thickness detection apparatus according to claim 1, wherein the thickness detection means includes a plate thickness detection camera provided on an abutting workpiece contact surface for positioning the workpiece.   3. The workpiece thickness detection apparatus according to claim 1, wherein the thickness information of the selected gauge from the storage means is a nominal value of the selected gauge.   The work plate thickness detection apparatus according to claim 1, wherein the processing machine is a bending machine. Between the workpiece and the reference gauge, a plate thickness detecting means for detecting the plate thickness of the object, a reference gauge comprising a plurality of gauges detected by the plate thickness detecting means and providing a plurality of reference plate thicknesses In a processing machine that has a moving means for moving the plate thickness detecting means, and a storage means for storing information on the workpiece and information on the reference gauge, and that processes the workpiece based on the control of the control means, A workpiece thickness detection method for detecting the thickness of the workpiece,
(A) The step of selecting, from the reference gauge, a gauge having a reference plate thickness close to a set plate thickness of the workpiece W from the workpiece information and the reference gauge information from the storage unit by the control unit;
(B) The step of moving the plate thickness detecting means using the moving means to the gauge selected in the step (A) by the control means;
(C) The step of detecting the thickness of the selected gauge by the thickness detecting means by the control means;
(D) The step of moving the plate thickness detecting means to the work by the control means using the moving means;
(E) The step of detecting the plate thickness of the workpiece by the plate thickness detection unit by the control unit;
(F) subtracting the selected gauge thickness detected in the step (C) and the workpiece thickness detected in the step (E) by the control means;
(G) The step of adding the plate thickness information of the selected gauge from the storage unit to the subtraction value obtained in the step (F) by the control unit to obtain the plate thickness of the workpiece; A workpiece thickness detecting method comprising:   6. The workpiece thickness detection method according to claim 5, wherein the thickness information of the selected gauge from the storage means is a nominal value of the selected gauge.

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